A high-precision packaging structure for a semiconductor laser

Abstract

The present invention relates to the technical field of semiconductor laser packaging, and discloses a high-precision packaging structure for a semiconductor laser, which includes a fixed outer shell and two side covers. The side covers are snap-connected to the front and back of the fixed outer shell. The side covers are provided with wiring holes and through holes. One end of the inner cavity of the fixed outer shell is connected with a laser generating structure, and two adjacent laser generating structures are connected through a cooling plate. Connecting pipes are arranged in the middle of the front and back of the cooling plate, and the other ends of the connecting pipes extend to the outside of the side cover through the through holes. In this high-precision packaging structure for a semiconductor laser, through the setting of the cooling plate, the laser generating structure can be quickly cooled, which is convenient for multiple laser generating structures in this structure to work simultaneously, so that the power of the semiconductor laser can be stably changed, and the use effect of the semiconductor laser is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor laser packaging, in particular to a semiconductor laser high-precision packaging structure. Background Art

[0002] Semiconductor lasers are devices that use certain semiconductor materials as working materials to produce stimulated emission. The principle is to achieve population inversion by exciting non-equilibrium carriers between energy bands of semiconductor materials or between energy bands and impurity energy levels through certain excitation methods (electrical injection, optical pumping or high-energy electron beam injection), thereby producing stimulated emission of light.

[0003] The waste heat generated by the chip when the semiconductor laser is working needs to be discharged in a timely and effective manner, otherwise the temperature of the laser chip will be too high, the device's luminous efficiency will be reduced, and the laser will fail. The currently widely used technical solution is to solidify the semiconductor laser chip onto a heat sink block with strong heat dissipation capacity, and effectively evacuate the heat generated by the chip when it is working through the heat sink block. Since the heat sink is made of copper material with good conductivity, its thickness generally does not exceed 0.5mm. Each heat sink has 10-20 square bars, and each square bar has 20-30 heat sink blocks. The structural characteristics of the heat sink determine that the heat sink has poor rigidity. In the production process of semiconductor laser packaging, the heat sink needs to go through operations such as cleaning, drying, patching, and indium evaporation. In the production process, it is very easy for the square bars and heat sink blocks to warp and deform. This kind of heat sink with warping and deformation needs to be corrected before it can continue to be used, otherwise it will seriously affect the packaging consistency of the laser. This undoubtedly greatly increases the production process of the heat sink, and the number of chips packaged in the semiconductor laser is fixed, and the power of the semiconductor laser cannot be stably changed. For this reason, a high-precision packaging structure for semiconductor lasers is proposed. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a high-precision packaging structure for a semiconductor laser, which has the advantages of being able to stably change the power of the semiconductor laser, having a built-in heat sink correction component, and improving the packaging efficiency of the semiconductor laser, thereby solving the problems raised in the above-mentioned background technology.

[0005] The present invention provides the following technical solution: a high-precision packaging structure for a semiconductor laser, including a fixed outer shell and two side covers. The front and back of the fixed outer shell are both clamped with side covers. The side covers are provided with wiring holes and through holes. One end of the inner cavity of the fixed outer shell is connected with a laser generating structure. Two adjacent laser generating structures are connected by a cooling plate. The middle parts of the front and back of the cooling plate are both provided with connecting pipes. The other ends of the connecting pipes extend to the outside of the side covers through the through holes. The laser generating structure includes a heat sink block. A correction plate is clamped on the top of the heat sink block. And a roller is movably connected to the middle of one end of the bottom of the correction plate. A limiting block is arranged on the top of the correction plate. A laser chip is arranged inside the limiting block. One side of the top of the correction plate is connected with a positive plate. The other side of the top of the correction plate is connected with a negative plate. The positive plate is connected with the positive electrode of the laser chip through a gold wire. The negative plate is connected with the negative electrode of the laser chip through a gold wire. A convex lens is arranged in the middle of the inner cavity of the fixed outer shell. The convex lens is clamped with the laser generating structure through a limiting rod. A first reflecting plate is embedded at the bottom end of the other end of the inner cavity of the fixed outer shell. A second reflecting plate is embedded at the top of the other end of the inner cavity of the fixed outer shell. A laser outlet is arranged at the top of the other end of the inner cavity of the fixed outer shell.

[0006] Preferably, clamping grooves are arranged at the four corners of the front and back of the fixed outer shell, and clamping posts adapted to the clamping grooves are arranged at the four corners of the inner side of the side covers.

