Molded product, electrical product, and method for manufacturing molded product

Abstract

Provided is a molded article or electrical product that facilitates processing of wiring from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. A molded article (10) comprises a circuit film (20) and a molded article (30). The circuit film (20) comprises an insulating film (21) and an electrical circuit (22). The molded body (30) is integrally molded with the circuit film (20). The circuit film (20) comprises a flexible wiring portion (25). The molded body (30) comprises a through hole (35) extending from one main surface (31) to the other main surface (32). The flexible wiring portion (25) is provided with a connection terminal (26) at a portion that passes through the through hole (35) and extends beyond the other main surface (32).

Description

Technical Field

[0001] The present invention relates to a molded product in which a circuit film and a molded body are integrally molded, an electrical product having the molded product, and a method for manufacturing the molded product. Background Art

[0002] The component module described in Patent Document 1 (Japanese Patent No. 5484529) is, for example, a molded product that integrally molds a touch sensor (circuit film) and a resin portion (molded body). To electrically connect the touch sensor to electrical components located outside the component module, the component module of Patent Document 1 includes a flexible printed circuit board. By connecting the external connection terminals of the flexible printed circuit board to the electrical components, the touch sensor and the electrical components are electrically connected via the flexible printed circuit board.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent No. 5484529 Summary of the Invention

[0006] Technical problem to be solved by the invention

[0007] However, in the component module described in Patent Document 1, since the resin portion is molded by injection molding using a mold, the flexible printed circuit board is drawn out from the end portion of the resin portion.

[0008] When the flexible printed circuit board is pulled out from the end of the resin portion, as in the component module described in Patent Document 1, handling of the flexible printed circuit board can be difficult. For example, a component module may be used as a portion of a housing for an electrical product, and electrical components connected to a touch sensor may be housed within the interior space of the housing.

[0009] In this case, in order to guide the external connection terminals of the flexible printed circuit board into the interior space of the electrical product, for example, a gap must be provided between the end of the component module and the rest of the surrounding housing. When the flexible printed circuit board is passed through this gap from outside the housing into the interior, for example, the flexible printed circuit board may interfere with the housing, or the wiring may be broken due to the flexible printed circuit board breaking. This interference with the housing and the breakage of the wiring can damage the flexible wiring board.

[0010] The present invention aims to provide a molded article or electrical product that facilitates handling of wiring from an electric circuit of a circuit film integrally molded with a molded body to a connection terminal. Furthermore, the present invention aims to provide a method for manufacturing such a molded article.

[0011] Solutions for solving technical problems

[0012] Hereinafter, a plurality of methods will be described as means for solving the problems, and these methods can be arbitrarily combined as needed.

[0013] A molded article according to one aspect of the present invention comprises a circuit film and a molded body. The circuit film comprises a thermoplastic insulating film and an electrical circuit formed on the insulating film. The molded body comprises a main surface and another main surface opposite the one main surface, and is integrally molded with the circuit film located on the one main surface. The circuit film comprises a flexible wiring portion formed by cutting away the periphery of the wiring connected to the electrical circuit while maintaining connection to the insulating film. The molded body comprises a through hole extending from one main surface to the other main surface. The flexible wiring portion is provided with a connection terminal in the through hole or in a portion passing through the through hole and extending beyond the other main surface.

[0014] A molded article having this structure has a circuit film on one principal surface of the molded article, and a flexible wiring portion extending from one principal surface to the other principal surface of the molded article through a through-hole. When an electrical component, for example, is connected to the connection terminals of the flexible wiring portion, the circuit film on one principal surface of the molded article and the electrical component on the other principal surface can be connected via the through-hole using the flexible wiring portion.

[0015] Another aspect of the present invention relates to a molded article comprising a circuit film, a flexible wiring portion, and a molded body. The circuit film comprises an insulating film and an electrical circuit formed on the insulating film. The flexible wiring portion is thermoplastic, separate from the circuit film, and comprises a flexible printed circuit board connected to the electrical circuit. The molded body comprises a main surface and another main surface opposite to the one main surface, and is integrally molded with the circuit film and the flexible wiring portion located on the one main surface. The molded body comprises a through hole extending from one main surface to the other main surface. The flexible wiring portion is provided with a connection terminal in the through hole or in a portion extending through the through hole and beyond the other main surface.

[0016] A molded article having this structure has a circuit film on one principal surface of the molded article, and a flexible wiring portion extending from one principal surface to the other principal surface of the molded article through a through-hole. When an electrical component, for example, is connected to the connection terminals of the flexible wiring portion, the circuit film on one principal surface of the molded article and the electrical component on the other principal surface can be connected via the through-hole using the flexible wiring portion.

[0017] The molded article may also be configured as a three-dimensional component separate from the molded body and disposed in the through-hole. In such a molded article, the three-dimensional component and the flexible wiring portion share the through-hole, thereby minimizing a decrease in the molded article's strength compared to a case where a dedicated hole is provided for the three-dimensional component.

[0018] The molded article can also be constructed as a three-dimensional component separate from the molded body, covering the through-hole. This configuration of the molded article conceals the through-hole with the three-dimensional component, enhancing the design of the exterior. Furthermore, blocking the through-hole with the three-dimensional component prevents foreign matter, such as dust and moisture, from intruding through the through-hole onto the other main surface of the molded body.

[0019] The molded article may also be configured such that the flexible wiring portion is fixed to the wall surface of the through-hole. Compared to a case where the flexible wiring portion is not fixed to the wall surface of the through-hole, the molded article configured in this manner can suppress positional changes of the flexible wiring portion and facilitate connection of the flexible wiring portion to the connection terminal.

[0020] An electrical product according to one aspect of the present invention comprises a housing containing the molded article and an electrical component. The electrical component is disposed within the housing and connected to a connection terminal of a flexible wiring portion. The molded article is mounted with one principal surface facing the exterior of the housing and the other principal surface facing the interior of the housing.

[0021] The electrical product thus constructed can connect electrical components and circuits within the housing through a through-hole in the housing from one main surface of the molded product facing the outside of the housing. This prevents interference between the flexible wiring and the housing, bending of the flexible wiring, and other undesirable issues that may arise from handling the flexible wiring.

