Flexible circuit board and display device

Abstract

This application discloses a flexible circuit board and display device. The flexible circuit board includes a circuit board body, the circuit board body including at least one metal trace layer, and each metal trace layer is provided with an insulating layer on both sides. The circuit board body includes a first binding area and a heat exchange area different from the first binding area. The metal trace layer includes contacts located in the first binding area and a heat exchange portion located in the heat exchange area. The insulating layer on one side of the circuit board body has a first hollow area exposing the contacts and a second hollow area exposing the heat exchange portion. This solution can achieve good heat dissipation for the chip.

Description

Technical Field

[0001] The present invention generally relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Art

[0002] With the development of display technology, a structure in which a fan-out area of ​​a display panel of a display device is bent to the back of the display panel to bind components such as a flexible circuit board is becoming increasingly popular.

[0003] Generally, the flexible circuit board and the fan-out area are arranged side by side on the back of the display panel. In order to increase the fitting space on the back of the display panel, the flexible circuit board and the fan-out area need to be bound in reverse, that is, the flexible circuit board is flipped over to cover the fan-out area. In this way, the flexible circuit board will cover the chip set in the fan-out area, resulting in obstruction of chip heat dissipation. Summary of the Invention

[0004] The present application aims to provide a flexible circuit board and a display device, which can at least solve the problem of heat dissipation obstruction of the chip when the flexible circuit board covers the chip.

[0005] In a first aspect, the present invention provides a flexible circuit board, comprising:

[0006] A circuit board body, the circuit board body comprising at least one metal wiring layer, with insulating layers provided on both sides of each metal wiring layer;

[0007] The circuit board body includes a first binding area and a heat exchange area different from the first binding area;

[0008] The metal routing layer includes a contact located in the first binding area, and a heat exchange portion located in the heat exchange area;

[0009] The insulating layer on one side of the circuit board body has a first hollow area exposing the contact and a second hollow area exposing the heat exchange portion.

[0010] As an implementation method, a reinforcement layer is provided on a side of the circuit board body facing away from the second hollow area, and the reinforcement layer is at least located in the heat exchange area.

[0011] As an implementation manner, the reinforcement layer is at least any one of a polyimide layer, a polypropylene layer, a polyethylene layer, a polycarbonate layer, a polyvinyl chloride layer, a polystyrene layer and a stainless steel layer.

[0012] As an implementation method, the circuit board body includes a plurality of stacked metal wiring layers, and the insulating layer is provided between adjacent metal wiring layers;

[0013] The second hollow region penetrates from the first insulating layer to one of the metal wiring layers, and the second hollow region penetrates at least two of the metal wiring layers.

[0014] As an implementable manner, the second hollow area extends from the first insulating layer to the last metal wiring layer.

[0015] As an implementation manner, at least the outermost insulating layer on the other side of the circuit board body has a third hollow area exposing the metal wiring layer.

[0016] As an implementation method, electromagnetic shielding layers are provided on both sides of the circuit board body at positions different from the first hollow area, the second hollow area, and the third hollow area.

[0017] As an implementation manner, in the orthographic projection of the circuit board body, the boundary of the heat-dissipated component is located within the second hollow area.

[0018] In a second aspect, the present invention provides a display device comprising a display panel and the above-mentioned flexible circuit board;

[0019] The display panel includes a display area and a fan-out area, the fan-out area is bent to the back of the display area, and a second binding area and a chip are provided on a side of the fan-out area away from the display area;

[0020] In the orthographic projection of the display panel, the flexible circuit board is located in the fan-out area, and the contacts of the flexible circuit board are bound to the second binding area, and the heat exchange portion is in thermal exchange cooperation with the chip.

[0021] As an implementation method, a heat conducting layer is provided between the chip and the heat exchange portion.

[0022] In the above solution, since a second hollow area is provided to expose the heat exchange part, the heat exchange part can exchange heat with the heat-dissipated components, such as chips, etc. Even if the chip is covered by the flexible circuit board, the heat generated by the chip can be transferred to the metal wiring layer through the heat exchange part. Since metal has good thermal conductivity and the metal wiring layer has a large area in the flexible circuit board, the large area of ​​the metal wiring layer and its excellent thermal conductivity can uniformly distribute the heat generated by the chip and conduct it to the outside world, thereby achieving good heat dissipation of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Other features, objects and advantages of the present application will become more apparent upon reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0024] Figure 1 It is a structural diagram of a display device in the related art;

