Adaptive millimeter wave radome

Abstract

A device is provided, the device comprising: a device cover; an antenna system under the device cover, the device cover is separated from the antenna system, and the device cover comprises a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping the antenna system.

Description

Technical Field

[0001] The present invention relates to an adaptive millimeter wave antenna cover for 5G millimeter wave communication, etc. Background Art

[0002] Various emerging applications such as virtual reality (VR), augmented reality (AR), big data analysis, artificial intelligence (AI), three-dimensional (3D) media, and ultra-high-definition video transmission have emerged, resulting in a significant increase in the amount of data on wireless networks. 5G extends the use of spectrum below 6 GHz and above 24 GHz (called millimeter wave), and opens up a large amount of bandwidth for high data rates and capacity. However, Long Term Evolution (LTE) still provides important support for the 5G experience by providing a broad coverage layer for emerging 5G networks in the early stages of 5G deployment. For a long time, 2G / 3G / 4G LTE will coexist with 5G New Radio (NR) antennas and millimeter wave antennas, as well as GPS and other connection antennas (such as Wi-Fi, Bluetooth, and near field communication (NFC) antennas) in the same mobile device. Summary of the invention

[0003] The present invention relates to an adaptive millimeter wave antenna cover for 5G millimeter wave communication, etc.

[0004] The first aspect relates to a device, comprising: a device cover; an antenna system under the device cover; wherein the device cover is separated from the antenna system; and the device cover comprises a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping the antenna system.

[0005] The second aspect relates to a device cover, which includes: a substrate, a first surface of which faces an antenna system below the substrate, and the substrate is separated from the antenna system; a perfect magnetic conductor (PMC) equivalent material is arranged on the first surface of the substrate, and the equivalent material surrounds the antenna system without overlapping the antenna system.

[0006] The third aspect relates to a mobile phone, comprising: a mobile phone housing; an antenna system below the mobile phone housing; wherein the mobile phone housing is separated from the antenna system; and the mobile phone housing comprises a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping with the antenna system.

[0007] A fourth aspect relates to a method for controlling electromagnetic (EM) waves generated by an antenna system of a device, the method comprising: emitting EM waves through the antenna system; controlling the emitted EM through a device cover placed above and separated from the antenna system, the device cover comprising a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping the antenna system.

[0008] A fifth aspect relates to a method of providing an apparatus for controlling electromagnetic (EM) waves, the method comprising placing an apparatus cover above and separating from an antenna system, the antenna system being used to transmit EM waves, wherein the apparatus cover comprises a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping the antenna system.

[0009] Optionally, the above aspects and other aspects described may each include one or more of the following implementations:

[0010] In a first implementation, the device cover comprises a dielectric device cover.

[0011] In a second implementation, the antenna system includes one or more antenna system elements.

[0012] In a third implementation, the antenna system includes an antenna in package (AiP), an antenna on board (AoB), or an antenna in module (AiM).

[0013] In a fourth implementation, the antenna system includes one or more antennas at millimeter wave frequencies.

[0014] In a fifth implementation, the device cover is used as an upper layer of the antenna system, and the PMC equivalent material is disposed on a surface of the device cover facing the antenna system.

[0015] In a sixth implementation, the width of the PMC equivalent material is equal to or greater than λd / 2, where λ d is the effective wavelength of the waveguide in the device cover.

[0016] In a seventh implementation, the PMC equivalent material has a structure that suppresses microwaves (eg, frequencies up to 300 MHz) inside the device cover.

[0017] In an eighth implementation manner, the structure includes an electromagnetic band gap (EBG) or a photonic band gap (PBG) structure.

[0018] In a ninth implementation, the PMC equivalent material includes a plurality of holes on a dielectric substrate, wherein shapes and sizes of the plurality of holes are determined based on dielectric parameters of the device cover and a distance between the device cover and the antenna system.

[0019] In a tenth implementation, the mobile phone housing includes a mobile phone front cover covering the front of the mobile phone, and the front includes a screen of the mobile phone.

[0020] In an eleventh implementation manner, the mobile phone housing includes a mobile phone back cover covering the back side of the mobile phone, and the back side is opposite to the screen of the mobile phone.

[0021] In a twelfth implementation, the mobile phone housing includes a mobile phone side cover or side cover covering the side or edge of the mobile phone, wherein the side or edge of the mobile phone is located outside the screen of the mobile phone.

[0022] In a thirteenth implementation manner, the antenna system is vertically mounted on a ground layer of the device, and the device cover covers the antenna system and the ground layer.

[0023] In a fourteenth implementation, the EM wave comprises one or more guided waves inside the device cover or surface waves on the ground layer.

[0024] Details of one or more implementations of the subject matter of this specification are set forth in the drawings and the specification. Other features, aspects, and advantages of the subject matter are apparent in the specification, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1A A schematic diagram of an exemplary millimeter wave packaged antenna (AiP) under a glass cover is provided to illustrate one implementation; Figure 1B is a schematic diagram showing a cross-sectional view of an exemplary mmWave AiP under a glass cover;

[0026] Figure 2A A schematic diagram of an exemplary adaptive millimeter wave radome system is provided to illustrate one implementation; Figure 2B is a schematic diagram showing a cross-sectional view of an exemplary adaptive millimeter wave radome system;

[0027] Figure 3A A schematic diagram of an exemplary millimeter wave antenna system beneath a limited device cover in free space is provided to illustrate one implementation; Figure 3B is a schematic diagram showing a cross-sectional view of an exemplary millimeter wave antenna system beneath a limited device cover;

[0028] Figure 4A A schematic diagram of an exemplary adaptive millimeter wave radome system is provided to illustrate one implementation; Figure 4B is a schematic diagram showing a cross-sectional view of an exemplary adaptive millimeter wave radome system;

[0029] Figure 5A A schematic diagram of an exemplary adaptive millimeter wave radome system is provided to illustrate one implementation; Figure 5B is a schematic diagram showing a cross-sectional view of an exemplary adaptive millimeter wave radome system; Figure 5C is a schematic diagram showing a top view of an adaptive millimeter wave radome system; Figure 5D A schematic diagram of a top view of an exemplary structure of a PMC equivalent material provided in one implementation, wherein the PMC equivalent material forms a PMC surface surrounding an exemplary millimeter wave AiP;

[0030] Fig. 6A A diagram of the electric field (E field) of an exemplary 2x2 patch antenna array provided to illustrate one implementation, the exemplary 2x2 patch antenna array being located on a ground plane in free space without any device cover; Figure 6B A diagram of the E-field of an exemplary patch antenna element provided to illustrate one implementation, the exemplary patch antenna element being located on a ground plane under a glass cover; Figure 6C A diagram of the E-field of an exemplary patch antenna element provided to illustrate one implementation, the exemplary patch antenna element being located on a ground plane under a glass cover having a PMC surface;

