Cutting processing method and system

Abstract

The present invention discloses a cutting method and system. After receiving a cutting instruction for a material to be cut, the method controls a first laser to emit a first positioning laser, and at the same time controls a second laser to emit a second positioning laser; along the length direction of the material to be cut, controls a preset conveying device to convey the material to be cut to a positioning cutting area; when a preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by a third laser is focused on the preset cutting position, performs laser cutting at the preset cutting position through the positioning cutting laser to cut a cutting line on the material to be cut; controls the preset conveying device to continue to convey the material to be cut along the length direction of the material to be cut to a preset cutting area, and after an aligning cutter above the cutting line in the preset cutting area aligns with the cutting line and cuts off the material to be cut, confirms the completion of the current cutting. The present invention improves the accuracy and efficiency of laser cutting.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and particularly relates to a cutting method and system. Background Art

[0002] In existing laser processing equipment, the cutting of straight plate-shaped materials is already very mature and perfect. However, in the prior art, when cutting roll-to-piece materials by laser cutting, there is still a problem of low cutting accuracy. The main reasons for this phenomenon are as follows: First, due to the excessive length of the roll-to-piece materials, during the cutting process of the roll-to-piece materials, the position of the materials often deviates from the original track. At this time, the cutting position will deviate. Second, when cutting the roll-to-piece materials with a cutting knife, it is very difficult to adjust the cutting knife to be horizontally consistent with the roll-to-piece materials to be cut. In this way, there will be an error in the cutting position of the materials, further reducing the cutting accuracy. Summary of the Invention

[0003] Embodiments of the present invention provide a cutting method and system to solve the problem of low cutting accuracy when cutting roll-to-piece materials by laser cutting.

[0004] A cutting method includes:

[0005] After receiving a cutting instruction for cutting a material to be cut, controlling a first laser to emit a first positioning laser, and simultaneously controlling a second laser to emit a second positioning laser parallel to the first positioning laser; the cutting instruction includes a preset cutting position on the material to be cut; the laser distance between the first positioning laser and the second positioning laser is equal to the material width of the material to be cut;

[0006] Controlling a preset conveying device to convey the material to be cut along the length direction of the material to be cut to a positioning cutting area below a third laser; the length direction is perpendicular to the width direction, and the material to be cut is always located between and in contact with the first positioning laser and the second positioning laser during the conveying process;

[0007] When the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser is focused on the preset cutting position, performing laser cutting at the preset cutting position through the positioning cutting laser to cut a cutting line perpendicular to the first positioning laser on the material to be cut;

[0008] Control the preset conveying device to continue to convey the material to be cut along the length direction of the material to be cut to a preset cutting area. After aligning the cutting line with a cutting knife located above the cutting line in the preset cutting area and cutting off the material to be cut, confirm that this cutting is completed.

[0009] A cutting processing system includes a first laser, a second laser, a third laser, a preset conveying device, a cutting working platform, a cutting working platform, a cutting knife, and a controller; the controller is used to execute the above cutting processing method.

[0010] In the above cutting processing method and system, after receiving a cutting instruction for cutting a material to be cut, control the first laser to emit a first positioning laser, and at the same time control the second laser to emit a second positioning laser parallel to the first positioning laser; the cutting instruction includes a preset cutting position on the material to be cut; the laser distance between the first positioning laser and the second positioning laser is equal to the material width of the material to be cut; along the length direction of the material to be cut, control the preset conveying device to convey the material to be cut to a positioning cutting area below the third laser; the length direction is perpendicular to the width direction, and the material to be cut is always located between the first positioning laser and the second positioning laser and fits with them during the conveying process; when the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser is focused on the preset cutting position, perform laser cutting at the preset cutting position through the positioning cutting laser to cut a cutting line perpendicular to the first positioning laser on the material to be cut; control the preset conveying device to continue to convey the material to be cut along the length direction of the material to be cut to a preset cutting area. After aligning the cutting line with a cutting knife located above the cutting line in the preset cutting area and cutting off the material to be cut, confirm that this cutting is completed.