[0022] A method for manufacturing a molded article according to one aspect of the present invention comprises: pre-molding a thermoplastic insulating film and a circuit film having an electrical circuit formed thereon; placing the circuit film on a first mold; closing the first and second molds; and injecting molten material into the cavities of the first and second molds to form a molded body integrally molded with the circuit film. During the pre-molding process, a thermoplastic flexible wiring portion, formed by cutting away the periphery of wiring connected to the electrical circuit while maintaining connection to the insulating film, is raised in a direction intersecting the in-plane direction of the circuit film. During the placing of the circuit film, at least a portion of the flexible wiring portion is positioned on a side surface of a convex portion of the first mold. During the closing of the molds, the convex portion of the first mold is inserted into a concave portion of the second mold, with the connection terminals of the flexible wiring portion being held between the first and second molds in the concave portion. During the forming of the molded body, the circuit film and the molded body are integrally molded, with the convex portion providing a through-hole in the molded body and the flexible wiring portion being positioned within the through-hole, so that the molten material does not come into contact with the connection terminals.

[0023] In this method for manufacturing a molded article, considering the possibility of connecting, for example, an electrical component to the connection terminals of the flexible wiring portion, the flexible wiring connecting the circuit film located on one side of a through-hole in the molded article and the electrical component located on the other side can be arranged within the through-hole. Furthermore, during the integral molding of the circuit film and the molded article, since the molten material does not come into contact with the connection terminals of the flexible wiring portion, poor connection between the circuit film and the electrical component due to poor connection at the connection terminals can be suppressed.

[0024] Another aspect of the present invention relates to a method for manufacturing a molded article, comprising: pre-molding a thermoplastic insulating film and a circuit film having an electrical circuit formed thereon; placing the circuit film on a first mold; closing the first and second molds; and injecting molten material into the cavities of the first and second molds to form a molded article integrally molded with the circuit film. During the pre-molding process, a thermoplastic flexible wiring portion, separate from the circuit film and comprising a flexible printed circuit board connected to the electrical circuit, is raised in a direction intersecting the in-plane direction of the circuit film. During the placing of the circuit film, at least a portion of the flexible wiring portion is positioned on a side surface of a convex portion of the first mold. During the closing of the molds, the convex portion of the first mold is inserted into a concave portion of the second mold, with the connection terminals of the flexible wiring portion being held between the first and second molds in the concave portion. During the forming of the molded article, the circuit film and the molded article are integrally molded, with the convex portion providing a through-hole in the molded article and the flexible wiring portion being positioned within the through-hole, so that the molten material does not come into contact with the connection terminals.

[0025] In this method for manufacturing a molded article, considering the possibility of connecting, for example, an electrical component to the connection terminals of the flexible wiring portion, the flexible wiring connecting the circuit film located on one side of a through-hole in the molded article and the electrical component located on the other side can be arranged within the through-hole. Furthermore, during the integral molding of the circuit film and the molded article, since the molten material does not come into contact with the connection terminals of the flexible wiring portion, poor connection between the circuit film and the electrical component due to poor connection at the connection terminals can be suppressed.

[0026] Effects of the Invention

[0027] According to the molded article of the present invention or an electrical product including the molded article, the wiring from the electrical circuit of the circuit film integrally molded with the molded article to the connecting terminals is easily handled. Furthermore, according to the method for manufacturing the molded article of the present invention, a molded article can be easily manufactured that facilitates the wiring from the electrical circuit of the circuit film integrally molded with the molded article to the connecting terminals. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a perspective view showing the appearance of eyeglasses to which the molded article is applied.

[0029] Figure 2 This is a partially enlarged perspective view of a through hole and its surroundings of the molded product according to the first embodiment.

[0030] Figure 3 It is along Figure 2 This is a cross-sectional view of a molded product taken along line II.

[0031] Figure 4 It is a partially enlarged plan view for explaining the structure of the circuit film 20 .

[0032] Figure 5 This is a block diagram showing the configuration of an electric product according to the first embodiment.

[0033] Figure 6 This is a partially enlarged perspective view for explaining a method for forming a flexible wiring portion.

[0034] Figure 7 It is a schematic cross-sectional view for explaining the structure of the circuit film 20 .

[0035] Figure 8 It is a partially enlarged stereoscopic image of a preformed circuit film.

[0036] Figure 9 It is a partially enlarged stereoscopic view of the first mold.

[0037] Figure 10 This is a partially enlarged perspective view of the convex portion of the first mold on which the circuit film is provided.

[0038] Figure 11 It is a partially enlarged cross-sectional view of the first mold and the second mold provided with the circuit film.

[0039] Figure 12 This is a partially enlarged perspective view of a through hole and its surroundings of the molded product according to the second embodiment.

[0040] Figure 13 It is a block diagram showing the configuration of an electric product according to the second embodiment.

[0041] Figure 14 It is a partially enlarged perspective view showing a flexible wiring portion connected to a circuit film.

[0042] Figure 15 This is a partially enlarged cross-sectional view showing a flexible wiring portion connected to a circuit film.

[0043] Figure 16 This is a partially enlarged cross-sectional view of a first mold and a second mold provided with a circuit film and a flexible wiring portion.

[0044] Figure 17It is a partially enlarged cross-sectional view for explaining a molded product according to a third embodiment.

[0045] Figure 18 It is a partially enlarged cross-sectional view for explaining another molded product according to the third embodiment.

[0046] Figure 19A It is a partially enlarged perspective view of another convex portion provided with a circuit film.

[0047] Figure 19B It is a partially enlarged cross-sectional view of another first mold and a second mold provided with a circuit film.

[0048] Figure 20A It is a partially enlarged perspective view of another convex portion provided with a circuit film.

[0049] Figure 20B It is a partially enlarged cross-sectional view of another first mold and a second mold provided with a circuit film.

[0050] Figure 21 This is a partially enlarged perspective view of a through hole and its surroundings of the molded product according to the second embodiment.

[0051] Figure 22A This is a partially enlarged cross-sectional view for explaining the relationship between the arrangement of the connection terminals and the through-holes.

[0052] Figure 22B It is a partially enlarged cross-sectional view showing another example of a connection terminal arranged in a through-hole.

[0053] Figure 23A This is a partially enlarged perspective view of a convex portion of a first mold according to a modified example in which a circuit film is provided.

[0054] Figure 23B This is a partially enlarged cross-sectional view of a first mold and a second mold according to a modified example in which a circuit film is provided.

[0055] Figure 24 This is a partially enlarged perspective view of a through hole and its surroundings of a molded product according to a modified example.

[0056] Figure 25 This is a partially enlarged perspective view showing a plurality of flexible wiring portions arranged in one through-hole.

[0057] Figure 26 It is a partially enlarged perspective view showing a three-dimensional member and a through-hole according to a modification.

