Inductor component and method of manufacturing the same

Abstract

The present invention relates to an inductor component and a method for manufacturing the same. The inductor component comprises: a base body formed by stacking a plurality of insulating layers; a coil disposed within the base body and wound into a spiral shape extending in the direction in which the insulating layers are stacked; and a substrate disposed on the upper surface of the base body, wherein the coil comprises: a plurality of coil wirings disposed along the stacking direction and wound along a plane perpendicular to the stacking direction; and a connecting wiring connecting the ends of the plurality of coil wirings to each other, wherein the coil wirings comprise a winding portion wound on a plane and a lead portion extending from the end of the winding portion to the connecting wiring. The connecting wirings are disposed in plurality along the stacking direction, wherein the lowest position of the upper surface of the topmost connecting wiring in the stacking direction is lower than the position of the bottom surface of the winding portion of the topmost coil wiring, and the lead portion of the topmost coil wiring extends from the plane in which the winding portion of the topmost coil wiring is disposed to the lower side in the stacking direction, is connected to the topmost connecting wiring, and is inclined relative to the plane.

Description

Technical Field

[0001] The present invention relates to an inductor component and a method for manufacturing the same. Background Art

[0002] Previously, an inductor component described in Japanese Patent Application Laid-Open No. 2016-139786 (Patent Document 1) existed. This inductor component comprises: a base formed from a plurality of laminated insulating layers; and a coil disposed within the base and wound into a spiral extending along the direction in which the insulating layers are laminated. The coil comprises: a plurality of coil wirings arranged along the laminated direction and wound along a plane perpendicular to the laminated direction; and a plurality of connecting wirings interconnecting the ends of the plurality of coil wirings.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2016-139786

[0004] However, in conventional inductor components, the individual connecting wirings are arranged so as to be staggered when viewed in the stacking direction of the insulating layers. Consequently, the space available for the coil wiring in a plane perpendicular to the stacking direction is reduced, resulting in a reduction in the number of turns of the coil wiring or a reduction in the coil wiring diameter, which can reduce the efficiency of inductance acquisition. Summary of the Invention

[0005] Therefore, an object of the present disclosure is to provide an inductor component capable of improving the efficiency of obtaining inductance.

[0006] In order to solve the above-mentioned problems, an inductor component as one embodiment of the present invention comprises: a base body, which is formed by stacking multiple insulating layers; a coil, which is arranged in the above-mentioned base body and wound into a spiral shape along the stacking direction of the above-mentioned insulating layers; and a substrate, which is arranged on the upper surface of the above-mentioned base body, the above-mentioned coil has: a coil wiring, which is arranged in plurality along the above-mentioned stacking direction and wound along a plane orthogonal to the above-mentioned stacking direction; and a connecting wiring, which connects the ends of the multiple coil wirings to each other, the above-mentioned coil wiring has: a winding portion, which is wound on the above-mentioned plane; and a lead portion, which is led out from the end of the above-mentioned winding portion to the above-mentioned connecting wiring, the above-mentioned connecting wiring is arranged in plurality along the above-mentioned stacking direction, in the above-mentioned stacking direction, the lowest position of the upper surface of the above-mentioned connecting wiring of the uppermost layer in the above-mentioned stacking direction is lower than the position of the bottom surface of the above-mentioned winding portion in the above-mentioned coil wiring of the uppermost layer, the above-mentioned lead portion of the above-mentioned coil wiring of the uppermost layer is led out from the above-mentioned plane where the above-mentioned winding portion of the above-mentioned coil wiring of the uppermost layer is arranged to the lower side of the above-mentioned stacking direction, is connected to the above-mentioned connecting wiring of the uppermost layer, and is inclined relative to the above-mentioned plane.

[0007] According to the above embodiment, since the plurality of connection wirings are arranged along the stacking direction, the space on the plane for the coil wiring arrangement can be increased. Therefore, the number of turns of the coil wiring can be increased, or the diameter of the coil wiring can be increased, thereby improving the efficiency of inductance acquisition.

[0008] In addition, the lowest position of the upper surface of the topmost connecting wiring is lower than the bottom surface of the winding portion of the topmost coil wiring, so the thickness of the insulating layer on the topmost connecting wiring is greater than the thickness of the insulating layer on the winding portion of the topmost coil wiring. This can suppress the reduction in the adhesion between the base and the substrate provided on the base, which may occur when multiple connecting wirings are arranged along the stacking direction.

[0009] Furthermore, by effectively utilizing the larger space on the plane where the coil wiring is located, increasing the number of turns in the coil wiring's windings and maximizing the size of the coil wiring on the plane, there is a risk that the lead-out portion's length will be shortened, or the efficiency of inductance acquisition will be reduced. According to the above embodiment, the lead-out portion of the topmost coil wiring is tilted relative to the plane. This ensures the lead-out portion's length, thereby minimizing any reduction in inductance acquisition efficiency.

[0010] In one embodiment of the inductor component, preferably, the lowest position of the upper surface of the uppermost connection wiring is higher than the bottom surface of the winding portion of the coil wiring in a layer next to the uppermost layer in the stacking direction.

[0011] According to the above embodiment, the height difference between the winding portion of the uppermost connection wiring and the uppermost coil wiring can be reduced, and disconnection of the connection wiring and the lead portion can be suppressed.

[0012] Preferably, in one embodiment of the inductor component, the lead-out portion of the coil wiring at the lowest layer in the stacking direction is parallel to the plane, and the higher the lead-out portion of the coil wiring is located in the stacking direction, the greater the inclination angle relative to the plane.

[0013] Here, the "tilt angle" refers to the angle that becomes an acute angle between the line connecting the two ends of the center line of the lead-out part and the above-mentioned plane in a cross section parallel to the stacking direction and intersecting all the connecting wirings arranged along the stacking direction and all the lead-out parts connected to these connecting wirings.

[0014] According to the above embodiment, the winding portion of the bottom-most coil wiring and the bottom-most connecting wiring are arranged on the same plane. Therefore, compared to a case where they are not arranged on the same plane, the winding portion of the bottom-most coil wiring and the bottom-most connecting wiring can be manufactured using the same process, thereby reducing the overall number of process steps. In addition, the lead-out portion of the coil wiring has a larger inclination angle the further it is located in the upper layer in the stacking direction, thereby more effectively ensuring the line length of the lead-out portion.

[0015] In one embodiment of the inductor component, preferably, in the stacking direction, a thickness of the insulating layer between the winding portions of the adjacent coil wirings is smaller than a thickness of the winding portions.

[0016] The connection wiring is formed by filling a conductor portion in a through-hole opening provided in the insulating layer. At this time, control is performed so that a recess is formed on the upper surface of the connection wiring. If the depth of the recess becomes too deep, the possibility of disconnection of the connection wiring and the coil wiring becomes higher. According to the above embodiment, the thickness of the insulating layer between the winding portions of adjacent coil wirings is relatively thin, so the depth of the through-hole opening also becomes relatively small. Therefore, the depth of the recess of the connection wiring can be prevented from becoming too deep, thereby preventing disconnection of the connection wiring and the coil wiring.

[0017] In one embodiment of the inductor component, preferably, the width of the connection wiring is larger than the width of the winding portion.

[0018] Here, the width of the connection wiring refers to the diameter of the inscribed circle within the outer periphery of the connection wiring when viewed from the stacking direction. The width of the winding portion refers to the width in a direction perpendicular to the extending direction of the winding portion when viewed from the stacking direction.

[0019] According to the above embodiment, the width of the connection wiring is larger than the width of the winding portion of the coil wiring, thereby increasing the connection strength between the connection wirings and improving the electromigration resistance.

[0020] Preferably, in one embodiment of the inductor component, there are a plurality of the coils, a plurality of the connection wirings arranged along the stacking direction are connected to each other to form a stacked body, and each of the plurality of coils includes the stacked body.

[0021] Here, “there are a plurality of coils” means that a plurality of coils that are electrically independent of each other are present in the inductor component. According to the above embodiment, a common mode choke coil, a transformer, an inductor array, and the like can be configured.

