Power supply unit

Abstract

The present invention provides a power supply device, comprising a housing, a power board, an output terminal and a DCDC conversion module. A accommodating space is provided in the housing, and a notch on the rear panel of the housing is connected to the accommodating space. The power board is parallel to the lower panel of the housing and is at least partially accommodated in the accommodating space, comprising two through-holes, side edges and two surfaces arranged oppositely, wherein the two through-holes pass through the power board, and the side edges are adjacent to the rear panel. The output terminal is parallel to the lower panel of the housing and passes through the rear panel through the notch. The DCDC conversion module is accommodated in the accommodating space and comprises a primary circuit, a transformer and a secondary circuit, the transformer and the secondary circuit are sequentially arranged on the power board, the secondary circuit is arranged on the side where the side edge of the power board is located and is electrically connected to the output terminal, the transformer comprises a winding, two magnetic columns and two magnetic cover plates, at least part of the winding is formed by copper plating in the power board, the two magnetic columns pass through the two through-holes of the power board, the two magnetic cover plates are respectively arranged on the two surfaces of the power board and are connected by the magnetic columns.

Description

Technical Field

[0001] The present invention relates to the field of power electronics technology, and in particular to a communication and server power supply device for optimizing the configuration of a planar transformer, while increasing the transformer power level and reducing line loss. Background Art

[0002] Modern power electronics, as an essential component of power conversion, are widely used in the power, electronics, motor, and energy industries. With the development of power electronics technology, higher requirements are being placed on the power level, power density, and modularity of high-power switching power supplies.

[0003] Traditional high-density power supplies often use planar transformers instead of wound transformers to increase power density. However, the PCB (Printed Circuit Board) containing these planar transformers is inserted vertically onto the power supply motherboard. Consequently, the busbar capacitors included in traditional communications and server power supplies require an additional PCB to connect electrically to the PCB containing the planar transformer on the motherboard.

[0004] In other words, in traditional communication and server power supply devices, the bus capacitor and the planar transformer PCB need to be connected through three connection interfaces (connection interface) (the bus capacitor is connected to the capacitor PCB, the capacitor PCB is connected to the power supply motherboard, and the power supply motherboard is connected to the planar transformer PCB). Furthermore, since the output current of the power supply device is all transmitted to the load through the power output interface, line loss is easily generated at the connection interface. Currently, the gold finger formed by copper plating on the PCB is a widely used output interface solution. In order to match the height of the external terminal, the PCB where the gold finger is located is not in the same plane as the power supply motherboard, so the gold finger and the power supply motherboard need to be electrically connected through a metal conductor, and thus the planar transformer PCB and the gold finger output interface need to be connected through two connection interfaces (the planar transformer PCB is connected to the power supply motherboard, and the power supply motherboard is connected to the gold finger output interface). Under high current conditions, the aforementioned complex connection method will lead to a larger line resistance, thereby generating higher losses.

[0005] On the other hand, in traditional communications and server power supplies, the planar transformer PCB is vertically inserted into the power supply motherboard. The length of the planar transformer is easily limited by the height of the power supply housing, making it impossible to increase power by increasing the core size, thus hindering the improvement of power density.

[0006] Therefore, how to develop a power supply device to optimize the configuration of the planar transformer while increasing the transformer power level and reducing line loss is a very important issue to be addressed in this field. Summary of the Invention

[0007] The present invention provides a communications and server power supply device that optimizes the configuration of a planar transformer, while simultaneously increasing the transformer's power rating and reducing line losses. When the DC-DC converter module is directly mounted on a power board, the output terminals are formed directly, for example, by copper plating on the side edge of the power board. Alternatively, the output terminals are fixedly connected to the side edge of the power board via a metal conductor sheet and can be directly connected to external terminals through the housing. Furthermore, by directly integrating the planar transformer into the power board, the interface between the transformer circuit board and the output terminals can be eliminated. Furthermore, when the transformer and secondary circuit of the DC-DC converter module are sequentially mounted on the power board, the bus capacitors of the primary circuit can be directly inserted into the power board via a bus capacitor circuit board, reducing the number of electrical connections to the transformer. Furthermore, the bus capacitor bodies can be stacked, for example, along a first direction on the first magnetic cover of the planar transformer. Other adjacent control boards and auxiliary power supply units can be directly inserted into and electrically connected to the power board, further improving power density.

[0008] Another object of the present invention is to provide a power supply device. By arranging the DC-DC converter module and output terminals in a planar manner on a power board, the current flow path is shortened and the number of interfaces between components is reduced. This further relaxes the housing height restriction on the size of the transformer in the DC-DC converter module, thereby increasing the transformer's power rating. When the DC-DC converter module is directly mounted on the power board, the planarization of the transformer facilitates the expansion of the horizontal dimension of the magnetic cover along the power board's extension, thereby increasing power density. When the magnetic cover is expanded, it can be combined with other magnetic covers, such as those for a resonant inductor, to form an integrated structure, simplifying the manufacturing and assembly process and reducing costs while simultaneously achieving the goals of reducing line losses and the number of interfaces. Furthermore, when the DC-DC converter module is directly mounted on the power board, the output terminals of the power supply device extend through the rear panel of the housing. Combined with a fan adjacent to the front panel of the housing, they can form an air duct between the two opposing panels, effectively dissipating heat generated by the transformer, power devices, and other heat-generating components in the DC-DC converter module. Furthermore, compared to the power supply device output terminal extending through the rear panel, the power board can extend toward the front panel or be combined with an input board to integrate the voltage conversion module, EMI module or input terminal components within the housing space, effectively improving the power density and enhancing the competitiveness of the product.

[0009] To achieve the aforementioned objectives, the present invention provides a power supply device comprising a housing, a power board, output terminals, and a DC-DC converter module. A housing is provided within the housing, comprising a rear panel and a lower panel. The rear panel has a first notch, the first notch communicating with the housing. The power board is parallel to the lower panel and at least partially accommodated within the housing. The power board comprises at least two first perforations, a side edge, and first and second opposing surfaces. At least two of the first perforations extend through the first and second surfaces of the power board, and the side edge is disposed adjacent to the rear panel. The output terminal is parallel to the lower panel and extends through the rear panel via the first notch. The DCDC conversion module is accommodated in the accommodating space and includes a primary circuit, a transformer and a secondary circuit, wherein the transformer and the secondary circuit are sequentially arranged on the power board, and the secondary circuit is arranged on the side where the side edge of the power board is located and electrically connected to the output terminal. The transformer includes a transformer winding, at least two first magnetic columns, a first magnetic cover and a second magnetic cover. At least part of the transformer winding is formed by copper plating in the power board. At least two first magnetic columns pass through at least two first through-holes of the power board. The first magnetic cover and the second magnetic cover are respectively arranged relative to the first surface and the second surface of the power board and are connected by at least one first magnetic column. The primary circuit includes a bus capacitor. The capacitor body of the bus capacitor extends along a first direction and is arranged on the first magnetic cover of the transformer. The first direction is perpendicular to the rear panel.

