Stacked electronic components

Abstract

The present invention relates to a laminated electronic component comprising: a substrate formed by laminating insulating layers and having a bottom surface serving as a mounting surface; and a bottom electrode formed on the bottom surface of the substrate and comprising glass and sintered metal, the bottom electrode comprising a first electrode layer and a second electrode layer formed on a side of the substrate closer to the first electrode layer than the first electrode layer, the edge of the second electrode layer being covered by an outer coating layer which is part of the substrate, the first electrode layer being laminated on the second electrode layer while holding the outer coating layer, and the glass content of the first electrode layer being greater than the glass content of the second electrode layer.

Description

Technical Field

[0001] One aspect of this disclosure relates to a stacked electronic component. Background Technology

[0002] Japanese Patent Application Publication No. 2020-61409 discloses a laminated electronic component comprising a substrate formed by laminating insulating layers and having a bottom surface as a mounting surface, and a bottom electrode formed on the bottom surface of the substrate and comprising glass and sintered metal. The bottom electrode comprises a first electrode layer and a second electrode layer formed on the substrate side closer to the first electrode layer than the first electrode layer. In this structure, the edge of the second electrode layer is covered by an outer layer that is part of the substrate, and the first electrode layer is laminated on the second electrode layer while holding the outer layer in place. Summary of the Invention

[0003] In the aforementioned stacked electronic components, it is necessary to set the bottom electrode as a double-layer structure consisting of a first electrode layer and a second electrode layer to disperse stress from stress concentration points and suppress cracking of the substrate. However, even if stress is dispersed, if the adhesion between the first electrode layer and the substrate is weak, the stress will act on the structurally weak parts, which may cause damage to the electrode side, such as plating peeling.

[0004] One aspect of this disclosure is to provide a stacked electronic component that can suppress the generation of cracks in the substrate and damage to the electrode side.

[0005] The laminated electronic component disclosed herein includes: a substrate formed by laminating insulating layers and having a bottom surface as a mounting surface; and a bottom electrode formed on the bottom surface of the substrate and comprising glass and sintered metal, the bottom electrode having a first electrode layer and a second electrode layer formed on a side of the substrate closer to the first electrode layer than the first electrode layer, the edge of the second electrode layer being covered by an outer coating layer which is part of the substrate, the first electrode layer being laminated on the second electrode layer while holding the outer coating layer, and the glass content of the first electrode layer being greater than the glass content of the second electrode layer.

[0006] In a laminated electronic component, the bottom electrode includes a first electrode layer and a second electrode layer formed closer to the substrate than the first electrode layer. The edge of this second electrode layer is covered by an outer layer that is part of the substrate. Conversely, the first electrode layer is laminated on the second electrode layer while holding the outer layer in place. Here, the glass content of the first electrode layer is higher than that of the second electrode layer. Therefore, the first electrode layer is bonded with a higher adhesion strength than the outer layer. Thus, when stress is applied to the bottom electrode, and stress concentration occurs near the end of the bottom electrode, the stress is dispersed to the outer layer via the boundary where the adhesion strength between the first electrode layer and the outer layer is high. This suppresses the generation of cracks in the substrate and damage to the electrode side.

[0007] Alternatively, the glass softening point of the first electrode layer may be lower than that of the second electrode layer. In this case, the sintering temperature can be kept low when the first electrode layer is sintered to the substrate, thus suppressing the reaction between the first electrode layer and the substrate.

[0008] Alternatively, when viewed in a cross-section of the region where the outer layer is sandwiched between the first and second electrode layers, if the direction of the bottom electrode extension is defined as the first direction, the direction along the thickness of the bottom electrode is defined as the second direction, the distance in the second direction between the ends of the first electrode layer and the second electrode layer in the first direction is defined as the first dimension, and the length of the second electrode layer covered by the outer layer in the first direction is defined as the second dimension, then the first dimension is smaller than the second dimension, and the first dimension is 10 μm or more. In this case, the stress dispersion area described above can be sufficiently ensured.

