Package structure and method of manufacturing the same

Abstract

A package structure and a method of manufacturing the same are disclosed. The package structure includes a circuit substrate, a light emitting diode array, a first encapsulation, and a sealing. The circuit substrate includes a top surface and a side surface. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulation is disposed over the circuit substrate. The first encapsulation includes a main portion and an extension portion. The main portion is disposed parallel to the top surface. The extension portion extends from the main portion to the side surface. The sealing is disposed under the extension portion of the first encapsulation. The sealing contacts the first encapsulation and the circuit substrate. The first encapsulation and the sealing collectively form a coplanar surface.

Description

Technical Field

[0001] The present invention relates to a packaging structure and a method for manufacturing the packaging structure. Background Art

[0002] With the advancement of electronic product technology, the quality requirements for display panels are becoming increasingly stringent. The display panel manufacturing process includes multiple operations such as sealing, cutting, etching, and cleaning. Failure to properly handle each of these processes can affect the luminous efficiency of the light-emitting diodes (LEDs), thereby compromising the quality of the display panel.

[0003] For example, if the black encapsulant covering the LED cannot be effectively removed from the LED surface, the LED's luminous efficiency will be reduced. If the side of the encapsulant is pulled during the cleaning process, causing the side encapsulant to peel, it will cause damage to the display area (active area) of the display panel. Summary of the Invention

[0004] In order to solve the above problems and overcome the shortcomings of the prior art, the purpose of the present invention is to provide a packaging structure and a method for manufacturing the packaging structure, which can improve the above problems and prevent the display panel from being damaged due to incomplete cleaning or degumming.

[0005] The present invention provides a packaging structure comprising a circuit substrate, a light-emitting diode array, a first encapsulant, and a sealant. The circuit substrate comprises an upper surface and a side surface. The light-emitting diode array is disposed on the upper surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate and comprises a main portion and an extension portion, wherein the main portion is disposed parallel to the upper surface and the extension portion extends from the main portion to the side surface. The sealant is disposed below the extension portion of the first encapsulant and contacts the first encapsulant and the circuit substrate. The first encapsulant and the sealant together form a coplanar surface.

[0006] In some embodiments, the first packaging glue includes 5-20 wt. % of black particles.

[0007] In some embodiments, the optical density of the sealant is greater than 3.

[0008] In some embodiments, the main portion of the first encapsulant, the extension portion of the first encapsulant, and the sealant together form a coplanar surface.

[0009] In some embodiments, the main portion of the first packaging adhesive and the sealant together form a coplanar surface, and the extension portion of the first packaging adhesive is located between the coplanar surface and the side surface of the circuit substrate.

[0010] In some embodiments, the packaging structure further includes a second packaging adhesive covering the light emitting diode array and the first packaging adhesive.

[0011] In some embodiments, the sealant, the first encapsulant, and the second encapsulant together form a coplanar surface.

[0012] In some embodiments, the distance between the coplanar surface and the side surface of the circuit substrate is between 5 μm and 15 μm.

[0013] In some embodiments, the distance between the coplanar surface and the side surface of the circuit substrate is between 45 μm and 55 μm.

[0014] In some embodiments, the light emitting diode array includes light emitting diodes, and a distance between an upper surface of the main body of the first encapsulant and an upper surface of the light emitting diodes is between 5 μm and 10 μm.

[0015] In some embodiments, the LED array includes LEDs, the LED array includes bonding pads located between the LEDs and the circuit substrate, and the main body of the first encapsulant and the bonding pads are substantially at the same height.

[0016] The present invention provides a method for manufacturing a packaging structure, comprising the following operations: forming a first packaging glue on a circuit substrate and a light-emitting diode array, the light-emitting diode array being arranged on the circuit substrate, the circuit substrate comprising an upper surface and a side surface, the first packaging glue comprising a main body and an extension portion, the main body being arranged parallel to the upper surface, and the extension portion extending from the main body to the side surface; forming a sealant on the side surface of the circuit substrate, the sealant contacting the side surface of the circuit substrate and the extension portion of the first packaging glue; performing an etching operation to mostly remove the first packaging glue above the light-emitting diode array; performing a dry cleaning operation to completely remove the ashed portion of the first packaging glue above the light-emitting diode array and expose the upper surface of the light-emitting diode array; forming a second packaging glue on the light-emitting diode array and the first packaging glue located between the light-emitting diode arrays.

