A multi-wire cutting device for quartz wafer production

Abstract

The present application provides a multi-wire cutting device for quartz wafer production, comprising: a machine body arranged on a table, a placement seat located below the machine body, and a cover frame assembly sleeved on the placement seat; the cover frame assembly comprises: a cover frame body, a connecting plate is arranged on the side wall of the cover frame body, a sliding groove and a clamping hole are opened on the side wall of the connecting plate, and the clamping hole is connected to the sliding groove; a second cover frame, a third locking bolt is arranged on the side wall of the second cover frame, an end of the third locking bolt away from the second cover frame passes through the sliding groove and abuts against the outer wall of the connecting plate, and the third locking bolt is clamped to the clamping holes at different positions on the connecting plate, so that the second cover frame is arranged at different positions on the connecting plate; a first cover frame is arranged on the upper part of the second cover frame, and the first cover frame is movably plugged with the second cover frame. The problem of quartz wafer movement caused by vibration during cutting is solved, thereby effectively improving the processing accuracy of quartz wafers.

Description

Technical Field

[0001] The invention relates to the field of cutting technology, in particular to a multi-wire cutting device for producing quartz wafers. Background Art

[0002] In the processing of SC-cut quartz wafers, a multi-wire saw is often required to cut the quartz wafers. However, in the use of the existing multi-wire saw, after placing the quartz wafer in the processing frame, the staff needs to wait for the multi-wire saw to complete cutting the wafer before they can take out and replace the cut wafer and process it again. This process takes a long time, affecting the processing efficiency of the quartz wafer. In addition, during the cutting process, the vibration will cause the quartz wafer to move, thereby affecting the processing accuracy of the quartz wafer. Summary of the invention

[0003] In view of this, the main purpose of the present invention is to solve the technical problems of low processing efficiency and processing precision of quartz wafers.

[0004] The invention provides a multi-wire cutting device for quartz wafer production, comprising: a machine body arranged on a table, a placement seat located below the machine body, and a cover frame assembly sleeved on the placement seat; the cover frame assembly comprises: a cover frame body, a connecting plate is arranged on the side wall of the cover frame body, a sliding groove and a clamping hole are opened on the side wall of the connecting plate, and the clamping hole is communicated with the sliding groove; a second cover frame, a third locking bolt is arranged on the side wall of the second cover frame, an end of the third locking bolt away from the second cover frame passes through the sliding groove and abuts against the outer wall of the connecting plate, and the second cover frame is arranged at different positions of the connecting plate by clamping the third locking bolt; a first cover frame arranged on the upper part of the second cover frame, the first cover frame is movably plugged with the second cover frame, and a moving groove is opened inside the first cover frame, a moving block is movably arranged inside the moving groove, a part of the moving block extending into the moving groove abuts against the inner wall of the first cover frame, and a part of the moving block extending out of the moving groove contacts the quartz wafer arranged in the middle of the second cover frame.

[0005] Furthermore, a positioning block is provided on the upper end surface of the placement seat, and when the cover frame assembly is sleeved on the placement seat, the positioning block extends into the positioning groove of the cover frame assembly and contacts the inner wall of the cover frame assembly.

[0006] Furthermore, a plurality of locking holes are formed at one end of the second cover frame extending into the first cover frame, and a second locking bolt arranged on the first cover frame passes through the locking holes at different positions to adjust the distance between the first cover frame and the second cover frame.

[0007] Furthermore, a buffer layer is disposed on the side walls of the second cover frame and the first cover frame that are in contact with the quartz wafer.

[0008] Furthermore, an electric push rod is fixedly installed on the outer side of the platform body, a bracket is fixedly installed on the top end of the electric push rod, and a support plate is connected to the inner side of the bracket; wherein the placement seat is fixedly arranged on the support plate.

[0009] Furthermore, the support plate is slidably connected to the inner side of the bracket, and a placement seat is symmetrically fixedly installed on the surface of the support plate.

[0010] Furthermore, a sliding assembly is also arranged on the outer side of the platform body, and the sliding assembly includes a sliding rod fixed on the bracket and a sliding block sleeved on the sliding rod, and the sliding block is fixed on the platform body.

[0011] Furthermore, a support assembly is provided at the bottom of the platform, and the support assembly is used to support the platform.

[0012] Furthermore, the support assembly includes: a connecting frame fixed to the side of the platform body; an adjusting bolt threadedly connected to the connecting frame; and an abutment seat movably connected to the connecting frame, the part of the abutment seat extending into the connecting frame contacts with the bottom of the adjusting bolt; wherein, by rotating the adjusting bolt, the length of the abutment seat extending out of the connecting frame can be adjusted.

