A PCB design and processing technology for mixed-model PCBs

Abstract

The present invention discloses a PCB design and processing process for a multi-model mixed-plate, belonging to the technical field of circuit board manufacturing, and comprising the following steps: 1) determining plate specifications, symmetrically arranging the positions of first annular materials on the plate, and staggering the positions of the first annular materials in two adjacent columns; 2) forming a circular waste area in the middle of the first annular materials, and embedding and arranging a second annular material in the circular waste area; the present invention arranges the first annular materials in two adjacent columns in a staggered manner, and arranges and embeds at least one small-sized material in the middle of the first annular material, so that materials of multiple specifications are processed simultaneously on the same plate, avoiding the tedious process of separate processing, fully utilizing the waste area, and greatly improving the utilization rate of the plate while keeping the size of the plate margin unchanged, thereby greatly improving production efficiency and reducing production costs.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit board manufacturing, and in particular relates to a PCB design and processing technology for a multi-model mixed-plate. Background Art

[0002] As the primary raw material for PCB production, sheet metal accounts for over 70% of total production costs. However, the PCB industry's utilization rate of sheet metal in converting finished products is still very low, averaging less than 80%.

[0003] Currently, the only way to improve board utilization is to minimize margins during cutting and layout. This leads to the following problems: The CCD alignment mark points on the board edge may not be fully covered by the dry film, or may not be covered at all, resulting in incomplete marks and directly affecting the alignment of the outer layer exposure. Furthermore, this can cause abnormal hole cracking in the positioning holes, making solder mask exposure and positioning difficult. Furthermore, the layout on the board is asymmetrical, and when the solder mask ink is double-sided screen printed, the copper surface of the circuit or pad may be damaged by the nail bed. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem that improving the utilization rate of the board material can only be achieved by minimizing the margin when cutting and layout, resulting in low board material utilization, single board single part number production, high production cost and low production efficiency, and to propose a PCB design and processing technology for multi-model mixed-plate.

[0005] In order to achieve the above object, the present invention adopts the following technical solution: a PCB design and processing process for a multi-model mixed version, which includes the following steps:

[0006] 1) Determine the plate specifications and arrange the positions of the first ring-shaped materials symmetrically on the plate, with the positions of the first ring-shaped materials in two adjacent rows being staggered;

[0007] 2) The middle of the first ring-shaped material is a round cake waste area, and the second ring-shaped material is embedded and laid out on the round cake waste area;

[0008] 3) Processing the circuit board at the layout position according to the structures of the first ring-shaped material and the second ring-shaped material;

[0009] 4) synchronously performing electrical measurements on the first and second ring-shaped materials;

[0010] 5) Blanking the middle portion of the second ring-shaped material, and then blanking the second ring-shaped material;

[0011] 6) performing blanking processing on the first annular material;

[0012] 7) After passing the appearance inspection, the products will be packaged and put into storage.

[0013] As a further description of the above technical solution:

[0014] In the steps 1) and 2), at least two types of ring-shaped materials are arranged on the plate.

[0015] As a further description of the above technical solution:

[0016] In the step 3), the processing steps of the circuit board include: cutting - inner layer circuit - pressing - drilling - PTH electroplating - outer layer circuit - solder mask - text - tin spraying - electrical testing - molding.

[0017] As a further description of the above technical solution:

[0018] In step 5) to step 6), a milling cutter with a diameter of 1.8 mm is used to perform milling processing on the plate.

[0019] As a further description of the above technical solution:

[0020] In the step 4), the first annular material and the second annular material are synchronously subjected to an electrical measurement process.

[0021] As a further description of the above technical solution:

[0022] In the step 6), the outer shape of the first annular material or the second annular material is milled, and the surface is cleaned after the milling is completed.

[0023] As a further description of the above technical solution:

[0024] In steps 5) to 6), a gap is left between the outer wall of the second annular material and the first annular material, and the material is blanked by laser cutting to ensure that the width of the gap is not less than the spot diameter of the laser acting on the plate.

[0025] As a further description of the above technical solution:

[0026] The distances between any two adjacent first annular materials in different columns are equal.

[0027] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0028] In the present invention, by staggering the first annular materials of two adjacent columns and embedding at least one small-sized material in the middle of the first annular material, materials of multiple specifications are processed simultaneously on the same plate, avoiding the tedious process of separate processing, and making full use of the waste area. This greatly improves the utilization rate of the plate while keeping the edge size of the plate unchanged, greatly improves production efficiency, reduces production costs, avoids incomplete MARK points or direct impact on the outer layer exposure alignment and the inability to align, and also avoids asymmetric layout on the board surface and abnormal situation in which the circuit or the copper surface of the pad is crushed by the nail bed when the solder mask ink is double-sided silk screened. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a flow chart of the PCB design and processing technology for a multi-model mixed version.

[0030] Figure 2 This is a schematic diagram of the board structure in step 1) of a PCB design and processing process for a multi-model mixed panel.

[0031] Figure 3 This is a schematic diagram of the layout of the first ring material in step 1) of a PCB design and processing process for a multi-model mixed panel.

[0032] Figure 4 This is a schematic diagram of the layout of the second ring material in step 2) of a PCB design and processing process for a multi-model mixed panel.

