Connection film and display module

Abstract

The present application provides a connection film and a display module. The connection film includes: a film body and a conductive layer. The film body is in contact with the conductive layer, and the conductive layer is used for electrically connecting with an external circuit to soften the film body. The conductive layer can directly transfer heat to the film body without transferring heat through other structural layers of the display module, and has less impact on the display module. The conductive layer heats the film body from the inside of the display module, and its heating range is small, so that the influence of high temperature during the softening connection process on the display module can be reduced. Therefore, the connection film and the display module provided by the present application have less impact on the display module during the softening connection process of the connection film, thereby reducing or avoiding damage to the display module.

Description

Technical Field

[0001] This application relates to the field of display technologies, and in particular, to a connection film and a display module. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels have been increasingly widely used due to their advantages such as light weight, self-luminescence, wide viewing angle, low driving signal, high luminous efficiency, low power consumption, and fast response speed.

[0003] In related technologies, a display module may include a display panel, a polarizer, and a cover plate that are sequentially stacked. An optical transparent adhesive is provided between the cover plate and the polarizer for connecting the polarizer and the cover plate. In the process of connecting the polarizer and the cover plate with the optical transparent adhesive, the optical transparent adhesive is first disposed between the polarizer and the cover plate, and then the display module is placed in a high-temperature environment for heat treatment to soften the optical transparent adhesive, so that the optical transparent adhesive is fully adhered and bonded to the cover plate and the polarizer, and then cooled and cured to form.

[0004] However, the above heat treatment process is likely to damage the display module. Summary of the Invention

[0005] In view of the above at least one technical problem, embodiments of this application provide a connection film and a display module, which have less impact on the display module during the softening connection process of the connection film, so as to reduce or avoid damage to the display module.

[0006] To achieve the above object, embodiments of this application provide the following technical solutions:

[0007] A first aspect of embodiments of this application provides a connection film, including: a film body and a conductive layer. The film body and the conductive layer are in contact, and the conductive layer is used for electrical connection with an external circuit to soften the film body.

[0008] The connection film provided by the embodiments of the present application may include a film body and a conductive layer. The film body can be used to connect an external component to be connected (for example, the component to be connected can be a structural layer in a display module). The connection film may further include a conductive layer, which is used for electrical connection with an external circuit. The conductive layer converts the electrical energy of the external circuit into heat to soften the film body. The softened film body has good fluidity and adhesiveness, so that the softened film body can be fully attached to and adhered to the component to be connected. In addition, when the surface of the component to be connected in contact with the connection film is uneven, the softened film body can also better fill the surface, so as to better realize the connection between the connection film and the component to be connected. Among them, the conductive layer is in contact with the film body, and the conductive layer can better transfer heat to the film body. There is no need to put the connection film and the component to be connected into a high-temperature environment for heating as a whole. The volume occupied by the conductive layer is small, and the heating range of the conductive layer is small, so that the influence of the high temperature in the softening connection process on the component to be connected can be reduced, the influence on the display module with the connection film can be reduced, and the damage to the display module can be reduced or avoided.

[0009] In a possible implementation, the conductive layer is located on the surface of the film body;

[0010] It can be realized that the film body includes a first surface and a second surface oppositely arranged along the thickness direction of the connection film, and the conductive layer is located on at least one of the first surface and the second surface;

[0011] It can be realized that the film body includes a side surface connecting the first surface and the second surface, and the conductive layer is located on the side surface.

[0012] In this way, the preparation difficulty of the conductive layer is relatively low.

[0013] In a possible implementation, the film body has a pore channel, the conductive layer is located in the pore channel and is in contact with the inner wall surface of the pore channel.

[0014] In this way, the film body forms a protection for the conductive layer.

[0015] In a possible implementation, a connection part is arranged on the outer periphery of the conductive layer, and the connection part is used for electrical connection to an external circuit;

[0016] It can be realized that the connection part and the conductive layer are of an integral structure.

[0017] In this way, the connection between the external circuit and the conductive layer is more convenient.

[0018] In a possible implementation, the conductive layer includes a plurality of first conductive wires and a plurality of second conductive wires. The plurality of first conductive wires are arranged at intervals and extend along a first direction, the plurality of second conductive wires are arranged at intervals and extend along a second direction, and the first conductive wires and the second conductive wires intersect with each other.

[0019] In a possible implementation, the distance between any two adjacent first conductive wires and / or any two adjacent second conductive wires is less than or equal to 3 μm;

[0020] It can be realized that the conductive layer is a transparent conductive layer;

[0021] It can be realized that the thickness of the conductive layer is greater than or equal to 1 μm;

[0022] It can be realized that the conductive layer is grounded.

