Microphone and electronic equipment

Abstract

The present application relates to a microphone and an electronic device including the microphone. The microphone includes: a housing for receiving a vibration signal; a conversion component in the housing for converting the vibration signal into an electrical signal, and a processing circuit for processing the electrical signal. The conversion component may include a transducer and at least one damping membrane connected to the transducer.

Description

[0001] CROSS REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese Application No. 202010051694.7 filed on January 17, 2020, the contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of microphones. Background Art

[0004] Microphones are widely used in daily communication devices. In order to achieve good communication quality in different environments, microphones with high signal-to-noise ratio (SNR) and excellent anti-noise performance have become increasingly popular. Microphones with excellent performance usually have a smooth frequency response curve and a high SNR. The existing method for smoothing the frequency response curve is usually to use the flat area before the resonance peak in the displacement resonance curve of the vibration device of the microphone. The resonance frequency of the vibration device may have to be set to a large value, which will cause the signal-to-noise ratio or sensitivity of the microphone to decrease and the communication quality to be poor. The existing method for improving the SNR or sensitivity of the microphone is often to set the resonance frequency within the voice band. Since the vibration device of the microphone has a large Q value (or small damping), picking up a large amount of sound signals near the resonance peak frequency (peak of the frequency response curve) will cause the frequency signal to be unevenly distributed throughout the frequency band, low clarity, and even cause distortion of the sound signal. Therefore, it is desirable to provide a microphone with high performance (e.g., with high sensitivity, a smooth frequency response curve and a wide frequency band). Summary of the invention

[0005] One aspect of the present application introduces a microphone. The microphone may include a housing for receiving a vibration signal; a conversion component located in the housing for converting the vibration signal into an electrical signal, and a processing circuit for processing the electrical signal. The conversion component may include a transducer and at least one damping membrane connected to the transducer.

[0006] In some embodiments, at least one damping film covers at least a portion of at least one surface of the transducer.

[0007] In some embodiments, the at least one surface of the transducer includes at least one of an upper surface, a lower surface, a side surface, or an inner surface of the transducer.

[0008] In some embodiments, at least one damping film is arranged on at least one location including an upper surface of the transducer, a lower surface of the transducer, a side surface of the transducer, or an interior of the transducer.

[0009] In some embodiments, at least one damping film is disposed at a predetermined angle on at least one surface of the transducer.

[0010] In some embodiments, the predetermined angle is 30°, 45°, 60°, or 90°.

[0011] In some embodiments, at least one damping membrane is connected to the housing.

[0012] In some embodiments, the at least one damping film includes at least two damping films, and the at least two damping films are arranged symmetrically with respect to a center line of the transducer.

[0013] In some embodiments, the conversion assembly further comprises at least one elastic element, wherein the at least one damping film is connected to the transducer and the at least one elastic element, respectively.

[0014] In some embodiments, the at least one elastic element and the transducer are arranged in a predetermined distribution pattern.

[0015] In some embodiments, the predetermined distribution pattern includes at least one of a horizontal distribution pattern, a vertical distribution pattern, an array distribution pattern, or a random distribution pattern.

[0016] In some embodiments, the at least one damping film covers at least a portion of at least one surface of the at least one elastic element.

[0017] In some embodiments, the width of at least one damping film varies.

[0018] In some embodiments, the thickness of at least one damping film varies.

[0019] In some embodiments, the transducer includes at least one of a diaphragm, a piezoelectric plate, a piezoelectric film, or an electrostatic film.

[0020] In some embodiments, the structure of the transducer includes at least one of a membrane, a cantilever beam, or a plate.

[0021] In some embodiments, the vibration signal is caused by at least one of a gas, a liquid, or a solid.

[0022] In some embodiments, the vibration signal is transmitted from the housing to the conversion assembly according to a non-contact mode or a contact mode.

[0023] In some embodiments, the transducer and the at least one damping membrane are designed according to a frequency response curve of a microphone.

[0024] According to another aspect of the application, an electronic device including a microphone is provided. The microphone may include a housing for receiving a vibration signal; a conversion component located in the housing for converting the vibration signal into an electrical signal, and a processing circuit for processing the electrical signal. The conversion component may include a transducer and at least one damping film connected to the transducer.

[0025] Some additional features of the present application may be explained in the following description. Some additional features of the present application will be apparent to those skilled in the art through study of the following description and corresponding drawings or understanding of the production or operation of the embodiments. Features of the present invention may be achieved by practicing or using various aspects of the methods, tools, and combinations described in the detailed examples discussed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present application will be further described by exemplary embodiments. These exemplary embodiments will be described in detail by the accompanying drawings. These embodiments are non-limiting exemplary embodiments, in which the same numbers in each figure represent similar structures, wherein:

[0027] Figure 1 is a block diagram of an exemplary microphone according to some embodiments of the present application;

[0028] Figure 2 is a schematic diagram of an exemplary spring-mass-damper system of a conversion assembly according to some embodiments of the present application;

[0029] Figure 3 is a schematic diagram of an exemplary normalized displacement resonance curve of a spring-mass-damper system according to some embodiments of the present application;

[0030] Figure 4 is a schematic diagram of an exemplary frequency response curve of an original conversion component and an exemplary frequency response curve after the resonance peak of the original conversion component is moved forward according to some embodiments of the present application;

[0031] Figure 5 is a schematic diagram of an exemplary frequency response curve after the resonance peak of the conversion component is shifted forward and an exemplary frequency response curve after damping material is added to the conversion component according to some embodiments of the present application;

[0032] Figure 6 is a schematic diagram of an exemplary equivalent model of a conversion assembly including a transducer and a damping film according to some embodiments of the present application;

[0033] Figure 7is a schematic diagram of an exemplary frequency response curve of an original conversion component according to some embodiments of the present application, an exemplary frequency response curve after the resonance peak of the original conversion component is moved forward, and an exemplary frequency response curve after a damping material is added to the conversion component;

[0034] Figure 8 is a schematic diagram of an exemplary frequency response curve of a transducer, an exemplary frequency response curve of an elastic element, and an exemplary frequency response curve of a conversion assembly including a transducer and an elastic element according to some embodiments of the present application;

[0035] Fig. 9 is a schematic diagram of an exemplary frequency response curve of a transducer according to some embodiments of the present application, an exemplary frequency response curve of a conversion assembly including a transducer and an elastic element, an exemplary frequency response curve of a conversion assembly including a transducer and two elastic elements, and an exemplary frequency response curve of a conversion assembly including a transducer and three elastic elements;

[0036] Fig.10 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0037] Fig.11 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0038] Fig.12 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0039] Fig.13 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0040] Fig.14 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0041] Fig.15 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0042] Fig.16 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0043] Fig.17 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0044] Fig.18 is a schematic diagram of an exemplary frequency response curve of a microphone when a damping membrane is not connected to at least one transducer according to some embodiments of the present application;

[0045] Fig.19 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0046] Fig. 20 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0047] Fig.21 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0048] Fig. 22 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0049] Fig.23 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0050] Fig.24 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0051] Fig.25 is a schematic diagram of an exemplary frequency response curve of a microphone when a damping membrane is connected to at least one transducer according to some embodiments of the present application;

