Electronic Devices

Abstract

The present invention relates to an electronic device, comprising a first substrate, a partition wall structure, a pressurizing component, a second substrate, a housing and a plurality of first conductive parts. The first substrate has a through hole and a first surface and a second surface opposite to each other. The partition wall structure is arranged on the first surface and surrounds a first cavity. The pressurizing component is arranged on the partition wall structure and covers the first cavity. The pressurizing component at least includes a mass block and a diaphragm. The housing is arranged on the second substrate and forms a second cavity together with the second substrate. The first cavity is formed in the second cavity. A plurality of first conductive parts are arranged between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.

Description

[0001] This application claims priority to U.S. patent application filed on March 19, 2021, with priority number 63 / 163,066 and invention name “ELECTRONIC DEVICE.” Technical Field

[0002] The present invention relates to a device, and in particular to an electronic device. Background Art

[0003] Generally speaking, the configuration of components and the corresponding cavity design in an electronic device are often closely related to its sensitivity. If the configuration of components and the corresponding cavity design in an electronic device is not good (for example, the cavity is too small), it is easy to cause excessive air resistance. In this way, its sensitivity will decrease. Therefore, how to effectively improve its sensitivity is indeed a challenge. Summary of the invention

[0004] The invention provides an electronic device, which can effectively improve the sensitivity of the electronic device.

[0005] An electronic device of the present invention includes a first substrate, a partition wall structure, a pressurizing component, a second substrate, a housing, and a plurality of first conductive parts. The first substrate has a through hole and a first surface and a second surface opposite to each other. The partition wall structure is arranged on the first surface and surrounds a first cavity. The pressurizing component is arranged on the partition wall structure and covers the first cavity. The pressurizing component includes at least a mass block and a diaphragm. The housing is arranged on the second substrate and forms a second cavity together with the second substrate. The first cavity is formed in the second cavity. A plurality of first conductive parts are arranged between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.

[0006] In one embodiment of the present invention, the electronic device includes a sensor disposed on the first surface and covering the through hole.

[0007] In one embodiment of the present invention, the electronic device comprises a back cavity, and the gas in the back cavity flows with the gas in the second cavity through the gap.

[0008] In one embodiment of the present invention, the electronic device includes a welding wire and an insulating layer disposed on the sensor, wherein the insulating layer covers a portion of the welding wire.

[0009] In an embodiment of the present invention, the shortest distance between the insulating layer and the diaphragm is smaller than the shortest distance between the welding wire and the diaphragm.

[0010] In one embodiment of the present invention, the sensor is formed in the first cavity and disposed between the first substrate and the diaphragm.

[0011] In one embodiment of the present invention, the sensor, the first substrate, and the plurality of first conductive portions are at least partially overlapped.

[0012] In an embodiment of the present invention, the plurality of first conductive portions are part of the second substrate, and protrude from the upper surface of the second substrate toward the first substrate and are electrically connected to the first substrate.

[0013] In one embodiment of the present invention, the plurality of first conductive parts are a plurality of metal welding balls.

[0014] In an embodiment of the present invention, the height of each of the first conductive portions is in a range from 30 micrometers to 50 micrometers.

[0015] In one embodiment of the present invention, the housing is made of metal material and has at least one groove, and the first cavity is formed in the at least one groove.

[0016] In one embodiment of the present invention, the electronic device includes a second conductive portion, which is disposed around the housing and the second substrate, and the housing is electrically connected to the second substrate through the second conductive portion.

[0017] In one embodiment of the present invention, the electronic device comprises an opening, and the opening connects the second cavity with the outside air to release the pressure in the second cavity.

[0018] In an embodiment of the present invention, the opening is located on the housing.

[0019] In an embodiment of the present invention, the mass block is disposed on the diaphragm and located in the first cavity.

[0020] In an embodiment of the present invention, the mass block is disposed on the diaphragm and outside the first cavity.

[0021] In one embodiment of the present invention, the electronic device includes a fixing ring disposed between the diaphragm and the partition wall structure, and the fixing ring is made of a rigid material.

[0022] In one embodiment of the present invention, the fixing ring and the partition wall structure are an integrally formed ring structure.

[0023] In an embodiment of the present invention, the partition wall structure and the first substrate together form a printed circuit board structure with a groove.