[0009] Alternatively, the second electrode layer can be thicker than the first electrode layer. In this way, by ensuring the thickness of the bottom electrode with a second electrode layer that has a low glass content and low resistance, the first electrode layer, which has a high glass content and high resistance, can be made thin.

[0010] Alternatively, the glass content of the first electrode layer can be 3.8–10.0 wt%. By setting it within this range, the adhesion strength of the first electrode layer relative to the outer layer can be improved.

[0011] According to one aspect of this disclosure, a stacked electronic component can be provided that can suppress the generation of cracks in the substrate and damage to the electrode side. Attached Figure Description

[0012] Figure 1 This is a perspective view of a stacked electronic component according to an embodiment of the present disclosure.

[0013] Figure 2 It will be along Figure 1 The enlarged cross-sectional view near the bottom electrode in the cross-sectional view along line II-II shown is an enlarged cross-sectional view.

[0014] Figure 3 An example of the structure showing the internal electrodes and through-hole conductors inside the substrate.

[0015] Figure 4 This is an enlarged sectional view of the end of the bottom electrode.

[0016] Figure 5 (a) and Figure 5 (b) is a conceptual diagram illustrating the manufacturing process of the second electrode layer.

[0017] Figure 6 It is a process diagram showing the manufacturing method of stacked electronic components.

[0018] Figure 7 of (a), Figure 7 (b) and Figure 7 (c) is a schematic diagram showing the situation at each stage of the manufacturing method of the stacked electronic components.

[0019] Figure 8 of (a), Figure 8 (b) and Figure 8 (c) is a schematic diagram showing the situation at each stage of the manufacturing method of the stacked electronic components.

[0020] Figure 9 (a) is an enlarged cross-sectional view of the stress situation of the composite electronic component in the comparative example. Figure 9 (b) is an enlarged cross-sectional view showing the stress of the stacked electronic components in this embodiment.

[0021] Figure 10 (a) and Figure 10 (b) is an enlarged cross-sectional view used to illustrate the effect of the dimensional relationship between the first electrode layer and the second electrode layer.

[0022] Figure 11 (a) is a bottom view showing the stacked electronic components used in the experiment. Figure 11 (b) is a table representing the test results.

[0023] Explanation of symbols:

[0024] 1…Layered electronic components, 2…Base body, 3…Bottom electrode, 5…Outer layer, 11…First electrode layer, 12…Second electrode layer. Detailed Implementation

[0025] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. In the description, the same symbols are used for the same elements or elements having the same function, and repeated descriptions are omitted.

[0026] Figure 1 This is a perspective view of the stacked electronic component 1 according to an embodiment of the present disclosure. Figure 2 It will be along Figure 1 The enlarged cross-sectional view near the bottom electrode 3 in the cross-sectional view along line II-II shown is an example of this. Figure 1 As shown, the stacked electronic component 1 has a body 2 and multiple bottom electrodes 3.

[0027] As described below, the base body 2 is formed by stacking multiple insulating layers. The base body 2 has a cuboid shape. This cuboid shape includes both cuboids with chamfered corners and edges, and cuboids with rounded corners and edges. The base body 2 has a top surface 2A, a bottom surface 2B serving as a mounting surface, and four side surfaces 2C, 2D, 2E, and 2F as its outer surfaces. The top surface 2A and bottom surface 2B are opposite to each other. Side surfaces 2C and 2D are opposite to each other. Side surfaces 2E and 2F are opposite to each other. Side surfaces 2C to 2F extend along the stacking direction (the direction of the stacked insulating layers) of the top surface 2A and bottom surface 2B, and are adjacent to the top surface 2A and bottom surface 2B. In the base body 2, the top surface 2A and bottom surface 2B are located at opposite ends of the stacking direction. The material of the base body 2 (the material of the insulating layer) is not particularly limited; for example, Al2O3, SiO2, 2MgO·SiO2, xBaO·yNdO·zTiO2, (Ca,Sr)TiO2, etc., can also be used. Furthermore, terms such as "upper" and "bottom" in this specification are used for ease of explanation and do not limit the orientation of the stacked electronic component 1. For example, the stacked electronic component 1 can be mounted with its upper surface 2A facing horizontally or downwards.