[0052] Fig.26 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0053] Fig. 27 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0054] Fig.28 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0055] Fig.29 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0056] Fig.30 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0057] Fig.31 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0058] Fig.32 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0059] Fig.33 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0060] Fig.34 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0061] Fig.35 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0062] Fig.36 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0063] Fig.37 is a schematic diagram of exemplary frequency response curves of a microphone that does not include a damping membrane and a microphone that includes at least one damping membrane arranged at 90° on the surface of a cantilever transducer according to some embodiments of the present application;

[0064] Fig.38 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0065] Fig.39 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0066] Fig.40 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0067] Fig.41 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0068] Fig.42 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0069] Fig.43 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0070] Fig.44 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0071] Fig.45 is a schematic structural diagram of an exemplary microphone according to some embodiments of the present application;

[0072] Fig.46 is a schematic diagram of exemplary frequency response curves of a microphone including a transducer and a microphone including a transducer and two elastic elements according to some embodiments of the present application;

[0073] Fig.47 is a schematic diagram of exemplary frequency response curves of a microphone including one transducer and a microphone including two transducers (output from one of the transducers) according to some embodiments of the present application. DETAILED DESCRIPTION

[0074] The following description is intended to enable those skilled in the art to make and use the present application, and is provided in conjunction with specific applications and their requirements. It will be apparent to those of ordinary skill in the art that various changes may be made to the disclosed embodiments, and that the general principles defined in the present application may be applied to other embodiments and application scenarios without departing from the principles and scope of the present application. Therefore, the present application is not limited to the embodiments shown, but conforms to the widest scope consistent with the claims.

[0075] The terms used in this application are only for the purpose of describing specific example embodiments and are not restrictive. The singular forms "one", "an" and "the" used in this application may also include plural forms unless the context clearly indicates an exception. It should be further understood that when the terms "comprising" and / or "including" are used in this application to specify the presence of the features, integers, steps, operations, elements and / or components, it does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0076] These and other features, characteristics, and methods of operation and functions of structurally related elements of the present invention, as well as component combinations and manufacturing economies, may become more apparent upon consideration of the following description with reference to the accompanying drawings, all of which form a part of this specification. It is to be expressly understood, however, that the drawings are for illustration and description purposes only and are not intended to limit the scope of the present invention. It is to be understood that the drawings are not drawn to scale.

[0077] The flowchart used in this application shows the operations performed by the system shown in some embodiments of the present application. It should be understood that the operations in the flowchart may not be performed in order. On the contrary, these operations may be performed in reverse order, or simultaneously. At the same time, one or more other operations may also be added to these flowcharts. One or more operations may also be deleted from the flowchart.

[0078] One aspect of the present invention relates to a microphone and an electronic device having the microphone. To this end, the microphone may cover at least a portion of at least one surface of a transducer with a damping material in the form of a film to form a conversion component for converting a vibration signal into an electrical signal. For example, the transducer may be a cantilever beam, and the microphone may include at least one damping film that completely covers at least one surface of the cantilever beam. As another example, at least one damping film may be arranged on at least one surface of the transducer at a predetermined angle. The microphone may also include at least one elastic element. At least one damping film may be connected to the transducer and the at least one elastic element, respectively. In this way, the microphone may have good communication quality performance, such as high sensitivity, a smooth frequency response curve, and a wide frequency band. In addition, the microphone may have high reliability and be easy to implement in manufacturing.

[0079] Figure 1 1 is a block diagram of an exemplary microphone 100 according to some embodiments of the present application. For example, the microphone 100 may be a microphone of an electronic device, such as a phone, an earphone, a headset, a wearable device, a smart mobile device, a virtual reality device, an augmented reality device, a computer, a laptop, etc. The microphone 100 may include a housing 110, a conversion component 120 in the housing 110, and a processing circuit 130.

[0080] In some embodiments, the housing 110 may be configured to receive a vibration signal. In some embodiments, the housing 110 may receive a vibration signal from a vibration source that generates the vibration signal in a contact mode. In some embodiments, the housing 110 may receive a vibration signal from a vibration source in a non-contact mode. For example, the housing 110 may receive a vibration signal through a medium such as air, solid, liquid, etc. In some embodiments, the vibration source may include any device or individual that generates a vibration to be detected. For example, the vibration source may include a human body, a musical instrument, a machine, etc., or any combination thereof. In some embodiments, the vibration signal may include an air vibration signal, a solid vibration signal, a liquid vibration signal, etc., or any combination thereof.

[0081] In some embodiments, the housing 110 may transmit the vibration signal to the conversion assembly 120 in a contact mode or a non-contact mode. For example, the conversion assembly 120 may be located within the housing 110 and contact the housing 110. The conversion assembly 120 may directly receive the vibration signal from the housing 110. As another example, the conversion assembly 120 may not contact the housing 110. The conversion assembly 120 may receive the vibration signal from the housing 110 through a medium, such as air, solid, liquid, etc.

[0082] In some embodiments, the conversion component 120 may be configured to convert a vibration signal into an electrical signal. In some embodiments, the conversion component 120 may receive a vibration signal and generate an electrical signal by deforming the structure of the conversion component 120. In some embodiments, the conversion component 120 may include at least one transducer 122, at least one damping film 124, and at least one elastic element 126. For example, the conversion component 120 may include only one transducer 122. As another example, the conversion component 120 may include one transducer 122 and a damping film 124 connected to the transducer 122. As another example, the conversion component may include one transducer 122, one elastic element 126, and a damping film 124 connected to the transducer 122 and the elastic element 126. As another example, the conversion component 120 may include at least two transducers 122, at least two elastic elements 126, and at least two damping films 124.

[0083] In some embodiments, at least one transducer 122 may be configured to convert a vibration signal into an electrical signal. For example, the vibration signal may be transmitted from the housing 110 and deform the at least one transducer 122 to output an electrical signal. In some embodiments, the signal conversion type of the at least one transducer 122 may include an electromagnetic type (e.g., a moving coil type, a moving iron type, etc.), a piezoelectric type, an inverse piezoelectric type, an electrostatic type, an electret type, a planar magnetic type, a balanced armature type, a thermoacoustic type, etc., or any combination thereof. In some embodiments, the at least one transducer 122 may include a diaphragm, a piezoelectric ceramic plate, a piezoelectric film, an electrostatic film, etc., or any combination thereof. In some embodiments, the shape of the at least one transducer 122 may be variable. For example, the shape of the at least one transducer 122 may include a circle, a rectangle, a square, an ellipse, etc., or any combination thereof. In some embodiments, the structure of the at least one transducer 122 may be variable. For example, the structure of the at least one transducer 122 may include a membrane, a cantilever beam, a plate, etc., or any combination thereof.

[0084] In some embodiments, only one of the at least one transducer 122 can be configured to output an electrical signal, and the remaining portion of the at least one transducer 122 can be configured to deform as an elastic element in response to the vibration signal. Each of the remaining at least one transducer 122 can provide a resonance peak for the frequency response curve of the microphone 100.

