Packaging module and method for manufacturing the same

Abstract

A preparation method of a packaging module, comprising: providing at least one packaging module; providing a circuit board; providing at least one connecting component; arranging at least one connecting component between each packaging module and the circuit board to electrically connect each packaging module and the circuit board, and obtaining an intermediate body; forming a first plastic sealing layer and a second plastic sealing layer on the intermediate body, the first plastic sealing layer covering the connecting component, and the second plastic sealing layer covering the electronic component, and obtaining at least one packaging module. The method provided by the application does not need to use tin paste when the packaging module is mounted on the circuit board, does not need to undergo a secondary high-temperature reflow process, has a shorter production process, and has high production efficiency. The application further provides a packaging module prepared by the preparation method of the packaging module.

Description

TECHNICAL FIELD

[0001] The present application relates to a packaging module and a preparation method thereof. BACKGROUND

[0002] With the continuous development of electronic manufacturing industry, the demand for electronic system development is increasing, and system in a package (SiP) can quickly shorten the development cycle of electronic system. SiP is to package different functional active electronic components and passive devices, and other devices such as micro-electro-mechanical system (MEMS) or optical devices together to form a SiP module or a SiP sub-module. After the SiP module is packaged, it needs to be connected to the circuit board.

[0003] The traditional interconnection structure of SiP module and circuit board packaging needs to go through two reflow soldering processes, which is easy to cause the delamination of SiP plastic packaging material and carrier plate; the interconnection of SiP module and circuit board is strict in the flatness requirement of circuit board; and the production process is relatively long. SUMMARY

[0004] Therefore, in order to overcome at least one of the above defects, the present application provides a preparation method of a packaging module.

[0005] In addition, it is necessary to provide a packaging module obtained by the above preparation method.

[0006] The present application provides a preparation method of a packaging module, which comprises:

[0007] Providing at least one packaging module, comprising a packaging carrier plate, the packaging carrier plate comprising a first surface and a second surface opposite to the first surface, and the first surface is provided with electronic components.

[0008] Providing a circuit board, comprising a third surface and a fourth surface opposite to the third surface.

[0009] Placing each of the packaging modules on the third surface, and arranging at least one connecting component between the second surface of each of the packaging modules and the third surface, so that each of the packaging modules and the circuit board are electrically connected through the connecting component, to obtain an intermediate body.

[0010] And forming a first plastic packaging layer and a second plastic packaging layer on the surface of the intermediate body, the first plastic packaging layer is formed between the second surface and the third surface and covers the connecting component, and the second plastic packaging layer is formed on the first surface and covers the electronic components, so as to obtain at least one packaging module.

[0011] In the embodiment, the connecting assembly includes a first connecting sheet and a second connecting sheet, the first connecting sheet is in contact with and electrically connected to the first pad on the second surface, and the second connecting sheet is in contact with and electrically connected to the second pad on the third surface.

[0012] In the embodiment, the connecting assembly further includes a connecting part, one end of the first connecting sheet and the second connecting sheet is arranged apart to form an opening, and the other end is connected to each other and connected to the connecting part, and the connecting part is fixed between the second surface and the third surface by a support.

[0013] In the embodiment, along the thickness direction of the intermediate body, the support is arranged outside the electronic component, and the preparation method further includes:

[0014] In the embodiment, along the thickness direction of the intermediate body, the intermediate body after the first plastic encapsulation layer and the second plastic encapsulation layer are formed is cut to remove the part of the intermediate body containing the support.

[0015] In the embodiment, the connecting assembly is multiple, the support is arranged around the electronic component, and the multiple connecting assemblies are fixed on the support.

[0016] In the embodiment, the support includes a fixed part and a hollow part, the connecting part is arranged on the fixed part, and the hollow part penetrates the side wall of the support close to the connecting assembly and the other side wall of the support away from the connecting assembly.

[0017] In the embodiment, the connecting assembly is multiple, the multiple connecting assemblies are arranged around the support, and the multiple connecting parts are fixed on the support.