[0022] Preferably, in one embodiment of the inductor component, the plurality of coils include a first coil and a second coil having different line lengths, and a width of a portion of the coil wiring of the first coil is different from a width of the coil wiring of the second coil.

[0023] According to the above embodiment, the characteristics of the first coil and the second coil can be matched.

[0024] In one embodiment of the inductor component, preferably, each of the laminated bodies has the same thickness.

[0025] According to the above embodiment, since the thickness of each laminated body is the same, it is possible to reduce the variation in the conductor distribution within the inductor component and reduce the residual stress in the inductor component, thereby improving the strength of the inductor component.

[0026] Preferably, in one embodiment of the inductor component, the multiple coils include a first coil and a second coil, in the first coil, the winding portion of the coil wiring is spirally wound, and the shortest distance between the winding portion of the first coil and the stacked body of the second coil is greater than the distance between adjacent turns of the winding portion of the first coil.

[0027] The voltage difference between adjacent turns of the winding portion of the first coil is generally considered to be the same potential, but different voltages may be applied to the first coil and the second coil. According to the above embodiment, the shortest distance between the winding portion of the first coil and the laminate is greater than the distance between adjacent turns of the winding portion of the first coil, thereby improving the insulation resistance between the coils.

[0028] Preferably, in one embodiment of the inductor component, the inductor component further includes a dummy wiring connected to an end portion of the winding portion, wherein the dummy wiring extends from the end portion of the winding portion along an extending direction of the winding portion and does not constitute a current path.

[0029] According to the above embodiment, since the dummy wiring is further provided, it is possible to suppress the lowering of the insulating layer stacked on the dummy wiring, and to suppress the disconnection of the coil wiring provided above the dummy wiring.

[0030] Preferably, in one embodiment of the inductor component, the dummy wiring is not connected to the coil wiring of the uppermost layer.

[0031] According to the above embodiment, the magnetic circuit can be expanded by not providing the dummy wiring corresponding to the coil wiring of the uppermost layer.

[0032] Preferably, in one embodiment of the inductor component, the line length of the above-mentioned dummy wiring connected to the end of the above-mentioned winding portion in the above-mentioned coil wiring of the lowest layer in the above-mentioned stacking direction is shorter than the line length of the above-mentioned dummy wiring connected to the end of the above-mentioned winding portion in the above-mentioned coil wiring other than the above-mentioned lowest layer of coil wiring.

[0033] According to the above embodiment, the magnetic circuit can be expanded by relatively shortening the line length of the dummy wiring corresponding to the coil wiring of the lowermost layer.

[0034] Preferably, in one embodiment of the inductor component, the above-mentioned substrate is a magnetic substrate, and the above-mentioned base has a through hole penetrating along the above-mentioned stacking direction in an area radially inward of the above-mentioned coil, and also has an internal magnetic circuit component, which is arranged in the above-mentioned through hole to constitute an internal magnetic circuit, and the above-mentioned internal magnetic circuit component contains a magnetic material different from the above-mentioned substrate.

[0035] According to the above embodiment, since the inner magnetic path member is further provided, the effective relative magnetic permeability is improved, and the efficiency of obtaining inductance can be improved.

[0036] Preferably, in one embodiment of the inductor component, the above-mentioned internal magnetic circuit component is composed of a composite material of metal magnetic powder and resin, and in the above-mentioned stacking direction, a close-bonding layer is provided between the above-mentioned winding portion of the above-mentioned topmost coil wiring and the above-mentioned substrate, and the close-bonding layer is composed of a composite material of metal magnetic powder having an average particle size of less than 1 / 2 of the average particle size of the above-mentioned metal magnetic powder, and resin.

[0037] According to the above embodiment, the inner magnetic circuit member is composed of a composite material of metal magnetic powder and resin, thereby increasing the effective relative magnetic permeability and thus improving the efficiency of inductance acquisition. In addition, since the above-mentioned adhesion layer contains resin, the adhesion between the substrate and the base can be improved.

[0038] Preferably, in one embodiment of the inductor component, the inductor component further includes a substrate provided on the lower surface of the base body and having a thickness thicker than the substrate.

[0039] According to the above embodiment, when the substrates provided on the upper surface and the lower surface of the base are magnetic substrates, a closed magnetic circuit can be formed.

[0040] In one embodiment of the inductor component, preferably, the thickness of the winding portion located on the upper side in the stacking direction is thinner than the thickness of the winding portion located on the lower side.

[0041] According to the above embodiment, unevenness of the upper insulating layer can be suppressed.

[0042] In one embodiment of a method for manufacturing an inductor component, the method includes the following steps: a step of stacking a first coil wiring and a first connecting wiring on a first insulating layer; a step of stacking a second insulating layer on the first coil wiring and the first connecting wiring in a manner that at least a portion of the upper surface of the first connecting wiring is exposed; and a step of stacking the second coil wiring and the second connecting wiring on the second insulating layer in a manner that the second connecting wiring contacts the upper surface of the first connecting wiring, forming the second coil wiring to be inclined toward a lead-out portion from which the second connecting wiring is led out.

[0043] According to the above-described embodiment, the inductor component according to the embodiment of the present invention can be manufactured.

[0044] According to the inductor component as one embodiment of the present disclosure, it is possible to improve the efficiency of obtaining inductance. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a perspective view showing the appearance of the inductor component according to the first embodiment.

[0046] Figure 2 is a perspective plan view of the inductor components.

[0047] Figure 3 is an exploded plan view of the inductor components.

[0048] Figure 4A yes Figure 3 Magnified view of area A.

[0049] Figure 4B yes Figure 3 Magnified view of area B.

[0050] Figure 5 yes Figure 2 A-A' cross-sectional view.

[0051] Figure 6 yes Figure 5 Magnified view of region C.

[0052] Figure 7 yes Figure 2 BB' cross-sectional view.

[0053] Figure 8 yes Figure 2 C-C' cross-sectional view.

[0054] Figure 9A This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0055] Figure 9B This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0056] Figure 9C This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0057] Figure 9D This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0058] Figure 9E This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0059] Figure 9F This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0060] Figure 10 It is a perspective plan view showing a second embodiment of the inductor component.

[0061] Figure 11 is an exploded plan view of the inductor components.

[0062] Figure 12 yes Figure 10 D-D' cross-sectional view.

[0063] Figure 13 It is a perspective plan view showing a third embodiment of the inductor component.

[0064] Figure 14 yes Figure 13 E-E' cross-sectional view.

[0065] Figure 15 It is a cross-sectional view showing a modified example of the third embodiment of the inductor component.

[0066] Figure 16 It is a cross-sectional view showing a modified example of the third embodiment of the inductor component.

[0067] Figure 17 It is a cross-sectional view showing a modified example of the third embodiment of the inductor component.

[0068] Figure 18A This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0069] Figure 18B This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0070] Figure 18C This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0071] Figure 18D This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0072] Figure 18EThis is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0073] Figure 18F This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0074] Figure 18G This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0075] Figure 18H This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0076] Figure 18J This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0077] Figure 18K This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0078] Figure 18L This is an explanatory diagram illustrating a method for manufacturing an inductor component.

[0079] Description of Reference Numerals

[0080] 1, 1A, 1B, 1C, 1D, 1E…inductor component; 10…base; 10a…through hole; 11…insulating layer; 11a…through hole opening; 21–24…first–fourth coil wiring; 26–27…sixth–seventh coil wiring; 28, 28A…first coil; 29, 29A…second coil; 211, 221, 231, 241, 261, 271…winding portion; 212, 22 2, 232, 242, 262, 272…lead-out portion; 251-258…connecting wiring; 31-33…dummy wiring; 41-44…connecting electrodes; 51-54…external electrodes; 61…first substrate; 62…second substrate; 81, 81E, 82, 82E…close-contact layer; 91, 91E…inner magnetic circuit member; 2571…through-hole pad; 2572…through-hole; L1, L2…laminated body. DETAILED DESCRIPTION

[0081] Hereinafter, an inductor component as one embodiment of the present disclosure will be described in detail based on the illustrated embodiment. Note that the drawings include some schematic components and may not reflect actual dimensions or ratios.

