Display panel and manufacturing method thereof

By using a thermal adhesive layer in the OLED display panel and taking advantage of its different viscosity states, the problems of excessive groove width and bending radius were solved, and an ultra-narrow bezel design was achieved.

CN115101701BActive Publication Date: 2026-04-28WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
Filing Date
2022-06-10
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Existing OLED display panels have relatively wide grooves in the bending area and large bending radii, making it difficult to achieve ultra-narrow bezel designs as the bezel width cannot meet design requirements.

Method used

A thermal adhesive layer is used between the back panel and the display panel body. The thermal adhesive layer has two different tack states. In the low tack state, it is easy to laser groove and eliminate bonding tolerances. In the high tack state, it ensures the bonding quality between the back panel and the display panel.

Benefits of technology

By eliminating fit tolerances and improving slotting precision, the width of the bending area is significantly reduced, achieving an ultra-narrow bezel design.

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Abstract

The application provides a display panel and a preparation method thereof. The display panel comprises a display panel body and a back plate arranged on the backlight side of the display panel body. The display panel body comprises a display area, a bending area and a binding area. The bending area is located between the display area and the binding area. The display panel further comprises a heat-sensitive adhesive layer arranged between the back plate and the display panel body. In the display panel, the heat-sensitive adhesive layer has two states with different adhesions. The adhesion in one state is low, so that the back plate attached to the display panel body can be easily laser grooved, the attachment tolerance can be eliminated, the grooving precision can be improved, and the width of the bending area can be greatly reduced. The adhesion in the other state is high, so that the attachment quality of the back plate and the display panel body can be ensured.
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Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and its manufacturing method. Background Technology

[0002] Organic light-emitting diode (OLED) display panels offer advantages over liquid crystal displays, including thinner and lighter designs, better display quality, higher resolution, wider color gamut, lower power consumption, and the ability to achieve flexible displays. These advantages have led to their rapid development in recent years, making them the preferred display panel type for mobile devices.

[0003] Because OLED display panels are flexible and bendable, the bonding area (or terminal area) at the bottom of the OLED display panel can be bent to the back of the display panel, thereby narrowing the bottom bezel and achieving a narrow bezel. To facilitate bending, the area of ​​the back panel corresponding to the bending area needs to be slotted. This is typically done using a die-cutting method, and then the cut back panel is bonded to the display panel body using pressure-sensitive adhesive. However, the die-cutting mold has a certain precision error, and there are also certain bonding tolerances during the bonding process. This results in a relatively wide slot, a long bending area, and a large bending radius on the back panel ultimately bonded to the display panel body, making it impossible to achieve the required bezel width. This is detrimental to ultra-narrow bezel designs, and this problem urgently needs to be solved. Summary of the Invention

[0004] This application provides a display panel and its manufacturing method, which can effectively solve the problems of existing OLED display panels having a wide back panel groove, a large bending radius, and a frame width that cannot meet design requirements.

[0005] On one hand, this application provides a display panel, the display panel comprising: a display panel body and a backplate disposed on the backlight side of the display panel body, the display panel body comprising a display area, a bending area and a bonding area, the bending area being located between the display area and the bonding area.

[0006] The display panel further includes a thermal adhesive layer, which is disposed between the back panel and the display panel body.

[0007] Optionally, the thermal adhesive layer has a first state and a second state, wherein in the first state, the thermal adhesive layer has a first viscosity to the display panel body; and in the second state, the thermal adhesive layer has a second viscosity to the display panel body, the second viscosity being greater than the first viscosity.

[0008] Optionally, the thermal adhesive layer includes an adhesive layer and a temperature-responsive polymer, wherein, in the first state, the temperature-responsive polymer is aggregated on the surface of the adhesive layer near the display panel body; and in the second state, the temperature-responsive polymer is dispersed in the adhesive layer.

[0009] Optionally, the display panel body includes a substrate, and the back panel is bonded to the substrate through the thermosensitive adhesive layer, wherein both the temperature-responsive polymer and the substrate are hydrophilic.