[0025] Figure 2 A schematic structural diagram of a display device provided in a first embodiment of the present invention;

[0026] Figure 3 A front view of a flexible circuit board provided in accordance with a second embodiment of the present invention;

[0027] Figure 4 for Figure 3 Rear view;

[0028] Figure 5 for Figure 4 Cross-sectional view of the AA part;

[0029] Figure 6 The flexible circuit board provided in the third embodiment of the present invention corresponds to Figure 4 Cross-sectional view of the AA part;

[0030] Figure 7 The flexible circuit board provided in the fourth embodiment of the present invention corresponds to Figure 4 Cross-sectional view of the AA part;

[0031] Figure 8 The flexible circuit board provided in the fifth embodiment of the present invention corresponds to Figure 4 Cross-sectional view of the AA part;

[0032] Figure 9 A front view of a flexible circuit board provided in a sixth embodiment of the present invention;

[0033] Figure 10 for Figure 9 Rear view;

[0034] Figure 11 for Figure 10 Cross-sectional view of the BB area;

[0035] Figure 12 The flexible circuit board provided in the seventh embodiment of the present invention corresponds to Figure 10 Cross-sectional view of the BB area;

[0036] Figure 13 This is a schematic structural diagram of a display device provided in an eighth embodiment of the present invention. DETAILED DESCRIPTION

[0037] The present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the relevant invention and are not intended to limit the invention. It should also be noted that, for ease of description, only portions relevant to the invention are shown in the accompanying drawings.

[0038] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0039] like Figure 1 As shown in the related art, the fan-out area Fanout of the display panel 204 of the display device is bent to the back of the display panel 204 to bind components such as the flexible circuit board 1. The flexible circuit board 1 and the fan-out area Fanout are arranged side by side on the back of the display panel 204. In this way, the flexible circuit board 1 occupies a certain space behind the display panel 204. In order to increase the fitting space on the back of the display panel 204, it is necessary to bind the flexible circuit board 1 and the fan-out area Fanout in the reverse direction, as shown in FIG. Figure 2 As shown, the flexible circuit board 1 is flipped over to cover the fan-out area Fanout. In this way, the flexible circuit board 1 will cover the chip 11 set in the fan-out area Fanout, resulting in heat dissipation obstruction of the chip 11. In order to solve the problem of heat dissipation obstruction of the chip 11, the present invention provides a heat exchange portion 41 in the circuit board body 6, and provides a second hollow area 42 exposing the heat exchange portion 41 on the same side of the circuit board body 6 where the contact 31 is provided, so that the heat exchange portion 41 can exchange heat with the heat-dissipated component, such as the chip 11, to solve the problem of heat dissipation obstruction. The solution of the present invention is described in detail below:

[0040] like Figure 3-Figure 5 As shown, the present invention provides a flexible circuit board 1, comprising:

[0041] A circuit board body 6, the circuit board body 6 comprising at least one metal wiring layer 62, with insulating layers 61 disposed on both sides of each metal wiring layer 62;

[0042] The metal wiring layer 62 is, for example but not limited to, a copper layer, and the copper layer can be patterned according to actual needs.

[0043] Generally, the number of metal trace layers 62 can be determined based on the complexity of the circuit connection. The more complex the circuit connection, the more metal trace layers 62 can be used. Different layers of metal trace layers 62 can be connected through via structures 64. Via structures 64 are generally made of the same material as metal trace layers 62. Therefore, in addition to achieving circuit connections between different layers of metal trace layers 62, they can also transfer heat between different layers of metal trace layers 62.

[0044] The insulating layer 61 may be a single-layer structure or a composite layer structure of two or more layers. For example, in this example, a composite layer structure is used, which includes a PI (Polyimide) layer 612 and an adhesive layer 611. For example, but not limited to, the insulating layer 61 may be a stacked PI layer 612 and adhesive layer 611, or a stacked adhesive layer 611, a PI layer 612, and an adhesive layer 611. Correspondingly, when one layer of metal routing layer 62 is used, the structure of the circuit board main body 6 can be a stacked arrangement of PI layer 612-adhesive layer 611-metal routing layer 62-adhesive layer 611-PI layer 612; when two layers of metal routing layers 62 are used, the structure of the circuit board main body 6 can be a stacked arrangement of PI layer 612-adhesive layer 611-metal routing layer 62-adhesive layer 611-PI layer 612-adhesive layer 611-metal routing layer 62-adhesive layer 611-PI layer 612; and multiple layers of metal routing layers 62 can be set according to this rule.

