Package Structure of Electronic Components and Electronic Products

Abstract

The present invention provides a packaging structure for electronic components and an electronic product, wherein the packaging structure is used to fix the electronic components. The electronic components have an installation surface. The packaging structure includes a mounting base and at least one through hole. An installation groove is formed in the mounting base. The electronic components can be accommodated in the installation groove, and the installation surface of the electronic components is close to or in contact with the bottom surface of the installation groove. The through hole is formed through the bottom surface of the installation groove and is used to fill the adhesive. The adhesive adheres at least the installation surface and the side wall of the through hole, so that the electronic components are fixedly connected to the mounting base, and the adhesive is adhered to the electronic components only at the installation surface. In the embodiment of the present invention, the adhesive is injected through the through hole formed in the bottom surface of the installation groove to bond the electronic components, and the bonding is only performed on the installation surface of the electronic components, reducing the amount of the adhesive used. At the same time, when it is necessary to remove the electronic components, it is only necessary to break the adhesive from the back side of the bottom surface of the installation groove, without affecting the electronic components.

Description

Technical Field

[0001] The present invention generally relates to the technical field of electronic components, and particularly to a packaging structure of an electronic component and an electronic product. Background Art

[0002] With the development of technology and the change of user requirements, the integration requirements for electronic products are getting higher and higher. The packaging volume of the electronic components therein is getting smaller and smaller. To make full use of the internal space of the electronic product and simplify the packaging structure of the electronic components, more and more electronic products currently adopt the method of dispensing fixation to package the electronic components.

[0003] However, the dispensing packaging method in the prior art is relatively simple, and there is usually a problem of excessive use of the adhesive, resulting in the exposure of the adhesive after curing, which affects the beauty of the electronic product. At the same time, the excessive use of the adhesive will also make it difficult to remove the electronic component when replacing it. It is often necessary to damage the electronic component to remove it from the electronic product. The process of replacing the electronic component is complex, costly, and the electronic component cannot be recycled, resulting in waste of resources.

[0004] The patent with the publication number CN 215599695 U discloses a face recognition module, in which a series of parameter tests can be carried out only after the adhesive is completely cured. Once the performance parameters cannot meet the production requirements, it is necessary to adjust the electronic components therein. This traditional packaging structure cannot completely remove the electronic components, resulting in a large amount of waste. The patent with the publication number CN 207068919 U discloses a dam-type packaging structure. This packaging method requires a large amount of adhesive, resulting in a significant increase in production costs, and there is also a problem of difficult removal of electronic components.

[0005] The content in the background art part is only the technology known to the inventor and does not of course represent the prior art in this field. Summary of the Invention

[0006] In view of one or more defects in the prior art, the present invention provides a packaging structure of an electronic component for fixing an electronic component. The electronic component has an installation surface, and the packaging structure includes:

[0007] A mounting seat, an installation groove is formed in the mounting seat, the electronic component can be accommodated in the installation groove, and the installation surface of the electronic component is close to or abuts against the bottom surface of the installation groove; and

[0008] At least one through hole, the through hole is opened through the bottom surface of the mounting groove; the through hole is used to fill the adhesive, the adhesive at least bonds the mounting surface and the side wall of the through hole, so that the electronic component is fixedly connected to the mounting seat, and the adhesive and the electronic component are only bonded at the mounting surface.

[0009] According to one aspect of the present invention, there are a plurality of through holes, and the plurality of through holes are all arranged through the bottom surface of the mounting groove.

[0010] According to one aspect of the present invention, the through hole has a contraction portion and at least one expansion portion, the longitudinal cross-sectional width of the expansion portion is greater than the longitudinal cross-sectional width of the contraction portion, and the expansion portion is close to the mounting surface and / or away from the mounting surface.

[0011] According to one aspect of the present invention, the cross section of the through hole is approximately I-shaped, the through hole has two expansion portions, and the contraction portion is located between the two expansion portions.

[0012] According to one aspect of the present invention, the connection position between the contraction portion and the expansion portion has a continuously changing curved surface or inclined surface.

[0013] According to one aspect of the present invention, the packaging structure further includes a blocking member, which is detachably disposed on a side of the through hole away from the mounting surface, and is connected to the mounting seat via the adhesive.

