A method and device for preparing a gas sensor chip

Abstract

The present disclosure relates to a method, apparatus, electronic device, and storage medium for preparing a gas sensor chip. Among them, the method includes: after the ground metal oxide powder is subjected to a first sintering treatment, a film is coated on the chip by a screen printing machine to form a printing area; the chip is baked based on a second preset condition to shape the printing area; the chip with the shaped printing area is subjected to a second sintering treatment based on a third preset condition to complete the preparation of the chip. The present disclosure removes substances in the material that absorb bound water under high temperature and high humidity conditions through the process of secondary sintering of the chip at a specific temperature, thereby improving the material stability and further enhancing the service life of the sensor chip.

Description

Background Art

[0002] In the life and production of modern society, with the development of modern industry, people will be exposed to various toxic and harmful gases, such as nitrogen oxides, sulfur oxides and some volatile organic compound pollution. In addition, with the vigorous development of modern industry, various products emerge in an endless stream, among which intelligent monitoring systems are particularly important. As the basic guarantee for the safe production and implementation of products, the monitoring system mainly monitors the potential dangers of products during production and use and provides timely feedback to avoid accidents. For example, in the launch system of a missile launcher, the chemical composition of the propellant has certain dangers. Improper use will cause leakage, combustion and even explosion of toxic and harmful substances. Therefore, leakage detection of toxic and harmful substances during production and use is particularly important. Chemical gas sensors are a type of detection device that changes their properties (usually resistance) by interacting with the surface of environmental gases. This device meets the detection requirements for toxic and harmful substances or other special conditions, so it has been widely studied. Chemical gas sensors are composed of sensitive materials, response circuits and output circuits, among which sensitive materials are particularly important as the core elements that contact and react with sensitive gases. Common sensitive materials include metal oxides, conductive polymers, carbon nanotubes, hydrogels, etc. Among them, metal oxide semiconductor materials are widely used in this field due to their significant advantages such as low cost, easy synthesis, abundant yield and rapid response.

[0003] So far, the process of preparing gas sensors with metal oxide semiconductor materials as sensitive materials has developed quite maturely. Many commercially mass-produced metal oxide materials can be directly applied to this field, and many commercial materials (such as indium oxide, zinc oxide, iron oxide, etc.) can be prepared into sensor chips through corresponding processes and subsequently improved. The commonly used preparation processes include screen printing, spin coating, drip coating, etc., to evenly cover the sensitive material on the chip, and connect the subsequent circuit to the chip to form a MEMS gas sensor device. Although this commercial method has become mature, there are still some shortcomings. Metal oxide materials are relatively stable, and the life of the corresponding prepared sensitive materials is theoretically far better than other materials. However, in actual evaluation, we used life aging experiments to detect its service life and found that the life of the sensor did not meet the basic requirements of the industry. The materials that did not participate in the life test and those that participated in the life test were analyzed and tested, and it was found that there was a large amount of bound water in the materials after the life test. This phenomenon is the main reason for the sudden reduction in life. After analysis, it was found that commercial batches of metal oxide materials are prepared by calcining metal precursors (hydroxides). During the sintering process, the materials are incompletely sintered and some hydroxides exist. Therefore, under high temperature and high humidity conditions, they will absorb bound water and affect the stability of the material.

[0004] Therefore, one or more methods are needed to solve the above problems.

[0005] It should be noted that the information disclosed in the above background art is only used to enhance the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0006] The purpose of the present disclosure is to provide a method for preparing a gas sensor chip, a device, an electronic device, and a computer-readable storage medium, so as to at least overcome one or more problems caused by the limitations and defects of the related art to a certain extent.

[0007] According to one aspect of the present disclosure, a method for preparing a gas sensor chip is provided, including:

[0008] Performing a first sintering treatment on the ground metal oxide powder based on a first preset condition;

[0009] Coating and forming the metal oxide powder that has undergone the first sintering treatment on the chip through a screen printing machine, so that the metal oxide powder forms a printing area on the chip;

[0010] Performing a baking treatment on the chip based on a second preset condition to shape the printing area;

[0011] Performing a second sintering treatment on the chip with the shaped printing area based on a third preset condition to complete the preparation of the chip.

[0012] In an exemplary embodiment of the present disclosure, the method further includes performing a first sintering treatment on the ground metal oxide powder based on a first preset condition, and the first preset condition is:

[0013] Without a protective gas, the heating rate is 1 - 5 °C / min to 500 °C, and keep the temperature at 500 °C for 2 - 3 hours.

