Worktable for laser processing

Abstract

A worktable for laser processing includes a lower plate including a first region, a second region surrounding the first region, and a third region surrounding the second region; a plurality of inner modules disposed on the first region of the lower plate; and a plurality of outer modules disposed on the third region of the lower plate and surrounding the plurality of inner modules.

Description

Technical Field

[0001] This invention relates to a worktable. More specifically, this invention relates to a worktable for laser processing. Background Technology

[0002] In recent years, the semiconductor industry has made great progress, and as a result, it has also made great progress in processing technologies such as cutting, scribing or patterning semiconductor material substrates, piezoelectric material substrates or glass substrates using lasers.

[0003] For cutting cells, processing using a laser beam is employed. This laser processing step involves placing the cell on a worktable and irradiating the desired location with the laser beam. A laser scanner irradiating the cell with the laser beam is located above the laser processing worktable, and processing is performed by moving the laser scanner along a cutting line while irradiating the laser beam. As described above, when the laser beam is irradiated, the substrate is cut along the cutting line, thereby separating it into an effective cell portion as the central portion of the cutting line and a dummy portion as the outer contour portion of the cutting line.

[0004] Furthermore, the dummy portion is a discarded part and is essentially unnecessary; therefore, solutions to minimize the dummy portion are being explored. Additionally, the cutting shape of the substrate (i.e., the shape of the cutting line) can be changed, and in this case, there is a problem of needing to replace the laser processing stage of the unit with a laser processing stage corresponding to the new cutting line. Summary of the Invention

[0005] The purpose of this invention is to provide a laser processing stage with improved reliability and usability.

[0006] However, the purpose of this invention is not limited to the above-described purpose, and various extensions can be made without departing from the spirit and scope of this invention.

[0007] To achieve the aforementioned objective of the present invention, an embodiment of the present invention relates to a laser processing stage that may include: a lower plate, including a first region, a second region surrounding the first region, and a third region surrounding the second region; a plurality of internal modules disposed on the first region of the lower plate; and a plurality of external modules disposed on the third region of the lower plate and surrounding the plurality of internal modules.

[0008] According to one embodiment, the width of the second region may be constant, and the second region may have a first polygonal shape including sides parallel to a first direction and sides parallel to a second direction different from the first direction.

[0009] According to one embodiment, the width of the second region may be constant, and the second region may have a second polygonal shape including an edge parallel to a first direction, an edge parallel to a second direction different from the first direction, and an edge parallel to a third direction different from the first direction and the second direction.

[0010] According to one embodiment, one of the plurality of internal modules may be an internal module adjacent to the edge parallel to the third direction, which may have a shape including the edge parallel to the third direction.

[0011] According to one embodiment, one of the plurality of external modules may have a shape including an edge parallel to the third direction among the external modules.

[0012] According to one embodiment, for the internal module adjacent to the second region among the plurality of internal modules, the shape of the outline of the internal module adjacent to the second region is determined according to the shape of the second region.

[0013] According to one embodiment, for the external module adjacent to the second region among the plurality of external modules, the shape of the outline of the external module adjacent to the second region is determined according to the shape of the second region.

[0014] According to one embodiment, the plurality of internal modules may include a plurality of first internal modules having a first shape and a plurality of second internal modules having a second shape, and the plurality of first internal modules and the plurality of second internal modules may be combined such that the overall shape of the plurality of first internal modules and the plurality of second internal modules corresponds to the first region.

[0015] According to one embodiment, the plurality of internal modules may include a plurality of first internal modules having a first shape, a plurality of second internal modules having a second shape, and a plurality of third internal modules having a third shape, and the plurality of first internal modules, the plurality of second internal modules, and the plurality of third internal modules are combined such that the overall shape of the plurality of first internal modules to the plurality of third internal modules corresponds to the first region.

[0016] According to one embodiment, the plurality of external modules may include a plurality of first external modules having a first shape and a plurality of second external modules having a second shape, and the plurality of first external modules and the plurality of second external modules may be combined such that the overall shape of the plurality of first external modules and the plurality of second external modules corresponds to the third region.

[0017] According to one embodiment, a processing object component comprising an effective unit portion and a dummy portion surrounding the effective unit portion may be configured on the plurality of internal modules and the plurality of external modules, wherein the boundary between the effective unit portion and the dummy portion is defined as a cutting line, and the cutting line overlaps with the second region.