[0082] (First embodiment)

[0083] Figure 1 It is a perspective view showing a first embodiment of the inductor component. Figure 2 is a perspective plan view of the inductor components. Figure 3This is an exploded plan view of an inductor component. As shown in the figure, the stacking direction of the insulating layer 11 (hereinafter referred to as the "stacking direction") is defined as the Z direction. When viewed from the Z direction, the direction along which the long sides of the base 10 extend is defined as the X direction, and the direction along which the short sides extend is defined as the Y direction. In this specification, the stacking direction (Z direction) is referred to as the vertical direction. Figure 3 The stacking direction indicates the order in the process only, and the top and bottom of the inductor component 1 may be reversed (ie, the external electrode is located on the upper side).

[0084] like Figures 1 to 3 As shown, the inductor component 1 includes: a base 10; a first substrate 61 disposed on the lower surface of the base 10; a second substrate 62 disposed on the upper surface of the base 10; a first coil 28 and a second coil 29 disposed within the base 10; a first connecting electrode 41 and a fourth connecting electrode 44 disposed on the base 10 and electrically connected to the first coil 28; a second connecting electrode 42 and a third connecting electrode 43 disposed on the base 10 and electrically connected to the second coil 29; and first, second, third, and fourth external electrodes 51, 52, 53, and 54 (the fourth external electrode 54 is not shown) disposed on the first substrate 61. The first connecting electrode 41 is connected to the first external electrode 51, the second connecting electrode 42 is connected to the second external electrode 52, the third connecting electrode 43 is connected to the third external electrode 53, and the fourth connecting electrode 44 is connected to the fourth external electrode 54.

[0085] Inductor component 1 is electrically connected to wiring on a circuit board (not shown) via first to fourth connection electrodes 41 to 44 and first to fourth external electrodes 51 to 54. Inductor component 1 is used, for example, as a common-mode choke coil in electronic equipment such as personal computers, DVD players, digital cameras, TVs, mobile phones, automotive electronics, and medical and industrial machinery.

[0086] The substrate 10 includes multiple insulating layers 11 stacked together. The insulating layers 11 are composed of an insulating material primarily composed of, for example, resin, ferrite, or glass. Furthermore, the substrate 10 may be fired, for example, to define the interfaces between the multiple insulating layers 11. The substrate 10 is formed into a generally rectangular parallelepiped shape.

[0087] The first substrate 61 and the second substrate 62 are, for example, ferrite substrates. The first substrate 61 and the second substrate 62 are quadrilateral in shape when viewed from the stacking direction. Preferably, the thickness of the first substrate 61 is thicker than that of the second substrate 62. In addition, the ferrite material used for the first substrate 61 and the second substrate 62 can be a magnetic body or a non-magnetic body. If it is a magnetic body, the effective relative magnetic permeability becomes higher, thereby improving the efficiency of inductance acquisition. In addition, when the first substrate 61 and the second substrate 62 are magnetic bodies, a closed magnetic circuit can be formed. The first substrate 61 and the second substrate 62 can also be made of materials other than ferrite, such as alumina and glass. In addition, the first substrate 61 and the second substrate 62 can increase the strength of the inductor component 1.

[0088] The first to fourth connecting electrodes 41-44 and the first to fourth external electrodes 51-54 are made of a conductive material such as Ag, Cu, Au, or an alloy primarily composed of these. The first to fourth connecting electrodes 41-44 are embedded in the corners of the base 10 along the stacking direction. The first to fourth external electrodes 51-54 extend from the bottom surface to the side surface of the first substrate 61.

[0089] Electrical connection of the inductor component 1 is achieved by configuring one of the first and fourth external electrodes 51 and 54 as an input terminal and the other as an output terminal, and configuring one of the second and third external electrodes 52 and 53 as an input terminal and the other as an output terminal. When viewed in the stacking direction, the first and fourth external electrodes 51 and 54 are located on opposite sides of the quadrilateral shape of the first substrate 61, while the second and third external electrodes 52 and 53 are located on opposite sides of the quadrilateral shape of the first substrate 61. This arrangement allows the input and output terminals to be located on opposite sides, simplifying wiring design.

[0090] The first coil 28 includes a first coil wiring 21 and a fourth coil wiring 24, and a first connection wiring 251, a second connection wiring 252, a third connection wiring 253, and a fourth connection wiring 254. The first coil wiring 21 and the fourth coil wiring 24 are arranged along the stacking direction and wound along a plane perpendicular to the stacking direction. The fourth coil wiring 24 is arranged above the first coil wiring 21 in the stacking direction. The first end of the first coil wiring 21 is connected to the first connection electrode 41, and the first end of the fourth coil wiring 24 is connected to the fourth connection electrode 44. The first to fourth connection wirings 251-254 are stacked in sequence and connected to each other. The first connection wiring 251 is connected to the second end of the first coil wiring 21. The fourth connection wiring 254 is connected to the second end of the fourth coil wiring 24. With the above configuration, the first connection electrode 41, the first coil wiring 21, the first to fourth connection wirings 251-254, the fourth coil wiring 24, and the fourth connection electrode 44 are connected in sequence, electrically connecting the first coil 28 to the first connection electrode 41 and the fourth connection electrode 44. In addition, the "plane" mentioned in this specification includes not only a completely flat surface but also a slightly curved surface. In addition, "winding along a plane" means not only winding on a plane but also winding in a manner that moves up and down based on the plane.

[0091] The first coil wiring 21 is made of, for example, the same conductive material as the first to fourth connection electrodes 41 to 44 and the first to fourth external electrodes 51 to 54. The first coil wiring 21 includes a winding portion 211 wound in a plane perpendicular to the stacking direction, and a lead portion 212 extending from a first end of the winding portion 211 to the first connection wiring 251.

[0092] The winding portion 211 is a planar spiral wound on a plane. The winding portion 211 has one or more turns, but may also have a winding number of less than one. The second end of the winding portion 211 is connected to the first connection electrode 41 .

[0093] The lead portion 212 is a portion extending from the first end portion of the winding portion 211 to a portion connected to the first connection wiring 251. The lead portion 212 is formed integrally with the winding portion 211.

[0094] The fourth coil wiring 24, like the first coil wiring 21, includes a winding portion 241 wound on a plane perpendicular to the stacking direction, and a lead portion 242 extending from a first end of the winding portion 241 to the fourth connection wiring 254. The winding portion 241 and the lead portion 242 of the fourth coil wiring 24 have the same structures as the winding portion 211 and the lead portion 212 of the first coil wiring 21, respectively, and therefore a detailed description thereof will be omitted.

[0095] The first to fourth connecting wirings 251 to 254 are made of, for example, the same conductive material as the first to fourth connecting electrodes 41 to 44 and the first to fourth external electrodes 51 to 54. The first to fourth connecting wirings 251 to 254 are each arranged on a plane perpendicular to the stacking direction. The shape of the first to fourth connecting wirings 251 to 254 is not particularly limited. In this embodiment, the first to fourth connecting wirings 251 to 254 each have an oblong shape extending in the Y direction when viewed in the stacking direction.

[0096] The second coil 29 has a second coil wiring 22 and a third coil wiring 23, and a sixth connection wiring 256 and a seventh connection wiring 257. The second coil wiring 22 and the third coil wiring 23 are arranged along the stacking direction and are wound along a plane orthogonal to the stacking direction. The second coil wiring 22 and the third coil wiring 23 are arranged between the first coil wiring 21 and the fourth coil wiring 24 in the stacking direction. The third coil wiring 23 is arranged on the upper side of the second coil wiring 22 in the stacking direction. The first end of the second coil wiring 22 is connected to the second connection electrode 42, and the first end of the third coil wiring 23 is connected to the third connection electrode 43. The sixth connection wiring 256 and the seventh connection wiring 257 are stacked in sequence and connected to each other. The sixth connection wiring 256 is connected to the second end of the second coil wiring 22. The seventh connection wiring 257 is connected to the second end of the third coil wiring 23. Through the above configuration, the second connection electrode 42, the second coil wiring 22, the sixth connection wiring 256, the seventh connection wiring 257, the third coil wiring 23, and the third connection electrode 43 are sequentially connected, and the second coil 29 is electrically connected to the second connection electrode 42 and the third connection electrode 43. The second coil 29 and the first coil 28 are electrically independent of each other, forming a common-mode choke coil. Alternatively, there may be three or more coils, in which case the coils are electrically independent of each other.