[0010] In one embodiment, the primary circuit further includes at least one primary power device, wherein the primary circuit, the transformer and the secondary circuit are sequentially arranged along a first direction on a first surface of a power board of at least one primary power device.

[0011] In one embodiment, the bus capacitor also includes a bus capacitor circuit board, which is inserted into the first surface of the power board, arranged adjacent to at least one primary power device and electrically connected to at least one primary power device by copper plating in the power board, and one end of the capacitor body is connected to the bus capacitor circuit board.

[0012] In one embodiment, the output terminal and the DCDC conversion module are electrically connected by copper plating in the power board.

[0013] In one embodiment, the output terminal is a gold finger, which is formed by copper plating on the side edge of the power board, and the gold finger is assembled and connected to the external terminal.

[0014] In one embodiment, the output terminal is a metal conductor sheet. The side edge of the power board is accommodated in the accommodation space. The side of the metal conductor sheet is fixedly connected to the side edge of the power board. The metal conductor sheet is assembled and connected to the external terminal.

[0015] In one embodiment, a surface of the second magnetic cover is adhered and fixed to the second surface of the power board.

[0016] In one embodiment, the secondary circuit includes at least one secondary power device and an output capacitor. The at least one secondary power device and the output capacitor are disposed on a power board and are electrically connected by copper plating in the power board.

[0017] In one embodiment, the DCDC conversion module further includes an LLC resonant circuit. The LLC resonant circuit has a resonant inductor and a resonant capacitor. The resonant capacitor is disposed on the power board. The resonant inductor and the resonant capacitor are disposed between the transformer and the primary circuit.

[0018] In one embodiment, the resonant inductor includes an inductor winding, at least one second magnetic column, a third magnetic cover, and a fourth magnetic cover. The power board includes at least one second through-hole, and the at least one second through-hole passes through the first and second surfaces of the power board and is located between at least two first through-holes and the side edge. At least a portion of the inductor winding is formed by copper plating in the power board. The at least one second magnetic column passes through the at least one second through-hole of the power board. The third magnetic cover and the fourth magnetic cover are respectively arranged relative to the first and second surfaces of the power board and are connected through at least one second magnetic column.

[0019] In one embodiment, the power supply device also includes an additional circuit board, which is arranged between the power board and the first magnetic cover plate and the third magnetic cover plate, or between the power board and the second magnetic cover plate and the fourth magnetic cover plate, wherein the additional circuit board includes at least two third through-holes and at least one fourth through-hole, at least two third through-holes and at least one fourth through-hole pass through the additional circuit board, at least two first magnetic columns correspondingly pass through the at least two third through-holes of the additional circuit board, at least one second magnetic column correspondingly passes through the at least one fourth through-hole of the additional circuit board, and part of the transformer winding and part of the inductor winding are formed by copper plating in the additional circuit board.

[0020] In one embodiment, the third magnetic cover plate is integrated with the first magnetic cover plate into an integrated structure, and / or the fourth magnetic cover plate is integrated with the second magnetic cover plate into an integrated structure, and / or a surface of the fourth magnetic cover plate is adhered and fixed to the second surface of the power board.

[0021] In one embodiment, the power supply device further includes an auxiliary power supply unit, which is inserted into the first surface of the power board along the second direction, electrically connected to the DCDC conversion module, and located on one side of the transformer; and / or, the power supply device further includes a control board, which is inserted into the first surface of the power board along the second direction, electrically connected to the power board, and located on one side of the transformer, wherein the second direction is perpendicular to the power board.

[0022] In one embodiment, the housing further includes a front panel, which is disposed opposite to the rear panel and has a second notch, and the second notch is connected to the accommodating space.

[0023] In one embodiment, the power supply device further includes a fan accommodated in the accommodation space and disposed adjacent to the front panel. The fan is controlled to form an air duct, which extends from the second slot through the DCDC conversion module to the first slot.

[0024] In one embodiment, the power supply device further includes a voltage conversion module housed in the accommodation space, located between the DCDC conversion module and the front panel, and arranged adjacent to the fan, spatially opposite to the air duct, wherein the voltage conversion module is a PFC module or a Boost module.

[0025] In one embodiment, the voltage conversion module is directly inserted into the first surface of the power board and electrically connected to the power board, or the voltage conversion module is inserted into an input board and electrically connected to the power board through the input board.

[0026] In one embodiment, the power supply device further includes an EMI module accommodated in the accommodation space and located between the DCDC conversion module and the front panel.

[0027] In one embodiment, the EMI module is directly inserted into the first surface of the power board and electrically connected to the power board, or the EMI module is disposed on an input board and electrically connected to the power board through the input board.

[0028] In one embodiment, the power supply device further includes an input end component penetrating the front panel through the second slot, wherein the input end component is directly electrically connected to the power board or electrically connected to the power board through an input board.

[0029] In one embodiment, the shell further includes an upper panel, a left panel and a right panel, wherein the front panel and the rear panel are arranged relative to each other along a first direction, the upper panel and the lower panel are arranged relative to each other along a second direction, and the left panel and the right panel are arranged relative to each other along a third direction. The front panel, the rear panel, the upper panel, the lower panel, the left panel and the right panel form a accommodating space, and the first direction, the second direction and the third direction are perpendicular to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 The main structural diagram of the power supply device of the first embodiment of this case is schematically shown.

[0031] Figure 2 The schematic diagram shows an exploded view of the structure of the power supply device according to the first embodiment of the present invention.

[0032] Figure 3 The three-dimensional structure diagram schematically shows the internal components of the power supply device of the first embodiment of the present invention.

[0033] Figure 4 for Figure 3 Top view of .

[0034] Figure 5 A first exemplary equivalent circuit diagram of the power supply device of the present invention is schematically shown.