[0018] According to one embodiment, the plurality of internal modules and the plurality of external modules may be combined with the lower plate.

[0019] According to one embodiment, the plurality of internal modules may be in contact with each other.

[0020] According to one embodiment, the plurality of external modules may be in contact with each other.

[0021] According to one embodiment, the plurality of internal modules and the plurality of external modules may respectively tilt their sides such that the area of ​​the upper surface is greater than the area of ​​the bottom surface.

[0022] According to one embodiment, the lower plate may further include a foreign matter discharge path that overlaps with the second region and is formed inside the lower plate.

[0023] According to one embodiment, the lower plate may further include a plurality of support portions protruding from the lower plate toward the plurality of internal modules and the plurality of external modules, the plurality of support portions each including through holes formed internally to engage with the internal modules or the external modules.

[0024] According to one embodiment, the plurality of support portions may be tilted such that the area of ​​the bottom surface is greater than the area of ​​the top surface.

[0025] According to one embodiment, the plurality of internal modules and the plurality of external modules may each include: an adsorption flow path formed internally; and a connecting portion connected to the through hole, wherein the interior of the connecting portion is connected to the adsorption flow path.

[0026] According to one embodiment, the through hole, the joint, and the adsorption flow path may be connected to each other, and the interior of each of the through hole, the joint, and the adsorption flow path may be in a vacuum state.

[0027] (Invention Effects)

[0028] The internal and external modules can be separated from the lower plate, allowing them to be replaced with modules having the desired shape depending on the part being processed. Therefore, when the shape of the part being processed changes, only a few modules need to be replaced, rather than the entire worktable, minimizing time, cost, and labor. This improves the efficient utilization of the worktable for laser processing.

[0029] The bottom area of ​​the module is smaller than the area of ​​the top surface, and the support portion of the lower plate has a frustum-shaped base with a larger bottom area than the top surface, which facilitates the removal of foreign matter generated during laser processing. This improves the reliability of the laser processing worktable.

[0030] However, the effects of the present invention are not limited to those described above, and various extensions can be made without departing from the scope and ideas of the present invention. Attached Figure Description

[0031] Figure 1 This is a plan view showing the lower plate of a laser processing stage included in an embodiment of the present invention.

[0032] Figure 2 It is an amplification including... Figure 1 A three-dimensional view of the support portion of the lower plate.

[0033] Figure 3 It is shown Figure 1 A plan view of the area below the floor.

[0034] Figure 4 and Figure 5 It is along Figure 3 A sectional view taken from line II′.

[0035] Figure 6 This is a perspective view of an enlarged block of a laser processing stage included in an embodiment of the present invention.

[0036] Figure 7 This is a plan view showing the internal and external modules of a laser processing stage included in an embodiment of the present invention.

[0037] Figure 8 This is a plan view showing a workpiece component being processed, arranged on a laser processing worktable according to an embodiment of the present invention.

[0038] Figure 9 and Figure 10 It shows the... Figure 8 A cross-sectional view of an example of laser processing of a workpiece.

[0039] Figure 11 and Figure 12 It shows the... Figure 8 A cross-sectional view of another example of laser processing of a workpiece.

[0040] Figure 13 and Figure 14 It shows the... Figure 8 A cross-sectional view of another example of laser processing of the workpiece.

[0041] Figure 15 and Figure 16 It shows the... Figure 8 A cross-sectional view of another example of laser processing of the workpiece.

[0042] Figure 17 This is a plan view showing a workpiece component being processed, arranged on a laser processing worktable according to an embodiment of the present invention.

[0043] Figure 18 It is shown that includes Figure 17 A plan view of the internal and external modules of the laser processing worktable.

[0044] Figure 19 It is along Figure 18 A sectional view taken from line III-III′.

[0045] Figure 20 It is along Figure 18 A sectional view taken along line IV-IV′.

[0046] Figure 21 It is shown Figure 18 A cross-sectional view of the internal and external modules before they are combined with the lower plate.

[0047] Figure 22 It is shown Figure 18 A sectional view of the internal modules and the external modules combined with the lower plate.

[0048] Symbol explanation:

[0049] 100: Lower plate; 10: First area; 20: Second area; 30: Third area; 94: Foreign material discharge path; 200: Internal module; 300: External module; 250: Third internal module; 700: Processed object component; 750: Foreign material. Detailed Implementation

[0050] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings, and repeated descriptions of the same constituent elements are omitted.