[0097] The second coil wiring 22 includes a winding portion 221 wound on a plane perpendicular to the stacking direction, and a lead portion 222 extending from the first end of the winding portion 221 to the sixth connection wiring 256. The third coil wiring 23 includes a winding portion 231 wound on a plane perpendicular to the stacking direction, and a lead portion 232 extending from the first end of the winding portion 231 to the seventh connection wiring 257. The winding portion 221 and the winding portion 231 have the same structure as the winding portion 211 of the first coil wiring 21, and therefore detailed description thereof will be omitted. The lead portions 222 and the lead portions 232 have the same structure as the lead portion 212 of the first coil wiring 21, and therefore detailed description thereof will be omitted. The sixth connection wiring 256 and the seventh connection wiring 257 have the same structure as the first to fourth connection wirings 251 to 254, and therefore detailed description thereof will be omitted.

[0098] Next, the positional relationship between the winding portion and the lead portion of the coil wiring and the connection wiring in a plane will be described using the third coil wiring 23 as an example. The following description is also the same for the first coil wiring 21, the second coil wiring 22, and the fourth coil wiring 24. Figure 4A yes Figure 3 A magnified view of area A. Figure 4A As shown, the lead portion 232 of the third coil wiring 23 extends from the end E ( Figure 4A The portion indicated by the oblique lines in the middle, that is, the end portion E of the portion constituting a turn of the third coil wiring 23 extends and is connected to the seventh connecting wiring 257. The lead portion 232 and the seventh connecting wiring 257 are formed integrally.

[0099] The seventh connecting wiring 257 includes a through-hole pad 2571 and a through-hole 2572. The through-hole pad 2571 is the main part of the seventh connecting wiring 257. When viewed from the stacking direction, the through-hole pad 2571 is an oblong shape extending along the Y direction. When viewed from the stacking direction, the through-hole 2572 is an oblong shape extending along the Y direction, and its diameter is smaller than that of the through-hole pad 2571. The through-hole 2572 is a part that extends from a part of the lower surface of the through-hole pad 2571 toward the lower side in the stacking direction and connects the adjacent through-hole pads in the stacking direction. The through-hole pad 2571 and the through-hole 2572 are formed as one body. In the seventh connecting wiring 257, the through-hole pad 2571 is connected to the lead-out portion 232. In addition, since the through-hole and the through-hole pad are formed as one body, it is sometimes impossible to confirm the interface.

[0100] The width W2 of the seventh connecting wiring 257 is preferably greater than the width W1 of the winding portion 231. This increases the connection strength between the connecting wirings and improves electromigration resistance. The width W2 of the seventh connecting wiring 257 refers to the diameter of the inscribed circle N that is contained within the outer periphery of the seventh connecting wiring 257 when viewed in the stacking direction. The width W1 of the winding portion 231 refers to the width in a direction perpendicular to the extending direction of the winding portion 231 when viewed in the stacking direction.

[0101] Figure 4B yes Figure 3 The winding portion 231 and the third connecting wiring 253 are provided on the same insulating layer 11. The winding portion 231 and the third connecting wiring 253 are electrically independent. Figure 4BAs shown, the shortest distance D1 between the winding portion 231 and the third connecting wiring 253 (i.e., the shortest distance between the winding portion 231 and the stacked body composed of the first to fourth connecting wirings 251 to 254) is preferably greater than the distance D2 between adjacent turns of the winding portion 231. The third connecting wiring 253 is a part of the first coil 28, and the winding portion 231 is a part of the second coil 29. The first coil 28 and the second coil 29 are electrically independent and sometimes have different voltages applied to them. According to the above structure, the shortest distance between the winding portion 231 of the first coil 28 and the stacked body composed of the connecting wiring of the second coil 29 is greater than the distance between adjacent turns of the winding portion 231, so that even when different voltages are applied to the first coil 28 and the second coil 29, the insulation resistance between the first coil 28 and the second coil 29 can be improved.

[0102] Next, the positional relationship between the winding portion and the lead portion of the coil wiring and the connection wiring in the lamination direction will be described. Figure 5 yes Figure 2 A-A' cross-sectional view. Figure 5 In FIG, the cross section of the substrate 10 is not hatched. The same is true in other cross-sectional views. Figure 5 As shown, the first to fourth connecting wirings 251 to 254 are stacked in sequence from the lower side to the upper side in the stacking direction, forming a stack L1. Thus, the stack L1 electrically connects the first coil wiring 21 and the fourth coil wiring 24. Similarly, the fifth to eighth connecting wirings 255 to 258 are stacked in sequence from the lower side to the upper side in the stacking direction, forming a stack L2. Thus, the stack L2 electrically connects the second coil wiring 22 and the third coil wiring 23. The stack L1 and the stack L2 are electrically independent. In this way, by providing a stack, multiple coil wirings can be connected, and a common mode choke coil, a transformer, an inductor array, etc. can be formed.

[0103] The first connecting wiring 251 and the fifth connecting wiring 255 are provided on the same insulating layer 11. The second connecting wiring 252 and the sixth connecting wiring 256 are provided on the same insulating layer 11. The third connecting wiring 253 and the seventh connecting wiring 257 are provided on the same insulating layer 11. The fourth connecting wiring 254 and the eighth connecting wiring 258 are provided on the same insulating layer 11. In addition, the fifth connecting wiring 255 and the eighth connecting wiring 258 do not constitute a current path for the second coil 29. In other words, the fifth connecting wiring 255 and the eighth connecting wiring 258 are not included in the structure of the second coil 29, but it is preferable that the thickness of the laminate L1 and the thickness of the laminate L2 are made the same by providing the fifth connecting wiring 255 and the eighth connecting wiring 258. Through this structure, the deviation of the conductor distribution within the inductor component can be reduced, and the residual stress of the inductor component 1 can be reduced. As a result, the strength of the inductor component 1 can be improved.

[0104] Figure 6 yes Figure 5 An enlarged view of the C area. The second to fourth connecting wirings 252 to 254 are formed by filling a conductor portion in a through-hole opening provided in the insulating layer 11. Specifically, the second to fourth connecting wirings 252 to 254 are formed on the through-hole opening and the insulating layer 11 around the through-hole opening. At this time, in each connecting wiring, control is performed so that a recess is formed on the upper surface of the portion corresponding to the through-hole opening. Specifically, for example, the interval between the winding portion 211 to 231 and the first to third connecting wirings 251 to 253 is made wider than the wiring interval within the winding portion 211 to 231, or the width of the first to third connecting wirings 251 to 253 is made larger than the width of the winding portion 211 to 231. Thus, the opening diameter when the through-hole opening is formed in the insulating layer 11 covering the winding portion 231 and the third connecting wiring 253 can be increased. Here, in the photolithography process, the exposure area (the opening diameter of the photoresist) is positively correlated with the depth that can be exposed (the depth to which the light in the insulating layer 11 reaches), that is, the opening diameter of the through hole is positively correlated with the opening depth. Therefore, if the opening diameter of the through hole is small, the through hole cannot be deepened, so only a thin insulating layer 11 can be stacked. On the other hand, as mentioned above, if the opening diameter of the through hole can be increased, the thickness of the insulating layer 11 can be increased, and a sufficiently deep through hole opening can be formed to connect to the third connecting wiring 253 of the lower layer. Therefore, the thickness of the insulating layer 11 covering the winding portion 231 and the third connecting wiring 253 can be thickened. In this way, if a through hole opening is formed in an insulating layer 11 having a thickness greater than a certain value, the height difference between the upper surface of the insulating layer 11 and the bottom surface of the through hole opening can be increased. Therefore, when the second to fourth coil wirings 22 to 24 and the second to fourth connecting wirings 252 to 254 having the same thickness are formed on the insulating layer 11 and in the through-hole opening by printing and plating, clear recesses can be formed in the second to fourth connecting wirings 252 to 254.