[0085] In some embodiments, at least one damping film 124 may be configured to change the composite damping and / or composite weight of the conversion assembly 120 to adjust the frequency response curve of the conversion assembly 120. For example, at least one damping film 124 may adjust the composite damping of the conversion assembly 120 so that the conversion assembly 120 has a predetermined Q value and a flat frequency response curve. As another example, at least one damping film 124 may adjust the composite weight of the conversion assembly 120 and the resonant frequency of the frequency response curve of the conversion assembly 120. It should be noted that at least one damping film 124 is provided for illustrative purposes only and is not intended to limit the scope of the present invention. The damping in the microphone 100 may be any other structure. For example, the structure of the damping in the microphone 100 may include a membrane, a block, a complex structure, etc. or any combination thereof. In some embodiments, at least one damping film 124 may be configured to transfer the vibration of at least one elastic element 126 to at least one transducer 122 to generate a plurality of equivalent resonance peaks.

[0086] In some embodiments, at least one elastic element 126 may be configured to change the vibration performance of the conversion assembly 120. In some embodiments, the material of at least one damping film 124 may include metal, inorganic non-metal, polymer material, composite material, etc. or any combination thereof. In some embodiments, at least one damping film 124 may be connected to at least one transducer 122 and at least one elastic element 126, respectively. For example, at least one damping film 124 may transmit the vibration signal generated by at least one elastic element 126 to at least one transducer 122.

[0087] In some embodiments, processing circuit 130 may be configured to process electrical signals.

[0088] Figure 2 is a schematic diagram of an exemplary spring-mass-damper system of the conversion assembly 120 according to some embodiments of the present application. In a microphone, its conversion assembly can be simplified and equivalent to Figure 2 The spring-mass-damper system shown. When the microphone is operating, the spring-mass-damper system may vibrate due to the excitation force.

[0089] like Figure 2 As shown, the spring-mass-damper system can be moved according to the differential equation (1):

[0090]

[0091] Among them, M represents the mass of the spring-mass-damper system, x represents the displacement of the spring-mass-damper system, R represents the damping of the spring-mass-damper system, K represents the elastic coefficient of the spring-mass-damper system, F represents the amplitude of the driving force, and ω represents the cyclic frequency of the external force.

[0092] The displacement in steady state (2) can be obtained by solving the differential equation (1):

[0093] x=x a cos(ωt-θ) (2),

[0094] Where x represents the deformation of the spring-mass-damper system when the microphone is working, which is equal to the value of the output electrical signal, x a represents the output displacement, Z represents the mechanical impedance, and θ represents the oscillation phase.

[0095] The normalized displacement amplitude ratio A can be described as equation (3):

[0096]

[0097] in, x a0 represents the displacement amplitude in steady state (or the displacement amplitude when ω = 0), It represents the ratio of external force frequency to natural frequency, ω0=K / M represents the circular frequency of vibration, Q m Represents the mechanical quality factor.

[0098] Figure 3 is a schematic diagram of an exemplary normalization of a displacement resonance curve of a spring-mass-damper system according to some embodiments of the present application.

[0099] The microphone 100 generates a voltage signal through the relative displacement between the conversion component 120 and the housing 110. For example, an electret microphone generates a voltage signal according to the change in the distance between the deformed diaphragm transducer and the substrate. For another example, a cantilever bone conduction microphone can generate an electrical signal according to the inverse piezoelectric effect caused by the deformed cantilever transducer. In some embodiments, the greater the displacement of the transducer deformation, the greater the electrical signal output by the microphone. Figure 3 As shown, the smaller the damping (eg, material damping, structural damping, etc.) of the conversion component, the larger the Q value, and the narrower the 3dB bandwidth at the resonance peak of the displacement resonance curve. In some embodiments, the resonance peak of a microphone with excellent performance may not be set within the speech frequency range.

[0100] Figure 4 is a schematic diagram of an exemplary frequency response curve of the original conversion component 120 according to some embodiments of the present application and an exemplary frequency response curve after the resonance peak of the original conversion component 120 is moved forward. In some embodiments, as Figure 4 As shown, in order to improve the overall sensitivity of the microphone, the sensitivity of the microphone can be improved by moving the resonance peak forward to the speech frequency range to increase the sensitivity of the microphone before the resonance peak. The output displacement can be determined according to equation (4):

[0101]

[0102] According to equation (4), if ω<ω0, ωM <Kω -1 If ω0 of the conversion component 120 is reduced by increasing M and / or decreasing K, then |ωM <Kω -1 | is reduced, and the corresponding output shift x a Can be increased. If ω=ω0, then ωM=Kω -1 If ω0 of the conversion component 120 is reduced or increased, the output displacement x a Can be constant. If ω>ω0, then ωM>Kω -1 If ω0 of the conversion component 120 is reduced by increasing M and / or decreasing K, then |ωM <Kω -1 | increases, and the corresponding output shift x a Can be reduced.

[0103] In some embodiments, as the resonance peak moves forward, the resonance peak may appear in the speech frequency range. If multiple signals are picked up near the resonance peak, the communication quality may be poor. In some embodiments, adding damping to the conversion component 120 may increase energy loss during vibration, especially energy loss near the resonance peak. The inverse of the Q value can be described according to equation (5):

[0104]

[0105] Where Q -1 It represents the inverse of the Q value, Δf represents the 3dB bandwidth (the difference between the two frequencies f1 and f2 at half the resonant amplitude, Δf=f1-f2), and f0 represents the resonant frequency.

[0106] As the damping of the conversion assembly 120 increases, the Q value decreases and the corresponding 3dB bandwidth increases. In some embodiments, the damping may not be constant during deformation and may be large at large forces or large amplitudes. The amplitude of the non-resonant region may be small, while the amplitude of the resonant region may be large. Figure 5 1 is a schematic diagram of an exemplary frequency response curve after the resonance peak of the conversion component 120 is moved forward and an exemplary frequency response curve after damping material is added to the conversion component 120 according to some embodiments of the present invention. Figure 5 As shown, by adding appropriate damping in the conversion assembly 120, the sensitivity of the microphone in the non-resonance region may not be reduced, and the Q value in the resonance region may be reduced. The frequency response curve may be smooth.

[0107] In some embodiments, the microphone 100 can be designed according to different application scenarios. For example, if the microphone 100 is applied to an application scenario requiring small size and low sensitivity, the microphone 100 can be designed to include a conversion assembly 120 including a transducer 122 and a damping membrane 124 in a housing 110 .

[0108] Figure 6 1 is a schematic diagram of an exemplary equivalent model of a conversion assembly 120 including a transducer 122 and a damping film 124 according to some embodiments of the present application. Figure 6 As shown, R represents the damping of the transducer 122, K represents the elastic coefficient of the transducer 122, and R1 represents the additional damping of the damping film 124. In some embodiments, the composite damping of the conversion assembly 120 can be increased by adding the damping film 124. The damping of the conversion assembly 120 can be changed.

[0109] Figure 7 1 is a schematic diagram of an exemplary frequency response curve of the original conversion component 120 according to some embodiments of the present application, an exemplary frequency response curve after the resonance peak of the original conversion component 120 is moved forward, and an exemplary frequency response curve after adding damping material to the conversion component 120. Figure 7 As shown, the Q value at the resonance peak may be reduced, while the sensitivity of the frequencies outside the resonance peak may not be reduced or may even increase. In some embodiments, by moving the resonance peak forward to the speech frequency range, the sensitivity of the microphone 100 may be increased and the frequency response curve may be flattened, which improves the performance of the microphone 100.

