Information identification method, device, system and storage medium

Abstract

The present disclosure provides an information identification method, device, system and storage medium, which relate to the field of detection. The method includes: collecting the voltage value of the semiconductor components assembled by the device; obtaining the temperature value corresponding to the voltage value according to each corresponding relationship among the voltage and temperature correspondences of multiple semiconductor components; selecting the corresponding relationship that matches the semiconductor components assembled by the device from multiple corresponding relationships according to the difference between the multiple temperature values ​​and the temperature to be matched. Regardless of which manufacturer's semiconductor components are installed in the device, the present disclosure can select the corresponding relationship that matches the semiconductor components assembled by the device from the voltage and temperature correspondences of the semiconductor components of multiple manufacturers according to the difference between the temperature value and the temperature to be matched, thereby reducing the problem of incorrect matching between the semiconductor components installed in the device and the running temperature detection program.

Description

Technical Field

[0001] The present disclosure relates to the field of detection, and in particular to an information recognition method, device, system and storage medium. Background Art

[0002] With the rapid advancement of localization in the semiconductor and chip industries, many domestic semiconductor components such as IPM (Intelligent Power Module) have developed rapidly, resulting in a situation where multiple manufacturers and multiple models are performing well.

[0003] Air conditioners, refrigerators and other application companies use multi-brand IPM and back up multiple production plans, which has become the fastest, most effective and safest localization method in the current home appliance industry.

[0004] However, the IPMs of different manufacturers have different parameters and inconsistent applications, especially in the temperature sampling part. Due to intellectual property issues, the temperature detection principles and temperature change curves adopted by each IPM manufacturer are different. As a result, home appliance companies need to install corresponding programs to match the IPMs of different manufacturers during the application process.

[0005] Related technologies typically use different program names to distinguish IPMs from different manufacturers, or employ hardware methods such as jumpers and DIP switches to differentiate them. This type of differentiation presents drawbacks when mass production is conducted on a large scale, creating risks of quality issues such as incorrect pairings, incorrect jumper caps, or DIP switches, hindering quality control during mass production. Summary of the Invention

[0006] A technical problem to be solved by the present disclosure is to provide an information identification method, device, system and storage medium, which can reduce the problem of incorrect matching between semiconductor components installed in a device and the running temperature detection program.

[0007] According to one aspect of the present disclosure, an information identification method is proposed, including: collecting the voltage value of a semiconductor component assembled by a device; obtaining a temperature value corresponding to the voltage value based on each of the corresponding relationships between the voltage and temperature of a plurality of semiconductor components; and selecting a corresponding relationship that matches the semiconductor component assembled by the device from a plurality of corresponding relationships based on the difference between the plurality of temperature values ​​and the temperature to be matched.

[0008] In some embodiments, the voltage value includes: a first voltage value during device debugging and a second voltage value when the device runs for a predetermined time, wherein the temperature value corresponding to the first voltage value is a first temperature value, and the temperature value corresponding to the second voltage value is a second temperature value.

[0009] In some embodiments, the temperature to be matched includes the ambient temperature and the theoretical temperature without heat dissipation, wherein, based on the difference between multiple temperatures and the temperature to be matched, selecting the corresponding relationship that matches the semiconductor components assembled with the device from multiple corresponding relationships includes: based on the difference between multiple first temperature values ​​and the ambient temperature, and the difference between multiple second temperature values ​​and the theoretical temperature without heat dissipation, selecting the corresponding relationship that matches the semiconductor components assembled with the device from multiple corresponding relationships.

[0010] In some embodiments, selecting a corresponding relationship that matches a semiconductor component assembled in the device includes: selecting N corresponding relationships from a plurality of corresponding relationships based on the difference between a plurality of first temperature values ​​and an ambient temperature, where N is a positive integer; and selecting M corresponding relationships from the N corresponding relationships based on the difference between a plurality of second temperature values ​​and a theoretical temperature without heat dissipation, as corresponding relationships that match the semiconductor component assembled in the device, where M is a positive integer, and M is a positive integer. <N。

[0011] In some embodiments, a debugging instruction sent by a main controller is received, wherein the debugging instruction includes ambient temperature data and a corresponding relationship identification indication, wherein, according to the corresponding relationship identification indication, a first voltage value of a semiconductor component assembled by the acquisition device is collected; the first temperature value corresponding to the first voltage value in each corresponding relationship is obtained; and the corresponding relationship where the N first temperature values ​​having the smallest difference with the ambient temperature are located is selected.