[0010] Optionally, the temperature-responsive polymer is made of (PEO-b-PNIPAM)-g-PBAMO, and the substrate is made of polyimide.

[0011] Optionally, the length of the bending zone is less than or equal to 0.7 mm.

[0012] On the other hand, this application provides a method for manufacturing a display panel, the method comprising the following steps:

[0013] A display panel body is provided, the display panel body including a display area, a bending area and a binding area, the bending area being located between the display area and the binding area;

[0014] A backplate is provided, and a thermal adhesive layer is coated on one side of the backplate at a first temperature to form a backplate. The backplate is then attached to the backlight side of the display panel body through the thermal adhesive layer. The backplate is disposed in the display area, the bending area, and the bonding area. The thermal adhesive layer has a first state in which it has a first viscosity to the display panel body.

[0015] The back plate of the bending area is subjected to laser processing to remove the back plate of the bending area, forming a first back plate disposed in the display area, a second back plate disposed in the bonding area, and a notch disposed in the bending area;

[0016] The first backplate of the display area and the second backplate of the bonding area are subjected to defoaming treatment and kept at a second temperature for a preset time to allow the thermal adhesive layer to switch from a first state to a second state. In the second state, the thermal adhesive layer has a second viscosity to the display panel body, wherein the second viscosity is greater than the first viscosity.

[0017] Optionally, the thermal adhesive layer includes an adhesive layer and a temperature-responsive polymer, wherein, in the first state, the temperature-responsive polymer is aggregated on the surface of the adhesive layer near the display panel body; and in the second state, the temperature-responsive polymer is dispersed in the adhesive layer.

[0018] Optionally, the display panel body includes a substrate, and the back panel is bonded to the substrate through the thermosensitive adhesive layer, wherein both the temperature-responsive polymer and the substrate are hydrophilic.

[0019] Optionally, the first temperature is 20-30℃, the first viscosity is 50-100gf / inch, and the laser process is a femtosecond laser process; the second temperature is greater than or equal to 50℃, the second viscosity is greater than or equal to 500gf / inch, and the preset time is greater than or equal to 15min.

[0020] This application provides a display panel and a method for manufacturing the same. The display panel includes a back panel, a display panel body, and a thermal adhesive layer. The thermal adhesive layer is located between the back panel and the display panel body. The thermal adhesive layer has two states with different adhesive properties. In one state, the adhesive property is lower, which facilitates laser grooving of the back panel bonded to the display panel body, eliminates bonding tolerances, improves grooving accuracy, and greatly reduces the width of the bending area. In the other state, the adhesive property is higher, which ensures the bonding quality between the back panel and the display panel body. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application;

[0023] Figure 2 A schematic flowchart illustrating the method for manufacturing a display panel according to an embodiment of this application;

[0024] Figure 3 This is a structural schematic diagram of the display panel body corresponding to step S01;

[0025] Figure 4 This is a structural diagram of the display panel body, back plate, and thermal adhesive layer corresponding to step S02;

[0026] Figure 5 This is a structural diagram of the display panel body, back plate, and thermal adhesive layer corresponding to step S03;

[0027] Figure 6 This is a schematic diagram of the display panel body, back plate, and thermal adhesive layer corresponding to step S04. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0029] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials. Detailed descriptions are provided below; it should be noted that the order of description of the following embodiments is not intended to limit the preferred order of embodiments.

[0030] The inventors of this application discovered through research that in the manufacturing process of flexible display panels, in order to facilitate bending of the bending area, a groove design is made in the area corresponding to the bending area of ​​the back panel. However, the current back panel manufacturing process involves first cutting and slotting a whole back panel with a die, and then bonding the cut back panel to the display panel body with pressure-sensitive adhesive. However, the precision limit of the die is relatively large, generally ±50μm. At the same time, there is also a certain bonding tolerance during the back panel bonding process, generally ±100um. The accumulation of these two precision tolerances results in a wider groove width of the back panel finally bonded to the display panel body, and a correspondingly larger bending area length. After bending through the terminal bending (pad bending) process, the bending radius of the display panel is large and the bezel is wide, making it difficult to meet the bezel design requirements.