[0017] In some embodiments, the method for manufacturing a package structure further includes performing a cutting operation after forming a sealant on the side surface of the circuit substrate, so that the main body of the first sealant and the sealant form a coplanar surface.

[0018] In some embodiments, the method for manufacturing the packaging structure further includes performing a cutting operation after forming a sealant on the side surface of the circuit substrate, so that the main portion of the first encapsulant, the extension portion of the first encapsulant and the sealant together form a coplanar surface.

[0019] In some embodiments, the manufacturing method of the packaging structure further includes performing a cutting operation after forming a second packaging glue and covering the light-emitting diode array and the first packaging glue located between the light-emitting diode array, so that the second packaging glue, the main body of the first packaging glue, the extension of the first packaging glue and the sealant together form a coplanar surface.

[0020] In some embodiments, the manufacturing method of the packaging structure further includes performing a cutting operation after forming a second packaging glue and covering the light-emitting diode array and the first packaging glue located between the light-emitting diode array, so that the second packaging glue, the main body of the first packaging glue and the sealant together form a coplanar surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The detailed description of the present invention will be fully understood when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard industry practice, the various features are not drawn to scale and are used for illustrative purposes only. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0022] Figure 1 A flow chart of a method for manufacturing a packaging structure according to some embodiments of the present invention;

[0023] Figures 2A to 2H Schematic cross-sectional views of package structures at different formation stages according to some embodiments of the present invention;

[0024] Figure 3 for Figures 2B to 2C A cross-sectional schematic diagram of a variation of the embodiment;

[0025] Figure 4 for Figures 2D to 2E A cross-sectional schematic diagram of a variation of the embodiment;

[0026] Figure 5 for Figures 2G to 2H A cross-sectional schematic diagram of a variation of the embodiment;

[0027] Figures 6 and 7 Schematic cross-sectional views of package structures according to some variations of the present invention are shown.

[0028] Explanation of symbols

[0029] 100: Method

[0030] 110,120,130,140,150: Operation

[0031] 200, 200a, 200b, 200c: Package structure

[0032] 210: Circuit board

[0033] 212: Upper surface

[0034] 214: side surface

[0035] 220: LED array

[0036] 222: Upper surface

[0037] 224: Bonding pad

[0038] 230: First packaging glue

[0039] 230a: Main body

[0040] 230b: Extension

[0041] 232: Upper surface

[0042] 240: Sealant

[0043] 250: Etching operation

[0044] 260: Dry cleaning operation

[0045] 270: Second packaging glue

[0046] AD: Ashing part

[0047] C: Cutting operation

[0048] D1, D2, D3: distance

[0049] H1: Height

[0050] R: Wings area

[0051] M: Dry Ice Blasting Components

[0052] LED: Light Emitting Diode

[0053] X,Y: direction DETAILED DESCRIPTION

[0054] The following disclosure provides many different embodiments or examples for implementing different features of the present invention. Specific embodiments of components and arrangements are described below to simplify the present invention. These are, of course, merely examples and are not intended to be limiting. For example, in the subsequent description, the formation of a first feature above or on a second feature may include an embodiment in which the first feature and the second feature are formed in direct contact, and may also include an embodiment in which another feature may be formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact. In addition, the present invention may repeat numbers or text in different examples. The purpose of repetition is to simplify and clarify the description, not to define the relationship between the different embodiments and configurations discussed.

[0055] In addition, spatially relative terms such as "below," "beneath," "below," "above," and similar terms are used to facilitate describing the relationship of one element or feature to another element or feature in the figures. Spatially relative terms encompass not only the orientation depicted in the figures, but also other orientations of the device during use or operation. That is, when the orientation of the device differs from the figures (rotated 90 degrees or in other orientations), the spatially relative terms used in this disclosure should be interpreted accordingly.

