Wafer corner defect inspection device and inspection method

Abstract

The present invention relates to a wafer corner defect inspection device and inspection method capable of accurately inspecting wafer corner defects, specifically comprising: a plate-shaped wafer, a clamping portion for fixing the wafer, and an edge detection portion for detecting wafer corner defects.

Description

Technical Field

[0001] The present invention relates to a wafer corner defect inspection device and an inspection method capable of accurately inspecting corner defects of a wafer. Background Art

[0002] Patent document 001 provides a device for inspecting wafer defects, which includes: a front lighting band, which extends in the upward and downward directions with a specific location on the edge of the wafer as the center and has a spherical band shape; a plurality of front fixing components, which are formed along the spherical band surface of the front lighting band; a lighting lamp, which is fixed on the plurality of front fixing components; and an optical camera, which is arranged toward a specific location on the edge of the wafer, and further includes: one or more side lighting bands, which extend in the upward and downward directions with a specific location on the edge of the wafer as the center and have a spherical band shape; a plurality of side fixing components, which are formed along the spherical band surface of the side lighting band; a lighting lamp, which is fixed on the plurality of side fixing components; and an optical camera, which is arranged toward a specific location on the edge of the wafer.

[0003] Patent document 002 provides a technology, including: a platform that supports a wafer and can move back and forth in a first horizontal direction; a bright field illuminator that is arranged above the platform and extends along a second horizontal direction perpendicular to the first horizontal direction, and when the platform moves forward along the first horizontal direction, a strip of bright field illumination light longer than the diameter of the wafer is irradiated onto the wafer; a dark field illuminator that is arranged above the platform and extends along the second horizontal direction, and when the platform moves backward along the first horizontal direction, a strip of dark field illumination light longer than the diameter of the wafer is irradiated onto the wafer; and a camera that is arranged above the platform and acquires a bright field image of the wafer when the platform moves forward along the first horizontal direction, and acquires a dark field image of the wafer when the platform moves backward along the first direction.

[0004] Patent document 003 provides a defect inspection device for silicon wafers, which includes: an infrared light illuminator, which is arranged opposite to the surface of the silicon wafer; a shooting unit, which is provided with a line sensor array that is sensitive to the infrared light of the infrared light illuminator; and an image processing unit, which detects defects on the surface or inside of the silicon wafer through the image of the shooting unit, wherein the resistivity of the silicon wafer is obtained in advance, and the infrared light illuminator adjusts the illumination according to the obtained resistivity of the silicon wafer, and at the same time, the shooting unit adjusts the sensitivity to the infrared light according to the obtained resistivity of the silicon wafer, and as a defect inspection device for silicon wafers, The device comprises: an infrared light illumination device, which is arranged opposite to the surface of the silicon wafer; a shooting unit, which is provided with a line sensor array sensitive to the infrared light of the infrared light illumination device; a light transmittance measuring unit, which measures the light transmittance value of the infrared light passing through the silicon wafer in advance; and an image processing unit, which detects defects on the surface or inside of the silicon wafer through the image of the shooting unit, wherein the resistivity of the silicon wafer is obtained in advance, the infrared light illumination device adjusts the illumination intensity according to the obtained resistivity of the silicon wafer, and at the same time, the shooting unit adjusts the sensitivity to the infrared light according to the measured light transmittance value of the infrared light passing through the silicon wafer.

[0005] Patent document 004 provides a technology including: a difference image generating step of generating a difference image by subtracting a difference value obtained by subtracting each pixel value corresponding to each coordinate of a normal image from each pixel value corresponding to each coordinate of an inspection object image obtained from a semiconductor wafer; an edge image generating step of recalculating in order to distinguish between a unit area and a cross-edge area, a horizontal edge area, and a vertical edge area in the normal image; a step of obtaining, in the edge image, unit area coordinate values ​​corresponding to the unit area, cross-edge area coordinate values ​​corresponding to the cross-edge area, horizontal edge area coordinate values ​​corresponding to the horizontal edge area, and vertical edge area coordinate values ​​corresponding to the vertical edge area; and calculating, in the difference image, the difference image corresponding to the unit area coordinate values. The invention also provides a step of calculating each pixel value of the difference image of the coordinate value corresponding to the cross-edge region in the difference image to determine the cross-edge critical value (Tc); a step of calculating each pixel value of the difference image of the coordinate value corresponding to the horizontal edge region in the difference image to determine the horizontal edge critical value (Th); and a step of calculating each pixel value of the difference image of the coordinate value corresponding to the vertical edge region in the difference image to determine the vertical edge critical value (Tv), wherein after respectively calculating the unit critical value (Ta), the cross-edge critical value (Tc), the horizontal edge critical value (Th) and the vertical edge critical value (Tv), the defects are calculated by using the respective critical values.