[0031] The inventors of this application further discovered that by first bonding the backplate to the display panel body and then slotting the backplate bonded to the display panel body, bonding tolerances can be effectively eliminated. In addition, laser slotting has higher slotting accuracy than traditional die-cutting processes and can effectively reduce the width of the slot. However, the problem is that the backplate bonded to the display panel body is fixed by pressure-sensitive adhesive, which has high adhesion. Since the laser energy is high, if the backplate bonded to the display panel body is directly laser-slotted, adhesion will occur between the backplate and the pressure-sensitive adhesive, greatly reducing the slotting accuracy and quality. As a result, the length of the bending area is still difficult to shorten, and the bezel is still relatively wide.

[0032] The display panel and its manufacturing method provided in this application are intended to solve the above-mentioned technical problems of the prior art.

[0033] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0034] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application. Figure 1 As shown, the display panel includes: a display panel body 10 and a back plate 20 disposed on the backlight side of the display panel body 10. The display panel body 10 includes a display area 11, a bending area 13 and a bonding area 12. The bending area 13 is located between the display area 11 and the bonding area 12. The back plate 20 includes a first back plate 21 disposed on the display area 11, a second back plate 22 disposed on the bonding area 12 and a notch 23 disposed on the bending area 13. The display panel also includes a thermal adhesive layer 30 disposed between the back plate 20 and the display panel body 10.

[0035] In the display panel provided in this application, the thermal adhesive layer 30 has two states with different adhesion. In one state, the adhesion is low, which facilitates laser grooving of the back plate 20 attached to the display panel body 10, ensuring the quality of laser grooving, eliminating the adhesion phenomenon between the back plate 20 and the display panel body 10 caused by the strong adhesive force of the adhesive during the laser grooving process, and enabling the display panel to adopt a process of first attaching the back plate 20 to the display panel body 10 and then laser grooving, eliminating the bonding tolerance, improving the grooving accuracy, greatly reducing the length of the bending area 13, and narrowing the bezel of the display panel; in the other state, the adhesion is high, which can ensure the bonding quality between the back plate 20 and the display panel body 10.

[0036] Specifically, since this application first attaches the back plate 20 to the display panel body 10 before performing the grooving operation, compared with the prior art where the back plate 20 is grooved first and then attached, it can effectively eliminate the attachment tolerance. Furthermore, since the initial state of the thermosensitive adhesive layer 30 has low adhesion during the laser grooving process, it can avoid the problem of adhesion between the back plate 20 and the display panel body 10 caused by the laser grooving process. This allows the back plate 20 attached to the display panel body 10 to be grooved normally using a higher precision laser grooving process to form the notch 23. This can greatly reduce the width of the notch 23 of the back plate 20 attached to the display panel body 10, greatly reduce the width of the bending area 13, and achieve an ultra-narrow bezel. In addition, after the back plate 20 attached to the display panel body 10 forms a narrower notch 23, by performing another temperature treatment on the thermal adhesive layer 30, the thermal adhesive layer 30 can be switched from the initial state to another state with enhanced adhesion and stability, thereby ensuring the bonding quality between the back plate 20 and the display panel body 10, and thus ensuring the supporting role of the back plate 20 on the display panel body 10.

[0037] In some embodiments of this application, the display panel is a flexible display panel, specifically a flexible OLED display panel.

[0038] In some embodiments of this application, the display panel body 10 includes: a substrate, a driving circuit layer disposed on the substrate, a light-emitting functional layer disposed on the driving circuit layer, and an encapsulation layer disposed on the light-emitting functional layer. The display panel body 10 is used to perform display functions and includes a display side and a backlight side.

[0039] In some embodiments of this application, the back plate 20 is disposed on the backlight side of the display panel body 10, and the back plate 20 is used to support the display panel body 10. Specifically, the back plate 20 is disposed on the side of the substrate opposite to the driving circuit layer.