[0012] In some embodiments, based on the difference between multiple second temperature values ​​and the theoretical temperature without heat dissipation, selecting M corresponding relationships from N corresponding relationships includes: receiving a power-on instruction sent by a main controller, the power-on instruction including a corresponding relationship identification indication; after closing the refrigerant flow path of the heat dissipation device of the semiconductor components assembled in the device and the device running for a predetermined time, collecting the second voltage value of the semiconductor components assembled in the device according to the corresponding relationship identification indication; obtaining the second temperature value corresponding to the second voltage value in each corresponding relationship in the N corresponding relationships; and selecting the corresponding relationship where the M second temperature values ​​with the smallest difference from the theoretical temperature without heat dissipation are located.

[0013] In some embodiments, the corresponding relationship between voltage and temperature of a plurality of semiconductor components and the theoretical temperature without heat dissipation are pre-stored.

[0014] In some embodiments, the corresponding relationship between voltage and temperature is a curve graph of voltage and temperature.

[0015] In some embodiments, the semiconductor component includes an intelligent power module (IPM).

[0016] According to another aspect of the present disclosure, an information identification device is also proposed, including: a voltage acquisition unit, configured to acquire the voltage value of the semiconductor component assembled by the device; a temperature acquisition unit, configured to acquire the temperature value corresponding to the acquired voltage value according to each correspondence between the voltage and temperature of multiple semiconductor components; and a correspondence selection unit, configured to select a correspondence that matches the semiconductor component assembled by the device from multiple correspondences based on the difference between the multiple temperature values ​​and the temperature to be matched.

[0017] In some embodiments, the voltage value includes: a first voltage value during device debugging and a second voltage value when the device runs for a predetermined time, wherein the temperature value corresponding to the first voltage value is a first temperature value, and the temperature value corresponding to the second voltage value is a second temperature value.

[0018] In some embodiments, the temperature to be matched includes the ambient temperature and the theoretical temperature without heat dissipation, wherein the correspondence selection unit is configured to select a correspondence that matches the semiconductor components assembled in the device from multiple correspondences based on the differences between multiple first temperature values ​​and the ambient temperature, and the differences between multiple second temperature values ​​and the theoretical temperature without heat dissipation.

[0019] In some embodiments, the correspondence selection unit is configured to select N correspondences from a plurality of correspondences based on the difference between the plurality of first temperature values ​​and the ambient temperature, where N is a positive integer; and select M correspondences from the N correspondences based on the difference between the plurality of second temperature values ​​and the theoretical temperature without heat dissipation, as correspondences matching the semiconductor components assembled in the device, where M is a positive integer, and M <N。

[0020] In some embodiments, the first instruction receiving unit is configured to receive a debugging instruction sent by the main controller, wherein the debugging instruction includes ambient temperature data and a corresponding relationship identification indication, wherein the voltage acquisition unit is configured to acquire the first voltage value of the semiconductor component assembled by the device according to the corresponding relationship identification indication; the temperature acquisition unit is configured to obtain the first temperature value corresponding to the first voltage value in each corresponding relationship; and the corresponding relationship selection unit is configured to select the corresponding relationship where the N first temperature values ​​with the smallest difference from the ambient temperature are located.

[0021] In some embodiments, the second instruction receiving unit is configured to receive a power-on instruction sent by the main controller, wherein the power-on instruction includes a corresponding relationship identification indication, wherein the voltage acquisition unit is configured to close the refrigerant flow path of the heat dissipation device of the semiconductor components assembled in the device, and after the device has been running for a predetermined time, acquire the second voltage value of the semiconductor components assembled in the device according to the corresponding relationship identification indication; the temperature acquisition unit is configured to obtain the second temperature value corresponding to the second voltage value in each of N corresponding relationships; and the corresponding relationship selection unit is configured to select the corresponding relationship where the M second temperature values ​​having the smallest difference from the theoretical temperature without heat dissipation are located.