[0056] Although a series of operations or steps are used below to illustrate the methods disclosed herein, the order in which these operations or steps are shown should not be construed as limiting the present invention. For example, certain operations or steps may be performed in a different order and / or simultaneously with other steps. Furthermore, not all illustrated operations, steps, and / or features must be performed to implement embodiments of the present invention. Furthermore, each operation or step described herein may include a number of sub-steps or actions.

[0057] The present invention provides a method for forming a packaging structure, please refer to Figure 1 and Figures 2A to 2H . Figure 1 FIG. 1 is a flow chart of a method 100 for manufacturing a package structure according to some embodiments of the present invention. The method 100 includes operations 110 to 150 . Figures 2A to 2H Schematic cross-sectional views of a package structure 200 at different formation stages according to some embodiments of the present invention are shown.

[0058] Please refer to Figure 1 Operation 110 and Figure 2A The first encapsulant 230 is formed on the circuit substrate 210 and the LED array 220. The LED array 220 is disposed on the circuit substrate 210. The circuit substrate 210 includes a top surface 212 and a side surface 214. The first encapsulant 230 includes a main portion 230a and an extension portion 230b. The main portion 230a of the first encapsulant 230 is disposed parallel to the top surface 212 of the circuit substrate 210, and the extension portion 230b of the first encapsulant 230 extends from the main portion 230a to the side surface 214 of the circuit substrate 210. The side of the first encapsulant 230 has a T-shaped structure. Specifically, the main portion 230a of the first encapsulant 230 extends along the direction X, and the extension portion 230b of the first encapsulant 230 extends along the direction Y and contacts the side surface 214 of the circuit substrate 210. It is worth noting that since the main portion 230a of the first encapsulant 230 protrudes from the extension portion 230b of the first encapsulant 230 in the direction X, this protruding portion can also be referred to as the wing region R. The extension portion 230b of the first encapsulant 230 extends downward by a height H1. In some embodiments, the height H1 is between 0 and 200 μm.

[0059] In some embodiments, the circuit substrate 210 may be a thin film transistor (TFT) substrate, a microchip (driver chip) substrate, a glass substrate, a polyimide (PI) substrate, or a printed circuit board (PCB). In some embodiments, the light emitting diode array 220 includes a plurality of light emitting diodes (LEDs), micro LEDs, sub-millimeter LEDs (mini LEDs), or organic LEDs (OLEDs).

[0060] like Figure 2A As shown, the first encapsulant 230 is configured to act as a light-shielding layer and has a light-absorbing effect, so the first encapsulant 230 can also be called black glue. In some embodiments, the material of the first encapsulant 230 may include organic compounds, inorganic compounds, other suitable materials, or a combination thereof. The organic compound may be, for example, polyacrylic resin, epoxy resin, allyl resin, phenolic resin, polytetrafluoroethylene, polymethyl methacrylate (acrylic), or a combination thereof. The inorganic compound may be, for example, aluminum oxide, silicon oxide (silica gel), boron oxide, aluminum silicate, borosilicate, or a combination thereof. In some embodiments, the first encapsulant 230 contains 5 to 20 wt.% of black particles, such as 8, 10, 12, 15, or 18 wt.%. If too low a proportion of black particles is doped, it may not have a light-absorbing effect. If too high a proportion of black particles is doped, after performing the etching operation and dry cleaning operation of the light-emitting diode LED (detailed in Figure 2D and Figure 2E In some embodiments, the first packaging adhesive 230 may be disposed on the circuit substrate 210 and the LED array 220 by lamination.