[0011] In the present invention, two lasers (i.e., the first laser and the second laser) are used to position the material to be cut, and during the process of conveying the material to be cut, the laser distance between the first positioning laser and the second positioning laser is kept equal to the material width of the material to be cut, thereby ensuring that the material to be cut is always in a horizontal state, providing a prerequisite for stable cutting for subsequent laser cutting of the material to be cut, and thus improving the cutting accuracy of the material to be cut. By using the third laser to cut a cutting line at the preset cutting position of the material to be cut, when cutting off the material to be cut by aligning the cutting knife with the cutting line, the cutting-off process of the material to be cut can be completed quickly and accurately. Description of the Drawings

[0012] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0013] Figure 1 is a schematic diagram of a cutting processing system in an embodiment of the present invention;

[0014] Figure 2 is a flowchart of a cutting processing method in an embodiment of the present invention;

[0015] Figure 3 is a flowchart of step S20 in the cutting processing method in an embodiment of the present invention;

[0016] Figure 4 is another flowchart of step S20 in the cutting processing method in an embodiment of the present invention;

[0017] Figure 5 is a flowchart of step S30 in the cutting processing method in an embodiment of the present invention;

[0018] Figure 6 is a flowchart of step S40 in the cutting processing method in an embodiment of the present invention; Detailed implementation manners

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0020] The present invention provides a cutting processing method, which can be applied to, for example, Figure 1 the controller of the cutting processing system as shown, the cutting processing system includes a first laser 1, a second laser 2, a third laser 4, a preset transfer device 3, a cutting workbench 5, a trimming workbench (not shown in Figure 1 ) and a trimming knife 6 and a controller.

[0021] In an embodiment, as Figure 2 shown, a cutting processing method is provided, including the following steps:

[0022] S10: After receiving a cutting instruction for cutting a material to be cut, control the first laser 1 to emit a first positioning laser, and at the same time control the second laser 2 to emit a second positioning laser parallel to the first positioning laser; the cutting instruction includes a preset cutting position on the material to be cut; the laser distance between the first positioning laser and the second positioning laser is equal to the material width of the material to be cut.

[0023] Optionally, the material to be cut can be a straight plate-shaped material of various materials, or a coil material; when the material to be cut is a coil material, the material to be cut is stretched and placed on a preset conveying device 3. It can be understood that the cutting instruction can be sent by the staff responsible for cutting, or can be automatically generated after the material to be cut is placed on the preset conveying device 3. The preset cutting position refers to the cutting position set in advance manually, and there can be one or more preset cutting positions on a material to be cut. Optionally, the first laser 1 and the second laser 2 can be an infrared laser or a green laser, etc. Since the infrared laser has a more intuitive and obvious visible beam, in this embodiment, the first laser 1 and the second laser 2 are preferably infrared lasers.

[0024] Further, the first positioning laser refers to the visible beam emitted by the first laser 1, and the second positioning laser refers to the visible beam emitted by the second laser 2, and the first positioning laser is parallel to the second positioning laser; it can be understood that the first positioning laser and the second positioning laser are jointly used to position the material to be cut, that is, when the material width of the material to be cut (the material width refers to the width value of the material to be cut) is equal to the laser distance between the first positioning laser and the second laser, it indicates that the material to be cut does not block the optical path of the first positioning laser or the second positioning laser, and then it is determined that the positioning of the material to be cut is successful, improving the positioning accuracy of the material to be cut. Further, by comparing the laser distance with the material width to determine whether the material to be cut is accurately positioned, it indicates that the first laser 1 and the second laser 2 can be set at the starting end or the end of the material length direction of the material to be cut at the same time, or the first laser 1 and the second laser 2 can be respectively set at the starting end and the end of the material length direction of the material to be cut (for example, the first laser 1 is set at the starting end of the material length of the material to be cut, and the second laser 2 is set at the end of the material length of the material to be cut).

[0025] S20: Along the length direction of the material to be cut, control the preset conveying device 3 to convey the material to be cut to a positioning and cutting area below the third laser 4; the length direction is perpendicular to the width direction, and the material to be cut is always located between the first positioning laser and the second positioning laser and fits with them during the conveying process.

[0026] Understandably, the length direction of the material to be cut is also the direction parallel to the first positioning laser and the second positioning laser. The third laser 4 can be a galvanometer laser welder. The third laser 4 can control the laser to focus on the preset cutting position of the material to be cut through the swing of the galvanometer for laser cutting. Preferably, the cutting speed of the third laser 4 is 500 mm / s, the cutting frequency is 500 KHZ, and the cutting power is 10 W. Optionally, the preset conveying device 3 can be a conveying device composed of a conveyor belt or a conveying device composed of multiple conveying shafts. The positioning cutting area refers to the area for laser cutting the material to be cut.