[0045] The circuit board body 6 includes a first binding area 3 and a heat exchange area 4 different from the first binding area 3;

[0046] The metal wiring layer 62 includes a contact 31 located in the first binding area 3 and a heat exchange portion 41 located in the heat exchange area 4;

[0047] The flexible circuit board 1 can be bound to a location requiring electrical connection via the contacts 31 of the first binding area 3 , such as the second binding area 12 of the fan-out area of ​​the display panel 204 , to achieve electrical connection with the display panel 204 .

[0048] Among them, a part of the area in the metal routing layer 62 can be used as the heat exchange part 41, and the heat exchange part 41 can be an independent part of the metal routing layer 62, which is only used for heat exchange; of course, it can also be a part of some lines in the metal routing layer 62, which can not only perform heat exchange but also be used for the transmission of electrical signals.

[0049] The insulating layer 61 on one side of the circuit board body 6 has a first hollowed-out area 32 that exposes the contacts 31 and a second hollowed-out area 42 that exposes the heat exchange portion 41. That is, the first hollowed-out area 32 and the second hollowed-out area 42 are located on the same side of the circuit board body 6. When the circuit board body 6 is bonded to the fan-out area (Fanout) of the display panel 204 via the contacts 31, the top surface of the chip 11 disposed in the fan-out area can exchange heat with the heat exchange portion 41 through the second hollowed-out area 42.

[0050] In the above scheme, since the second hollow area 42 exposing the heat exchange portion 41 is provided, the heat exchange portion 41 can exchange heat with the heat-dissipated components, such as the chip 11, etc. Even if the chip 11 is covered by the flexible circuit board 1, the heat generated by the chip 11 can be transferred to the metal wiring layer 62 through the heat exchange portion 41. Since metal has good thermal conductivity and the metal wiring layer 62 has a large area in the flexible circuit board 1, the large area of ​​the metal wiring layer 62 and its excellent thermal conductivity can uniformly distribute the heat generated by the chip 11 and conduct it to the outside world, thereby achieving good heat dissipation of the chip 11.

[0051] As an implementation method, when the total number of layers of the circuit board body 6 is relatively small, such as when one or two metal trace layers 62 are provided, and the insulating layer 61 is a composite structure of a PI layer 612 and an adhesive layer 611, the circuit board body 6 can accordingly be five or nine layers, and is relatively thin overall. After the second hollow area 42 is provided in one of the insulating layers 61, the overall strength of the circuit board body 6 is reduced. To improve the strength of the circuit board body 6, a reinforcement layer is provided on the side of the circuit board body 6 facing away from the second hollow area 42, and the reinforcement layer is located at least in the heat exchange area 4. Since the second hollow area 42 is located in the heat exchange area 4, the reinforcement layer is provided at least in the heat exchange area 4, that is, the reinforcement layer can just cover the heat exchange area 4. Of course, its coverage range can also be larger than the heat exchange area 4, to compensate for the reduction in strength of the circuit board body 6 caused by the provision of the second hollow area 42, thereby strengthening the strength of the circuit board body 6.

[0052] As an implementation manner, the reinforcement layer is at least any one of a polyimide layer, a polypropylene layer, a polyethylene layer, a polycarbonate layer, a polyvinyl chloride layer, a polystyrene layer and a stainless steel layer.

[0053] In this example, a stainless steel (SUS) layer is used as the reinforcement layer. The stainless steel layer can fix the shape of the flexible circuit board 1 on the one hand, and on the other hand, stainless steel is also a good conductor of heat, which can further achieve the purpose of heat distribution and heat dissipation.

[0054] As an implementation method, the circuit board body 6 includes a plurality of stacked metal wiring layers 62 , and the insulating layer 61 is provided between adjacent metal wiring layers 62 ;

[0055] The second hollow region 42 penetrates from the first insulating layer 61 to one of the metal wiring layers 62 , and the second hollow region 42 penetrates at least two of the metal wiring layers 62 .

[0056] In the case where the circuit board body 6 includes multiple stacked metal trace layers 62, the overall thickness of the circuit board body 6 is relatively thick. In this case, the second hollowed-out area 42 can be formed from the first insulating layer 61 through at least two of the metal trace layers 62. This can also be considered as a blind hole extending from the first insulating layer 61 to at least the third metal trace layer 62. This blind hole serves as a space for accommodating the chip 11, and its depth (which may also refer to the specific metal trace layer 62 to be penetrated) can be determined based on the height of the chip 11. In this structure, due to the overall thickness of the circuit board body 6, it has sufficient strength, and the chip 11 is located within the blind hole, the flexible circuit board 1 can remain relatively flat, eliminating the need for a reinforcement layer to stabilize the shape of the flexible circuit board 1.