[0028] Bottom electrode 3 is an electrode disposed on the bottom surface 2B of the substrate 2. Viewed from the stacking direction, bottom electrode 3 has a rectangular shape. Figure 1 In the example shown, six bottom electrodes 3 are formed. These bottom electrodes 3 have the same shape as each other. Furthermore, the number of bottom electrodes 3 can be appropriately varied depending on the application of the stacked electronic component 1. Additionally, the shapes of the multiple bottom electrodes do not necessarily have to be identical. For example, they can also be as follows: Figure 7 The diagram shows four bottom electrodes 3 of two different sizes, which can also be formed as shown. Figure 11 As shown, a large number of bottom surface electrodes 3 are formed.

[0029] like Figure 2 As shown, the substrate 2 is constructed by stacking multiple insulating layers 4. Furthermore, multiple internal electrodes 6 and through-hole conductors 7 are formed inside the substrate 2. The substrate 2 is formed by stacking and firing sheets of insulating layers 4 with conductor patterns of internal electrodes 6 formed on their surfaces. The through-hole conductors 7 are conductors that penetrate each insulating layer 4 and connect the internal electrodes 6 formed on other insulating layers 4 to each other. Additionally, the through-hole conductors 7 connect the internal electrodes 6 and the bottom electrode 3. Furthermore, the boundaries between the insulating layers 4 are integrated to a degree that is not visible to the naked eye. Moreover, the substrate 2 has an outer layer 5 as one of the insulating layers at the bottom surface 2B. The outer layer 5 will be described later along with the structure of the bottom electrode 3.

[0030] Figure 3 This is an example showing the structure of the internal electrode 6 and the through-hole conductor 7 inside the body 2. For example... Figure 3As shown, a circuit 8 performing a specified function is formed by three-dimensionally combining multiple internal electrodes 6 and multiple through-hole conductors inside the body 2. Figure 3 The circuit 8 is shown as an example of a directional coupler. Multiple bottom electrodes 3 are electrically connected to the circuit 8. Thus, the circuit 8 and the external mounting substrate are connected via the bottom electrodes 3.

[0031] Next, the structure of the bottom electrode 3 will be described in detail. For example... Figure 4 As shown, the bottom electrode 3 includes a first electrode layer 11 and a second electrode layer 12. The first electrode layer 11 is formed to expose outwards from the bottom surface 2B. The first electrode layer 11 is formed by bonding a conductive material to the substrate 2 (and the second electrode layer 12) after firing the substrate 2. The first electrode layer 11 is electrically connected to an external mounting substrate via solder 16. Therefore, a plating layer 14 for improving the wettability of the solder is formed on the outer surface of the first electrode layer 11. The second electrode layer 12 is formed on the substrate 2 side closer to the first electrode layer 11. The second electrode layer 12 is formed in a manner as if embedded into the interior of the substrate 2, and is formed by firing simultaneously with the substrate 2.

[0032] Furthermore, in the following explanation, in Figure 4 In the cross-section shown, sometimes the direction of the extension of the bottom electrode 3 is defined as the first direction D1, and the direction along the thickness of the bottom electrode 3 is defined as the second direction D2.

[0033] The second electrode layer 12 has a main body portion 21 extending along the first direction D1 and an edge portion 22 formed on the outer peripheral side of the first direction D1. The edge portion 22 of the second electrode layer 12 is covered by an outer coating layer 5, which is part of the substrate 2. The upper surface 22a of the edge portion 22 in the second direction D2 contacts the insulating layer 4 of the substrate 2. The lower surface 22b of the edge portion 22 in the second direction D2 contacts the outer coating layer 5 of the substrate 2. Thus, the edge portion 22 is embedded into the interior of the substrate 2 in such a way that it is held between the insulating layer 4 and the outer coating layer 5. The edge portion 22 is formed such that it slopes upward from the outer peripheral side of the main body portion 21 in the first direction D1 and tapers at its tip. Therefore, the lower surface 22b of the edge portion 22 separates upward from the bottom surface 2B as it moves away from the main body portion 21 in the first direction D1.