[0024] In one embodiment of the present invention, the first cavity and the second cavity are two independent chambers.

[0025] Based on the above, the electronic device of the present invention increases the volume of the first cavity and reduces air resistance by setting the pressurizing component on the partition wall structure and covering the first cavity, thereby effectively improving its sensitivity. In addition, since there are gaps between the multiple first conductive parts set between the first substrate and the second substrate, air can flow in the second cavity to increase the vibration energy of the diaphragm. In this way, the electronic device can respond more smoothly at lower frequencies and have better sensitivity.

[0026] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1a is a schematic top view of an electronic device according to an embodiment of the present invention;

[0028] Figure 1b is along Figure 1a A schematic cross-sectional view of line A-A' in FIG.

[0029] Figure 1c yes Figure 1b Schematic diagram of the air flow direction;

[0030] Figure 2 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention;

[0031] Figure 3 is a cross-sectional schematic diagram of an electronic device according to yet another embodiment of the present invention;

[0032] Figure 4 is a cross-sectional schematic diagram of an electronic device according to yet another embodiment of the present invention;

[0033] Figure 5 is a cross-sectional schematic diagram of an electronic device according to yet another embodiment of the present invention.

[0034] Description of reference numerals:

[0035] 10: Fixed ring

[0036] 100: Electronic devices

[0037] 110: first substrate

[0038] 110a: first surface

[0039] 110b: Second surface

[0040] 112:Through hole

[0041] 120: Partition wall structure

[0042] 130: Pressurized component

[0043] 132: Mass block

[0044] 134: Diaphragm

[0045] 140: Second substrate

[0046] 150: Shell

[0047] 151: Groove

[0048] 152: Opening

[0049] 160: first conductive part

[0050] 162: Second conductive part

[0051] 170:Sensor

[0052] 172: Processing chip

[0053] 174:Sensor chip

[0054] 180:Welding wire

[0055] 190: Insulation layer

[0056] C1: First cavity

[0057] C2: Second cavity

[0058] C3: Back cavity

[0059] D: Air circulation direction DETAILED DESCRIPTION

[0060] Directional terms used herein (eg, up, down, right, left, front, back, top, bottom) are used only with reference to the drawings and are not intended to imply an absolute orientation.

[0061] The present invention is more fully described with reference to the drawings of the present embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The thickness, size or size of the layers or regions in the drawings may be exaggerated for clarity. The same or similar reference numbers represent the same or similar elements, and the following paragraphs will not be repeated one by one.

[0062] Figure 1a is a schematic top view of an electronic device according to an embodiment of the present invention. Figure 1b is along Figure 1a Schematic cross-sectional view of line AA'. Figure 1c yes Figure 1b Schematic diagram of the air flow direction.

[0063] Please refer to Figure 1a to Figure 1cIn this embodiment, the electronic device 100 at least includes a first substrate 110, a partition wall structure 120, a pressurizing assembly 130, a second substrate 140, a housing 150, and a plurality of first conductive parts 160. The partition wall structure 120 and the pressurizing assembly 130 are both disposed on the same side of the first substrate 110, and the second substrate 140 and the plurality of first conductive parts 160 are both disposed on the other side of the first substrate 110 relative to the partition wall structure 120 and the pressurizing assembly 130. In addition, the pressurizing assembly 130 includes a mass block 132 and a diaphragm 134.

[0064] Further, if Figure 1b As shown, the partition wall structure 120 is arranged on the first surface 110a of the first substrate 110 and surrounds the first cavity C1, the pressurizing component 130 is arranged on the partition wall structure 120 and covers the first cavity C1, and the housing 150 is arranged on the second substrate 140 and forms the second cavity C2 together with the second substrate 140. Under this design, the first cavity C1 will be formed in the second cavity C2. Therefore, when the external environment vibrates, the pressurizing component 130 can generate associated vibrations, and the mass of the mass block 132 is increased and the vibration of the diaphragm 134 is actuated to vibrate the air in the first cavity C1 and transmit it toward the first substrate 110. Accordingly, the electronic device 100 of this embodiment increases the volume of the first cavity C1 and reduces the air resistance through the above configuration, thereby effectively improving its sensitivity.