[0110] In some embodiments, the microphone 100 may be designed to include a conversion assembly 120 including a transducer 122, a damping membrane 124, and an elastic element 126 located in a housing 110. In some embodiments, the elastic element 126 and the transducer 122 may each have a resonance peak. The damping membrane 124 may be connected to the elastic element 126 and the transducer 122, respectively, to transfer the vibration of the elastic element 126 to the transducer 122. In some embodiments, the microphone 100 including the transducer 122, the damping membrane 124, and the elastic element 126 may output a frequency response curve having two resonance peaks.

[0111] Figure 81 is a schematic diagram of an exemplary frequency response curve of the transducer 122, an exemplary frequency response curve of the elastic element 126, and an exemplary frequency response curve of the conversion assembly 120 including the transducer 122 and the elastic element 126 according to some embodiments of the present application. In some embodiments, the elastic element 126 can be designed according to different application scenarios. For example, the elastic element 126 can be designed as a suitable structure. The first-order resonant frequency of the elastic element 126 can be within a predetermined voice frequency range. The elastic element 126 can contribute a resonance peak to the microphone 100 using the first-order resonant frequency of the elastic element 126. In some embodiments, the elastic element 126 with a suitable structure can generate multiple resonance peaks within a predetermined voice frequency range. In some embodiments, as Figure 8 As shown, the damping of the damping membrane 124 may be designed to enable the microphone 100 to have high sensitivity, a large Q value, and two resonance peaks in the frequency response curve of the microphone 100 .

[0112] In some embodiments, the microphone 100 may be designed to include a conversion assembly 120 including a transducer 122, a plurality of damping films 124, and a plurality of elastic elements 126 located in a housing 110. In some embodiments, each damping film 124 may be connected to an elastic element 126 and a transducer 122, respectively, to transfer the vibration of the corresponding elastic element 126 to the transducer 122. In some embodiments, the microphone 100 including the transducer 120, at least two damping films 124, and at least two elastic elements 126 may output a frequency response curve having at least two resonance peaks. In some embodiments, the damping of each of the plurality of damping films 124 may be designed to adjust the Q value of each resonance peak of the frequency response curve.

[0113] Fig. 9 1 is a schematic diagram of an exemplary frequency response curve of a transducer 122 according to some embodiments of the present application, an exemplary frequency response curve of a conversion assembly 120 including one transducer 122 and one elastic element 126, an exemplary frequency response curve of a conversion assembly 120 including one transducer 122 and two elastic elements 126, and an exemplary frequency response curve of a conversion assembly 120 including one transducer 122 and three elastic elements 126. Fig. 9 As shown, the resonance frequencies of each elastic element 126 can be different from each other and are all within the predetermined voice frequency range. The sensitivity within the entire predetermined voice frequency range can be high, and the frequency response curve of the microphone 100 can be flat.

[0114] In some embodiments, the internal structure of the microphone 100 and the layout of each part in the microphone 100 can be designed according to different application scenarios. For example, the microphone 100 can be designed according to the position where the microphone 100 is placed (for example, in front of a person's ear, behind the ear, on the neck, etc.). As another example, the microphone 100 can be designed according to the conduction mode of the microphone 100 (for example, bone conduction mode, air conduction mode, etc.). As another example, the microphone 100 can be designed according to the frequency of different signals (for example, human voice signals, machine sound signals, etc.) acquired by the microphone 100. As another example, the microphone 100 can be designed according to the production process of the microphone 100. In some embodiments, the size, shape, installation position, layout, structure, and number of at least one transducer 122, at least one damping membrane 124, and / or at least one elastic element 126 can be determined according to different application scenarios. For example, the transducer 122 and at least one damping membrane 124 of the microphone 100 can be designed according to the frequency response curve of the microphone 100.

[0115] In some embodiments, at least one damping film 124 may be arranged at any position of at least one transducer 122. For example, at least one damping film 124 may be arranged on an upper surface of at least one transducer 122, a lower surface of at least one transducer 122, a side surface of at least one transducer 122, an interior of at least one transducer 122, or the like, or any combination thereof. In some embodiments, at least one damping film 124 may cover at least a portion of at least one surface of at least one transducer 122. For example, one of the damping films 124 of at least one damping film 124 may cover all surfaces of one of the transducers 122 of at least one transducer 122. As another example, one of the damping films 124 of at least one damping film 124 may cover a portion of one surface of one of the transducers 122 of at least one transducer 122. In some embodiments, at least one surface of the transducer 122 may include an upper surface of the transducer 122, a lower surface of the transducer 122, a side surface of the transducer 122, an interior surface of the transducer 122, or the like, or any combination thereof.

[0116] In some embodiments, at least one damping membrane 124 may be connected to at least one transducer 122 and may not be connected to the housing 110. In some embodiments, the connection between any two components inside the microphone 100 may include bonding, riveting, screwing, integral molding, suction connection, etc., or any combination thereof.

[0117] Fig.10 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.10As shown, the microphone 100 may include a housing 110, a transducer 122 connected to the housing 110, and a damping film 124 connected to the transducer 122 and not connected to the housing 110. The transducer 122 may be fixed to the housing 110 at both ends of the transducer 122. The damping film 124 may cover a portion of the upper surface of the transducer 122.

[0118] Fig.11 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.11 As shown, the microphone 100 may include a housing 110, a transducer 122 connected to the housing 110, and a damping membrane 124 connected to the transducer 122 and partially connected to the housing 110. The transducer 122 may be fixed to the housing 110 at both ends of the transducer 122. The damping membrane 124 may cover a portion of the lower surface of the transducer 122.

[0119] Fig.12 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.12 As shown, the microphone 100 may include a housing 110, two transducers 122 respectively connected to the housing 110, and a damping film 124 connected to the transducers 122 and not connected to the housing 110. Each of the two transducers 122 may be fixed to the housing 110 at both ends of the transducer 122. The damping film 124 may cover a portion of an upper surface of one of the two transducers 122 and a portion of a lower surface of the other of the two transducers 122. Fig.12 As shown, the two transducers 122 and the damping film 124 may form a sandwich structure. The damping film 124 may be sandwiched between the two transducers 122.

[0120] Fig.13 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.13 As shown, the microphone 100 may include a housing 110, a transducer 122 connected to the housing 110, and two damping films 124 respectively connected to the transducer 122 and not connected to the housing 110. The transducer 122 may be fixed to the housing 110 at both ends of the transducer 122. The two damping films 124 may cover a portion of the upper surface of the transducer 122 and a portion of the lower surface of the transducer 122, respectively.

[0121] Fig.14 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.14As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and a damping film 124 connected to the transducer 122 and not connected to the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The damping film 124 may cover a portion of the lower surface of the cantilever transducer 122.

[0122] Fig.15 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.15 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and a damping film 124 connected to the transducer 122 and not connected to the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The damping film 124 may cover a portion of the upper surface of the cantilever transducer 122.