[0006] (Patent Document 1) KR 10-2010-0053038 A (May 20, 2010)

[0007] (Patent Document 2) KR 10-2016-0068228 A (June 15, 2016)

[0008] (Patent Document 3) KR 10-2010-0023861 A (March 4, 2010)

[0009] (Patent Document 4) KR 10-2013-0049359 A (May 14, 2013) Summary of the Invention

[0010] Technical issues

[0011] The present invention relates to a wafer corner defect inspection device and an inspection method capable of accurately inspecting corner defects of a wafer.

[0012] Problem Solutions

[0013] The present invention is used to solve the problems of the existing inventions. The present invention includes: a plate-shaped wafer 100; a wafer clamping part 200, which fixes the wafer 100; and an edge detection part 300, which detects defects in the wafer corners 110.

[0014] The present invention relates to a device and method for inspecting chip edge defects. In the invention consisting of a chip 100, a chip clamping part 200 and an edge detection part 300 as described above, the chip clamping part 200 further includes: a contact body 210, which is formed in multiple numbers and contacts the surface and / or edges of the chip 100.

[0015] The present invention relates to a device and method for inspecting chip corner defects. In the invention consisting of a chip 100, a chip clamping part 200 and an edge detection part 300 as described above, the edge detection part 300 further includes: a light source 310, which emits light of a specific illumination to the corner; and a camera 320, which photographs the chip corner 110.

[0016] The present invention relates to a device and method for inspecting chip corner defects. In the invention composed of a chip 100, a chip clamping part 200 and an edge detection part 300 as described above, it further includes: a control part 410, which receives image information input from the camera 320 and determines whether there is a defect in the chip corner 110.

[0017] The present invention relates to a device and method for inspecting wafer corner defects. In the invention consisting of a wafer 100, a wafer clamping portion 200, and an edge detection portion 300 as described above, the device further includes: a shell 510, which forms an internal space to accommodate the wafer clamping portion 200 and the edge detection portion 300; a wafer box, which is combined with the outside of the shell 510 and accommodates multiple wafers 100; and a transfer robot, which transfers the wafer 100 to the wafer 100 box and the wafer clamping portion 200.

[0018] The present invention is used to solve the problems of the existing inventions and provides a method for inspecting chip corner defects, including: a conveying step S100, conveying the chip 100 to the chip clamping part 200; a clamping step S200, clamping the corners of the chip 100 after the conveying step S100; and a detection step S300, detecting the chip corners 110 after the clamping step S200.

[0019] Effects of the Invention

[0020] The present invention can accurately measure defects in the corners of silicon wafers

[0021] The present invention can inspect defects and patterns at the corners of wafers.

[0022] The present invention can inspect the entire wafer corner by rotating the wafer.

[0023] The present invention can rotate smoothly as the contact body for clamping the wafer rotates up and down, and will not be stuck on the camera.

[0024] The present invention shines light toward the wafer and can reflect the light and keep it at a specific angle so that it does not enter the camera.

[0025] The present invention is formed with multiple cameras, so that the vertical surface and the inclined surface of the wafer corner can be inspected separately. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a perspective view of a wafer corner defect inspection device according to the present invention;

[0027] Figure 2 yes Figure 1 A side view of a wafer corner defect inspection apparatus is shown;

[0028] Figures 3 and 4 is a perspective view of a wafer clamping portion of the present invention;

[0029] Figure 5 yes Figure 4 A plan view of the wafer holder is shown;

[0030] Figure 61 is a side view showing a state where a wafer is clamped on a wafer clamping portion of the present invention;

[0031] Figures 7 and 8 is a side view showing an edge detection unit of the present invention;

[0032] Figure 9 Flowchart showing the wafer corner defect inspection method of the present invention. DETAILED DESCRIPTION

[0033] Hereinafter, in order to enable those skilled in the art to easily implement the present invention, the most preferred embodiments of the present invention will be described in detail.

[0034] The reference numbers in the following embodiments are not limited to the referenced objects and are applicable to all embodiments. Objects having the same purpose and effect as the structures proposed in the embodiments are equivalent to equivalent replacement objects. The superordinate concepts proposed in the embodiments include objects with subordinate concepts not mentioned.