[0022] In some embodiments, the pre-storage unit is configured to pre-store the corresponding relationship between the voltage and temperature of a plurality of semiconductor components, as well as the theoretical temperature without heat dissipation.

[0023] In some embodiments, the corresponding relationship between voltage and temperature is a curve graph of voltage and temperature.

[0024] In some embodiments, the semiconductor component includes an intelligent power module (IPM).

[0025] According to another aspect of the present disclosure, an information identification device is provided, including: a memory; and a processor coupled to the memory, wherein the processor is configured to execute the above-mentioned information identification method based on instructions stored in the memory.

[0026] According to another aspect of the present disclosure, an information identification system is further proposed, comprising: the above-mentioned information identification device; and a main controller configured to send a debugging instruction and a power-on instruction to the information identification device.

[0027] According to another aspect of the present disclosure, a device is also proposed, including: the above-mentioned information recognition system.

[0028] According to another aspect of the present disclosure, a non-transitory computer-readable storage medium is further provided, on which computer program instructions are stored, and when the instructions are executed by a processor, the above-mentioned information identification method is implemented.

[0029] In the disclosed embodiment, no matter which manufacturer's semiconductor components are installed in the device, through the above method, among the voltage-temperature correspondences of semiconductor components from multiple manufacturers, a correspondence that matches the semiconductor components assembled in the device can be selected based on the difference between the temperature value and the temperature to be matched, thereby reducing the problem of incorrect matching between the semiconductor components installed in the device and the running temperature detection program.

[0030] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0032] The present disclosure can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0033] Figure 1 Schematic diagram of the flow of some embodiments of the information identification method disclosed herein;

[0034] Figure 2 Schematic diagram of the flow chart of other embodiments of the information identification method disclosed herein;

[0035] Figure 3 is a schematic diagram of a curve showing the relationship between voltage and temperature of the IPM disclosed herein;

[0036] Figure 4 Schematic diagrams of some embodiments of the communication protocol disclosed herein;

[0037] Figure 5 is a schematic diagram of a curve showing the relationship between voltage and temperature of the IPM disclosed herein;

[0038] Figure 6 Schematic diagrams of other embodiments of the communication protocol disclosed herein;

[0039] Figure 7 is a schematic diagram of a curve showing the relationship between voltage and temperature of the IPM disclosed herein;

[0040] Figure 8 Schematic diagram of the structure of some embodiments of the information identification device disclosed in the present invention;

[0041] Figure 9 Schematic diagrams of structures of other embodiments of the information identification device disclosed in the present invention; and

[0042] Figure 10 Schematic diagram of the structure of some other embodiments of the information identification device disclosed in the present invention. DETAILED DESCRIPTION

[0043] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure.

[0044] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0045] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0046] Technologies, methods and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods and equipment should be considered part of the authorization specification.

[0047] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0048] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0049] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0050] Figure 1 1 is a flow chart of some embodiments of the information identification method disclosed herein, which is executed by a frequency conversion controller.

[0051] In step 110 , the voltage values ​​of semiconductor components mounted on the device are collected.

[0052] In some embodiments, the device is an air conditioning unit or a refrigerator.

[0053] In some embodiments, the semiconductor components include IPM, PFC (Power Factor Correction) modules, etc.

[0054] In step 120 , a temperature value corresponding to the collected voltage value is obtained according to each of the corresponding relationships between the voltage and the temperature of the plurality of semiconductor components.

[0055] In some embodiments, the corresponding relationship between voltage and temperature is a curve graph of voltage and temperature.

[0056] In some embodiments, the corresponding relationships between voltage and temperature of multiple IPMs are pre-stored. For example, the corresponding relationships between voltage and temperature of IPMs from five manufacturers are stored. After collecting a voltage value of the IPM installed in the device, five temperature values ​​can be obtained based on the corresponding relationships.

[0057] In some embodiments, the collected voltage values ​​include a first voltage value during device debugging and a second voltage value when the device is running for a predetermined time. The temperature value corresponding to the first voltage value is a first temperature value, and the temperature value corresponding to the second voltage value is a second temperature value.