[0014] According to one aspect of the present invention, the blocking member is a light-transmitting structure, the adhesive is a light-curing adhesive, and the adhesive is cured by light passing through the blocking member.

[0015] According to one aspect of the present invention, a groove is formed on the bottom surface of the mounting seat, the blocking member is embedded in the groove, and a side of the blocking member facing away from the through hole does not protrude from the bottom surface of the mounting seat.

[0016] According to one aspect of the present invention, the mounting surface of the electronic component is close to the bottom surface of the mounting groove, and a thermal pad is provided between the bottom surface of the mounting groove and the mounting surface of the electronic component, and two sides of the thermal pad are respectively attached to the bottom surface of the mounting groove and the mounting surface; the thermal pad is provided with at least one reserved hole, and the reserved hole corresponds to the position of the through hole.

[0017] According to one aspect of the present invention, the thermally conductive pad is a silicone pad or a graphite heat sink.

[0018] According to one aspect of the present invention, the expansion part is close to the mounting surface, and the connection position between the contraction part and the expansion part forms a preset angle, so that light can irradiate from one end of the through hole far from the mounting surface to one end close to the mounting surface, and cover all positions of the expansion part.

[0019] According to one aspect of the present invention, the groove has a notch, and the plugging member has a handle position, and the handle position corresponds to the position of the notch. The handle position is configured to be able to be stressed so that the plugging member can be removed from the groove.

[0020] According to one aspect of the present invention, the present invention further includes an electronic product, and the electronic product includes:

[0021] A main body having a mounting seat on the main body;

[0022] A circuit board disposed inside the main body; and

[0023] At least one electronic component, which is fixed to the mounting seat through the packaging structure as described above, and the electronic component is also signal-connected to the circuit board.

[0024] According to one aspect of the present invention, the electronic product further includes an upper cover, the upper cover is buckled on the main body, and the electronic component is accommodated between the upper cover and the main body; the upper cover has an opening, and the functional part of the electronic component is exposed from the opening to realize its use function.

[0025] According to one aspect of the present invention, the electronic product further includes a sealing member, the sealing member is disposed on the circumference of the opening of the upper cover, and the sealing member is recessed in the outer surface of the upper cover or flush with the outer surface of the upper cover.

[0026] Compared with the prior art, the embodiment of the present invention provides a packaging structure for fixing and packaging electronic components. The adhesive is injected through the through hole opened on the bottom surface of the installation groove to bond the electronic components, and only bonded on the mounting surface of the electronic components, reducing the amount of adhesive used. At the same time, when the electronic component needs to be removed, it only needs to break the adhesive from the side of the electronic component far from the bottom surface of the installation groove, and it will not affect the electronic component. The present invention also includes a structure of an electronic product, which uses the foregoing packaging structure to package the electronic components, facilitating the removal and replacement of the electronic components, and reducing the production and maintenance costs. Description of the Drawings

[0027] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention. In the drawings:

[0028] Figure 1 It is a schematic cross-sectional view of the encapsulation structure in an embodiment of the present invention;

[0029] Figures 2A - 2C It is a schematic cross-sectional view of the encapsulation structure in an embodiment of the present invention;

[0030] Figure 3 It is a schematic cross-sectional view of the encapsulation structure with a finger grip position in an embodiment of the present invention;

[0031] Figure 4 It is a schematic cross-sectional view of the through hole in an embodiment of the present invention;

[0032] Figure 5A and Figure 5B It is a schematic view after the adhesive is cured in an embodiment of the present invention;

[0033] Figure 6 It is an explosion schematic view of the electronic product in an embodiment of the present invention;

[0034] Figure 7 It is a schematic cross-sectional view of the electronic product in an embodiment of the present invention.

[0035] Reference numerals: 100, encapsulation structure; 110, mounting base; 111, mounting groove; 120, through hole; 121, constriction portion; 122, expansion portion; 130, plugging member; 131, finger grip position; 140, thermal pad; 200, electronic component; 1, electronic product; 10, main body; 20, circuit board; 30, upper cover; 40, seal. Detailed implementation manners

[0036] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0037] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0038] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection: it may be a mechanical connection, an electrical connection or a connection capable of mutual communication; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present invention, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely means that the horizontal height of the first feature is lower than that of the second feature.