[0065] On the other hand, the plurality of first conductive portions 160 are disposed between the first substrate 110 and the second substrate 120. In other words, the plurality of first conductive portions 160 are disposed on the second surface 110b of the first substrate 110 relative to the first surface 110a, and there is a gap G between any two adjacent first conductive portions 160, so that air can flow in the second cavity C2 (the air flow direction D is, for example, from the through hole 112 of the first substrate 110 through the gap G from bottom to top to the pressurizing assembly 130, such as Figure 1a and Figure 1c As shown in FIG. 1 ), the vibration energy of the diaphragm 134 is increased. In this way, the electronic device 100 can respond more smoothly at lower frequencies and have better sensitivity. Here, the sensitivity can be increased by more than 50%, but the present invention is not limited thereto, and the increase ratio can be determined according to actual design requirements.

[0066] In some embodiments, the first substrate 110 and the second substrate 140 are circuit substrates. For example, the first substrate 110 and the second substrate 140 are, for example, printed circuit boards (PCBs). The material of the partition wall structure 120 includes stainless steel, brass, or a printed circuit board. The material of the mass block 132 is metal (for example, stainless steel or brass). The material of the diaphragm 134 is plastic (for example, polytetrafluoroethylene (PTFE), polyethylene (PE), polyimide (PI), or polyether etherketone (PEEK)). The multiple first conductive portions 160 are multiple metal welding balls, but the present invention is not limited to this. Each of the above components can be replaced by any other suitable material.

[0067] In some embodiments, the first cavity C1 and the second cavity C2 are two independent chambers. In addition, the electronic device 100 may only include the first cavity C1 and the second cavity C2, but the present invention is not limited thereto.

[0068] In this embodiment, the electronic device 100 includes a sensor 170 disposed on the first surface 110a and covering the through hole 112, and the sensor 170 may include a processing chip 172 and a sensing chip 174. Further, the sensing chip 174 may be a microphone element to sense the air pressure change generated by the vibration of the pressurizing component 130, and the processing chip 172 may be an application specific integrated circuit (ASIC) to receive and process the signal measured by the microphone element, but the present invention is not limited thereto.

[0069] In some embodiments, the sensing chip 174 covers the through hole 112, and the processing chip 172 is disposed next to the sensing chip 174, and the processing chip 172 and the sensing chip 174 can be disposed on the first substrate 110 by adhesion, but the present invention is not limited to this, and the processing chip 172 and the sensing chip 174 can be configured according to actual design requirements.

[0070] In some embodiments, the sensor 170 is formed in the first cavity C1 and is disposed between the first substrate 110 and the diaphragm 134. In other words, the height of the first cavity C1 can be greater than the height of the sensor 170. In this way, the first cavity C1 can utilize the space between the sensor 170 (the processing chip 172 and the sensing chip 174) and the pressurizing component 130 to increase the volume of the first cavity C1 without changing the size of the electronic device 100. Therefore, the structure of the present invention helps to achieve thinning of the device, but the present invention is not limited to this.

[0071] In some embodiments, the sensor 170, the first substrate 110, and the plurality of first conductive portions 160 are at least partially overlapped, for example, the sensor 170, the first substrate 110, and the orthographic projections of the plurality of first conductive portions 160 on the second substrate 140 are at least partially overlapped, so that the plurality of first conductive portions 160 can provide support for the sensor 170 and the first substrate 110 to ensure that the electronic device 100 has better reliability. In addition, the height range of each first conductive portion 160 can be within a certain range, such as between 30 microns and 50 microns, but the present invention is not limited thereto. It should be noted that the present invention does not limit the height, quantity, and configuration position of the first conductive portion 160, and can be adjusted according to actual needs.

[0072] In some embodiments, the electronic device 100 includes a welding wire 180 and an insulating layer 190 disposed on the sensor 170, and the formation step may be to first form the welding wire 180 on the sensor 170, and then form the insulating layer 190 on the sensor 170, so that the insulating layer 190 can cover a portion of the welding wire 180. Further, the shortest distance d1 of the insulating layer 190 relative to the diaphragm 134 can be smaller than the shortest distance d2 of the welding wire 180 relative to the diaphragm 134. In other words, the insulating layer 190 is closer to the diaphragm 134 than the welding wire 180. In this way, when the electronic device 100 is undergoing a reliability test, the insulating layer 190 can serve as a blocking member to reduce the probability of the welding wire 180 being crushed, so that the insulating layer 190 can effectively protect the welding wire 180 and improve the reliability of the electronic device 100, but the present invention is not limited thereto.