[0123] Fig.16 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.16 As shown, the microphone 100 may include a housing 110, two cantilever transducers 122 respectively connected to the housing 110, and a damping film 124 connected to the cantilever transducers 122 and not connected to the housing 110. Each of the two cantilever transducers 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The damping film 124 may cover a portion of the upper surface of one of the two cantilever transducers 122 and a portion of the lower surface of the other of the two cantilever transducers 122. Fig.16 As shown, the two cantilever transducers 122 and the damping film 124 may form a sandwich structure. The damping film 124 may be sandwiched between the two cantilever transducers 122 .

[0124] Fig.17 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.17 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and two damping films 124 respectively connected to the cantilever transducer 122 and not connected to the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The two damping films 124 may cover a portion of the upper surface and a portion of the lower surface of the cantilever transducer 122, respectively.

[0125] Fig.181 is a diagram of an exemplary frequency response curve of the microphone 100 when the damping membrane 124 is not connected to the at least one transducer 122 according to some embodiments of the present invention. The frequency response curves of the microphone 100 without the damping membrane 124, the microphone 100 including four layers of the damping membrane 124, and the microphone 100 including ten layers of the damping membrane 124 may be different. Fig.18 As shown, as the number of layers of the damping membrane 124 increases, the resonance peak moves forward, the sensitivity before the resonance peak increases, and the Q value at the resonance peak decreases. The more damping membranes 124 there are, the lower the frequency at the resonance peak, the higher the sensitivity before the resonance peak, and the smaller the Q value at the resonance peak. Therefore, in order to achieve the actual requirements of the microphone 100 (for example, sensitivity, Q value at the resonance peak, frequency at the resonance peak, etc.), the microphone 100 can be designed to include one damping membrane 124 or multiple damping membranes 124.

[0126] In some embodiments, at least one damping membrane 124 can be connected to at least one transducer 122 and the housing 110. In some embodiments, the connection between any two components inside the microphone 100 can include bonding, riveting, screwing, integral molding, suction connection, etc., or any combination thereof.

[0127] Fig.19 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.19 As shown, the microphone 100 may include a housing 110, two transducers 122 respectively connected to the housing 110, and a damping membrane 124 connected to the transducers 122 and the housing 110. Each of the two transducers 122 may be fixed to the housing 110 at both ends of the transducer 122. The damping membrane 124 may be connected to the housing 110 at both ends of the damping membrane 124. The damping membrane 124 may completely cover the upper surface of one of the two transducers 122 and the lower surface of the other of the two transducers 122. Fig.19 As shown, the two transducers 122 and the damping film 124 may form a sandwich structure. The damping film 124 may be sandwiched between the two transducers 122.

[0128] Fig. 20 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig. 20 As shown, the microphone 100 may include a housing 110, a transducer 122 connected to the housing 110, and a damping membrane 124 connected to the transducer 122 and the housing 110. The transducer 122 may be fixed to the housing 110 at both ends of the transducer 122. The damping membrane 124 may completely cover the lower surface of the transducer 122. The damping membrane 124 may be connected to the housing 110 at both ends of the damping membrane 124.

[0129] Fig.21is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.21 As shown, the microphone 100 may include a housing 110, a transducer 122 connected to the housing 110, and a damping membrane 124 connected to the transducer 122 and the housing 110. The transducer 122 may be fixed to the housing 110 at both ends of the transducer 122. The damping membrane 124 may completely cover the upper surface of the transducer 122. The damping membrane 124 may be connected to the housing 110 at both ends of the damping membrane 124.

[0130] Fig. 22 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig. 22 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and a damping membrane 124 connected to the transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The damping membrane 124 may completely cover the lower surface of the cantilever transducer 122. The damping membrane 124 may be connected to the housing 110 at one end of the damping membrane 124.

[0131] Fig.23 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.23 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and a damping membrane 124 connected to the transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The damping membrane 124 may completely cover the upper surface of the cantilever transducer 122. The damping membrane 124 may be connected to the housing 110 at one end of the damping membrane 124.

[0132] Fig.24 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.24 As shown, the microphone 100 may include a housing 110, two cantilever transducers 122 respectively connected to the housing 110, and a damping film 124 connected to the cantilever transducers 122 and the housing 110. Each of the two cantilever transducers 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The damping film 124 may completely cover the upper surface of one of the two cantilever transducers 122 and the lower surface of the other of the two cantilever transducers 122. Fig.24 As shown, the two cantilever transducers 122 and the damping film 124 may form a sandwich structure. The damping film 124 may be sandwiched between the two cantilever transducers 122. The damping film 124 may be connected to the housing 110 at one end of the damping film 124.

[0133] Fig.25 1 is a diagram of an exemplary frequency response curve of the microphone 100 when the damping membrane 124 is connected to the at least one transducer 122 according to some embodiments of the present invention. The frequency response curves of the microphone 100 without the damping membrane 124, the microphone 100 including four layers of the damping membrane 124, and the microphone 100 including ten layers of the damping membrane 124 may be different. Fig.25 As shown, as the number of damping films 124 increases, the resonance peak is constant, the sensitivity before the resonance peak increases, and the Q value at the resonance peak decreases. The more damping films 124 there are, the higher the sensitivity before the resonance peak, and the smaller the Q value at the resonance peak.

[0134] In some embodiments, at least one damping film 124 may be connected to at least one transducer 122 and the housing 110. In some embodiments, at least one damping film 124 may be arranged on at least one surface of the transducer at a predetermined angle. For example, the predetermined angle may include 10°, 15°, 30°, 45°, 60°, 70°, 90°, etc. In some embodiments, at least one damping film 124 may include at least two damping films 124. In some embodiments, at least two damping films 124 may be arranged symmetrically with respect to the center line of the transducer 122. In some embodiments, at least two damping films 124 may be arranged asymmetrically with respect to the center line of the transducer 122. In some embodiments, the width of each of the at least one damping film 124 may be the same or different. For example, the width of each of the at least one damping film 124 may vary. In some embodiments, the thickness of each of the at least one damping film 124 may be the same or different. For example, the thickness of each of the at least one damping film 124 may vary. In some embodiments, each of the at least one damping film 124 may overlap a portion of each of the at least one transducer 122.

[0135] Fig.26 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.26 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and a damping film 124 connected to the cantilever transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The damping film 124 may completely cover the upper surface of the cantilever transducer 122. The damping film 124 may be connected to the housing 110 at both ends of the damping film 124.

[0136] Fig. 27 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig. 27As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and a damping film 124 connected to the cantilever transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. The damping film 124 may completely cover the lower surface of the cantilever transducer 122. The damping film 124 may be connected to the housing 110 at both ends of the damping film 124.

[0137] Fig.28 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.28 As shown, the microphone 100 may include a housing 110, two cantilever transducers 122 respectively connected to the housing 110, and a damping film 124 connected to the cantilever transducers 122 and the housing 110. Each of the two cantilever transducers 122 may be fixed to the housing 110 at both ends of the cantilever transducer 122. The damping film 124 may be connected to the housing 110 at both ends of the damping film 124. The damping film 124 may completely cover the upper surface of one of the two cantilever transducers 122 and the lower surface of the other of the two cantilever transducers 122. Fig.28 As shown, the two cantilever transducers 122 and the damping film 124 may form a sandwich structure. The damping film 124 may be sandwiched between the two cantilever transducers 122 .