[0058] In step 130 , a corresponding relationship that matches the semiconductor component mounted on the device is selected from a plurality of corresponding relationships based on the differences between the plurality of temperature values ​​and the temperature to be matched.

[0059] In some embodiments, the temperature to be matched includes the ambient temperature and the theoretical temperature without heat dissipation. The theoretical temperature without heat dissipation is the theoretical temperature after the refrigerant flow path of the heat dissipation device of the IPM installed in the device is closed and the device has been running for a predetermined period of time. The theoretical temperature without heat dissipation is a pre-stored value.

[0060] In some embodiments, based on the differences between the plurality of first temperature values ​​and the ambient temperature, and the differences between the plurality of second temperature values ​​and the theoretical temperature without heat dissipation, a corresponding relationship matching the IPM installed in the device is selected from a plurality of corresponding relationships. For example, based on the differences between the plurality of first temperature values ​​and the ambient temperature, N corresponding relationships are selected from a plurality of corresponding relationships, where N is a positive integer; based on the differences between the plurality of second temperature values ​​and the theoretical temperature without heat dissipation, M corresponding relationships are selected from the N corresponding relationships as the corresponding relationships matching the IPM installed in the device, where M is a positive integer, and M is a positive integer. <N。

[0061] In the above embodiment, no matter which manufacturer's semiconductor components are installed in the device, through the above method, among the correspondences between voltage and temperature of semiconductor components from multiple manufacturers, a correspondence that matches the semiconductor components assembled in the device can be selected based on the difference between the temperature value and the temperature to be matched, thereby avoiding the problem of incorrect matching of the semiconductor components installed in the device with the running temperature detection program.

[0062] Figure 2 1 is a flow chart of another embodiment of the information identification method disclosed herein. In this embodiment, the semiconductor component is introduced by taking IPM as an example.

[0063] In step 210 , temperature curve data and theoretical temperatures without heat dissipation of a plurality of IPMs are pre-stored.

[0064] In some embodiments, as Figure 3 As shown, the temperature curve data of the IPMs of various manufacturers that need to be replaced are all stored in the frequency conversion controller.

[0065] In some embodiments, the variable frequency controller stores the theoretical temperature of the IPM at time t when the refrigerant heat dissipation path is blocked. This theoretical temperature is determined at the beginning of project development and is the average of multiple measurements taken over t minutes of IPM operation with the refrigerant heat dissipation path blocked. This theoretical temperature is determined by the size of the heat sink on the back of the IPM. For a given unit, the heat sink size is already determined, so the theoretical temperature can also be determined. For example, time t is 3 to 5 minutes.

[0066] In step 220 , when the device is in an initial debugging state, N pieces of temperature curve data matching the IPMs installed on the device are selected from the temperature curve data of the multiple IPMs.

[0067] In some embodiments, the frequency conversion controller receives a debugging instruction sent by the main controller, wherein the debugging instruction includes ambient temperature data and a temperature curve identification indication. According to the corresponding relationship identification indication, the first voltage value of the IPM assembled by the acquisition device is collected, the first temperature value corresponding to the first voltage value in each corresponding relationship is obtained, and the corresponding relationship of the N first temperature values ​​with the smallest difference from the ambient temperature is selected.

[0068] For example, when the unit is powered on for the first time and enters the debugging state, the main controller sends the current unit's ambient temperature data and IPM temperature curve identification instructions to the frequency converter through the protocol. Figure 4 As shown, the protocol contains data bits for conventional debugging instructions, ambient temperature, and temperature curve identification instructions. The frequency conversion controller calculates multiple first temperature values ​​corresponding to the first voltage value of the IPM based on the pre-selected temperature curve. The temperature curve containing the N first temperature values ​​with the smallest difference from the ambient temperature is selected. For example, 2 to 3 temperature curves are selected. Figure 5 As shown, taking the ambient temperature of 30°C and the voltage value detected by the IPM as 1.7V as an example, the temperature curves corresponding to manufacturer 1, manufacturer 2, and manufacturer 3 are selected.

[0069] In step 230 , during a predetermined operation time of the device, M pieces of temperature curve data matching the IPM equipped with the device are selected from the temperature curve data of the N pieces of IPM.