[0035] (Example 1-1) The wafer corner defect inspection device of the present invention includes: a plate-shaped wafer 100; a wafer clamping part 200, which fixes the wafer 100; and an edge detection part 300, which detects defects in the wafer corner 110.

[0036] (Example 1-2) According to the wafer edge defect inspection apparatus of the present invention of Example 1-1, the wafer 100 is formed of silicon.

[0037] (Example 1-3) According to the wafer edge defect inspection device of the present invention of Example 1-1, the flat surface 111 of the wafer 100 is formed in any one shape selected from a circle, an ellipse, or a polygon.

[0038] (Example 1-4) According to the chip edge defect inspection device of the present invention of Example 1-1, the chip 100 includes: a vertical surface 113, perpendicular to the plane 111; a first boundary surface 114, located between the vertical surface 113 and the plane 111; a back surface 112, located on the corresponding surface of the plane 111; and a second boundary surface 115, located between the back surface 112 and the vertical surface 113.

[0039] (Example 1-5) According to the wafer edge defect inspection device of the present invention of Example 1-4, the first boundary surface 114 and / or the second boundary surface 115 is formed to be rounded or chamfered.

[0040] The present invention relates to a device for inspecting wafer corner defects, and more particularly, to an inspection device for inspecting corner defects of a wafer 100 formed of silicon. The inspection device of the present invention inspects the corners of a wafer 100 formed by a plane 111 of various shapes, such as a circle, an ellipse, or a polygon, wherein the corners of the wafer 100 are formed by a mixture of oblique lines and vertical surfaces 113. Such a wafer 100 is formed by cutting a silicon ingot, and most of the defects generated during the manufacturing process of the wafer 100 are generated at the corners rather than the plane 111. To this end, the inspection device fixes and rotates the wafer 100, thereby detecting corner defects. The corners of the wafer 100 inspected in the inspection device are formed with a vertical surface 113 perpendicular to the plane 111 and the back surface 112, and a first boundary surface 114 and a second boundary surface 115 are formed between the vertical surface 113 and the plane 111 and the back surface 112. First boundary surface 114 is located between vertical surface 113 and flat surface 111 and is rounded or chamfered. Second boundary surface 115 is located between vertical surface 113 and the bottom surface and is rounded or chamfered in the same manner as first boundary surface 114. This wafer 100 is fixed to a wafer holding portion 200 of an inspection apparatus and rotated. The edge detection portion 300 inspects vertical surface 113, first boundary surface 114, and second boundary surface 115 of the rotating wafer 100 for damage.

[0041] Therefore, the wafer corner defect inspection apparatus inspects corner defects generated during the manufacturing process of the wafer 100 and has a feature of inspecting corners by fixing and rotating the wafer 100 .

[0042] (Example 1-6) According to the wafer corner defect inspection device of the present invention of Example 1-1, the wafer holding part 200 is formed into one or more.

[0043] (Example 1-7) According to the wafer corner defect inspection device of the present invention of Example 1-1, the edge detection unit 300 is formed into one or more.

[0044] The present invention relates to a wafer edge defect inspection device. Specifically, a wafer clamping unit 200 is used to hold wafers 100 formed in various shapes, and an edge detection unit 300 is used to inspect the wafers 100 held in the wafer clamping unit 200 for edge defects. The wafer clamping unit 200 and edge detection unit 300 are formed in one or more configurations and are used to hold and inspect the wafers 100. The wafer clamping unit 200 is formed in one or more configurations at the lower end of the wafer 100 to hold the wafer 100, which is then positioned and secured to each wafer clamping unit 200. Furthermore, the edge detection unit 300 is formed on the side surfaces of the wafer 100 and the wafer clamping unit 200 to inspect the wafer 100 for edge defects and the manufacturing status.

[0045] Therefore, by forming one or more wafer holding parts 200 and edge detection parts 300 , the wafer 100 can be effectively fixed and inspected.

[0046] (Example 2-1) The present invention relates to a device for inspecting wafer corner defects. According to Example 1-1, the wafer clamping portion 200 includes: a plurality of contact bodies 210 , which are in contact with the surface and / or corners of the wafer 100 .

[0047] (Example 2-2) The wafer edge defect inspection device of the present invention according to Example 2-1 includes: a bracket fastening body 220, which is rotated by a driving motor 240 and simultaneously rotates multiple contact bodies 210; and a bracket actuator 230, which individually selects and rotates the contact bodies 210 on the bracket fastening body 220.