[0013] The multi-wire cutting device for quartz wafer production provided by the present invention has the following beneficial effects:

[0014] 1. The second locking bolt arranged on the first cover frame passes through the locking holes at different positions, so that the distance between the first cover frame and the second cover frame can be adjusted, so as to adapt to the height of the quartz wafer placed on the placement seat, and the top of the quartz wafer is abutted, and the part of the moving block extending out of the moving groove contacts the quartz wafer arranged in the middle of the second cover frame, so as to abut the side of the quartz wafer, thereby solving the problem of the quartz wafer moving due to vibration during the cutting process, thereby effectively improving the processing accuracy of the quartz wafer.

[0015] 2. The second cover frame is arranged at different positions of the connecting plate by clamping the third locking bolt to the clamping holes at different positions of the connecting plate, thereby achieving the purpose of adjusting the distance between adjacent second cover frames, which is convenient for subsequent staff to cut quartz wafers of different thicknesses.

[0016] 3. By setting up the pallet, the staff can move the pallet to move one of the cover frame assemblies to the bottom of the machine body for processing, and move the other cover frame assembly out from under the pallet, so that the staff can replace the quartz wafer during the machine body processing, saving the time required for replacement, so as to improve the processing efficiency of the quartz wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the assembly of a multi-wire sawing device for quartz wafer production according to one embodiment of the present invention;

[0018] Figure 2 It is a structural schematic diagram of a cover frame assembly of a multi-wire sawing device for quartz wafer production according to one embodiment of the present invention;

[0019] Figure 3 for Figure 2 A magnified view of point A;

[0020] Figure 4 The present invention is a cross-sectional schematic diagram of a cover frame assembly of a multi-wire sawing device for producing quartz wafers according to an embodiment of the present invention.

[0021] The above drawings include the following reference numerals:

[0022] 10. Platform; 1101. Adjusting bolt; 1102. Connecting frame; 1103. Abutting seat; 12. Bracket; 13. Sliding assembly; 14. Electric push rod; 15. Support plate; 16. First locking bolt; 20. Machine body; 31. Placement seat; 3101. Positioning block; 3102. Positioning hole; 32. Cover frame assembly; 3201. First cover frame; 3202. Second cover frame; 3203. Second locking bolt; 3204. Moving groove; 3205. Moving block; 3206. Locking hole; 3207. Cover frame body; 33. Connecting plate; 3301. Snap-in hole; 3302. Third locking bolt; 3303. Sliding groove; 40. Quartz wafer. DETAILED DESCRIPTION

[0023] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It will be appreciated that the specific embodiments described herein are only used to explain the relevant inventions, rather than to limit the inventions. It should also be noted that, for ease of description, only portions related to the relevant inventions are shown in the accompanying drawings. It should be noted that, in the absence of conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0024] See also Figure 1-Figure 4, which shows a multi-wire cutting device for quartz wafer production of the present application, comprising: a body 20 arranged on a table 10, a placement seat 31 located below the body 20, and a cover frame assembly 32 sleeved on the placement seat 31; the cover frame assembly 32 comprises: a cover frame body 3207, a connecting plate 33 is arranged on the side wall of the cover frame body 3207, a sliding groove 3303 and a clamping hole 3301 are opened on the side wall of the connecting plate 33, and the clamping hole 3301 is communicated with the sliding groove 3303; a second cover frame 3202, a third locking bolt 3302 is arranged on the side wall of the second cover frame 3202, and the end of the third locking bolt 3302 away from the second cover frame 3202 passes through the sliding groove 3303 and the connecting plate 33 The outer wall of the connecting plate 33 is abutted, and the third locking bolt 3302 is clamped to the clamping holes 3301 at different positions on the connecting plate 33, so that the second cover frame 3202 is set at different positions of the connecting plate 33; the first cover frame 3201 is set on the upper part of the second cover frame 3202, the first cover frame 3201 is movably plugged with the second cover frame 3202, and a movable groove 3204 is opened inside the first cover frame 3201, and a movable block 3205 is movably arranged inside the movable groove 3204, the part of the movable block 3205 extending into the movable groove 3204 abuts against the inner wall of the first cover frame 3201, and the part of the movable block 3205 extending out of the movable groove 3204 contacts the quartz wafer 40 arranged in the middle of the second cover frame 3202.