[0070] In some embodiments, the frequency conversion controller receives a power-on instruction sent by the main controller, which includes a corresponding relationship identification indication; after the refrigerant flow path of the heat dissipation device of the IPM equipped with the equipment is closed and the equipment has been running for a predetermined time, the second voltage value of the IPM equipped with the equipment is collected according to the corresponding relationship identification indication; the second temperature value corresponding to the second voltage value in each of N corresponding relationships is obtained; and the corresponding relationship where the M second temperature values ​​having the smallest difference from the theoretical temperature without heat dissipation are located is selected.

[0071] For example, the main controller sends a power-on command to the frequency converter through a protocol, such as Figure 6 As shown, the protocol includes a flag bit indicating that the refrigerant flow path has been closed and a data bit for a temperature curve identification instruction. After closing the refrigerant flow path of the heat dissipation device and running the unit for t time, multiple second temperature values ​​corresponding to the second voltage value of the IPM are calculated based on the N selected temperature curve data. The temperature curve with the smallest temperature difference is selected for comparison with the pre-saved theoretical temperature at time t, and the temperature curve is stored in the Flash memory of the frequency conversion controller. Figure 7 As shown, taking the theoretical temperature of 90°C and the voltage value detected by the IPM as 2.9V as an example, the temperature curve corresponding to manufacturer 2 is selected and stored in the Flash memory of the frequency converter controller.

[0072] In step 240, the temperature curve of the IPM is identified, and a temperature identification completion status bit is sent to the main controller.

[0073] The unit commissioning proceeds to the next step until all commissioning items are completed.

[0074] In step 250 , temperature curve data matching the IPM installed in the device is called to detect the temperature of the installed IPM.

[0075] In the above embodiment, no matter which manufacturer's IPM is installed in the equipment, the frequency conversion controller can use the above method to select the optimal temperature curve from multiple temperature curves as the temperature curve corresponding to the IPM installed in the equipment. This can solve the problem of quality abnormality risk caused by incorrect matching and is conducive to quality control in mass production.

[0076] Figure 8 Schematic diagram of the structure of some embodiments of the information identification device disclosed in the present invention. The information identification device is a variable frequency controller, including a voltage acquisition unit 810, a temperature acquisition unit 820, and a corresponding relationship selection unit 830.

[0077] The voltage acquisition unit 810 is configured to acquire voltage values ​​of semiconductor components mounted on the device.

[0078] In some embodiments, the device is an air conditioning unit or a refrigerator.

[0079] In some embodiments, the semiconductor components include an IPM, a PFC module, and the like.

[0080] The temperature acquisition unit 820 is configured to acquire a temperature value corresponding to the collected voltage value according to each of the corresponding relationships between the voltage and the temperature of the plurality of semiconductor components.

[0081] In some embodiments, the corresponding relationship between voltage and temperature is a curve graph of voltage and temperature.

[0082] In some embodiments, the collected voltage values ​​include a first voltage value during device debugging and a second voltage value when the device is running for a predetermined time. The temperature value corresponding to the first voltage value is a first temperature value, and the temperature value corresponding to the second voltage value is a second temperature value.

[0083] The correspondence selection unit 830 is configured to select a correspondence matching the semiconductor component mounted on the device from among the multiple correspondences according to the differences between the multiple temperature values ​​and the temperature to be matched.

[0084] In some embodiments, the temperature to be matched includes the ambient temperature and the theoretical temperature without heat dissipation. The theoretical temperature without heat dissipation is the theoretical temperature after the refrigerant flow path of the heat dissipation device of the IPM installed in the device is closed and the device has been running for a predetermined period of time. The theoretical temperature without heat dissipation is a pre-stored value.

