Circuit board, lens assembly and electronic device thereof

Abstract

The application provides a circuit board, comprising a circuit substrate and a first anti-soldering layer. The circuit substrate has a first surface; the first anti-soldering layer is arranged on the first surface, and a plurality of heat dissipation fins are arranged on the surface of the first anti-soldering layer away from the first surface, and heat dissipation channels are formed between adjacent heat dissipation fins. By arranging the heat dissipation fins on the first anti-soldering layer of the circuit board, the heat on the circuit substrate is transmitted to the first anti-soldering layer, and the heat is released through the heat dissipation fins, thereby improving the heat dissipation efficiency of the circuit board. The application also provides a lens assembly using the circuit board and an electronic device comprising the lens assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board, a lens assembly, and an electronic device. BACKGROUND

[0002] Nowadays, electronic devices (such as mobile phones, tablet computers, etc.) are becoming smaller and smaller, which requires the lens assembly applied to such electronic devices to be miniaturized. In such a lens assembly, the area of the circuit board is smaller, resulting in a higher integration density of various electronic components on the circuit board, and heat is difficult to dissipate quickly, thereby affecting the normal operation of the electronic components in the lens assembly. SUMMARY

[0003] Therefore, the present application provides a circuit board capable of improving heat dissipation efficiency.

[0004] In addition, it is necessary to provide a lens assembly having the circuit board and an electronic device applying the lens assembly.

[0005] The present application provides a circuit board, comprising a circuit substrate and a first solder mask layer. The circuit substrate has a first surface; the first solder mask layer is arranged on the first surface, and a plurality of heat dissipation fins are arranged on the surface of the first solder mask layer away from the first surface, and a heat dissipation channel is formed between adjacent heat dissipation fins.

[0006] In some embodiments, the circuit substrate has a second surface corresponding to the first surface, and the circuit board further comprises a second solder mask layer arranged on the second surface; a plurality of through holes are formed in the circuit substrate, and the circuit board further comprises a heat conduction column arranged in the through hole, and the heat conduction column connects the circuit substrate between the first solder mask layer and the second solder mask layer.

[0007] In some embodiments, the circuit substrate comprises a plurality of conductive circuit layers, and a metal layer for electrically connecting the conductive circuit layers is arranged in the through hole, and the heat conduction column is arranged in the through hole with the metal layer.

[0008] In some embodiments, the heat conduction column is a metal column.

[0009] In some embodiments, the material of the heat conduction column is silver or copper.

[0010] In some embodiments, the adjacent heat dissipation fins are arranged in parallel.

[0011] In some embodiments, the plurality of heat dissipation fins are distributed at equal intervals.

[0012] In some embodiments, the first solder resist layer extends integrally along the direction from the second solder resist layer to the circuit board to form the heat dissipation fins.

[0013] A lens assembly includes the aforementioned circuit board, and further includes a photosensitive chip, a lens mount, and a lens module. The photosensitive chip is disposed on the circuit board, and the circuit board is located between the photosensitive chip and a first solder resist layer. The lens mount is disposed on the circuit board and the photosensitive chip is housed within the lens mount. The lens module is disposed on the surface of the lens mount facing away from the circuit board.

[0014] This application also provides an electronic device for using a lens assembly.

[0015] In this application, heat dissipation fins are provided on the first solder resist layer of the circuit board. By increasing the contact area between the first solder resist layer and the air, more heat on the circuit board is transferred to the heat dissipation fins. The heat is released through the heat dissipation channel. The provision of heat dissipation fins on the first solder resist layer increases the heat dissipation space, increases the airflow, reduces the accumulation of heat on the circuit board, and improves the heat dissipation effect of the circuit board. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a circuit board provided in an embodiment of this application.

[0017] Figure 2 yes Figure 1 A schematic diagram of the circuit board from another perspective in one embodiment is shown.

[0018] Figure 3 yes Figure 1 A cross-sectional view of the circuit board in another embodiment is shown.

[0019] Figure 4 It is an application Figure 1 A schematic diagram of the lens assembly on the circuit board.

[0020] Figure 5 yes Figure 4 An exploded view of the lens assembly in one embodiment is shown.

[0021] Figure 6 yes Figure 4 An exploded view of the lens assembly from another perspective in one embodiment is shown.

[0022] Figure 7 It provides an application Figure 4 The electronic device of the lens assembly shown.