[0058] Figure 27 It is a partially enlarged cross-sectional view showing a three-dimensional member and a through-hole according to a modification.

[0059] Figure 28 It is a partially enlarged perspective view showing a flexible wiring portion according to a modified example. DETAILED DESCRIPTION

[0060] <First embodiment>

[0061] (1) Overall structure

[0062] Figure 1 Spectacles to which the molded article according to the first embodiment of the present invention is applied are shown. Figure 1 In the glasses 1 shown, the temples 3 that hang on the ears, the temples 2, and the hinges 4 are molded products 10. Inside the molded product 10, a space for accommodating an electrical component 90 is provided.

[0063] The molded article 10 has Figure 2 The circuit film 20 and the molded body 30 are shown. The circuit film 20 and the molded body 30 are integrally molded.

[0064] Figure 2 A portion of the molded body 30 is shown in an enlarged manner. Figure 2 The portion shown is a portion of the temple 2 of the eyeglasses 1, where an "N"-shaped insert 33 is located. A through-hole 35 passes through this insert 33. An "N"-shaped three-dimensional component 80 is embedded in this insert 33. The through-hole 35 is covered by the three-dimensional component 80. Thus, the through-hole 35 is concealed from the outside by the three-dimensional component 80. Therefore, the three-dimensional component 80 not only enhances the design of the molded article 10 but also prevents dust from entering the molded article 10 through the through-hole 35.

[0065] Figure 3 Shown along Figure 2 The cross section cut off from line II. Figure 3 As shown, the molded body 30 has a main surface 31 and another main surface 32 opposite to the main surface 31. The embedded portion 33 is formed on the main surface 31 of the molded body 30. The molded body 30 and the circuit film 20 are integrally molded. The circuit film 20 integrally molded with the molded body 30 is located on one main surface 31 of the main surface 31. It should be noted that Figure 3 The case where one main surface 31 and the other main surface 32 are flat is shown. However, the shapes of the one main surface 31 and the other main surface 32 are not limited to flat surfaces, and may be curved surfaces or may have uneven shapes.

[0066] like Figure 4 As shown, the circuit film 20 includes an insulating film 21 and an electric circuit 22 formed on the insulating film 21. In this first embodiment, the electric circuit 22 formed on the circuit film 20 is an antenna.

[0067] Figure 5FIG. 2 shows an outline of the structure of the electrical product 5 provided on the glasses 1. The electrical circuit 22 is connected to the electrical device 90 via a flexible wiring portion 25. The flexible wiring portion 25 includes a connection terminal 26 and wiring 27 for connecting the electrical circuit 22 and the electrical device 90 (see FIG. 2 ). Figure 4 Wiring 27 is electrically connected to electrical circuit 22 and to connection terminal 26. The electrical device 90 of the first embodiment has a function of transmitting and receiving using an antenna. For example, electrical device 90 is a receiver that converts received wireless signals into audio and / or video signals, or a transmitter that converts control signals into wireless signals and transmits them.

[0068] The molded body 30 has a through hole 35 that penetrates from one main surface 31 to the other main surface 32 (see Figure 3 One end 35b of the through-hole 35 is located in the embedded portion 33, and the other end 35a of the through-hole 35 is located on the other main surface 32. The flexible wiring portion 25 is provided with a connection terminal 26 at a location that passes through the through-hole 35 and extends beyond the other main surface 32 of the molded body 30. A reinforcing film 28 is provided on the surface of the flexible wiring portion 25 opposite the location where the connection terminal 26 is provided.

[0069] The portion of the flexible wiring portion 25 passing through the through hole 35 is fixed to the wall surface 35w of the through hole 35. Therefore, an adhesive layer, for example, is disposed at the portion where the flexible wiring portion 25 contacts the wall surface 35w.

[0070] Figure 6 A portion of the circuit film 20 is shown in an enlarged manner. Figure 7 The cross-sectional structure of the circuit film 20 is schematically shown. In the first embodiment, the pattern layer 71 is formed on the outer surface of the insulating film 21. In addition, the pattern layer 72, the electric circuit 22, and the protective layer 73 are formed on the inner surface of the insulating film 21.

[0071] The flexible wiring portion 25 of the circuit film 20 is a member that cuts off the periphery of the wiring 27 connected to the electric circuit 22 while maintaining the connection with the insulating film 21 . Figure 6 The portion shown is an opening 29 and its surroundings formed by punching out the circuit film 20 into an N-shape so as to correspond to the N-shaped insertion portion 33. The flexible wiring portion 25 protrudes from the opening 29.

[0072] (2) Detailed structure

[0073] (2-1) Circuit film 20

[0074] like Figure 7 As shown, the circuit film 20 includes a thermoplastic insulating film 21 , an electric circuit, pattern layers 71 and 72 , and a protective layer 73 .

[0075] Thermoplastic insulating films can be made of, for example, thermoplastic resin films, thermoplastic elastomer films, or laminated films thereof. Examples of materials for thermoplastic resin films include resin films made of polyester resin, polyethylene terephthalate (PET) resin, acrylic resin, polycarbonate resin, polybutylene terephthalate (PBT) resin, triacetylcellulose resin, styrene resin, or ABS resin; multilayer films of acrylic resin and ABS resin; or multilayer films of acrylic resin and polycarbonate resin. The thickness of the resin film can be selected, for example, from 30 μm to 500 μm.

[0076] The electrical circuit 22 is formed, for example, by forming a conductive material on the surface of the insulating film 21 and / or the pattern layer 72 and then patterning it. Alternatively, the electrical circuit 22 is formed, for example, by printing a conductive ink on the surface of the insulating film 21 and / or the pattern layer 72 by thick film printing. Conductive materials constituting the electrical circuit 22 include, for example, metal materials and semiconductor materials. Examples of metal materials include copper, aluminum, carbon, nickel, gold, silver, or tin. Examples of semiconductor materials include metal oxides and conductive polymers. For example, when a touch sensor is provided as the electrical circuit 22 in the lens portion of the glasses 1, a transparent electrode may also be used. The transparent electrode is formed, for example, of a metal oxide, a transparent conductive polymer, or a transparent conductive ink. Examples of metal oxides include indium tin oxide (ITO) and indium zinc oxide (IZO). Examples of transparent conductive polymers include PEDOT / PSS (poly-3,4-ethylenedioxythiophene / polysulfonic acid). In addition, examples of transparent conductive inks include inks containing carbon nanotubes or silver nanofibers in a binder.