[0085] In some embodiments, based on the differences between the plurality of first temperature values ​​and the ambient temperature, and the differences between the plurality of second temperature values ​​and the theoretical temperature without heat dissipation, a corresponding relationship matching the IPM installed in the device is selected from a plurality of corresponding relationships. For example, based on the differences between the plurality of first temperature values ​​and the ambient temperature, N corresponding relationships are selected from a plurality of corresponding relationships, where N is a positive integer; based on the differences between the plurality of second temperature values ​​and the theoretical temperature without heat dissipation, M corresponding relationships are selected from the N corresponding relationships as the corresponding relationships matching the IPM installed in the device, where M is a positive integer, and M is a positive integer. <N。

[0086] In the above embodiment, no matter which manufacturer's semiconductor components are installed in the device, through the above method, among the correspondences between voltage and temperature of semiconductor components from multiple manufacturers, a correspondence that matches the semiconductor components assembled in the device can be selected based on the difference between the temperature value and the temperature to be matched, thereby avoiding the problem of incorrect matching of the semiconductor components installed in the device with the running temperature detection program.

[0087] Figure 9 This is a structural schematic diagram of some other embodiments of the information identification device disclosed in the present invention, which includes: a pre-storage unit 910, a first instruction receiving unit 920, a second instruction receiving unit 930, a voltage acquisition unit 810, a temperature acquisition unit 820, and a correspondence selection unit 830.

[0088] The pre-storage unit 910 is configured to pre-store the corresponding relationship between the voltage and temperature of a plurality of semiconductor components, as well as the theoretical temperature without heat dissipation.

[0089] In some embodiments, all the temperature curve data of the IPMs of various manufacturers that need to be replaced are stored in the pre-storage unit 910 of the frequency conversion controller.

[0090] In some embodiments, the variable frequency controller stores the theoretical temperature of the IPM at time t when the refrigerant heat dissipation path is blocked. This theoretical temperature is determined at the beginning of project development and is the average of multiple measurements taken over t minutes of IPM operation with the refrigerant heat dissipation path blocked. This theoretical temperature is determined by the size of the heat sink on the back of the IPM. For a given unit, the heat sink size is already determined, so the theoretical temperature can also be determined. For example, time t is 3 to 5 minutes.

[0091] The first instruction receiving unit 920 is configured to receive a debugging instruction sent by the main controller, wherein the debugging instruction includes ambient temperature data and a corresponding relationship identification indication. The voltage acquisition unit 810 is configured to acquire a first voltage value of the IPM installed in the device based on the corresponding relationship identification indication. The temperature acquisition unit 820 is configured to obtain the first temperature value corresponding to the first voltage value in each corresponding relationship. The corresponding relationship selection unit 830 is configured to select the corresponding relationship containing the N first temperature values ​​with the smallest difference from the ambient temperature.

[0092] In some embodiments, when a unit is powered on for the first time and enters a commissioning state, the main controller sends the unit's current ambient temperature data and an IPM temperature curve identification instruction to the variable frequency controller via a protocol. Based on a preselected temperature curve, the variable frequency controller calculates multiple first temperature values ​​corresponding to a first voltage value of the IPM. The temperature curve containing the N first temperature values ​​with the smallest difference from the ambient temperature is selected.

[0093] The second instruction receiving unit 930 is configured to receive a power-on instruction sent by the main controller, wherein the power-on instruction includes a corresponding relationship identification indication, wherein the voltage acquisition unit 810 is configured to, after closing the refrigerant flow path of the heat dissipation device of the IPM equipped with the device and the device has been running for a predetermined time, acquire the second voltage value of the IPM equipped with the device according to the corresponding relationship identification indication; the temperature acquisition unit 820 is configured to obtain the second temperature value corresponding to the second voltage value in each of the N corresponding relationships; the corresponding relationship selection unit 830 is configured to select the corresponding relationship where the M second temperature values ​​having the smallest difference from the theoretical temperature without heat dissipation are located.

[0094] In some embodiments, the main controller sends a power-on command to the variable frequency controller via a protocol that includes data bits indicating the refrigerant flow path closure and temperature curve identification. After closing the refrigerant flow path of the heat sink and operating the unit for a time period t, multiple second temperature values ​​corresponding to the second voltage value of the IPM are calculated based on the N selected temperature curve data. The temperature curve with the smallest temperature difference is selected for comparison with the previously saved theoretical temperature at time t, and the temperature curve is stored in the flash memory of the variable frequency controller.