[0007] Preferably, a fixed frame is connected to the outer circle of the heat sink block. Limiting holes are arranged at the four corners of the top of the fixed frame, and a limiting post is arranged in the middle of the inner cavity of the limiting hole. Limiting tubes adapted to the limiting holes are arranged at the four corners of the bottom of the correction plate. A clamping tube is arranged in the middle of one side of the fixed frame. A placement groove adapted to the roller is arranged in the middle of the top of one side of the fixed frame.

[0008] Preferably, the correction plate and the heat sink block are made of the same material, and the sum of the thicknesses of the correction plate and the heat sink block is 0.5 mm.

[0009] Preferably, there are two limiting blocks, and the two limiting blocks are distributed on a diagonal line of the correction plate. The limiting blocks are in an L shape. The outer side walls of the limiting blocks are flush with the outer side walls of the correction plate, and the inner side walls of the limiting blocks are in contact with the side walls of the laser chip.

[0010] Preferably, limiting rods are connected to the middle parts of the top and bottom of the side of the convex lens close to the laser generating structure, and the other ends of the limiting rods are clamped in the inner cavity of the clamping tube.

[0011] Preferably, the cooling plate is made of the same material as the heat sink block. A positioning frame is connected to the top of the cooling plate. The outer surface of the positioning frame is in contact with the inner surface of the fixed outer shell, and the inner surface of the positioning frame is in contact with the outer surface of the fixed frame. The cooling plate is hollow.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. For the high-precision packaging structure of the semiconductor laser, through the setting of the cooling plate, the laser generating structure can be quickly cooled, facilitating the simultaneous operation of multiple laser generating structures within this structure, enabling the power of the semiconductor laser to be stably changed, and improving the usage effect of the semiconductor laser.

[0014] 2. For the high-precision packaging structure of the semiconductor laser, through the setting of the correction plate, during the packaging process of this structure, the movement of the roller on the top of the heat sink can correct the heat sink, facilitating the use of the heat sink. Through the setting of the limiting rod and the clamping tube, the position of the convex lens can be quickly determined, improving the assembly accuracy and assembly efficiency of this structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a front view schematic diagram of the structure of the present invention;

[0016] Figure 2 is the Figure 1 internal schematic diagram of the structure of the present invention;

[0017] Figure 3 is an exploded schematic diagram of the laser generating structure of the structure of the present invention;

[0018] Figure 4 is a bottom view schematic diagram of the correction plate of the structure of the present invention;

[0019] Figure 5 is an enlarged schematic diagram of the convex lens of the structure of the present invention;

[0020] Figure 6 is an enlarged schematic diagram of the cooling plate of the structure of the present invention.

[0021] In the figure: 1. Fixed outer shell; 2. Side cover; 3. Laser outlet; 4. Wiring hole; 5. Connecting pipe; 6. Laser generating structure; 7. Cooling plate; 8. Roller; 9. Card slot; 10. Reflector one; 11. Limiting rod; 12. Convex lens; 13. Reflector two; 14. Clamping tube; 15. Positioning frame; 16. Heat sink; 17. Fixed frame; 18. Limiting column; 19. Correction plate; 20. Negative plate; 21. Limiting block; 22. Positive plate; 23. Limiting tube; 24. Laser chip; 25. Placing groove. DETAILED DESCRIPTION OF THE INVENTION

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0023] Please refer to Figure 1 and 2 , a high-precision packaging structure for a semiconductor laser, which includes a fixed housing 1 and two side covers 2. Card slots 9 are provided at the four corners of the front and back. At the four corners inside the side cover 2, there are card posts adapted to the card slots. Through the arrangement of the card slots 9 and the card posts, the fixed housing 1 and the side cover 2 can be quickly connected together, facilitating the assembly of the structure. The side cover 2 is provided with a wiring hole 4 and a through hole.

[0024] At the right end of the inner cavity of the fixed housing 1, there is a laser generating structure 6. Two adjacent laser generating structures 6 are connected by a cooling plate 7, and the structure composed of the laser generating structure 6 and the cooling plate 7 is fixedly connected to the right end of the inner cavity of the fixed housing 1. Through the arrangement of the cooling plate 7, the laser generating structure 6 can be quickly cooled, facilitating the operation of the structure.