[0014] In an exemplary embodiment of the present disclosure, the method further includes, during the baking treatment of the chip based on a second preset condition, the second preset condition is:

[0015] Preheat the oven temperature to 90 - 100 °C, and keep the temperature at 90 - 100 °C for 2 - 3 hours.

[0016] In an exemplary embodiment of the present disclosure, the method further includes, during the second sintering treatment of the chip with the shaped printing area based on a third preset condition, the third preset condition is:

[0017] Without a protective gas, the heating rate is 1 - 5 °C / min to 500 °C, and keep the temperature at 500 °C for 2 - 3 hours.

[0018] In an exemplary embodiment of the present disclosure, the method further includes:

[0019] Performing a second grinding process on the metal oxide powder that has undergone the first sintering process;

[0020] Coating and forming a film on the chip with the metal oxide powder after the second grinding process through a screen printing machine.

[0021] In an exemplary embodiment of the present disclosure, the method further includes:

[0022] Performing a second grinding process on the metal oxide powder that has undergone the first sintering process;

[0023] Mixing the metal oxide powder after the second grinding process with an adhesive;

[0024] Coating and forming a film on the chip with the metal oxide powder mixed with the adhesive through a screen printing machine.

[0025] In an exemplary embodiment of the present disclosure, the method further includes:

[0026] Performing a second sintering process on the chip after the printing area is shaped based on a third preset condition to remove hydroxides and adhesives in the printing area of the chip, thereby completing the preparation of the chip.

[0027] In one aspect of the present disclosure, there is provided a gas sensor chip preparation device, including:

[0028] A first sintering module for performing a first sintering process on the ground metal oxide powder based on a first preset condition;

[0029] A printing module for coating and forming a film on the chip with the metal oxide powder that has undergone the first sintering process through a screen printing machine, so that the metal oxide powder forms a printing area on the chip;

[0030] A baking module for baking the chip based on a second preset condition to shape the printing area;

[0031] A second sintering module for performing a second sintering process on the chip after the printing area is shaped based on a third preset condition to complete the preparation of the chip.

[0032] In one aspect of the present disclosure, there is provided an electronic device, including:

[0033] A processor; and

[0034] A memory, on which computer-readable instructions are stored, and when the computer-readable instructions are executed by the processor, the method according to any one of the above is implemented.

[0035] In one aspect of the present disclosure, there is provided a computer-readable storage medium having stored thereon a computer program, which when executed by a processor implements the method according to any one of the above.

[0036] A method for preparing a gas sensor chip in an exemplary embodiment of the present disclosure, wherein the method includes: after the ground metal oxide powder is subjected to a first sintering treatment, a film is coated on the chip by a screen printing machine to form a printing area; the chip is baked based on a second preset condition to shape the printing area; the chip with the shaped printing area is subjected to a second sintering treatment based on a third preset condition to complete the preparation of the chip. The present disclosure improves the material stability and further extends the service life of the sensor chip by removing substances that absorb bound water under high temperature and high humidity conditions through the process of secondary sintering of the chip at a specific temperature.

[0037] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The above and other features and advantages of the present disclosure will become more apparent by referring to the accompanying drawings to describe its exemplary embodiments in detail.

[0039] Figure 1 FIG. shows a flowchart of a method for preparing a gas sensor chip according to an exemplary embodiment of the present disclosure;

[0040] Figure 2 FIG. shows a schematic block diagram of a device for preparing a gas sensor chip according to an exemplary embodiment of the present disclosure;

[0041] Figure 3 FIG. schematically shows a block diagram of an electronic device according to an exemplary embodiment of the present disclosure; and

[0042] Figure 4 FIG. schematically shows a schematic diagram of a computer-readable storage medium according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0043] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Identical reference numerals in the figures denote identical or similar parts, and thus their repeated description will be omitted.

[0044] In addition, the described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present disclosure. However, those skilled in the art will realize that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, devices, steps, etc. may be employed. In other cases, well-known structures, methods, devices, implementations, materials, or operations are not shown or described in detail to avoid obscuring aspects of the present disclosure.

[0045] The block diagrams shown in the drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or these functional entities or a part of the functional entities may be implemented in one or more software-hardened modules, or these functional entities may be implemented in different networks and / or processor devices and / or microcontroller devices.

[0046] In the present exemplary embodiment, first, a method for preparing a gas sensor chip is provided; as shown in Figure 1 , the method for preparing a gas sensor chip may include the following steps:

[0047] Step S110, performing a first sintering process on the ground metal oxide powder based on a first preset condition;

[0048] Step S120, coating and forming a film on the chip with the metal oxide powder that has undergone the first sintering process by a screen printer, so that the metal oxide powder forms a printing area on the chip;

[0049] Step S130, baking the chip based on a second preset condition to shape the printing area;

[0050] Step S140, performing a second sintering process on the chip with the shaped printing area based on a third preset condition to complete the preparation of the chip.