[0077] The pattern layers 71 and 72 are layers used to express designs such as patterns. These layers are formed on the insulating film 21, for example, by gravure printing or screen printing. Materials comprising these layers include, for example, acrylic resins, vinyl chloride / vinyl acetate copolymers, thermoplastic urethane resins, polyester resins, and pigments or dyes added to the resins. Alternatively, the pattern layers 71 and 72 can be designed with metallic patterns using, for example, insulating aluminum paste or mirror ink. Furthermore, the pattern layer 71 can also have a concave-convex surface.

[0078] Protective layer 73 is, for example, a layer used to prevent oxidation, sulfurization, and scratching of electrical circuit 22 by circuit film 20. Protective layer 73 also serves to improve the insulation properties of electrical circuit 22 and wiring 27. Protective layer 73 is made of a material that can adhere to molded article 30 during integral molding. Examples of protective layer 73 include UV (ultraviolet) curable resins and thermosetting resins. If protective layer 73 is located on the molded article 30 side, it can be omitted.

[0079] (2-2) Molded body 30

[0080] The molded body 30 may be colored or uncolored and may be formed using a transparent, translucent, or opaque thermoplastic resin or thermoplastic elastomer. The molded body 30 is preferably made of a general-purpose thermoplastic resin such as a polystyrene resin, a polyolefin resin, ABS resin, or AS resin. Alternatively, the molded body 30 may be made of a polycarbonate resin, a polyacetal resin, an acrylic resin, a polybutylene terephthalate resin, an engineering resin (such as a polysulfone resin, a polyphenylene sulfide resin, a polyphenylene ether resin, or a polyarylate resin), a polyamide resin, or a urethane-, polyester-, or styrene-based thermoplastic elastomer. Reinforcements such as glass fiber and inorganic fillers may also be added to the molded body 30.

[0081] (3) Method for manufacturing molded article 10

[0082] First, the flexible wiring portion 25 is formed on the circuit film 20. Figure 4 The circuit film 20 shown before the flexible wiring section 25 is rectangular, for example, and lacks the N-shaped opening 29. The opening 29 is formed, for example, by punching. During this process, a portion of the flexible wiring section 25 remains unpunched. As a result, the flexible wiring section 25 is formed, while maintaining its connection to the insulating film 21, while separating the area surrounding the wiring 27 connected to the electrical circuit 22.

[0083] use Figure 6 The circuit film 20 shown is preformed. Figure 8 The flexible wiring portion 25 and its surroundings of the preformed circuit film 20 are shown in an enlarged manner. Figure 9 The N-shaped protrusion 112 and its surroundings in the first mold 110 are shown in an enlarged manner. Figure 10 The convex portion 113 in the first mold 110 is shown in an enlarged manner.

[0084] The N-shaped protrusion 112 in the first mold 110 is a structure for forming the N-shaped insert portion 33 of the molded body 30. The protrusion 112 is a structure for forming the cavity Cv (refer to Figure 11 ) is a portion of the inner surface 111 of the first mold 110 that protrudes toward the cavity Cv. A convex portion 113 further protrudes from the protruding portion 112. The convex portion 113 is a structure for forming the through hole 35 of the molded body 30. Figure 10 The flexible wiring portion 25 arranged along the convex portion 113 is shown.

[0085] In preforming, a flat circuit film 20 such as Figure 8The flexible wiring portion 25 is further bent twice from the portion 20a where it is bent along the side of the N-shaped embedded portion 33. The flexible wiring portion 25 is bent twice so that, after being arranged along the bottom surface of the N-shaped embedded portion 33, a portion of the flexible wiring portion 25 passes through the through-hole 35.

[0086] The preformed circuit film 20 is placed on the first mold 110. The circuit film 20 is formed on the side surface 113a (refer to Figure 11 ) is provided with at least a portion of the flexible wiring portion 25. Here, the front end portion 25a of the flexible wiring portion 25 is arranged along the side surface 113a of the protrusion 113. In order to be able to pull the protrusion 113 out of the molded body 30 after the molded body 30 is formed, it is inclined by more than 0.5 degrees relative to the moving direction of the first mold 110. The front end portion 25a is a portion including the connection terminal 26. In order to prevent the wiring 27 from being damaged, the circuit film 20 is bent at the locations P1, P2, and P3 (see Figure 10 ) is preferably a curved surface.

[0087] The front end 25a of the flexible wiring portion 25 is surrounded by the rib 113b of the protrusion 113. The rib 113b is a portion that protrudes from the side surface 113a. The rib 113b prevents the molten material from entering between the side surface 113a and the flexible wiring portion 25. It should be noted that the rib 113b is not necessarily required. Examples of the molten material include molten resin and molten elastomer.

[0088] Then, if Figure 11 As shown, the first mold 110 and the second mold 120 are joined. During this joining step, the convex portion 113 of the first mold 110 fits into the concave portion 123 of the second mold 120. Concave portion 123 is a portion of the inner surface 121 of the second mold 120, which is recessed toward the side opposite to the cavity Cv, and is used to form the cavity Cv. By fitting the convex portion 113 of the first mold 110 into the concave portion 123 of the second mold 120, the connection terminals 26 of the flexible wiring portion 25 are clamped in the concave portion 123 by the first and second molds 110 and 120.

[0089] After the molds are closed, molten material is injected into the cavity Cv formed by the first mold 110 and the second mold 120. This molten material solidifies in the cavity Cv, forming the molded body 30. As the molten material solidifies, the molded body 30 and the circuit film 20 are integrated. During the step of forming the molded body 30, a through-hole 35 is formed in the molded body 30 via the protrusion 113. At this time, since the tip 25a of the flexible wiring portion 25 is positioned along the side surface 113a of the protrusion 113, the flexible wiring portion 25 is positioned within the through-hole 35. This prevents the connection terminal 26, which is clamped between the first mold 110 and the second mold 120, from coming into contact with the molten material injected into the cavity Cv during the integrated molding of the circuit film 20 and the molded body 30. The distance L1 from the recess 113s for accommodating the reinforcing film 28 to the inner surface 121 of the second mold 120 is preferably at least 2 mm, for example.

[0090] <Second embodiment>

[0091] In the first embodiment, the flexible wiring portion 25 is formed as a part of the circuit film 20. However, a flexible wiring board separate from the circuit film 20 may be used as the flexible wiring portion.

[0092] (4) Overall structure

[0093] The molded article according to the second embodiment can also be used in the same manner as Figure 1 Here, in the second embodiment, the molded product 10 serving as the temple 3, the temple 2, and the hinge 4 of the eyeglasses 1 is also described as an example.