[0073] In some embodiments, the bonding wire 180 may connect the processing chip 172 and the sensing chip 174 to form an electrical connection between the processing chip 172 and the sensing chip 174. The height of the processing chip 172 may be lower than the height of the sensing chip 174, and the top of the bonding wire 180 may be located above the sensing chip 174. In addition, the electronic device 100 includes another bonding wire (not shown) connecting the processing chip 172 and the first substrate 110 to form an electrical connection between the processing chip 172 and the first substrate 110, but the present invention is not limited thereto.

[0074] In some embodiments, the material of the bonding wire 180 is, for example, gold or other suitable conductive materials, and the material of the insulating layer 190 is, for example, black glue or other suitable insulating materials, which is not limited in the present invention.

[0075] In this embodiment, the mass block 132 is disposed on the diaphragm 134 and is located in the first cavity C1, so the mass block 132, the welding wire 180 and the insulating layer 190 are all located in the first cavity C1, but the present invention is not limited thereto. In other embodiments, the position of the mass block 132 may have other settings.

[0076] In some embodiments, the electronic device 100 includes a back cavity C3 , and the gas in the back cavity C3 flows through the gap G with the gas in the second cavity C2 . For example, the back cavity C3 may be a space formed by the sensing chip 174 and the through hole 112 , but the present invention is not limited thereto.

[0077] In some embodiments, the electronic device 100 includes a second conductive portion 162, which is disposed around the housing 150 and the second substrate 140. Further, the second conductive portion 162 may be a metal welding ball or a suitable conductive terminal, so that the housing 150 may be electrically connected to the second substrate 140 through the second conductive portion 162. In addition, the housing 150 is made of metal material and has at least one groove 151, and the first cavity C1 is formed in the at least one groove 151. In other words, the housing 150 may surround the sensor 170, so that the probability of the sensor 170 being subjected to electromagnetic interference may be reduced by this configuration, but the present invention is not limited thereto.

[0078] In some embodiments, the electronic device 100 includes an opening 152 connecting the second cavity C2 with the outside air to release the pressure in the second cavity C2. For example, the opening 152 may be located on the housing 150. Figure 1b As shown, the present invention is not limited thereto. In an embodiment not shown, the opening may also be disposed on the second substrate 140 or other suitable positions, as long as the pressure in the second cavity C2 can be released, it falls within the protection scope of the present invention. Here, the pressure in the second cavity C2 may be generated by a high temperature process during the manufacturing process.

[0079] In some embodiments, the electronic device 100 includes a fixing ring 10 disposed between the diaphragm 134 and the partition wall structure 120. The fixing ring 10 is made of a rigid material, so that the pressurizing component 130 and the partition wall structure 120 can be more securely connected together, thereby improving the reliability of the electronic device 100, but the present invention is not limited to this.

[0080] It must be noted here that the following embodiments continue to use the component numbers and some contents of the above-mentioned embodiments, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted. For the description of the omitted parts, please refer to the above-mentioned embodiments, and the following embodiments will not be repeated.

[0081] Figure 2 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Figure 2 Compared to the electronic device 100, the multiple first conductive portions 260 of the electronic device 200 of this embodiment are part of the second substrate 240, protruding from the upper surface of the second substrate 240 toward the first substrate 110 and forming an electrical connection with the first substrate 110. For example, the second substrate 240 is a printed circuit board, and the first conductive portions 260 are conductive circuit contacts thereon, but the present invention is not limited to this.

[0082] Figure 3 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Figure 3 Compared with the electronic device 100, the mass block 332 of the pressurizing component 330 of the electronic device 300 of this embodiment is arranged on the diaphragm 134 and is located outside the first cavity C1. In other words, the mass block 322 of the pressurizing component 340 can be located in the second cavity C2, so the diaphragm 134 is located between the mass block 322 and the sensor 170, but the present invention is not limited to this.

[0083] Figure 4 is a cross-sectional schematic diagram of an electronic device according to yet another embodiment of the present invention. Figure 4 Compared with the electronic device 100, the fixing ring and the partition wall structure 420 of the electronic device 400 of this embodiment are an integrally formed ring structure, and the partition wall structure 420 can be a pre-formed component and then directly bonded to the first substrate 110, thereby increasing the convenience of the process. On the other hand, the material of the partition wall structure 420 can be substantially the same as the material of the mass block 132, but the present invention is not limited thereto, and the material of the partition wall structure 420 can also be different from the material of the mass block 132.

