Wafer cleaning system with nitrogen blowing and wafer cleaning method

Abstract

The present invention discloses a wafer cleaning system with nitrogen blowing and a wafer cleaning method, wherein the wafer cleaning system with nitrogen blowing comprises: a cleaning chamber, a cleaning table, a movable arm and a dual-fluid spray assembly, a cleaning table is provided in the cleaning chamber, a wafer is operably placed on the cleaning table, the movable arm is provided on the outside of the cleaning chamber, the dual-fluid spray assembly is installed on the movable arm, and the movable arm is used to drive the dual-fluid spray assembly to move directly above the wafer. Through the application of the present invention, in the process of cleaning the wafer surface, it is achieved that the liquid nozzle and the nitrogen nozzle work simultaneously and the output end of the nitrogen nozzle moves around the output end of the liquid nozzle, forming a nearly spiral dual fluid to clean the wafer surface, and the corresponding cleaning liquid or pure water is more efficiently and evenly diffused on the surface of the wafer, thereby ensuring the cleaning quality of the wafer and reducing the generation of liquid spots on the wafer surface.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and in particular to a wafer cleaning system with nitrogen blowing and a wafer cleaning method. Background Art

[0002] At present, many wafer production companies use a wet process to clean the surface of the wafer. This wet process generally uses a corresponding cleaning table to make the wafer rotate, and sprays various cleaning liquids on the surface of the wafer so that the cleaning liquid can be stably diffused under the drive of the rotating wafer to achieve cleaning. During the cleaning process, nitrogen is often blown onto the wafer from the outside of the cleaning table to better cover the surface of the wafer with a water film. However, in the actual cleaning process, the cleaning liquid often spreads unevenly on the corresponding wafer to be cleaned, causing the above-mentioned cleaning liquid to be more randomly distributed and accumulated on the position of the wafer when the wafer rotates, which is prone to produce liquid spots, causing the cleaning or pickling process to result in inconsistent uniformity, which is very likely to affect the cleaning quality of the wafer. Summary of the Invention

[0003] In view of this, in order to solve the above problems, the object of the present invention is to provide a wafer cleaning system with nitrogen blowing, comprising: a cleaning chamber, a cleaning table, a movable arm and a dual-fluid spray assembly, wherein the cleaning table is provided in the cleaning chamber, a wafer is operably placed on the cleaning table, the movable arm is provided outside the cleaning chamber, the dual-fluid spray assembly is mounted on the movable arm, and the movable arm is used to drive the dual-fluid spray assembly to move directly above the wafer;

[0004] The dual-fluid spray assembly includes: a pipeline assembly, a liquid nozzle and at least one nitrogen nozzle. The movable arm has a movable mounting portion, on which the nitrogen nozzle and the liquid nozzle are arranged. Both the nitrogen nozzle and the liquid nozzle are connected to the pipeline assembly. The nitrogen nozzle is movably mounted on the movable mounting portion, and the moving trajectory of the nitrogen nozzle is arranged around the liquid nozzle.

[0005] In another preferred embodiment, the number of the nitrogen spray heads is two, both of the nitrogen spray heads are movably mounted on the movable mounting portion, and the two nitrogen spray heads are symmetrically arranged with respect to the liquid spray head.

[0006] In another preferred embodiment, the movable arm includes: a base, a lifting arm and a rotating arm, the base is arranged on the outside of the cleaning chamber, the lifting arm is arranged in a vertical direction, the lower end of the lifting arm is connected to the base, the rotating arm is arranged in a horizontal direction, one end of the rotating arm is rotatably connected to the upper end of the lifting arm, and the other end of the rotating arm is connected to the movable mounting part.

[0007] In another preferred embodiment, the movable mounting portion includes: a mounting body and a movable driving mechanism, the liquid nozzle is fixedly mounted on the middle part of the lower surface of the mounting body, the nitrogen nozzle is movably mounted on the outer edge of the lower surface, the movable driving mechanism is mounted on the mounting body, the movable driving mechanism is connected to the nitrogen nozzle, and the movable driving mechanism is used to drive the nitrogen nozzle to move around the liquid nozzle.

[0008] In another preferred embodiment, the mobile drive mechanism includes: a rotating mechanism, a connecting arm and a connecting head. The rotating mechanism is installed in the middle of the upper surface of the installation body, the output end of the rotating mechanism is connected to one end of the connecting arm, the other end of the connecting arm is connected to the connecting head, and the connecting head is connected to the nitrogen nozzle.