[0027] Specifically, after controlling the first laser 1 to emit the first positioning laser and simultaneously controlling the second laser 2 to emit the second positioning laser parallel to the first positioning laser, along the length direction of the material to be cut, control the preset conveying device 3 to convey the material to be cut to the positioning cutting area below the third laser 4. And during the conveying process of the material to be cut, it is necessary to detect in real time whether the material to be cut is always located between the first positioning laser and the second positioning laser and is in contact with them, so as to ensure that the position of the material to be cut is not moved after being conveyed to the positioning cutting area, and then laser cutting can be accurately performed at the preset cutting position of the material to be cut, improving the accuracy of cutting processing.

[0028] In one embodiment, as Figure 3 shown, in step S20, that is, along the length direction of the material to be cut, controlling the preset conveying device 3 to convey the material to be cut to the positioning cutting area below the third laser 4 includes:

[0029] S201: Detect in real time whether the material to be cut exceeds the preset positioning area during the conveying process; the preset positioning area refers to the area between the first positioning laser and the second positioning laser.

[0030] Understandably, in order to ensure that the position of the material to be cut is not moved after being conveyed to the positioning cutting area, and then laser cutting can be accurately performed at the preset cutting position of the material to be cut, improving the accuracy of cutting processing. Therefore, during the conveying process of the material to be cut, it is necessary to detect in real time whether the material to be cut is located in the preset positioning area during the conveying process, that is, to detect in real time whether the material to be cut is between the first positioning laser and the second positioning laser and is in contact with them.

[0031] S202: When the material to be cut exceeds the preset positioning area during the conveying process, generate a material position adjustment instruction to adjust the material to be cut to the preset positioning area according to the position adjustment instruction.

[0032] Understandably, when it is detected that the material to be cut exceeds the preset positioning area during the conveying process, such as when the material to be cut exceeds the preset positioning area, the laser beams of the first positioning laser and the second positioning laser will be blocked. Furthermore, when it is detected that the laser beams of the first positioning laser and the second positioning laser are blocked, it can be determined that the material to be cut exceeds the preset positioning area at this time, and then a material position adjustment instruction is generated. The material to be cut can be adjusted to the preset positioning area manually, or it can be adjusted to the preset positioning area and fitted with the first positioning laser and the second positioning laser by adjustment devices (such as paddles) arranged on both sides of the preset conveying device 3.

[0033] In another embodiment, as Figure 4 shown, in step S20, that is, controlling the preset conveying device 3 to convey the material to be cut to the positioning and cutting area below the third laser 4 includes:

[0034] S203: Obtain the focal position information of the positioning and cutting laser emitted by the third laser 4 and the cutting position information of the preset cutting position.

[0035] S204: Determine the first moving distance of the material to be cut according to the focal position information and the cutting position information.

[0036] Understandably, the focal position information refers to the position information corresponding to the positioning and cutting laser emitted by the third laser 4 focused on the preset conveying device 3, and the cutting position information refers to the cutting position information of the preset cutting position of the material to be cut when the material to be cut is loaded. The focal position information and the cutting position information should be selected as the position information in the same plane. Furthermore, according to the focal position information and the cutting position information, determine the distance that the material to be cut needs to move to be conveyed to the positioning and cutting area, that is, the first moving distance. Understandably, the first moving distance directly determined by the focal position information and the cutting position information can directly make the preset cutting position of the material to be cut coincide exactly with the position where the positioning and cutting laser emitted by the third laser 4 is focused. Furthermore, after the preset cutting position moves to the position where the positioning and cutting laser emitted by the third laser 4 is focused, laser cutting can be performed on the preset cutting position of the material to be cut by the third laser 4.

[0037] S205: Drive the material to be cut by the preset conveying device to move the first moving distance towards the positioning and cutting area, so that the preset cutting position moves to the positioning and cutting area, and the positioning and cutting laser emitted by the third laser is focused on the preset cutting position.

[0038] Specifically, after determining the first moving distance of the material to be cut according to the focal position information and the cutting position information, the preset conveying device 3 drives the material to be cut to move the first moving distance towards the positioning cutting area, so that the preset cutting position moves to the positioning cutting area. When the positioning cutting laser emitted by the third laser 4 is focused on the preset cutting position, laser cutting is performed at the preset cutting position through the positioning cutting laser.