[0057] As an implementation method, the second hollow area 42 extends from the first insulating layer 61 to the last metal routing layer 62. The last metal routing layer 62 is the metal routing layer 62 farthest from the fan-out area and is also the layer closest to the outside world (which can be considered to be outside the flexible circuit board 1). The second hollow area 42 extends through each layer, allowing heat transfer to diffuse to the outside world with the minimum distance, further improving the heat dissipation capability of the chip 11.

[0058] As a feasible method, in order to further improve the ability of heat diffusion to the outside world and improve the heat dissipation of the chip 11, at least the outermost insulating layer 61 on the other side of the circuit board body 6 (that is, the side away from the chip 11) has a third hollow area 2 exposing the metal wiring layer 62. Part of the metal wiring layer 62 is exposed from the insulating layer 61 through the third hollow area 2, so that the heat absorbed by the metal wiring layer 62 from the chip 11 can be directly dissipated to the outside world.

[0059] As an implementable method, in order to improve the anti-interference performance of the flexible circuit board 1 in transmitting signals and to prevent the flexible circuit board 1 from interfering with other external circuits when transmitting signals, an electromagnetic shielding layer 63 is provided on both sides of the circuit board body 6 at positions different from the first hollow area 32, the second hollow area 42 and the third hollow area 2.

[0060] As an implementation method, in the orthographic projection of the circuit board body 6, the boundary of the heat dissipation component is located within the second hollow area 42. That is, the second hollow area 42 is larger than the heat dissipation component, so that the heat dissipation component can fully contact the heat exchange portion 41 for heat exchange. The heat dissipation component can be in direct contact with the heat exchange portion 41 or indirectly contacted through a heat conductive layer. The heat conductive layer can be thermal grease, thermal adhesive, etc.

[0061] The flexible circuit board 1 and the display device provided by the present invention are exemplified below with certain specific implementations, which should not be construed as the sole limitation on the present invention.

[0062] Example 1

[0063] like Figure 3-Figure 5 As shown, the flexible circuit board 1 of this example includes a circuit board body 6, and the circuit board body 6 includes a metal trace layer 62, and insulating layers 61 are respectively provided on both sides of the metal trace layer 62;

[0064] The insulating layer 61 adopts a composite layer structure, which includes a PI (Polyimide) layer and an adhesive layer 611. Accordingly, the structure of the circuit board body 6 is a five-layer structure stacked in sequence: PI layer 612 - adhesive layer 611 - metal trace layer 62 - adhesive layer 611 - PI layer 612;

[0065] The metal wiring layer 62 is, for example but not limited to, a copper layer, and the copper layer can be patterned to form corresponding signal lines, contacts 31 and heat exchange parts 41 according to actual needs.

[0066] The circuit board body 6 includes a first binding area 3 and a heat exchange area 4 different from the first binding area 3;

[0067] The metal wiring layer 62 includes a contact 31 located in the first binding area 3 and a heat exchange portion 41 located in the heat exchange area 4;

[0068] The flexible circuit board 1 can be bound to a location requiring electrical connection via the contacts 31 of the first binding area 3 , such as the second binding area 12 of the fan-out area of ​​the display panel 204 , to achieve electrical connection with the display panel 204 .

[0069] A portion of the metal wiring layer 62 can serve as the heat exchange portion 41. The heat exchange portion 41 can be an independent portion of the metal wiring layer 62, used only for heat exchange. Of course, it can also be a portion of a portion of the circuit in the metal wiring layer 62, which can then perform heat exchange and also be used for the transmission of electrical signals.

[0070] For the convenience of description, the two opposite sides of the circuit board body 6 are respectively referred to as the front side and the back side.

[0071] The insulating layer 61 on the front surface of the circuit board body 6 is provided with a first hollow area 32 and a second hollow area 42. The first hollow area 32 exposes the contacts 31, and the second hollow area 42 exposes the heat exchange portion 41. That is, the first hollow area 32 and the second hollow area 42 are located on the same side of the circuit board body 6. When the circuit board body 6 is bonded to the fan-out area of ​​the display panel 204 via the contacts 31, the top surface of the chip 11 located in the fan-out area can exchange heat with the heat exchange portion 41 through the second hollow area 42.