[0035] Figure 6 The figure schematically shows an exploded view of the internal components of the power supply device according to the first embodiment of the present invention.

[0036] Figure 7 The figure schematically shows a three-dimensional structural diagram of the internal components of the power supply device according to the second embodiment of the present invention.

[0037] Figure 8 for Figure 7 Top view of .

[0038] Figure 9 The figure schematically shows an exploded view of the internal components of the power supply device according to the second embodiment of the present invention.

[0039] Figure 10 The three-dimensional structure diagram schematically shows the internal components of the power supply device of the third embodiment of the present case.

[0040] Figure 11 for Figure 10 Top view of .

[0041] Figure 12 The figure schematically shows an exploded view of the internal components of the power supply device according to the third embodiment of the present invention.

[0042] Figure 13 A second exemplary equivalent circuit diagram of the power supply device of the present invention is schematically shown.

[0043] Figure 14 A third exemplary equivalent circuit diagram of the power supply device of this embodiment is schematically shown.

[0044] Figure 15 A fourth exemplary equivalent circuit diagram of the power supply device of the present invention is schematically shown.

[0045] Figure 16 The figure schematically shows a three-dimensional structural diagram of the internal components of the power supply device according to the fourth embodiment of the present invention.

[0046] Figure 17 The figure schematically shows an exploded view of the internal components of the power supply device according to the fourth embodiment of the present invention.

[0047] Component Symbol:

[0048] 1, 1a, 1b, 1c: Power supply unit

[0049] 10: Shell

[0050] 10a: Upper cover

[0051] 10b: Lower cover

[0052] 11: Rear panel

[0053] 11a: Upper panel

[0054] 11b: Left panel

[0055] 12: Front panel

[0056] 12a: Right panel

[0057] 12b: Lower panel

[0058] 13: First notch

[0059] 14: Second notch

[0060] 15: Accommodation space

[0061] 20, 20a: Power board

[0062] 21: Side 1

[0063] 22: Side 2

[0064] 23: posterior margin

[0065] 24: Anterior edge

[0066] 25: First piercing

[0067] 26: Second piercing

[0068] 27: Additional circuit board

[0069] 271: Third Perforation

[0070] 272: Fourth Perforation

[0071] 30: Output terminal

[0072] 40, 40a: DCDC conversion module

[0073] 41: Primary circuit

[0074] 411, S1, S2, S3, S4: primary power devices

[0075] 412. CBUS: busbar capacitance

[0076] 413: Ontology

[0077] 414: Busbar capacitor circuit board

[0078] 42, 42a: Transformer

[0079] 421: Transformer winding

[0080] 422: First magnetic column

[0081] 423, 423a: First magnetic cover

[0082] 424, 424a: Second magnetic cover

[0083] 43: Secondary circuit

[0084] 431, S5, S6, S7, S8: Secondary side power devices

[0085] 432. COUT: output capacitor

[0086] 44, 44a, Lr / Lm: Resonant inductance

[0087] 441: Inductor winding

[0088] 442: Second magnetic column

[0089] 443: Third magnetic cover

[0090] 444: Fourth magnetic cover

[0091] 45. Cr: resonant capacitor

[0092] 46: Control Panel

[0093] 47: Auxiliary power supply unit

[0094] 50: Fan

[0095] 60: Input Board

[0096] 61: Voltage conversion module

[0097] 62: EMI module

[0098] 63: Input components

[0099] 9: External terminal

[0100] X, Y, Z: Axis DETAILED DESCRIPTION

[0101] Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various variations in various ways without departing from the scope of the present invention, and that the description and drawings herein are intended to be illustrative, not limiting, in nature. For example, if the following description of a first feature being positioned above or on top of a second feature includes embodiments in which the first feature and the second feature are in direct contact, it also includes embodiments in which an additional feature may be positioned between the first and second features, such that the first and second features are not in direct contact. Furthermore, reference symbols and / or designations may be repeated across different embodiments in the present disclosure. This repetition is for simplicity and clarity and is not intended to limit the relationship between the various embodiments and / or the described structures. Furthermore, to facilitate description of the relationship between one component or feature and another component or features in the drawings, spatially related terms such as "below," "above," "in front of," "behind," and similar terms may be used. In addition to the orientations depicted in the drawings, spatially relative terms are used to encompass different orientations of the device during use or operation. The device may also be positioned differently (e.g., rotated 90 degrees or in other orientations), and the description of the spatially relative terms used should be interpreted accordingly. In addition, when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, the numerical values ​​are stated as precisely as possible in the specific examples. In addition, it is understood that although the terms "first," "second," and "third" may be used in the claims to describe different components, these components should not be limited by these terms. In the embodiments, these components are represented by different component symbols. These terms are intended to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items. Except in the operating / working examples, or unless explicitly stated, all numerical ranges, amounts, values ​​and percentages disclosed herein (such as those percentages of angles, time durations, temperatures, operating conditions, amount ratios and the like) should be understood as being modified by the term "about" or "substantially" in all embodiments. Accordingly, unless otherwise indicated, the numerical parameters stated in this disclosure and the accompanying claims are approximate values ​​that may vary as needed. For example, each numerical parameter should be interpreted at least in terms of the number of significant figures described and by applying ordinary rounding principles. Ranges can be expressed herein as from one endpoint to the other or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