[0061] Please refer to Figure 1 Operation 120 and Figure 2B, forming a sealant 240 on the side surface 214 of the circuit substrate 210. In detail, the sealant 240 contacts the side surface 214 of the circuit substrate 210 and the extension 230b of the first encapsulant 230. In more detail, the sealant 240 also contacts a portion of the wing area R. The sealant 240 is formed on the side surface 214 of the circuit substrate 210 in a surrounding manner. Therefore, the sealant 240 of the present invention can also be called a side sealant. In some embodiments, the sealant 240 is applied by piezoelectric spraying. The sealant 240 is configured to provide good adhesion, so that the circuit substrate 210 and the first encapsulant 230 are tightly bonded without debonding. Since the sealant 240 is arranged below the sealant 240 and the first encapsulant 230 has a certain degree of light shielding effect, the sealant 240 does not need to be doped with black particles. In some embodiments, the optical density of the sealant 240 is greater than 3. In some embodiments, the material of the sealant 240 may include acrylic resin, such as UV-curing resin.

[0062] Please continue to refer to Figure 2B and Figure 2C , in execution Figure 1 After operation 120, a cutting operation C is performed so that the main body 230a of the first encapsulant 230 and the sealant 240 form a coplanar surface. Specifically, the coplanar surface after cutting is formed by the side surface of the main body 230a of the first encapsulant 230 and the side surface of the sealant 240. The side of the first encapsulant 230 after cutting still retains a T-shaped structure. More specifically, Figure 2C The inverted triangle Indicates the cutting position. Figure 2C The cutting position is located at the wing area R of the protruding portion of the main body 230a of the first encapsulant 230, so that the relatively small wing area R remains in the package structure 200. It should be understood that since the main body 230a of the first encapsulant 230 contacts the sealant 240 and forms a coplanar surface together, the sealant 240 can provide good adhesion to the first encapsulant 230. On the other hand, reducing the size of the wing area R is beneficial for the subsequent dry cleaning operation (described in detail in Figure 2E The process of removing the sealant 240 from the first encapsulant 230 can reduce or prevent peeling (e.g., separation) between the sealant 240 and the first encapsulant 230, thereby preventing damage to the display area (or active area) of the display panel caused by peeling between the circuit substrate 210 and the first encapsulant 230. The cutting operation C can be, for example, a laser cutting operation.

[0063] Please refer to Figure 3 , which is Figures 2B to 2CA cross-sectional schematic diagram of a variation of the embodiment. Figure 3 and Figure 2C The difference lies in the cutting position (inverted triangle place). Figure 3 The wing area R of the protruding portion of the main body 230a of the first encapsulant 230 is cut off at the cutting position, so that the main body 230a of the first encapsulant 230, the extension 230b of the first encapsulant 230 and the sealant 240 together form a coplanar surface. In detail, the coplanar surface after cutting is formed by the side surface of the main body 230a of the first encapsulant 230, the side surface of the extension 230b of the first encapsulant 230 and the side surface of the sealant 240. The side of the first encapsulant 230 after cutting has a structure similar to a ㄇ shape. It should be understood that since the main body 230a and the extension 230b of the first encapsulant 230 contact the sealant 240 and form a coplanar surface together, the sealant 240 can provide good adhesion to the first encapsulant 230. On the other hand, removing the wing area R is beneficial for the subsequent dry cleaning operation (described in detail in Figure 2E ), the debonding (eg, separation) of the sealant 240 and the first packaging adhesive 230 can be reduced or avoided.

[0064] Please refer to Figure 1 Operation 130 and Figure 2D , performing an etching operation 250 to remove most of the first encapsulant 230 above the LED array 220. Specifically, most of the main body 230a of the first encapsulant 230 is removed to expose the upper surface 222 of the LED array 220, so that the upper surface 232 of the main body 230a of the first encapsulant 230 (see FIG. Figure 2E In some embodiments, the etching operation 250 may be a dry etching operation, such as plasma etching.

[0065] Please refer to Figure 1 Operation 140 and Figure 2E , a dry cleaning operation 260 is performed to completely remove the ashed portion AD of the first packaging glue 230 above the LED array 220 and expose the upper surface 222 of the LED array 220. Figure 2D After the etching operation 250, the upper surface 232 of the first packaging glue 230 drops below the upper surface 222 of the light-emitting diode LED of the light-emitting diode array 220, and the upper surface 232 of the first packaging glue 230 is higher than the height of the bonding pad 224 of the light-emitting diode LED. Figure 2E shown.