[0048] (Example 2-3) According to the wafer corner defect inspection device of the present invention of Example 2-2, the holder actuator 230 includes: a holder operating cam 250 , which contacts the contact body 210 and is operated by interference of the edge detection unit 300 .

[0049] The present invention relates to a wafer clamping unit 200. Specifically, the wafer clamping unit 200 is used to secure and rotate a wafer 100. This wafer clamping unit 200 is used to secure a silicon wafer 100 and is formed with contact bodies 210 that contact the back surface 112 and corners of the wafer 100. Multiple contact bodies 210 are provided, and they contact the corners of the wafer 100, rotating the wafer 100 and inspecting for defects in the corners 110. Furthermore, the contact bodies 210 are mounted on a support fastener 220, which is rotated by a motor 240. A support base for positioning the wafer 100 is formed on top of the support fastener 220. The support base has multiple through-holes, allowing one end of each contact body 210 to protrude and secure the corners of the wafer 100. Furthermore, the two side surfaces of the support base are formed to correspond to each other, with spacers formed between the through-holes formed in the support base. A seating plate is formed in the center of the mounting table to seat the wafer 100. A support fastener 220 is formed below the seating plate. Furthermore, support fastener 220 is provided with support actuators 230 for individually rotating the multiple fasteners. Multiple support actuators 230 are formed on the sides of support fastener 220 and rotate together with contact body 210 via support fastener 220. These support actuators 230 rotate the contact body 210 vertically during rotation to prevent it from getting stuck on the spacer plate of the mounting table. Furthermore, the support actuators 230 contact the contact body 210 and, through the interference of the edge detection unit 300 and the spacer plate, form a support operating cam 250. The support activation cam 250 does not contact the contact body 210 during operation. If the support operating cam 250 determines that the contact body 210 is likely to interfere with the edge detection unit 300 during rotation, it rotates the contact body 210 vertically.

[0050] Therefore, the wafer holding part 200 of the present invention has a feature of being able to fix the wafer 100 and rotate it by means of the plurality of contact bodies 210 .

[0051] (Example 2-4) The wafer corner defect inspection device according to Example 2-1 of the present invention includes: a support fastener 220 that positions the plurality of contact bodies 210; and a support actuator 230 that operates the contact bodies 210.

[0052] (Example 2-5) In the wafer corner defect inspection apparatus according to Example 2-4 of the present invention, the holder actuator 230 includes a holder operating cam 250 that operates by detecting movement of the edge detecting portion 300 .

[0053] The present invention relates to a wafer clamping unit 200. Specifically, the wafer clamping unit 200 includes a holder actuator 230 that vertically rotates a contact body 210 that secures the wafer 100. This wafer clamping unit 200 includes a holder fastening body 220 that secures the wafer 100 via multiple contact bodies 210. The contact bodies 210 are rotated vertically by the holder actuator 230. Furthermore, the multiple contact bodies 210 secure the corners of the wafer 100. An edge detection unit 300 is formed on the side of the contact body 210 to detect defects in the corners of the wafer 100. As another embodiment of the present invention, the edge detection unit 300 rotates around the holder fastening body 220 to detect defects in the corners 110 of the wafer. In this case, as the edge detection unit 300 rotates, the contact body 210 is moved vertically by the holder actuator 230 without becoming stuck. Furthermore, a holder operating cam 250 detects the movement of the edge detection unit 300 and moves the contact body 210. Rotation of the edge detection unit 300 also causes the contact body 210 to move.

[0054] Therefore, the wafer holding portion 200 has a feature of operating the contact body 210 when the edge detecting portion 300 rotates.

[0055] (Example 2-6) In the wafer edge defect inspection apparatus according to Example 2-1 of the present invention, the contact body 210 is formed of an insulating material.

[0056] (Example 2-7) In the wafer edge defect inspection apparatus according to Example 2-1 of the present invention, the contact body 210 is formed of a polymer.

[0057] (Example 2-8) In the wafer edge defect inspection apparatus according to Example 2-1 of the present invention, one surface of the contact body 210 is formed into a straight line or a curved line.

[0058] (Example 2-9) The wafer edge defect inspection device according to Example 2-8 of the present invention includes an elastic member 211 that generates a uniform contact force on the contact body 210 .

[0059] (Example 2-10) In the wafer edge defect inspection device according to the present invention of Example 2-1, the elastic member is formed of a spring.

[0060] (Example 2-11) The wafer edge defect inspection device according to Example 2-1 of the present invention includes: a contact pressure measurement sensor located on one side of the contact body 210 to measure the contact pressure of the wafer 100.