[0040] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0041] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for explaining and illustrating the present invention, and are not used to limit the present invention.

[0042] Figure 1 A cross-section of the encapsulation structure 100 according to an embodiment of the present invention is shown and will be described in detail below in conjunction with Figure 1 Detailed description.

[0043] The encapsulation structure 100 is used to fix the electronic component 200, where the electronic component 200 has an installation surface. The installation surface of a conventional electronic component is usually arranged on the opposite side of the side where the function is realized. For example, the installation surface of a light emitter is usually arranged on the opposite side of the light-emitting component.

[0044] As Figure 1 shown, the encapsulation structure 100 includes a mounting base 110 and at least one through hole 120. The mounting base 110 can be the main structure of an electronic product or can be separately provided and connected to the main structure for easy disassembly and replacement. An installation groove 111 is formed in the mounting base 110. The electronic component 200 is accommodated in the installation groove 111, and the installation surface of the electronic component 200 is close to or in contact with the bottom surface of the installation groove 111. Preferably, the shape of the installation groove 111 is similar to the shape of the electronic component 200, which can further define the position of the electronic component 200 to reduce the shaking degree of the electronic component 200 and prevent the electronic component 200 from falling off.

[0045] The through hole 120 is formed through the bottom surface of the mounting groove 111. The through hole 120 is used to fill the adhesive. The adhesive is adhered to at least the mounting surface of the electronic component 200 and the side wall of the through hole 120, so as to realize the fixed connection between the electronic component 200 and the mounting base 110. And the adhesive is adhered and fixed to the electronic component 200 only at the mounting surface, which can reduce the amount of the adhesive used, prevent the occurrence of glue overflow, affect the appearance of the electronic product, and at the same time can also reduce the difficulty of disassembling the electronic component 200 and the difficulty of cleaning the adhesive. When it is necessary to remove the electronic component 200 from the mounting base 110, only need to break the adhesive from the side of the bottom surface of the mounting groove 111 away from the electronic component 200, then the electronic component 200 can be separated from the mounting base 110. After removing the residual adhesive on the mounting surface, the disassembled electronic component 200 can still be used normally, enabling the electronic component 200 to be reused and reducing resource waste.

[0046] For the electronic component 200 with a larger size, a plurality of through holes 120 can be formed on the bottom surface of the mounting groove 111, for example Figure 2C as shown, so as to increase the bonding area between the adhesive and the mounting base 110, ensure the bonding strength, control the amount of the adhesive used, reduce the production cost, and at the same time can also shorten the curing time of the adhesive and improve the production and processing efficiency.

[0047] According to different embodiments of the present invention, the shape of the through hole 120 can be set according to the structure and size of the electronic component 200. For example, for the elongated electronic component 200, a plurality of through holes 120 can be arranged side by side in the extending direction of the electronic component 200, or the through hole 120 can be set in a strip shape, for example Figure 5B as shown, so as to increase the bonding strength between the electronic component 200 and the mounting base 110.

[0048] According to a preferred embodiment of the present invention, the through hole 120 can be processed into the shape as Figures 2A - 2C shown, having a constriction portion 121 and a dilation portion 122. Specifically, the longitudinal cross-sectional width of the dilation portion 122 is greater than the longitudinal cross-sectional width of the constriction portion 121. Preferably, the dilation portion 122 and the constriction portion 121 are arranged substantially concentrically. For example, both the constriction portion 121 and the dilation portion 122 are cylindrical, and the axes of the cylinders are substantially collinear. The longitudinal direction described here is the direction from the electronic component 200 to the bottom surface of the mounting groove 111, and the position of the dilation portion 122 is close to or far from the mounting surface. The specific setting form will be described in detail in the subsequent embodiments in combination with Figures 2A - 2C detailed description.