[0102] Figure 1 The main structural diagram of the power supply device of the first embodiment of this case is schematically shown. Figure 2 The schematic diagram shows an exploded view of the structure of the power supply device according to the first embodiment of the present invention. Figure 3 The three-dimensional structure diagram schematically shows the internal components of the power supply device of the first embodiment of the present invention. Figure 4 for Figure 3 Top view of . Figure 5 A first exemplary equivalent circuit diagram of the power supply device of the present invention is schematically shown. Figure 6A schematic diagram illustrates an exploded view of the internal components of a power supply device according to a first embodiment of the present invention. This invention provides a communications and server power supply device (hereinafter referred to as the power supply device) 1, which utilizes a planar layout to reduce line losses and the number of interfaces between components. In this embodiment, the power supply device 1 includes a housing 10, a power board 20, output terminals 30, and a DC-DC converter module 40. The housing 10 may, for example, be composed of an upper cover 10a and a lower cover 10b, but the present invention is not limited to the combination or shape of the housing 10. In other embodiments, the housing 10 may be composed of a box and a cover, but the present invention is not limited to this. In this embodiment, the housing 10 is, for example, a rectangular housing extending along the X-axis and includes a rear panel 11 and a front panel 12 facing each other, with the front panel 12 oriented toward the rear panel 11 to form a first direction, i.e., the X-axis. In this embodiment, the housing 10 also includes, for example, an upper panel 11a and a lower panel 12b disposed opposite each other along a second direction (i.e., the Z-axis), and a left panel 11b and a right panel 12a disposed opposite each other along a third direction (i.e., the Y-axis). The housing 10 defines a receiving space 15 between the front panel 12, rear panel 11, upper panel 11a, lower panel 12b, left panel 11b, and right panel 12a. In other embodiments, the combination of the front panel 12, rear panel 11, upper panel 11a, lower panel 12b, left panel 11b, and right panel 12a can be adjusted based on actual application requirements, and the present invention is not limited thereto. In this embodiment, the rear panel 11 has a first notch 13, and the front panel 12 has a second notch 14, both of which connect to the receiving space 15. It should be noted that the number and type of the first notch 13 and the second notch 14 can be adjusted based on actual application requirements, and the present invention is not limited thereto. In this embodiment, the power board 20 is, for example, a rectangular plate body. The power board 20 is parallel to the lower panel 12b and is at least partially accommodated in the accommodating space 15, extending along the first direction (X-axis direction), and includes a first surface 21, a second surface 22, a rear side edge 23, a front side edge 24, and at least two first through-holes 25. It can be understood that the "parallel to" in this case is not limited to a strict parallel relationship between the two. In normal manufacturing processes, a certain tolerance is allowed, and in this case, the two are also defined as a "parallel" relationship. The first surface 21 and the second surface 22 are arranged opposite to each other. The front side edge 24 and the rear side edge 23 are opposite to each other in the first direction (X-axis direction), wherein the front side edge 24 and the rear side edge 23 are two side surfaces of the power board 20 formed by the first surface 21 and the second surface 22, wherein the rear side edge 23 is arranged adjacent to the rear panel 11 of the shell 10. At least two first through-holes 25 pass through the first surface 11 and the second surface 12 of the power board 20. The output terminal 30 is, for example, a gold finger or a metal conductor sheet, parallel to the lower panel 12 b and passing through the rear panel 11 of the housing 10 through the first notch 13 .In this embodiment, the DC-DC converter module 40 is housed in the housing space 15 and includes a primary circuit 41, a transformer 42, and a secondary circuit 43. The transformer 42 and secondary circuit 43 are sequentially disposed on the power board 20. The secondary circuit 43 is disposed on the rear edge 23 of the power board 20 and is electrically connected to the output terminal 30. In some embodiments, the primary circuit 41, transformer 42, and secondary circuit 43 in the DC-DC converter module 40 may be sequentially arranged along a first direction (X-axis), perpendicular to the rear panel 11 of the housing 10. Specifically, the transformer 42 is disposed between the primary circuit 41 and the secondary circuit 43. In other words, the primary circuit 41, transformer 42, secondary circuit 43, and output terminal 30 of the DC-DC converter module 40 are sequentially disposed along the first direction (X-axis) on the power board 20 and are electrically connected via, for example, a copper trace. Of course, the present invention is not limited to electrically connecting the primary circuit 41, transformer 42, secondary circuit 43, and output terminal 30 via copper plating within the power board 20. It is understood that in some embodiments, the primary circuit 41 may be disposed on another PCB and inserted into the power board 20, and the present invention is not limited thereto. In this embodiment, the transformer 42 includes a transformer winding 421, at least two first magnetic pillars 422, a first magnetic cover 423, and a second magnetic cover 424. At least a portion of the transformer winding 421 is formed by copper plating within the power board 20. In some embodiments, a portion of the transformer winding 421 may also be formed by winding copper wire around the first magnetic pillars 422 on the outside of the power board 20. In this embodiment, the transformer winding 421 is disposed, for example, around at least one first through-hole 25. The at least two first magnetic pillars 422 extend through the at least two first through-holes 25 of the power board 20. The cross-section of the first magnetic pillars 422 may, for example, be oval-shaped. The first magnetic cover 423 and the second magnetic cover 424 are, for example, disposed relative to the first surface 21 and the second surface 22 of the power board 20, respectively, and are connected by at least two first magnetic pillars 422. Specifically, the first magnetic cover 423 is disposed on the side of the power board 20 where the first surface 21 is located, and the second magnetic cover 424 is disposed on the side of the power board 20 where the second surface 22 is located. In some implementations, one surface of the second magnetic cover 424 can be adhered and fixed to the second surface 22 of the power board 20, so that the at least two first magnetic pillars 422, the first magnetic cover 423, and the second magnetic cover 424 are fixed relative to the power board 20 and, together with the transformer winding 421, form a planar transformer 42 disposed on the power board 20. In some embodiments, the transformer 42 further includes at least one side pillar, which, together with the first magnetic pillar 422, the first magnetic cover 423, and the second magnetic cover 424, can form a magnetic circuit for the transformer 42.

[0103] In this embodiment, the primary circuit 41 includes at least one primary power device 411 and a bus capacitor 412, wherein the bus capacitor 412 and at least one primary power device 411 can be arranged on the first surface 21 of the power board 20, and are electrically connected to each other by plating copper in the power board 20. It should be noted that this case is not limited to the number and connection method of the primary power devices 411. In some embodiments, some of the primary power devices 411 can also be arranged on the second surface 22 of the power board 20. Figure 5 The first exemplary equivalent circuit diagram of the power supply device 1 is shown. In this embodiment, the primary circuit 41 includes, for example, four primary power devices 411 (refer to Figure 5 Components S1, S2, S3, S4), and a bus capacitor 412 (reference Figure 5 Component C BUS ) are connected in parallel. In this embodiment, the bus capacitor 412 is used to filter the input voltage and provide instantaneous energy for the DCDC conversion module 40. Its rated voltage is high and requires a large capacitance value, so it is relatively large. In this embodiment, the bus capacitor 412 includes a capacitor body 413 and a bus capacitor circuit board 414, wherein the capacitor body 413 can, for example, extend along the first direction (X-axis direction) and be disposed on the first magnetic cover 423 of the transformer 42, and the bus capacitor circuit board 414 can, for example, be vertically inserted into the first surface 21 of the power board 20 along the Z-axis direction and adjacent to the primary power device 411, with one end of the capacitor body 413 connected to the bus capacitor circuit board 414. When the primary circuit 41, transformer 42, and secondary circuit 43 of the DCDC conversion module 40 are sequentially arranged on the power board 20 along the first direction, the bus capacitor 412 of the primary circuit 41 can be directly inserted into the power board 20 via the bus capacitor circuit board 414, reducing the interface electrically connected to the transformer 42. Furthermore, the capacitor body 413 of the bus capacitor 412 can be disposed on the first magnetic cover 423 of the planar transformer 42 along the first direction (X-axis direction), for example, to further improve the power density.