[0061] The present invention relates to a contact body 210. Specifically, multiple contact bodies 210 are formed on the side of a support fastener 220, and are rotated and secured to the wafer 100 by a support actuator 230. The contact body 210 is made of a polymer, an insulating material, and one surface is formed into a straight or curved shape. Furthermore, one end of the contact body 210 is rotated by the support actuator 230, and when the wafer 100 rotates, it rotates downward to prevent it from getting stuck in the edge detection unit 300. The contact body 210 is formed with an elastic member to generate a uniform contact force with the wafer 100. The elastic member is formed of a spring, but the type of elastic member is not limited in the present invention. Furthermore, a contact pressure sensor is formed on one surface of the contact body 210 to measure the contact pressure with the wafer 100. This contact pressure sensor allows the silicon wafer 100 to be secured and rotated while preventing damage. As the wafer 100 rotates, the contact body 210 secures the wafer 100 with a specific pressure to prevent it from separating from the contact body 210.

[0062] Therefore, the contact body 210 has the characteristics of fixing the wafer 100 and fixing the corners of the wafer 100 for rotation.

[0063] (Example 3-1) The present invention relates to a device for inspecting chip corner defects. According to Example 2-1, the edge detection unit 300 includes: a light source 310 that emits light of a specific illumination to the corner; and a camera 320 that photographs the chip corner 110.

[0064] (Example 3-2) In the wafer corner defect inspection apparatus according to the present invention of Example 3-1, the camera 320 and / or the light source 310 are formed in one or more forms.

[0065] (Example 3-3) The wafer corner defect inspection device according to Example 3-1 of the present invention includes: a detection housing 330 that fixes the light source 310 and the camera 320.

[0066] (Example 3-4) According to the wafer edge defect inspection device of the present invention of Example 3-3, the inspection housing 330 is formed with one or more.

[0067] (Example 3-5) In the wafer corner defect inspection device according to the present invention of Example 3-4, the inspection housing is fixed or changeable.

[0068] The present invention relates to an edge detection unit 300, specifically, for capturing and inspecting wafer corners 110. This edge detection unit 300 is used to inspect corners formed from silicon and potentially causing defects during manufacturing. It is located on the side of the wafer holder 200. The edge detection unit 300 includes a light source 310 that emits light at a specific intensity toward the wafer 100. Light source 310 emits light at a specific angle to prevent light from being reflected and entering a camera 320. One or more light sources 310 are provided and fixed to a detection housing 330. Light source 310 is formed into a "C"-shaped curved surface, emitting light simultaneously toward its flat surface 111, vertical surface 113, and back surface 112. Furthermore, a camera 320 is located near light source 310 to inspect the corners of the wafer 100, which is fixed and rotated on the wafer holder 200. Similar to light source 310, one or more cameras 320 are provided and fixed to the detection housing 330. Furthermore, the camera 320 captures the vertical surface 113, the first boundary surface 114, and the second boundary surface 115 of the wafer corner 110. One or more detection housings 330 are provided, each of which can simultaneously secure the light source 310 and the camera 320, or each of which can be secured separately. In this case, the detection housings 330 securing the light source 310 and the camera 320 can be fixed or removable on the wafer holder 200, and the multiple detection housings 330 are spaced apart to maintain the required illumination for the camera 320.

[0069] (Example 3-6) The wafer edge defect inspection device according to Example 3-3 of the present invention includes: a reflection portion 331 formed on the inner surface of the detection housing 330.

[0070] (Example 3-7) The wafer corner defect inspection device according to Example 3-6 of the present invention includes: a diffusion plate attached to the detection housing 330 or the light source 310 to diffuse the light of the light source 310.

[0071] (Example 3-8) According to the wafer edge defect inspection device of the present invention of Example 3-3, the inspection housing 330 is formed in a circular or polygonal shape.

[0072] The present invention relates to an inspection housing 330. Specifically, the inspection housing 330 reflects and diffuses light from the light source 310. This inspection housing 330 comprises a first inspection housing 333, which secures the light source 310, and a second inspection housing 334, which secures the camera 320. The first inspection housing 333 secures the light source 310, which, through its circular and polygonal curved surfaces, emits light toward the corners of the wafer 100. Furthermore, the first inspection housing 333 is formed with connecting rods for connecting to the second inspection housing 334 or securing it to the wafer holder 200. A reflector 331 is formed on the inner surface of the first inspection housing 333, which reflects and transmits light emitted by the light source 310 toward the wafer 100. Furthermore, the first inspection housing 333 is formed with a diffuser plate to diffuse the light from the light source 310. The diffuser plate illuminates the entire wafer 100, allowing the camera 320 to more effectively monitor corners. The second inspection housing 334 is fixed to the ground to secure the camera 320 and is located close to the wafer holder 200.