[0023] In this way, there are many implementation manners of the conductive layer, and it can be applied to many scenarios.

[0024] In a possible implementation, the film body is multilayer, and the multilayer film bodies are stacked along the thickness direction of the connecting film.

[0025] In a possible implementation, a support layer is provided between at least two adjacent film bodies;

[0026] It can be realized that the softening temperature of the support layer is greater than that of the film body; and / or, the modulus of the support layer is greater than that of the film body; and / or, the thermal expansion coefficient of the support layer is less than that of the film body.

[0027] In this way, the support layer can support the film body.

[0028] The second aspect of the embodiments of the present application provides a display module, including the connecting film in the above first aspect.

[0029] For the display module provided by the embodiments of the present application, the display module includes a connecting film, and the connecting film may include a film body and a conductive layer. The film body can be used to connect an external component to be connected (for example, the component to be connected may be a structural layer in the display module). The connecting film may further include a conductive layer, and the conductive layer is used for electrical connection with an external circuit. The conductive layer converts the electrical energy of the external circuit into heat to soften the film body. The softened film body has good fluidity and adhesiveness, so that the softened film body can be fully attached to and adhered to the component to be connected. In addition, when the surface of the component to be connected in contact with the connecting film is uneven, the softened film body can also better fill the surface, so as to better realize the connection between the connecting film and the component to be connected. Among them, the conductive layer is in contact with the film body, and the conductive layer can better transfer heat to the film body. There is no need to put the connecting film and the component to be connected into a high-temperature environment for heating as a whole. The volume occupied by the conductive layer is small, and the heating range of the conductive layer is small. Therefore, the influence of the high temperature in the softening connection process on the component to be connected can be reduced, the influence on the display module with the connecting film can be reduced, and the damage to the display module can be reduced or avoided.

[0030] In a possible implementation, the display module includes a display panel, a light filtering layer, and a cover plate that are stacked in sequence. The connection film is located on the side of the light filtering layer close to the display panel;

[0031] and / or, the connection film is located on the side of the light filtering layer close to the cover plate; It can be achieved that the display module further includes an ink layer, and the ink layer is located between the connection film and the cover plate;

[0032] It can be achieved that the light filtering layer includes a polarizer.

[0033] In this way, there are many ways to set the connection film, which can be applied to many scenarios.

[0034] The structure of the present application and its other invention purposes and beneficial effects will become more obvious and understandable through the description of the preferred embodiments in conjunction with the drawings. Description of the Drawings

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0036] Figure 1 It is a cross-sectional view of the display module provided by the embodiment of the present application;

[0037] Figure 2 It is a schematic structural diagram of the connection film provided by the embodiment of the present application;

[0038] Figure 3 It is another schematic structural diagram of the connection film provided by the embodiment of the present application;

[0039] Figure 4 It is another schematic structural diagram of the connection film provided by the embodiment of the present application;

[0040] Figure 5 It is another schematic structural diagram of the connection film provided by the embodiment of the present application;

[0041] Figure 6 It is a top view of the conductive layer provided by the embodiment of the present application;

[0042] Figure 7 It is a schematic structural diagram of the conductive layer after being energized provided by the embodiment of the present application;

[0043] Figure 8 It is a schematic structural diagram of the film body with multiple layers provided by the embodiment of the present application;

[0044] Figure 9Another schematic structural view of the multi-layer film body provided by the embodiment of the present application;

[0045] Figure 10 Another schematic structural view of the multi-layer film body provided by the embodiment of the present application;

[0046] Figure 11 Schematic structural view of a support layer provided between adjacent two-layer film bodies in the embodiment of the present application;

[0047] Figure 12 Schematic structural view of the connection film located between the cover plate and the light filtering layer in the embodiment of the present application;

[0048] Figure 13 Another schematic structural view of the connection film located between the cover plate and the light filtering layer in the embodiment of the present application.

[0049] Explanation of reference numerals:

[0050] 100 - Display module; 110 - Display panel;

[0051] 120 - Light filtering layer; 130 - Cover plate;

[0052] 140 - Ink layer; 200 - Connection film;

[0053] 210 - Film body; 211 - First surface;

[0054] 212 - Second surface; 213 - Side surface;

[0055] 214 - First film body; 215 - Second film body;

[0056] 220 - Conductive layer; 221 - First conductive layer;

[0057] 222 - Second conductive layer; 223 - First conductive wire;

[0058] 224 - Second conductive wire; 230 - Connection part;

[0059] 240 - Support layer. Detailed implementation manners

[0060] In the related art, a display module may include a display panel, a polarizer, and a cover plate that are sequentially stacked. The display panel is connected to the polarizer, and the cover plate and the polarizer are bonded by an optical transparent adhesive. An ink layer is provided at the edge of the surface of the cover plate facing the optical transparent adhesive to prevent light leakage. The ink layer protrudes from the cover plate, resulting in a step between the cover plate and the ink layer. In the process of connecting the polarizer and the cover plate with the optical transparent adhesive, the optical transparent adhesive is first disposed between the polarizer and the cover plate, and then the entire display module is placed in a high-temperature environment for heat treatment to soften the optical transparent adhesive. The softened optical transparent adhesive has good fluidity, and thus has good step coverage ability to fill the step difference caused by the step of the ink layer.