[0040] In some embodiments of this application, the thermal adhesive layer 30 has a first state and a second state, wherein, in the first state, the thermal adhesive layer 30 has a first viscosity to the display panel body 10; and in the second state, the thermal adhesive layer 30 has a second viscosity to the display panel body 10, the second viscosity being greater than the first viscosity.

[0041] Specifically, the thermal adhesive layer 30 has a first viscosity before high-temperature treatment and a second viscosity after high-temperature treatment. That is, before high-temperature treatment, the thermal adhesive layer 30 maintains a low viscosity to the display panel body 10, thereby ensuring that the back plate 20 attached to the display panel body 10 can normally apply a higher precision laser grooving process to form the notch 23 with a narrower grooving width in the bending area 13 of the display panel body 10; after high-temperature treatment, the thermal adhesive layer 30 has enhanced adhesion to the display panel body 10, thereby enabling the back plate 20 to adhere well to the display area 11 and the bonding area 12 on the display panel body 10 through the thermal adhesive layer 30, forming the first back plate 21 and the second back plate 22. Specifically, before high-temperature treatment, the heat-sensitive adhesive layer 30 is always in a first temperature environment, which is room temperature, such as 20-30℃; the first viscosity is 50-100gf / inch; the temperature in the high-temperature treatment process is a second temperature, which is greater than or equal to 50℃, the treatment time of the high-temperature treatment process is more than 15 minutes, and the second viscosity is 500gf / inch.

[0042] In some embodiments of this application, the thermal adhesive layer 30 includes an adhesive layer 31 and a temperature-responsive polymer 32. In a first state, the temperature-responsive polymer 32 is aggregated on the surface of the adhesive layer 31 near the display panel body 10; in a second state, the temperature-responsive polymer 32 is dispersed within the adhesive layer 31. Specifically, in the first state, because the temperature-responsive polymer 32 is aggregated on the surface of the adhesive layer 31 near the display panel body 10, it can hinder direct contact between the adhesive layer 31 and the display panel body 10, keeping the contact area between the adhesive layer 31 and the display panel body 10 within a lower range, thereby reducing the adhesion of the thermal adhesive layer 30 to the display panel body 10. In the second state, the temperature-responsive polymer 32 is dispersed within the adhesive layer 31, thereby increasing the contact area between the adhesive layer 31 and the display panel body 10, and increasing the adhesion of the thermal adhesive layer 30 to the display panel body 10.

[0043] In some embodiments of this application, the adhesive layer 31 is made of a colloid, such as pressure-sensitive adhesive or other viscous colloid.

[0044] In some embodiments of this application, the backplate 20 is bonded to the substrate via the thermosensitive adhesive layer 30. The substrate can be made of at least one of polyimide (PI) or polyethylene terephthalate (PET). Preferably, the substrate is hydrophilic, such as PI.

[0045] In some embodiments of this application, the temperature-responsive polymer 32 is also hydrophilic, such as a hydrophilic and temperature-responsive polymer brush, such as (PEO-b-PNIPAM)-g-PBAMO, wherein PEO-b-PNIPAM is a block copolymer of polyethylene glycol and poly(N-isopropylacrylamide), and PBAMO is poly(3,3-bis(azidomethyl)epoxybutane).

[0046] In some embodiments of this application, both the temperature-responsive polymer 32 and the substrate are hydrophilic. Specifically, because both the temperature-responsive polymer 32 and the substrate are hydrophilic, in the first state at room temperature, the temperature-responsive polymer 32 in the thermal adhesive layer 30 can accumulate towards the side closer to the substrate, causing the temperature-responsive polymer 32 to gather on the surface of the adhesive layer 31 near the display panel body 10. This creates a certain degree of isolation between the adhesive layer 31 and the substrate, significantly reducing the adhesion of the thermal adhesive layer 30 to the display panel body 10 and further improving the accuracy of the laser grooving process. High-temperature treatment disperses the temperature-responsive polymer 32 that was originally gathered on the surface of the adhesive layer 31 near the substrate within the adhesive layer 31, greatly enhancing the adhesion of the adhesive layer 31 to the backplate 20. This allows the thermal adhesive layer 30 to switch from the first state to the second state, ensuring the bonding quality between the display panel body 10 and the backplate 20. It should be noted that the thermal adhesive layer 30 in the finished display panel is a thermal adhesive that has a stable second state after high-temperature treatment, and the temperature-responsive polymer 32 in the thermal adhesive layer 30 is dispersed in the adhesive layer 31.