[0095] In the above embodiment, no matter which manufacturer's IPM is installed in the equipment, the frequency conversion controller can use the above method to select the optimal temperature curve from multiple temperature curves as the temperature curve corresponding to the IPM installed in the equipment. This can solve the problem of quality abnormality risk caused by incorrect matching and is conducive to quality control in mass production.

[0096] Figure 10 Schematic diagrams of other embodiments of the information identification device disclosed herein. The information identification device 1000 includes a memory 1010 and a processor 1020. The memory 1010 may be a disk, flash memory, or any other non-volatile storage medium. The memory 1010 is used to store the instructions described in the above embodiments. The processor 1020 is coupled to the memory 1010 and may be implemented as one or more integrated circuits, such as a microprocessor or microcontroller. The processor 1020 is used to execute the instructions stored in the memory.

[0097] In some embodiments, the processor 1020 is coupled to the memory 1010 via a BUS 1030. The information identification device 1000 may also be connected to an external storage device 1050 via a storage interface 1040 to access external data, and may also be connected to a network or another computer system (not shown) via a network interface 1060, which will not be described in detail here.

[0098] In this embodiment, the memory stores data instructions, and the processor processes the instructions, thereby avoiding the problem of incorrect matching between the IPM installed in the device and the running temperature detection program.

[0099] In other embodiments of the present disclosure, an information identification system is provided. The information identification system includes the information identification device in the above embodiment and a main controller configured to send debugging instructions and power-on instructions to the information identification device.

[0100] In other embodiments of the present disclosure, a device is also protected, which includes the information identification system in the above embodiment. The device is, for example, an air conditioning unit or a refrigerator.

[0101] In other embodiments, a computer-readable storage medium stores computer program instructions thereon, which, when executed by a processor, implement the steps of the method in the above-described embodiment. Those skilled in the art will appreciate that the embodiments of the present disclosure may be provided as methods, devices, or computer program products. Therefore, the present disclosure may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the present disclosure may take the form of a computer program product implemented on one or more computer-usable non-transient storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0102] The present disclosure is described with reference to flowcharts and / or block diagrams of methods, devices (systems) and computer program products according to embodiments of the present disclosure. It should be understood that each process and / or block in the flowchart and / or block diagram and the combination of processes and / or blocks in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0103] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0104] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0105] The present disclosure has been described in detail so far. To avoid obscuring the concept of the present disclosure, some details known in the art have not been described. Based on the above description, those skilled in the art can fully understand how to implement the technical solutions disclosed herein.

[0106] Although some specific embodiments of the present disclosure have been described in detail by way of examples, those skilled in the art will appreciate that the above examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. An information identification method, comprising: Acquiring a first voltage value of a semiconductor component assembled in a device when the device is debugged and a second voltage value when the device is operated for a predetermined time; According to each of the corresponding relationships between the voltages and temperatures of the plurality of semiconductor components, acquiring a temperature value corresponding to the first voltage value as a plurality of first temperature values, and a temperature value corresponding to the second voltage value as a plurality of second temperature values; Selecting N corresponding relationships from a plurality of corresponding relationships according to differences between the plurality of first temperature values ​​and the ambient temperature, where N is a positive integer; as well as According to the difference between the plurality of second temperature values ​​and the theoretical temperature without heat dissipation, M corresponding relationships are selected from the N corresponding relationships as corresponding relationships matching the semiconductor components assembled in the device, wherein M is a positive integer, and M <N。 2. The information identification method according to claim 1, further comprising: Receive a debugging instruction sent by the main controller, wherein the debugging instruction includes ambient temperature data and a corresponding relationship identification indication, wherein, According to the corresponding relationship identification indication, collecting a first voltage value of a semiconductor component assembled in the device; Obtaining a first temperature value corresponding to each corresponding relationship of the first voltage value; and Select the corresponding relationship of the N first temperature values ​​having the smallest difference with the ambient temperature.