[0018] The application also provides a packaging module, which includes at least one packaging module, a circuit board, at least one connecting assembly, a first plastic encapsulation layer, and a second plastic encapsulation layer. The packaging module includes a packaging carrier, the packaging carrier includes a first surface and a second surface arranged opposite to the first surface, and the first surface is provided with an electronic component. The circuit board includes a third surface and a fourth surface arranged opposite to the third surface, and each packaging module is arranged on the third surface. At least one connecting assembly is arranged between the second surface of each packaging module and the third surface, so that each packaging module and the circuit board are electrically connected through the connecting assembly. The first plastic encapsulation layer is formed between the second surface and the third surface and covers the connecting assembly. The second plastic encapsulation layer is formed on the side of the first surface away from the second surface and covers the electronic component.

[0019] In the embodiment, the connecting assembly comprises a first connecting sheet and a second connecting sheet, the first connecting sheet is in abutment with and electrically connected to the first pad on the second surface, and the second connecting sheet is in abutment with and electrically connected to the second pad on the third surface.

[0020] In the embodiment, the connecting assembly further comprises a connecting part, one end of the first connecting sheet and the second connecting sheet is arranged apart to form an opening, and the other end is connected to each other and connected to the connecting part, and the connecting part is fixed between the second surface and the third surface through the support.

[0021] In the embodiment, the connecting assembly is multiple, the multiple connecting assemblies are arranged around the support, and the multiple connecting parts are fixed on the support.

[0022] Compared with the prior art, the manufacturing method of the packaging module provided by the application interconnects the packaging module and the circuit board through the connecting assembly, does not need to use tin paste, does not need to go through a secondary high-temperature reflow process, has a shorter production process, can simultaneously manufacture multiple packaging modules, and effectively improves the manufacturing efficiency of the packaging module. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a sectional view of a packaging board provided by an embodiment of the application.

[0024] Figure 2 is a sectional view of a packaging board provided by an embodiment of the application. Figure 1 is a sectional view of a packaging board provided by an embodiment of the application.

[0025] Figure 3 is a sectional view of a packaging board provided by an embodiment of the application. Figure 2 is a sectional view of a packaging board provided by an embodiment of the application.

[0026] Figure 4 is a sectional view of a packaging board provided by an embodiment of the application. Figure 3 is a sectional view of a packaging board provided by an embodiment of the application.

[0027] Figure 5 is a sectional view of a packaging board provided by an embodiment of the application. Figure 4 is a sectional view of a packaging board provided by an embodiment of the application.

[0028] Figure 6 is a sectional view of a circuit board provided by an embodiment of the application.

[0029] Figure 7 is a sectional view of a circuit board provided by an embodiment of the application. Figure 6 is a sectional view of a circuit board provided by an embodiment of the application.

[0030] Figure 8is a top view of the circuit board after mounting the connection assembly according to an embodiment of the present application.

[0031] Figure 9 is a side view of the bracket according to an embodiment of the present application.

[0032] Figure 10 is a sectional view of an intermediate body formed after mounting the package module on the connection assembly shown in Figure 7

[0033] is a sectional view of the intermediate body shown in Figure 11 Figure 10 is a sectional view of the intermediate body shown in

[0034] Figure 12 Figure 10 is a sectional view of the intermediate body shown in

[0035] Figure 13 is a top view of the intermediate body after molding according to an embodiment of the present application.

[0036] Figure 14 is a sectional view of the intermediate body shown in Figure 12

[0037] Figure 15 is a sectional view of the package module according to another embodiment of the present application.

[0038] Explanation of main component symbols

[0039] Package module 100, 200

[0040] Package module 1

[0041] Package board 11

[0042] First surface 111

[0043] Second surface 112

[0044] Third pad 12

[0045] First pad 13

[0046] Electronic element 14

[0047] Solder paste layer 15

[0048] Insulating adhesive 16

[0049] Circuit board 2

[0050] Third surface 21

[0051] Fourth surface 22

[0052] ​​​Second pad 23

[0053] Connection assembly 3

[0054] First connecting piece 31

[0055] First contact end 311

[0056] Second connecting piece 32

[0057] Connection portion 33

[0058] Opening 34

[0059] Support 4, 6

[0060] Fixing portion 41

[0061] Hollow portion 42

[0062] Adhesive layer 5

[0063] First plastic sealing layer 7

[0064] Second plastic sealing layer 8

[0065] Flow channel a

[0066] Fixing column b

[0067] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0068] The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0069] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0070] Referring to Figures 1 to 11 , the first embodiment of the present application provides a preparation method of a packaging structure, specifically comprising the following steps:

[0071] Step S1, referring to Figures 1 to 5 , at least one packaging module 1 is provided, the packaging module 1 comprises a packaging carrier plate 11, the packaging carrier plate 11 comprises a first surface 111 and a second surface 112 arranged opposite to the first surface 111, and the first surface 111 is provided with an electronic element 14.

[0072] In this embodiment, the packaging module 1 is specifically a SiP module.

[0073] In this embodiment, the preparation method of the packaging module 1 specifically includes the following steps:

[0074] Step S11, referring to Figure 1 , providing the packaging substrate 11, forming third pads 12 on the first surface 111, and forming first pads 13 on the second surface 112.

[0075] Step S12, referring to Figure 2 , disposing a tin paste layer 15 (or tin balls) on the third pads 12.

[0076] Step S13, referring to Figure 3 , placing the electronic components 14 on the tin paste layer 15. Specifically, the electronic components 14 include active components and passive components.

[0077] Step S14, referring to Figure 4 , reflow soldering the packaging substrate 11 on which the electronic components 14 are mounted, so that the electronic components 14 are mounted on the third pads 12.

[0078] Step S15, referring to Figure 5 , filling insulating glue 16 between the bottom of the reflow soldered electronic components 14 and the first surface 111, to obtain the packaging module 1.

[0079] The insulating glue 16 is used to further fix the electronic components 14 and prevent the third pads 12 from being exposed.

[0080] Step S2, referring to Figure 6 , providing a circuit board 2, which includes a third surface 21 and a fourth surface 22 arranged opposite to the third surface 21.

[0081] Specifically, the third surface 21 of the circuit board 2 is provided with second pads 23, and the fourth surface 22 is provided with a circuit layer (not shown in the figure), and the second pads 23 are electrically connected with the circuit layer.

[0082] In this embodiment, the circuit board 2 is an FPC board.

[0083] Step S3, referring to Figure 7 and Figure 10 , placing each packaging module 1 on the third surface 21, and arranging at least one connecting component 3 between the second surface 112 of each packaging module 1 and the third surface 21, so that each packaging module 1 and the circuit board 2 are electrically connected through the connecting component 3, to obtain an intermediate body 10.

[0084] In this embodiment, please refer to Figure 7 , and refer to Figure 8 , the connection assembly 3 is first arranged on the circuit board 2, and then the packaging module 1 is arranged on the connection assembly 3, so as to realize the electrical connection between the packaging module 1 and the circuit board 2.

[0085] In this embodiment, the connection assembly 3 includes a first connecting sheet 31 and a second connecting sheet 32. The first connecting sheet 31 is in abutment with and electrically connected to the first pad 13 on the packaging module 1. The second connecting sheet 32 is in abutment with and electrically connected to the second pad 23 on the circuit board 2.

[0086] In this embodiment, the connection assembly 3 further includes a connecting portion 33. One end of the first connecting sheet 31 and the second connecting sheet 32 is arranged apart to form an opening 34, and the other end is connected to each other and to the connecting portion 33. That is, the first connecting sheet 31, the second connecting sheet 32 and the connecting portion 33 form a Y-shaped structure. The end of the connecting portion 33 away from the first connecting sheet 31 and the second connecting sheet 32 is fixed between the second surface 112 and the third surface 21 by a support 4. The connecting portion 33 is fixed on the support 4, which can ensure the stability of the connection assembly 3 during the process.

[0087] In this embodiment, the material of the support 4 can be plastic, which is convenient for molding, low in cost and light in weight.