[0105] Alternatively, as a method of forming the recess, the first to third connecting wirings 251 to 253 of the lower layer exposed from the through-hole opening may be partially dissolved from the upper surface side by a wet process such as desmearing to lower the bottom surface of the through-hole opening. Figure 6As shown, recesses C1, C2, and C3 are provided on the upper surfaces of the second to fourth connecting wirings 252 to 254, excluding the first connecting wiring 251, which is the bottom layer, of the first to fourth connecting wirings 251 to 254 that constitute the stack L1. The deeper the connecting wiring is located in the stacking direction, the deeper the recess is. That is, the depth of the recess increases in the order of recesses C1, C2, and C3. Due to the presence of recesses C1, C2, and C3, the lowest position P1 of the upper surface 254a of the fourth connecting wiring 254, the top layer in the stacking direction, becomes lower than the position P2 of the bottom surface 241b of the winding portion 241 of the fourth coil wiring 24, the top layer. In particular, the recess C3 provided on the upper surface of the fourth connecting wiring 254, the top layer, exerts an anchoring effect, which can improve the adhesion between the fourth connecting wiring 254 and the insulating layer 11 above it.

[0106] In addition, the "lowest position of the upper surface of the connection wiring" refers to the position of the bottom surface of the recess. In addition, it is preferred that the lowest position P1 of the upper surface 254a of the fourth connection wiring 254 of the uppermost layer is higher than the position P3 of the bottom surface 231b of the winding portion 231 in the coil wiring of the next layer of the uppermost layer in the stacking direction, that is, the third coil wiring 23. Through this structure, the height difference between the fourth connection wiring 254 of the uppermost layer and the coil wiring of the uppermost layer, that is, the winding portion 241 of the fourth coil wiring 24, can be reduced, thereby suppressing the possible disconnection of the fourth connection wiring 254 and the lead-out portion 242 of the fourth coil wiring 24. The positional relationship between the upper surface of the connection wiring and the lower surface of the winding portion described above is also the same for the stacked body L2.

[0107] In addition, it is preferred that the thickness of the insulating layer between the winding portions of adjacent coil wirings is smaller than the thickness of the winding portions in the stacking direction. Figure 6 As shown, in the first coil wiring 21 and the second coil wiring 22 adjacent in the stacking direction, the thickness t2 of the insulating layer 11 between the winding portion 211 and the winding portion 221 is smaller than the thickness t1 of the winding portion 211. If the depth of the recessed portions C1 to C3 becomes too deep, the possibility of the second to fourth connecting wirings 252 to 254 and the second to fourth coil wirings 22 to 24 being broken becomes higher. According to the above structure, the thickness of the insulating layer between the winding portions of adjacent coil wirings is relatively thin, so the depth of the through-hole opening is also relatively small. Therefore, the depth of the recessed portion of the connecting wiring can be prevented from becoming too deep, and the connecting wiring and the coil wiring can be prevented from being broken.

[0108] Figure 7 yes Figure 2 BB' cross-sectional view. Figure 8 yes Figure 2C-C' cross-sectional view. As described above, the first to fourth connecting wirings 251 to 254 are stacked sequentially from the lower side to the upper side in the stacking direction to form the stack body L1. In addition, the fifth to eighth connecting wirings 255 to 258 are stacked sequentially from the lower side to the upper side in the stacking direction to form the stack body L2. The lead portion 242 of the topmost fourth coil wiring 24 is led out from the plane where the winding portion 241 of the fourth coil wiring 24 is provided to the lower side in the stacking direction, connected to the topmost fourth connecting wiring 254, and inclined relative to this plane.

[0109] The lead-out portion 212 of the first coil wiring 21 of the lowest layer in the stacking direction is preferably parallel to a plane perpendicular to the stacking direction. In addition, the lead-out portion of the coil wiring is preferably located in an upper layer in the stacking direction, and the angle of inclination relative to the plane perpendicular to the stacking direction is larger. The "angle of inclination" refers to the angle formed by the line connecting the two ends of the center line of the lead-out portion and the above-mentioned plane in a cross section parallel to the stacking direction and intersecting all the connection wiring arranged in the stacking direction and all the lead-out portions connected to these connection wirings, which is an acute angle.

[0110] Reference Figure 7 and Figure 8 Specifically, the lead-out portion 232 of the third coil wiring 23 and the lead-out portion 242 of the fourth coil wiring 24 preferably have a greater inclination angle than the lead-out portion 222 of the second coil wiring 22, located below the third and fourth coil wirings 23 and 24. The lead-out portion 242 of the fourth coil wiring 24 preferably has a greater inclination angle than the lead-out portion 232 of the third coil wiring 23, located below the fourth coil wiring 24. According to the above structure, the winding portion 211 of the bottommost first coil wiring 21 and the bottommost first connecting wiring 251 are arranged on the same plane. Therefore, compared to a case where they are not arranged on the same plane, the winding portion 211 and the first connecting wiring 251 can be manufactured using the same process, thereby reducing the overall number of process steps. Furthermore, the higher the lead-out portions 222, 232, and 242 are located in the stacking direction, the greater their inclination angles, thereby more effectively ensuring the line length of the lead-out portions 222, 232, and 242. Furthermore, the inclination angle of each of the lead portions 212 , 222 , 232 , and 242 may gradually increase from the lower side toward the upper side in the stacking direction (ie, in the order of the lead portions 212 , 222 , 232 , and 242 ).

[0111] Next, refer to Figures 9A to 9F A method for manufacturing the above-mentioned inductor component 1 will be described.

[0112] like Figure 9AAs shown, an insulating layer 11 is provided on the first substrate 61. At this time, a conductive seed layer (not shown) is formed on the insulating layer 11 by sputtering or the like. Figure 9B As shown in FIG. 1 , a photoresist 72 having an opening 72a formed therein by exposure and development is provided on the insulating layer 11 including the seed layer. The photoresist 72 is, for example, a negative resist. Figure 9C As shown, the first coil wiring 21, the first connecting wiring 251 and the fifth connecting wiring 255 are set in the opening 72a of the photoresist 72, and the photoresist 72 is peeled off and the seed layer is removed by etching. That is, the first coil wiring 21, the first connecting wiring 251 and the fifth connecting wiring 255 are stacked on the insulating layer 11. The first coil wiring 21, the first connecting wiring 251 and the fifth connecting wiring 255 are formed, for example, by electroplating copper on the powered seed layer in the opening 72a of the photoresist 72. In addition, the wiring formation method is not limited to the above method, and can also be formed by an additive method or a subtractive method, a sputtering method or a printing method.