[0009] In another preferred embodiment, an arc-shaped groove is provided on the outer edge of the installation body, and the connector can be slidably disposed through the arc-shaped groove.

[0010] In another preferred embodiment, the apparatus further comprises: a liquid supply device and a nitrogen supply device, both of which are connected to the pipeline assembly, the liquid supply device being used to supply liquid to the liquid nozzle, and the nitrogen supply device being used to supply nitrogen to the nitrogen nozzle.

[0011] In another preferred embodiment, the liquid is a chemical liquid or pure water.

[0012] In another preferred embodiment, the pipeline assembly includes a first pipeline and a second pipeline, the first pipeline is arranged in the movable installation part, one end of the first pipeline is connected to the liquid nozzle, and the second pipeline is arranged on the outside of the movable installation part, one end of the second pipeline is connected to the nitrogen nozzle.

[0013] The present invention also aims to provide a wafer cleaning method, comprising the wafer cleaning system with nitrogen blowing as described in any one of the above, comprising the following steps:

[0014] Step S1, placing the wafer on a cleaning table;

[0015] Step S2, driving the wafer to rotate in the cleaning chamber via the cleaning table;

[0016] Step S3, controlling the movable mounting portion to move to directly above the wafer and opening the liquid spray head for spraying;

[0017] Step S4: Open the nitrogen nozzle to blow air and make the nitrogen nozzle move back and forth around the liquid nozzle.

[0018] Due to the adoption of the above technical solution, the present invention has the following positive effects compared with the prior art: through the application of the present invention, during the process of cleaning the wafer surface, the liquid nozzle and the nitrogen nozzle work simultaneously and the output end of the nitrogen nozzle moves around the output end of the liquid nozzle, forming a double fluid in an approximately spiral shape to clean the wafer surface, and making the corresponding cleaning liquid or pure water more efficiently and evenly diffuse on the surface of the wafer, thereby ensuring the cleaning quality of the wafer and reducing the generation of liquid spots on the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a wafer cleaning system of a nitrogen blowing device of the present invention.

[0020] In the attached figure:

[0021] 1. Cleaning table; 2. Cleaning chamber; 3. Pipeline assembly; 4. Mobile mounting unit; 5. Nitrogen nozzle; 6. Mobile arm; 7. Liquid nozzle. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0023] like Figure 1As shown, a wafer cleaning system with nitrogen blowing in a preferred embodiment is shown, comprising: a cleaning chamber 2, a cleaning table 1, a movable arm 6 and a dual-fluid spray assembly, a cleaning table 1 is provided in the cleaning chamber 2, a wafer is operably placed on the cleaning table 1, the movable arm 6 is provided on the outside of the cleaning chamber 2, a dual-fluid spray assembly is installed on the movable arm 6, and the movable arm 6 is used to drive the dual-fluid spray assembly to move directly above the wafer; wherein, the dual-fluid spray assembly comprises: a pipeline assembly 3, a liquid nozzle 7 and at least one nitrogen nozzle 5, the movable arm 6 has a movable movable mounting portion 4, a nitrogen nozzle 5 and a liquid nozzle 7 are provided on the movable mounting portion 4, the nitrogen nozzle 5 and the liquid nozzle 7 are both connected to the pipeline assembly 3, the nitrogen nozzle 5 is movably mounted on the movable mounting portion 4, and the moving trajectory of the nitrogen nozzle 5 is arranged around the liquid nozzle 7. Furthermore, the movable arm 6 is used to drive the movement of the movable mounting part 4 so that the movable mounting part 4 can be set close to the cleaning table 1 or away from the cleaning table 1, and then by controlling the dual-fluid spray component, when the movable mounting part 4 is above the wafer, liquid spraying and nitrogen blowing can be performed simultaneously, and as the nitrogen nozzle 5 moves around the liquid nozzle 7, the nitrogen blown out by the nitrogen nozzle 5 and the liquid sprayed by the liquid nozzle 7 together form a two-fluid form that is approximately spiral and contacts the surface of the wafer, thereby achieving a better cleaning effect on the wafer surface.

[0024] Furthermore, as a preferred embodiment, there are two nitrogen spray heads 5, both of which are movably mounted on the movable mounting portion 4, and the two nitrogen spray heads 5 are symmetrically arranged about the liquid spray head 7. Furthermore, the two nitrogen spray heads 5 can be simultaneously moved counterclockwise or clockwise around the liquid spray head 7, and the movement amplitude of the two nitrogen spray heads 5 relative to the liquid spray head 7 is no more than 180 degrees, and the movement trajectories of the two nitrogen spray heads 5 are both arranged in an arc shape.