[0138] Fig.29 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.29 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and two damping films 124 respectively connected to the cantilever transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. Each of the two damping films 124 may be connected to the housing 110 at both ends of each damping film 124. The two damping films 124 may respectively completely cover the upper surface and the lower surface of the cantilever transducer 122. Fig.29 As shown, the two damping films 124 and the cantilever transducer 122 may form a sandwich structure. The cantilever transducer 122 may be sandwiched between the two damping films 124.

[0139] Fig.30 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.30As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and two damping films 124 respectively connected to the cantilever transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. Each of the two damping films 124 may be connected to the housing 110 at one end of each damping film 124, and connected to the cantilever transducer 122 at the other end of each damping film. The two damping films 124 may cover a portion of the upper surface and a portion of the lower surface of the cantilever transducer 122, respectively. Fig.30 As shown, the two damping films 124 may be arranged at 90° on the upper and lower surfaces of the cantilever transducer 122. The overlapping portion of the two damping films 124 and the cantilever transducer 122 may be close to one end other than the fixed end of the cantilever transducer 122. The thickness of each of the two damping films 124 may be constant and the same as each other.

[0140] Fig.31 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.31 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and two damping films 124 respectively connected to the cantilever transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. Each of the two damping films 124 may be connected to the housing 110 at one end of each damping film 124, and connected to the cantilever transducer 122 at the other end of each damping film. The two damping films 124 may cover a portion of the upper surface and a portion of the lower surface of the cantilever transducer 122, respectively. Fig.31 As shown, the two damping films 124 may be arranged at 90° on the upper and lower surfaces of the cantilever transducer 122. The overlapping portions of the two damping films 124 and the cantilever transducer 122 may be close to the center line of the cantilever transducer 122. The thickness of each of the two damping films 124 may be constant and identical to each other.

[0141] Fig.32 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.32As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and two damping films 124 respectively connected to the cantilever transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. Each of the two damping films 124 may be connected to the housing 110 at one end of each damping film 124, and connected to the cantilever transducer 122 at the other end of each damping film. The two damping films 124 may cover a portion of the upper surface and a portion of the lower surface of the cantilever transducer 122, respectively. Fig.32 As shown, the two damping films 124 can be arranged at 90 degrees on the upper surface and the lower surface of the cantilever transducer 122. The overlapping portion of the two damping films 124 and the cantilever transducer 122 can be close to one end other than the fixed end of the cantilever transducer 122. The thickness of each of the two damping films 124 can be varied. The thickness at the position connected to the cantilever transducer 122 can be less than the thickness at the position connected to the housing 110.

[0142] Fig.33 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.33 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and two damping films 124 respectively connected to the cantilever transducer 122 and the housing 110. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. Each of the two damping films 124 may be connected to the housing 110 at one end of each damping film 124, and connected to the cantilever transducer 122 at the other end of each damping film. The two damping films 124 may cover a portion of the upper surface and a portion of the lower surface of the cantilever transducer 122, respectively. Fig.33 As shown, the two damping films 124 can be arranged at 90 degrees on the upper surface and the lower surface of the cantilever transducer 122. The overlapping portion of the two damping films 124 and the cantilever transducer 122 can be close to one end other than the fixed end of the cantilever transducer 122. The thickness of each of the two damping films 124 can be variable. The thickness at the position connected to the cantilever transducer 122 can be greater than the thickness at the position connected to the housing 110.

[0143] Fig.34 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.34As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and two damping films 124 connected to the cantilever transducer 122 and the housing 110, respectively. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. Each of the two damping films 124 may be connected to the housing 110 at one end of each damping film 124, and connected to the cantilever transducer 122 at the other end of each damping film. The two damping films 124 may cover a portion of the upper surface and a portion of the lower surface of the cantilever transducer 122, respectively. Fig.34 As shown, the two damping films 124 may be arranged at an angle between 60° and 90° on the upper and lower surfaces of the cantilever transducer 122. The overlapping portion of the two damping films 124 and the cantilever transducer 122 may be close to one end other than the fixed end of the cantilever transducer 122. The thickness of each of the two damping films 124 may be constant and the same as each other.

[0144] Fig.35 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.35 As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and two damping films 124 of the housing 110 respectively connected to the cantilever transducer 122. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. Each of the two damping films 124 may be connected to the housing 110 at one end of each damping film 124, and connected to the cantilever transducer 122 at the other end of each damping film. The two damping films 124 may cover a portion of the upper surface and a portion of the lower surface of the cantilever transducer 122, respectively. Fig.35 As shown, the two damping films 124 may be arranged at 90° on the upper and lower surfaces of the cantilever transducer 122. The overlapping portion of one of the two damping films 124 and the cantilever transducer 122 may be close to one end other than the fixed end of the cantilever transducer 122, and the overlapping portion of the other of the two damping films 124 and the cantilever transducer 122 may be close to the center line of the cantilever transducer 122. The thickness of each of the two damping films 124 may be constant and the same as each other.

[0145] Fig.36 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.36As shown, the microphone 100 may include a housing 110, a cantilever transducer 122 connected to the housing 110, and six damping films 124 connected to the cantilever transducer 122 and the housing 110, respectively. The cantilever transducer 122 may be fixed to the housing 110 at one end of the cantilever transducer 122. Each of the six damping films 124 may be connected to the housing 110 at one end of each damping film 124, and connected to the cantilever transducer 122 at the other end of each damping film. Each of the six damping films 124 may cover a portion of the upper surface or a portion of the lower surface of the cantilever transducer 122. Fig.36 As shown, each of the six damping films 124 may be arranged at 90° on the upper surface or the lower surface of the cantilever transducer 122. The overlapping portion of each of the six damping films 124 and the cantilever transducer 122 may be distributed from the fixed end to the other end of the cantilever transducer 122. The thickness of each of the six damping films 124 may be constant and the same as each other.

[0146] Fig.37 1 is a diagram of exemplary frequency response curves of a microphone 100 without a damping membrane 124 and a microphone 100 including at least one damping membrane 124 arranged at 90° on the surface of a cantilever transducer 122 according to some embodiments of the present invention. Fig.37 As shown, after adding at least one damping film 124, the resonant frequency increases and the Q value at the resonant peak decreases. Regardless of whether at least one damping film 124 is added, the sensitivity of frequencies other than the resonant peak may generally be constant.

[0147] In some embodiments, the microphone 100 may include one transducer 122, at least one damping membrane 124, and at least one elastic element 126. The at least one damping membrane may be connected to the transducer 122 and the at least one elastic element 126, respectively. In some embodiments, the microphone 100 may include at least two transducers 122 and at least one damping membrane 124. In some embodiments, the microphone 100 may include multiple transducers 122, at least one damping membrane 124, and at least one elastic element 126. The at least one damping membrane may be connected to the transducer 122 and the at least one elastic element 126, respectively. In some embodiments, at least one elastic element 126 and one transducer 122 (or multiple transducers 122) may be arranged in a predetermined distribution pattern. In some embodiments, the predetermined distribution pattern may include a horizontal distribution pattern, a vertical distribution pattern, an array distribution pattern, a random distribution pattern, etc., or any combination thereof. In some embodiments, at least one damping membrane 124 may cover at least a portion of at least one surface of at least one elastic element 126.

