A printed board device with a component heat dissipation structure embedded therein

Abstract

The present application relates to a kind of printed board devices embedded in component heat dissipation structure, including fluid connector, upper printed board, cooling liquid flow channel plate, lower printed board;The upper surface of lower printed board is provided with recess, and cooling liquid flow channel plate is horizontally installed in the recess;Upper printed board is assembled on lower printed board, and the lower surface of upper printed board is closely attached to the upper surface of lower printed board and the upper surface of cooling liquid flow channel plate, and upper and lower printed board are fixed by adhesive material PP glue and press-fit mode between, and the electrical signal connection of the contact position of upper and lower printed board is realized by metal pad;Fluid connector is installed on the upper surface of upper printed board and fixed between cooling liquid flow channel plate and lower printed board.The present application uses the way of printed board embedded cooling liquid flow channel plate heat dissipation, so that instrument equipment space structure arrangement is more tight, occupies smaller space, more suitable for the development and design of precision instrument equipment, solve the problem of larger space occupied by traditional heat dissipation mode.

Description

TECHNICAL FIELD

[0001] The present application relates to a kind of printed board devices embedded in component heat dissipation structure, mainly suitable for the instrument equipment heat dissipation space is small, cannot be placed in the surface of electronic component air-cooled, liquid-cooled heat dissipation device instrument equipment. BACKGROUND

[0002] With the development of society and the progress of science and technology, the level of industrial automation is higher and higher, printed board is the provider of electrical connection of electronic components, the main advantage of using printed board is that it can greatly reduce wiring and assembly errors, improve automation level and production efficiency.

[0003] At present, printed board component heat dissipation device mainly uses air cooling and liquid cooling as medium to dissipate heat for instrument equipment, the form of air cooling includes fan, heat dissipation tooth, etc., the form of liquid cooling includes cooling liquid flow channel, etc.The realized printed board component heat dissipation device has component surface-mounted heat dissipation fan, surface-mounted heat dissipation tooth, surface-mounted heat dissipation cooling liquid flow channel, etc.Fan, heat dissipation tooth, cooling liquid flow channel are generally large in size, and additional space is needed to place fan, heat dissipation tooth, cooling liquid flow channel and their accessories.When the available space of instrument equipment structure is small, the placement of fan, heat dissipation tooth and cooling liquid flow channel is limited, and the surface-mounted fan, heat dissipation tooth and cooling liquid flow channel of printed board component have the problems of not being able to dissipate heat and not being ideal in heat dissipation, in order to solve the above problems, a device with small space occupation and good heat dissipation is needed to solve the problem of heat dissipation in small space. SUMMARY

[0004] In view of the defects of the prior art, the present application provides a kind of printed board device embedded in component heat dissipation structure, which adopts the mode of printed board embedded cooling liquid flow channel heat dissipation to solve the problem of large space occupation of component surface-mounted heat dissipation fan, surface-mounted heat dissipation tooth and surface-mounted heat dissipation cooling liquid flow channel, and the problem of affecting heat dissipation performance in limited space.

[0005] The present application is realized by the following technical scheme, according to the printed board device embedded in component heat dissipation structure proposed by the present application, which comprises a fluid connector, an upper printed board, a cooling liquid flow channel plate and a lower printed board; the upper surface of the lower printed board is provided with a groove for assembling the cooling liquid flow channel plate, and the cooling liquid flow channel plate is horizontally installed in the groove; the upper printed board is assembled on the lower printed board, and the lower surface of the upper printed board is tightly attached to the upper surface of the lower printed board and the upper surface of the cooling liquid flow channel plate; the upper printed board and the lower printed board are fixed by adhesive material PP glue and compression method, and the cooling liquid flow channel plate is compressed between the upper and lower printed boards; after the compression of the upper printed board, the cooling liquid flow channel plate and the lower printed board, the electrical signal connection between the upper printed board and the lower printed board is realized by metal pads at the contact position of the upper and lower printed boards; the fluid connector is installed on the upper surface of the upper printed board and fixed between the cooling liquid flow channel plate and the lower printed board.