[0104] In this embodiment, the DCDC converter module 40 is directly mounted on the power board 20, and the output terminals 30 are formed, for example, by copper plating on the power board at the rear edge 23. These terminals can be directly connected to the external terminals 9 through the rear panel 11 of the housing 10. In other words, by integrating the planar transformer 42 directly on the power board 20, the power supply device 1 of this embodiment can eliminate the interface between the conventional transformer circuit board and the output terminals 30.

[0105] In another embodiment, the output terminal 30 is also, for example, a metal conductor sheet, which can be, for example, a rectangular plate. In this case, the side edge 23 of the power board 20 is accommodated in the accommodating space 15, and one side surface of the metal conductor sheet is fixedly connected to the side edge of the power board 20, so that the metal conductor sheet and the power board extend on the same plane. The metal conductor sheet can directly pass through the rear panel 11 of the shell 10 and be connected to the external terminal 9.

[0106] In this embodiment, the secondary circuit 43 includes at least one secondary power device 431 and an output capacitor 432, which are arranged on the power board 20 and are electrically connected to each other by plating copper in the power board 20. Specifically, the secondary power device 431 can be arranged on the first side 21 of the power board 20, or on the second side 22 of the power board 20; similarly, the output capacitor 432 can be arranged on the first side 21 of the power board 20, or on the second side 22 of the power board 20, and the present invention does not limit this. In this embodiment, the output capacitor 432 is used to filter the output voltage ripple and provide instantaneous energy for the subsequent load (i.e., the device connected to the external terminal 9). It has a low rated voltage and a small size. It is connected between the transformer 42 and the output terminal 30, which helps to reduce the current path flowing through the filter capacitor. It should be noted that this case is not limited to the number and connection method of the secondary power devices 431. Comparison Figure 5 The first exemplary equivalent circuit diagram of the power supply device 1 is shown. In this embodiment, the secondary circuit 43 includes, for example, four secondary power devices 431 (refer to Figure 5 Components S5, S6, S7, S8), and output capacitor 432 (Compared Figure 5 Component C OUT The secondary power device 431 and the output capacitor 432 of the secondary circuit 43 are disposed adjacent to the output terminal 30 , which helps reduce line loss from the DCDC conversion module 40 to the output terminal 30 and reduces the number of interfaces between components.

[0107] In this embodiment, the DCDC conversion module 40 further includes an LLC resonant circuit having a resonant inductor 44 (refer to Figure 5Element Lr) is disposed between the transformer 42 and the primary circuit 41. In this embodiment, the resonant inductor 44 includes an inductor winding 441, at least one second magnetic column 442, a third magnetic cover 443, and a fourth magnetic cover 444. In addition, the power board 20 further includes at least one second through-hole 26 penetrating the first surface 21 and the second surface 22 of the power board 20. At least one first through-hole 25 is located between the at least one second through-hole 26 and the rear edge 23, and at least a portion of the inductor winding 441 surrounds the at least one second through-hole 26 and is implemented by copper plating in the power board 20. In some embodiments, a portion of the inductor winding 441 can also be formed by using copper wire to wind around the second magnetic column 442 on the outside of the power board 20. In this embodiment, at least one second magnetic column 442 passes through at least one second through-hole 26 of the power board 20. The third magnetic cover 443 and the fourth magnetic cover 444 are respectively disposed relative to the first side 21 and the second side 22 of the power board 20 and are connected via the at least one second magnetic column 442. Specifically, the third magnetic cover 443 is disposed on the side of the power board 20 where the first side 21 is located, and the fourth magnetic cover 444 is disposed on the side of the power board 20 where the second side 22 is located. In some embodiments, one surface of the fourth magnetic cover 444 can be adhesively fixed to the second side 22 of the power board 20, so that the at least one second magnetic column 442, the third magnetic cover 443, and the fourth magnetic cover 444 are fixed relative to the power board 20 and, together with the inductor winding 441, constitute the resonant inductor 44 on the power board 20.

[0108] In this embodiment, the LLC resonant circuit further includes a resonant capacitor 45 (refer to Figure 5 Component Cr) is provided on the power board 20. Specifically, the resonant capacitor 45 can be provided on the first surface 21 of the power board 20, or on the second surface 22 of the power board 20. The resonant capacitor 45 has a low capacitance and a small size, and is provided between the transformer 42 and the primary circuit 41, which helps to reduce the flow path of the resonant current flowing through the resonant capacitor 45. In addition, in this embodiment, the power supply device 1 also includes an auxiliary power supply unit 47, which is vertically inserted into the power board 20 along a second direction such as the Z axis, is electrically connected to the DCDC conversion module 40, and is located on one side of the transformer 42, without affecting the stacking of the capacitor body 413 of the bus capacitor 412 and the first magnetic cover 423 of the transformer 42 in the Z axis direction. The auxiliary power supply unit 47 can be used to supply power to the components in the primary circuit 41 and the secondary circuit 43. In this embodiment, the power supply device 1 may also include a control board 46, which is vertically inserted into the power board 20 along a second direction, such as the Z axis, electrically connected to the power board 20, and located on one side of the transformer 42, without affecting the stacking of the capacitor body 413 of the bus capacitor 412 and the first magnetic cover 423 of the transformer 42 in the Z axis direction. The control board can be used to control the opening and closing of power devices in the primary circuit 41 and the secondary circuit 43, thereby achieving stable output of the power supply device.