[0148] Fig.38 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.38 As shown, the microphone 100 may include a housing 110, a transducer 122, a damping membrane 124, and two elastic elements 126 (or two transducers 122, or one elastic element 126 and one transducer 122). The damping membrane 124 may completely cover the lower surface of each transducer 122 and / or the elastic element 126. The damping membrane 124 may not be connected to the housing 110.

[0149] Fig.39 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.39 As shown, the microphone 100 may include a housing 110, a transducer 122, a damping membrane 124, and two elastic elements 126 (or two transducers 122, or one elastic element 126 and one transducer 122). The damping membrane 124 may completely cover the lower surface of each transducer 122 and / or the elastic element 126. The damping membrane 124 may be connected to the housing 110 at both ends of the damping membrane 124.

[0150] Fig.40 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.40 As shown, the microphone 100 may include a housing 110, two transducers 122, a damping membrane 124, and two elastic elements 126 (or two transducers 122, or one elastic element 126 and one transducer 122). Each of the two damping membranes 124 may be sandwiched between the two transducers 122 and / or the elastic element 126. The damping membrane 124 may not be connected to the housing 110.

[0151] Fig.41 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.41 As shown, the microphone 100 may include a housing 110, two transducers 122, a damping membrane 124, and two elastic elements 126 (or two transducers 122, or one elastic element 126 and one transducer 122). Each of the two damping membranes 124 may be sandwiched between the two transducers 122 and / or the elastic element 126. Each of the two damping membranes 124 may be connected to the housing 110 at both ends of each damping membrane 124.

[0152] Fig.42 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.42As shown, the microphone 100 may include a housing 110, a transducer 122, two damping membranes 124, and two elastic elements 126 (or two transducers 122, or one elastic element 126 and one transducer 122). Each of the two damping membranes 124 may be connected to one end of the transducer 122 and / or the elastic element 126. For example, the microphone 100 may include the elastic element 126 (or transducer 122), the damping membrane 124, the transducer 122, the damping membrane 124, and the elastic element 126 (or transducer 122) connected in sequence. The transducer 122, the two damping membranes 124, and the two elastic elements 126 (or two transducers 122, or one elastic element 126 and one transducer 122) may form a "V"-like shape in the housing 110. The two damping films 124 or the two elastic elements 126 (or the two transducers 122, or one elastic element 126 and one transducer 122) may be symmetrical with respect to the center line of the transducer 122. The two damping films 124 may not be connected to the housing 110.

[0153] Fig.43 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.43 As shown, the microphone 100 may include a housing 110, a transducer 122, four damping membranes 124, and two elastic elements 126 (or two transducers 122, or one elastic element 126 and one transducer 122). Each of the two damping membranes 124 may be connected to one end of the transducer 122 and / or the elastic element 126. For example, the microphone 100 may include a damping membrane 124, an elastic element 126 (or a transducer 122), a damping membrane 124, a transducer 122, a damping membrane 124, and an elastic element 126 (or a transducer 122) connected in sequence. The transducer 122, the four damping membranes 124, and the two elastic elements 126 (or two transducers 122, or one elastic element 126 and one transducer 122) may form a "V"-like shape in the housing 110. Two of the four damping films 124 or the two elastic elements 126 (or the two transducers 122, or one elastic element 126 and one transducer 122) may be symmetrical with respect to the center line of the transducer 122. Two of the four damping films 124 may be connected to the housing 110, respectively.

[0154] Fig.44 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.44As shown, the microphone 100 may include a housing 110, a transducer 122, four damping membranes 124, and four elastic elements 126 (or four transducers 122, or one elastic element 126 and three transducers 122, or two elastic elements 126 and two transducers 122, or three elastic elements 126 and one transducer 122). Each of the four damping membranes 124 may be connected to one end of the transducer 122 and / or the elastic element 126. The transducer 122, the four damping membranes 124, and the four elastic elements 126 (or four transducers 122, or one elastic element 126 and three transducers 122, or two elastic elements 126 and two transducers 122, or three elastic elements 126 and one transducer 122) may form an "x"-like shape in the housing 110. Two of the four damping films 124 or two of the four transducers 126 (or four transducers 122, or one elastic element 126 and three transducers 122, or two elastic elements 126 and two transducers 122, or three elastic elements 126 and one transducer 122) may be symmetrical about the center line of the transducer 122. The four damping films 124 may not be connected to the housing 110.

[0155] Fig.45 is a schematic diagram of the structure of an exemplary microphone 100 according to some embodiments of the present application. Fig.45 As shown, the microphone 100 may include a housing 110, a transducer 122, six damping membranes 124, and four elastic elements 126 (or four transducers 122, or one elastic element 126 and three transducers 122, or two elastic elements 126 and two transducers 122, or three elastic elements 126 and one transducer 122). Each of the four damping membranes 124 may be connected to one end of the transducer 122 and / or the elastic element 126. The transducer 122, the six damping membranes 124, and the four elastic elements 126 (or four transducers 122, or one elastic element 126 and three transducers 122, or two elastic elements 126 and two transducers 122, or three elastic elements 126 and one transducer 122) may form an "x"-like shape in the housing 110. Two of the six damping films 124 or two of the four elastic elements 126 (or four transducers 122, or one elastic element 126 and three transducers 122, or two elastic elements 126 and two transducers 122, or three elastic elements 126 and one transducer 122) may be symmetrical with respect to the center line of the transducer 122. Four of the six damping films 124 may be connected to the housing 110.

[0156] Fig.461 is a schematic diagram of exemplary frequency response curves of a microphone 100 including one transducer 122 and a microphone 100 including one transducer 122 and two elastic elements 126 according to some embodiments of the present application. Fig.46 As shown, the frequency response curve of the microphone 100 including one transducer 122 and two elastic elements 126 may include three resonance peaks. The frequency response curve of the microphone 100 including only one transducer 122 may include only one resonance peak. The sensitivity of the microphone 100 including two elastic elements 126 before the resonance peak may be greater than the sensitivity of the microphone 100 including only one transducer 122 before the resonance peak. The Q value before the resonance peak of the microphone 100 including two elastic elements 126 may be less than the Q value before the resonance peak of the microphone 100 including only one transducer 122.

[0157] Fig.47 1 is a schematic diagram of exemplary frequency response curves of a microphone 100 including one transducer 122 and a microphone 100 including two transducers 122 (output from one of the transducers 122) according to some embodiments of the present application. Fig.47 As shown, the frequency response curve of the microphone 100 including two transducers 122 may include two resonance peaks. The frequency response curve of the microphone 100 including one transducer resonance may include only one resonance peak. The sensitivity of the microphone 100 including two transducers 122 before the resonance peak may be greater than the sensitivity of the microphone 100 including only one transducer 122 before the resonance peak. The Q value before the resonance peak of the microphone 100 including two transducers 122 may be less than the Q value before the resonance peak of the microphone 100 including only one transducer 122.

[0158] It should be noted that the exemplary microphones described in the present invention are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that various changes may be made to the disclosed embodiments, and that the general principles defined in the present application may be applied to other embodiments and application scenarios without departing from the principles and scope of the present application.