3. The information identification method according to claim 1, wherein: Selecting M corresponding relationships from the N corresponding relationships according to differences between the plurality of second temperature values ​​and the theoretical temperature without heat dissipation includes: receiving a power-on instruction sent by a main controller, wherein the power-on instruction includes a corresponding relationship identification indication; After closing a refrigerant flow path of a heat sink of a semiconductor component mounted on the device and the device has been running for a predetermined time, collecting a second voltage value of the semiconductor component mounted on the device according to the corresponding relationship identification indication; Obtaining a second temperature value corresponding to the second voltage value in each of the N corresponding relationships; and Select the corresponding relationship of the M second temperature values ​​having the smallest difference from the theoretical temperature without heat dissipation.

4. The information identification method according to any one of claims 1 to 3, further comprising: The corresponding relationship between the voltage and temperature of the plurality of semiconductor components and the theoretical temperature without heat dissipation are stored in advance.

5. The information identification method according to any one of claims 1 to 3, wherein: The corresponding relationship between voltage and temperature is a curve graph of voltage and temperature.

6. The information identification method according to any one of claims 1 to 3, wherein: The semiconductor components include intelligent power modules (IPMs).

7. An information recognition device comprising: a voltage acquisition unit configured to acquire a first voltage value of a semiconductor component mounted on a device when the device is being debugged and a second voltage value when the device is running for a predetermined time; a temperature acquisition unit configured to acquire, according to each of the correspondences between the voltages and temperatures of the plurality of semiconductor components, a temperature value corresponding to the first voltage value as a plurality of first temperature values, and a temperature value corresponding to the second voltage value as a plurality of second temperature values; as well as The corresponding relationship selection unit is configured to select N corresponding relationships from a plurality of corresponding relationships according to the difference between the plurality of first temperature values ​​and the ambient temperature, wherein N is a positive integer, and select M corresponding relationships from the N corresponding relationships according to the difference between the plurality of second temperature values ​​and the theoretical temperature without heat dissipation as corresponding relationships matching the semiconductor components assembled in the device, wherein M is a positive integer, and M <N。 8. The information identification device according to claim 7, further comprising: The first instruction receiving unit is configured to receive a debugging instruction sent by the main controller, wherein the debugging instruction includes ambient temperature data and a corresponding relationship identification indication, wherein: The voltage acquisition unit is configured to acquire a first voltage value of a semiconductor component assembled in the device according to the corresponding relationship identification indication; The temperature acquisition unit is configured to acquire a first temperature value corresponding to the first voltage value in each corresponding relationship; and The correspondence relationship selection unit is configured to select the correspondence relationship including the N first temperature values ​​having the smallest difference from the ambient temperature.

9. The information identification device according to claim 7, further comprising: The second instruction receiving unit is configured to receive a power-on instruction sent by the main controller, wherein the power-on instruction includes a corresponding relationship identification indication, wherein: The voltage acquisition unit is configured to acquire a second voltage value of the semiconductor component assembled in the device according to the corresponding relationship identification indication after closing a refrigerant flow path of a heat dissipation device of the semiconductor component assembled in the device and the device has been running for a predetermined time; The temperature acquisition unit is configured to acquire a second temperature value corresponding to the second voltage value in each of the N corresponding relationships; and The correspondence relationship selection unit is configured to select the correspondence relationship of the M second temperature values ​​having the smallest difference from the theoretical temperature without heat dissipation.

10. The information identification device according to any one of claims 7 to 9, further comprising: The pre-storage unit is configured to pre-store the corresponding relationship between the voltage and temperature of the plurality of semiconductor components, as well as the theoretical temperature without heat dissipation.

11. The information recognition device according to any one of claims 7 to 9, wherein: The corresponding relationship between voltage and temperature is a curve graph of voltage and temperature.

12. The information recognition device according to any one of claims 7 to 9, The semiconductor components include intelligent power modules (IPMs).

13. An information recognition device comprising: Memory; as well as A processor coupled to the memory, wherein the processor is configured to execute the information identification method according to any one of claims 1 to 6 based on instructions stored in the memory.

14. An information recognition system comprising: The information identification device according to any one of claims 7 to 13; as well as The main controller is configured to send a debugging instruction and a power-on instruction to the information identification device.

15. A device comprising: The information recognition system according to claim 14.

16. A non-transitory computer-readable storage medium having computer program instructions stored thereon, wherein when the instructions are executed by a processor, the information identification method according to any one of claims 1 to 6 is implemented.

Images