[0051] Figure 1 This is a plan view showing the lower plate of a laser processing stage included in an embodiment of the present invention.

[0052] Reference Figure 1The lower plate 100 may be a first polygonal shape on a plane defined by the x-axis D1 and the y-axis D2, including sides parallel to the x-axis D1 and the y-axis D2. The x-axis D1 and the y-axis D2 may be substantially perpendicular. In other words, the lower plate 100 may be quadrilateral. The lower plate 100 may include a plurality of support portions 50 arranged in a matrix. The support portions 50 may protrude in a direction perpendicular to the z-axis D4, which is perpendicular to the x-axis D1 and the y-axis D2. Each support portion 50 may have the same shape and size. Through holes 91 may be formed inside each support portion 50. A case where the through hole 91 is circular is shown, but the shape is not limited to this. The support portions 50 are spaced apart from each other at a predetermined distance. The support portions 50 may be spaced apart from each other at the same distance. The area where the support portions 50 are spaced apart from each other may be defined as a separation region SA. In other words, the separation region SA may have a grid pattern. More specifically, on the lower plate 100, all areas except the area where the support portion 50 is configured can be defined as the separation area SA.

[0053] Figure 2 It is an amplification including... Figure 1 A three-dimensional view of the support portion of the lower plate.

[0054] Reference Figure 2 Each support portion 50 can protrude from the lower plate 100 toward the z-axis D4, which is perpendicular to the x-axis D1 and the y-axis D2. The example shown is a frustum-shaped structure where the area of ​​the base is larger than the area of ​​the upper surface; however, the shape is not limited to this. For example, each support portion 50 can also be a cuboid shape.

[0055] Each support portion 50 may have a through hole 91 formed inside. The through hole 91 is shown in a cylindrical shape, but the shape is not limited to this. The depth of the through hole 91 may be the same as the height of the support portion 50 (i.e., the height of the truncated pyramid). In other words, the through hole 91 may extend from the upper surface of the support portion 50 to the bottom surface. More specifically, the through hole 91 may extend through the support portion 50, but may not extend through the lower plate 100 including the support portion 50.

[0056] Figure 3 It is shown Figure 1 A plan view of the area below the floor.

[0057] Reference Figure 3 The lower plate 100 may include a first region 10, a second region 20 surrounding the first region 10, and a third region 30 surrounding the second region 20. For example, the first region 10 may include a region with six adjacent support portions 50 and a spacer region between the six adjacent support portions 50. Figure 1The second region 20 may be formed outside the first region 10, thereby surrounding the first region 10. The width of the second region 20 may be the width of the separating region (SA). Figure 1 The third region 30 is half the width of the separating region SA. The third region 30 may be the region outside the first region 10 and the second region 20. For example, as... Figure 3 As shown, the second region 20 can be quadrilateral in shape.

[0058] Figure 4 and Figure 5 It is along Figure 3 A sectional view taken from line II′.

[0059] Reference Figure 4 The support portion 50a disposed in the first region 10 and the support portion 50b disposed in the third region 30 may be spaced apart by a spacer region SA. The spacer region SA may include a second region 20. The second region 20 may correspond to half of the spacer region SA and may be the region adjacent to the support portion 50a disposed in the first region 10.

[0060] Through holes 91a and 91b can be formed inside the support portion 50a in the first region 10 and the support portion 50b in the third region 30, respectively. Vacuum flow paths 90a and 90b disposed below the through holes 91a and 91b can be connected to the through holes 91a and 91b and pass through the lower plate 100. A vacuum chamber (not shown) can be disposed outside the lower plate 100 and connected to the vacuum flow paths 90a and 90b. The vacuum chamber can provide vacuum pressure to the vacuum flow paths 90a and 90b. As a result, the vacuum flow paths 90a and 90b can be in a vacuum state, and the interiors of the through holes 91a and 91b connected to the vacuum flow paths 90a and 90b can also be in a vacuum state.

[0061] In the partition region SA, the lower plate 100 may include a foreign matter discharge path 94 extending through the lower plate 100. The vacuum chamber may be connected to the foreign matter discharge path 94. The vacuum chamber may provide vacuum pressure to the foreign matter discharge path 94. Thus, the foreign matter discharge path 94 can maintain a vacuum state and can draw in foreign matter present in the partition region SA. Figure 10 Foreign matter 750). In other words, the foreign matter discharge path 94 can discharge foreign matter ( Figure 10 The foreign material (750) provides suction.