[0033] Figure 5 This is a schematic diagram of embodiment 1 of step 2) of a PCB design and processing process for a multi-model mixed-plate.

[0034] Figure 6 Schematic diagram of a comparative example of step 2) of a PCB design and processing process for a multi-model mixed panel. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] Example 1:

[0037] S01: Determine the plate specifications and arrange the positions of the first ring-shaped materials symmetrically on the plate. The positions of the first ring-shaped materials in two adjacent columns are staggered. The positions of the first ring-shaped materials are connected along the arrangement direction of multiple columns. The connection path is W-shaped. The distance between any two adjacent first ring-shaped materials in different columns is equal.

[0038] S02: The middle of the first ring-shaped material is a round cake waste area, and the second ring-shaped material is embedded and laid out on the round cake waste area;

[0039] S03: According to the structures of the first ring-shaped material and the second ring-shaped material, the circuit board is processed at the position of the above layout. The processing steps of the circuit board include: cutting - inner layer circuit - pressing - drilling - PTH electroplating - outer layer circuit - solder mask - text - tin spraying - electrical testing - molding;

[0040] S04: The first ring material and the second ring material are synchronously subjected to electrical testing process;

[0041] S05: Use a milling cutter with a diameter of 1.8 mm to mill the plate, perform blanking on the middle part of the second ring-shaped material, and then perform blanking on the second ring-shaped material;

[0042] S06: Use a milling cutter with a diameter of 1.8 mm to perform milling processing on the plate, perform blanking processing on the first ring-shaped material, perform milling processing on the outer shape of the first ring-shaped material or the second ring-shaped material, and clean the surface after the processing is completed;

[0043] S07: Packing and storage after passing the appearance inspection.

[0044] Example 2:

[0045] S01: Determine the plate specifications, and arrange the positions of the first ring-shaped materials symmetrically on the plate, with the positions of the first ring-shaped materials in two adjacent columns being staggered;

[0046] S02: The middle of the first ring-shaped material is a round cake waste area, and the second ring-shaped material is embedded and laid out on the round cake waste area;

[0047] S03: According to the structures of the first ring-shaped material and the second ring-shaped material, processing the circuit board at the layout position;

[0048] S04: The first ring material and the second ring material are synchronously subjected to electrical testing process;

[0049] S05: Blanking the middle of the second ring-shaped material, and then blanking the second ring-shaped material. A gap is left between the outer wall of the second ring-shaped material and the first ring-shaped material, and blanking is performed using laser cutting to ensure that the width of the gap is not less than the spot diameter of the laser acting on the plate;

[0050] S06: performing blanking processing on the first annular material, performing blanking processing by laser cutting processing, performing milling processing on the outer shape of the first annular material or the second annular material, and performing surface cleaning after the processing is completed;

[0051] S07: Packing and storage after passing the appearance inspection.

[0052] Comparative Example:

[0053] S01: Determine the plate specifications and arrange the position of the first ring material on the plate;

[0054] S02: According to the structure of the first ring-shaped material, the circuit board is processed at the position of the layout;

[0055] S03: performing blanking processing on the middle portion of the first ring-shaped material, and then performing blanking processing on the first ring-shaped material;

[0056] S04: The first ring-shaped material is subjected to an electrical measurement process, and the first ring-shaped material that passes the electrical measurement is subjected to milling processing:

[0057] S05: Packing and storage after passing the appearance inspection.

[0058] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A PCB design and processing technology for a multi-model mixed version, characterized by: The steps include: 1) Determine the plate specifications and arrange the positions of the first ring-shaped materials symmetrically on the plate, with the positions of the first ring-shaped materials in two adjacent rows being staggered; 2) The middle of the first ring-shaped material is a round cake waste area, and the second ring-shaped material is embedded and laid out on the round cake waste area; 3) Processing the circuit board at the layout position according to the structures of the first ring-shaped material and the second ring-shaped material; 4) synchronously performing electrical measurements on the first and second ring-shaped materials; 5) Blanking the middle portion of the second ring-shaped material, and then blanking the second ring-shaped material; 6) performing blanking processing on the first annular material; 7) After the appearance inspection is passed, it is packed and put into storage; In steps 1) to 2), at least two specifications of annular materials are arranged on the plate; in step 3), the processing procedures of the circuit board include: cutting - inner layer circuit - pressing - drilling - PTH electroplating - outer layer circuit - solder mask - text - tin spraying - electrical testing - forming; in steps 5) to 6), a gap is left between the outer wall of the second annular material and the first annular material, and laser cutting is used for blanking to ensure that the width of the gap is not less than the spot diameter of the laser acting on the plate; the distance between any two adjacent first annular materials in different columns is equal.

2. The PCB design and processing technology for a multi-model mixed version according to claim 1 is characterized in that: In the steps 5) to 6), a milling cutter with a diameter of 1.8 mm is used to perform milling processing on the plate.

3. The PCB design and processing technology for a multi-model mixed version according to claim 1 is characterized in that: In the step 4), the first annular material and the second annular material are synchronously subjected to an electrical measurement process.

4. The PCB design and processing technology for a multi-model mixed version according to claim 1 is characterized in that: In the step 6), the outer shape of the first annular material or the second annular material is milled, and the surface is cleaned after the milling is completed.

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