[0073] Therefore, the inspection housing 330 fixes the light source 310 and the camera 320 and effectively inspects corner defects while the wafer 100 rotates.

[0074] (Example 3-9) The chip edge defect inspection device according to Example 3-3 of the present invention includes: a first conveying device 341, which moves the position of the camera 320 and / or the light source 310 inside the detection shell 330; and a first movement controller 342, which controls the position movement of the first conveying device 341.

[0075] (Example 3-10) The chip edge defect inspection device according to Example 3-9 of the present invention includes: an illuminator 351, which is adjacent to the chip 100; and an illumination controller 352, which recognizes the signal of the illuminator 351 and changes the luminance of the light source 310.

[0076] (Example 3-11) The wafer corner defect inspection device according to the present invention of Example 3-9 includes: a second conveying device 361 that conveys the inspection housing 330.

[0077] (Example 3-12) The chip edge defect inspection device of the present invention according to Example 3-11 includes: a position measurement sensor 362, which measures the position of the edge; and a conveying controller 363, which recognizes the signal of the first position measurement sensor 362 and controls the conveying trajectory of the second conveying device 361.

[0078] The present invention relates to an inspection housing 330, specifically, an inspection housing 330 that adjusts the positions of a camera 320 and a light source 310. The inspection housing 330 emits uniform light toward the wafer holder 200 and transports the light source 310 and camera 320 to inspect the wafer corners 110. A first conveyor 341 is provided to move the camera 320 and light source 310 within the inspection housing 330, and the positional movement of the first conveyor 341 is controlled by a first movement controller 342. Furthermore, an illuminator 351 is provided adjacent to the wafer 100 to measure the luminous intensity of the light source 310, which is moved by the first conveyor 341. This illuminator 351 is characterized in that the luminous intensity of the light source 310 is adjusted by an illumination controller 352.

[0079] (Example 4-1) The present invention relates to a device for inspecting chip corner defects, which includes, according to Example 3-1, a control unit 410 that receives image information input from the camera 320 and determines whether there is a defect in the chip corner 110.

[0080] (Example 4-2) The wafer corner defect inspection apparatus according to Example 4-1 of the present invention includes a focus controller 420 that detects the image of the camera 320 and controls the focus.

[0081] (Example 4-3) In the wafer corner defect inspection device according to Example 4-1 of the present invention, the focus controller 420 includes a lens driving device 430 that causes the lens of the camera 320 to move back and forth.

[0082] (Example 4-4) The wafer corner defect inspection device according to the present invention of Example 4-1 includes: a judgment unit 440, which receives the image information input and determines the type and position of the defect.

[0083] The present invention relates to a control unit 410, specifically, a unit that determines whether a defect exists in the wafer corner 110 measured by the camera 320. This control unit 410 receives image information detected by the camera 320 of the edge detection unit 300 and determines whether a defect exists in the wafer corner 110. The control unit 410 includes a focus controller 420 that controls the focus while detecting the image from the camera 320. This controller 420 measures the corner of the rotating wafer 100. Furthermore, the focus controller 420 includes a lens driver 430 that moves the lens of the camera 320 back and forth. The lens driver 430 moves the lens of the camera 320 up, down, and left and right. In this process, the lens driver 430 simultaneously or individually moves the multiple cameras 320 used to detect the vertical surface 113, first boundary surface 114, and second boundary surface 115 of the wafer corner 110. As described above, by receiving image information from the cameras 320 detecting the wafer corner 110, the determination unit determines the type and location of defects in the wafer 100. In this case, defects on wafer 100 may include various defects such as tears, dents, and cracks. Furthermore, camera 320 includes a first camera 321 that measures defects while wafer 100 rotates, and a second camera 322 that magnifies and measures defects on wafer 100. First camera 321 and second camera 322 are spaced apart from each other. Second camera 322 not only magnifies and measures corner defects on wafer 100, but also detects foreign matter, patterns, and curved interfaces.

[0084] Therefore, the control unit 410 of the present invention has a feature of being able to effectively inspect the wafer 100 by controlling the camera 320 .