[0072] A stainless steel layer (not shown in the figure) serving as a reinforcement layer is provided on the side of the back insulation layer 61 facing away from the metal wiring layer 62 . The stainless steel layer is located at a position corresponding to the second hollow area 42 .

[0073] A third hollow area 2 is provided on the insulating layer 61 on the back side of the circuit board body 6 , and the third hollow area 2 exposes the metal wiring layer 62 .

[0074] Of course, according to actual needs, the insulating layer 61 on the front of the circuit board body 6 can also be provided with a fourth hollow area 51 to expose the grounding part 5 of the metal wiring layer 62. The grounding part 5 can be provided with conductive glue to ground the grounding part 5 to external components.

[0075] Example 2

[0076] At least see also Figure 6 As shown, the main difference between this example and Example 1 is that electromagnetic shielding layers 63 are respectively provided on two opposite sides of the circuit board body 6, and the position of the electromagnetic shielding layer 63 is different from the position of the first hollow area 32, the second hollow area 42 and the third hollow area 2.

[0077] Example 3

[0078] At least see also Figure 7 As shown, the main difference between this example and Example 1 is that two metal trace layers 62 are provided in the circuit board body 6. In this case, the structure of the circuit board body 6 can be a stacked structure of PI layer 612 - adhesive layer 611 - metal trace layer 62 - adhesive layer 611 - PI layer 612 - adhesive layer 611 - metal trace layer 62 - adhesive layer 611 - PI layer 612. A via structure 64 can be provided between the two metal trace layers 62 as required for electrical connection to electrically connect the corresponding circuits in the two metal trace layers 62.

[0079] Example 4

[0080] At least see also Figure 8 As shown, the main difference between this example and Example 3 is that electromagnetic shielding layers 63 are respectively provided on two opposite sides of the circuit board body 6, and the position of the electromagnetic shielding layer 63 is different from the position of the first hollow area 32, the second hollow area 42 and the third hollow area 2.

[0081] Example 5

[0082] At least see also Figures 9-11 As shown, the main difference between this example and Example 1 is that the circuit board main body 6 has multiple layers of metal routing layers 62. For example, it is not limited to including five layers of metal routing layers 62. At this time, the structure of the circuit board main body 6 can be a stacked arrangement of PI layer 612-adhesive layer 611-metal routing layer 62-adhesive layer 611-PI layer 612-adhesive layer 611-metal routing layer 62-adhesive layer 611-PI layer 612-adhesive layer 611-metal routing layer 62-adhesive layer 611-PI layer 612-adhesive layer 611-metal routing layer 62-adhesive layer 611-PI layer 612-adhesive layer 611-PI layer 612; and a reinforcement layer may not be required.

[0083] The second hollow area 42 extends from the first insulating layer 61 on the front side and the first PI layer 612 on the front side to the fifth metal wiring layer 62 . The second hollow area 42 is equivalent to a blind hole extending to the fifth metal wiring layer 62 .

[0084] Example 6

[0085] At least see also Figure 12 As shown, the main difference between this example and Example 5 is that electromagnetic shielding layers 63 are respectively provided on two opposite sides of the circuit board body 6, and the position of the electromagnetic shielding layer 63 is different from the position of the first hollow area 32, the second hollow area 42 and the third hollow area 2.

[0086] On the second hand, see at least Figure 2-Figure 5 As shown, the present invention provides a display device, including a display panel 204 and the above-mentioned flexible circuit board 1;

[0087] The display panel 204 includes a display area AA and a fan-out area Fanout. The fan-out area Fanout is bent to the back of the display area AA. A second binding area 12 and a chip 11 are provided on a side of the fan-out area Fanout away from the display area AA.

[0088] In the orthographic projection of the display panel 204 , the flexible circuit board 1 is located in the fan-out area Fanout, and the contacts 31 of the flexible circuit board 1 are bound to the second binding area 12 , and the heat exchange portion 41 is in thermal exchange cooperation with the chip 11 .

[0089] As an implementation method, a heat-conducting layer is provided between the chip 11 and the heat exchange portion 41. The heat-conducting layer can be, for example but not limited to, a heat-conducting glue or a heat-conducting silicone grease.

[0090] Example 7

[0091] At least Figure 2-Figure 5 As shown, the display device of this example includes a stacked cover plate 201, an adhesive layer 202, a polarizer 203, a display panel 204, and a super clean foam layer (SCF) 205; the cover plate 201 is, for example but not limited to, a glass cover plate, and the adhesive layer 202 is, for example but not limited to, an optically clear adhesive (OCA).