[0062] Reference Figure 5Vacuum flow paths 90a and 90b and foreign matter discharge flow path 94 can be connected to each other and pass through the lower plate 100. Thus, the vacuum cavity can be simultaneously connected to vacuum flow paths 90a and 90b and foreign matter discharge flow path 94. Therefore, the interiors of vacuum flow paths 90a and 90b, through holes 91a and 91b, and foreign matter discharge flow path 94 can simultaneously be in a vacuum state.

[0063] Figure 6 This is a perspective view of an enlarged block of a laser processing stage included in an embodiment of the present invention.

[0064] Reference Figure 6 Module 500 illustratively illustrates the internal modules described later. Figure 7 The internal module 200) and the external module described later ( Figure 7 At least one of the external modules 300. Adsorption flow paths 93 may be formed inside the module 500. The case of forming four adsorption flow paths 93 inside a module 500 is shown, but it is not limited to this. In other words, multiple adsorption flow paths 93 may be formed inside a module 500.

[0065] Module 500 may include a connecting portion 92, which connects and converges the adsorption flow path 93 and is disposed on the bottom surface of module 500. The connecting portion 92 may not be disposed in the center of the bottom surface of module 500. In other words, the connecting portion 92 may be configured to freely attach to the bottom surface of module 500. A cylindrical shape of the connecting portion 92 is shown, but the shape is not limited to this. The connecting portion 92 may be connected to a through hole (…). Figure 2 The through hole 91 has the same shape. Therefore, the module 500 can be connected to the through hole ( ) via the joint 92. Figure 2 The connecting portion 92 is connected to the lower plate 100 via the through hole 91. A portion of the interior of the connecting portion 92 can be penetrated. In other words, the connecting portion 92 can be a hollow cylindrical shape.

[0066] Module 500 can be a frustum-shaped square pyramid with the area of ​​its upper surface greater than the area of ​​its lower surface. In other words, module 500 can have its sides angled so that the area of ​​its upper surface is greater than the area of ​​its lower surface. The illustration shows a frustum-shaped square pyramid with the area of ​​its upper surface greater than the area of ​​its lower surface, but the shape is not limited to this. For example, module 500 can be a cuboid shape.

[0067] Module 500, its size can be determined according to the internal modules ( Figure 7 Internal module 200) and external module ( Figure 7 The external module 300 may vary in size and shape, depending on the first internal module described later. Figure 7 First internal module 210), second internal module ( Figure 7The second internal module 220) and the third internal module ( Figure 18 The third internal module 250) varies, and its size and shape may vary depending on the external module described later. Figure 7 External module 300 or Figure 18 The first external module 300 and Figure 18 The second external module 350 is different.

[0068] Figure 7 This is a plan view showing the internal and external modules of a laser processing stage included in an embodiment of the present invention.

[0069] Reference Figure 7 Configured in the first area ( Figure 3 Each support part of the first region 10) Figure 1 The support portion 50 can be combined with the internal module 200. On a plane, each internal module 200 can contact each other. Thus, the internal module 200 can include a size and shape determined by the spaced area from the lower plate 100. Figure 1 The degree of overlap between the separated regions SA) of the first internal module 210 and the second internal module 220 varies.

[0070] Configured in the third region ( Figure 3 The various support parts of the third region 30) Figure 1 The support portion 50) can be combined with the external module 300. On the plane, each external module 300 can contact each other.

[0071] Internal module 200 and external module 300 with support ( Figure 1 The connection of the support portion 50) can be achieved through the connection portion ( Figure 6 The joint 92) and the through hole ( Figure 2 This is achieved through the combination of the through hole 91.

[0072] An adsorption flow path 93 may be formed on the upper surfaces of the inner module 200 and the outer module 300. The adsorption flow path 93 may include an adsorption flow path 93a of the inner module 200 and an adsorption flow path 93b of the outer module 300. The adsorption flow path 93a of the inner module 200 can adsorb the processing object component described later. Figure 8 The effective unit part of the processing object component 700 ( Figure 8 The effective unit portion 710). Therefore, the adsorption flow path 93a of the internal module 200 can be defined as the effective unit adsorption flow path. The adsorption flow path 93b of the external module 300 can adsorb the processing object component described later ( Figure 8 The virtual part of the processing object component 700) Figure 8 (The dummy part 720). Therefore, the adsorption flow path 93b of the external module 300 can be defined as a dummy adsorption flow path.