[0066] Please refer to Figure 4 , which is Figures 2D to 2E Schematic cross-sectional view of a variation of the embodiment. Figure 2D After the etching operation 250, the upper surface 232 of the first packaging glue 230 drops below the upper surface 222 of the light-emitting diodes LED of the light-emitting diode array 220, and the upper surface 232 of the first packaging glue 230 and the height of the bonding pads 224 of the light-emitting diodes LED are at the same level, as shown in FIG. Figure 4 In some embodiments, the upper surface 232 of the first encapsulant 230 must not be lower than the height of the bonding pad 224 of the light emitting diode (LED).

[0067] Please refer again Figure 2E The dry cleaning operation 260 is performed by a dry ice blasting assembly M, which is configured to apply pressurized dry ice (CO2) pellets above the LED array 220 to clean and remove the ash portion AD of the first encapsulant 230. Because the sealant 240 provides good adhesion to the circuit substrate 210 and the first encapsulant 230, the risk of debonding in the wing area R is reduced during the dry cleaning operation 260. Furthermore, because the extension 230b of the first encapsulant 230 extends to the side surface 214 of the circuit substrate 210, even if slight debonding occurs in the wing area R, it will not further affect the bonding between the circuit substrate 210, the LED array 220, and the first encapsulant 230, thereby preventing damage to the display area of ​​the package structure 200 (e.g., the area of ​​the LED array 220) caused by debonding between the circuit substrate 210 and the first encapsulant 230.

[0068] Please refer to Figure 1 Operation 150 and Figure 2F , forming a second encapsulant 270 on the LED array 220 and the first encapsulant 230 located between the LED arrays 220. In detail, the second encapsulant 270 covers the upper surface 222 of the LED array 220 and the upper surface 232 of the first encapsulant 230. In some embodiments, the second encapsulant 270 is a transparent encapsulant or an optical film, such as an anti-reflection film. In some embodiments, the second encapsulant 270 can be disposed on the LED array 220 and the first encapsulant 230 by lamination. In some embodiments, the material of the second encapsulant 270 is the same as or similar to the material of the first encapsulant 230, except that the second encapsulant 270 does not contain black particles.

[0069] Please continue to refer to Figure 2F and Figure 2G , in execution Figure 1 After operation 150, a cutting operation C is performed so that the second packaging glue 270, the main body 230a of the first packaging glue 230, the extension 230b of the first packaging glue 230 and the sealant 240 together form a coplanar surface, as shown in FIG. Figure 2H shown.

[0070] Please refer to Figure 5 , which is Figures 2G to 2H A cross-sectional schematic diagram of a variation of the embodiment. Figure 2H The packaging structure 200 and Figure 5 The difference between the package structure 200a is Figure 2G The cutting position (inverted triangle It should be understood that it can be determined according to product requirements. Figure 2G The cutting position of Figure 2G The cutting position widens left and right along the direction X without cutting the extension portion 230b of the first packaging glue 230, so that the second packaging glue 270, the main body portion 230a of the first packaging glue 230 and the sealant 240 together form a coplanar surface, as shown in FIG. Figure 5 Specifically, the coplanar surface after cutting is formed by the side surface of the second encapsulant 270, the side surface of the main portion 230a of the first encapsulant 230, and the side surface of the sealant 240. In other words, the side of the first encapsulant 230 after cutting still retains a T-shaped structure.