[0061] In addition, the display module needs to undergo reliability tests, that is, by changing basic parameters such as temperature, humidity, and pressure, increasing environmental stress, and accelerating product aging to evaluate the reliability of the display module. For example, Highly Accelerated Stress Test (HAST for short), 85-degree Celsius and 85% relative humidity test conditions, etc. During the above reliability test process, the optical transparent adhesive will be softened and flow, thus affecting the connection performance of the optical transparent adhesive. Therefore, an optical transparent adhesive with a softening temperature higher than the reliability test temperature needs to be used to connect the cover plate and the polarizer to avoid softening the optical transparent adhesive at high temperature during the reliability test.

[0062] However, when the softening temperature of the optical transparent adhesive is higher than the reliability test temperature, the softening temperature is relatively high. In the process of softening the optical transparent adhesive to connect the cover plate and the polarizer, the entire display module is placed in a high-temperature environment to connect the cover plate and the polarizer. The high-temperature environment during the softening connection process is likely to damage the display module.

[0063] Based on at least one of the above technical problems, an embodiment of the present application provides a connection film and a display module. The connection film may include a film body and a conductive layer. The film body can be used to connect an external component to be connected (for example, the component to be connected can be a structural layer in the display module). The connection film may further include a conductive layer, which is used for electrical connection with an external circuit. The conductive layer converts the electrical energy of the external circuit into heat to soften the film body. The softened film body has good fluidity and adhesiveness, so that the softened film body can be fully attached to and adhered to the component to be connected. In addition, when the surface of the component to be connected in contact with the connection film is uneven, the softened film body can also better fill the surface to better achieve the connection (such as bonding) between the connection film and the component to be connected. Among them, the conductive layer is in contact with the film body, and the conductive layer can better transfer heat to the film body to make the film body evenly heated inside. There is no need to put the connection film and the component to be connected into a high-temperature environment for heating as a whole. The volume occupied by the conductive layer is small, and the heating range of the conductive layer is small, so that the influence of the high temperature in the softening connection process on the component to be connected can be reduced, the influence on the display module with the connection film can be reduced, and the damage to the display module can be reduced or avoided.

[0064] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0065] The following will be combined with Figures 1-13 to illustrate the display module 100 provided by the embodiments of the present application.

[0066] An embodiment of the present application provides a display module 100, which can be applied to display devices, such as mobile or fixed terminals with a display module 100, such as electronic paper, mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, smart bracelets, smart watches, super personal computers, navigators, etc.

[0067] As Figure 1 shown, the display module 100 may include a display panel 110, and the display panel 110 may be an organic light-emitting diode (OLED) display panel, a micro light-emitting diode (Micro LED or μLED) display panel, or a liquid crystal (LCD) display panel.

[0068] The display panel 110 may include a light-emitting surface and a backlight surface that are oppositely arranged. The light-emitting surface is the side from which the light of the display panel 110 exits and is used to display an image; the backlight surface is the opposite surface to the light-emitting surface along the thickness direction of the display panel 110.

[0069] The display panel 110 includes a plurality of pixels, and the pixels are the light-emitting units of the display panel 110. The plurality of pixels may be arranged in an array, and the plurality of pixels may include, but are not limited to, red pixels, green pixels, and blue pixels. In some other examples, the plurality of pixels may further include white pixels.

[0070] It can be understood that the display module 100 may include a display area and a non-display area, and the display area and the non-display area are adjacently arranged. The display area may be used to display an image. For example, the non-display area may surround the outer periphery of the display area. The display area may include a light-emitting area and a non-light-emitting area. The light-emitting area corresponds to the pixels, and the pixels are located in the light-emitting area. For example, the light-emitting area and the pixels may coincide; in addition, a non-light-emitting area is provided between adjacent light-emitting areas, and the non-light-emitting area may be arranged to surround the outer periphery of the light-emitting area.