[0034] With the structure described above, the thickness of the outer layer 5, which contacts the surface 22b of the edge portion 22, increases as it extends from the main body portion 21 toward the outer periphery in the first direction D1. Thus, the outer layer 5 has a region that penetrates the bottom side of the edge portion 22 and supports the surface 22a. This region constitutes a covering portion 23 that covers the edge portion 22. The covering portion 23 tapers at its tip as it moves toward the main body portion 21 in the second direction D2. The main body portion 21 of the second electrode layer 12 becomes a structure that exposes from the covering portion 23. Furthermore, the positions of the upper surface 22a and the bottom surface 22b at their ends 12a in the first direction D1 of the second electrode layer 12 intersect each other.

[0035] The shapes of such a second electrode layer 12 and outer layer 5 are achieved by, for example... Figure 5 The manufacturing method shown is used to form it. First, as... Figure 5 As shown in (a), a paste for the second electrode layer 12 is printed on the outer surface 4a of the outermost insulating layer 4 before firing. Next, a paste for the outer coating layer 5 is printed on the outer surface 4a of the insulating layer 4, covering the edge 22 of the second electrode layer 12 and exposing the main body 21. Then, by pressing the second electrode layer 12 and the outer coating layer 5, as shown in (a), the second electrode layer 12 and the outer coating layer 5 are pressed together. Figure 5 As shown in (b), the edge 22 is flattened by the outer layer 5, resulting in a tapered front end.

[0036] like Figure 4 As shown, the first electrode layer 11 is stacked on the second electrode layer 12 while the outer coating layer 5 is being held in place. As described above, the outer coating layer 5 covers the edge 22 of the second electrode layer 12 with the covering portion 23. The first electrode layer 11 is formed such that it covers the main body 21 of the second electrode layer 12 and the outer surface (i.e., the bottom surface 2B) of the outer coating layer 5 from the bottom side. Therefore, the covering portion 23 of the outer coating layer 5 is positioned between the bottom surface 22b of the edge 22 of the second electrode layer 12 and the first electrode layer 11, in a manner that the outer coating layer 5 is being held in place.

[0037] Next, the dimensional relationships of the bottom electrode 3 will be explained. The distance in the second direction D2 between the end 11a of the first electrode layer 11 in the first direction D1 and the end 12a of the second electrode layer 12 in the first direction D1 is defined as the first dimension La. Furthermore, the length of the second electrode layer 12 covered by the outer layer 5 in the first direction D1 is defined as the second dimension Lb. In addition, in Figure 4 In this structure, the first electrode layer 11 extends substantially parallel to the first direction, therefore, the end portion 11a is positioned in the same direction as the other portions in the second direction D2. However, the end portion 11a may be positioned differently from the other portions of the first electrode layer 11 in the second direction. The dimension of the first electrode layer 11 in the second direction D2 is defined as thickness t1. The dimension of the main body portion 21 of the second electrode layer 12 in the second direction D2 is defined as thickness t2.

[0038] In this case, the first dimension La is smaller than the second dimension Lb. Furthermore, the first dimension La is preferably 10 μm or more, more preferably 15 μm or more. Furthermore, the first dimension La is preferably 60 μm or less, more preferably 40 μm or less. The second dimension Lb is preferably 20 μm or more, more preferably 25 μm or more. Furthermore, the second dimension Lb is preferably 90 μm or less, more preferably 60 μm or less. The thickness t2 of the second electrode layer 12 is thicker than the thickness t1 of the first electrode layer 11. Furthermore, the thickness t1 of the first electrode layer 11 is preferably 3 μm or more, more preferably 5 μm or more. Furthermore, the thickness t1 of the first electrode layer 11 is preferably 30 μm or less, more preferably 20 μm or less. Furthermore, the thickness t2 of the second electrode layer 12 is preferably 5 μm or more, more preferably 20 μm or more. Furthermore, the thickness t2 of the second electrode layer 12 is preferably 40 μm or less, more preferably 30 μm or less.