[0113] Then, if Figure 9DAs shown, the insulating layer 11 formed with the through-hole opening 11a is stacked on the first coil wiring 21, the first connecting wiring 251 and the fifth connecting wiring 255. The through-hole opening 11a exposes a portion of the upper surface of the first connecting wiring 251 and a portion of the upper surface of the fifth connecting wiring 255. Next, the second coil wiring 22, the second connecting wiring 252 and the sixth connecting wiring 256 are stacked on the insulating layer 11 in such a manner that the second connecting wiring 252 and the sixth connecting wiring 256 are in contact with the upper surfaces of the first connecting wiring 251 and the fifth connecting wiring 255. At this time, the second connecting wiring 252 and the sixth connecting wiring 256 are arranged on the through-hole opening 11a and the insulating layer 11 around the through-hole opening 11a, and are controlled so that a recess is formed on the upper surface of the portion of the second connecting wiring 252 and the sixth connecting wiring 256 corresponding to the through-hole opening 11a. Specifically, the spacing between the winding portion 211 and the first and fifth connecting wirings 251 and 255 is made wider than the spacing between the wirings in the winding portion 211, or the width of the first and fifth connecting wirings 251 and 255 is made greater than the width of the winding portion 211. Thus, as described above, the thickness of the insulating layer 11 covering the winding portion 211 and the first and fifth connecting wirings 251 and 255 can be thickened. If a through-hole opening is formed in the insulating layer 11 having a thickness greater than a certain value, the height difference between the upper surface of the insulating layer 11 and the bottom surface of the through-hole opening can be increased. Therefore, when the second coil wiring 22 and the second and sixth connecting wirings 252 and 256 having the same thickness are formed on the insulating layer 11 and in the through-hole opening by printing and plating, a clear recess can be formed in the second and sixth connecting wirings 252 and 256. Alternatively, the recessed portion can be formed by partially dissolving the first, second, fifth, and sixth connecting wirings 251, 252, 255, and 256 exposed from the through-hole opening from the upper surface side using a wet process such as desmearing, thereby lowering the bottom surface of the through-hole opening. By forming the recessed portion on the upper surface of the portion of the second connecting wiring 252 and the sixth connecting wiring 256 corresponding to the through-hole opening 11a, the lower surfaces of the second connecting wiring 252 and the sixth connecting wiring 256 are positioned below the lower surface of the winding portion 221 of the second coil wiring 22 in the stacking direction. Consequently, the lead portion connecting the winding portion 221 and the sixth connecting wiring 256 is tilted.

[0114] Repeat the above process, such as Figure 9EAs shown, the first to fourth coil wirings 21 to 24 and the first to eighth connecting wirings 251 to 258 are provided in the insulating layer 11. The lowest position of the upper surface of the fourth connecting wiring 254 and the eighth connecting wiring 258 in the uppermost layer in the stacking direction is formed to be lower than the position of the bottom surface of the winding portion 241 in the fourth coil wiring 24 in the uppermost layer. At this time, control is performed so that the deeper the connecting wiring is located in the stacking direction, the deeper the depth of the recess provided on the upper surface is, and the first to eighth connecting wirings 251 to 258 are formed. As a result, the higher the coil wiring is located in the stacking direction, the greater the height difference between the position of the winding portion of the coil wiring in the stacking direction and the position of the connecting wiring connected to the coil wiring in the stacking direction. Therefore, the higher the lead portion is located in the stacking direction, the greater the inclination angle of the lead portion.

[0115] Then, if Figure 9F As shown, the second substrate 62 is stacked on the insulating layer 11 to manufacture the inductor component 1 .

[0116] According to the inductor component 1 described above, the first to fourth connecting wirings 251 to 254 are arranged along the stacking direction (i.e., the first to fourth connecting wirings 251 to 254 are arranged at the same position when viewed in the stacking direction), and the fifth to eighth connecting wirings 255 to 258 are arranged along the stacking direction (i.e., the fifth to eighth connecting wirings 255 to 258 are arranged at the same position when viewed in the stacking direction). This allows for greater space on the plane in which the first to fourth coil wirings 21 to 24 are arranged. Consequently, the efficiency of inductance acquisition can be improved.

[0117] Furthermore, the lowest position of the upper surface of the fourth connecting wiring 254 and the eighth connecting wiring 258 in the top layer is lower than the bottom surface of the winding portion 241 in the fourth coil wiring 24 in the top layer. Therefore, the thickness of the insulating layer 11 on the fourth connecting wiring 254 and the eighth connecting wiring 258 in the top layer is greater than the thickness of the insulating layer 11 on the winding portion 241. This can suppress the reduction in the adhesion between the base 10 and the second substrate 62 provided on the base 10, which may occur when a plurality of connecting wirings are arranged in the stacking direction.

[0118] Furthermore, when effectively utilizing the larger space on the plane where the first to fourth coil wirings 21 to 24 are arranged, increasing the number of turns of the windings of the first to fourth coil wirings 21 to 24 and maximizing the size of the first to fourth coil wirings 21 to 24 on the plane, there is a possibility that the lead length of the lead portion will be shortened, thereby reducing the efficiency of inductance acquisition. In the inductor component 1 described above, the lead portion 242 of the topmost fourth coil wiring 24 is tilted relative to a plane perpendicular to the stacking direction. This ensures the lead portion 242 has a sufficient length, thereby suppressing a reduction in the efficiency of inductance acquisition.

[0119] The thickness of the winding portion located on the upper side in the stacking direction is preferably thinner than the thickness of the winding portion located on the lower side. For example, the thickness of the winding portions 211, 221, 231, and 241 in the stacking direction decreases in this order.

[0120] According to the above structure, unevenness of the insulating layer 11 on the upper side can be suppressed.

[0121] Refer again Figure 3 and Figure 4A Preferably, the inductor component 1 further includes a first dummy wiring 31, a second dummy wiring 32, and a third dummy wiring 33 connected to the ends of the winding portion. Specifically, the first dummy wiring 31 is connected to the end of the winding portion 211 of the first coil wiring 21, the second dummy wiring 32 is connected to the end of the winding portion 221 of the second coil wiring 22, and the third dummy wiring 33 is connected to the end of the winding portion 231 of the third coil wiring. The first dummy wiring 31 extends from the end of the winding portion 211 along the direction in which the winding portion 211 extends. The second dummy wiring 32 extends from the end of the winding portion 221 along the direction in which the winding portion 221 extends. The third dummy wiring 33 extends from the end of the winding portion 231 along the direction in which the winding portion 231 extends. The first to third dummy wirings 31 to 33 do not constitute a current path. Specifically, the ends of the first to third dummy wirings 31 to 33 opposite to the ends connected to the winding portion are not connected to other wiring or the like.

[0122] According to the above configuration, since the first to third dummy wirings 31 to 33 are further provided, the lowering of the insulating layer 11 stacked on the first to third dummy wirings 31 to 33 can be suppressed, thereby suppressing disconnection of the coil wiring provided above the dummy wirings.

[0123] It is preferable that the dummy wiring is not connected to the fourth coil wiring 24 in the uppermost layer.

[0124] According to the above structure, the magnetic circuit can be expanded by not providing dummy wiring corresponding to the topmost fourth coil wiring 24. In addition, since no coil wiring or the like is provided above the topmost fourth coil wiring 24, the possibility of disconnection of the coil wiring and the connecting wiring is low even if dummy wiring corresponding to the fourth coil wiring 24 is not provided.

[0125] The line length of the first dummy wiring 31 corresponding to the lowermost first coil wiring 21 is preferably shorter than the line lengths of the second dummy wiring 32 and the third dummy wiring 33 corresponding to the second coil wiring 22 and the third coil wiring 23 other than the first coil wiring 21 .

[0126] According to the above structure, the magnetic circuit can be expanded by relatively shortening the line length of the first dummy wiring 31 corresponding to the bottom-most first coil wiring 21. In addition, the insulating layer 11 stacked on the bottom-most first coil wiring 21 has a smaller drop than the insulating layer 11 of the upper layer, so the line length of the first dummy wiring 31 corresponding to the bottom-most first coil wiring 21 can be minimized.

[0127] (Second embodiment)

[0128] Figure 10 It is a perspective plan view showing a second embodiment of the inductor component according to the present invention. Figure 11 This is an exploded plan view of a second embodiment of the inductor component according to the present invention. The second embodiment differs from the first embodiment in the structure of the first and second coils. These differences are described below. The remaining structures are identical to those of the first embodiment and are denoted by the same reference numerals as those of the first embodiment, and their descriptions are omitted.

[0129] like Figure 10 and Figure 11 As shown, the inductor component 1A of the second embodiment includes a first coil 28A and a second coil 29A.

[0130] The first coil 28A includes the first coil wiring 21, the sixth coil wiring 26, and the first to third connection wirings 251 to 253. The first coil wiring 21 is arranged on the lower side of the sixth coil wiring 26 in the stacking direction. The first end of the sixth coil wiring 26 is connected to the fourth connection electrode 44, and the second end is connected to the third connection wiring 253. The sixth coil wiring 26 includes a winding portion 261 and a lead portion 262. The number of turns of the winding portion 261 is less than 1 turn, specifically, it is a straight line. The first end of the winding portion 261 is connected to the fourth connection electrode 44, and the second end is connected to the first end of the lead portion 262. The second end of the lead portion 262 is connected to the third connection wiring 253. Through the above structure, the first connection electrode 41, the first coil wiring 21, the first to third connection wirings 251 to 253, the sixth coil wiring 26, and the fourth connection electrode 44 are connected in sequence, and the first coil 28A is electrically connected to the first connection electrode 41 and the fourth connection electrode 44.