[0071] As Figure 1 shown, the display module 100 may include a light-filtering layer 120, and the light-filtering layer 120 may be used to reduce the reflection of ambient light, thereby improving the display effect of the display panel 110. For example, the light-filtering layer 120 may be a polarizer. Alternatively, the light-filtering layer 120 includes color resistors and a light-shielding layer. The color resistors are located in the light-emitting area, and the light-shielding layer is located in the non-light-emitting area. The color resistors may be used to filter light in the ambient light that is different from their own colors, and the light-shielding layer may be formed of a material that can block light, can absorb the light irradiated on the light-shielding layer, and the light-shielding layer may have a relatively dark color (for example, black).

[0072] Among them, the light-filtering layer 120 may completely cover the display area of the display panel 110, and a part of the light-filtering layer 120 may extend into the non-display area. Among them, the light-filtering layer 120 may be covered on the light-emitting surface side of the display panel 110.

[0073] As Figure 1 shown, the display module 100 may further include a cover plate 130. The cover plate 130 is located on the side of the light-filtering layer 120 away from the display panel 110. The cover plate 130 is located on the outermost side of the display module 100 and is used to protect the display panel 110 to prevent the display panel 110 from being scratched when the user uses the display module 100. That is, the light-filtering layer 120 is located between the cover plate 130 and the display panel 110.

[0074] Wherein, at least one of the interfaces between the light filtering layer 120 and the cover plate 130 and between the light filtering layer 120 and the display panel 110 may be provided with a connecting film 200. For example, a connecting film 200 may be provided between the light filtering layer 120 and the cover plate 130 for connecting the light filtering layer 120 and the cover plate 130. Alternatively, a connecting film 200 may be provided between the light filtering layer 120 and the display panel 110 for connecting the light filtering layer 120 and the display panel 110. Or, connecting films 200 may be provided between the light filtering layer 120 and the cover plate 130 and between the light filtering layer 120 and the display panel 110 simultaneously, that is, connecting films 200 are provided on both opposite sides of the light filtering layer 120 in the thickness direction to connect the cover plate 130 and the display panel 110 respectively.

[0075] In the embodiments of the present application, the case where the connecting film 200 is provided between the cover plate 130 and the light filtering layer 120 will be described.

[0076] As Figure 1 shown, an ink layer 140 may be provided on the surface of the cover plate 130 facing the display panel 110. The ink layer 140 can be used to prevent light leakage and improve the display effect of the display module 100. Among them, the ink layer 140 may be located at the edge of the display panel 110. For example, the ink layer 140 may be located in the non-display area. The ink layer 140 may be partially or entirely located between the cover plate 130 and the connecting film 200.

[0077] The connecting film 200 provided in the embodiments of the present application will be described below.

[0078] As Figure 2 shown, the connecting film 200 may include a film body 210, and the film body 210 can be used to connect the cover plate 130 and the light filtering layer 120. For example, the film body 210 can be placed between the cover plate 130 and the light filtering layer 120, and the cover plate 130, the film body 210 and the light filtering layer 120 are bonded together. Then, the film body 210 is heated and softened. The softened film body 210 has good fluidity and adhesiveness, so that the softened film body 210 can be fully bonded and adhered to the cover plate 130 and the light filtering layer 120 respectively. When the ink layer 140 is provided on the cover plate 130, the film body 210 can also fill the step difference caused by the ink layer 140, so as to better realize the connection between the cover plate 130 and the light filtering layer 120.

[0079] Exemplarily, the film body 210 may be formed of a heat-active transparent material, and its softening temperature (such as the glass transition temperature) may be greater than the temperature of the reliability test (such as 110 °C) to prevent the film body 210 from being softened by the reliability test temperature, so as to avoid the reliability test affecting the connection of the film body 210 to the cover plate 130 and the light filtering layer 120. For example, the material of the film body 210 may include acrylic polymers. Optionally, the degree of polymerization of the acrylic polymers is n, where 30 ≤ n ≤ 100,000.

[0080] As shown Figure 2 in the figure, the connecting film 200 further includes a conductive layer 220, which is used for electrically connecting with an external circuit. The conductive layer 220 converts the electrical energy of the external circuit into heat for heating the film body 210 to soften the film body 210. When the conductive layer 220 is electrically connected with the external circuit, a current can be generated in the conductive layer 220, and the conductive layer 220 generates heat to soften the film body 210 so that the film body 210 is fully attached and bonded to the cover plate 130 and the light filtering layer 120. Then, the external circuit is disconnected to end the power-on, so that the film body 210 cools and solidifies.