[0094] like Figure 12 As shown, molded body 30 has one main surface 31 and another main surface 32 opposite to one main surface 31. Embedded portion 33 is formed on one main surface 31 of molded body 30. Molded body 30 is integrally molded with circuit film 20 and flexible wiring portion 55, which is a flexible printed wiring board. Circuit film 20 integrally molded with molded body 30 is located on one main surface 31.

[0095] As in the first embodiment, the circuit film 20 includes an insulating film 21 and an electrical circuit 22 formed on the insulating film 21. In the second embodiment, the electrical circuit 22 formed on the circuit film 20 is an antenna. In the electrical product 5 of the second embodiment, the flexible wiring portion 55 connects the electrical circuit 22 of the circuit film 20 to the electrical device 90. Figure 13 The electric device 90 of the second embodiment shown can also be used with Figure 5 The electric device 90 shown in the first embodiment is the same electric device.

[0096] exist Figure 14, a portion of the circuit film 20 connected to the flexible wiring portion 55 is shown in an enlarged manner. For the flexible wiring board used in the flexible wiring portion 55, an existing flexible wiring board can be used. The flexible wiring board can be formed using, for example, an insulating film, wiring, and a protective layer made of the same materials as those used in the circuit film 20. The cross-sectional structure of the circuit film 20 of the second embodiment can be, for example, the same structure as that of the circuit film of the first embodiment. The flexible wiring board used in the flexible wiring portion 55 and the electrical circuit 22 of the circuit film 20 can be connected, for example, via an anisotropic conductive film 54. The electrical circuit 22 and the flexible wiring portion 55 can also be connected using solder.

[0097] The molded body 30 has a through-hole 35 extending from one main surface 31 to the other main surface 32. One end 35b of the through-hole 35 is located in the embedded portion 33, and the other end 35a of the through-hole 35 is located on the other main surface 32. A connection terminal 56 is disposed on the flexible wiring portion 55 at a location that passes through the through-hole 35 and extends beyond the other main surface 32 of the molded body 30. A reinforcing film 58 is provided on the surface of the flexible wiring portion 55 opposite the location where the connection terminal 56 is disposed.

[0098] (5) Method for manufacturing molded article 10

[0099] like Figure 14 As shown, first, the flexible wiring portion 55 is connected to the circuit film 20. The opening 29 of the circuit film 20 is formed by, for example, punching.

[0100] use Figure 14 The circuit film 20 and the flexible wiring portion 55 shown are preformed. Figure 15 The circuit film 20 and the flexible wiring portion 55 after preforming are shown in an enlarged manner. In preforming, the flat circuit film 20 and the flexible wiring portion 55 are formed by, for example, hot pressing. Figure 15 It is processed into a three-dimensional shape as shown.

[0101] The preformed circuit film 20 and the flexible wiring portion 55 are provided on the Figure 9 as well as Figure 10 The first mold 110 shown is the same as the first mold 110 (refer to Figure 16 The flexible wiring portion 55 is arranged along the convex portion 11 for forming the through hole 35 of the molded body 30.

[0102] Circuit film 20 Figure 16At least a portion of the flexible wiring portion 55 is disposed on the side surface 113a of the convex portion 113 of the first mold 110. The distal end of the flexible wiring portion 55 is disposed along the side surface 113a of the convex portion 113. The distal end of the flexible wiring portion 55 includes the connection terminal 56.

[0103] The front end of the flexible wiring portion 55, which is disposed on the side surface 113a of the protrusion 113, is surrounded by the rib 113b of the protrusion 113. The rib 113b is a portion that protrudes from the side surface 113a. The rib 113b prevents molten material from entering between the side surface 113a and the flexible wiring portion 55. It should be noted that the rib 113b may not be necessary.

[0104] Then, if Figure 16 As shown, the first mold 110 and the second mold 120 are clamped together. During this clamping step, the convex portion 113 of the first mold 110 is inserted into the concave portion 123 of the second mold 120. By inserting the convex portion 113 of the first mold 110 into the concave portion 123 of the second mold 120, the connection terminal 56 of the flexible wiring portion 55 is clamped in the concave portion 123 by the first mold 110 and the second mold 120.

[0105] After the molds are closed, molten material is injected into the cavity Cv formed by the first and second molds 110, 120. This molten material solidifies in the cavity Cv, forming the molded body 30. As the molten material solidifies, the molded body 30, the circuit film 20, and the flexible wiring portion 55 are integrated. During the step of forming the molded body 30, the protrusion 113 forms a through-hole 35 in the molded body 30. At this time, since the tip of the flexible wiring portion 55 is positioned along the side surface 113a of the protrusion 113, the flexible wiring portion 55 is positioned within the through-hole 35. This prevents the connection terminal 56, which is held between the first and second molds 110, 120, from coming into contact with the molten material injected into the cavity Cv during the integrated molding of the circuit film 20, the molded body 30, and the flexible wiring portion 55. The distance L2 from the recess 113s for housing the reinforcing film 58 to the inner surface 121 of the second mold 120 is preferably at least 2 mm, for example.

[0106] <Third embodiment>

[0107] (6) Overall structure

[0108] The molded article according to the third embodiment can be, for example, Figure 1 The structure of the molded article 10 shown in FIG. The structure of the molded article 10 of the third embodiment is omitted here. In the first and second embodiments, at the end of injection molding, the circuit film 20 and the molded article 30 are integrally molded, or the circuit film 20, the molded article 30, and the flexible wiring portion 55 are integrally molded, with the through-hole 35 open.

[0109] However, at the end of injection molding, the circuit film 20 and the molded body 30 may be integrally molded, or the circuit film 20 , the molded body 30 , and the flexible wiring portion 55 may be integrally molded to close the through hole 35 of the molded body 30 .

[0110] (7) Method for manufacturing molded article 10

[0111] Figure 17 FIG. 3 shows a molded article 10 according to a third embodiment, including a molded body 30, a circuit film 20, a flexible wiring portion 55, and a design film 40. The design film 40 covers the through-hole 35 and at least a portion of the circuit film 20. In the method for manufacturing the molded article 10 in which the design film 40 covers the through-hole 35 without a gap, for example, Figure 17 The manufacturing steps are shown.

[0112] The first mold 110 has a protrusion 113 and a groove 114. The side surface 113a of the protrusion 113 is connected to the side surface 114a of the groove 114. In other words, the side surfaces 113a and 114a form a smooth surface. A smooth surface is, for example, a plane or a continuous curved surface, and is a surface without sharp corners. When the mold is closed, the front end portion of the flexible wiring portion 55 is accommodated in the groove 114. Therefore, the connection terminal 56 at the front end portion of the flexible wiring portion 55 does not come into contact with the molten material during injection molding.