[0025] By applying the technical solution of this embodiment, the second cover frame 3202 is arranged at different positions of the connecting plate 33 by clamping the third locking bolt 3302 with the clamping holes 3301 at different positions on the connecting plate 33, thereby achieving the purpose of adjusting the distance between adjacent second cover frames 3202, and facilitating subsequent workers to cut quartz wafers 40 of different thicknesses. Moreover, the part of the moving block 3205 extending out of the moving groove 3204 contacts the quartz wafer 40 arranged in the middle of the second cover frame 3202, thereby achieving abutment against the side of the quartz wafer 40, thereby solving the problem of the quartz wafer 40 moving due to vibration during the cutting process, thereby effectively improving the processing accuracy of the quartz wafer 40.

[0026] In some optional embodiments, a positioning block 3101 is disposed on the upper end surface of the placement seat 31, and when the cover frame assembly 32 is sleeved on the placement seat 31, the positioning block 3101 extends into the positioning groove of the cover frame assembly 32 and contacts the inner wall of the cover frame assembly 32. In this way, the stability of the connection between the cover frame assembly 32 and the placement seat 31 can be improved.

[0027] In some optional embodiments, a plurality of locking holes 3206 are formed at one end of the second cover frame 3202 extending into the first cover frame 3201, and a second locking bolt 3203 provided on the first cover frame 3201 passes through the locking holes 3206 at different positions, so as to adjust the distance between the first cover frame 3201 and the second cover frame 3202.

[0028] In this embodiment, the second locking bolt 3203 provided on the first cover frame 3201 passes through the locking holes 2306 at different positions, so that the distance between the first cover frame 3201 and the second cover frame 3202 can be adjusted to adapt to the height of the quartz wafer placed on the placement seat 31, thereby achieving abutment against the top of the quartz wafer.

[0029] In some optional embodiments, a buffer layer is provided on the side walls of the second cover frame 3202 and the first cover frame 3201 that are in contact with the quartz wafer 40. In this way, the second cover frame 3202 and the first cover frame 3201 can reduce the occurrence of scratches on the quartz wafer 40.

[0030] In some optional embodiments, an electric push rod 14 is fixedly installed on the outer side of the platform 10, a bracket 12 is fixedly installed on the top of the electric push rod 14, and a support plate 15 is connected to the inner side of the bracket 12; wherein the placement seat 31 is fixedly set on the support plate 15.

[0031] Specifically, the support plate 15 is slidably connected to the inner side of the bracket 12 , and a placement seat 31 is symmetrically fixedly installed on the surface of the support plate 15 .

[0032] In this technical solution, when the quartz wafer 40 needs to be processed, the electric push rod 14 can be controlled to retract, thereby driving the bracket 12 to move downward, and then the quartz wafer 40 to be processed can be placed on the placement seat 31, and then the handle can be used to move the support plate 15 to move the quartz wafer 40 to be processed to the bottom of the machine body 20. During the movement of the support plate 15, the first locking bolt 16 will slide along the slide groove on the bracket 12, so that the support plate 15 slides stably and the maximum movement range of the support plate 15 is limited, so that the staff can put the quartz wafer 40 into the machine body 20. 0 is moved to the bottom of the machine body 20, and then the first locking bolt 16 can be screwed to make the first locking bolt 16 abut against the side wall of the bracket 14 to fix the position of the support plate 15, and then the machine body 20 can be controlled to start, and the electric push rod 14 can be controlled to rise, so that the machine body 20 performs multi-wire cutting on the quartz wafer, and at the same time, the other placement seat 31 will be moved out from under the machine body 20, so that the staff can remove and replace the quartz wafer 40 of the other placement seat 31 during the processing of the machine body 20, so as to improve the processing efficiency of the piezoelectric quartz wafer.

[0033] In some optional embodiments, a sliding assembly 13 is further provided on the outer side of the platform 10, and the sliding assembly 13 includes a sliding rod fixed on the bracket 12 and a slider sleeved on the sliding rod, and the slider is fixed on the platform 10. In this way, during the movement of the bracket 12, the sliding rod will slide along the slider, so that the bracket 12 can slide stably.

[0034] In some optional embodiments, a support assembly is further disposed at the bottom of the platform 10 , and the support assembly is used to support the platform 10 .

[0035] Specifically, the support assembly includes: a connecting frame 1102 fixed on the side of the platform body 10; an adjusting bolt 1101 threadedly connected to the connecting frame 1102; and an abutment seat 1103 movably connected to the connecting frame 1102, the part of the abutment seat 1103 extending into the connecting frame 1102 contacts with the bottom of the adjusting bolt 1101; wherein, by rotating the adjusting bolt 1101, the length of the abutment seat 1103 extending out of the connecting frame 1102 can be adjusted.