[0084] Figure 5 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Figure 5 Compared with the electronic device 100, the partition wall structure 520 and the first substrate 510 of the electronic device 500 of this embodiment are jointly formed into a printed circuit board structure with a groove. In other words, the partition wall structure 520 and the first substrate 510 are an integrally formed structure, but the present invention is not limited to this.

[0085] In summary, the electronic device of the present invention increases the volume of the first cavity and reduces air resistance by setting the pressurizing component on the partition wall structure and covering the first cavity, thereby effectively improving its sensitivity. In addition, since there are gaps between the multiple first conductive parts set between the first substrate and the second substrate, air can flow in the second cavity (for example, the flow direction is from the through hole of the first substrate through the aforementioned gap from bottom to top back to the pressurizing component) to increase the vibration energy of the diaphragm. In this way, the electronic device can respond more smoothly at lower frequencies and have better sensitivity.

[0086] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be based on the scope defined by the claims.

Claims

1. An electronic device, characterized in that: include: A first substrate having a through hole and a first surface and a second surface opposite to each other; A partition wall structure, disposed on the first surface and surrounding the first cavity; A pressurizing component, disposed on the partition wall structure and covering the first cavity, the pressurizing component at least comprising a mass block and a diaphragm; a second substrate; a housing, disposed on the second substrate and forming a second cavity together with the second substrate, wherein the first cavity is formed in the second cavity; A plurality of first conductive parts are arranged between the first substrate and the second substrate, and there is a gap between any two adjacent first conductive parts; as well as The back cavity is provided with gas in the back cavity, and the gas in the back cavity flows through the gap with the gas in the second cavity.

2. The electronic device according to claim 1, characterized in that: A sensor is included, which is disposed on the first surface and covers the through hole.

3. The electronic device according to claim 2, characterized in that: It comprises a welding wire and an insulating layer, wherein the welding wire is arranged on the sensor, and the insulating layer covers a part of the welding wire.

4. The electronic device according to claim 3, characterized in that: The shortest distance between the insulating layer and the diaphragm is smaller than the shortest distance between the welding wire and the diaphragm.

5. The electronic device according to claim 2, characterized in that: The sensor is formed in the first cavity and disposed between the first substrate and the diaphragm.

6. The electronic device according to claim 2, characterized in that: The sensor, the first substrate, and the plurality of first conductive portions at least partially overlap.

7. The electronic device according to claim 1, characterized in that: The plurality of first conductive portions are part of the second substrate, protrude from an upper surface of the second substrate toward the first substrate, and are electrically connected to the first substrate.

8. The electronic device according to claim 1, characterized in that: The plurality of first conductive parts are a plurality of metal welding balls.

9. The electronic device according to claim 1, characterized in that: The height of the first conductive portion ranges from 30 micrometers to 50 micrometers.

10. The electronic device according to claim 1, characterized in that: The shell is made of metal material and has at least one groove, and the first cavity is formed in the at least one groove.

11. The electronic device according to claim 1, characterized in that: The second conductive part is disposed around the housing and the second substrate, and the housing is electrically connected to the second substrate through the second conductive part.

12. The electronic device according to claim 1, characterized in that: An opening is included to connect the second cavity with the outside air so as to release the pressure in the second cavity.

13. The electronic device according to claim 12, characterized in that: The opening is located on the housing.

14. The electronic device according to claim 1, characterized in that: The mass block is disposed on the diaphragm and located in the first cavity.

15. The electronic device according to claim 1, characterized in that: The mass block is disposed on the diaphragm and outside the first cavity.

16. The electronic device according to claim 1, characterized in that: It comprises a fixing ring which is arranged between the diaphragm and the partition wall structure, and the fixing ring is made of a rigid material.

17. The electronic device according to claim 16, characterized in that: The fixing ring and the partition wall structure are an integrally formed ring structure.

18. The electronic device according to claim 1, characterized in that: The partition wall structure and the first substrate together form a printed circuit board structure with a groove.

19. The electronic device according to claim 1, characterized in that: The first cavity and the second cavity are two independent chambers.

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