[0031] Fig. 7A A diagram illustrating an antenna gain pattern of an exemplary AiP antenna array provided for one implementation, the exemplary AiP antenna array being located on a PCB ground plane in free space without any device cover; Figure 7B A diagram illustrating an antenna gain pattern of an exemplary AiP antenna array provided in one implementation, the exemplary AiP antenna array being located on a PCB ground plane under a glass cover; Figure 7CA diagram illustrating an antenna gain pattern of an exemplary AiP antenna array provided in one implementation, the exemplary AiP antenna array being located on a PCB ground layer under a glass cover having a PMC surface;

[0032] Fig. 8A A graph of the following in the E-field plane provided to illustrate one implementation: a gain versus angle pattern of an exemplary AiP antenna array in free space without any device cover, a gain versus angle pattern of an exemplary AiP antenna array under a glass cover, and a gain versus angle pattern of an exemplary AiP antenna array under a glass cover with a PMC surface;

[0033] Figure 8B A plot of the following in a magnetic field (H-field) plane provided to illustrate one implementation: a gain versus angle pattern of an exemplary AiP antenna array in free space without any device cover, a gain versus angle pattern of an exemplary AiP antenna array under a glass cover, and a gain versus angle pattern of an exemplary AiP antenna array under a glass cover with a PMC surface;

[0034] Fig. 9A A schematic diagram of another exemplary adaptive millimeter wave radome system is provided to illustrate an implementation; the exemplary adaptive millimeter wave radome system comprises: a millimeter wave AiP under a device cover; a PMC equivalent material, the PMC equivalent material forming a PMC surface surrounding the exemplary millimeter wave AiP;

[0035] Fig. 9B is a schematic diagram showing a cross-sectional view of an exemplary adaptive millimeter wave radome system; Fig. 9C is a schematic diagram showing a top view of an exemplary adaptive millimeter wave radome system; Fig.9D A schematic diagram of a top view of an exemplary structure of a PMC equivalent material provided in one implementation, wherein the PMC equivalent material forms a PMC surface surrounding an exemplary millimeter wave AiP;

[0036] Fig.10 A schematic diagram of another exemplary adaptive millimeter wave radome system is provided to illustrate an implementation;

[0037] Fig.11A A schematic diagram of another exemplary adaptive millimeter wave radome system is provided to illustrate an implementation; Fig. 11B is a schematic diagram showing an enlarged view of an exemplary adaptive millimeter wave radome system; Fig. 11C is a schematic diagram showing a top view of an exemplary adaptive millimeter wave radome system;

[0038] Fig.12A schematic diagram showing an exemplary structure of a PMC equivalent material provided in an implementation, wherein the PMC equivalent material forms a PMC surface of an exemplary adaptive millimeter wave radome system;

[0039] Fig.13A A diagram showing the electric field (E field) of an exemplary 1x4 patch antenna array provided for one implementation, wherein the exemplary 1x4 patch antenna array is vertically mounted on a PCB ground plane in free space without a glass cover; Fig. 13B is a diagram showing a perspective view of the E-field of an exemplary 1x4 patch antenna array mounted vertically on a PCB ground plane in free space without a glass cover;

[0040] Fig. 13C A diagram showing the electric field (E field) of an exemplary 1x4 patch antenna array provided in one implementation, wherein the exemplary 1x4 patch antenna array is vertically mounted on a PCB ground plane with a glass cover; Fig.13D is a diagram showing a perspective view of an E-field 1330 of an exemplary 1x4 patch antenna array mounted vertically on a PCB ground plane 1325 with a glass cover;

[0041] Fig.13E A diagram of the electric field (E field) of an exemplary 1x4 patch antenna array 1305 provided to illustrate one implementation is provided, wherein the exemplary 1x4 patch antenna array 1305 is vertically mounted on a PCB ground layer with a glass cover and surrounding PMC surface; Fig.13F is a diagram showing a perspective view of the E-field of an exemplary 1x4 patch antenna array mounted vertically on a PCB ground plane 1325 with a glass cover and surrounding PMC surface;

[0042] Fig.14A A diagram illustrating an antenna gain pattern of an exemplary AiP antenna array (e.g., 1x4 AiP) provided in one implementation, wherein the exemplary AiP antenna array is vertically mounted on a PCB ground plane in free space without any device cover (e.g., FIG. 13A to FIG. 13B shown); Fig. 14B FIG. 1 is a diagram showing an antenna gain pattern of an exemplary AiP antenna array provided in one implementation, wherein the exemplary AiP antenna array is vertically mounted on a PCB ground plane under a folding glass cover (eg, FIG. 13C to FIG. 13D shown); Fig. 14C A diagram showing an antenna gain pattern of an exemplary AiP antenna array provided in one implementation, wherein the exemplary AiP antenna array is vertically mounted on a PCB ground plane under a folding glass cover with a PMC surface (eg, FIG. 13E to FIG. 13F shown);

[0043] Fig.15A A graph of the following in the E-field plane is provided to illustrate one implementation: Gain versus angle pattern of an exemplary AiP antenna array in free space without any device cover (e.g., as FIG. 13A to FIG. 13B ), gain and angle patterns of an exemplary AiP antenna array under a glass cover (e.g., as shown in FIG. 13C to FIG. 13D ) and the gain versus angle pattern of an exemplary AiP antenna array under a glass cover with a PMC surface (e.g., as FIG. 13E to FIG. 13F shown);

[0044] Fig. 15B A plot of the gain versus angle pattern of an exemplary AiP antenna array in free space without any device cover (e.g., as shown in FIG. 1 ) is provided in the magnetic field (H field) plane to illustrate one implementation: FIG. 13A to FIG. 13B ), gain and angle patterns of an exemplary AiP antenna array under a glass cover (e.g., as shown in FIG. 13C to FIG. 13D ) and the gain versus angle pattern of an exemplary AiP antenna array under a glass cover with a PMC surface (e.g., as FIG. 13E to FIG. 13F shown).

[0045] Like reference numbers and designations in the various drawings represent like elements. DETAILED DESCRIPTION

[0046] The following detailed description describes an adaptive millimeter wave antenna cover for 5G millimeter wave communications, etc., and proposes the adaptive millimeter wave antenna cover to enable those skilled in the art to implement and use the disclosed subject matter in the context of one or more specific implementations.

[0047] Various modifications, changes, and arrangements may be made to the disclosed implementations and will be apparent to those of ordinary skill in the art, and the general principles defined may be applied to other implementations and applications without departing from the scope of the invention. In some cases, details not necessary for understanding the described subject matter may be omitted so as not to obscure one or more of the described implementations with unnecessary detail as such details are within the capabilities of those of ordinary skill in the art. The invention is not intended to be limited to the implementations described or shown, but rather to be accorded the widest scope consistent with the principles and features described.

[0048] In wireless communication systems, especially with the development of 5G systems, mobile phones may need to accommodate more and more 2G / 3G / 4G LTE, as well as 5G New Radio (NR) antennas and millimeter wave antennas. As the thickness of the industrial design (ID) of the phone becomes thinner, and its frame area becomes smaller, while the display becomes larger, the area left for the antenna may be limited.