[0113] exist Figure 17 The second mold 120 shown has a terraced protrusion 125 at the location opposite the protrusion 113. The presence of this protrusion 125 facilitates positioning of the preformed circuit film 20, design film 40, and flexible wiring portion 25. While the protrusion 125 is provided, the portion opposite the protrusion 113 can be flat or concave. However, in the case of the molded article 10, the portion opposite the protrusion 113 is preferably flat to make the through-hole 35 less noticeable from the outside.

[0114] By placing and positioning the circuit film 20, design film 40, and flexible wiring section 55 on the second mold 120, the flexible wiring section 55 is guided into the groove 114 while contacting the side surfaces 113a and 114a of the protrusion 113 during mold closing. Therefore, compared to the second mold 120, the side surface 113a is preferably inclined so that the closer it is to the first mold 110, the farther it is from the side surface opposite to the side surface 113a. The side surface 113a is inclined at least 0.5 degrees relative to the direction of movement of the first mold 110.

[0115] exist Figure 17 In the figure, the circuit film 20 and the flexible wiring portion 55 are shown as separate structures, but it is also possible to use Figure 18 The circuit film 20 having the flexible wiring portion 25 shown is formed into the molded article 10 in which the through-hole 35 is blocked. Figure 18 The through hole 35 shown is blocked by the design film 40 on the other main surface 32 side of the molded body 30. Therefore, the design film 40 is recessed by the through hole 35.

[0116] In the method for manufacturing the molded article 10 in which the film 40 covers the through hole 35 without a gap, for example, Figure 18 The manufacturing steps are shown. The first mold 110 has a groove 114, and the second mold 120 has a protrusion 126. When the molds are closed, the tip of the flexible wiring portion 25 is accommodated in the groove 114. Therefore, the connection terminal 26 at the tip of the flexible wiring portion 55 does not come into contact with the molten material during injection molding.

[0117] By placing and positioning the circuit film 20 and the design film 40 on the second mold 120 , the flexible wiring portion 25 is guided into the groove 114 when the mold is closed.

[0118] (8) Modification

[0119] (8-1)

[0120] In order to realize the injection molding described in the first embodiment, the method of making the flexible wiring portion 25 follow the convex portion 113 is not limited to Figure 10 as well as Figure 11 For example, Figure 19A as well as Figure 19B As shown in FIG. 1 , the flexible wiring portion 25 may be arranged on the upper surface 113c of the protrusion 113. Figure 20A as well as Figure 20B As shown, the front end 25b of the flexible wiring portion 25 extending from the protrusion 113 can also be accommodated in the groove portion 124 of the second mold 120 along the side surface 113a of the protrusion 113. The flexible wiring portion 55 of the second embodiment can also be arranged along the protrusion 113 of the flexible wiring portion 25 in the same manner as in the first embodiment.

[0121] It should be noted that in Figure 19A as well as Figure 19B and Figure 20A as well as Figure 20B , the flexible wiring portion 25 is shown without a reinforcing film. However, a recessed portion for accommodating a reinforcing film may be provided on the convex portion 113 , and a reinforcing film may be provided on the flexible wiring portion 25 .

[0122] (8-2)

[0123] In the first embodiment, the connection terminal 26 is arranged in the flexible wiring portion 25 at a portion passing through the through hole 35 and extending beyond the other main surface 32 of the molded body 30. Figure 21 As shown in FIG. 3 , the connection terminal 26 of the flexible wiring portion 25 may be arranged in the through hole 35. In this configuration, when the molded article 10 is arranged in the order of the molded body 30, the electric circuit 22, and the insulating film 21 from the inside to the outside, the electric circuit 22 is sandwiched between the molded body 30 and the insulating film 21. In this case, for example, Figure 22A As shown, the connection terminal 26 is formed on the outer surface of the circuit film 20, and the wiring 27 and the connection terminal 26 are connected through the through hole 27a. It should be noted that when the flexible wiring portion 25 is set away from the wall surface 35w of the through hole 35, as shown in FIG. Figure 22B As shown, the through hole may not be provided, and the connection terminal 26 may be provided so as to face the wall surface 35w.

[0124] In this case, in order to realize the injection molding described in the first embodiment, the flexible wiring portion 25 is also arranged along the side surface 113a of the convex portion 113. For example, Figure 23A as well as Figure 23B As shown, the flexible wiring portion 25 of the circuit film 20 is positioned on the protrusion 113 so that the front end 25b of the flexible wiring portion 25 does not reach the inner surface 121 of the second mold 120. At this point, the connection terminals 26 of the flexible wiring portion 25 abut against the side surface 113a. This abutment of the connection terminals 26 against the side surface 113a prevents molten material from coming into contact with the connection terminals 26 during the integral molding of the circuit film 20 and the molded article 30.

[0125] The flexible wiring portion 25 is arranged in the through-hole 35 as described above so that it does not protrude toward the other main surface 32 of the molded article 30. This also applies to the flexible wiring portion 55. When the flexible wiring portion 55 is arranged and fixed in the through-hole 35, the connection terminal 56 is also arranged on the opposite side of the wall surface 35w using the through-hole. When the flexible wiring portion 55 has wiring on both sides, the wiring on one side is also connected to the connection terminal 56 on the other side through the through-hole.

[0126] (8-3)

[0127] In the first and second embodiments, the circuit film 20 is exposed on the surface of the molded article 10. However, a structure in which the circuit film 20 is not exposed on the surface of the molded article 10 may also be adopted. Figure 24As shown, a design film 40 may also be provided on the outer surface of the molded article 30. In this variation, the design film 40 is provided on the outer side of the molded article 10. The design film 40 is composed, for example, of a film made of the same material as the insulating film 21 and a design layer printed on the film. The design layer can be printed using the same material as the pattern layer. Fine irregularities may also be formed on the surface of the design film 40. An adhesive layer is preferably provided between the design film 40 and the circuit film 20.

[0128] Figure 24 The circuit film 20 shown has an electric circuit 22 disposed on the side opposite to the side where the molded article 30 is located, with the insulating film 21 interposed therebetween. It should be noted that the molded article 10, which does not include the design film 40 as in the first embodiment, may also be configured such that the electric circuit 22 is disposed on the side opposite to the side where the molded article 30 is located, with the insulating film 21 interposed therebetween. Alternatively, the electric circuit 22 may be formed on both sides of the insulating film 21.