[0071] Please refer again Figure 2H The package structure 200 includes a circuit substrate 210, an LED array 220, a first encapsulant 230, a sealant 240, and a second encapsulant 270. The LED array 220 is disposed on the upper surface 212 of the circuit substrate 210. The first encapsulant 230 is disposed above the circuit substrate 210. The main body 230a of the first encapsulant 230 is disposed parallel to the upper surface 212 of the circuit substrate 210, and the extension 230b of the first encapsulant 230 extends from the main body 230a of the first encapsulant 230 to the side surface 214 of the circuit substrate 210. Figure 2H The first encapsulant 230 has a structure similar to a U-shaped structure. The sealant 240 is arranged below the extension portion 230b of the first encapsulant 230, and the sealant 240 contacts the first encapsulant 230 and the circuit substrate 210. The first encapsulant 230 is arranged between the second encapsulant 270 and the sealant 240, and the second encapsulant 270 does not contact the sealant 240. The second encapsulant 270 covers the light emitting diode array 220 and the first encapsulant 230. Figure 2HIn some embodiments, the first encapsulant 230 and the sealant 240 together form a coplanar surface. In other words, the main body 230a of the first encapsulant 230, the extension 230b of the first encapsulant 230, and the sealant 240 together form a coplanar surface. In some embodiments, the distance D1 between the coplanar surface of the encapsulation structure 200 and the side surface 214 of the circuit substrate 210 is between 5 and 15 μm, for example, 8, 10, or 12 μm. In some embodiments, the distance D3 between the upper surface 232 of the main body 230a of the first encapsulant 230 and the upper surface 222 of the light-emitting diode LED is between 5 and 10 μm, for example, 6, 7, 8, or 9 μm. The size of the distance D1 can be determined according to the requirements of the subsequent splicing product.

[0072] Please refer again Figure 5 , Figure 5 The package structure 200a and Figure 2H The difference between the package structure 200 and the package structure 200a is that the side of the first packaging glue 230 of the package structure 200a has a T-shaped structure. Figure 5 In the embodiment, the first encapsulant 230 and the sealant 240 form a coplanar surface. In other words, the main body 230a of the first encapsulant 230 and the sealant 240 form a coplanar surface. The distance between the coplanar surface of the package structure 200a and the side surface 214 of the circuit substrate 210 is between 45 and 55 μm, for example, 48, 50 or 52 μm. The size of the distance D2 can be determined according to the requirements of the subsequent splicing product. It should be noted that Figure 2H and Figure 5 The same or similar elements are given the same symbols, and the related descriptions are omitted.

[0073] Figure 6 and Figure 7 Schematic cross-sectional views of package structures 200b and 200c according to some variations of the present invention are shown. Identical or similar elements are given the same reference numerals, and related descriptions are omitted.

[0074] Please refer to Figure 6 , Figure 6 The package structure 200b and Figure 2H The difference between the package structure 200 and the package structure 200b is that the position of the upper surface 232 of the main body 230a of the first packaging glue 230 is the position of the upper surface 232 of the main body 230a of the first packaging glue 230. Figure 4 After the embodiment of the variation, the upper surface 232 of the first packaging glue 230 is formed to be at the same level as the bonding pad 224 of the light emitting diode LED. Figure 2G The cutting operation C forms Figure 6The package structure 200 b includes a bonding pad 224 located between the light-emitting diodes LED of the light-emitting diode array 220 and the circuit substrate 210 , and a main body 230 a of the first packaging adhesive 230 and the bonding pad 224 are substantially at the same height.

[0075] Please refer to Figure 7 , Figure 7 The package structure 200c and Figure 5 The package structure 200a differs from the package structure 200a in the position of the upper surface 232 of the main body 230a of the first encapsulant 230. The main body 230a of the first encapsulant 230 and the sealant 240 together form a coplanar surface, and the extension 230b of the first encapsulant 230 is located between this coplanar surface and the side surface 214 of the circuit substrate 210.

[0076] In summary, the packaging structure provided by the present invention has a sealant (side sealant) arranged around the circuit substrate. The sealant provides good adhesion, so that the circuit substrate and the first sealant are tightly bonded, and will not debond due to the manufacturing process (such as etching and / or cleaning operations), which can avoid the situation where the display area of ​​the display panel is damaged due to the debonding of the circuit substrate and the first sealant. Therefore, the first sealant of the packaging structure of the present invention can be effectively removed from the surface of the LED, thereby providing good luminous efficiency. In addition, the first sealant of the packaging structure of the present invention has an extension area extending to the side surface of the circuit substrate, and the extension area can further avoid the situation where the display area of ​​the display panel is damaged due to the debonding of the circuit substrate and the first sealant.

[0077] It will be apparent to those skilled in the art that various modifications and variations may be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, the present invention is intended to cover modifications and variations of the present invention that fall within the appended claims.