[0049] In some implementations, unlike antennas below 6 GHz that are typically implemented as a single antenna element, a mobile phone may include an antenna system or antenna module that includes one or more antenna elements. For example, a phased antenna array may be used at millimeter wave frequencies to achieve higher gain and beamforming scanning to compensate for high signal attenuation when propagating through the air interface. For example, the antenna system may be an antenna in package (AiP), an antenna on board (AoB), or an antenna in module (AiM). Antenna in package (AiP) is currently the mainstream format for 5G millimeter wave antenna modules. However, the design and calibration of standard AiP antennas are based on the characteristics of AiP in free space to achieve mass production. However, when the AiP is placed inside a device (e.g., a mobile phone), a device cover (e.g., a phone back cover, a phone front cover, or a side or edge cover) with a high dielectric constant (DK) material such as glass may have a significant effect on antenna performance. Furthermore, multiple AiP modules may be used in a single device and the surrounding environment of the antenna system may be more complex and different from that in free space, especially when the size of the phone is thinner and the distance between the device cover and the antenna system is smaller.

[0050] For example, the device cover is typically larger than 10 times the size of the AiP. Such a large size of the device cover on the AiP may cause the guided waves inside the device cover to be uncontrollable instead of being concentrated in the intended radiation direction. In some implementations, the closer the distance between the device cover and the AiP, the narrower the main beam of the antenna beam pattern of the AiP and the higher the side lobes of the antenna beam pattern of the AiP. In one implementation, when the distance between the AiP and the glass cover increases to 3.8 mm or greater than 3.8 mm, the beam pattern of the AiP is similar to the beam pattern in free space. However, the thickness of most devices is limited, and the antenna systems of traditional devices will experience problems with degraded antenna performance.

[0051] The present invention provides a technology for solving the above-mentioned problems. The antenna system can help improve or optimize the antenna performance of a millimeter wave antenna system (e.g., a standardized AiP) in different situations for millimeter wave communications. For example, when the AiP is under a dielectric cover of a device, the technology can help the standardized AiP achieve or approach optimal antenna performance. The technology is capable of designing and implementing an adaptive millimeter wave radome system. In some implementations, an adaptive millimeter wave radome system may include: a device cover; an antenna system under the device cover; wherein the device cover is separated from the antenna system (e.g., a distance less than 3.8 mm); the device cover includes a perfect magnetic conductor (PMC) equivalent material that surrounds the antenna system without overlapping the antenna system.

[0052] In some implementations, the PMC equivalent material can be used to form a PMC boundary condition, which can electronically truncate the device cover to a finite size similar to the antenna array aperture, rather than physically truncate the device cover. Therefore, the waveguide inside the device cover and the antenna aperture size can be controlled, so that the impact of the surrounding environment such as the device dielectric cover on the antenna performance can be reduced. The PMC equivalent material on the device cover can help form a millimeter wave antenna cover that fits the surrounding environment of the antenna such as the device dielectric cover. In some implementations, the PMC equivalent material can form a loop, a closed loop, a U-shape, or another different shape (e.g., a frame, a ring, a band, etc.) around the antenna and have different sizes (e.g., length, width, and thickness). In some implementations, the width along the shape of the device dielectric cover formed by the PMC equivalent material is equal to or greater than λ d / 2, where λ d is the effective wavelength of the waveguide in the device cover.

[0053] For example, a PMC equivalent material may be used to form a PMC having a width of at least λ d / 2 PMC boundary condition surface to surround the AiP under the back cover of the mobile phone. The PMC boundary condition surface can effectively play the role of a magnetic conductor within a certain frequency range. The PMC boundary condition surface can electronically truncate the back cover to a limited size similar to the antenna array aperture. The PMC boundary condition surface helps to effectively form the antenna cover of the AiP under the back cover of the mobile phone.

[0054] PMC equivalent materials can be artificial electromagnetic (EM) materials that can reach or approach PMC boundary conditions with high impedance and almost lossless. Artificial EM materials with different structures such as electromagnetic band gap (EBG) structure or photonic band gap (PBG) structure can be used to realize PMC equivalent materials. PBG structure is usually an infinite periodic structure of dielectric material, which prevents the propagation of EM waves at a certain frequency. For finite PBG structure instead of infinite PBG structure, the propagated signal is attenuated in the specified frequency band. Although "photon" refers to light, the principle of "bandgap" applies to electromagnetic waves of all wavelengths. PBG provides a certain degree of three-dimensional control over the propagation of EM waves. In some implementations, a true three-dimensional PBG is required to achieve full control through the effect of PBG.

[0055] The technology can also jointly design the millimeter wave antenna system of the device and the dielectric cover of the device to achieve a radome for the millimeter wave antenna system that adapts to different device surrounding environments. For example, various parameters of the PMC equivalent material (e.g., structure, size, etc.), antenna (e.g., type, radiation pattern, etc.), back cover (e.g., material type, shape, size, etc.), and other factors in the surrounding environment can be designed or otherwise configured to optimize or otherwise improve antenna performance. For example, the PMC equivalent material may include a plurality of metal elements, wherein the shape and size of each of the plurality of metal elements is determined based on the dielectric parameters of the device cover and the distance between the device cover and the antenna system. In some implementations, the PMC equivalent material may include a plurality of holes on a dielectric substrate, wherein the shape and size of each of the plurality of holes is determined based on the dielectric parameters of the device cover and the distance between the device cover and the antenna system.

[0056] In some implementations, a millimeter wave antenna system with an adaptive millimeter wave radome can achieve an antenna gain of 3 dB beam width compared to one of the millimeter wave antenna systems in free space. In some implementations, the technology enables the implementation of millimeter wave antennas inside compact mobile devices (e.g., 5G mobile devices) to improve the capacity of multiple-input-multiple-output (MIMO) diversity systems.

[0057] Figure 1A A schematic diagram 100 of an exemplary mmWave AiP 105 beneath a glass cover 115 is provided to illustrate one implementation. Figure 1BSchematic 150 is a cross-sectional view of an exemplary millimeter wave AiP 105 shown below a glass cover 115. In some implementations, the millimeter wave AiP 105 (e.g., an AiP antenna array) can be an example of a millimeter wave antenna system of a device (e.g., a mobile phone). The glass cover 115 can be an example of a dielectric cover of the device. For example, the glass cover 115 can be an example of a dielectric back cover of a mobile phone, which extends beyond the exemplary millimeter wave AiP 105 and forms the entire back of the mobile phone. The millimeter wave AiP 105 is placed on a printed circuit board (PCB) 125. Therefore, the glass cover 115 can be used as an upper layer of the millimeter wave AiP 105, and the PCB 125 can be used as a ground layer or substrate for the millimeter wave AiP 105.

[0058] In some implementations, the millimeter wave antenna system can excite guided waves inside the dielectric cover of the device, especially when the dielectric cover has a relatively high DK (e.g., DK>3). Figure 1A to Figure 1B As shown, the millimeter wave AiP 105 excites the waveguide 110 inside the glass cover 115. In some implementations, the waveguide 110 inside the glass cover 115 and the surface wave 120 on the PCB 125 can promote the propagation of each other. In some implementations, the waveguide inside the dielectric cover (e.g., the waveguide 110) expands the actual radiation aperture of the millimeter wave antenna system, making the actual radiation aperture larger than its radiation aperture in free space, which may reduce the beam width and scanning capability of the millimeter wave antenna system.