[0159] The basic concepts have been described above. Obviously, for those of ordinary skill in the art who have read this application, the above invention disclosure is only for example and does not constitute a limitation of this application. Although not explicitly stated here, those of ordinary skill in the art may make various modifications, improvements and amendments to this application. Such modifications, improvements and amendments are suggested in this application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of this application.

[0160] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and understood that in various parts of this specification, two or more references to "embodiment", "one embodiment" or "alternative embodiment" do not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0161] In addition, it will be understood by those skilled in the art that various aspects of the present application may be illustrated and described by a number of patentable categories or situations, including any new and useful process, machine, product, or combination of substances, or any new and useful improvement thereof. Therefore, various aspects of the present invention may be implemented entirely by hardware, software (including firmware, resident software, microcode, etc.), or a combination of software and hardware, which are generally referred to herein as "blocks", "modules", "engines", "units", "components" or "systems". In addition, various aspects of the present invention may take the form of a computer program product containing computer-readable program code in one or more computer-readable media.

[0162] A computer readable signal medium may include a propagated data signal containing computer program code, for example, in baseband or as part of a carrier wave. Such propagated signals may be in a variety of forms, including electromagnetic, optical, etc., or any suitable combination. A computer readable signal medium may be any computer readable medium other than a computer readable storage medium, which may be connected to an instruction execution system, device or apparatus to communicate, propagate or transmit a program for use. The program code on a computer readable signal medium may be propagated via any suitable medium, including radio, cable, fiber optic cable, RF, etc., or any combination of the above.

[0163] The computer program code for performing the operation of aspects of the application can be written in any combination of one or more programming languages, including object-oriented programming languages, such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python and other traditional program programming languages, such as "C" programming language, VisualBasic, Fortran1703, Perl, COBOL1702, PHP, ABAP, dynamic programming languages, such as Python, Ruby and Groovy, or other programming languages. The program code can be run completely on the user's computer, or run on the user's computer as an independent software package, or partly run on the user's computer and partly run on the remote computer, or run completely on the remote computer or server. In the latter case, the remote computer can be connected to the user's computer by any type of network (including local area network (LAN) or wide area network (WAN)), or can be connected to an external computer (for example, by using the network of a network service provider) or in a cloud computing environment or as a service, for example, software as a service (SaaS).

[0164] In addition, unless explicitly stated in the claims, the order of the processing elements and sequences described in this application, the use of alphanumeric characters, or the use of other names are not intended to limit the order of the processes and methods of this application. Although the above disclosure discusses some invention embodiments that are currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this application. For example, although the implementation of the various components described above can be embodied in a hardware device, it can also be implemented as a software-only solution, for example, installation on an existing server or mobile device.

[0165] Similarly, it should be noted that in order to simplify the description disclosed in this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of the present application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this method of the present application should not be interpreted as reflecting the intention that the claimed object material to be scanned requires more features than those explicitly stated in each claim. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.

[0166] In some embodiments, numbers representing quantities or characteristics used to describe and claim certain embodiments of the present application should be understood to be modified by the terms "approximately", "approximately" or "substantially" in some cases. For example, "approximately", "approximately" or "substantially" may represent a ±20% change in the value described, unless otherwise specified. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the desired characteristics of individual embodiments. In some embodiments, numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, such numerical values ​​are set as accurately as possible within the feasible range.

[0167] All patents, patent applications, patent application publications, and other materials (such as papers, books, specifications, publications, records, things, and / or the like) referred to herein are hereby incorporated by reference in their entirety for all purposes, except any prosecution record related to such documents, any such documents that are inconsistent or conflicting with this document, or any such documents that have the effect of limiting the broad scope of the claims that may or may not be related to this document. For example, if there is any inconsistency or conflict between the description, definition, and / or use of a term related to any incorporated material and a term related to this document, the description, definition, and / or use in this document shall control.

[0168] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, as an example and not a limitation, the alternative configurations of the embodiments of the present application may be considered to be consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

1. A microphone, characterized in that: include: A housing for receiving a vibration signal; A conversion component located in the housing and used to convert the vibration signal into an electrical signal, wherein the conversion component comprises: transducer; and at least one damping membrane connected to the transducer, the damping membrane being used to adjust the frequency response curve of the conversion assembly; and A processing circuit is used to process the electrical signal.

2. The microphone according to claim 1, characterized in that The at least one damping film covers at least a portion of at least one surface of the transducer.

3. The microphone according to claim 2, characterized in that The at least one surface of the transducer includes at least one of an upper surface, a lower surface, a side surface or an inner surface of the transducer.

4. The microphone according to any one of claims 1 to 3, characterized in that: The at least one damping film is disposed at at least one position including an upper surface of the transducer, a lower surface of the transducer, a side surface of the transducer, or an inner surface of the transducer.

5. The microphone according to any one of claims 1 to 3, characterized in that: The at least one damping film is disposed on at least one surface of the transducer at a predetermined angle.

6. The microphone according to claim 5, characterized in that The predetermined angle is 30°, 45°, 60° or 90°.

7. The microphone according to any one of claims 1 to 3, characterized in that: The at least one damping membrane is connected to the housing.

8. The microphone according to any one of claims 1 to 3, characterized in that: The at least one damping film includes at least two damping films, and the at least two damping films are arranged symmetrically with respect to a center line of the transducer.

9. The microphone according to any one of claims 1 to 3, characterized in that: The conversion assembly further comprises: at least one elastic element, wherein the at least one damping film is connected to the transducer and the at least one elastic element, respectively.

10. The microphone according to claim 9, characterized in that The at least one elastic element and the transducer are arranged in a predetermined distribution pattern.

11. The microphone according to claim 10, characterized in that The predetermined distribution pattern includes at least one of a horizontal distribution pattern, a vertical distribution pattern, an array distribution pattern or a random distribution pattern.

12. The microphone according to claim 9, characterized in that The at least one damping film covers at least a portion of at least one surface of the at least one elastic element.

13. The microphone according to any one of claims 1-3, 10-12, characterized in that: The width of the at least one damping membrane varies.

14. The microphone according to any one of claims 1-3, 10-12, characterized in that: The thickness of the at least one damping film varies.

15. The microphone according to claim 1, characterized in that The transducer includes at least one of a diaphragm, a piezoelectric ceramic plate, a piezoelectric film, or an electrostatic film.

16. The microphone according to any one of claims 1-3, 10-12, and 15, characterized in that: The structure of the transducer includes at least one of a membrane, a cantilever beam, or a plate.

17. The microphone according to any one of claims 1-3, 10-12, and 15, characterized in that: The vibration signal is caused by at least one of a gas, a liquid or a solid.

18. The microphone according to any one of claims 1-3, 10-12, and 15, characterized in that: The vibration signal is transmitted from the housing to the conversion assembly according to a non-contact mode or a contact mode.

19. The microphone according to any one of claims 1-3, 10-12, and 15, characterized in that: The transducer and the at least one damping membrane are designed according to a frequency response curve of the microphone.

20. An electronic device comprising a microphone, characterized in that: The microphone comprises: A housing for receiving a vibration signal; A conversion component located in the housing and used to convert the vibration signal into an electrical signal, wherein the conversion component comprises: transducer; and at least one damping membrane connected to the transducer, the damping membrane being used to adjust the frequency response curve of the conversion assembly; and A processing circuit is used to process the electrical signal.

Images