[0109] In this embodiment, the power supply device 1 further includes a fan 50 housed in the housing space 15 and positioned adjacent to the front panel 12 of the housing 10. The fan 50 can be controlled to form an air duct that extends from the second slot 14 along the first direction (the X-axis) through the DC-DC converter module 40 and the first slot 13. In this embodiment, when the DC-DC converter module 40 is directly mounted on the power board 20, the output terminals 30 of the power supply device 1 extend through the rear panel 11 of the housing 10. This, combined with the fan 50 positioned adjacent to the front panel 12 of the housing 10, forms an air duct between the two opposing panels, effectively dissipating heat generated by the transformer 42, power devices, and other heat-generating components within the DC-DC converter module 40. In this embodiment, the power supply device 1 further includes an input board 60 housed in the housing space 15 within the housing 10, electrically connected to the power board 20, and positioned between the DC-DC converter module 40 and the front panel 12 of the housing 10. In this embodiment, a voltage conversion module 61 and an EMI module 62 are inserted into the input board 60 and electrically connected to the power board 20 via the input board 60. In one embodiment, the voltage conversion module 61, such as a PFC module, is used to convert input AC power into DC power. In another embodiment, the voltage conversion module 61, such as a Boost module, is inserted into the input board 60 and electrically connected to the power board 20 via the input board 60 to convert a lower input DC voltage into a higher DC voltage. In this embodiment, the EMI module 62 is used to enhance the electromagnetic compatibility of the power supply device 1. In this embodiment, the voltage conversion module 61 is positioned adjacent to the fan 50, spatially relative to the air duct. Of course, in other embodiments, the fan 50 may be omitted. This is not a limitation. In addition, in this embodiment, the power supply device 1 further includes an input terminal component 63 that extends through the front panel 12 of the housing 10 through the second notch 14 and is electrically connected to the power board 20 directly or through the input board 60. While the rear edge 23 is positioned adjacent to the rear panel 11 of the housing 10 , the front edge 24 of the power board 20 can be connected to the input board 60 toward the front panel 12 , thereby integrating the voltage conversion module 61 , EMI module 62 , or input terminal components 63 within the housing space 15 of the housing 10 , effectively increasing power density and enhancing product competitiveness. Of course, the present invention is not limited to this.

[0110] Figure 7 The figure schematically shows a three-dimensional structural diagram of the internal components of the power supply device according to the second embodiment of the present invention. Figure 8 for Figure 7 Top view of . Figure 9 The schematic diagram shows the structure of the internal components of the power supply device of the second embodiment of the present invention. In this embodiment, the power supply device 1a and Figures 1 to 6The power supply device 1 shown is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, the power supply device 1a omits the auxiliary power supply unit 47 of the aforementioned power supply device 1, so the transformer 42a of the DCDC conversion module 40a can expand the size of the first magnetic cover 423a and the second magnetic cover 424a in the XY plane, that is, the horizontal direction of the power board 20, to further improve the power density. Of course, the present case is not limited to this. On the other hand, in this embodiment, the first magnetic cover 423a and the second magnetic cover 424a extend horizontally, replacing the third magnetic cover 443 and the fourth magnetic cover 444 of the aforementioned power supply device 1, that is, the third magnetic cover 443 and the first magnetic cover 423 can be integrated into an integrated structure, and the fourth magnetic cover 444 and the second magnetic cover 424 can be integrated into an integrated structure. Of course, the third magnetic cover 443 and the first magnetic cover 423, or the fourth magnetic cover 444 and the second magnetic cover 424 can be integrated into an integrated structure, and the present invention is not limited to this. At least one second magnetic column 442 of the resonant inductor 44a is connected to the first magnetic cover 423a and the second magnetic cover 424a through at least one second through-hole 26 of the power board 20, and can form the resonant inductor 44a on the power board 20 together with the inductor winding 441. In other words, when the first magnetic cover 423a and the second magnetic cover 424a are enlarged in size, they can be combined with other magnetic cores such as the resonant inductor 44a to form an integrated structure, thereby simplifying the manufacturing and assembly process, reducing costs, and achieving the purpose of reducing line loss and reducing the number of interfaces. Of course, the present case is not limited to this.

[0111] Figure 10 The three-dimensional structure diagram schematically shows the internal components of the power supply device of the third embodiment of the present case. Figure 11 for Figure 10 Top view of . Figure 12 The schematic diagram shows the structure of the internal components of the power supply device of the third embodiment of this case. In this embodiment, the power supply device 1b and Figures 7 to 9The power supply device 1a shown is similar, and like component numbers represent like components, structures, and functions, and will not be further described here. In this embodiment, the power board 20a of the power supply device 1b extends from the rear panel 11 of the housing 10 to the front panel 12. That is, the front side edge 24 of the power board 20a is closer to the front panel 12. In this embodiment, the fan 50 and the input terminal component 62 can be, for example, sandwiched between the front side edge 24 of the power board 20a and the front panel 12 of the housing 10. The voltage conversion module 61 and the EMI module 62 can be directly disposed on the power board 20a and electrically connected to the DC-DC converter module 40a via the copper wiring on the power board 20a. Compared to the aforementioned embodiment, the power supply device 1b omits the interface between the power board 20 and the input board 60 in the power supply device 1a, and sets the DCDC conversion module 40a, the voltage conversion module 61, the EMI module 62 and other components on the power board 20a, and uses copper-plated lines to achieve electrical connection, which helps to simplify the manufacturing and assembly process, reduce costs, and achieve the purpose of reducing line loss and reducing the number of interfaces.

[0112] It should be noted that the primary circuit 41 , the transformer 42 and the secondary circuit 43 included in the DCDC conversion modules 40 and 40 a in the aforementioned embodiments can be adjusted according to actual application requirements. Figure 5 This is merely an exemplary equivalent circuit diagram and does not limit the number and layout of components within the primary circuit 41 , the transformer 42 , and the secondary circuit 43 . Figure 13 The second exemplary equivalent circuit diagram of the power supply device of the present invention is schematically shown. Figures 1 to 4 as well as Figure 13 . Different from Figure 5 In the first exemplary equivalent circuit diagram, in this embodiment, the DCDC conversion module 40 further omits the resonant inductor 44 and the resonant capacitor 45. In addition, Figure 14 The third exemplary equivalent circuit diagram of the power supply device of the present invention is schematically shown. In this embodiment, the primary circuit 41 and the secondary circuit 43 include different numbers of primary power devices 411 and secondary power devices 431, for example, two primary power devices 411 and one secondary power device 431. Of course, the present invention is not limited to the number of primary power devices 411 and secondary power devices 431 disposed on the power board 20. Furthermore, Figure 15 A fourth exemplary equivalent circuit diagram of the power supply device of this embodiment is schematically shown. In this embodiment, the primary circuit 41, transformer 42, and secondary circuit 43 in the DCDC converter module 40 are further combined to form a step-down circuit. Of course, this embodiment is not limited to this, and will not be further described.