[0059] Figure 2A A schematic diagram of an exemplary adaptive millimeter wave radome system 200 is provided to illustrate one implementation. Figure 2B Schematic diagram 250 is a cross-sectional view of an exemplary adaptive millimeter wave radome system 200. In some implementations, the adaptive millimeter wave radome system 200 includes: an exemplary millimeter wave antenna system 205 below a device cover 215; and a PMC surface 235 on the device cover 215. The device cover 215 is separated from the exemplary millimeter wave antenna system 205 by a distance of less than 3.8 mm in a first dimension (i.e., in this example, in a vertical direction along the z-axis). In some implementations, the distance between the device cover 215 and the millimeter wave antenna system 205 can be 3 mm or less. Therefore, the PMC surface 235 and the exemplary millimeter wave antenna system 205 are not on the same plane, but are also separated in the first dimension.

[0060] In some implementations, the mmWave antenna system 205 may be a mmWave AiP 205 (eg, an AiP antenna array), a mmWave AoB, or a mmWave AiM. In some implementations, the antenna system may include one or more antennas configured to operate at mmWave frequencies.

[0061] The device cover 215 can be an example of a dielectric cover for a device (e.g., a cell phone). In some implementations, the cell phone case can be a cell phone front cover that covers the front of the cell phone, wherein the front includes the screen of the cell phone (e.g., a touch screen or display). In some implementations, the cell phone case can be a cell phone back cover that covers the back of the cell phone, wherein the back is opposite the screen of the cell phone. In some implementations, for example, the dielectric cover can be a dielectric back cover of a cell phone that extends beyond the exemplary millimeter wave antenna system 205 and forms the entire back of the cell phone. For example, the device cover 215 can be Figure 1A to Figure 1B The device cover 215 may be a glass cover similar to the glass cover 115 shown in FIG. The device cover 215 may be used as an upper layer of the millimeter wave antenna system 205. The device cover 215 may include a substrate (e.g., a glass substrate), wherein a first surface (e.g., an inner surface) of the substrate faces the millimeter wave antenna system 205 below the substrate. The substrate is separated from the millimeter wave antenna system 205 in a first dimension (i.e., in this example, in a vertical direction along the z-axis).

[0062] In some implementations, a PMC equivalent material can be disposed, deposited, placed, or otherwise included on the device cover 215. For example, the PMC equivalent material can be disposed on a first surface of the substrate of the device cover 215, facing the millimeter wave antenna system 205. In some implementations, the thickness or height of the PMC material is significantly less than its length and width along the first surface of the substrate of the device cover 215, thereby forming a PMC surface 235 surrounding the millimeter wave antenna system 205. The PMC surface 235 below the device cover 215 can be used to suppress guided waves (e.g., microwaves with a frequency of up to 300 MHz) inside the device cover 215, thereby reducing or eliminating energy flowing in unwanted directions.

[0063] The PMC surface 235 helps to effectively form the adaptive millimeter wave radome of the adaptive millimeter wave radome system 200. For example, the PMC surface 235 can actually electronically truncate the device cover 215 into a limited device cover 315, which forms the entire back of the phone and has uncontrollable waveguides (e.g., Figure 1A to Figure 1B ), the limited device cover 315 has a size similar to the actual antenna array aperture of the millimeter wave antenna system 305 in free space, such as FIG. 3A to FIG. 3BIn some implementations, in terms of the performance of the antenna system, FIG. 2A to FIG. 2B The exemplary adaptive millimeter wave radome system 200 shown may be similar to or substantially identical to FIG. 3A to FIG. 3B The exemplary millimeter wave antenna system 305 is shown. Specifically, Figure 3A A schematic diagram 300 of an exemplary millimeter wave antenna system 305 beneath a limited device cover 315 in free space is provided to illustrate one implementation. Figure 3B Schematic diagram 350 is a cross-sectional view of an exemplary millimeter wave antenna system 305 shown below a limited device cover 315. The limited device cover 315 does not extend to FIG. 3A to FIG. 3B The limited device cover 315 has a similar size to the actual antenna array aperture of the millimeter wave antenna system 305 in free space.

[0064] like Figure 2A As shown, the PMC surface 235 has a rectangular frame shape having a width along the first surface of the substrate of the device cover 215. The width may be equal to or greater than λ d / 2, where λ d is the effective wavelength of the guided waves in the device cover 215. The PMC surface 235 may have another shape and have different sizes. In some implementations, for example, the PMC surface 235 and the millimeter wave antenna system 205 may be co-designed by selecting the type of the PMC equivalent material, the shape and size (length, width and depth) of the PMC surface, and the configuration of the millimeter wave antenna system 205 to improve or optimize the performance of the millimeter wave antenna system 205 under the device cover 215 of the device. For example, the shape of the PMC surface 235 may be selected to be the same, similar, or otherwise match the shape of the millimeter wave antenna system 205. The size of the PMC surface 235 may be slightly larger than the size of the millimeter wave antenna system 205, so that the PMC surface 235 surrounds or otherwise surrounds the millimeter wave antenna system 205. In some implementations, the PMC surface 235 may be as close to the millimeter wave antenna system 205 as possible along the first surface of the substrate of the device cover 215 without overlapping it. For example, the lateral distance between the PMC surface 235 and the millimeter wave antenna system 205 may be λ d or smaller.

[0065] Figure 4A A schematic diagram of an exemplary adaptive millimeter wave radome system 400 is provided to illustrate one implementation. Figure 4BSchematic diagram 450 is a cross-sectional view of an exemplary adaptive millimeter wave radome system 400. In some implementations, the adaptive millimeter wave radome system 400 includes: a millimeter wave AiP 405 below a device cover 415; and a PMC ring 435 on the device cover 415 surrounding the millimeter wave AiP 405. The device cover 415 is separated from the millimeter wave AiP 405 in a first dimension (i.e., in this example, in a vertical direction along the z-axis). Therefore, the PMC ring 435 and the millimeter wave AiP 405 are not on the same plane, but are also separated in the first dimension.

[0066] The mmWave AiP 405 may be an example of a mmWave antenna system inside a device (e.g., a cell phone), such as the mmWave antenna system 205. The device cover 415 may be an example of a dielectric cover for a device (e.g., a cell phone). For example, the dielectric cover may be a dielectric back cover of a cell phone that extends beyond the exemplary mmWave AiP 405 and forms the entire back of the cell phone. For example, the device cover 415 may be a dielectric back cover that is provided with a device (e.g., a cell phone). Figure 1A to Figure 1B The device cover 415 may be a glass cover similar to the glass cover 115 shown in FIG. The millimeter wave AiP 405 is placed on a printed circuit board (PCB) 425. Thus, the device cover 415 may serve as an upper layer of the millimeter wave AiP 405, and the PCB 425 may serve as a ground layer or substrate for the millimeter wave AiP 405. Figure 4A As shown, the millimeter wave AiP 405 includes a 2x2 28GHz antenna patch array. The millimeter wave AiP 405 is surrounded by a PMC ring 435. The width of the PMC ring 435 is 4mm. It should be noted that the PMC ring 435 surrounds the millimeter wave AiP 405 but does not overlap it.