Claims

1. A packaging structure comprising: A circuit substrate comprising an upper surface and a side surface; A light emitting diode array is disposed on the upper surface of the circuit substrate; A first packaging adhesive is disposed above the circuit substrate, the first packaging adhesive comprising a main body portion and an extension portion, wherein the main body portion is disposed parallel to the upper surface, and the extension portion extends from the main body portion to the side surface; and A sealant is disposed below the extension portion of the first packaging adhesive, and the sealant contacts the first packaging adhesive and the circuit substrate. The first packaging adhesive and the sealant together form a coplanar surface. 2 . The packaging structure as claimed in claim 1 , wherein the first packaging adhesive comprises 5-20 wt % of black particles. 3 . The package structure as claimed in claim 1 , wherein the optical density of the sealant is greater than 3. 4 . The package structure as claimed in claim 1 , wherein the main portion of the first packaging adhesive, the extension portion of the first packaging adhesive, and the sealant together form the coplanar surface. 5 . The package structure as claimed in claim 1 , wherein the main portion of the first packaging adhesive and the sealant together form the coplanar surface, and the extending portion of the first packaging adhesive is located between the coplanar surface and the side surface of the circuit substrate. The packaging structure as claimed in claim 1 , further comprising a second packaging adhesive covering the light emitting diode array and the first packaging adhesive. 7 . The package structure as claimed in claim 6 , wherein the sealant, the first packaging adhesive and the second packaging adhesive together form the coplanar surface. 8 . The package structure as claimed in claim 1 , wherein a distance between the coplanar surface and the side surface of the circuit substrate is between 5 μm and 15 μm. 9 . The package structure as claimed in claim 1 , wherein a distance between the coplanar surface and the side surface of the circuit substrate is between 45 μm and 55 μm. 10 . The package structure according to claim 1 , wherein the LED array comprises LEDs, and a distance between an upper surface of the main body of the first packaging adhesive and an upper surface of the LEDs is between 5 μm and 10 μm. 11 . The package structure according to claim 1 , wherein the LED array comprises LEDs, the LED array comprises bonding pads located between the LEDs and the circuit substrate, and the main body of the first packaging adhesive is substantially at the same height as the bonding pads.

12. A method for manufacturing a packaging structure, comprising: forming a first encapsulation adhesive on a circuit substrate and a light-emitting diode array, the light-emitting diode array being disposed on the circuit substrate, the circuit substrate including an upper surface and a side surface, the first encapsulation adhesive including a main body portion and an extension portion, the main body portion being disposed parallel to the upper surface, and the extension portion extending from the main body portion to the side surface; forming a sealant on the side surface of the circuit substrate, wherein the sealant contacts the side surface of the circuit substrate and the extending portion of the first packaging adhesive; performing an etching operation to mostly remove the first packaging adhesive above the LED array; Performing a dry cleaning operation to completely remove the ashed portion of the first packaging adhesive above the LED array and expose the upper surface of the LED array; A second packaging adhesive is formed on the light emitting diode array and the first packaging adhesive located between the light emitting diode arrays. 13 . The manufacturing method according to claim 12 , further comprising performing a cutting operation after forming the sealant on the side surface of the circuit substrate, so that the main body of the first packaging adhesive and the sealant form a coplanar surface.

14. The manufacturing method of claim 12, further comprising performing a cutting operation after forming the sealant on the side surface of the circuit substrate so that the main portion of the first encapsulant, the extension portion of the first encapsulant, and the sealant together form a coplanar surface.

15. The manufacturing method according to claim 12, further comprising performing a cutting operation after forming the second encapsulant to cover the LED array and the first encapsulant located between the LED arrays, so that the second encapsulant, the main body of the first encapsulant, the extension of the first encapsulant, and the sealant together form a coplanar surface.

16. The manufacturing method according to claim 12, further comprising performing a cutting operation after forming the second encapsulant and covering the LED array and the first encapsulant located between the LED arrays, so that the second encapsulant, the main body of the first encapsulant, and the sealant together form a coplanar surface.

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