[0131] The second coil 29A includes the second coil wiring 22 and the seventh coil wiring 27 and the sixth connection wiring 256 and the seventh connection wiring 257. The second coil wiring 22 is arranged on the lower side of the stacking direction of the seventh coil wiring 27. The first end of the seventh coil wiring 27 is connected to the third connection electrode 43, and the second end is connected to the seventh connection wiring 257. The seventh coil wiring 27 includes a winding portion 271 and a lead-out portion 272. The number of turns of the winding portion 271 is less than 1 turn, specifically, it is a straight line. The first end of the winding portion 271 is connected to the third connection electrode 43, and the second end is connected to the first end of the lead-out portion 272. The second end of the lead-out portion 272 is connected to the third connection wiring 253. Through the above structure, the second connection electrode 42, the second coil wiring 22, the sixth connection wiring 256 and the seventh connection wiring 257, the seventh coil wiring 27 and the third connection electrode 43 are connected in sequence, and the second coil 29A is electrically connected to the second connection electrode 42 and the third connection electrode 43. The width of the lead portion 262 of the sixth coil wiring 26 is greater than the width of the lead portion 272 of the seventh coil wiring 27 .

[0132] Figure 12 yes Figure 10 D-D' cross-sectional view. Figure 12 As shown, the first to third connecting wirings 251-253 are stacked sequentially from the lower side to the upper side in the stacking direction to form the stacked body L1A. Furthermore, the lead portion 262 of the sixth coil wiring 26 is led out from the plane in which the winding portion 261 is provided to the lower side in the stacking direction, connected to the third connecting wiring 253 in the top layer, and inclined relative to the plane. Furthermore, although detailed description is omitted, similar to the first embodiment, the lowest point of the upper surface of the third connecting wiring 253 in the top layer is lower than the bottom surface of the winding portion 261 of the sixth coil wiring 26 in the top layer.

[0133] In the inductor component 1A described above, the width of the lead portion 262 of the sixth coil wiring 26 is greater than the width of the lead portion 272 of the seventh coil wiring 27. Consequently, the width of a portion of the coil wiring of the first coil 28A differs from the width of the coil wiring of the second coil 29A. Therefore, even when the line lengths of the first coil 28A and the second coil 29A differ, the characteristics of the first coil 28A and the second coil 29A can be matched.

[0134] (Third embodiment)

[0135] Figure 13 It is a perspective plan view showing a third embodiment of the inductor component according to the present invention. Figure 14 yes Figure 13EE' cross-sectional view. The third embodiment differs from the first embodiment in that an inner magnetic circuit member is provided. This different structure is described below. The other structures are the same as those of the first embodiment, and are marked with the same figure marks as those of the first embodiment and their descriptions are omitted.

[0136] like Figure 13 and Figure 14 As shown, the base 10 of the inductor component 1B has a through hole 10a that penetrates in the stacking direction in an area radially inward of the first coil 28 and the second coil 29. The radial inward refers to the area closer to the axial side than the inner surfaces of the first coil 28 and the second coil 29 when viewed from the stacking direction. In addition, the inner magnetic circuit member 91 that constitutes the inner magnetic circuit is arranged in the through hole 10a. The inner magnetic circuit member 91 contains a magnetic material. Specifically, the inner magnetic circuit member 91 is composed of a composite material of metal magnetic powder and resin. In the case where the first substrate 61 and the second substrate 62 are magnetic substrates, the inner magnetic circuit member 91 contains a magnetic material that is different from at least one of the first substrate 61 and the second substrate 62. "The inner magnetic circuit member 91 contains a magnetic material different from that of the substrate" refers to the case where the magnetic material of the inner magnetic circuit member 91 itself is different from that of the substrate, or even if the inner magnetic circuit member 91 and the substrate are the same magnetic material, the substrate is, for example, a sintered body of ferrite, and the inner magnetic circuit member 91 is, for example, a resin body containing ferrite particles, or the inner magnetic circuit member 91 and the substrate are composed of the same material, for example, a ferrite system, but have different compositions.

[0137] According to the above-described inductor component 1B, since the inner magnetic path member 91 is further provided, the effective relative magnetic permeability is improved, and the efficiency of obtaining inductance can be improved.

[0138] <First Modification>

[0139] Figure 15 1 is a cross-sectional view showing a first modified example of the third embodiment of the inductor component. Figure 15 As shown, the inductor component 1C has a first adhesion layer 81 between the winding portion 241 of the fourth coil wiring 24 of the top layer and the second substrate 62 in the stacking direction. The first adhesion layer 81 is composed of a composite material of metal magnetic powder having an average particle size of less than 1 / 2 of the average particle size of the metal magnetic powder contained in the internal magnetic circuit member 91, and resin. Specifically, the first adhesion layer 81 is provided on the upper surface of the base 10. The first adhesion layer 81 bonds the base 10 to the second substrate 62. The resin contained in the first adhesion layer 81 is an insulating resin with adhesive properties. "Average particle size" refers to the average particle size D50 (equivalent to the particle size of 50% cumulative percentage on a volume basis) when three SEM images of a field of view area of ​​200μm×200μm are obtained. The second substrate 62 is provided on the upper surface of the first adhesion layer 81.

[0140] In the inductor component 1C, the inner magnetic path member 91 is formed from a composite material of metal magnetic powder and resin, thereby increasing the effective relative magnetic permeability and improving the efficiency of inductance. Furthermore, the first adhesion layer 81 contains resin, thereby improving the adhesion between the second substrate 62 and the base 10.

[0141] <Second Modification>

[0142] Figure 16 This is a cross-sectional view showing a second variation of the third embodiment of the inductor component. The inductor component 1D includes a second adhesion layer 82 between the winding portion 241 of the topmost fourth coil wiring 24 and the second substrate 62 in the stacking direction. Specifically, the second adhesion layer 82 is provided on the upper surface of the base 10. The second substrate 62 is provided on the upper surface of the second adhesion layer 82. The second adhesion layer 82 adheres the base 10 to the second substrate 62. The second adhesion layer 82 is, for example, an adhesive insulating resin.

[0143] According to the above-described inductor component 1D, the adhesion between the second substrate 62 and the base body 10 can be improved.

[0144] <Third Modification>

[0145] Figure 17 1 is a cross-sectional view showing a third modified example of the third embodiment of the inductor component. Figure 17 As shown, on the upper surface of the base 10 of the inductor component 1E, a recessed portion 10b is provided within a specified range around the through hole 10a. Moreover, a portion of the upper portion of the inner magnetic circuit member 91E is provided in the recessed portion 10b. When viewed from a direction perpendicular to the stacking direction, the shape of the inner magnetic circuit member 91E is roughly T-shaped. A first adhesion layer 81E is provided on the upper surface of the base 10 and on the upper surface of an area other than the area where the inner magnetic circuit member 91E is provided. The first adhesion layer 81E is the same as the first adhesion layer 81 of the first variant. In addition, a second adhesion layer 82E is provided on the upper surface of the inner magnetic circuit member 91E and the first adhesion layer 81E. The second adhesion layer 82E is the same as the second adhesion layer 82 of the second variant. A second substrate 62 is provided on the upper surface of the second adhesion layer 82E.

[0146] According to the above-described inductor component 1E, the adhesion between the second substrate 62 and the base body 10 can be further improved.

[0147] Next, refer to Figures 18A to 18H as well as Figures 18J to 18L A method for manufacturing the inductor component 1E will be described.