[0067] Figure 5A A schematic diagram of an exemplary adaptive millimeter wave radome system 500 is provided to illustrate one implementation. The adaptive millimeter wave radome system 500 includes: a millimeter wave AiP 505 under a device cover 515; and a PMC equivalent material 560 forming a PMC surface 535 surrounding the exemplary millimeter wave AiP 505. Figure 5B A schematic diagram 550 is shown showing a cross-sectional view of an exemplary adaptive millimeter wave radome system 500 . Figure 5C Schematic diagram 555 is a diagram showing a top view of the adaptive millimeter wave radome system 500 . Figure 5D A schematic diagram of a top view of an exemplary structure of a PMC equivalent material 560 is provided for one implementation, the PMC equivalent material forming a PMC surface 535 surrounding an exemplary mmWave AiP 505 .

[0068] The mmWave AiP 505 may be an example of a mmWave antenna system inside a device (e.g., a cell phone), such as the mmWave antenna system 205. The device cover 515 may be an example of a dielectric cover for a device (e.g., a cell phone). For example, the dielectric cover may be a dielectric back cover of a cell phone that extends beyond the exemplary mmWave AiP 505 and forms the entire back of the cell phone. For example, the device cover 515 may be a dielectric back cover that is provided with a plurality of dielectric layers. Figure 1A to Figure 1B The device cover 515 may be a glass cover similar to the glass cover 115 shown in FIG. The millimeter wave AiP 505 is placed on a printed circuit board (PCB) 525. Thus, the device cover 515 may serve as an upper layer of the millimeter wave AiP 505, and the PCB 525 may serve as a ground layer or substrate for the millimeter wave AiP 505.

[0069] like Figure 5B and Figure 5C As shown, the mmWave AiP 505 is surrounded by a PMC surface 535. Figure 5D As shown, the PMC surface 535 is made of a PMC equivalent material 565 having a PGB structure, wherein the PMC equivalent material 565 is constructed by drilling or etching spherical holes 564 in a dielectric material 562. Figure 5D In the example shown, the diameter of each of the circular holes 564 is 0.6 mm. The diameter of the circular holes 564 can have other values, such as in the range of 0.3 to 0.8 mm. In some implementations, the diameter and arrangement of each of the spherical holes 564 can be designed or otherwise configured, for example, to optimize or otherwise improve the impedance or other characteristics of the PMC equivalent material 565, thereby better suppressing the guided waves in the device cover 515. In some implementations, the shape and size of each of the spherical holes 564 is determined based on the dielectric parameters of the device cover 515 and the distance between the device cover 515 and the antenna system 505 in the first dimension (i.e., in this example, the vertical direction along the z-axis).

[0070] Fig. 6A A graph of the electric field (E-field) 600 of an exemplary 2x2 patch antenna array 605 located on a ground plane 602 in free space without any device cover is provided to illustrate one implementation. Figure 6B A diagram of the E-field 630 of an exemplary patch antenna element 615 located on a ground plane 612 beneath a glass cover 614 is provided to illustrate one implementation. Figure 6CA diagram of an E-field 660 of an exemplary patch antenna element 625 is provided to illustrate one implementation, the exemplary patch antenna element 625 being located on a ground plane 622 under a glass cover 624 having a PMC surface 635. The PMC surface 635 surrounds the patch antenna element 625 but does not overlap it. The PMC surface 635 is formed of a PMC equivalent material having a PGB structure. FIG. 6A to FIG. 6C As shown, the guided waves in the glass cover 624 and the surface waves on the ground layer 622 can be partially suppressed by the PMC surface 635.

[0071] Fig. 7A A diagram of an antenna gain pattern 700 of an exemplary AiP antenna array provided to illustrate one implementation is provided, the exemplary AiP antenna array being located on a PCB ground plane in free space without any device cover. Antenna gain pattern 700 shows a peak gain of 9.9 dB for an exemplary AiP antenna array 705 on a PCB ground plane in free space without any device cover. Figure 7B A diagram of an antenna gain pattern 730 of an exemplary AiP antenna array provided to illustrate one implementation is provided, the exemplary AiP antenna array being located on a PCB ground plane under a glass cover. Antenna gain pattern 730 shows that the peak gain of the exemplary AiP antenna array on a PCB ground plane under a glass cover is 8.4 dB. Figure 7C A diagram of an antenna gain pattern 760 of an exemplary AiP antenna array provided to illustrate one implementation is provided, the exemplary AiP antenna array being located on a PCB ground layer under a glass cover with a PMC surface. The antenna gain pattern 760 shows that the peak gain of the exemplary AiP antenna array on a PCB ground layer under a glass cover with a PMC surface is 10.1 dB.

[0072] like 7A to 7C As shown, when using the PMC equivalent material on the glass cover, the peak gain potential of the antenna gain pattern 760 of the exemplary AiP antenna array under the glass cover with the PMC surface is improved by 1.7 dB compared with the peak gain potential of the antenna gain pattern 730 of the exemplary AiP antenna array under the glass cover without the PMC surface. In addition, the antenna gain pattern 760 is much smoother than the antenna gain pattern 730. Due to the controlled reflection between the glass cover and the PCB ground layer, the antenna gain pattern 760 has less ripples and its side lobes are much lower than the side lobes of the antenna gain pattern 730.

[0073] Fig. 8AA graph 800 of the following in the E-field plane is provided to illustrate one implementation: a gain versus angle pattern 805 of an exemplary AiP antenna array in free space without any device cover, a gain versus angle pattern 815 of an exemplary AiP antenna array under a glass cover, and a gain versus angle pattern 825 of an exemplary AiP antenna array under a glass cover with a PMC surface.

[0074] Figure 8B A plot 850 of the following in the magnetic field (H-field) plane is provided to illustrate one implementation: gain versus angle pattern 804 of an exemplary AiP antenna array in free space without any device cover, gain versus angle pattern 814 of an exemplary AiP antenna array under a glass cover, and gain versus angle pattern 824 of an exemplary AiP antenna array under a glass cover with a PMC surface. Gain versus angle patterns 805, 815, 825, 804, 814, and 824 are all measured at a frequency of 28 GHz at phi = 90°.

[0075] like FIG. 8A to FIG. 8B As shown, the side lobes and back lobes of the gain and angle patterns 825 and 824 of the exemplary AiP antenna array under the glass cover with the PMC surface are closer to the corresponding patterns 805 and 804 in free space without any device cover, and are smoother than the corresponding patterns 815 and 814 of the exemplary AiP antenna array under the glass cover without the PMC surface.

[0076] Fig. 9A A schematic diagram of another exemplary adaptive millimeter wave radome system 900 is provided to illustrate one implementation. The exemplary adaptive millimeter wave radome system 900 includes: a millimeter wave AiP 905 under a device cover 915; and a PMC equivalent material 960, which forms a PMC surface 935 surrounding the exemplary millimeter wave AiP 905.