[0081] With this arrangement, compared with heating the entire display module 100 in a high-temperature environment to soften the film body 210, the external high temperature first heats the cover plate 130, the display panel 110, and the light filtering layer 120, and then transfers the heat to the film body 210 to soften the film body 210. The external high-temperature environment has a greater impact on the display panel 110, the light filtering layer 120, and the cover plate 130 (the impact on the display panel 110 is particularly important and may cause damage to the display panel 110 and failure of the display module 100). By providing the conductive layer 220, the conductive layer 220 contacts the film body 210, and the conductive layer 220 can directly transfer heat to the film body 210 without transferring heat through the display panel 110, the light filtering layer 120, and the cover plate 130, resulting in a smaller impact on the display panel 110, the light filtering layer 120, and the cover plate 130. The heat of the conductive layer 220 is mainly used to soften the film body 210, and the heat of the conductive layer 220 is absorbed while the film body 210 is softened, so that less heat is transferred to the display panel 110, the cover plate 130, etc. In addition, the conductive layer 220 heats the film body 210 from the inside of the display module 100, and its heating range is small, so that the impact of the high temperature during the softening connection (i.e., bonding) process on the display module 100 can be reduced.

[0082] The following describes the implementation manner in which the conductive layer 220 provided in the embodiment of the present application contacts the film body 210.

[0083] In the first implementation manner, as Figures 2-4As shown, the conductive layer 220 may be located on the surface of the film body 210. The film body 210 may include a first surface 211 and a second surface 212 that are oppositely arranged along the thickness direction of the connecting film 200. The first surface 211 is located on the side of the film body 210 close to the cover plate 130, and the second surface 212 is located on the side of the film body 210 close to the light filtering layer 120. The film body 210 further includes a side surface 213 connecting the first surface 211 and the second surface 212, and the side surface 213 extends along the thickness direction of the film body 210. The conductive layer 220 may be located on at least one of the first surface 211 and the second surface 212. The areas of the first surface 211 and the second surface 212 are relatively large, and the conductive layer 220 can heat and soften the film body 210 relatively quickly. The softening of the film body 210 by the conductive layer 220 is relatively sufficient and uniform.

[0084] Exemplarily, as Figure 2 shown, the conductive layer 220 may be located on the first surface 211, and the heat of the conductive layer 220 is transferred from the first surface 211 to the second surface 212 to sufficiently soften the film body 210. In this way, the conductive layer 220 is relatively far from the display panel 110, and the influence of the high temperature of the conductive layer 220 on the display panel 110 can be reduced. Or, as Figure 3 shown, the conductive layer 220 may be located on the second surface 212, and the heat of the conductive layer 220 is transferred from the second surface 212 to the first surface 211 to sufficiently soften the film body 210. Or, the conductive layer 220 may be located on both the first surface 211 and the second surface 212 at the same time, and the heat of the conductive layer 220 is transferred from the first surface 211 and the second surface 212 to the middle region along the thickness direction of the conductive layer 220 at the same time to sufficiently soften the film body 210. In this way, the coverage area of the conductive layer 220 is relatively large, and the heat transfer path is relatively short, and the film body 210 can be softened faster.

[0085] Exemplarily, as Figure 4 shown, the conductive layer 220 may be located on the side surface 213, so as to further increase the area covered by the conductive layer 220 and improve the softening speed of the film body 210.

[0086] In the second implementation manner, as Figure 5 shown, the conductive layer 220 may be located in the film body 210. The film body 210 may have a pore channel, and the conductive layer 220 is located in the pore channel and is in contact with the inner wall surface of the pore channel. The film body 210 forms a protection for the conductive layer 220. The heat of the conductive layer 220 is transferred from the middle of the film body 210 (i.e., the inner wall surface of the pore channel) to the first surface 211 and the second surface 212 of the film body 210 at the same time. The paths for the heat to reach the first surface 211 and the second surface 212 are relatively short, and the heat can reach the first surface 211 and the second surface 212 relatively quickly, and the softening of the film body 210 on the opposite sides of the conductive layer 220 along the thickness direction is relatively uniform.

[0087] It can be understood that the conductive layers 220 located on the first surface 211, the second surface 212, and the side surface 213 of the film body 210 can be provided separately or in combination. The conductive layer 220 located in the film body 210 and the conductive layer 220 located on the surface of the film body 210 can be provided separately or in combination.

[0088] Exemplarily, the conductive layer 220 can be a transparent conductive layer, that is, the conductive layer 220 is formed of a transparent material to avoid affecting the display of the display panel 110. For example, the material of the conductive layer 220 can include poly(3,4-ethylenedioxythiophene) / polystyrene sulfonate (PEDOT / PSS). PEDOT / PSS can form an aqueous solution of a polymer, so as to form a conductive member by inkjet printing, and its process is relatively simple.