[0129] exist Figure 24 In the method for manufacturing the molded article shown, for example, during the pre-molding of the first embodiment, the circuit film 20 and the design film 40 may be overlapped and molded, and the circuit film 20 and the design film 40 may be bonded together. Thereafter, the circuit film 20 and the design film 40 may be placed together on the first mold 110.

[0130] Alternatively, the circuit film 20 and the design film 40 may be preformed separately and then overlapped. Furthermore, when the circuit film 20 and the molded article 30 are integrally molded, the circuit film 20 and the design film 40 are bonded together.

[0131] (8-4)

[0132] The first embodiment has been described with respect to the molded article 10 in which only one flexible wiring portion 25 is disposed in the through hole 35. However, the number of flexible wiring portions 25 disposed in the through hole 35 is not limited to one, and may be multiple. For example, Figure 25 As shown, two flexible wiring portions 25 can be arranged in the through hole 35. In this case, for example, one flexible wiring portion 25 can be arranged along each of the two opposing side surfaces of the convex portion forming the through hole 35, or two flexible wiring portions 25 can be arranged along the same side surface.

[0133] The flexible wiring portion 55 of the second embodiment may be arranged in plurality in the through-hole 35, similarly to the flexible wiring portion 25 of the first embodiment. Furthermore, the flexible wiring portions 25 and 55 of the third embodiment may be arranged in plurality in the through-hole 35, similarly to the flexible wiring portion 25 of the first embodiment.

[0134] (8-5)

[0135] In the first embodiment, an N-shaped letter plate separate from the molded body 30 is described as an example of the three-dimensional member 80 covering the through hole 35. However, the three-dimensional member can be used not only as a cover for the through hole, but also as a Figure 26 as well as Figure 27 As shown, the three-dimensional member 85 is arranged in the through hole 35 .

[0136] Figure 26 Five through-holes 35 are shown formed in the molded article 10. Four of these five through-holes 35 are used, for example, as openings for speakers. Furthermore, the remaining one is used, for example, as an opening that uses light to indicate that the speaker is activated. To guide the light in this case, a three-dimensional component 85 serving as a light-guiding member is arranged in the through-hole 35. The three-dimensional component 85 serving as a light-guiding member extends toward the interior space IS of the molded article 10 surrounded by the molded body 30. The electrical circuit 22 is used, for example, as an antenna. The flexible wiring portion 25 for connecting the electrical circuit 22 extends into the interior space IS of the molded article 10 through the through-hole 35 in which the three-dimensional component 85 is arranged.

[0137] In the molded article 10 according to the second embodiment and the third embodiment, a three-dimensional member can also be arranged in the through hole 35 .

[0138] (8-6)

[0139] In the first embodiment, as a method for forming the flexible wiring portion 25, the insulating film 21 around the wiring 27 is punched out to remove the insulating film 21 around the wiring 27. However, for example, Figure 28 As shown, the flexible wiring portion 25 may be formed by cutting the insulating film 21 around the wiring 27 using the cutting lines 20 b around the wiring 27 .

[0140] (8-7)

[0141] In the first, second, and third embodiments, the electrical circuit 22 is described as an antenna. However, the electrical circuit 22 is not limited to an antenna. Examples of electrical circuits 22 other than antennas include sensors such as touch sensors, heaters, display devices such as liquid crystal displays, and input devices such as membrane switches.

[0142] The electrical device 90 is not limited to a device having a function of transmitting and receiving using an antenna, and may include, for example, a detection device connected to a sensor, a heater driver, a display driver, or a device receiving a signal input from an input device.

[0143] (8-8)

[0144] In the first, second, and third embodiments, the flexible wiring portions 25 and 55 are fixed to the wall surface 35w of the through-hole 35. However, the flexible wiring portions 25 and 55 may be provided without being fixed to the wall surface 35w of the through-hole 35. In other words, the flexible wiring portions 25 and 55 may be configured to be free and detachable without being fixed to the wall surface 35w of the through-hole 35.

[0145] In the case where the flexible wiring portion 25, 55 is not fixed to the wall surface 35w of the through-hole 35, for example, no adhesive is provided on the portion of the flexible wiring portion 25, 55 located in the through-hole 35, and the flexible wiring portion 25, 55 and the wall surface 35w are integrally molded without adhesion. For example, a mold release film may be interposed between the flexible wiring portion 25, 55 and the wall surface 35w to form the flexible wiring portion 25, 55 integrally, thereby enabling the flexible wiring portion 25, 55 to be separated from the wall surface 35w.

[0146] (9) Features

[0147] (9-1)

[0148] The molded articles 10 of the first, second, and third embodiments have a circuit film 20 on one principal surface 31 of a molded body 30. The molded body 30 has flexible wiring portions 25, 55 extending from one principal surface 31 to the other principal surface 32 through through-holes 35. When an electrical component 90 is connected to the connection terminals 26, 56 of the flexible wiring portions 25, 55, the circuit film 20 located on one principal surface 31 of the molded body 30 and the electrical component 90 located on the other principal surface 32 can be connected via the flexible wiring portions 25, 55 through the through-holes 35. The flexible wiring portions 25, 55 can be handled through the through-holes 35, thereby preventing interference between the flexible wiring portions 25, 55 and the molded body 30 or bending during handling, thereby preventing damage to the wiring 27.

[0149] (9-2)

[0150] The molded article 10 of the first, second, and third embodiments may also be configured to include a three-dimensional member 85 disposed in the through hole 35 and separate from the molded article 30 (see Figure 26 Since the molded article 10 configured in this manner shares the through-hole 35 between the three-dimensional member 85 and the flexible wiring portions 25 and 55 , a decrease in the strength of the molded article 10 can be suppressed compared to a case where a dedicated hole is provided for the three-dimensional member 85 .

[0151] (9-3)

[0152] The molded article 10 of the first and second embodiments is configured to include a three-dimensional member 80 that covers the through-hole 35 and is separate from the molded body 30. With this configuration, the through-hole 35 of the molded article 10 is concealed by the three-dimensional member 80, improving the design of the exterior. Furthermore, blocking the through-hole 35 with the three-dimensional member 80 prevents foreign matter such as dust and moisture from intruding through the through-hole 35 onto the other main surface 32 of the molded body 30.