[0085] (Example 5-1) The present invention relates to a chip edge defect inspection device, according to Example 1-1, including: a shell 510, which forms an internal space to accommodate the chip clamping part 200 and the edge detection part 300; a chip box, which is combined with the outside of the shell 510 to accommodate a plurality of chips 100; and a transfer robot, which transfers the chip 100 to the chip 100 box and the chip clamping part 200.

[0086] (Example 5-2) The wafer corner defect inspection device according to Example 5-1 of the present invention includes: a power supply unit 540, which supplies power to the wafer 100 clamping unit, the edge detection unit 300, the wafer 100 box and the transfer robot.

[0087] (Example 5-3) The wafer corner defect inspection device according to the present invention of Example 5-1 includes: a power charger 541, which is formed in the power supply part and stores and releases power.

[0088] (Example 5-4) The wafer edge defect inspection device according to Example 5-1 of the present invention includes: a vibration isolation device 511, which is located in the shell 510 and eliminates vibration.

[0089] The present invention relates to a housing 510 that houses the wafer gripping unit 200 and the edge detection unit 300. Specifically, the housing 510 includes a wafer 100 cassette coupled to the exterior of the housing 510 and housing the wafers 100. This housing 510 houses the wafer gripping unit 200 and the edge detection unit 300 and is designed to prevent the wafer gripping unit 200 from becoming stuck when the wafer gripping unit 200 rotates. Furthermore, a wafer 100 cassette is formed on the exterior of the housing 510 to house a plurality of wafers 100 formed by slicing an ingot. The wafer 100 cassette supplies each wafer 100 to the upper portion of the wafer gripping unit 200. A transfer robot, which is fed from the wafer 100 cassette, supplies the wafers 100 using a robotic arm, cylinder, or the like. Furthermore, a power supply unit is provided to supply power to the wafer gripping unit 200, the edge detection unit 300, the wafer 100 cassette, and the transfer robot. The power supply unit includes a power charger that stores and releases power. In addition, the housing 510 is formed with a vibration isolating device for eliminating vibration of the wafer 100 during the inspection of the wafer 100 . The vibration isolating device eliminates vibration acting on the outside of the housing 510 .

[0090] Therefore, the housing 510 accommodates the wafer gripping part 200 and the edge detecting part 300 , and is formed with a wafer 100 cassette and a transfer robot that accommodate and supply a plurality of wafers 100 .

[0091] (Example 6-1) The present invention relates to a method for inspecting chip edge defects, which includes: a conveying step S100, conveying the chip 100 to the chip clamping part 200; a clamping step S200, clamping the edge of the chip 100 after the conveying step S100; and a detection step S300, detecting the chip edge 110 after the clamping step S200.

[0092] (Example 6-2) The wafer corner defect inspection method according to Example 6-1 of the present invention includes: a partial detachment step S310, in which in the inspection step S300, a part of the multiple contact bodies 210 clamping the wafer 100 is detached from the wafer 1000.

[0093] (Example 6-3) The wafer corner defect inspection method according to the present invention of Example 6-1 includes: a wafer rotation step S410, in which the wafer 100 is rotated in the inspection step S300.

[0094] (Example 6-4) The wafer corner defect inspection method of the present invention according to Example 6-1 includes: a wafer moving step S420, and in the inspection step S300, moving the inspection device.

[0095] The present invention relates to a method for inspecting wafer corner defects. Specifically, the method is used to inspect corner defects on a wafer 100 using a wafer corner defect inspection apparatus. The wafer 100 is transported to a wafer clamping unit 200 in a transport step S100. The wafer 100 is clamped at its corners in a clamping step S200. In the clamping step S200, the wafer corners 110 are secured by a plurality of contact members 210 formed on the wafer clamping unit 200. In an inspection step S300, the wafer corners 110 are inspected, and the wafer 100 is inspected by an edge inspection unit 300 as the wafer 100 rotates. In the inspection step S300, the wafer 100 is rotated in a wafer rotation step S410, or the inspection apparatus can be rotated around the wafer clamping unit 200 during the wafer 100 movement step. In addition, in the detection step S300 , the plurality of contact bodies 210 holding the wafer 100 are formed to rotate the contact bodies 210 up and down to prevent the wafer 100 from contacting the edge detection unit 300 .

[0096] Therefore, the wafer corner defect inspection method of the present invention has a feature of detecting the wafer corner 110 by the camera 320 while the wafer 100 is clamped and rotated.