[0047] In some embodiments of this application, the length of the bending area 13 is less than or equal to 0.7 mm. Here, the length of the bending area 13 is also the distance between the display area 11 and the bonding area 12 when the display panel is unfolded. Since the bending area 13 of the finished display panel is generally a semicircular arc with a fixed bending radius R, when the bending area 13 is a semicircular arc with a fixed bending radius R, the length of the bending area 13 is equal to πR, and πR is less than or equal to 0.7 mm.

[0048] In some embodiments of this application, after the display panel body 10 is bent, the second back plate 22 is bent to the side of the first back plate 21 away from the display panel body 10 of the display area 11, so that the first back plate 21 and the second back plate 22 are arranged opposite to each other.

[0049] In some embodiments of this application, the display panel further includes a buffer layer 50, a support sheet 40, and double-sided adhesive 60 disposed between the first back plate 21 and the second back plate 22. The support sheet 40 is disposed between the buffer layer 50 and the double-sided adhesive 60 and may be made of steel. The buffer layer 50 is disposed between the support sheet 40 and the first back plate 21 and may be made of foam. The double-sided adhesive 60 is disposed between the support sheet 40 and the second back plate 22, and the double-sided adhesive 60 fixes the support sheet 40 and the second back plate 22 together.

[0050] In some embodiments of this application, the display panel further includes an anti-reflection layer 70, which is disposed on the side of the display panel body 10 in the display area 11 facing away from the first back plate 21. The anti-reflection layer 70 is used to reduce reflected light generated by ambient light reflecting off the display panel, thereby improving the display effect of the display panel. The anti-reflection layer 70 can be a polarizer or a color filter.

[0051] In some embodiments of this application, the display panel further includes a flexible cover plate 80, which is disposed on the side of the display panel body 10 opposite to the display area 11 of the antireflection layer 70. The flexible cover plate 80 can be a curved cover plate or a flat cover plate.

[0052] In some embodiments of this application, the display panel further includes a protective adhesive 90, which is located on the side of the display panel body 10 away from the back plate 20 and is at least disposed on the bending area 13 to protect the display panel body 10 of the bending area 13.

[0053] In some embodiments of this application, the display panel further includes an integrated circuit (IC) 100 and a flexible circuit board 110, wherein the integrated circuit 100 and the flexible circuit board 110 are located on the side of the display panel body 10 away from the back plate 20 and are disposed in the bonding area 12 of the display panel body 10.

[0054] On the other hand, this application also provides a method for manufacturing a display panel. Figure 2 This is a schematic flowchart illustrating the method for manufacturing a display panel according to an embodiment of this application. Figure 3This is a structural diagram of the display panel body corresponding to step S01. Figure 4 This is a structural diagram of the display panel body, back panel, and thermal adhesive layer corresponding to step S02. Figure 5 This is a structural diagram of the display panel body, back panel, and thermal adhesive layer corresponding to step S03. Figure 6 This is a structural diagram of the display panel body, back panel, and thermal adhesive layer corresponding to step S04. (Combined with...) Figures 2-6 As shown, the method for manufacturing the display panel includes the following steps:

[0055] S01: A display panel body 10 is provided, the display panel body 10 includes a display area 11, a bending area 13 and a binding area 12, the bending area 13 is located between the display area 11 and the binding area 12;

[0056] S02: A backplate 20 is provided. At a first temperature, a thermal adhesive layer 30 is coated on one side of the backplate 20 to form a backlight side of the display panel body 10. The backplate 20 is attached to the backlight side of the display panel body 10 through the thermal adhesive layer 30. The backplate 20 is disposed in the display area 11, the bending area 13 and the bonding area 12. The thermal adhesive layer 30 has a first state. In the first state, the thermal adhesive layer 30 has a first viscosity to the display panel body 10.