[0025] Please refer to Figure 2 , 3 and 4. The laser generating structure 6 includes a heat sink block 16 and a correction plate 19. The side wall of the heat sink block 16 is fixedly connected with a fixed frame. At the four corners of the top of the fixed frame 17, there are limit holes, and in the middle of the inner cavity of the limit holes, there is a limit post 18. At the four corners of the bottom of the correction plate 19, there are limit tubes 23 adapted to the limit holes. Through the arrangement of the limit holes and the limit tubes 23, the correction plate 19 can be clamped with the fixed frame 17, and the limit post 18 increases the firmness of the connection between the correction plate 19 and the fixed frame 17. At the middle of the bottom of one end of the correction plate 19, there is a roller 8 movably connected. The roller 8 is located outside the heat sink block 16. Through the arrangement of the roller 8, when the roller 8 moves on the top of the heat sink block 16, the heat sink block 16 can be corrected, facilitating the use of the heat sink block 16. And the height of the roller 8 is lower than the height of the bottom of the limit tube 23, facilitating the movement of the roller 8 on the top of the heat sink block 16. At the same position at the top of this end of the fixed frame 17, there is a placement groove 25. Through the arrangement of the placement groove 25, when the correction plate 19 is clamped with the fixed frame 17, the roller 8 is located inside the inner cavity of the placement groove 25.

[0026] On one side of both ends at the top of the correction plate 19, a limit block 21 is fixedly connected. And the two limit blocks 21 are distributed on a diagonal line of the correction plate 19. The shape of the limit block 21 is L-shaped. The outer side wall of the limit block 21 is flush with the outer side wall of the correction plate 19. The inner side wall of the limit block 21 contacts the side wall of the laser chip 24. Through the setting of the limit block 21, a positioning function can be achieved, enabling the laser chip 24 to be quickly and fixedly connected to the top of the correction plate 19.

[0027] On one side at the top of the correction plate 19, a positive plate 22 is fixedly connected. On the other side at the top of the correction plate 19, a negative plate 20 is connected. The positive plate 22 is connected to the positive electrode of the laser chip 24 through a gold wire. The negative plate 20 is connected to the negative electrode of the laser chip 24 through a gold wire. And the ends of the negative plate 20 and the positive plate 22 are connected to the limit block 21. This setting makes it convenient to connect the laser chip 24 and the electrode plates together with gold wires, and can improve the packaging efficiency of this structure.

[0028] The correction plate 19 and the heat sink block 16 are made of the same material. The sum of the thicknesses of the correction plate 19 and the heat sink block 16 is 0.5 millimeters. In the middle of one end of the fixing frame 17 close to the middle of the fixing shell 1, a clamping tube 14 is fixedly connected.

[0029] Please refer to Figure 2 and 5 , in the middle of the fixing shell 1, a convex lens 12 is provided. At the middle of the top and bottom of the side of the convex lens 12 close to the laser generating structure 6, a limit rod 11 is connected. The other end of the limit rod 11 is clamped in the inner cavity of the clamping tube 14. Through the setting of the limit rod 11, a positioning function can be achieved, facilitating the determination of the position of the convex lens 12 during the packaging process of this structure, and can reduce the assembly error of this structure and improve the precision of this structure. The setting of the limit rod 11 and the clamping tube 14 enables the disassembly and assembly of the convex lens 12.

[0030] At the bottom end of the other end of the inner cavity of the fixing shell 1, a first reflecting plate 10 is inlaid. At the top of the other end of the inner cavity of the fixing shell 1, a second reflecting plate 13 is inlaid. At the top of the other end of the inner cavity of the fixing shell 1, a laser outlet 3 is provided. Through the setting of the first reflecting plate 10 and the second reflecting plate 13, the direction of the laser can be changed, enabling the laser to vertically emit along the laser outlet 3.

[0031] Please refer to Figure 6 , the cooling plate 7 is made of the same material as the heat sink block 16. At the top of the cooling plate 7, a positioning frame 15 is connected. The outer surface of the positioning frame 15 contacts the inner surface of the fixing shell 1. The inner surface of the positioning frame 15 contacts the outer surface of the fixing frame 17. The cooling plate 7 is hollow. Through the setting of the positioning frame 15, it is convenient to connect the cooling plate 7 to the laser generating structure 6.

[0032] Embodiment: Three laser generating structures 6 are installed in this structure. There are four combination ways for the three laser generating structures 6 to be connected in parallel, and the total circuit after parallel connection extends to the outside of the side cover 2 through the wiring hole 4. When the laser is in use, by energizing different total circuits, the number of laser generating structures 6 working in this structure can be changed, and thus the working efficiency of the laser can be changed. When this structure is encapsulated, first encapsulate the laser generating structure 6. When encapsulating the laser generating structure 6, move the roller 8 on the top of the heat sink block 16. The roller 8 corrects the heat sink block 16 to facilitate the use of the laser generating structure 6. After the roller 8 rolls one week on the top of the heat sink block 16, snap the correction plate 19 with the fixed frame 17. Fix the laser chip 24 on the top of the correction plate 19, and the side wall of the laser chip 24 contacts the inner surface of the limit block 21. Install electrodes at both ends of the laser chip 24, and connect the electrodes to the positive and negative poles of the laser chip 24 with gold wires respectively. Place the laser generating structure 6 in the inner cavity of the positioning frame 15. The laser generating structure 6 can be connected to the cooling plate 7. Fix the structure formed by these two to the right end of the inner cavity of the fixed housing 1. The side wall of the cooling plate 7 is closely attached to the side wall of the fixed housing 1. Snap the limit rod 11 and the clamping tube 14 to determine and fix the position of the convex lens 12, and fix the positions of the first reflector 10 and the second reflector 13. Snap the side cover with the fixed housing 1. This structure can complete the encapsulation quickly, and the total circuit and the connecting pipe 5 are both located outside the side cover 2.