[0049] Wherein the dilation portion 122 is arranged at a position away from the mounting surface of the electronic component 200, for example Figure 2AAs shown, the inner surface area of ​​the through hole 120 is increased, thereby increasing the bonding area with the adhesive, and improving the bonding strength between the electronic component 200 and the mounting seat 110. At the same time, the structural characteristics of the expansion portion 122 can be utilized, and the cured adhesive and the step or inclined surface at the connection position of the contraction portion 121 and the expansion portion 122 in the through hole 120 abut against each other, which can also prevent the electronic component 200 from falling out of the mounting groove 111. Figure 2A The I-beam adhesive shown in FIG. 1 is supplemented in subsequent examples.

[0050] According to a preferred embodiment of the present invention, the through hole 120 has an expansion portion 122 at a position close to the mounting surface and a position away from the mounting surface, and the middle position of the through hole 120 shrinks inwardly. Specifically, the cross-sectional shape of the through hole 120 is as follows: Figure 2B As shown, at a position close to the mounting surface of the electronic component 200 , the cross-sectional width of the through hole 120 is increased, thereby increasing the bonding area between the adhesive and the electronic component 200 and further improving the stability of the electronic component 200 .

[0051] Figure 2C The specific case of having two through holes 120 is shown. When the size of the electronic component 200 is relatively large, multiple through holes 120 may be provided on the bottom surface of the mounting groove 111. The shapes and sizes of the multiple through holes 120 may be the same or different. Specifically, the positions of the multiple through holes 120 may be evenly arranged, or may be arranged according to the distribution of the center of gravity of the electronic component 200, or according to the direction of the external force that the electronic component 200 may be subjected to.

[0052] According to a preferred embodiment of the present invention, the cross section of the through hole 120 is approximately I-shaped, and the through hole 120 has two expansion portions 122, and the contraction portion 121 is located in the middle of the two expansion portions 122, for example Figure 2B The connection position of the contraction portion 121 and the expansion portion 122 has a continuously defended curved surface or inclined surface, and right-angle bends or sharp-angle bends are minimized to allow the adhesive to fully fill the through hole 120, avoiding the occurrence of voids that affect the bonding strength, especially at one end of the through hole 120 close to the mounting surface of the electronic component 200.

[0053] like Figure 3 As shown, according to a preferred embodiment of the present invention, the packaging structure 100 further includes a plugging member 130, which is detachably disposed on a side of the through hole 120 away from the mounting surface, and the plugging member 130 is connected to the mounting seat 110 via an adhesive. The plugging member 130 can plug the through hole 120 before the adhesive is cured to prevent the adhesive from overflowing, and after the adhesive is cured, the plugging member 130 is fixedly connected to the mounting seat 110, further improving the overall stability of the packaging structure 100. The plugging member 130 is detachably bonded and fixed to the mounting seat 110, and further, as shown in FIG. Figure 3As shown, a groove is formed on the bottom surface of the mounting base 110, and the sealing member 130 is sunken and embedded in the groove, and the side of the sealing member 130 facing away from the through hole 120 does not protrude from the bottom surface of the mounting base 110. During normal use, the sealing member 130 sinks in the mounting base 110, avoiding occupying the space inside the electronic product and ensuring the stability of the encapsulation structure 100. When it is necessary to remove and replace the electronic component 200, the sealing member 130 is removed from the bottom surface of the mounting base 110 to expose the through hole 120. After removing the cured adhesive, the electronic component 200 can be completely removed without affecting the reuse of the electronic component 200.

[0054] In a preferred embodiment of the present invention, as Figure 3 shown, the groove formed on the bottom surface of the mounting base 110 for accommodating the sealing member 130 has a notch, the sealing member 130 has a handle position 131, and the handle position 131 corresponds to the position of the notch on the groove. The handle position 131 is used to facilitate the removal of the sealing member 130. For example, an inclined surface facing the inside of the mounting base 110 is provided on one side of the sealing member 130. When it is necessary to remove the sealing member 130, the sealing member 130 is pulled outward from the position of the handle position 131, so that the sealing member 130 is separated from the adhesive, and the sealing member 130 is removed from the mounting base 110.