[0057] S03: The back plate 20 of the bending area 13 is subjected to laser processing to remove the back plate 20 of the bending area 13, forming a first back plate 21 disposed in the display area, a second back plate 22 disposed in the binding area 12 and a notch 23 disposed in the bending area 13.

[0058] S04: Defoaming treatment is performed on the first back plate 21 of the display area 11 and the second back plate 22 of the bonding area 12, and the temperature is kept at a second temperature for a preset time so that the thermal adhesive layer 30 switches from the first state to the second state. In the second state, the thermal adhesive layer 30 has a second viscosity to the display panel body 10, wherein the second viscosity is greater than the first viscosity.

[0059] In some embodiments of this application, the heat-sensitive adhesive layer 30 is in an environment of a first temperature and has a first viscosity before being treated with a second temperature, and has a second viscosity after being treated with a second temperature, wherein the second temperature is greater than the first temperature and the second viscosity is greater than the first viscosity.

[0060] In some embodiments of this application, the thermal adhesive layer 30 includes an adhesive layer 31 and a temperature-responsive polymer 32, wherein, in the first state, the temperature-responsive polymer 32 is aggregated on the surface of the adhesive layer 31 near the display panel body 10; and in the second state, the temperature-responsive polymer 32 is dispersed in the adhesive layer 31.

[0061] In some embodiments of this application, the display panel body includes a substrate, and the backplate 20 is bonded to the substrate via the thermosensitive adhesive layer 30. Both the temperature-responsive polymer 32 and the substrate are hydrophilic. In step S03, because both the temperature-responsive polymer 32 and the substrate are hydrophilic, in the first state at room temperature, the temperature-responsive polymer 32 in the thermosensitive adhesive layer 30 can accumulate towards the side closer to the substrate, causing the temperature-responsive polymer 32 to gather on the surface of the adhesive layer 31 near the display panel body 10. This provides a certain degree of isolation between the adhesive layer 31 and the substrate, significantly reducing the adhesion of the thermosensitive adhesive layer 30 to the display panel body 10, thereby providing conditions for the application of laser grooving technology. In step S04, after the thermal adhesive layer 30 is kept at the second temperature for a preset time, the thermal adhesive layer 30 switches from the first state to the second state. The temperature-responsive polymer 32 in the thermal adhesive layer 30 is dispersed in the adhesive layer 31, thereby greatly improving the adhesion effect of the adhesive layer 31 to the display panel body 10 and ensuring the bonding quality between the back plate 20 and the display panel body 10.

[0062] In some embodiments of this application, the first temperature is room temperature, such as 20-30°C; the first viscosity is 50-100 gf / inch; the laser process is a femtosecond laser process, which can further reduce the processing time of the laser process, reduce the thermal effect of the laser on the thermosensitive adhesive 30, and reduce the risk of the thermosensitive adhesive layer 30 becoming viscous or overflowing; the second temperature is greater than or equal to 50°C; the second viscosity is greater than or equal to 500 gf / inch; and the preset time is greater than or equal to 15 min.

[0063] In some embodiments of this application, the method for manufacturing the display panel further includes step S05: bending the display panel to bend the second back plate 22 to the side of the display panel body 10 away from the first back plate 21 and the display area 11.

[0064] In summary, this application provides a display panel and its manufacturing method. The display panel includes a display panel body and a backplate disposed on the backlight side of the display panel body. The display panel body includes a display area, a bending area, and a bonding area, with the bending area located between the display area and the bonding area. The display panel also includes a thermal adhesive layer disposed between the backplate and the display panel body. In the display panel provided by this application, the thermal adhesive layer has two states with different adhesive strengths. In one state, the adhesive strength is lower, which facilitates laser grooving of the backplate bonded to the display panel body, eliminating bonding tolerances, improving grooving accuracy, and significantly reducing the width of the bending area. In the other state, the adhesive strength is higher, which ensures the bonding quality between the backplate and the display panel body.