[0077] Fig. 9B A schematic diagram 950 is shown showing a cross-sectional view of an exemplary adaptive millimeter wave radome system 900 . Fig. 9C A schematic diagram 955 is shown showing a top view of an exemplary adaptive millimeter wave radome system 900 . Fig.9D A schematic diagram of a top view of an exemplary structure of a PMC equivalent material 960 is provided in one implementation, wherein the PMC equivalent material forms a PMC surface 935 surrounding an exemplary mmWave AiP 905 .

[0078] The mmWave AiP 905 may be an example of a mmWave antenna system inside a device (e.g., a cell phone), such as the mmWave antenna system 205. The device cover 915 may be an example of a dielectric cover for a device (e.g., a cell phone). For example, the dielectric cover may be a dielectric back cover of a cell phone that extends beyond the exemplary mmWave AiP 905 and forms the entire back of the cell phone. For example, the device cover 915 may be a dielectric back cover that is provided with a plurality of dielectric layers. Figure 1A to Figure 1B The device cover 915 may be a glass cover similar to the glass cover 115 shown in FIG. The millimeter wave AiP 905 is placed on a printed circuit board (PCB) 925. Thus, the device cover 915 may serve as an upper layer of the millimeter wave AiP 905, and the PCB 925 may serve as a ground layer or substrate for the millimeter wave AiP 905.

[0079] like Fig. 9B and Fig. 9C As shown, the millimeter wave AiP 905 is surrounded by a PMC surface 935, which is made of a PMC equivalent material 960. Fig.9D As shown, the PMC equivalent material 960 has a PGB structure, wherein the PMC equivalent material 969 has a periodic structure of rectangular holes 964 on the dielectric material 962. Fig.9D In the example shown, each of the rectangular holes 964 is arranged in a snowflake shape, and the length of its outer contour is 0.8 mm. The diameter of the circular hole 964 can have other values, such as in the range of 0.6 to 1 mm. In some implementations, the size and arrangement of each hole 964 can be designed or otherwise configured, for example, to optimize or otherwise improve the impedance or other characteristics of the PMC equivalent material 960, so as to better suppress the guided waves in the device cover 915.

[0080] Fig.10 A schematic diagram 1000 of another exemplary adaptive millimeter wave radome system 1000 is provided to illustrate one implementation. The exemplary adaptive millimeter wave radome system 1000 includes a millimeter wave AiP 1005 below a device cover 1015 and a PMC surface 1035 on the device cover 1015 .

[0081] Millimeter wave AiP 1005 can be an example of a millimeter wave antenna system inside a device (e.g., a mobile phone), such as millimeter wave antenna system 205. The millimeter wave AiP 1005 shown includes 4 antenna elements. In some implementations, millimeter wave AiP 1005 can include other numbers of antenna elements (e.g., 1, 2, 3, 5, 6, etc.). Device cover 1015 can be an example of a dielectric cover of a device (e.g., a mobile phone). For example, the dielectric cover can be a dielectric back cover of a mobile phone, which extends beyond the exemplary millimeter wave AiP 1005 and forms the entire back of the mobile phone. For example, the device cover 1015 can be a dielectric back cover of a mobile phone. Figure 1A to Figure 1B The millimeter wave AiP 1005 is placed on a printed circuit board (PCB) 1025. Therefore, the device cover 1015 can be used as an upper layer of the millimeter wave AiP 1005, and the PCB 1025 can be used as a ground layer or substrate for the millimeter wave AiP 1005. Fig.10 As shown in FIG. 1A , the millimeter wave AiP 1005 includes four antenna elements arranged horizontally in a 1×4 configuration. The millimeter wave AiP 1005 is surrounded by a PMC surface 1035 . It should be noted that the PMC surface 1035 does not overlap with the millimeter wave AiP 1005 .

[0082] Fig.11A A schematic diagram of another exemplary adaptive millimeter wave radome system 1100 is provided to illustrate one implementation. The exemplary adaptive millimeter wave radome system 1100 includes a millimeter wave AiP 1105 under a device cover 1115 of a device 1150 and a PMC strip 1135 on the device cover 1115 . Fig. 11B A schematic diagram 1130 is shown showing an enlarged view of an exemplary adaptive millimeter wave radome system 1100 . Fig. 11C A schematic diagram 1160 is shown showing a top view of an exemplary adaptive millimeter wave radome system 1100 .

[0083] The millimeter wave AiP 1105 is vertically mounted on a ground plane 1125. The ground plane 1125 can be located at the screen of the device 1150 (e.g., a touch screen or display, Fig.11A The ground layer 1125 may be in a plane where the screen of the device 1150 is located or parallel to the plane. For example, the ground layer 1125 may be a front plane where the screen of the device 1150 is located. For another example, the ground layer 1125 may be a rear plane opposite to the front plane where the screen of the device 1150 is located.

[0084] The mobile phone housing includes a mobile phone side cover or edge cover covering the side or edge of the mobile phone, wherein Fig.11AAs shown, the millimeter wave AiP 1105 is placed on the side (e.g., top or bottom) or edge of the device 1150. The side or edge can be located at the periphery of the screen of the mobile phone, substantially spanning the thickness dimension of the device 1150. The device cover 1115 includes a plane covering the ground layer 1125 (which may be referred to as a back cover) and a plane covering the side or edge of the device 1150 (which may be referred to as a side cover or edge cover). A plurality of PMC strips 1135 are provided on the device cover 1115 surrounding the millimeter wave AiP 1105. The millimeter wave AiP 1105 is located below the side cover or edge cover of the mobile phone of the device cover 1115. The millimeter wave AiP 1105 includes 4 antenna elements arranged horizontally in 1x4.

[0085] The mmWave AiP 1105 is surrounded by a device cover 1115. The device cover 1115 may serve as an upper layer of the mmWave AiP 1105. Fig. 11C As shown, the mmWave AiP 1105 is separated from the device cover 1115 in both a first dimension (e.g., in this example, along the x-axis in the horizontal plane) and a second dimension (e.g., in this example, along the y-axis in the horizontal plane). The PMC strip 1135 forms a U-shape around the mmWave AiP 1105.

[0086] like Fig.11A As shown, the device cover 1115 is a folding cover, for example, the folding cover includes a back cover and a side cover or an edge cover. The device cover 1115 can be an example of a dielectric cover of a device (e.g., a mobile phone). For example, the dielectric cover can be a dielectric cover of a mobile phone that at least spans the top or bottom or the top edge or bottom edge of the mobile phone.

[0087] like FIG. 11A to FIG. 11C As shown, the mmWave AiP 1105 is surrounded by three PMC strips 1135, except on the ground layer 1125, to suppress guided waves in the device cover 1115. The PMC strips 1135 are disposed on the inner surface of the device cover 1115 facing the mmWave AiP 1105. Note that the PMC strips 1135 do not overlap the mmWave AiP 1105. In some implementations, the size (e.g., length, width, or thickness) of each of the PMC strips 1135 can be configured or co-designed with other factors in the mmWave AiP 1105, the device cover 1115, or the environment surrounding the mmWave AiP 1105 to electronically intercept the device cover 1115 and form a radome for the mmWave AiP 1105.