[0039] In a specific embodiment, the positioning cutting area includes a cutting working platform 5 located above the preset conveying device 3; after step S20, that is, before laser cutting is performed at the preset cutting position 3 through the positioning cutting laser to cut a cutting line perpendicular to the first positioning laser on the material to be cut, it includes:

[0040] Start the cutting working platform 5 to make the cutting working platform 5 adsorb the material to be cut, so that the end face of the material to be cut facing away from the third laser 4 is attached to the cutting working platform 5.

[0041] It can be understood that in order to improve the accuracy of laser cutting of the material to be cut, a cutting working platform 5 with adsorption ability is provided above the preset conveying device 3 and below the third laser 4 (for example, the upper end face of the cutting working platform is provided with adsorption holes, and the adsorption holes are connected to an adsorption device that can evacuate the adsorption holes. At this time, as long as the material to be cut is laid flat and attached to the upper end face of the cutting working platform, starting the cutting working platform means that the adsorption device starts to evacuate the adsorption holes to adsorb the material to be cut on the cutting working platform). When controlling the preset conveying device 3 to convey the material to be cut to the positioning cutting area located below the third laser 4, and when the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser 4 is focused on the preset cutting position, start the cutting working platform 5 to make the cutting working platform 5 adsorb the material to be cut, so that the end face of the material to be cut facing away from the third laser 4 is attached to the cutting working platform 5, thereby making the material to be cut keep horizontal on the cutting working platform 5, improving the accuracy and efficiency of laser cutting of the material to be cut. It should be noted that the platform width of the cutting working platform 5 is greater than or equal to the material width of the material to be cut, thereby ensuring that the cutting line generated during laser cutting of the material to be cut is accurate (because when the material width of the material to be cut is greater than the platform width of the cutting working platform 5, the material to be cut exceeding the cutting working platform 5 cannot be ensured to be horizontal, which may lead to deviation in the cutting result of the material to be cut).

[0042] S30: When the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser 4 is focused on the preset cutting position, perform laser cutting at the preset cutting position through the positioning cutting laser to cut a cutting line perpendicular to the first positioning laser on the material to be cut.

[0043] Specifically, in the length direction of the material to be cut, after controlling the preset conveying device 3 to convey the material to be cut to the positioning cutting area below the third laser 4, when the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser 4 is focused on the preset cutting position, perform laser cutting at the preset cutting position through the positioning cutting laser. The cutting processing speed of the third laser 4 is 500 mm / s, the cutting frequency is 500 KHZ, the cutting power is 10 W, and the number of cutting times is 1 time, so as to cut a cutting line perpendicular to the first positioning laser on the material to be cut. It can be understood that the third laser 4 performs laser cutting on the preset cutting position of the material to be cut, only generating a cutting line and not performing a cutting-off process on the material to be cut at the preset cutting position. This cutting line is obtained through pre-processing (i.e., laser cutting) by the third laser 4, which facilitates accurate cutting of the material to be cut by the cutting knife in step S40, improves the accuracy of laser cutting, and reduces the waste rate of the material to be cut.

[0044] In a specific embodiment, as Figure 5 shown, the cutting instruction further includes the cutting length and cutting width of the cutting line; in step S30, it includes:

[0045] S301: Determine the laser parameters of the third laser 4 according to the cutting length and the cutting width.

[0046] S302: Control the third laser to emit positioning cutting laser corresponding to the laser parameters, and perform laser cutting through the positioning cutting laser focused on the preset cutting position to cut a cutting line with the cutting length and the cutting width at the preset cutting position.

[0047] It can be understood that the cutting length and cutting width refer to the length value and width value that the material to be cut needs to be cut at the preset cutting position. Then, when the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser 4 is focused on the preset cutting position, determine the laser parameters of the third laser 4 according to the cutting length and cutting width. Furthermore, perform laser cutting at the preset cutting position of the material to be cut through the positioning cutting laser containing the laser parameters emitted by the third laser 4 to cut a cutting line perpendicular to the first positioning laser on the material to be cut.

[0048] S40: Control the preset conveying device 3 to continue conveying the material to be cut along the length direction of the material to be cut to a preset cutting area. After aligning with the cutting line by the cutting knife 6 above the cutting line in the preset cutting area and cutting off the material to be cut, confirm that this cutting is completed.

[0049] Understandably, the preset cutting area is an area for performing a cutting process on the cutting line of the material to be cut. The cutting knife 6 is used to cut off the material to be cut.