[0089] Exemplarily, as Figure 6 and Figure 7 shown, the conductive layer 220 can be grid-shaped. The grid-shaped conductive layer 220 has a good light transmittance. In addition, the grid-shaped conductive layer 220 can be evenly distributed at various positions of the film body 210. For example, the conductive layer 220 can be distributed in at least part of the light-emitting area, the non-light-emitting area, and the non-display area. The grid-shaped conductive layer 220 includes a plurality of grids, and the shape of the grids can be a polygon (for example, a triangle, a quadrilateral, a pentagon, etc.).

[0090] It can be understood that the conductive layer 220 can also be other shapes than grid-shaped, as long as it can soften the film body 210 during conduction. For example, the conductive layer 220 can be a sheet structure, so that the structure of the conductive layer 220 is relatively simple. Or, the conductive layer 220 can include a plurality of spaced conductive wires. The plurality of conductive wires can be arranged in parallel, or there is a certain angle between the plurality of conductive wires but they do not intersect; in addition, the plurality of conductive wires can be connected by a conductive connection structure, so as to facilitate the simultaneous conduction of the plurality of conductive wires.

[0091] As Figure 6 shown, the grid-shaped conductive layer 220 can include a plurality of first conductive wires 223 and a plurality of second conductive wires 224. The plurality of first conductive wires 223 are spaced apart and extend along the first direction Y. The plurality of second conductive wires 224 are spaced apart and extend along the second direction X. The first conductive wires 223 and the second conductive wires 224 intersect with each other to form a grid-shaped conductive layer 220.

[0092] Among them, the first direction Y and the second direction X are different. For example, the first direction Y can be the length direction of the film body 210, and the second direction X can be the width direction of the film body 210. The film body 210 further includes a third direction Z, and the third direction can be the thickness direction of the film body 210. Herein, the length, width, and thickness in the embodiments of the present application are only for convenience of description and do not imply any limitation on the size. For example, the length can be greater than, less than, or equal to the width.

[0093] Specifically, the distance between any two adjacent first conductive wires 223 can be less than or equal to 3 μm. For example, the distance between any two adjacent first conductive wires 223 can be 1 μm, 2 μm, 3 μm, or any distance less than 3 μm. Thereby, a plurality of grids can be evenly distributed in the light-emitting area corresponding to a single pixel, avoiding affecting the display uniformity of the display panel 110. In addition, since the distance between any two adjacent first conductive wires 223 is small, the film body 210 can be fully and evenly heated to ensure that the film body 210 can be fully adhered and bonded to the cover plate 130 and the light filter layer 120, and the step difference caused by the ink layer 140 and the conductive layer 220 can be eliminated. The distance between any two adjacent second conductive wires 224 is less than or equal to 3 μm. For example, the distance between any two adjacent second conductive wires 224 can be 1 μm, 2 μm, 3 μm, or any distance less than 3 μm, and the principle is similar to that of the first conductive wire 223 and will not be elaborated herein.

[0094] It can be understood that when the connection film 200 is located between the display panel 110 and the light filter layer 120, the conductive layer 220 can also be formed of a metal material, and the light filter layer 120 can prevent the conductive layer 220 formed of the metal material from reflecting ambient light. At this time, the conductive layer 220 can be distributed in the non-light-emitting area and the non-display area, thereby avoiding the influence of the conductive layer 220 on the aperture ratio of the display panel 110.

[0095] Exemplarily, the thickness of the conductive layer 220 is greater than or equal to 1 μm. For example, the thickness of the conductive layer 220 can be 1 μm, 1.5 μm, 2 μm, or any thickness greater than 1 μm. Thereby, good conductivity of the conductive layer 220 can be ensured.

[0096] For example, the conductive layer 220 can be grounded, thereby dissipating static electricity generated by the display module 100 during use, improving the anti-static capability of the display module 100, and preventing the impact of static electricity on the display module 100. Specifically, the conductive layer 220 can be directly grounded or indirectly grounded. For example, a conductor structure (not shown in the figure) can be provided on part or all of at least one side surface of the display module 100 perpendicular to the display surface. The conductive layer 220 is grounded through the conductor structure. The conductor structure can better disperse the static electricity generated in the display module 100 and prevent the impact of static electricity on the display module 100.

[0097] In this embodiment, the number of the film body 210 in the connecting film 200 may be at least one layer. When the number of the film body 210 is one layer, the structure of the connecting film 200 is relatively simple.

[0098] like Figures 8-10 As shown, the film body 210 can be multi-layered, and the multi-layered film body 210 is stacked along the thickness direction of the connecting film 200. For example, the number of film layers can be 2 layers, 3 layers, 4 layers, or more than 4 layers. One layer of film body 210 contacts one conductive layer 220, and the arrangement of the conductive layers 220 corresponding to each film body 210 can be the same (e.g., Figure 8 ), or different (as shown in Figure 9 and Figure 10 shown).