[0055] According to a preferred embodiment of the present invention, the adhesive is selected as a photo-curable adhesive, which remains transparent after curing, does not affect the aesthetic degree of the electronic product, does not generate volatile gases, is environmentally friendly, has a fast curing speed, stable properties, good compatibility, and can be injected and cured repeatedly. When the photo-curable adhesive is used as the adhesive, the sealing member 130 can be set as a light-transmitting structure. Before the adhesive is cured, the sealing member 130 is installed, and then cured by ultraviolet irradiation to ensure the bonding and fixing of the sealing member 130, the mounting base 110 and the electronic component 200. When it is necessary to remove the electronic component 200, first remove the sealing member 130, and the photo-curable adhesive can be brushed with a debonding agent, such as acetone, to soften the photo-curable adhesive, so as to ensure the removal without damaging the electronic component 200.

[0056] Furthermore, in a preferred embodiment of the present invention, the adhesive is selected as a photo-curable adhesive. To ensure the curing effect of the adhesive, the through hole 120 can be set in the shape as Figure 4 shown, the expansion portion 122 is close to the mounting surface of the electronic component 200, and the connection position between the contraction portion 121 and the expansion portion 122 forms a preset angle, forming an approximately open shape, so that light can irradiate from the end of the through hole 120 far from the mounting surface to the end close to the mounting surface and cover all positions of the expansion portion 122 to ensure the sufficient curing of the adhesive in the through hole 120. After the adhesive is cured, it forms as Figure 5A or Figure 5BAccordingly, in the embodiment where the through hole 120 is arranged in an I-shape, the connection position of the expansion portion 122 away from the mounting surface and the contraction portion 121 can be arranged as follows: Figure 4 The right-angle bend shown will not be blocked by the structure of the mounting base 110 and thus will not be unable to fully receive ultraviolet radiation.

[0057] According to a preferred embodiment of the present invention, Figure 2A and Figure 2C As shown, the packaging structure 100 also includes a thermal pad 140. In this embodiment, the mounting surface of the electronic component 200 is close to the bottom surface of the mounting groove 111. The thermal pad 140 is arranged between the mounting surface and the mounting groove 111, and is used to transfer the heat generated when the electronic component 200 is powered on to the mounting seat 110, and the mounting seat 110 assists in heat dissipation. Preferably, the thermal pad 140 is a silicone pad or a graphite heat sink. In some embodiments of the present invention, the mounting seat 110 is made of metal material, which ensures the structural strength of the electronic product and can improve the heat dissipation speed and accelerate the heat dissipation. In addition, at least one reserved hole 141 is opened on the thermal pad 140, and the position of the reserved hole 141 corresponds to the position of the through hole 120.

[0058] like Figure 2A As shown, when the packaging structure 100 has a through hole 120, a reserved hole 141 can be opened on the thermal pad 140, and the position of the reserved hole 141 corresponds to the position of the through hole 120, so as to avoid the adhesive from adhering to the thermal pad 140 and reducing the bonding strength between the electronic component 200 and the mounting base 110. Preferably, as Figure 2A As shown, the cross-sectional width of the reserved hole 141 is greater than the cross-sectional width of the through hole 120 near the mounting surface, and the through hole 120 and the reserved hole 141 opened on the thermal pad 140 together form an I-shaped glue injection space, and this structure can simplify the processing of the mounting seat 110 and reduce the processing difficulty of the mounting seat 110. Of course, in some embodiments of the present invention, the cross-sectional width of the reserved hole 141 can also be set to be the same as the cross-sectional width of the through hole 120 near the mounting surface.

[0059] like Figure 2CAs shown, in some embodiments of the present invention, the packaging structure 100 includes a plurality of through holes 120, and a plurality of reserved holes 141 are provided on the thermal pad 140, and the positions thereof correspond to the positions of the through holes 120, so as to ensure that the adhesive can be bonded to the mounting surface of the electronic component 200. For example, the number of the reserved holes 141 on the thermal pad 140 is the same as the number of the through holes 120, and the positions thereof correspond one to one, and the adhesive is directly bonded to the mounting surface of the electronic component 200. Alternatively, further, the cross-sectional width of the reserved holes 141 in this embodiment is greater than the cross-sectional width of the through hole 120 at one end close to the mounting surface, and the reserved holes 141 provided on the through hole 120 and the thermal pad 140 together form an I-shaped glue injection space. In other embodiments of the present invention, the reserved holes 141 on the thermal pad 140 can be configured to cover the positions of multiple through holes 120. The cross-sectional size of the reserved holes 141 is relatively large. After the adhesive is injected into the multiple through holes 120, the adhesive fills the space of the reserved holes 141 and together forms a larger bonding surface, which is confined within the range of the reserved holes 141. When light-curing glue is used as the adhesive, the angle of the connection position of the expansion part 122 and the contraction part 121 can also be designed to ensure that ultraviolet rays can irradiate the entire position of the adhesive.