[0097] (Example 6-5) The chip edge defect inspection method of the present invention according to Example 6-1 includes: an illumination step S320, emitting divergent light toward the edges of the chip 100 in the detection step S300; a photographing step S330, photographing the edges of the chip 100 in the detection step S300; a focus adjustment step S340, adjusting the focus of the photographed image in the photographing step S330; and an illumination adjustment step S350, adjusting the illumination in the photographing step S330.

[0098] (Example 6-6) The wafer corner defect inspection method according to Example 6-1 of the present invention includes: a defect judgment step S500, in which the defect is judged by a controller in the detection step S300.

[0099] The present invention relates to an inspection step S300. Specifically, in inspection step S300, light is diverged toward the wafer 100 to image defects at the wafer corner 110. This inspection step S300 includes an illumination step S320 for diverging light toward the wafer corner 100, using a light source 310 formed into a curved surface to diverge light toward the wafer corner 110. Furthermore, the inspection step S300 includes an imaging step S330 for imaging the wafer corner 100 using a camera 320. The camera 320 captures and measures the vertical surface 113, first boundary surface 114, and second boundary surface 115 of the corner. In this case, one or more cameras 320 are provided to image defects at the wafer corner 110 or to magnify and inspect the wafer corner 110. Furthermore, imaging step S330 includes a focus adjustment step S340 for adjusting the focus by the control unit 410, and an illumination adjustment step S350 for adjusting the illumination. Furthermore, in inspection step S300, a defect determination step S500 is also included, in which the controller determines defects.

[0100] Description of Reference Numerals

[0101] 100: chip 110: chip corners

[0102] 111: plane 112: back

[0103] 113: Vertical surface 14: First boundary surface

[0104] 115: Second boundary surface 200: Wafer clamping portion

[0105] 210: Contact body 220: Bracket fastener

[0106] 230: Bracket actuator 240: Drive motor

[0107] 250: Bracket operating cam 300: Edge detection unit

[0108] 310: Light source 320: Camera

[0109] 321: First camera 322: Second camera

[0110] 330: Detection housing 331: Reflection unit

[0111] 332: diffusion plate 341: first conveying device

[0112] 342: First mobile controller 351: Illuminator

[0113] 352: Illumination controller 361: Second transmission device

[0114] 362: Position measurement sensor 363: Transmission controller

[0115] 410: Control unit 420: Focus controller

[0116] 430: Lens driving device 510: Housing

[0117] S100: Transfer step S200: Clamping step

[0118] S300: Detection step S310: Partial separation step

[0119] S320: Lighting step S330: Photographing step

[0120] S340: Focus adjustment step S350: Illumination adjustment step

[0121] S500: Defect judgment step S410: Wafer rotation step

[0122] S420: Wafer movement step

Claims

1. A wafer corner defect inspection device, comprising: a plate-shaped wafer (100); a wafer clamping portion (200) for fixing the wafer (100); as well as An edge detection unit (300) detects defects in the wafer corners (110), The wafer clamping portion (200) comprises: a plurality of contact bodies (210) which are in contact with the surface and / or corners of the wafer (100); A bracket fastening body (220) which is rotated by a driving motor (240) and simultaneously rotates the plurality of contact bodies (210); and a stent actuator (230) which individually selects and rotates the contact bodies (210) on the stent fastening body (220), The bracket actuator (230) includes a bracket operating cam (250) that contacts the contact body (210) and operates through interference from the edge detection unit (300).

2. The wafer edge defect inspection device according to claim 1, wherein: The edge detection unit (300) comprises: a light source (310) that emits light of a specific illuminance toward the corner; and A camera (320) is provided for photographing the wafer corners (110).

3. The wafer corner defect inspection device according to claim 2, comprising: The control unit (410) receives image information input from the camera (320) and determines whether there is a defect in the wafer corner (110).

4. The wafer corner defect inspection device according to claim 1, comprising: a housing (510) forming an internal space for accommodating the wafer clamping portion (200) and the edge detection portion (300); a wafer box, which is combined with the exterior of the housing (510) and accommodates a plurality of wafers (100); and A transfer robot transfers the wafer (100) to the wafer box and the wafer clamping portion (200).

5. A method for inspecting wafer corner defects, characterized in that: The method is performed using the wafer corner defect inspection device according to any one of claims 1 to 4, and comprises: a conveying step (S100), conveying the wafer (100) to the wafer clamping portion (200); a clamping step (S200), after the conveying step (S100), clamping the corners of the wafer (100); and The detection step (S300) is to detect the edge corners (110) of the wafer after the clamping step (S200).

Images