[0006] Through the above scheme, the cooling liquid flow channel plate can be embedded in the printed board, and the cooling liquid flow channel plate is fixedly embedded between the upper printed board and the lower printed board, without the need of external cooling equipment, so that the space structure arrangement of the instrument equipment is more compact, the occupied space is smaller, and the development and design of the precision instrument equipment are more suitable. The problems of the traditional cooling mode, such as large occupied space, frequent disassembly and assembly, and high failure rate, are avoided, the installation space of the cooling equipment is reduced, and the reliability of the equipment and the device is improved.

[0007] The printed board device with the embedded component heat dissipation structure, the shape and size of the groove are the same as those of the cooling liquid flow channel plate, and the surface of the groove is provided with a heat-conducting metal. The heat of the lower printed board is timely transmitted to the cooling liquid flow channel plate through the heat-conducting metal, the heat generated by the printed board is timely taken away through the circulation heat dissipation of the cooling medium in the cooling liquid flow channel plate, and the purpose of heat dissipation and cooling is achieved.

[0008] The printed board device with the embedded component heat dissipation structure, after the cooling liquid flow channel plate is installed in the groove, the upper surface of the cooling liquid flow channel plate is flush with the upper surface of the lower printed board.

[0009] The printed board device with the embedded component heat dissipation structure, the upper surface and the lower surface of the cooling liquid flow channel plate are coated with heat-conducting silicone grease. The heat generated on the upper printed board and the lower printed board is timely transmitted to the cooling liquid flow channel plate through the heat-conducting silicone grease, and the heat generated by the printed board is timely taken away through the cooling liquid flow channel plate.

[0010] The printed board device with the embedded component heat dissipation structure, the fluid connector includes a first fluid connector and a second fluid connector, and the cooling medium flow-through openings are arranged in the first fluid connector and the second fluid connector; the cooling liquid flow channel plate is provided with a liquid inlet and a liquid outlet, the cooling medium flow-through opening of the first fluid connector is connected with the liquid inlet, and the cooling medium flow-through opening of the second fluid connector is connected with the liquid outlet.

[0011] The cooling medium is introduced into the cooling liquid flow channel plate through the fluid connector, and the heat-exchanged cooling medium is introduced out of the cooling liquid flow channel plate, so that the purpose of heat dissipation is achieved.

[0012] Further, the lower printed board is further provided with a threaded hole I, the cooling liquid flow channel board is further provided with a threaded hole II corresponding to the threaded hole I, the upper printed board is provided with an avoiding slot, the first fluid connector and the second fluid connector are both provided with a threaded hole III; the first fluid connector and the second fluid connector are installed in the avoiding slot of the upper printed board and are in communication with the liquid inlet and the liquid outlet of the cooling liquid flow channel board respectively, and the screw is screwed through the threaded hole I, the threaded hole II and finally screwed with the threaded hole III of the first fluid connector and the second fluid connector, so that the first fluid connector and the second fluid connector are assembled and fixed to the upper printed board.

[0013] The foregoing printed board device embedded with a heat dissipation structure of components and elements is further provided with a heating component and element on the upper surface of the contact position of the upper printed board and the cooling liquid flow channel board.

[0014] The foregoing printed board device embedded with a heat dissipation structure of components and elements is further provided with a heating component and element on the upper surface of the contact position of the upper printed board and the cooling liquid flow channel board.

[0015] Further, the heating component and element is arranged on the upper surface of the upper printed board and located between the first fluid connector and the second fluid connector, and the heating component and element at least includes one of a CPU chip, a power supply chip and a power supply module.

[0016] The foregoing printed board device embedded with a heat dissipation structure of components and elements is further provided with a heating component and element on the upper surface of the contact position of the upper printed board and the cooling liquid flow channel board.