[0023] Explanation of main component symbols

[0024] Circuit board 100

[0025] circuit substrate 10

[0026] first surface 101

[0027] second surface 102

[0028] first anti-solder layer 11

[0029] second anti-solder layer 12

[0030] through hole 13

[0031] metal layer 14

[0032] thermally conductive post 15

[0033] electrically conductive circuit layer 16

[0034] heat dissipation fin 20

[0035] heat dissipation channel 21

[0036] photosensitive chip 30

[0037] electronic connector 40

[0038] lens assembly 200

[0039] lens holder 210

[0040] lens module 220

[0041] electronic device 300

[0042] The following detailed description will describe the technical solutions in the embodiments of the present application in conjunction with the above-mentioned accompanying drawings. Figures 1-7 The present application will be further described. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all.

[0044] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or there can be an intervening element.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0046] In order to further clarify the technical hand and effect of the technical means adopted by the present application to achieve the predetermined purpose, the following is a detailed description of the present application in combination with the drawings and embodiments.

[0047] Please refer to Figure 1 , Figure 2 and Figure 3 , the embodiment of the present application provides a circuit board 100, comprising a circuit substrate 10, a first solder mask layer 11, a second solder mask layer 12, a heat-conducting column 15 and a heat dissipation fin 20. The circuit substrate 10 has a first surface 101 and a second surface 102 corresponding to the first surface 101, the first solder mask layer 11 is arranged on the first surface 101, and the second solder mask layer 12 is arranged on the second surface 102. A plurality of through holes 13 are formed in the circuit substrate 10, i.e. the through holes 13 are located between the first solder mask layer 11 and the second solder mask layer 12. The heat-conducting column 15 is correspondingly accommodated in the through hole 13, and the heat-conducting column 15 is connected between the first solder mask layer 11 and the second solder mask layer 12. The heat dissipation fin 20 is arranged on the first solder mask layer 11 for releasing heat on the circuit board 100.

[0048] Please refer to Figure 2 and Figure 3 , the circuit board 100 can be a soft board, a hard board or a combination of soft and hard boards. In the embodiment, the circuit board 100 adopts a hard board. A plurality of heat dissipation fins 20 are arranged on the surface of the first solder mask layer 11 away from the first surface 101, and a heat dissipation channel 21 is formed between adjacent heat dissipation fins 20. The cross section of the heat dissipation fin 20 is triangular, and in another embodiment, the cross section of the heat dissipation fin 20 is trapezoidal, but not limited thereto. The heat on the circuit substrate 10 is dissipated through the heat dissipation fins 20 on the first solder mask layer 11. Therefore, the arrangement of the heat dissipation fins 20 increases the heat dissipation space and the air flow, increases the heat transfer area of the circuit board 100, so that the heat of the circuit board 100 can be released, and the thermal resistance of the circuit board 100 is reduced.

[0049] Please refer to Figure 2 and Figure 3The circuit substrate 10 further comprises a plurality of conductive circuit layers 16. The circuit substrate 10 is provided with a metal layer 14 on the inner wall of the through hole 13, and the metal layer 14 is used to conduct the conductive circuit layers 16 in the circuit substrate 10. The heat-conducting column 15 is filled in the through hole 13 provided with the metal layer 14. The heat-conducting column 15 is a metal column, and the specific material can be metal silver or copper, which improves the heat dissipation efficiency of the circuit substrate 10. In another embodiment, the heat-conducting column 15 can be made of the same material as the first solder mask layer 11.

[0050] Referring to Figure 2 and Figure 3 , the first solder mask layer 11 extends in the direction of the second solder mask layer 12 to the circuit substrate 10 to form the heat dissipation fins 20. Adjacent heat dissipation fins 20 are arranged in parallel, so as to improve the flow of air in the heat dissipation channel 21 and facilitate direct heat release. The plurality of heat dissipation fins 20 are distributed at equal intervals, so that the heat dissipation fins 20 release heat more uniformly. The heat dissipation fins 20 can be plate-shaped or columnar, but are not limited thereto. The heat dissipation fins 20 can be arranged at any interval and in any arrangement. The heat dissipation fins 20 can be fixedly installed on the first solder mask layer 11 or integrally formed with the first solder mask layer 11. In this embodiment, the heat dissipation fins 20 are obtained by multiple printing of the first solder mask layer 11, that is, the heat dissipation fins 20 are made of the same material (such as solder mask ink) as the first solder mask layer 11. In this way, the heat dissipation efficiency of the circuit board 100 is improved without increasing the production cost of the circuit board 100. It has been verified that the arrangement of the heat dissipation fins 20 on the first solder mask layer 11 meets the impedance requirements of the circuit board 100.