[0051] A method for preparing a gas sensor chip in an exemplary embodiment of the present disclosure, wherein the method includes: after performing a first sintering process on the ground metal oxide powder, coating and forming a film on the chip by a screen printer to form a printing area; baking the chip based on a second preset condition to shape the printing area; performing a second sintering process on the chip with the shaped printing area based on a third preset condition to complete the preparation of the chip. The present disclosure removes substances in the material that absorb bound water under high-temperature and high-humidity conditions through the process of secondary sintering of the chip at a specific temperature, thereby improving the material stability and further enhancing the service life of the sensor chip.

[0052] Next, a method for preparing a gas sensor chip in this exemplary embodiment will be further described.

[0053] In step S110, the ground metal oxide powder can be subjected to a first sintering process based on a first preset condition.

[0054] In the embodiment of this example, the method further includes subjecting the ground metal oxide powder to a first sintering process based on a first preset condition, and the first preset condition is:

[0055] Without a protective gas, the heating rate is 1 - 5 °C / min to 500 °C, and it is held at 500 °C for 2 - 3 hours.

[0056] In step S120, the metal oxide powder that has undergone the first sintering process can be coated and formed into a film on the chip by a screen printing machine, so that the metal oxide powder forms a printing area on the chip.

[0057] In the embodiment of this example, the method further includes:

[0058] Subjecting the metal oxide powder that has undergone the first sintering process to a second grinding process;

[0059] Coating and forming the metal oxide powder after the second grinding process into a film on the chip by a screen printing machine.

[0060] In step S130, the chip can be baked based on a second preset condition to shape the printing area.

[0061] In the embodiment of this example, the method further includes, during baking the chip based on a second preset condition, the second preset condition is:

[0062] Preheat the oven temperature to 90 - 100 °C and hold at 90 - 100 °C for 2 - 3 hours.

[0063] In the embodiment of this example, the method further includes:

[0064] Subjecting the metal oxide powder that has undergone the first sintering process to a second grinding process;

[0065] Mixing the metal oxide powder after the second grinding process with an adhesive;

[0066] Coating and forming the metal oxide powder mixed with the adhesive into a film on the chip by a screen printing machine.

[0067] In step S140, the chip with the shaped printing area can be subjected to a second sintering process based on a third preset condition to complete the preparation of the chip.

[0068] In the embodiment of this example, the method further includes performing a second sintering process on the chip after the printing area is finalized based on a second preset condition, wherein the third preset condition is:

[0069] Without protective gas, heating rate is 1-5℃ / min to 500℃, and keeping at 500℃ for 2-3 hours.

[0070] In the embodiment of this example, the method further includes:

[0071] The chip after the printing area is finalized is subjected to a second sintering treatment based on the third preset condition to remove the hydroxide and adhesive in the printing area of ​​the chip, thereby completing the preparation of the chip.

[0072] In the embodiment of this example, commercial metal oxide materials are usually prepared by calcining metal precursors (hydroxides). We use commercial indium oxide as an example for process analysis and improvement. The sensor chip is a 3*3mm interdigitated electrode chip, and the film forming process is screen printing. Screen printing is a commonly used film forming process, and its outstanding features are simple operation, uniform and firm film formation. First, commercial metal oxides (taking indium oxide as an example) are fully and evenly ground and then sintered at 500°C with a heating rate of 1-5°C / min, without protective gas, and a holding time of 2-3h; the sintered powder sample is ground again to avoid agglomeration during the sintering process, a binder (glycerol) is added and fully mixed with the material, and a uniform film is formed on the interdigitated electrode chip by a screen printer, and the coating area is approximately 1mm*1mm square. The printed chip is placed in an oven at 90-100°C for aging for 2-3h to shape the printed area, and the shaped chip is sintered for a second time, and the chip is heated to 500°C at a rate of 1-5°C / min in air and kept warm for 2-3h to remove glycerol and excess moisture in the material to obtain a long-life product-grade MEMS gas sensor chip.

[0073] In the embodiments of this example, the technical solution of the present invention effectively removes the bound water in the commercial metal oxide material through a secondary sintering process combined with a screen printing process, and prepares a product-level MEMS gas sensor chip by this process. This sensor can perform trace detection of nitrogen dioxide (1 ppm), and compared with other methods (such as directly preparing a commercial material into a sensor chip), this sensor chip shows a longer service life in the life aging test, which can reach more than twice that of other methods. The life aging experiment is one of the common means to evaluate the service life of the sensor chip. The chip is aged and accelerated through the Peck model, and the aging conditions are simulated by (temperature 85 degrees Celsius, humidity 85%). The service life of the chip is judged. For the sensor chip prepared without the secondary sintering process, the tested service life is 1 - 3 years, and for the sensor chip prepared with the secondary sintering process, the tested service life is 6 - 9 years.