[0099] like Figure 11 As shown, a support layer 240 may be provided between at least two adjacent film bodies 210. The support layer 240 may provide good support for the film bodies 210 and the conductive layer 220. The support layer 240 may be formed of a highly light-transmitting material to reduce the impact of the support layer 240 on the display effect of the display panel 110. For example, the material of the support layer 240 may include cycloolefin polymer (such as COP, COC, etc.).

[0100] For example, the softening temperature of the support layer 240 may be greater than the softening temperature of the film body 210 , thereby preventing the softening of the film body 210 from affecting the support layer 240 .

[0101] For example, the modulus of the support layer 240 can be greater than the modulus of the membrane body 210. The modulus is a measure of how easily a material deforms; a higher modulus indicates a greater stress required to cause a certain amount of deformation, i.e., a greater material stiffness. A higher modulus of the support layer 240 allows the connecting membrane 200 to be more quickly transferred to all parts of the connecting membrane 200 when subjected to external forces, thereby evenly distributing stress and preventing damage caused by excessive stress concentration.

[0102] For example, the thermal expansion coefficient of the support layer 240 may be smaller than that of the film 210 , so that the support layer 240 deforms less when heated and does not experience significant stretching as the ambient temperature rises, thereby preventing the stretching from generating significant stress on the display module 100 and affecting the display module 100 .

[0103] It is understood that when there are multiple layers of membranes 210, a support layer 240 may be provided between any two adjacent membrane layers 210. Alternatively, a support layer 240 may be provided between only some adjacent membrane layers 210, while no support layer 240 may be provided between other adjacent membrane layers 210.

[0104] The embodiment of the present application is described by taking two adjacent film layers 210 as an example.

[0105] like Figure 12 and Figure 13 As shown, two adjacent film bodies 210 may include a first film body 214 and a second film body 215. The first film body 214 is located on a side of the connecting film 200 close to the cover plate 130. A support layer 240 is provided between the first film body 214 and the second film body 215. The conductive layer 220 contacted by the first film body 214 may be a first conductive layer 221, and the conductive layer 220 contacted by the second film body 215 may be a second conductive layer 222.

[0106] Some examples, such as Figure 12 As shown, the first conductive layer 221 can be located on the side of the first film 214 facing the support layer 240, so that the first conductive layer 221 can be directly formed on the surface of the support layer 240 facing the cover plate 130 to provide better support for the first conductive layer 221, and then the first film 214 is formed on the side of the first conductive layer 221 facing away from the support layer 240. The second conductive layer 222 can be located on the side of the second film 215 facing the support layer 240, so that the second conductive layer 222 can be directly formed on the surface of the support layer 240 facing the display panel 110 to provide better support for the second conductive layer 222, and then the second film 215 is formed on the side of the second conductive layer 222 facing away from the support layer 240. In this way, the first conductive layer 221 is far away from the cover plate 130, and the second conductive layer 222 is far away from the filter layer 120. The first conductive layer 221 and the second conductive layer 222 are both close to the support layer 240, but far away from the cover plate 130 and the display panel 110, etc., which can reduce the impact of the high temperature of the conductive layer 220 on the cover plate 130 and the display panel 110, etc.

[0107] In other examples, such as Figure 13As shown, the first conductive layer 221 can be located on the side of the first film body 214 away from the support layer 240. The first conductive layer 221 can be directly prepared on the surface of the cover plate 130 facing the connection film 200, so that the part of the first film body 214 close to the cover plate 130 can be softened faster, and the connection between the first film body 214 and the cover plate 130 can be realized faster, avoiding the phenomenon that the connection effect between the first film body 214 and the cover plate 130 is poor due to insufficient softening. The second conductive layer 222 can be located on the side of the second film body 215 away from the support layer 240. The second conductive layer 222 can be directly prepared on the surface of the light filtering layer 120 facing the connection film 200, so that the part of the second film body 215 close to the light filtering layer 120 can be softened faster, and the connection between the second film body 215 and the light filtering layer 120 can be realized faster, avoiding the phenomenon that the connection effect between the second film body 215 and the light filtering layer 120 is poor due to insufficient softening.

[0108] In some other examples, the contact manner between the first conductive layer 221 and the first film body 214, and the contact manner between the second conductive layer 222 and the second film body 215 have been described in the above embodiments and will not be elaborated here.

[0109] In some embodiments, as Figure 7 shown, a connection portion 230 can be provided on the outer periphery of the conductive layer 220. The connection portion 230 is used to electrically connect the conductive layer 220 to an external circuit, so that the external circuit can supply power to heat the conductive layer 220, thereby softening the film body 210.