[0051] Referring to Figure 4 , Figure 5 , Figure 6 and Figure 5 , the present application further provides a lens assembly 200, which comprises the circuit board 100, and further comprises a photosensitive chip 30, an electronic connector 40, a lens seat 210 and a lens module 220. The photosensitive chip 30 is arranged on the second surface 102 of the circuit substrate 10 having the second solder mask layer 12, and the circuit substrate 10 is located between the photosensitive chip 30 and the first solder mask layer 11. The photosensitive chip 30 generates heat during operation. The heat generated by the photosensitive chip 30 is transmitted to the first solder mask layer 11 via the second solder mask layer 12, the circuit substrate 10 and the heat-conducting column 15, and the heat is released via the heat dissipation fins 20 and the heat dissipation channel 21. The lens seat 210 is arranged on the circuit substrate 10, the photosensitive chip 30 is accommodated in the lens seat 210, and the lens module 220 is arranged on the surface of the lens seat 210 away from the circuit substrate 10.

[0052] Referring to Figure 6 and Figure 7The circuit board 10 is also provided with an electronic connector 40 on the first surface 101 with the heat dissipation fins 20. The electronic connector 40 can be a connector or a gold finger, which is used to realize the signal transmission between the lens assembly 200 and other electronic elements in the electronic device 300. The electronic connector 40 is arranged on a part of the first surface 101, and the heat generated by the long-term work of the electronic connector 40 can also be released through the heat dissipation fins 20 of the first solder mask layer 11.

[0053] Referring to ​ The lens assembly 200 can be applied to various electronic devices 300 with camera modules, such as mobile phones, wearable devices, vehicles, cameras, or monitoring devices. In this embodiment, the lens assembly 200 is applied to a mobile phone.

[0054] In this application, the heat dissipation fins 20 are arranged on the first solder mask layer 11 of the circuit board 100, which increases the contact area between the first solder mask layer 11 and the air, so that the heat generated on the photosensitive chip 30 is more transmitted to the heat dissipation fins 20. The heat is released through the heat dissipation channels 21, and the arrangement of the heat dissipation fins 20 on the first solder mask layer 11 increases the heat dissipation space and the air flow, reduces the accumulation of heat on the circuit board 100, and improves the heat dissipation effect of the circuit board 100.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A lens assembly, comprising a photosensitive chip, a lens seat, a lens module and a circuit board, characterized in that, The circuit board comprises: a circuit substrate having a first surface, the circuit substrate comprising a plurality of conductive circuit layers; a first anti-soldering layer disposed on the first surface, a surface of the first anti-soldering layer away from the first surface being provided with a plurality of heat dissipation fins, heat dissipation channels being formed between adjacent heat dissipation fins; a second anti-soldering layer, the circuit substrate having a second surface corresponding to the first surface, the second anti-soldering layer being disposed on the second surface; a plurality of through holes are formed in the circuit substrate, the through holes penetrating the circuit substrate, the circuit board further comprising a heat conduction column disposed in the through holes, the heat conduction column connecting the circuit substrate between the first anti-soldering layer and the second anti-soldering layer, the heat conduction column being a metal column; the photosensitive chip is disposed on the circuit substrate, the circuit substrate being located between the photosensitive chip and the first anti-soldering layer, the lens seat is disposed on the circuit substrate, the photosensitive chip is accommodated in the lens seat, and the lens module is disposed on a surface of the lens seat away from the circuit substrate.

2. The lens assembly of claim 1, wherein, The through holes are further provided with a metal layer for electrically connecting the conductive circuit layers, and the heat conduction column is disposed in the through hole with the metal layer.

3. The lens assembly of claim 1, wherein, The material of the heat conduction column is silver or copper.

4. The lens assembly of claim 1, wherein, Adjacent heat dissipation fins are arranged in parallel.

5. The lens assembly of claim 4, wherein, A plurality of heat dissipation fins are distributed at equal intervals.

6. The lens assembly of claim 1, wherein, The first anti-soldering layer integrally extends in the direction from the second anti-soldering layer to the circuit substrate to form the heat dissipation fins.

7. An electronic device, comprising: The lens assembly comprises any one of the lens assemblies according to claims 1 to 6.

Images