[0060] Figure 6 and Figure 7 The specific structure of an electronic product 1 according to an embodiment of the present invention is shown, wherein the electronic component 200 is fixed by using the aforementioned packaging structure 100. Figure 6 and Figure 7 The application of the packaging structure 100 in the electronic product 1 is described in detail.

[0061] like Figure 6 As shown, the electronic product 1 includes a main body 10, a circuit board 20 and at least one electronic component 200, wherein the main body 10 has a mounting seat 110. Specifically, the mounting seat 110 may be directly arranged at a preset position of the main body 10, or a structure cooperating with the mounting seat 110 may be arranged on the main body 10 so that the mounting seat 110 can be installed at a preset position of the main body 10. The circuit board 20 is arranged in the main body 10, and the electronic component 200 is fixed on the mounting seat 110 by means of the aforementioned packaging structure 100. At the same time, the electronic component 200 is also connected to the circuit board 20 by signal to realize power supply, control and data interaction of the electronic component 200. In a specific embodiment of the present invention, the electronic product 1 is an image acquisition device, wherein the electronic component 200 includes two types, a light transmitter and a receiver. The light transmitter is relatively small in size and can be packaged by injecting an adhesive into a single through hole 120. Furthermore, the through hole 120 can be arranged into a suitable shape according to the shape and center of gravity distribution of the light transmitter, for example, forming a similar Figure 5BThe shape of the adhesive shown. The receiver is usually larger in size. Multiple through holes 120 can be opened on the bottom surface of the corresponding mounting groove 111 of the receiver, and the adhesive is injected through the multiple through holes to fix and encapsulate the receiver. Correspondingly, reserved holes 141 corresponding to the through holes 120 are opened on the corresponding heat-conducting pads 140 of the optical transmitter and the receiver.

[0062] Furthermore, as Figure 6 and Figure 7 shown, the electronic product 1 further includes an upper cover 30. The upper cover 30 is buckled on the main body 10, and the electronic components 200 are accommodated between the upper cover 30 and the main body 10. Specifically, the upper cover 30 can be processed into a structure with a certain cavity to accommodate the electronic components 200, and completely or semi-encapsulate the main body 10. The outer side wall of the upper cover 30 can be set into other shapes according to specific usage requirements or decoration requirements. The upper cover 30 also has an opening, and the functional part of the electronic component 200 is exposed from the opening to realize its function. For example, the aforementioned image acquisition device, where the electronic component 200 includes an optical transmitter and a receiver. The light-emitting part in the optical transmitter is exposed from the opening on the upper cover 30 and can emit light outward to realize the function of the optical transmitter. The receiver, such as a color lens or an infrared lens, etc., where the lens part is exposed from the opening on the upper cover 30 to avoid being blocked by the upper cover 30. Preferably, as Figure 7 shown, the top surface of the electronic component 200 is recessed into the upper cover 30 or flush with the top surface of the upper cover 30 to avoid the electronic component 200 being affected by external factors such as bumps and scratches. The shape of the opening on the upper cover 30 can also be set to match the electronic component 200 to limit the shaking of the electronic component 200 and further improve the stability of the encapsulation of the electronic component 200.

[0063] As Figure 6 shown, according to a preferred embodiment of the present invention, the electronic product 1 further includes a seal 40. The seal 40 is arranged on the circumference of the opening of the upper cover 30, and the seal 40 is recessed into the outer surface of the upper cover 30 or flush with the outer surface of the upper cover 30. Preferably, the seal 40 is made of a flexible material. The opening on the upper cover 30 is used to cooperate to realize the function of the electronic component 200 and can limit the shaking of the electronic component 200. However, due to the limitations of processing accuracy and assembly process, the opening on the upper cover 30 and the electronic component 200 cannot be completely matched. The seal 40 can play a role in waterproofing and dustproofing, and can also further limit the shaking of the electronic component 200. The seal 40 being recessed into the outer surface of the upper cover 30 or flush with the outer surface of the upper cover 30 can prevent the seal 40 from falling off the upper cover 30.