[0017] Compared with the prior art, the printed board device embedded with a heat dissipation structure of components and elements has obvious advantages and beneficial effects.

[0018] (1) The traditional air-cooled heat dissipation device needs to be externally provided with a fan, a heat dissipation tooth and a cooling liquid flow channel board, and the heat dissipation is performed by means of air and cooling liquid outside the instrument and equipment.

[0019] The present application adopts the mode of embedding the cooling liquid runner plate in the printed board, recesses are formed in the lower printed board, the cooling liquid runner plate is embedded in the recess, the cooling liquid runner plate is fixed between the upper and lower printed boards after the upper and lower printed boards are pressed together, the fluid connector is arranged on the upper printed board, the cooling medium is introduced and discharged conveniently, the electronic components which are easy to generate heat such as CPU chip, power chip, power module or other high-power heating devices are arranged on the upper surface of the upper printed board at the position contacting with the cooling liquid runner plate, and the heat-conducting silicone grease is coated on the upper and lower surfaces of the cooling liquid runner plate, the heat generated by the printed board and the electronic components is transmitted to the cooling liquid runner plate in time through the heat-conducting silicone grease, and the cooling is performed in time.

[0020] (2) The present application makes the spatial structure arrangement of the instrument and equipment more compact, occupies smaller space, and is more suitable for the development and design of the precision instrument and equipment.

[0021] (3) The present application avoids the problems of frequent disassembly and frequent failure of the external heat dissipation device, reduces the failure rate and maintenance cost of the equipment and device, and improves the reliability of the equipment and device.

[0022] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is the exploded view of the printed board device embedded with the component heat dissipation structure of the present application;

[0024] Figure 2 is the cross-sectional view of the printed board device embedded with the component heat dissipation structure of the present application after assembly;

[0025] Figure 3 is the assembly drawing of the printed board device embedded with the component heat dissipation structure of the present application.

[0026]

Element and symbol description

[0027] 1-heating component;

[0028] 2-fluid connector;

[0029] 2.1-first fluid connector;

[0030] 2.2-second fluid connector;

[0031] 3-upper printed board;

[0032] 4-cooling liquid runner plate;

[0033] 4.1 - Liquid inlet;

[0034] 4.2-Liquid outlet;

[0035] 5- Lower printed circuit board;

[0036] 6-groove;

[0037] 7-Threaded Hole I;

[0038] 8-Threaded Hole II;

[0039] 9-Avoid slotting. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments and accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. The embodiments described and shown in the accompanying drawings can generally be implemented through various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claims, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0041] The present invention provides a printed circuit board device with an embedded heat dissipation structure for components, including a heat-generating component 1, a fluid connector 2, an upper printed circuit board 3, a coolant flow channel plate 4, and a lower printed circuit board 5.

[0042] The lower printed circuit board is placed horizontally on the PCB lamination platform. The upper surface of the lower printed circuit board is machined with a groove 6 for assembling the coolant flow channel plate. The shape and size of the groove are the same as those of the coolant flow channel plate. The surface of the groove is provided with a heat-conducting copper sheet or other heat-conducting metal.

[0043] The upper and lower surfaces of the coolant flow channel plate are coated with thermal grease, and the coolant flow channel plate 4 is horizontally installed in the groove 6. After the coolant flow channel plate 4 is installed in the groove, its upper surface is flush with the upper surface of the lower printed circuit board.

[0044] The above solution allows for the embedding of a coolant channel plate inside the printed circuit board, avoiding the problems of traditional heat dissipation methods, such as the need to reserve external fans and cooling fins in the equipment, the large space occupied by the coolant channel plate, the need for frequent disassembly and assembly, and the high failure rate. This reduces the installation space of the cooling equipment and improves the reliability of the equipment and devices.