[0110] Among them, at least part of the connection portion 230 is exposed outside the connection film 200 to achieve connection with the external circuit. In some examples, the exposed connection portion 230 can cover the side surface 213 of the connection film 200. In some other examples, the exposed connection portion 230 can be provided at the edge of the support layer 240. At this time, the size of the support layer 240 can be larger than the size of the film body 210. The orthographic projection of the film body 210 on the plane where the support layer 240 is located is located within the support layer 240, and there is a gap between the film body 210 and the edge of the support layer 240. The exposed connection portion 230 can be provided on the support layer 240 corresponding to this gap. In this way, the film body 210 can be prevented from blocking the exposed connection portion 230, avoiding affecting the connection between the connection portion 230 and the external circuit. In some other examples, the exposed connection portion 230 can also be provided at the edges of the cover plate 130, the light filtering layer 120, etc. The principle is similar to that of being provided at the edge of the support layer 240 and will not be elaborated here.

[0111] It is possible that the connecting portion 230 may be partially or entirely located outside the connecting film 200, or the connecting portion 230 may partially extend into the connecting film 200. The material of the connecting portion 230 may be the same as or different from the material of the conductive layer 220. The connecting portion 230 may be in a grid shape or other shapes. The connecting portion 230 and the conductive layer 220 may be an integral structure, so that the connecting portion 230 and the conductive layer 220 can be prepared simultaneously. Or, the connecting portion 230 and the conductive layer 220 may also be prepared independently.

[0112] As Figure 7 shown, the connecting portion 230 may surround the outer periphery of the conductive layer 220 for one week, so that there are more connection points between the connecting portion 230 and the external circuit, and the connection is more convenient. In specific implementation, the external circuit is electrically connected to the connecting portion 230, and a current is generated on the conductive layer 220 through the connecting portion 230 to heat and soften the film body 210, so as to achieve sufficient adhesion and bonding between the film body 210, the cover plate 130 and the light filtering layer 120.

[0113] It should be noted here that the numerical values and numerical value ranges involved in the embodiments of the present application are approximate values. Affected by the manufacturing process, there may be a certain range of errors, and those skilled in the art can consider this part of the errors to be negligible.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A connecting film, characterized in that, Comprising: A film body and a conductive layer, the film body being in contact with the conductive layer, the conductive layer being used for electrical connection with an external circuit to soften the film body; The film body is multi-layered, and the multi-layer film bodies are stacked along the thickness direction of the connecting film; A support layer is provided between at least two adjacent film bodies.

2. The connecting film according to claim 1, characterized in that, The conductive layer is located on the surface of the film body; The film body includes a first surface and a second surface that are oppositely arranged along the thickness direction of the connecting film, and the conductive layer is located on at least one of the first surface and the second surface; Alternatively, the film body includes a side surface connecting the first surface and the second surface, and the conductive layer is located on the side surface.

3. The connecting film according to claim 1, characterized in that, The film body has channels, the conductive layer is located in the channels and is in contact with the inner wall surface of the channels.

4. The connecting film according to any one of claims 1-3, characterized in that, A connecting portion is provided on the outer periphery of the conductive layer, and the connecting portion is used for electrical connection to the external circuit; And / or, the connecting portion and the conductive layer are of an integral structure.

5. The connecting film according to claim 4, characterized in that, The conductive layer includes a plurality of first conductive wires and a plurality of second conductive wires. The plurality of first conductive wires are arranged at intervals and extend in a first direction, the plurality of second conductive wires are arranged at intervals and extend in a second direction, and the first conductive wires and the second conductive wires intersect each other.

6. The connecting film according to claim 5, characterized in that The distance between any two adjacent first conductive wires and / or any two adjacent second conductive wires is less than or equal to 3 μm; And / or, the conductive layer is a transparent conductive layer; And / or, the thickness of the conductive layer is greater than or equal to 1 μm; And / or, the conductive layer is grounded.

7. The connecting film according to claim 1, wherein The softening temperature of the support layer is higher than that of the film body; and / or, the modulus of the support layer is greater than that of the film body; and / or, the thermal expansion coefficient of the support layer is less than that of the film body.

8. A display module, characterized in that, Comprising the connecting film according to any one of claims 1-7 above.

9. The display module according to claim 8, wherein The display module includes a display panel, a light filtering layer, and a cover plate that are sequentially stacked, and the connecting film is located on the side of the light filtering layer close to the display panel; And / or, the connecting film is located on the side of the light filtering layer close to the cover plate; And / or, the display module further includes an ink layer, and the ink layer is located between the connecting film and the cover plate; And / or, the light filtering layer includes a polarizer.

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