[0064] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A packaging structure of an electronic component, used for fixing the electronic component, wherein the electronic component has a mounting surface, and the packaging structure comprises: A mounting seat, wherein a mounting groove is formed in the mounting seat, wherein the electronic component can be accommodated in the mounting groove, and wherein the mounting surface of the electronic component is close to or in contact with the bottom surface of the mounting groove; and at least one through hole, the through hole being opened through the bottom surface of the mounting groove; the through hole being used to be filled with an adhesive, the adhesive at least bonding the mounting surface and the side wall of the through hole so that the electronic component is fixedly connected to the mounting seat, and the adhesive and the electronic component are bonded only at the mounting surface; A blocking member, the blocking member is detachably disposed on a side of the through hole away from the mounting surface, and the blocking member is connected to the mounting seat via the adhesive; Among them, a groove is provided on the bottom surface of the mounting seat, the sealing member is embedded in the groove, and the side of the sealing member facing away from the through hole does not protrude from the bottom surface of the mounting seat; the groove has a notch, and the sealing member has a latch position, the latch position corresponds to the position of the notch, and the latch position is configured to be able to bear force so that the sealing member can be removed from the groove; the latch position includes an inclined surface on one side of the sealing member facing the inside of the mounting seat. 2 . The packaging structure according to claim 1 , wherein there are a plurality of through holes, and the plurality of through holes are all arranged through the bottom surface of the mounting groove.

3. The packaging structure according to claim 1 or 2, wherein the through hole has a contraction portion and at least one expansion portion, the longitudinal cross-sectional width of the expansion portion is greater than the longitudinal cross-sectional width of the contraction portion, and the expansion portion is close to the mounting surface and / or away from the mounting surface. 4 . The packaging structure according to claim 3 , wherein the cross-section of the through hole is approximately I-shaped, the through hole has two expansion portions, and the contraction portion is located between the two expansion portions. 5 . The packaging structure according to claim 3 , wherein a connection position between the contraction portion and the expansion portion has a continuously changing curved surface or inclined surface. 6 . The packaging structure according to claim 1 , wherein the sealing member is a light-transmitting structure, the adhesive is a light-curing adhesive, and the adhesive is cured by light passing through the sealing member.

7. The packaging structure according to claim 1, wherein the mounting surface of the electronic component is close to the bottom surface of the mounting groove, and a thermal pad is also arranged between the bottom surface of the mounting groove and the mounting surface of the electronic component, and two sides of the thermal pad are respectively attached to the bottom surface of the mounting groove and the mounting surface; the thermal pad is provided with at least one reserved hole, and the reserved hole corresponds to the position of the through hole. The packaging structure according to claim 7 , wherein the thermal pad is a silicone pad or a graphite heat sink.

9. The packaging structure according to claim 3, wherein the expansion portion is close to the mounting surface, and the connection position of the contraction portion and the expansion portion forms a preset angle, so that light can be irradiated from one end of the through hole away from the mounting surface to the end close to the mounting surface and cover the entire position of the expansion portion.

10. An electronic product, comprising: a main body, on which there is a mounting seat; a circuit board, which is disposed inside the main body; and at least one electronic component, which is fixed to the mounting seat through the encapsulation structure according to any one of claims 1-9, and the electronic component is also signal-connected to the circuit board.

11. The electronic product according to claim 10, further comprising an upper cover, which is buckled on the main body, and the electronic component is accommodated between the upper cover and the main body; the upper cover has an opening, and the functional part of the electronic component is exposed from the opening to realize its use function.

12. The electronic product according to claim 11, further comprising a sealing member, which is disposed on the circumference of the opening of the upper cover, and the sealing member is recessed in the outer surface of the upper cover or flush with the outer surface of the upper cover.

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