[0088] In this embodiment, the first connecting sheet 31 and the second connecting sheet 32 are both metal springs. When subjected to extrusion, the ends of the first connecting sheet 31 and the second connecting sheet 32 located at one end of the opening 34 will move towards each other, at which time a reverse elastic force will be formed, so that the packaging module 1 and the circuit board 2 are in full contact through the connection assembly 3, thereby reducing the risk of dislocation of the connection assembly 3 in the subsequent process, which leads to poor contact or open circuit.

[0089] In this embodiment, please refer to Figure 8 , the first connecting sheet 31 includes two first contact ends 311, and the second connecting sheet 32 includes two second contact ends (not shown in the figure). The first connecting sheet 31 is electrically connected to the circuit board 2 through the two first contact ends 311, and the second connecting sheet 32 is electrically connected to the packaging module 1 through the two second contact ends. The above design can reduce the resistance of the connection assembly 3.

[0090] As Figure 7 and Figure 8As shown, in the embodiment, one end of the bracket 4 is adhered to the third surface 21 of the circuit board 2 through the adhesive layer 5, and the thickness of the bracket 4 is slightly smaller than the distance between the first connecting piece 31 and the second connecting piece 32 corresponding to the opening 34, so that a certain pressure exists between the first connecting piece 31, the second connecting piece 32, the packaging module 1 and the circuit board 2, so that the first connecting piece 31 and the second connecting piece 32 are in full contact with the packaging module 1 and the circuit board 2, and the dislocation of the connecting assembly 3 caused by movement in the later manufacturing process is avoided, thereby causing poor contact or open circuit and the like. At the same time, the bracket 4 also plays a certain supporting role on the packaging module 1, so as to avoid the inclination and dislocation of the packaging module 1 in the subsequent packaging process, thereby causing poor product quality.

[0091] In the embodiment, the first connecting piece 31 and the second connecting piece 32 are arranged corresponding to the electronic element 14, and the bracket 4 is located outside the electronic element 14 in the thickness direction of the intermediate body 10. In this way, in order to facilitate the removal of the bracket 4 in the subsequent cutting process, the size of the entire packaging structure is reduced.

[0092] In the embodiment, referring to Figure 8 , the connecting assembly 3 is provided in multiple numbers, the bracket 4 is arranged around the electronic element 14, and multiple connecting assemblies 3 are fixed on one bracket 4. Multiple connecting assemblies 3 can realize multi-point electrical connection, and can improve the stability of the electrical connection between the packaging module 1 and the circuit board 2. At the same time, one bracket 4 is arranged around the electronic element 14, which can simplify the process and improve the assembly efficiency of the connecting assembly 3. Moreover, the bracket 4 arranged around the electronic element 14 does not occupy the space of the packaging module 100, which is conducive to reducing the size of the packaging module 100.

[0093] In the embodiment, referring to Figure 9 , the bracket 4 includes a fixed portion 41 and a hollow portion 42, and the connecting portion 33 is arranged on the fixed portion 41. The hollow portion 42 penetrates the side wall of the bracket 4 close to the connecting assembly 3 and the side wall of the bracket 4 away from the connecting assembly 3. The design of the hollow portion 42 of the bracket 4 is to enable the plastic sealing material to enter the area where the first connecting piece 31 and the second connecting piece 32 are located in the subsequent plastic sealing process, so as to plastic seal the connecting assembly 3.

[0094] In step S4, referring to Figure 11 and Figure 12 , the first plastic sealing layer 7 and the second plastic sealing layer 8 are formed on the surface of the intermediate body 10. The first plastic sealing layer 7 is formed between the second surface 112 and the third surface 21 and covers the connecting assembly 3, and the second plastic sealing layer 8 is formed on the first surface 111 and covers the electronic element 14.