[0088] Fig.12A schematic diagram 1200 of an exemplary structure of a PMC equivalent material is provided to illustrate one implementation, wherein the PMC equivalent material forms a PMC surface 1135 of an exemplary adaptive millimeter wave radome system 1100. Similar to the PMC equivalent material 565 in Figure 5, the PMC equivalent material has a PGB structure having periodic circular holes 1164 on a dielectric material 1162. In some implementations, the size and arrangement of each circular hole 1164 can be designed or otherwise configured, for example, to optimize or otherwise improve the impedance or other characteristics of the PMC equivalent material to better suppress guided waves in the device cover 1115. In some implementations, the PMC equivalent material forming the PMC surface 1135 can have another structure or pattern. For example, the PMC equivalent material forming the PMC surface 1135 can have a PGB structure having a periodic circular hole 1164 on a dielectric material 1162. In some implementations, the size and arrangement of each circular hole 1164 can be designed or otherwise configured, for example, to optimize or otherwise improve the impedance or other characteristics of the PMC equivalent material to better suppress guided waves in the device cover 1115. In some implementations, the PMC equivalent material forming the PMC surface 1135 can have another structure or pattern. For example, the PMC equivalent material forming the PMC surface 1135 can have a PGB structure having a periodic circular hole 1164 on a dielectric material 1162. Fig.9D The PMC equivalent material 960 has a similar structure.

[0089] Fig.13A A graph of the electric field (E-field) 1300 of an exemplary 1x4 patch antenna array 1305 mounted vertically on a PCB ground plane 1325 in free space without a glass cover is provided to illustrate one implementation. Fig. 13B A diagram showing a perspective view 1302 of an E-field 1300 of an exemplary 1x4 patch antenna array 1305 mounted vertically on a PCB ground plane 1325 in free space without a glass cover.

[0090] Fig. 13C To illustrate one implementation, a diagram of an electric field (E field) 1330 of an exemplary 1x4 patch antenna array 1305 (e.g., an antenna system of a device) is provided, which is vertically mounted on a PCB ground layer 1325 with a glass cover 1315 (e.g., a device cover). The glass cover 1315 covers the exemplary 1x4 patch antenna array 1305 and the PCB ground layer 1325. Fig.13D A diagram illustrating a perspective view 1332 of an E-field 1330 of an exemplary 1x4 patch antenna array 1305 mounted vertically on a PCB ground plane 1325 with a glass cover 1315 .

[0091] Fig.13E To illustrate one implementation, a graph of the electric field (E-field) 1360 of an exemplary 1x4 patch antenna array 1305 is provided, which is vertically mounted on a PCB ground layer 1325 with a glass cover 1315 and a surrounding PMC surface. Fig.13FFIG. 1362 is a diagram showing a perspective view 1360 of an exemplary 1x4 patch antenna array 1305 vertically mounted on a PCB ground plane 1325 with a glass cover 1315 and a surrounding PMC surface 1335. The exemplary 1x4 patch antenna array 1305 vertically mounted on a PCB ground plane 1325 with a glass cover 1315 and a surrounding PMC surface 1335 may be FIG. 11A to FIG. 11C 1. An example of an exemplary adaptive millimeter wave radome system 1100 in FIG. The guided waves in the glass cover 1315 shown in the E-field 1330 and the surface waves on the ground layer 1325 can be partially suppressed by the surrounding PMC surface 1335 shown in the E-field 1360.

[0092] Fig.14A A diagram is provided to illustrate an antenna gain pattern 1400 of an exemplary AiP antenna array (e.g., 1x4 AiP) provided in one implementation, wherein the exemplary AiP antenna array is vertically mounted on a PCB ground plane in free space without any device cover (e.g., FIG. 13A to FIG. 13B ). Antenna gain pattern 1400 shows a peak gain of 10.9 dB for an exemplary AiP antenna array 1405 on a PCB ground plane in free space without any device cover. Fig. 14B A diagram showing an antenna gain pattern 1430 of an exemplary AiP antenna array provided in one implementation is provided, wherein the exemplary AiP antenna array is vertically mounted on a PCB ground plane under a folding glass cover (eg, FIG. 13C to FIG. 13D ). Antenna gain pattern 1430 shows a peak gain of 8.8 dB for an exemplary AiP antenna array mounted vertically on a PCB ground plane under a folding glass cover. Fig. 14C A diagram is provided to illustrate an antenna gain pattern 1460 of an exemplary AiP antenna array provided in one implementation, wherein the exemplary AiP antenna array is vertically mounted on a PCB ground layer under a folding glass cover with a PMC surface (eg, FIG. 13E to FIG. 13F ). Antenna gain pattern 1460 shows a peak gain of 10.3 dB for an exemplary AiP antenna array mounted vertically on a PCB ground plane under a folding glass cover with a PMC surface.

[0093] like FIG. 14A to FIG. 14C As shown in FIG. 1 , due to the folded glass cover, when the exemplary AiP antenna array is vertically mounted on the PCB ground plane, its main lobe (peak gain) direction is tilted upward (towards the folded glass cover). The PMC surface surrounding the exemplary AiP antenna array on the folded glass cover can suppress the guided waves propagating in the glass. As a result, the main lobe direction will be returned toward the horizontal plane, the peak gain is increased by 1.5 dB, and the back lobe is reduced.

[0094] Fig.15AA graph 1500 of the following in the E-field plane is provided to illustrate one implementation: Gain versus angle pattern 1505 of an exemplary AiP antenna array in free space without any device cover (e.g., as FIG. 13A to FIG. 13B ), gain and angle pattern 1515 of an exemplary AiP antenna array under a glass cover (e.g., as shown in FIG. 13C to FIG. 13D ) and a gain versus angle pattern 1525 of an exemplary AiP antenna array under a glass cover with a PMC surface (e.g., as FIG. 13E to FIG. 13F shown).

[0095] Fig. 15B A plot 1550 of the gain versus angle pattern 1504 of an exemplary AiP antenna array in free space without any device cover (e.g., as shown in FIG. 1 ) is provided in a magnetic field (H field) plane to illustrate one implementation. FIG. 13A to FIG. 13B ), gain and angle pattern 1514 of an exemplary AiP antenna array under a glass cover (e.g., as shown in FIG. 13C to FIG. 13D ) and a gain versus angle pattern 1524 of an exemplary AiP antenna array under a glass cover with a PMC surface (e.g., as FIG. 13E to FIG. 13F The gain and angle patterns 1505, 1515, 1525, 1504, 1514 and 1524 are all measured at a frequency of 28 GHz when phi = 90°.

[0096] like FIG. 15A to FIG. 15B As shown, the side lobes of the gain and angle patterns 1525 and 1524 of the exemplary AiP antenna array under the glass cover with the PMC surface are suppressed on the glass cover side compared to the corresponding patterns 1515 and 1514 of the exemplary AiP antenna array under the glass cover without the PMC surface.