[0050] Specifically, as Figure 6 shown, in step S40, that is, controlling the preset conveying device 3 to continue conveying the material to be cut along the length direction of the material to be cut to a preset cutting area includes:

[0051] S401: Obtain the cutting position information of the cutting knife 6 and the focal position information of the positioning cutting laser emitted by the third laser 3.

[0052] S402: Determine the second moving distance of the material to be cut according to the cutting position information and the focal position information.

[0053] Understandably, the cutting position information refers to the position information of the cutting knife 6. The focal position information and the cutting position information should be selected as position information in the same plane. Then, according to the cutting position information and the focal position information, the second moving distance of the material to be cut is determined. Understandably, the second moving distance directly determined by the cutting position information and the focal position information can directly make the cutting line of the material to be cut coincide exactly with the position below the cutting knife 6. Then, after the cutting line of the material to be cut moves to the position below the cutting knife 6 (that is, the cutting position information), the cutting line can be aligned by the cutting knife 6 and the material to be cut can be cut off.

[0054] S403: Turn off the cutting workbench 5 and make the cutting workbench 5 release the material to be cut.

[0055] S404: Drive the material to be cut by the preset conveying device to move the second moving distance, so that the cutting line moves from the positioning cutting area to the preset cutting area, and the cutting knife above the cutting line in the preset cutting area is aligned with the cutting line.

[0056] Understandably, in the above embodiments, it is pointed out that when the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser 4 is focused on the preset cutting position, the cutting work platform 5 is started to make the cutting work platform 5 adsorb the material to be cut, so that the end face of the material to be cut facing away from the third laser 4 is attached to the cutting work platform 5. Therefore, after cutting a cutting line perpendicular to the first positioning laser at the preset cutting position of the material to be cut, the cutting work platform 5 is closed to make the cutting work platform 5 release the material to be cut, and then the material to be cut is conveyed by the preset conveying device 3 to move the second moving distance, so that the cutting line moves from the positioning cutting area to the preset cutting area, and then the cutter 6 located above the cutting line in the preset cutting area aligns with the cutting line and cuts off the material to be cut.

[0057] In one embodiment, the positioning cutting area includes a cutting work platform located below the cutter 6 and above the preset conveying device 3; after the material to be cut is continuously conveyed to the preset cutting area, it includes:

[0058] Start the cutting work platform to make the cutting work platform adsorb the material to be cut, so that the end face of the material to be cut facing away from the cutter 6 is attached to the cutting work platform.

[0059] Understandably, in order to improve the accuracy of cutting the material to be cut, a cutting work platform with adsorption ability is arranged above the preset conveying device 3 and below the cutter 6. After the material to be cut is continuously conveyed to the preset cutting area, the cutting work platform is started to make the cutting work platform adsorb the material to be cut, so that the end face of the material to be cut facing away from the cutter 6 is attached to the cutting work platform, and then the material to be cut is kept horizontal on the cutting work platform, improving the accuracy and efficiency of cutting off the material to be cut. It should be noted that the platform width of the cutting work platform should be greater than or equal to the material width of the material to be cut and greater than or equal to the cutter width of the cutter 6.

[0060] In the present invention, the material to be cut is positioned by two lasers (i.e., the first laser 1 and the second laser 2), and the laser distance between the first positioning laser and the second positioning laser is kept equal to the material width of the material to be cut during the process of conveying the material to be cut, thereby ensuring that the material to be cut is always in a horizontal state, providing a prerequisite for stable cutting for subsequent laser cutting of the material to be cut, and then improving the accuracy of cutting the material to be cut. The cutting line is cut at the preset cutting position of the material to be cut by the third laser 4, so that when the material to be cut is cut off by the cutter 6, the cutting-off process of the material to be cut can be completed quickly and accurately.

[0061] In one embodiment, a cutting processing system is provided, including a first laser 1, a second laser 2, a third laser 4, a preset conveying device 3, a cutting workbench 5, a trimming workbench, a trimming knife 6, and a controller; the controller is configured to execute the cutting processing method in the above embodiment.

[0062] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not imply the order of execution. The execution order of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0063] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0064] Those skilled in the art can clearly understand that for the convenience and brevity of description, only the above division of each functional unit and module is used as an example. In practical applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above.