[0039] Next, the material of the bottom electrode 3 will be described. The bottom electrode 3 is made of a conductive material comprising glass and sintered metal. Examples of sintered metals include Ag, Cu, Au, Pt, Pd, or alloys thereof. The sintered metals contained in the first electrode layer 11 and the sintered metals contained in the second electrode layer 12 may be different from or the same as each other. In addition, the bottom electrode 3 may contain trace amounts of metal oxides as other inorganic components.

[0040] The glass content of the first electrode layer 11 is greater than that of the second electrode layer 12. Specifically, the glass content of the first electrode layer 11 is preferably 3.8 wt% or more, more preferably 5.0 wt% or more. The glass content of the first electrode layer 11 is preferably 8.0 wt% or less, more preferably 10.0 wt% or less. The glass content of the second electrode layer 12 is preferably 0.5 wt% or more, more preferably 1.0 wt% or more. The glass content of the second electrode layer 12 is preferably 2.8 wt% or less, more preferably 2.5 wt% or less.

[0041] The glass softening point of the first electrode layer 11 is lower than that of the second electrode layer 12. Specifically, the glass softening point of the first electrode layer 11 is 540–670°C. By increasing the glass content and lowering the softening point, the high density of the electrode (for the electrical properties of the product, and to prevent the intrusion of the plating solution) can be maintained as a sintering electrode, while also taking into account plating performance. Furthermore, the glass softening point of the second electrode layer 12 is 810–860°C. Thus, by increasing the softening point of the second electrode layer 12 and reducing the amount of glass added, sintering matching with the substrate 2 can be achieved. This sintering matching balances the effect of suppressing the bending of the substrate 2 and the high density of the electrode.

[0042] Next, refer to Figures 6-8 The manufacturing method of the stacked electronic component 1 will be described. Figure 6This is a process diagram illustrating the manufacturing method of the stacked electronic component 1. Figure 7 and Figure 8 This is a schematic diagram illustrating the various stages of the manufacturing method for the stacked electronic component 1. Furthermore, in Figure 7 and Figure 8 The example shown is when there are four bottom electrodes 3. Figure 7 The upper side view of (a)(b)(c) represents the top view, and the lower side view represents the side view.

[0043] like Figure 6 As shown, firstly, a process for forming an insulating layer 4 sheet is performed (step S10). In this process, a paste constituting the insulating layer 4 is applied to a substrate sheet 31 such as a PET film to form a sheet (see reference). Figure 7 (a) Next, a process is performed to form the second electrode layer 12 of the bottom electrode 3 by screen printing on the sheet of insulating layer 4 (step S20). In this process, paste is screen printed on the outer surface of insulating layer 4 into a shape corresponding to the second electrode layer 12 (see reference). Figure 7 (b)). Furthermore, at this time, internal electrodes 6 are printed on the sheets of the other insulating layers 4. Next, a process is performed to form an outer layer 5 by screen printing on the outer surface of the insulating layer 4 (step S30). In this process, paste is screen printed on the outer surface of the insulating layer 4 into a shape corresponding to the outer layer 5 (see reference). Figure 7 (c)). At this time, the outer layer 5 is printed in such a way that it covers the edge of the second electrode layer 12, and is pressed after printing (see reference). Figure 5 ).

[0044] Next, a process is performed to fabricate a sheet laminate substrate 40, which serves as the base material 2 before sintering, by laminating the printed insulating layer 4. Each insulating layer 4 is laminated onto the sheet laminate substrate 40 with the outermost layer being the outermost layer (see step S40). Figure 8 (a) Next, the sheet laminate 40 is cut into a specified size using a cutting machine, and chamfered using a green roller (step S50). Next, the sheet laminate 40 is sintered to form the substrate 2, and then sintered and polished using a roller (step S60). Through these steps, a substrate 2 with a corner R is formed (see reference). Figure 8 (b) Next, for screen printing, a process of neatly arranging the substrate 2 is performed (step S70). Then, a process of forming the first electrode layer 11 by screen printing the substrate 2 is performed (step S80). In this process, a process of forming the first electrode layer 11 by screen printing in a manner that covers the second electrode layer 12 is performed (see [reference]). Figure 8(c)). The first electrode layer 11 is formed by heat treatment for welding. Next, a process is performed to form a plating layer 14 by plating the outer surface of the first electrode layer 11 (step S90).