[0025] Furthermore, as a preferred embodiment, the movable arm 6 includes a base, a lifting arm, and a rotating arm. The base is disposed outside the cleaning chamber 2. The lifting arm is disposed vertically, with the lower end of the lifting arm connected to the base. The rotating arm is disposed horizontally, with one end of the rotating arm rotatably connected to the upper end of the lifting arm, and the other end of the rotating arm connected to the movable mounting portion 4. Furthermore, the lifting arm drives the rotating arm to perform vertical lifting and lowering movements so that the movable mounting portion 4 is at a suitable height relative to the wafer, and the movable mounting portion 4 can be driven to swing in an arc shape by the control of the rotating arm.

[0026] Furthermore, as a preferred embodiment, the movable mounting portion 4 includes: a mounting body and a movable driving mechanism, the liquid nozzle 7 is fixedly mounted on the middle part of the lower surface of the mounting body, the nitrogen nozzle 5 is movably mounted on the outer edge of the lower surface, the movable driving mechanism is mounted on the mounting body, the movable driving mechanism is connected to the nitrogen nozzle 5, and the movable driving mechanism is used to drive the nitrogen nozzle 5 to move around the liquid nozzle 7.

[0027] Furthermore, as a preferred embodiment, the installation body is provided in a disc-shaped structure.

[0028] Furthermore, as a preferred embodiment, the mobile drive mechanism includes: a rotating mechanism, a connecting arm and a connecting head. The rotating mechanism is installed in the middle of the upper surface of the installation body, the output end of the rotating mechanism is connected to one end of the connecting arm, the other end of the connecting arm is connected to the connecting head, and the connecting head is connected to the nitrogen nozzle 5.

[0029] Furthermore, as a preferred embodiment, the rotating mechanism may be a rotating motor.

[0030] Furthermore, as a preferred embodiment, an arcuate groove is provided on the outer edge of the installation body, and the connector can be slidably arranged through the arcuate groove.

[0031] Furthermore, as a preferred embodiment, for the embodiment in which the two nitrogen spray nozzles 5 are provided at the same time, the connecting arm can be extended, and the middle part of the connecting arm is connected to the rotating mechanism, and the two ends of the connecting arm are respectively connected to the two connecting heads, and the two connecting heads are respectively operably provided with the two nitrogen spray nozzles 5.

[0032] Furthermore, as a preferred embodiment, the connector is provided in a sleeve structure, and the nitrogen nozzle 5 is provided through the connector from top to bottom.

[0033] Furthermore, as a preferred embodiment, it also includes: a liquid supply device and a nitrogen supply device, both of which are connected to the pipeline assembly 3, the liquid supply device is used to supply liquid to the liquid nozzle 7, and the nitrogen supply device is used to supply nitrogen to the nitrogen nozzle 5.

[0034] Furthermore, as a preferred embodiment, the liquid is a chemical liquid or pure water.

[0035] Furthermore, as a preferred embodiment, the pipeline assembly 3 includes a first pipeline and a second pipeline, the first pipeline is arranged in the movable mounting portion 4, one end of the first pipeline is connected to the liquid nozzle 7, and the second pipeline is arranged on the outside of the movable mounting portion 4, one end of the second pipeline is connected to the nitrogen nozzle 5.

[0036] Furthermore, as a preferred embodiment, the other end of the first pipeline passes through the movable mounting portion 4 and is connected to the liquid supply device, and the other end of the second pipeline is connected to the nitrogen supply device.

[0037] Furthermore, as a preferred embodiment, it further comprises: a pipeline limiting member, the pipeline limiting member is installed on the movable arm 6, and the first pipeline and the second pipeline are both constrained in the pipeline limiting member.

[0038] The above descriptions are merely preferred embodiments of the present invention and are not intended to limit the implementation and protection scope of the present invention.

[0039] The present invention also has the following implementation modes based on the above:

[0040] The present invention also aims to provide a wafer cleaning method, comprising any one of the above-mentioned wafer cleaning systems with nitrogen blowing, comprising the following steps:

[0041] Step S1, placing the wafer on the cleaning table 1;

[0042] Step S2, the cleaning table 1 drives the wafer to rotate in the cleaning chamber 2;

[0043] Step S3, controlling the movable mounting portion 4 to move to the top of the wafer and opening the liquid spray head 7 for spraying;

[0044] In step S4 , the nitrogen nozzle 5 is turned on to blow air and the nitrogen nozzle 5 is moved back and forth around the liquid nozzle 7 .