[0092] The display panel 204 includes a display area AA and a fan-out area Fanout. The fan-out area Fanout is bent to the back of the display area AA and supported on the SCF by a support pad 206. A second binding area 12 and a chip 11 are provided on the side of the fan-out area away from the display area AA.

[0093] In the orthographic projection of the display panel 204, the flexible circuit board 1 is located in the fan-out area Fanout, and the contact 31 of the flexible circuit board 1 is bound to the second binding area 12. The heat exchange portion 41 of the flexible circuit board 1 cooperates with the chip 11 for heat exchange. For example, the heat exchange portion 41 of the flexible circuit board 1 contacts the top surface of the chip 11 to perform heat exchange. Of course, thermal grease or the like can be provided between the heat exchange portion 41 of the flexible circuit board 1 and the top surface of the chip 11 to prevent air from existing between the heat exchange portion 41 of the flexible circuit board 1 and the top surface of the chip 11 and affecting the heat exchange.

[0094] In this example, the flexible circuit board 1 may be of a thinner structure, such as having only a single or two metal trace layers 62. A thinner flexible circuit board 1 can be laid in a bent manner in the fan-out area.

[0095] Example 8

[0096] At least Figure 13 As shown, the main difference between this example and Example 7 is that the flexible circuit board 1 adopts a thicker structure, such as a structure with multiple metal trace layers 62. In this structure, the second hollow area 42 is equivalent to a blind hole, and the chip 11 requiring heat dissipation is located within the blind hole, thereby achieving thermal exchange between the heat exchange portion 41 of the flexible circuit board 1 and the chip 11.

[0097] The flexible circuit board 1 with this structure can be laid relatively flatly in the fan-out area Fanout.

[0098] It should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like used above to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0099] The above description is merely a preferred embodiment of the present application and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solutions formed by the specific combination of the above-mentioned technical features, but also encompasses other technical solutions formed by any combination of the above-mentioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the above-mentioned features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A flexible circuit board, characterized in that: include: A circuit board body, the circuit board body comprising at least one metal wiring layer, with insulating layers provided on both sides of each metal wiring layer; The circuit board body includes a first binding area and a heat exchange area different from the first binding area; The metal routing layer includes a contact located in the first binding area, and a heat exchange portion located in the heat exchange area; The insulating layer on one side of the circuit board body has a first hollow area exposing the contact and a second hollow area exposing the heat exchange portion.

2. The flexible circuit board according to claim 1, wherein: A reinforcement layer is provided on a side of the circuit board body facing away from the second hollow area, and the reinforcement layer is at least located in the heat exchange area.

3. The flexible circuit board according to claim 2, wherein: The reinforcement layer is at least any one of a polyimide layer, a polypropylene layer, a polyethylene layer, a polycarbonate layer, a polyvinyl chloride layer, a polystyrene layer and a stainless steel layer.

4. The flexible circuit board according to claim 1, wherein: The circuit board body comprises a plurality of stacked metal wiring layers, and the insulating layer is provided between adjacent metal wiring layers; The second hollow region penetrates from the first insulating layer to one of the metal wiring layers, and the second hollow region penetrates at least two of the metal wiring layers.

5. The flexible circuit board according to claim 4, characterized in that: The second hollow area extends from the first insulating layer to the last metal wiring layer.

6. The flexible circuit board according to any one of claims 1 to 5, characterized in that: At least the outermost insulating layer on the other side of the circuit board body has a third hollow area exposing the metal wiring layer.

7. The flexible circuit board according to claim 6, wherein: Electromagnetic shielding layers are provided on both sides of the circuit board body at positions different from the first hollow area, the second hollow area and the third hollow area.

8. The flexible circuit board according to any one of claims 1 to 5, characterized in that: In the orthographic projection of the circuit board body, the boundary of the heat-dissipated component is located within the second hollow area.

9. A display device, characterized in that: comprising a display panel and the flexible circuit board according to any one of claims 1 to 8; The display panel includes a display area and a fan-out area, the fan-out area is bent to the back of the display area, and a second binding area and a chip are provided on a side of the fan-out area away from the display area; In the orthographic projection of the display panel, the flexible circuit board is located in the fan-out area, and the contacts of the flexible circuit board are bound to the second binding area, and the heat exchange portion is in thermal exchange cooperation with the chip.

10. The display device according to claim 9, wherein A heat conducting layer is provided between the chip and the heat exchanging portion.

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