[0045] Next, the function and effects of the stacked electronic component 1 in this embodiment will be explained.

[0046] First of all, Figure 9 The comparative example of the stacked electronic component shown in (a) will be described. In the comparative example, the first electrode layer 11 is not formed. In this case, when the stacked electronic component is installed, stress F1 is applied to the bottom electrode 3 due to the effect of heat. Then, the stress concentrates on the bottom surface 2B of the substrate 2 and the portion P1 of the second electrode layer 12. As a result, stress F2 moves from the stress concentration portion P1 toward the interior of the substrate 2. If such stress F2 acts under high-cycle conditions, cracks will be generated on the substrate 2.

[0047] In the stacked electronic component 1, the bottom electrode 3 includes a first electrode layer 11 and a second electrode layer 12 formed on the side of the substrate 2 closer to the first electrode layer 11. The edge 22 of this second electrode layer 12 is covered by an outer layer 5, which is part of the substrate 2. Conversely, the first electrode layer 11 is stacked on the second electrode layer 12 while holding the outer layer 5 in place. In this structure, as... Figure 9 As shown in (b), by applying stress F1 to the bottom electrode 3, stress concentrates in the portion P2 near the end of the bottom electrode 3. For example, if the first electrode layer 11 is not bonded to the outer layer 5 with sufficient adhesion strength, the stress cannot be well dispersed to the outer layer 5, and cracks may occur on the substrate 2. Alternatively, the plating layer 14 may peel off, causing damage to the bottom electrode 3 itself. In contrast, in the laminated electronic component 1 of this embodiment, the glass content of the first electrode layer 11 is greater than that of the second electrode layer 12. Therefore, the first electrode layer 11 is bonded to the outer layer 5 with a high adhesion strength. Therefore, as Figure 9 As shown in (b), when stress F1 is applied to the bottom electrode 3, and stress concentration occurs in the portion P2 near the end of the bottom electrode 3, the stress is dispersed to the covering portion 23 of the outer layer 5 (the area surrounded by A in the figure) via the boundary BL of the first electrode layer 11 and the outer layer 5 where the adhesion strength is high. As a result, the generation of cracks in the substrate 2 and damage to the electrode side can be suppressed.

[0048] The glass softening point of the first electrode layer 11 can also be lower than that of the second electrode layer 12. In this case, when the first electrode layer 11 is sintered to the substrate 2, the sintering temperature can be kept low, thus suppressing the reaction between the first electrode layer 11 and the substrate 2.

[0049] In a cross-section of the region where the outer layer 5 is sandwiched between the first electrode layer 11 and the second electrode layer 12, if the direction in which the bottom electrode 3 extends is defined as the first direction D1, the direction along the thickness of the bottom electrode 3 is defined as the second direction D2, the distance in the second direction D2 between the end 11a of the first electrode layer 11 in the first direction D1 and the end 12a of the second electrode layer 12 in the first direction D1 is defined as the first dimension La, and the length of the second electrode layer 12 covered by the outer layer 5 in the first direction D1 is defined as the second dimension Lb, then the first dimension La can be smaller than the second dimension Lb, and the first dimension La can be 10 μm or more. In this case, the stress dispersion area described above can be sufficiently ensured. For example, as... Figure 10 As shown in (a), if the first dimension La is too short, the stress distribution to the covering portion 23 may be insufficient. Additionally, as... Figure 10 As shown in (b), if the second dimension Lb is too short, the stress distribution to the covering portion 23 may be insufficient. In contrast, as Figure 4 As shown, by setting the first dimension La and the second dimension Lb to appropriate dimensions, the stress dispersion effect towards the covering part 23 can be fully obtained.