[0065] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A cutting process method, characterized in that, Including: After receiving a cutting instruction for cutting a material to be cut, controlling a first laser to emit a first positioning laser, and simultaneously controlling a second laser to emit a second positioning laser parallel to the first positioning laser; the cutting instruction includes a preset cutting position on the material to be cut; the laser distance between the first positioning laser and the second positioning laser is equal to the material width of the material to be cut; Controlling a preset conveying device to convey the material to be cut along the length direction of the material to be cut to a positioning cutting area below a third laser; The length direction is perpendicular to the width direction, and the material to be cut is always located between and in contact with the first positioning laser and the second positioning laser during the conveying process; When the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser is focused on the preset cutting position, performing laser cutting at the preset cutting position through the positioning cutting laser to cut a cutting line perpendicular to the first positioning laser on the material to be cut; Controlling the preset conveying device to continue to convey the material to be cut along the length direction of the material to be cut to a preset cutting area, so as to align the cutting line with a cutter above the cutting line in the preset cutting area and cut off the material to be cut, and then confirming that this cutting is completed.

2. The cutting method according to claim 1, characterized in that The controlling the preset conveying device to convey the material to be cut along the length direction of the material to be cut to the positioning cutting area below the third laser includes: Real-time detecting whether the material to be cut exceeds a preset positioning area during the conveying process; the preset positioning area refers to the area between the first positioning laser and the second positioning laser; When the material to be cut exceeds the preset positioning area during the conveying process, generating a material position adjustment instruction to adjust the material to be cut to the preset positioning area according to the position adjustment instruction.

3. The cutting process method according to claim 1, wherein The controlling the preset conveying device to convey the material to be cut to the positioning cutting area below the third laser includes: Obtaining focus position information of the positioning cutting laser emitted by the third laser and cutting position information of the preset cutting position; Determining a first moving distance of the material to be cut according to the focus position information and the cutting position information; Driving the material to be cut by the preset conveying device to move the first moving distance towards the positioning cutting area, so that the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser is focused on the preset cutting position.

4. The cutting method according to claim 1, wherein The positioning cutting area includes a cutting working platform located above the preset conveying device and below the third laser; Before performing laser cutting at the preset cutting position through the positioning cutting laser to cut a cutting line perpendicular to the first positioning laser on the material to be cut, it includes: Starting the cutting working platform to make the cutting working platform adsorb the material to be cut, so that the end face of the material to be cut facing away from the third laser is in contact with the cutting working platform.

5. The cutting method according to claim 4, wherein Controlling the preset conveying device to continue conveying the material to be cut along the length direction of the material to be cut to a preset cutting area, so that the cutting knife above the cutting line in the preset cutting area aligns with the cutting line, includes: Obtaining the cutting position information of the cutting knife and the focal position information of the positioning cutting laser emitted by the third laser; Determining the second moving distance of the material to be cut according to the cutting position information and the focal position information; Closing the cutting workbench to make the cutting workbench release the material to be cut; Driving the material to be cut to move the second moving distance through the preset conveying device, so that the cutting line moves from the positioning cutting area to the preset cutting area, and the cutting knife above the cutting line in the preset cutting area aligns with the cutting line.

6. The cutting method according to claim 1, characterized in that, The cutting instruction further includes the cutting length and cutting width of the cutting line; the laser cutting at the preset cutting position by the positioning cutting laser to cut a cutting line perpendicular to the first positioning laser on the material to be cut, includes: Determining the laser parameters of the third laser according to the cutting length and the cutting width; Controlling the third laser to emit positioning cutting laser corresponding to the laser parameters, and performing laser cutting through the positioning cutting laser focused on the preset cutting position, so as to cut a cutting line with the cutting length and the cutting width at the preset cutting position.

7. The cutting process method according to claim 1, characterized in that, The positioning cutting area includes a cutting workbench located below the cutting knife and above the preset conveying device; After continuing to convey the material to be cut to the preset cutting area, it includes: Starting the cutting workbench to make the cutting workbench adsorb the material to be cut, so that the end face of the material to be cut facing away from the cutting knife fits with the cutting workbench.

8. The cutting method according to claim 1, characterized in that The first laser and the second laser are infrared lasers.

9. The cutting and processing method according to claim 1, characterized in that The cutting processing speed of the third laser is 500 mm / s, and the cutting frequency is 500 KHZ.

10. A cutting processing system, characterized in that, Including a first laser, a second laser, a third laser, a preset conveying device, a cutting workbench, a cutting workbench, a cutting knife and a controller; the controller is used to execute the cutting processing method according to any one of claims 1 to 9.

Images