[0036] By applying the technical solution of this embodiment, during the process of placing the platform 10, if the ground is uneven, causing the platform 10 to shake during use, the staff can turn the adjusting bolt 1101 to move the adjusting bolt 1101 downward or upward along the connecting frame 1102, so as to push the abutment seat 1103 to extend outward or inward, thereby making the platform 10 more stable during use.

[0037] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A multi-wire cutting device for quartz wafer production, It is characterized in that include: A machine body (20) disposed on a platform (10), a placement seat (31) located below the machine body (20), and a cover frame assembly (32) sleeved on the placement seat (31); A positioning block (3101) is provided on the upper end surface of the placement seat (31); when the cover frame assembly (32) is sleeved on the placement seat (31), the positioning block (3101) extends into the positioning groove of the cover frame assembly (32) and contacts the inner wall of the cover frame assembly (32); The cover frame assembly (32) comprises: A cover frame body (3207), wherein a connecting plate (33) is provided on a side wall of the cover frame body (3207), a sliding groove (3303) and a snap-on hole (3301) are provided on the side wall of the connecting plate (33), and the snap-on hole (3301) is communicated with the sliding groove (3303); a second cover frame (3202), wherein a third locking bolt (3302) is arranged on a side wall of the second cover frame (3202), and one end of the third locking bolt (3302) away from the second cover frame (3202) passes through the sliding groove (3303) and abuts against the outer wall of the connecting plate (33), and the third locking bolt (3302) is clamped to the clamping holes (3301) at different positions on the connecting plate (33), so that the second cover frame (3202) is arranged at different positions of the connecting plate (33); a first cover frame (3201) arranged on the upper part of the second cover frame (3202), the first cover frame (3201) being movably plugged into the second cover frame (3202), and a movable groove (3204) being provided inside the first cover frame (3201), a movable block (3205) being movably provided inside the movable groove (3204), a portion of the movable block (3205) extending into the movable groove (3204) abutting against an inner wall of the first cover frame (3201), and a portion of the movable block (3205) extending out of the movable groove (3204) contacting a quartz wafer (40) arranged in the middle of the second cover frame (3202); A plurality of locking holes (3206) are provided at one end of the second cover frame (3202) extending into the interior of the first cover frame (3201), and a second locking bolt (3203) arranged on the first cover frame (3201) passes through the locking holes (3206) at different positions to adjust the distance between the first cover frame (3201) and the second cover frame (3202).

2. A multi-wire sawing device for quartz wafer production according to claim 1, It is characterized in that A buffer layer is provided on the side walls of the second cover frame (3202) and the first cover frame (3201) that are in contact with the quartz wafer (40).

3. A multi-wire sawing device for quartz wafer production according to claim 1, It is characterized in that An electric push rod (14) is fixedly mounted on the outer side of the platform (10), a bracket (12) is fixedly mounted on the top of the electric push rod (14), and a support plate (15) is connected to the inner side of the bracket (12); Wherein, the placement seat (31) is fixedly arranged on the support plate (15).

4. A multi-wire sawing device for quartz wafer production according to claim 3, It is characterized in that The support plate (15) is slidably connected to the inner side of the bracket (12), and a placement seat (31) is symmetrically fixedly mounted on the surface of the support plate (15).

5. A multi-wire sawing device for quartz wafer production according to claim 3, It is characterized in that A sliding assembly (13) is also provided on the outer side of the platform (10), wherein the sliding assembly (13) comprises a sliding rod fixed on the bracket (12) and a sliding block sleeved on the sliding rod, and the sliding block is fixed on the platform (10).

6. A multi-wire sawing device for quartz wafer production according to claim 1, It is characterized in that A support component is also provided at the bottom of the platform (10), and the support component is used to support the platform (10).

7. A multi-wire sawing device for quartz wafer production according to claim 6, It is characterized in that The support assembly comprises: A connection frame (1102) fixed on the side of the platform (10); an adjusting bolt (1101) threadedly connected to the connecting frame (1102); and an abutment seat (1103) movably connected to the connection frame (1102), wherein the portion of the abutment seat (1103) extending into the connection frame (1102) contacts the bottom of the adjustment bolt (1101); Wherein, by rotating the adjusting bolt (1101), the length of the abutment seat (1103) extending out of the connection frame (1102) can be adjusted.

Images