[0074] It should be noted that although the steps of the method in the present disclosure are described in a specific order in the drawings, this does not require or imply that these steps must be executed in this specific order, or that all the shown steps must be executed to achieve the desired result. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be decomposed into multiple steps for execution, etc.

[0075] In addition, in the embodiments of this example, a device for preparing a gas sensor chip is also provided. Referring to Figure 2 As shown, the device 200 for preparing a gas sensor chip may include: a first sintering module 210, a printing module 220, a baking module 230, and a second sintering module 240. Among them:

[0076] The first sintering module 210 is used to perform a first sintering process on the ground metal oxide powder based on a first preset condition;

[0077] The printing module 220 is used to coat and form a film on the chip with the metal oxide powder that has undergone the first sintering process through a screen printing machine, so that the metal oxide powder forms a printing area on the chip;

[0078] The baking module 230 is used to perform a baking process on the chip based on a second preset condition to shape the printing area;

[0079] The second sintering module 240 is used to perform a second sintering process on the chip with the shaped printing area based on a third preset condition to complete the preparation of the chip.

[0080] The specific details of each module of the above device for preparing a gas sensor chip have been described in detail in the corresponding method for preparing a gas sensor chip, so they will not be elaborated here.

[0081] It should be noted that although several modules or units of a gas sensor chip preparation device 200 are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0082] In addition, in an exemplary embodiment of the present disclosure, an electronic device capable of implementing the above method is also provided.

[0083] Those skilled in the art can understand that various aspects of the present invention can be implemented as a system, a method, or a program product. Therefore, various aspects of the present invention can be specifically implemented in the following forms, namely: a complete hardware embodiment, a complete software embodiment (including firmware, microcode, etc.), or an embodiment combining hardware and software aspects, which can be collectively referred to as "circuit", "module", or "system" here.

[0084] The following refers to Figure 3 to describe the electronic device 300 according to this embodiment of the present invention. Figure 3 The electronic device 300 shown is only an example and should not impose any limitations on the functions and usage scope of the embodiments of the present invention.

[0085] As Figure 3 shown, the electronic device 300 is presented in the form of a general-purpose computing device. The components of the electronic device 300 may include, but are not limited to: at least one of the above-mentioned processing units 310, at least one of the above-mentioned storage units 320, a bus 330 connecting different system components (including the storage unit 320 and the processing unit 310), and a display unit 340.

[0086] Among them, the storage unit stores program code, and the program code can be executed by the processing unit 310, so that the processing unit 310 executes the steps according to various exemplary embodiments of the present invention described in the above "exemplary method" part of this specification. For example, the processing unit 310 can execute steps S110 to S140 as Figure 1 shown.

[0087] The storage unit 320 may include a readable medium in the form of a volatile storage unit, such as a random access storage unit (RAM) 3201 and / or a cache storage unit 3202, and may further include a read-only storage unit (ROM) 3203.

[0088] The storage unit 320 may also include a program / utility 3204 having a set (at least one) of program modules 3203. Such program modules 3205 include, but are not limited to, an operating system, one or more application programs, other program modules, and program data. Each or some combination of these examples may include an implementation of a network environment.

[0089] The bus 350 may represent one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus structures.

[0090] The electronic device 300 may also communicate with one or more external devices 370 (such as a keyboard, a pointing device, a Bluetooth device, etc.), may also communicate with one or more devices that enable a user to interact with the electronic device 300, and / or may communicate with any device that enables the electronic device 300 to communicate with one or more other computing devices (such as a router, a modem, etc.). Such communication may be through the input / output (I / O) interface 350. Also, the electronic device 300 may communicate with one or more networks (such as a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet) through the network adapter 360. As shown, the network adapter 360 communicates with other modules of the electronic device 300 through the bus 350. It should be understood that, although not shown in the figure, other hardware and / or software modules may be used in conjunction with the electronic device 300, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems, etc.

[0091] Through the description of the above embodiments, those skilled in the art can easily understand that the example embodiments described herein can be implemented by software or by a combination of software and necessary hardware. Therefore, the technical solution according to the embodiments of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, including several instructions to enable a computing device (which can be a personal computer, a server, a terminal device, or a network device, etc.) to execute the method according to the embodiments of the present disclosure.