[0045] Furthermore, PCB interlayer adhesive is horizontally laid on the upper surface of the lower printed circuit board at the location not in contact with the coolant channel plate (i.e., the location outside the groove of the lower printed circuit board). PP adhesive can be used for this PCB interlayer adhesive. The upper printed circuit board is assembled on the lower printed circuit board, with the lower surface of the upper printed circuit board in close contact with the upper surface of the lower printed circuit board and the upper surface of the coolant channel plate. Thermal grease is applied between the lower surface of the upper printed circuit board and the upper surface of the coolant channel plate. The upper and lower printed circuit boards are fixed together by PP adhesive and pressing, with the coolant channel plate pressed into the groove between the upper and lower printed circuit boards. After the upper printed circuit board, coolant channel plate, and lower printed circuit board are pressed together, holes are drilled at the contact points between the upper and lower printed circuit boards (excluding the coolant channel plate location). Metal pads are created at the drilled locations to achieve electrical signal connection between the upper and lower printed circuit boards.

[0046] By embedding and fixing the coolant flow channel plate between the upper and lower printed circuit boards in the above manner, the cooling equipment does not need to be externally placed, making the spatial structure of the instrument and equipment more compact, occupying less space, and more suitable for the development and design of precision instruments and equipment.

[0047] The fluid connector is mounted on the upper surface of the printed circuit board and fixed between it and the coolant flow channel plate and the lower printed circuit board. The fluid connector includes a first fluid connector 2.1 and a second fluid connector 2.2. Both the first and second fluid connectors have cooling medium flow ports. The coolant flow channel plate has an inlet 4.1 and an outlet 4.2. The cooling medium flow port of the first fluid connector is connected to the inlet, and the cooling medium flow port of the second fluid connector is connected to the outlet. The fluid connectors introduce the cooling medium into the coolant flow channel plate and draw the cooled medium out of the coolant flow channel plate after heat exchange, achieving the purpose of heat dissipation.

[0048] In one embodiment, the lower printed circuit board is further provided with a threaded hole I 7, the coolant flow channel plate is further provided with a threaded hole II 8 corresponding to the threaded hole I, the upper printed circuit board is provided with a clearance slot 9, and both the first fluid connector and the second fluid connector are provided with threaded holes III. After the upper printed circuit board, the coolant flow channel plate and the lower printed circuit board are assembled, the first fluid connector and the second fluid connector are installed in the clearance slot of the upper printed circuit board and communicate with the inlet and outlet of the coolant flow channel plate, respectively. The screws are assembled from the lower surface of the lower printed circuit board upwards, passing through the threaded hole I and the threaded hole II in sequence, and finally being threaded into the threaded hole III on the first fluid connector and the second fluid connector, thereby assembling and fixing the first fluid connector and the second fluid connector to the upper printed circuit board.

[0049] Furthermore, a heating element 1 is also installed on the upper printed circuit board. Specifically, the heating element 1 is located on the upper surface of the upper printed circuit board at the contact position with the coolant flow channel plate.

[0050] In one embodiment, the heating element 1 is disposed between the first fluid connector and the second fluid connector.

[0051] Furthermore, the heating element can be attached to the surface of the upper printed circuit board by means of, but not limited to, surface mount soldering, through-hole soldering, screw fastening, etc.

[0052] Furthermore, the heat-generating components are electronic components that require heat dissipation and cooling, such as CPU chips, power chips, power modules, or other high-power heat-generating devices.

[0053] The upper and lower printed circuit boards are printed circuit boards laminated together during the production process at a printed circuit board factory. In one embodiment, both the lower surface of the upper printed circuit board and the upper surface of the lower printed circuit board are covered with thermally conductive copper foil or other thermally conductive metal. The first fluid connector and the second fluid connector are a coolant inlet connector and a coolant outlet connector for the printed circuit board, respectively.

[0054] Although not shown in the diagram, those skilled in the art will recognize that the coolant flow channel plate should contain microchannels for the flow of the cooling medium, which can be rectangular or circular. The cooling medium enters the coolant flow channel plate from the first fluid connector, flows within the microchannels of the coolant flow channel plate, and finally enters the second fluid connector from the outlet. Through the circulation of the cooling medium, the heat generated by the heat-generating components is carried away, achieving the purpose of heat dissipation for the printed circuit board.