[0045] In a further embodiment of the present invention, while step S4 is being performed, the movable arm 6 can be controlled to drive the movable mounting portion 4 to swing back and forth in the horizontal direction.

[0046] The above description is only a preferred embodiment of the present invention and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer cleaning system with nitrogen blowing, characterized in that: include: A cleaning chamber, a cleaning table, a movable arm, and a dual-fluid spray assembly. The cleaning table is disposed in the cleaning chamber, a wafer is operably placed on the cleaning table, the movable arm is disposed outside the cleaning chamber, the dual-fluid spray assembly is mounted on the movable arm, and the movable arm is used to drive the dual-fluid spray assembly to move directly above the wafer. The dual-fluid spray assembly includes: a pipeline assembly, a liquid spray head, and at least one nitrogen spray head. The movable arm has a movable mounting portion. The nitrogen spray head and the liquid spray head are arranged at different positions on the movable mounting portion. The nitrogen spray head and the liquid spray head are both connected to the pipeline assembly. The nitrogen spray head is movably mounted on the movable mounting portion. The moving trajectory of the nitrogen spray head is arranged around the liquid spray head. By operating the liquid nozzle and the nitrogen nozzle simultaneously and making the output end of the nitrogen nozzle move around the output end of the liquid nozzle, a nearly spiral double fluid is formed to clean the wafer surface.

2. The wafer cleaning system with nitrogen blowing according to claim 1, characterized in that There are two nitrogen spray heads, both of which are movably mounted on the movable mounting portion, and are symmetrically arranged with respect to the liquid spray head.

3. The wafer cleaning system with nitrogen blowing according to claim 1, characterized in that The movable arm includes: a base, a lifting arm and a rotating arm. The base is arranged on the outside of the cleaning chamber, the lifting arm is arranged in a vertical direction, the lower end of the lifting arm is connected to the base, the rotating arm is arranged in a horizontal direction, one end of the rotating arm is rotatably connected to the upper end of the lifting arm, and the other end of the rotating arm is connected to the movable mounting part.

4. The wafer cleaning system with nitrogen blowing according to claim 1, characterized in that The movable mounting portion includes: a mounting body and a movable driving mechanism, the liquid nozzle is fixedly mounted on the middle part of the lower surface of the mounting body, the nitrogen nozzle is movably mounted on the outer edge of the lower surface, and the movable driving mechanism is mounted on the mounting body. The movable driving mechanism is connected to the nitrogen nozzle and is used to drive the nitrogen nozzle to move around the liquid nozzle.

5. The wafer cleaning system with nitrogen blowing according to claim 4, characterized in that: The mobile drive mechanism includes: a rotating mechanism, a connecting arm and a connecting head. The rotating mechanism is installed in the middle of the upper surface of the installation body. The output end of the rotating mechanism is connected to one end of the connecting arm, the other end of the connecting arm is connected to the connecting head, and the connecting head is connected to the nitrogen spray head.

6. The wafer cleaning system with nitrogen blowing according to claim 5, characterized in that: An arc-shaped groove is provided on the outer edge of the installation body, and the connecting head can be slidably arranged through the arc-shaped groove.

7. The wafer cleaning system with nitrogen blowing according to claim 1, characterized in that: Also includes: A liquid supply device and a nitrogen supply device, both of which are connected to the pipeline assembly, the liquid supply device is used to supply liquid to the liquid nozzle, and the nitrogen supply device is used to supply nitrogen to the nitrogen nozzle.

8. The wafer cleaning system with nitrogen blowing according to claim 7, characterized in that: The liquid is chemical liquid or pure water.

9. The wafer cleaning system with nitrogen blowing according to claim 1, characterized in that: The pipeline assembly includes a first pipeline and a second pipeline. The first pipeline is arranged in the movable installation part, and one end of the first pipeline is connected to the liquid nozzle. The second pipeline is arranged outside the movable installation part, and one end of the second pipeline is connected to the nitrogen nozzle.

10. A wafer cleaning method, using the wafer cleaning system with nitrogen blowing according to any one of claims 1 to 9, characterized in that: The steps include: Step S1, placing the wafer on a cleaning table; Step S2, driving the wafer to rotate in the cleaning chamber via the cleaning table; Step S3, controlling the movable mounting portion to move to directly above the wafer and opening the liquid spray head for spraying; Step S4: Open the nitrogen nozzle to blow air and make the nitrogen nozzle move back and forth around the liquid nozzle.

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