[0073] Figure 8 This is a plan view showing a workpiece component being processed, arranged on a laser processing worktable according to an embodiment of the present invention.

[0074] Reference Figure 8 The workpiece 700 can be configured in an internal module ( Figure 7 Internal module 200) and external module ( Figure 7 The external module 300 is used for machining. The machining object part 700 may be a first polygonal shape including a side parallel to the x-axis D1 and a side parallel to the y-axis D2. In other words, the machining object part 700 may be a quadrilateral shape.

[0075] The workpiece 700 can be cut by being irradiated with a laser beam. As described above, if the laser beam is irradiated, the workpiece 700 can be cut along the cutting line CL, thereby being separated into an effective unit portion 710, which is the central part of the cutting line CL, and a dummy portion 720 surrounding the effective unit portion 710.

[0076] Although not in Figure 8 As shown in the image, but refer to... Figure 7 and Figure 8 The adsorption flow path 93a of the internal module 200 can adsorb the effective unit portion 710 of the workpiece 700, and the adsorption flow path 93b of the external module 300 can adsorb the dummy portion 720 of the workpiece 700. That is, the adsorption flow path 93a of the internal module 200 and the adsorption flow path 93b of the external module 300 can fix the workpiece 700 during laser processing. More specifically, the vacuum flow path ( Figure 4 Vacuum flow paths 90a, 90b), through holes ( Figure 4 The interior of the through holes 91a and 91b, and the joint ( Figure 6 The interior of the joint 92) and the adsorption flow path ( Figure 7 The adsorption flow path 93) can receive a vacuum pressure from the vacuum chamber (not shown) to provide suction to the workpiece 700 to maintain the vacuum state.

[0077] Figure 9 and Figure 10 It shows the... Figure 8 A cross-sectional view of an example of laser processing of a workpiece.

[0078] Reference Figure 9 An embodiment illustrating the morphology prior to laser processing involves the following along... Figure 8The cross-section is taken by line II-II′. The workpiece 700 may overlap with the first region 10, the second region 20, and the third region 30, and is configured on the inner module 200 and the outer module 300. The workpiece 700 may be configured on the inner module 200 and the outer module 300 such that a preset cutting line ( Figure 8 The cutting line CL overlaps with the second region 20.

[0079] The adsorption flow path 93a formed inside the inner module 200 and the adsorption flow path 93b formed inside the outer module 300 can provide suction to fix the workpiece 700. A laser scanner (not shown) arranged on the upper part of the laser processing stage can irradiate a laser beam LB to perform laser processing on the workpiece 700.

[0080] Reference Figure 10 An embodiment illustrating the morphology after laser processing involves the following along... Figure 8 The cross-section taken along line II-II′. Figure 8 The cutting line CL is irradiated with laser beams LB1 and LB2. The workpiece 700 can be separated into an effective unit part 710 and a dummy part 720. An adsorption flow path 93a for adsorbing the effective unit part 710 can be formed inside the internal module 200. An adsorption flow path 93b for adsorbing the dummy part 720 can be formed inside the external module 300.

[0081] If the length t1 of the dummy part 720 is less than the interval t2 between the internal module 200 and the external module 300, the dummy part 720 may fall between the internal module 200 and the external module 300. Therefore, the length t1 of the dummy part 720 can be greater than the interval t2 between the internal module 200 and the external module 300.

[0082] On the other hand, since the dummy part 720 is essentially discarded, there is a problem that the larger the length t1 of the dummy part 720, the more serious the material waste. Therefore, a solution to minimize the dummy part 720 is being explored. However, as mentioned above, since the length t1 of the dummy part 720 should be greater than the interval t2 between the internal module 200 and the external module 300, shortening the length t1 of the dummy part 720 may require shortening the interval t2 between the internal module 200 and the external module 300.

[0083] If laser beams LB1 and LB2 are irradiated, foreign matter 750 may be generated in the workpiece 700. Foreign matter 750 may be carbonized foreign matter. The size of foreign matter 750 is exaggerated.

[0084] Foreign matter 750 can fall along the space between the inner module 200 and the outer module 300, thereby falling into the spaced-out areas of each support 50. Figure 1 The separation area SA). In other words, the foreign material 750 may not fall onto the support 50, but rather into the separation area between each support 50 (the area SA). Figure 1 The separated area SA). Falling into the separated area ( Figure 1 Foreign matter 750 in the separated area (SA) can be discharged to the outside of the lower plate 100 by the suction of the foreign matter discharge flow path 94 formed in the lower plate 100.