[0113] Figure 16 The figure schematically shows a three-dimensional structural diagram of the internal components of the power supply device according to the fourth embodiment of the present invention. Figure 17The schematic diagram shows the structure of the internal components of the power supply device of the fourth embodiment of the present invention. In this embodiment, the power supply device 1c and Figures 1 to 6 The power supply device 1 shown is similar, and like component numbers represent like components, structures, and functions, which will not be further described here. In this embodiment, the power supply device 1c further includes an additional circuit board 27 disposed between the first magnetic cover 423 of the transformer 42 and the first surface 21 of the power board 20. The additional circuit board 27 includes at least two third through-holes 271 that pass through the additional circuit board 27 and are spatially aligned with the at least two first through-holes 25 of the power board 20. The at least two first magnetic pillars 422 correspondingly pass through the at least two third through-holes 271 of the additional circuit board 27 and the at least two first through-holes 25 of the power board 20. A portion of the transformer winding 421 surrounds at least one of the third through-holes 271 and is implemented by copper plating in the additional circuit board 27. The transformer winding 421 in the additional circuit board 27 and the transformer winding 421 in the power board 20 together constitute the transformer winding of this embodiment. In other embodiments, the additional circuit board 27 may be further arranged between the first surface 21 of the power board 20 and the third magnetic cover 443. In this case, the additional circuit board 27 includes at least two third through-holes 271 and at least one fourth through-hole 272. The at least two third through-holes 272 and the at least one fourth through-hole 271 pass through the additional circuit board 27 and are spatially relative to the at least two first through-holes 25 and the second through-hole 26 of the power board 20. The at least two first magnetic pillars 422 pass through the at least two third through-holes 271 of the additional circuit board 27 and the at least two first through-holes 25 of the power board 20, and the at least second magnetic pillars 442 pass through the additional circuit board 27. The at least one fourth through-hole 272 of the additional circuit board 27 and the at least one second through-hole 26 of the power board 20 are surrounded by a portion of the transformer winding 421 and a portion of the inductor winding 441. Portions of the transformer winding 421 and the inductor winding 441 are formed by copper plating in the additional circuit board 27. The transformer winding 421 in the additional circuit board 27 and the transformer winding 421 in the power board 20 together constitute the transformer winding of this embodiment, and the inductor winding 441 in the additional circuit board 27 and the inductor winding 441 in the power board 20 together constitute the inductor winding 441 of this embodiment. Thus, the transformer winding 421 of the transformer 42 and the inductor winding 441 of the resonant inductor 44 can achieve more diverse application variations. In addition, in other embodiments, the additional circuit board 27 may be, for example, disposed between the second magnetic cover 424 of the transformer 42 and the second surface 22 of the power board 20, and further disposed between the fourth magnetic cover 444 of the resonant inductor 44 and the second surface 22 of the power board 20, and the present invention is not limited thereto.

[0114] In summary, embodiments of the present invention provide a communications and server power supply device that optimizes the configuration of a planar transformer, while simultaneously increasing the transformer's power rating and reducing line losses. When the DC-DC converter module is directly mounted on a power board, the output terminals are formed directly, for example, by copper plating on the side edge of the power board. Alternatively, the output terminals are fixedly connected to the side edge of the power board via a metal conductor sheet and can be directly connected to external terminals through the housing. Furthermore, by directly integrating the planar transformer into the power board, the interface between the transformer circuit board and the output terminals can be eliminated. Furthermore, when the transformer and secondary circuit of the DC-DC converter module are sequentially mounted on the power board, the bus capacitors of the primary circuit can be directly inserted into the power board via a bus capacitor circuit board, reducing the number of electrical connections to the transformer. Furthermore, the bus capacitor bodies can be stacked, for example, along a first direction on the first magnetic cover of the planar transformer. Other adjacent control boards and auxiliary power supply units can be directly inserted into and electrically connected to the power board, further improving power density. This case arranges the DCDC conversion module and output terminals in a planar manner on the power board to shorten the current flow path and reduce the number of interfaces between components, further relaxing the housing height restriction on the size of the transformer in the DCDC conversion module, thereby increasing the transformer power level. When the DCDC conversion module is directly placed on the power board, the planarization of the transformer helps the magnetic cover to expand its horizontal size along the extension direction of the power board to increase the power density. When the magnetic cover is enlarged, it can be combined with other magnetic covers such as resonant inductors to form an integrated structure, simplifying the manufacturing and assembly process, reducing costs, and achieving the purpose of reducing line losses and reducing the number of interfaces. On the other hand, when the DCDC conversion module is directly placed on the power board, the output terminals of the power supply device pass through the rear panel of the housing and can be combined with a fan adjacent to the front panel of the housing to form an air duct between the two opposing panels to effectively dissipate the heat energy generated by the transformer, power devices and other heating elements in the DCDC conversion module. Furthermore, compared to the power supply device output terminal extending through the rear panel, the power board can extend toward the front panel or be combined with an input board to integrate the voltage conversion module, EMI module or input terminal components within the housing space, effectively improving the power density and enhancing the competitiveness of the product.

[0115] The present invention can be modified in various ways by those skilled in the art, but all of these modifications are within the protection scope of the appended claims.

Claims

1. A power supply device, comprising: A housing having an accommodating space therein, the housing having a rear panel and a lower panel, the rear panel having a first notch, the first notch communicating with the accommodating space; a power board, parallel to the lower panel and at least partially accommodated in the accommodation space, comprising at least two first through-holes, a side edge, and a first surface and a second surface disposed opposite each other, wherein the at least two first through-holes pass through the first surface and the second surface of the power board, and the side edge is disposed adjacent to the rear panel; an output terminal, parallel to the lower panel and passing through the rear panel through the first notch; and a DC-DC converter module accommodated in the accommodation space and comprising a primary circuit, a transformer, and a secondary circuit, wherein the transformer and the secondary circuit are sequentially disposed on the power board, the secondary circuit being disposed on the side of the side edge of the power board and electrically connected to the output terminal, the transformer comprising a transformer winding, at least two first magnetic pillars, a first magnetic cover, and a second magnetic cover, at least a portion of the transformer winding being formed by copper plating in the power board, the at least two first magnetic pillars passing through the at least two first through-holes of the power board, the first magnetic cover and the second magnetic cover being disposed opposite the first side and the second side of the power board, respectively, and connected via the at least two first magnetic pillars; The primary circuit includes a bus capacitor. A capacitor body of the bus capacitor extends along a first direction and is disposed on the first magnetic cover of the transformer. The first direction is perpendicular to the rear panel.