[0065] The above provides a detailed description of a display panel and its preparation method according to the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display panel, characterized in that, The display panel includes: a display panel body and a backplate disposed on the backlight side of the display panel body. The display panel body includes a display area, a bending area, and a bonding area, wherein the bending area is located between the display area and the bonding area. The display panel further includes a thermal adhesive layer, which is disposed between the back plate and the display panel body and has a second viscosity to the display panel body; The display panel is also provided with a notch, which penetrates the back plate and the thermosensitive adhesive layer and is adjacent to the bending area of ​​the display panel body; wherein, during the formation of the notch, the thermosensitive adhesive layer with a first viscosity to the display panel body is located between the back plate and the display panel body; The thermosensitive adhesive layer having the second viscosity is obtained by treating the thermosensitive adhesive layer having the first viscosity at a second temperature, wherein the second viscosity is greater than the first viscosity.

2. The display panel according to claim 1, characterized in that, The first viscosity is 50 gf / inch to 100 gf / inch, and the second viscosity is greater than or equal to 500 gf / inch; and / or, The second temperature is greater than or equal to 50°C.

3. The display panel according to claim 2, characterized in that, The thermal adhesive layer includes an adhesive layer and a temperature-responsive polymer, wherein, when the thermal adhesive layer has a first viscosity to the display panel body, the temperature-responsive polymer is aggregated on the side surface of the adhesive layer near the display panel body; when the thermal adhesive layer has a second viscosity to the display panel body, the temperature-responsive polymer is dispersed in the adhesive layer.

4. The display panel according to claim 3, characterized in that, The display panel body includes a substrate, and the back panel is bonded to the substrate through the thermosensitive adhesive layer, wherein both the temperature-responsive polymer and the substrate are hydrophilic.

5. The display panel according to claim 4, characterized in that, The temperature-responsive polymer is (PEO-b-PNIPAM)-g-PBAMO, and the substrate is made of polyimide.

6. The display panel according to claim 1, characterized in that, The length of the bending zone is less than or equal to 0.7 mm.

7. A method for manufacturing a display panel, characterized in that, Includes the following steps: A display panel body is provided, the display panel body including a display area, a bending area and a binding area, the bending area being located between the display area and the binding area; A backplate is provided, and a thermal adhesive layer is coated on one side of the backplate at a first temperature to form a backplate. The backplate is then attached to the backlight side of the display panel body through the thermal adhesive layer. The backplate is disposed in the display area, the bending area, and the bonding area. The thermal adhesive layer has a first state in which it has a first viscosity to the display panel body. The back plate in the bending area is subjected to laser processing to remove the back plate and the heat-sensitive adhesive layer in the bending area, forming a first back plate in the display area, a second back plate in the bonding area, and a notch in the bending area; The first backplate of the display area and the second backplate of the bonding area are subjected to defoaming treatment and kept at a second temperature for a preset time to allow the thermal adhesive layer to switch from a first state to a second state. In the second state, the thermal adhesive layer has a second viscosity to the display panel body, wherein the second viscosity is greater than the first viscosity.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The thermal adhesive layer includes an adhesive layer and a temperature-responsive polymer, wherein, in the first state, the temperature-responsive polymer is aggregated on the surface of the adhesive layer near the display panel body; and in the second state, the temperature-responsive polymer is dispersed in the adhesive layer.

9. The method for manufacturing a display panel according to claim 8, characterized in that, The display panel body includes a substrate, and the back panel is bonded to the substrate through the thermosensitive adhesive layer, wherein both the temperature-responsive polymer and the substrate are hydrophilic.

10. The method for manufacturing a display panel according to claim 7, characterized in that, The first temperature is 20-30℃, the first viscosity is 50-100gf / inch, and the laser process is a femtosecond laser process; the second temperature is greater than or equal to 50℃, the second viscosity is greater than or equal to 500gf / inch, and the preset time is greater than or equal to 15min.

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