[0085] On the other hand, foreign matter 750 can be adsorbed onto the side of the inner module 200, the side of the outer module 300, or the side of the support portion 50. Therefore, even if suction is applied through the foreign matter discharge path 94, the foreign matter 750 may not be discharged to the outside of the lower plate 100, but may instead accumulate in the separated area ( Figure 1 The narrower the gap t2 between the inner module 200 and the outer module 300, the greater the likelihood that the foreign material 750 will be adsorbed onto the side of the inner module 200, the side of the outer module 300, or the side of the support portion 50. Therefore, it is necessary to explore a scheme that minimizes the gap t2 between the inner module 200 and the outer module 300 without adsorbing the foreign material 750.

[0086] Figure 11 and Figure 12 It shows the... Figure 8 A cross-sectional view of another example of laser processing of a workpiece.

[0087] Reference Figure 11 and Figure 12 Each support portion 50 may have an inclined side. In other words, each support portion 50 may have a truncated pyramid shape. As a result, the possibility of foreign matter 750 being adsorbed onto the side of the support portion 50 is reduced. Therefore, foreign matter 750 can be easily discharged.

[0088] Figure 13 and Figure 14 It shows the... Figure 8 A cross-sectional view of another example of laser processing of the workpiece.

[0089] Reference Figure 13 and Figure 14 Each support portion 50 may have an inclined side, thus each support portion 50 may have a frustum shape, and a portion of the side of each of the inner module 200 and the outer module 300 may also be inclined. This makes it easier to discharge foreign matter 750.

[0090] Figure 15 and Figure 16It shows the... Figure 8 A cross-sectional view of another example of laser processing of the workpiece.

[0091] Reference Figure 15 and Figure 16 Each support portion 50 may have an inclined side, thus each support portion 50 may have a truncated quadrangular pyramid shape, and the sides of both the inner module 200 and the outer module 300 may also be inclined. This makes it easier to discharge foreign matter 750.

[0092] Therefore, refer to Figures 11 to 16 The sides of each internal module 200, each external module 300, and each support 50 are inclined, thus preventing the adsorption of foreign matter 750 and facilitating its removal through the foreign matter discharge path 94. In other words, the likelihood of foreign matter 750 being adsorbed is reduced. Therefore, the interval t2 between the internal module 200 and the external module 300 can be minimized. Consequently, the length t1 of the dummy portion 720 can be shortened to minimize material waste.

[0093] Furthermore, in the prior art, when the processing shape is changed (i.e., when the cutting line is changed), the same worktable cannot be used to perform the process. In other words, if the shape of the workpiece 700 is changed, the worktable itself needs to be replaced. As a result, several worktables are required, wasting space for storing the worktables and wasting time for replacement, thus resulting in cost losses.

[0094] Figure 17 This is a plan view showing a workpiece component being processed, arranged on a laser processing worktable according to an embodiment of the present invention. Figure 18 It is shown that includes Figure 17 A plan view of the internal and external modules of the laser processing worktable.

[0095] Reference Figure 17 The machining object component 701, having a second polygonal shape, may include sides parallel to the x-axis D1, sides parallel to the y-axis D2, and sides not parallel to either the x-axis D1 or the y-axis D2. For example, the machining object component 701 with the second polygonal shape may be pentagonal. The machining object component 701 with the second polygonal shape may include an effective unit portion 711 and a dummy portion 721. A cutting line CL may be defined along the boundary between the effective unit portion 711 and the dummy portion 721. The machining object component 701 may be configured on an internal module 200 and an external module 300.

[0096] Reference Figure 18The inner module 200 and outer module 300, which are located at the lower part of the workpiece part 701 having a second polygonal shape, can be replaced. The lower plate 100, which is located at the lower part of the inner module 200 and outer module 300, can remain unchanged.

[0097] In other words, the internal module 200 adjacent to the edge of the workpiece 701 parallel to the third direction D3 can be replaced with a third internal module 250, which has a shape including the edge parallel to the third direction D3. Furthermore, the external module 300 adjacent to the edge of the workpiece 701 parallel to the third direction D3 can be replaced with a second external module 350, which includes an edge parallel to the third direction D3.