[0148] like Figure 18AAs shown, an insulating layer 11 is provided on the first substrate 61. At this time, a conductive seed layer (not shown) is formed on the insulating layer 11 by sputtering or the like. Figure 18B As shown in FIG. 1 , a photoresist 72 having an opening 72a formed therein by exposure and development is provided on the insulating layer 11 including the seed layer. The photoresist 72 is, for example, a negative resist. Figure 18C As shown, the first coil wiring 21, the first connecting wiring 251 and the fifth connecting wiring 255 are set in the opening 72a of the photoresist 72, and the photoresist 72 is peeled off and the seed layer is removed by etching. That is, the first coil wiring 21, the first connecting wiring 251 and the fifth connecting wiring 255 are stacked on the insulating layer 11. The first coil wiring 21, the first connecting wiring 251 and the fifth connecting wiring 255 are formed by, for example, electroplating copper on the powered seed layer in the opening 72a of the photoresist 72. Then, as shown in FIG. Figure 18D As shown, the insulating layer 11 formed with the through hole opening 11a is stacked on the first coil wiring 21, the first connecting wiring 251 and the fifth connecting wiring 255. The through hole opening 11a exposes a portion of the upper surface of the first connecting wiring 251 and a portion of the upper surface of the fifth connecting wiring 255. Then, the second coil wiring 22, the sixth connecting wiring 256 and the second connecting wiring 252 are stacked on the insulating layer 11 in such a manner that the second connecting wiring 252 and the sixth connecting wiring 256 are in contact with the upper surfaces of the first connecting wiring 251 and the fifth connecting wiring 255. The above steps are repeated, as shown in FIG. Figure 18E As shown, first to fourth coil wirings 21 to 24 and first to eighth connecting wirings 251 to 258 are provided within the insulating layer 11. A recessed portion 10b is formed on the upper surface of the base 10. The recessed portion 10b can be formed, for example, by reducing the amount of insulating material applied to form the insulating layer 11, at the center of the plane perpendicular to the stacking direction when the topmost insulating layer 11 is provided.

[0149] Then, if Figure 18F As shown in FIG. 1 , a through hole 10a is formed in the base 10 by sandblasting, laser processing, etc. Figure 18G As shown in FIG. 1 , an inner magnetic circuit member 91E is provided in the through hole 10a and the recessed portion 10b. Figure 18H As shown in FIG. 1 , the first adhesion layer 81E is laminated on the upper surface of the base 10 in an area other than the area where the inner magnetic circuit member 91E is provided. Figure 18J As shown in FIG. 1 , the upper surfaces of the inner magnetic circuit member 91E and the first adhesion layer 81E are flattened by grinding or the like. Figure 18K As shown in FIG. 1 , the second adhesion layer 82E is stacked on the first adhesion layer 81E and the inner magnetic circuit member 91E. Figure 18LAs shown, the second substrate 62 is stacked on the second adhesion layer 82E to manufacture the inductor component 1E.

[0150] The present invention is not limited to the above-described embodiment, and design changes can be made without departing from the spirit of the present invention. For example, various combinations of the respective features of the first to third embodiments are also possible.

[0151] In the first embodiment described above, the number of layers of the coil wiring is four, but the number of layers of the coil wiring may be one to three, or five or more.

[0152] In the above embodiment, the first substrate 61 is provided on the lower surface of the base 10 , but the first substrate 61 may not be provided.

[0153] In the above embodiment, the lead portions of the coil wirings other than the coil wiring in the lowermost layer are inclined with respect to the plane perpendicular to the stacking direction. However, only the lead portions of the coil wiring in the uppermost layer may be inclined.

Claims

1. An inductor component, wherein: have: A substrate, which is formed by stacking multiple insulating layers; a coil, disposed in the base body and wound into a spiral shape running along the stacking direction of the insulating layer; as well as a substrate, disposed on the upper surface of the base, The coil comprises: a plurality of coil wirings arranged along the stacking direction and wound along a plane perpendicular to the stacking direction; and a connecting wiring connecting ends of the plurality of coil wirings to each other. The coil wiring includes: a winding portion wound on the plane; and a lead portion led out from an end of the winding portion to the connection wiring. The connecting wiring is arranged in plurality along the stacking direction. In the stacking direction, the lowest position of the upper surface of the connection wiring in the uppermost layer in the stacking direction is lower than the position of the bottom surface of the winding portion of the coil wiring in the uppermost layer. The lead portion of the uppermost coil wiring is led out from the plane on which the winding portion of the uppermost coil wiring is provided to the lower side in the stacking direction, connected to the uppermost connection wiring, and inclined relative to the plane. The lowest position of the upper surface of the uppermost connection wiring is higher than the position of the bottom surface of the winding portion of the coil wiring in a layer next to the uppermost layer in the stacking direction.

2. The inductor component according to claim 1, wherein The lead portion of the coil wiring of the lowermost layer in the stacking direction is parallel to the plane, The lead portion of the coil wiring has a larger inclination angle with respect to the plane as it is positioned in an upper layer in the stacking direction.

3. The inductor component according to claim 1 or 2, wherein: In the stacking direction, the thickness of the insulating layer between the winding portions of the adjacent coil wirings is smaller than the thickness of the winding portions.

4. The inductor component according to claim 1 or 2, wherein: The width of the connection wiring is greater than the width of the winding portion.

5. The inductor component according to claim 1 or 2, wherein: There are multiple coils. The plurality of connection wirings arranged along the stacking direction are connected to each other to form a stacked body. Each of the plurality of coils includes the laminated body. The inductor component according to claim 5 , wherein: The plurality of coils include a first coil and a second coil having different line lengths. A width of a portion of the coil wiring of the first coil is different from a width of the coil wiring of the second coil.

7. The inductor component according to claim 5, wherein The thickness of each of the laminated bodies is the same.

8. The inductor component according to claim 5, wherein The plurality of coils include a first coil and a second coil, In the first coil, the winding portion of the coil wiring is wound in a spiral shape, A shortest distance between the winding portion of the first coil and the laminated body of the second coil is greater than a distance between adjacent turns of the winding portion of the first coil.

9. The inductor component according to claim 1 or 2, wherein: The inductor component further includes a dummy wiring connected to an end portion of the winding portion. The dummy wiring extends from an end portion of the winding portion along an extending direction of the winding portion and does not constitute a current path.

10. The inductor component according to claim 9, wherein The dummy wiring is not connected to the coil wiring of the uppermost layer.

11. The inductor component according to claim 9, wherein The line length of the dummy wiring connected to the end of the winding portion of the coil wiring in the lowest layer in the stacking direction is shorter than the line length of the dummy wiring connected to the end of the winding portion of the coil wiring other than the lowest layer.

12. The inductor component according to claim 1 or 2, wherein: The substrate is a magnetic substrate, The base body has a through hole penetrating in the stacking direction in a region radially inward of the coil. The inductor component further includes an inner magnetic circuit member, which is provided in the through hole and constitutes an inner magnetic circuit. The inner magnetic circuit member includes a magnetic material different from that of the substrate.

13. The inductor component according to claim 12, wherein The inner magnetic circuit component is composed of a composite material of metal magnetic powder and resin. In the stacking direction, a bonding layer is provided between the winding portion of the uppermost coil wiring and the substrate. The bonding layer is formed of a composite material of metal magnetic powder having an average particle size of less than 1 / 2 the average particle size of the metal magnetic powder and resin.

14. The inductor component according to claim 12, wherein The inductor component further includes a substrate provided on the lower surface of the base and having a thickness greater than that of the substrate.

15. The inductor component according to claim 1 or 2, wherein The thickness of the winding portion located on the upper side in the stacking direction is thinner than the thickness of the winding portion located on the lower side.

16. A method for manufacturing an inductor component according to any one of claims 1 to 15, wherein: Including the following processes: a step of laminating a first coil wiring and a first connecting wiring on a first insulating layer; a step of laminating a second insulating layer on the first coil wiring and the first connecting wiring so that at least a portion of the upper surface of the first connecting wiring is exposed; as well as a step of laminating a second coil wiring and a second connecting wiring on the second insulating layer in such a manner that the second connecting wiring contacts the upper surface of the first connecting wiring; The second coil wiring is formed to be inclined toward a lead portion from which the second connection wiring is led.

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