[0050] The second electrode layer 12 can also be thicker than the first electrode layer 11. In this way, by ensuring the thickness of the bottom electrode 3 with a second electrode layer 12 that has a low glass content and low resistance, the first electrode layer 11, which has a high glass content and high resistance, can be kept thin.

[0051] The glass content of the first electrode layer 11 can be 3.8 to 10.0 wt%. By setting it within this range, the adhesion strength of the first electrode layer 11 to the outer layer 5 can be improved.

[0052] Next, refer to Figure 11 This section describes the thermal shock test of the laminated electronic components relative to the embodiments and comparative examples. Preparations were made with... Figure 11 A stacked electronic component with a bottom electrode 3 pattern as shown in (a). As a comparative example of a stacked electronic component, such as... Figure 9 (a) Electronic components without the first electrode layer 11 were prepared. The stacked electronic components of the comparative example and the embodiment were connected to the substrate via solder, and repeatedly heated and cooled to -40°C to 125°C. Each temperature was maintained for 30 minutes. A thermal shock test was performed under these conditions. Figure 11 The cutting line CL of (a) was cut, and the formation of substrate cracks (cracks in body 2), terminal damage (peeling of the plating layer from the bottom electrode, etc.), and solder cracks were observed in the seven bottom electrodes. The defects observed in several of the seven bottom electrodes were counted. The test results were then presented in… Figure 11 As shown in (b).

[0053] like Figure 11 As shown in (b), matrix cracking and terminal failure were confirmed in the comparative example with a low number of cycles. Furthermore, as a matrix crack, it was observed to extend upwards from the stress concentration portion P1 and to the second electrode layer 12 and the insulating layer 4 (see reference). Figure 9 Cracks such as those caused by damage to the second electrode layer 12, and those extending upwards from part P1 and along the boundary between the second electrode layer 12 and the insulating layer 4, were observed. As terminal damage, peeling between the electrode and the plating was confirmed. Furthermore, solder cracks were confirmed to occur in 6 out of 7 out of 500 cycles. As solder cracks, cracks indicating internal damage to the solder were confirmed. In contrast, the embodiment demonstrated that even with high cycle numbers, substrate cracking and terminal damage could be prevented. Furthermore, it was confirmed that solder crack formation could be suppressed even with low cycle numbers.

Claims

1. A stacked electronic component, wherein, have: The base body, formed by stacking insulating layers, has a bottom surface designated as a mounting surface; and A bottom electrode, formed on the bottom surface of the substrate, comprises glass and sintered metal. The bottom electrode has a first electrode layer and a second electrode layer formed on the body side further than the first electrode layer. The edge of the second electrode layer is covered by an outer layer that is part of the substrate. The first electrode layer is stacked on the second electrode layer while the outer coating layer is being held in place. The glass content of the first electrode layer is greater than that of the second electrode layer. The second electrode layer is formed such that the edge is bent within the substrate in a manner that it slopes inward toward the inside of the substrate in the direction of the thickness of the bottom electrode, following the direction of the outer periphery of the second electrode layer extending from the main body toward the bottom electrode. The first electrode layer includes a portion that holds the outer coating layer and is exposed from the bottom surface of the substrate.

2. The stacked electronic component according to claim 1, wherein, The glass softening point of the first electrode layer is lower than that of the second electrode layer.

3. The stacked electronic component according to claim 1 or 2, wherein, Viewed in a cross-section of the region where the outer layer is sandwiched between the first electrode layer and the second electrode layer, the direction in which the bottom electrode extends is defined as the first direction, and the direction along the thickness of the bottom electrode is defined as the second direction. The distance in the second direction between the end of the first electrode layer in the first direction and the end of the second electrode layer in the first direction is defined as a first dimension. When the length of the second electrode layer in the first direction covered by the outer layer is set as the second dimension, The first dimension is smaller than the second dimension, and the first dimension is greater than 10 μm.

4. The stacked electronic component according to claim 1 or 2, wherein, The second electrode layer is thicker than the first electrode layer.

5. The stacked electronic component according to claim 1 or 2, wherein, The glass content of the first electrode layer is 3.8 to 10.0 wt%.

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