[0153] (9-4)

[0154] In the molded articles 10 of the first, second, and third embodiments, the flexible wiring portions 25 and 55 are fixed to the wall surface 35w of the through-hole 35. Compared to a case where the flexible wiring portions 25 and 55 are not fixed to the wall surface 35w of the through-hole 35, the molded articles 10 thus configured can suppress positional changes in the flexible wiring portions 25 and 55. As a result, external devices such as the electrical device 90 can be easily connected to the connection terminals 26 and 56 of the flexible wiring portions 25 and 55.

[0155] (9-5)

[0156] The above-mentioned electrical product 5 can connect the electrical device 90 and the electrical circuit 22 inside the frame by means of the flexible wiring parts 25 and 55 from a main surface 31 of the molded product 10 facing the outside of the frame, through the through hole 35 of the molded product 10. In the first embodiment, the second embodiment and the third embodiment, the molded product 10 itself, which is composed of the temples 2, the temples 3 and the hinges 4 of the glasses 1, is the frame. In this electrical product 5, the processing of the flexible wiring parts 25 and 55 can prevent the flexible wiring parts 25 and 55 from interfering with the frame or the flexible wiring parts 25 and 55 from bending. It should be noted that the molded product 10 can also be integrated with other components to constitute an electrical product. In addition, the molded product 10 can also be a component of the frame.

[0157] (9-6)

[0158] Regarding the manufacturing methods of the molded article 10 according to the first and second embodiments, consider the case where an electrical component 90 is connected to the connection terminals 26, 56 of the flexible wiring portions 25, 55. In this case, the flexible wiring portions 25, 55 connecting the circuit film 20 located on one side of the through-hole 35 of the molded article 10 and the electrical component 90 located on the other side of the through-hole 35 can be arranged within the through-hole 35. Furthermore, when the circuit film 20 and the molded article 30 are integrally molded, since the molten material does not come into contact with the connection terminals 26, 56 of the flexible wiring portions 25, 55, poor connection between the circuit film 20 and the electrical component 90 due to poor connection of the connection terminals 26, 56 can be suppressed.

[0159] While the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and various modifications can be made without departing from the spirit of the invention. In particular, the multiple embodiments and modifications described in this specification can be arbitrarily combined as needed.

[0160] Description of Reference Numerals

[0161] 5…Electrical product, 10…Molded article, 20…Circuit film, 21…Insulating film, 22…Electrical circuit, 25, 55…Flexible wiring portion, 26, 56…Connecting terminal, 27…Wiring, 30…Molded article, 35…Through hole, 35w…Wall surface, 40…Design film, 80, 85…Three-dimensional component.

Claims

1. A molded article comprising: A circuit film comprising a thermoplastic insulating film and an electric circuit formed on the insulating film; and The molded body has one main surface and another main surface opposite to the one main surface, and is integrally molded with the circuit film located on the one main surface. The circuit film has a flexible wiring portion formed of wiring connected to the electric circuit. The molded body has a through hole extending from the one main surface to the other main surface. The flexible wiring portion is arranged with a gap between it and a wall surface of the through-hole, and a connection terminal is arranged in the through-hole or in a portion of the flexible wiring portion that passes through the through-hole and exceeds the other main surface.

2. A molded article comprising: A circuit film comprising a thermoplastic insulating film and an electric circuit formed on the insulating film; a flexible wiring portion having thermoplasticity, being separate from the circuit film, and being composed of a flexible printed circuit board connected to the electrical circuit; and The molded body has one main surface and another main surface opposite to the one main surface, and is integrally molded with the circuit film and the flexible wiring portion located on the one main surface. The molded body has a through hole extending from the one main surface to the other main surface. The flexible wiring portion is arranged with a gap between it and a wall surface of the through-hole, and a connection terminal is arranged in the through-hole or in a portion of the flexible wiring portion that passes through the through-hole and exceeds the other main surface.

3. The molded article according to claim 1 or 2, wherein The molded article includes a three-dimensional member that is arranged in the through-hole and is separate from the molded body.

4. The molded article according to claim 1 or 2, wherein The molded article includes a three-dimensional member that is separate from the molded body and covers the through-hole.

5. The molded article according to claim 1 or 2, wherein The molded article includes a design film that covers the through-hole and at least a portion of the circuit film and is integrally molded with the molded body.

6. The molded article according to claim 1 or 2, wherein The flexible wiring portion is fixed to a wall surface of the through hole.

7. An electrical product having: A frame comprising the molded article according to any one of claims 1 to 6; and an electrical device, disposed in the frame and connected to the connection terminal of the flexible wiring portion; The molded article is mounted so that the one main surface faces the outside of the frame and the other main surface faces the inside of the frame.

8. A method for manufacturing a molded article, comprising: a step of preforming a thermoplastic insulating film and a circuit film having an electric circuit formed on the insulating film; a step of arranging the circuit film on a first mold; performing a step of closing the first mold and the second mold; and Injecting molten material into the cavities of the first mold and the second mold to form a molded body integrally molded with the circuit film, In the preforming, a thermoplastic flexible wiring portion formed to be connected to the electric circuit is raised in a direction intersecting the in-plane direction of the circuit film. In the step of providing the circuit film, at least a portion of the flexible wiring portion is arranged on a side surface of the convex portion of the first mold. In the mold clamping, the convex portion of the first mold is fitted into the concave portion of the second mold, and the connection terminal of the flexible wiring portion is clamped in the concave portion by the first mold and the second mold. In the step of forming the molded body, the circuit film and the molded body are integrally molded by providing a through hole in the molded body through the protrusion and arranging the flexible wiring portion in the through hole, without allowing the molten material to contact the connection terminal.

9. A method for manufacturing a molded article, comprising: a step of preforming a thermoplastic insulating film and a circuit film having an electric circuit formed on the insulating film; a step of arranging the circuit film on a first mold; performing a step of closing the first mold and the second mold; and Injecting molten material into the cavities of the first mold and the second mold to form a molded body integrally molded with the circuit film, In the preforming, a thermoplastic flexible wiring portion, which is separate from the circuit film formed of a flexible printed circuit board connected to the electric circuit, is raised in a direction intersecting the in-plane direction of the circuit film. In the step of providing the circuit film, at least a portion of the flexible wiring portion is arranged on a side surface of the convex portion of the first mold. In the mold clamping, the convex portion of the first mold is fitted into the concave portion of the second mold, and the connection terminal of the flexible wiring portion is clamped in the concave portion by the first mold and the second mold. In the step of forming the molded body, the circuit film and the molded body are integrally molded by providing a through hole in the molded body through the protrusion and arranging the flexible wiring portion in the through hole, without allowing the molten material to contact the connection terminal.

Images