[0033] All the electrical components involved in this application can be bought on the market and are all prior arts. Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision packaging structure for a semiconductor laser, comprising a fixed housing (1) and two side covers (2). The side covers (2) are snap-fitted to the front and back of the fixed housing (1). The side covers (2) are provided with wiring holes (4) and through holes, and are characterized in that: One end of the inner cavity of the fixed housing (1) is connected with a laser generating structure (6). Two adjacent laser generating structures (6) are connected through a cooling plate (7). The cooling plate (7) is hollow. Connection pipes (5) are arranged in the middle of the front and back surfaces of the cooling plate (7). The other ends of the connection pipes (5) extend to the outside of the side cover (2) through through holes. The laser generating structure (6) includes a heat sink block (16). A correction plate (19) is clamped on the top of the heat sink block (16). A roller (8) is movably connected to the middle of one end of the bottom of the correction plate (19). A limiting block (21) is arranged on the top of the correction plate (19). A laser chip (24) is arranged inside the limiting block (21). A positive plate (22) is connected to one side of the top of the correction plate (19). A negative plate (20) is connected to the other side of the top of the correction plate (19). The positive plate (22) is connected to the positive electrode of the laser chip (24) through a gold wire. The negative plate (20) is connected to the negative electrode of the laser chip (24) through a gold wire. A convex lens (12) is arranged in the middle of the inner cavity of the fixed housing (1). The convex lens (12) is clamped with the laser generating structure (6) through a limiting rod (11). A first reflecting plate (10) is embedded at the bottom end of the other end of the inner cavity of the fixed housing (1). A second reflecting plate (13) is embedded at the top of the other end of the inner cavity of the fixed housing (1). A laser outlet (3) is arranged at the top of the other end of the inner cavity of the fixed housing (1). There are two limiting blocks (21). The two limiting blocks (21) are distributed on a diagonal line of the correction plate (19). The limiting block (21) is in an L shape. The outer side wall of the limiting block (21) is flush with the outer side wall of the correction plate (19). The inner side wall of the limiting block (21) is in contact with the side wall of the laser chip (24).

2. The high-precision packaging structure for a semiconductor laser according to claim 1, characterized in that: Clamping grooves (9) are arranged at the four corners of the front and back surfaces of the fixed housing (1). Clamping posts adapted to the clamping grooves are arranged at the four corners of the inner side of the side cover (2).

3. The high-precision packaging structure for a semiconductor laser according to claim 1, characterized in that: A fixed frame (17) is connected to the outer circle of the heat sink block (16). Limiting holes are arranged at the four corners of the top of the fixed frame (17). A limiting post (18) is arranged in the middle of the inner cavity of the limiting hole. Limiting tubes (23) adapted to the limiting holes are arranged at the four corners of the bottom of the correction plate (19). A clamping tube (14) is arranged in the middle of one side of the fixed frame (17). A placement groove (25) adapted to the roller (8) is arranged in the middle of one side of the top of the fixed frame (17).

4. The high-precision packaging structure for a semiconductor laser according to claim 1, characterized in that: The correction plate (19) and the heat sink block (16) are made of the same material. The sum of the thicknesses of the correction plate (19) and the heat sink block (16) is 0.5 mm.

5. The high-precision packaging structure for a semiconductor laser according to claim 3, characterized in that: Limiting rods (11) are connected to the middle of the top and bottom ends of the side of the convex lens (12) close to the laser generating structure (6). The other ends of the limiting rods (11) are clamped in the inner cavity of the clamping tube (14).

6. The high-precision packaging structure for a semiconductor laser according to claim 3, characterized in that: The material of the cooling plate (7) is the same as that of the heat sink block (16). A positioning frame (15) is connected to the top of the cooling plate (7). The outer surface of the positioning frame (15) is in contact with the inner surface of the fixed housing (1), and the inner surface of the positioning frame (15) is in contact with the outer surface of the fixed frame (17).

Images