[0097] The implementation of the subject matter and functional operations described in this specification can be implemented in digital electronic circuits, computer software or firmware that can be tangibly embodied, computer hardware, including the structures disclosed in this specification and their structural equivalents, or in one or more combinations thereof. Although this specification includes many specific implementation details, these details should not be interpreted as limiting the scope of any invention or the scope of the content claimed, but should be interpreted as a description of features that may be unique to a specific implementation of a specific invention. In the context of a separate implementation, certain features described in this specification may also be implemented in combination in a single implementation. Conversely, the various features described in the context of a single implementation may also be implemented separately in multiple implementations or in any suitable sub-combination. In addition, although the previously described features may be described as acting in certain combinations, and even initially claimed as such, in some cases, one or more features in the claimed combination may be removed from the combination, and the claimed combination may be directed to a sub-combination or a variant of the sub-combination.

[0098] A specific implementation of the subject matter has been described. Other implementations, modifications, and permutations of the described implementations are within the scope of the appended claims and will be apparent to those skilled in the art. Although operations are described in a particular order in the drawings or claims, this should not be construed as requiring that the operations be performed in the particular order shown or in a sequential order, or that all operations shown (some operations may be considered optional) be performed to obtain the desired results. In some cases, multitasking or parallel processing (or a combination of multitasking and parallel processing) may be advantageous and may be performed as appropriate.

[0099] In addition, the separation or integration of various system modules and components in the previously described implementations should not be understood as requiring such separation or integration for all implementations, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products.

[0100] Therefore, the exemplary implementations described above do not define or restrict the present invention. Other changes, substitutions and modifications may also be made without departing from the spirit and scope of the present invention.

Claims

1. A device, characterized in that: The device comprises: Equipment cover; an antenna system beneath the device cover; wherein the device cover is separated from the antenna system; The device cover includes a perfect magnetic conductor (PMC) equivalent material that surrounds the antenna system but does not overlap with the antenna system; the PMC equivalent material has a photonic band gap (PBG) structure that suppresses microwaves inside the device cover, and the PBG structure includes a plurality of holes on a dielectric substrate, wherein shapes and sizes of the plurality of holes are determined based on dielectric parameters of the device cover and a distance between the device cover and the antenna system.

2. The device according to claim 1, characterized in that The device cover includes a dielectric device cover.

3. The device according to claim 1, characterized in that The antenna system includes one or more antenna system elements.

4. The device according to claim 1, characterized in that The antenna system includes an antenna in package (Antenna in Package, AiP), an antenna on board (Antenna on Board, AoB) or an antenna in Module (Antenna in Module, AiM).

5. The device according to claim 1, characterized in that The antenna system includes one or more antennas configured to operate at millimeter wave frequencies.

6. The device according to claim 1, characterized in that The device cover serves as an upper layer of the antenna system, and the PMC equivalent material is disposed on a surface of the device cover facing the antenna system.

7. The device according to claim 1, characterized in that The width of the PMC equivalent material is equal to or greater than λ d / 2, where λ d is the effective wavelength of the waveguide in the device cover.

8. A device cover, characterized in that: include: A substrate, wherein a first surface of the substrate faces the antenna system below the substrate, and the substrate is separated from the antenna system; A perfect magnetic conductor (PMC) equivalent material is arranged on the first surface of the substrate, the equivalent material surrounds the antenna system without overlapping the antenna system, the PMC equivalent material includes a photonic band gap (PBG) structure, the PBG structure includes a plurality of holes on a dielectric substrate, wherein shapes and sizes of the plurality of holes are determined based on dielectric parameters of the device cover and a distance between the device cover and the antenna system.

9. The device cover according to claim 8, characterized in that The substrate is a dielectric material.

10. The device cover according to claim 8 or 9, characterized in that: The width of the PMC equivalent material is equal to or greater than λ d / 2, where λ d is the effective wavelength of the waveguide in the device cover.

11. A mobile phone, characterized in that: include: Mobile phone housing; An antenna system below the mobile phone housing; Wherein, the mobile phone housing is separated from the antenna system; The mobile phone case includes a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping the antenna system, and the PMC equivalent material includes a photonic band gap (PBG) structure, and the PBG structure includes a plurality of holes on a dielectric substrate, wherein shapes and sizes of the plurality of holes are determined based on dielectric parameters of the mobile phone case and a distance between the mobile phone case and the antenna system.

12. The mobile phone according to claim 11, characterized in that: The antenna system includes an antenna in package (AiP), an antenna on board (AoB) or an antenna in module (AiM).

13. The mobile phone according to claim 11 or 12, characterized in that: The mobile phone case is used as an upper layer of the antenna system, and the PMC equivalent material is arranged on a surface of the mobile phone case facing the antenna system.

14. The mobile phone according to claim 11 or 12, characterized in that: The width of the PMC equivalent material is equal to or greater than λ d / 2, where λ d It is the effective wavelength of the waveguide in the mobile phone housing.

15. The mobile phone according to claim 11, characterized in that: The mobile phone housing comprises a mobile phone front cover covering the front side of the mobile phone, and the front side comprises the screen of the mobile phone.

16. The mobile phone according to claim 11, characterized in that: The mobile phone housing comprises a mobile phone back cover covering the back side of the mobile phone, and the back side is opposite to the screen of the mobile phone.

17. The mobile phone according to claim 11, characterized in that: The mobile phone housing comprises a mobile phone side cover or a side cover covering the side or edge of the mobile phone, and the side or edge of the mobile phone is located at the periphery of the screen of the mobile phone.

18. A method for controlling electromagnetic (EM) waves generated by an antenna system of a device, characterized in that: include: Transmitting EM waves through an antenna system; The emitted EM waves are controlled by a device cover placed above and separated from the antenna system, the device cover including a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping the antenna system, the PMC equivalent material having a photonic band gap (PBG) structure that suppresses one or more guided waves in the device cover, the PBG structure including a plurality of holes on a dielectric substrate, wherein shapes and sizes of the plurality of holes are determined based on dielectric parameters of the device cover and a distance between the device cover and the antenna system.

19. The method according to claim 18, characterized in that The antenna system is vertically mounted on a ground plane of the device, and the device cover covers the antenna system and the ground plane.

20. The method according to claim 19, characterized in that The EM waves include one or more guided waves inside the device cover or surface waves on the ground layer.

21. The method according to claim 20, characterized in that The width of the PMC equivalent material is equal to or greater than λ d / 2, where λ d is the effective wavelength of the one or more waveguides in the device cover.

22. A method of providing a device for controlling electromagnetic (EM) waves, characterized in that The method comprises: A device cover is placed above and separated from an antenna system for transmitting EM waves, wherein the device cover includes a perfect magnetic conductor (PMC) equivalent material surrounding the antenna system without overlapping the antenna system, the PMC equivalent material having a photonic band gap (PBG) structure that suppresses one or more guided waves in the device cover, the PBG structure including a plurality of holes on a dielectric substrate, wherein shapes and sizes of the plurality of holes are determined based on dielectric parameters of the device cover and a distance between the device cover and the antenna system.

23. The method according to claim 22, characterized in that The antenna system is vertically mounted on a ground plane of the device, and the device cover covers the antenna system and the ground plane.

24. The method according to claim 23, characterized in that The EM waves include one or more guided waves inside the device cover or surface waves on the ground layer.

25. The method according to claim 24, characterized in that The width of the PMC equivalent material is equal to or greater than λ d / 2, where λ d is the effective wavelength of the one or more waveguides in the device cover.

Images