2. The power supply device as claimed in claim 1, wherein the primary circuit further comprises at least one primary power device, wherein: At least one primary power device is disposed on the first surface of the power board, and the primary circuit, the transformer, and the secondary circuit are sequentially disposed along the first direction.

3. The power supply device as described in claim 2, wherein the bus capacitor further includes a bus capacitor circuit board, which is inserted into the first surface of the power board, arranged adjacent to the at least one primary power device and electrically connected to the at least one primary power device by copper plating in the power board, and one end of the capacitor body is connected to the bus capacitor circuit board. 4 . The power supply device as claimed in claim 1 , wherein the output terminal and the DCDC conversion module are electrically connected by copper plating in the power board. 5 . The power supply device as claimed in claim 1 , wherein the output terminal is a gold finger, the gold finger is formed by copper plating on the side edge of the power board, and the gold finger is assembled and connected to an external terminal.

6. The power supply device as claimed in claim 1, wherein the output terminal is a metal conductor sheet, the side edge of the power board is accommodated in the accommodation space, a side surface of the metal conductor sheet is fixedly connected to the side edge of the power board, and the metal conductor sheet is assembled and connected to an external terminal. 7 . The power supply device as claimed in claim 1 , wherein a surface of the second magnetic cover is adhered and fixed to the second surface of the power board.

8. The power supply device as claimed in claim 1, wherein the secondary circuit comprises at least one secondary power device and an output capacitor, the at least one secondary power device and the output capacitor are disposed on the power board and are electrically connected by copper plating in the power board.

9. The power supply device as claimed in claim 1 or 2, wherein the DCDC conversion module further comprises an LLC resonant circuit, the LLC resonant circuit comprising a resonant inductor and a resonant capacitor, the resonant capacitor being disposed on the power board, and the resonant inductor and the resonant capacitor being disposed between the transformer and the primary circuit.

10. The power supply device as described in claim 9, wherein the resonant inductor includes an inductor winding, at least one second magnetic column, a third magnetic cover and a fourth magnetic cover, the power board includes at least one second through-hole, the at least one second through-hole passes through the first surface and the second surface of the power board, and the at least two first through-holes are located between the at least one second through-hole and the side edge, at least a portion of the inductor winding is formed by copper plating in the power board, the at least one second magnetic column passes through the at least one second through-hole of the power board, the third magnetic cover and the fourth magnetic cover are respectively arranged relative to the first surface and the second surface of the power board, and are connected through the at least one second magnetic column.

11. The power supply device according to claim 10, further comprising an additional circuit board disposed between the power board and the first magnetic cover and the third magnetic cover, or disposed between the power board and the second magnetic cover and the fourth magnetic cover, wherein: The additional circuit board includes at least two third through-holes and at least one fourth through-hole, and the at least two third through-holes and the at least one fourth through-hole pass through the additional circuit board. The at least two first magnetic columns pass through the at least two third through-holes of the additional circuit board correspondingly, and the at least one second magnetic column passes through the at least fourth through-hole of the additional circuit board correspondingly. Part of the transformer winding and part of the inductor winding are formed by copper plating in the additional circuit board.

12. The power supply device as described in claim 10, wherein the third magnetic cover plate is integrated with the first magnetic cover plate to form an integrated structure, and / or the fourth magnetic cover plate is integrated with the second magnetic cover plate to form an integrated structure, and / or a surface of the fourth magnetic cover plate is adhered and fixed to the second surface of the power board.

13. The power supply device according to claim 1, further comprising an additional circuit board disposed between the first magnetic cover and the power board, or disposed between the second magnetic cover and the power board, wherein: The additional circuit board includes at least two third through-holes, which pass through the additional circuit board, and the at least two first magnetic columns pass through the at least two third through-holes of the additional circuit board respectively. Part of the transformer winding is formed by copper plating in the additional circuit board.

14. The power supply device according to claim 1, further comprising an auxiliary power supply unit inserted along a second direction onto the first surface of the power board, electrically connected to the DC-DC conversion module, and located on one side of the transformer; and / or, further comprising a control board inserted along a second direction onto the first surface of the power board, electrically connected to the power board, and located on one side of the transformer, wherein: The second direction is perpendicular to the power board. 15 . The power supply device as claimed in claim 1 , wherein the housing further comprises a front panel, the front panel is disposed opposite to the rear panel and has a second notch, and the second notch is connected to the accommodating space.

16. The power supply device according to claim 15, further comprising a fan accommodated in the accommodation space and disposed adjacent to the front panel, the fan being controlled to form an air duct extending from the second slot through the DCDC conversion module to the first slot.

17. The power supply device according to claim 16, further comprising a voltage conversion module accommodated in the accommodation space, located between the DCDC conversion module and the front panel, and disposed adjacent to the fan and spatially opposite to the air duct, wherein: The voltage conversion module is a PFC module or a Boost module.

18. The power supply device as claimed in claim 17, wherein the voltage conversion module is directly inserted into the first surface of the power board and electrically connected to the power board, or the voltage conversion module is inserted into an input board and electrically connected to the power board through the input board. 19 . The power supply device as claimed in claim 15 , further comprising an EMI module accommodated in the accommodation space and located between the DCDC conversion module and the front panel.

20. The power supply device as claimed in claim 19, wherein the EMI module is directly inserted into the first surface of the power board and electrically connected to the power board, or the EMI module is disposed on an input board and electrically connected to the power board through the input board.

21. The power supply device according to claim 15, further comprising an input terminal component, the input terminal component passing through the front panel through the second slot, wherein The input-end component is directly electrically connected to the power board or is electrically connected to the power board through an input board.

22. The power supply device as claimed in claim 15, wherein the housing further comprises an upper panel, a left panel and a right panel, wherein: The front panel and the rear panel are arranged opposite to each other along the first direction, the upper panel and the lower panel are arranged opposite to each other along a second direction, and the left panel and the right panel are arranged opposite to each other along a third direction. The front panel, the rear panel, the upper panel, the lower panel, the left panel and the right panel form the accommodating space, and the first direction, the second direction and the third direction are perpendicular to each other.

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