[0098] Furthermore, within the area of ​​the lower plate 100, the area containing the internal module 200 can be defined as the first area 11, the area containing the external module 300 can be defined as the third area 31, and the area between the first area 11 and the third area 31 can be defined as the second area 21. That is, for the lower plate 100, compared to the first area 10, second area 20, and third area 30 when laser processing the workpiece 700 having a first polygonal shape, it can be redefined as the first area 11, second area 21, and third area 31 when laser processing the workpiece 701 having a second polygonal shape (see reference). Figure 19 ).

[0099] More specifically, the internal module 200 can be replaced, such that the first internal module 210 (see reference) Figure 7 ), second internal module 220 (see reference) Figure 7 The overall shape of the first external module 300 and the third internal module 250 corresponds to the first region 11. Furthermore, the replaceable external module 300 is configured such that the overall shape of the first external module 300 (here, the first external module 300 refers to the unreplaced portion of the external module 300) and the second external module 350 corresponds to the third region 31.

[0100] Figure 19 It is along Figure 18 A sectional view taken from line III-III′.

[0101] Reference Figure 19The lower plate 100 may include support portions 50c and 50d spaced apart in a spaced region SA. Through holes 91 may be formed inside each of the support portions 50c and 50d. The third inner module 250 and the second outer module 350 may respectively engage with the connecting portion 92 and the through hole 91, thereby engaging with the lower plate 100. The lower plate 100 may be redivided into a first region 11 where the third inner module 250 is disposed, a third region 31 where the second outer module 350 is disposed, and a second region 21 between the first region 11 and the third region 31. The third inner module 250 and the second outer module 350 may be spaced apart from each other by the second region 21. A workpiece component having a second polygonal shape ( Figure 17 The workpiece component 701 can be configured on the third inner module 250 and the second outer module 350. If along the cutting line CL towards the workpiece component (which has a second polygonal shape)... Figure 17 If the processing object component 701 is irradiated with a laser beam, foreign matter may be generated between the third internal module 250 and the second external module 350. Figure 20 (Irrelevant 751).

[0102] Figure 20 It is along Figure 18 A sectional view taken along line IV-IV′.

[0103] Reference Figure 20 The foreign matter 751 generated between the third internal module 250 and the second external module 350 can be disposed on the support portion 50c. The foreign matter discharge paths 94b, 94c, connected to the external vacuum chamber (not shown) of the lower plate 100, can receive a vacuum pressure supply, thereby providing suction to draw in the foreign matter 751. Therefore, even if the foreign matter 751 is not generated on each support portion (… Figure 19 If the foreign material 751 is not generated between the support portions 50c and 50d, but rather on the support portion 50c, it can still be discharged to the outside of the lower plate 100 through the foreign material discharge channels 94b and 94c. In other words, even if the foreign material 751 is not generated in the separated area ( Figure 19 Foreign matter 751 can also be removed by other foreign matter discharge paths 94b and 94c that are spaced apart on the plane, on the overlapping foreign matter discharge path 94a of the separated area SA).

[0104] On the other hand, since the laser beam needs to be irradiated perpendicularly onto the workpiece, the flatness of the laser processing stage is very important.

[0105] Figure 21 It is shown Figure 18 A sectional view of the internal and external modules before they are combined with the lower plate, and Figure 22 It is shown Figure 18A sectional view of the internal modules and the external modules combined with the lower plate.

[0106] Reference Figure 21 and Figure 22 The heights t1, t2, t3, and t4 of the internal module 200 and the external module 300 can be the same. Furthermore, the length t5 of the joint 92 of each of the internal module 200 and the external module 300 can be the same as the depth t6 of the through hole 91. Therefore, even when the internal module 200 and the external module 300 are combined with the lower plate 100, the laser processing worktable will not have an inclination, but will be flat. That is, the workpiece 700 can be configured to be flat, perpendicular to the laser beams LB1 and LB2.

[0107] Therefore, in one embodiment of the present invention, the laser processing worktable can replace a portion of the internal module 200 and a portion of the external module 300, thereby eliminating the need to replace the entire laser processing worktable. In other words, since there is no need to store individual worktables corresponding to the processing shape, cost losses can be minimized.

[0108] This invention is applicable to various laser processing devices, etc., for cutting units formed on a mother substrate.

[0109] The invention has been described above with reference to exemplary embodiments thereof. However, those skilled in the art should understand that various modifications and alterations may be made to the invention without departing from the spirit and scope of the invention as set forth in the claims.