[0055] The present invention uses the above solution to embed a coolant flow channel plate inside the printed circuit board for heat dissipation, which makes the spatial structure of the instrument more compact, occupies less space, and is more suitable for the development and design of precision instruments and equipment.

[0056] The above description is merely an embodiment of the present invention and is not intended to limit the present invention in any way. The present invention can also have other embodiments based on the above structure and function, which will not be listed hereafter. Therefore, any simple modifications, equivalent changes, and alterations made by those skilled in the art to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A printed circuit board device with a heat dissipation structure embedded in a component, characterized in that... The system includes a fluid connector (2), an upper printed circuit board (3), a coolant channel plate (4), and a lower printed circuit board (5). The upper surface of the lower printed circuit board is provided with a groove (6) for assembling the coolant channel plate, and the coolant channel plate (4) is horizontally installed in the groove (6). The upper printed circuit board (3) is assembled on the lower printed circuit board, and the lower surface of the upper printed circuit board is in close contact with the upper surface of the lower printed circuit board and the upper surface of the coolant channel plate. The upper and lower printed circuit boards are fixed together by adhesive PP glue and pressing, and the coolant channel plate is pressed in the groove between the upper and lower printed circuit boards. After the upper printed circuit board, coolant channel plate, and lower printed circuit board are pressed together, the electrical signal connection between the upper and lower printed circuit boards is achieved by metal pads at the contact position of the upper and lower printed circuit boards. The fluid connector is installed on the upper surface of the upper printed circuit board and fixed between the coolant channel plate and the lower printed circuit board.

2. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 1, characterized in that... The groove has the same shape and size as the coolant flow channel plate, and the surface of the groove is provided with thermally conductive metal.

3. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 1, characterized in that... After the coolant flow channel plate is installed in the groove, the upper surface of the coolant flow channel plate is flush with the upper surface of the lower printed circuit board.

4. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 1, characterized in that... The upper and lower surfaces of the coolant flow channel plate are coated with thermally conductive silicone grease.

5. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 1, characterized in that... The fluid connector includes a first fluid connector (2.1) and a second fluid connector (2.2), and both the first fluid connector and the second fluid connector are provided with a cooling medium flow port; the coolant flow channel plate is provided with an inlet (4.1) and an outlet (4.2), the cooling medium flow port of the first fluid connector is connected to the inlet, and the cooling medium flow port of the second fluid connector is connected to the outlet.

6. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 5, characterized in that... The lower printed circuit board is also provided with threaded hole I (7), and the coolant flow channel board is also provided with threaded hole II (8) corresponding to threaded hole I. The upper printed circuit board is provided with clearance slot (9), and the first fluid connector and the second fluid connector are both provided with threaded hole III. The first fluid connector and the second fluid connector are installed in the clearance slot of the upper printed circuit board and are respectively connected to the inlet and outlet of the coolant flow channel board. The screw passes through threaded hole I and threaded hole II in sequence and is finally screwed into threaded hole III on the first fluid connector and the second fluid connector, thereby assembling and fixing the first fluid connector and the second fluid connector to the upper printed circuit board.

7. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 5, characterized in that... Heating components are also installed on the upper surface of the contact position between the upper printed circuit board and the coolant flow channel plate (1).

8. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 7, characterized in that... The heating components are attached to the surface of the upper printed circuit board by means of surface mount soldering, through-hole soldering, or screw fastening.

9. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 7, characterized in that... The heat-generating component is disposed on the upper surface of the printed circuit board and located between the first fluid connector and the second fluid connector. The heat-generating component includes at least one of the following: CPU chip, power chip, and power module.

10. The printed circuit board device embedded in the heat dissipation structure of a component as described in claim 1, characterized in that... The coolant flow channel plate is equipped with rectangular or circular microchannels for the flow of cooling medium.

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