[0092] In an exemplary embodiment of the present disclosure, there is also provided a computer-readable storage medium, on which a program product capable of implementing the above-described method of this specification is stored. In some possible embodiments, various aspects of the present invention can also be implemented in the form of a program product, which includes program code. When the program product runs on a terminal device, the program code is used to cause the terminal device to execute the steps according to various exemplary embodiments of the present invention described in the above "Exemplary Method" section of this specification.

[0093] As shown in the reference Figure 4 400 is a program product for implementing the above method according to an embodiment of the present invention. It can be a portable compact disc read-only memory (CD-ROM) and includes program code, and can run on a terminal device, such as a personal computer. However, the program product of the present invention is not limited to this. In this document, a readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0094] The program product can adopt any combination of one or more readable media. The readable media can be a readable signal medium or a readable storage medium. The readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples (non-exhaustive list) of the readable storage medium include: an electrical connection having one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0095] The computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, which carries the readable program code. Such a propagated data signal can take various forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination of the above. The readable signal medium can also be any readable medium other than the readable storage medium, which can send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0096] The program code contained on the readable medium can be transmitted by any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination of the above.

[0097] The program code for performing the operations of the present invention can be written in any combination of one or more programming languages, including object-oriented programming languages such as Java, C++, etc., and also including conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computing device, partially on the user's device, executed as a stand-alone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user's computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (e.g., by using an Internet service provider to connect through the Internet).

[0098] In addition, the above-mentioned drawings are only schematic illustrations of the processes included in the method according to the exemplary embodiments of the present invention, rather than for limiting purposes. It is easy to understand that the processes shown in the above-mentioned drawings do not indicate or limit the chronological order of these processes. Additionally, it is also easy to understand that these processes can be executed synchronously or asynchronously, for example, in multiple modules.

[0099] Those skilled in the art will readily think of other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the claims.

[0100] It should be understood that the present disclosure is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A method for preparing a gas sensor chip, characterized in that, The method includes: Performing a first sintering process on the ground metal oxide powder based on a first preset condition; the first preset condition is: without a protective gas, a heating rate of 1-5 °C / min to 500 °C, and holding at 500 °C for 2-3 hours; Coating and forming a film on the chip with the metal oxide powder that has undergone the first sintering process through a screen printing machine, so that the metal oxide powder forms a printing area on the chip; Performing a baking process on the chip based on a second preset condition to shape the printing area; the second preset condition is: preheating the oven temperature to 90-100 °C and holding at 90-100 °C for 2-3 hours; Performing a second sintering process on the chip with the shaped printing area based on a third preset condition to complete the preparation of the chip; the third preset condition is: without a protective gas, a heating rate of 1-5 °C / min to 500 °C, and holding at 500 °C for 2-3 hours.

2. The method according to claim 1, characterized in that, The method further includes: Performing a second grinding process on the metal oxide powder that has undergone the first sintering process; Coating and forming a film on the chip with the metal oxide powder after the second grinding process through a screen printing machine.

3. The method according to claim 2, characterized in that, The method further includes: Performing a second grinding process on the metal oxide powder that has undergone the first sintering process; Mixing the metal oxide powder after the second grinding process with an adhesive; Coating and forming a film on the chip with the metal oxide powder mixed with the adhesive through a screen printing machine.

4. The method according to claim 3, characterized in that, The method further includes: Performing a second sintering process on the chip with the shaped printing area based on a third preset condition to remove hydroxides and adhesives in the printing area of the chip and complete the preparation of the chip.

5. A device for preparing a gas sensor chip, characterized in that, The device includes: A first sintering module for performing a first sintering process on the ground metal oxide powder based on a first preset condition; the first preset condition is: without a protective gas, a heating rate of 1-5 °C / min to 500 °C, and holding at 500 °C for 2-3 hours; A printing module for coating and forming a film on the chip with the metal oxide powder that has undergone the first sintering process through a screen printing machine, so that the metal oxide powder forms a printing area on the chip; A baking module for performing a baking process on the chip based on a second preset condition to shape the printing area; the second preset condition is: preheating the oven temperature to 90-100 °C and holding at 90-100 °C for 2-3 hours; A second sintering module for performing a second sintering process on the chip with the shaped printing area based on a third preset condition to complete the preparation of the chip; the third preset condition is: without a protective gas, a heating rate of 1-5 °C / min to 500 °C, and holding at 500 °C for 2-3 hours.

6. An electronic device, characterized in that, Includes A processor; and A memory, on which computer-readable instructions are stored, and when the computer-readable instructions are executed by the processor, the method according to any one of claims 1 to 4 is implemented.

7. A computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the method according to any one of claims 1 to 4 is implemented.

Images