Claims

1. A laser processing worktable, comprising: The lower plate includes a first region, a second region surrounding the first region, a third region surrounding the second region, and a plurality of support portions protruding from the first region and the third region of the lower plate; Multiple internal modules are configured in the first region of the lower plate; as well as Multiple external modules are configured in the third region on the lower plate and surround the multiple internal modules. The plurality of internal modules and the plurality of external modules are respectively tilted so that the area of ​​the upper surface is greater than the area of ​​the bottom surface. The second region has a polygonal shape and includes a first side parallel to the first direction, a second side parallel to the second direction intersecting the first direction, and a third side parallel to the third direction intersecting the first and second directions. The plurality of internal modules include: At least one first internal module, the first internal module having a first shape including an edge parallel to the third direction; and A plurality of second internal modules having a second shape that is different from the first shape and does not include an edge parallel to the third direction.

2. The laser processing worktable according to claim 1, characterized in that, The width of the second region is constant.

3. The laser processing worktable according to claim 2, characterized in that, The plurality of internal modules includes at least one first internal module adjacent to the third side.

4. The laser processing worktable according to claim 2, characterized in that, Among the plurality of external modules, the external module adjacent to the third side parallel to the third direction has a shape including the side parallel to the third direction.

5. The laser processing worktable according to claim 1, characterized in that, For the internal module adjacent to the second region among the plurality of internal modules, the shape of the outline of the internal module adjacent to the second region is determined according to the shape of the second region.

6. The laser processing worktable according to claim 1, characterized in that, For the external module adjacent to the second region among the plurality of external modules, the shape of the outline of the external module adjacent to the second region is determined according to the shape of the second region.

7. The laser processing worktable according to claim 1, characterized in that, The at least one first internal module and the plurality of second internal modules are combined such that the overall shape of the at least one first internal module and the plurality of second internal modules corresponds to the first region.

8. The laser processing worktable according to claim 1, characterized in that, The plurality of internal modules also include a plurality of third internal modules having a third shape different from the first shape and the second shape. The at least one first internal module, the plurality of second internal modules, and the plurality of third internal modules are combined such that the overall shape of the at least one first internal module to the plurality of third internal modules corresponds to the first region.

9. The laser processing worktable according to claim 1, characterized in that, The plurality of external modules includes a plurality of first external modules having a first shape and a plurality of second external modules having a second shape. The plurality of first external modules and the plurality of second external modules are combined such that the overall shape of the plurality of first external modules and the plurality of second external modules corresponds to the third region.

10. The laser processing worktable according to claim 1, characterized in that, Processing object components, including effective unit portions and dummy portions surrounding the effective unit portions, are configured on the plurality of internal modules and the plurality of external modules. The boundary between the effective unit portion and the dummy portion is defined as a cutting line, and the cutting line overlaps with the second region.

11. The laser processing worktable according to claim 1, characterized in that, The plurality of internal modules and the plurality of external modules are combined with the lower plate.

12. The laser processing worktable according to claim 1, characterized in that, The multiple internal modules are in contact with each other.

13. The laser processing worktable according to claim 1, characterized in that, The multiple external modules are in contact with each other.

14. The laser processing worktable according to claim 1, characterized in that, The multiple support portions in the first region are spaced apart by the partition regions, and the width of the second region is constant, which is half the width of the partition regions.

15. The laser processing worktable according to claim 1, characterized in that, The lower plate also includes a foreign matter discharge path that overlaps with the second region and is formed inside the lower plate.

16. The laser processing worktable according to claim 1, characterized in that, The lower plate also includes a plurality of support portions protruding from the lower plate toward the plurality of internal modules and the plurality of external modules. The plurality of support portions each include internally formed through holes that are combined with the internal module or the external module.

17. The laser processing worktable according to claim 16, characterized in that, The multiple support portions tilt the sides so that the area of ​​the bottom surface is greater than the area of ​​the top surface.

18. The laser processing worktable according to claim 17, characterized in that, The plurality of internal modules and the plurality of external modules respectively include: Adsorption flow path, formed internally; and The joint portion is connected to the through hole. The interior of the joint is connected to the adsorption flow path.

19. The laser processing worktable according to claim 18, characterized in that, The through hole, the joint, and the adsorption flow path are connected to each other, and the interior of each of the through hole, the joint, and the adsorption flow path is in a vacuum state.

20. The laser processing worktable according to claim 1, characterized in that, The multiple internal modules are in contact with each other. The multiple external modules are in contact with each other, and The gaps between the plurality of internal modules and the plurality of external modules correspond to the second region.

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