[0095] In this embodiment, referring to Figure 11 , the intermediate body 10 is first placed in the mold cavity of the mold, and the plastic sealing material is injected into the mold cavity through the injection flow channel a by using the injection molding process, so as to simultaneously cover the packaging module 1 and the connecting assembly 3. The plurality of hollow portions 42 provided on the support 4 can enable the plastic sealing material to enter the area where the connecting assembly 3 is located from the hollow portions 42, so as to encapsulate the connecting assembly 3 in the plastic sealing material, and enable the area where the connecting assembly 3 is arranged to be isolated from air, thereby improving the reliability and stability of the connecting assembly 3. In addition, a plurality of fixing columns b are arranged outside the mounting area of the electronic component 14 during the design of the mold, which can limit the electronic component 14 and fix the packaging module 1, thereby avoiding dislocation of the packaging module 1 under the impact of the flowing plastic melt during the injection molding process.

[0096] In this embodiment, the material of the first plastic sealing layer 7 and the second plastic sealing layer 8 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

[0097] Step S5, referring to Figure 12 and Figure 13 , the intermediate body 10 after the first plastic sealing layer 7 and the second plastic sealing layer 8 are formed is cut along the thickness direction of the intermediate body 10 to remove the part of the intermediate body 10 containing the support 4, thereby obtaining at least one packaging module 100.

[0098] In this embodiment, as shown in Figure 12 and Figure 13 , the area where the electronic component 14 and the connecting assembly 3 are located is retained during cutting, and the part of the intermediate body 10 containing the support 4 is removed along the thickness direction of the intermediate body 10 along the dashed line, thereby obtaining the packaging module 100.

[0099] In this embodiment, one packaging module 100 is formed at a time. It can be understood that, according to actual needs, a plurality of packaging modules 1 can be arranged on one circuit board 2 at the same time, a plurality of connecting assemblies 3 are used to realize electrical connection, and the plurality of packaging modules 1 are encapsulated into one whole, and finally a plurality of packaging modules 100 are formed by cutting.

[0100] Referring to Figure 15 It can be understood that in another embodiment, the bracket 6 can also be arranged below the electronic element 14, that is, corresponding to the electronic element 14, to play a role of fixing the connection assembly 3 and supporting the packaging module 1. At this time, the bracket 6 is retained in the packaging module 100, and the bracket 6 does not need to be removed during cutting.

[0101] Specifically, the connection assembly 3 can be multiple, the bracket 6 can be one, the multiple connection assemblies 3 are arranged around the bracket 6, and the connecting portion 33 is fixed on the bracket 6. At this time, the bracket 6 is arranged inside the packaging module 100, and the bracket 6 does not need to be arranged in a hollow form, and the bracket structure is simple. Moreover, the multiple connection assemblies 3 adopt one bracket 6, which can save the space inside the packaging module 100.

[0102] The manufacturing method of the packaging module 100 of the application, the packaging module 1 and the circuit board 2 are interconnected by the connection assembly 3, without using tin paste and without going through a secondary high-temperature reflow process, the production process is shorter, multiple packaging modules can be manufactured at the same time, and the manufacturing efficiency of the packaging module 100 is effectively improved; in the plastic packaging process, the distance between the first connecting sheet 31 and the second connecting sheet 32 can be adjusted to ensure that the circuit board 2 and the packaging module 1 are in full contact and electrically connected, and the surface flatness requirement of the circuit board 2 is relatively low; the region where the connection assembly 3 is arranged is isolated from air by the second plastic packaging layer, so that the connection assembly 3 has better reliability and more stable connection.

[0103] Referring to Figure 14 The application also provides a packaging module 100, which comprises at least one packaging module 1, a circuit board 2, at least one connection assembly 3, a first plastic packaging layer 7 and a second plastic packaging layer 8. The packaging module 1 comprises a packaging carrier plate 11, the packaging carrier plate 11 comprises a first surface 111 and a second surface 112 arranged opposite to the first surface 111, and the first surface 111 is provided with an electronic element 14. The circuit board 2 comprises a third surface 21 and a fourth surface 22 arranged opposite to the third surface 21. Each packaging module 1 is arranged on the third surface 21, and at least one connection assembly is arranged between the second surface 112 of each packaging module 1 and the third surface 21, so that each packaging module 1 and the circuit board 2 are electrically connected through the connection assembly 3. The first plastic packaging layer 7 is formed between the second surface 112 and the third surface 21 and covers the connection assembly 3; and the second plastic packaging layer 8 is formed on the side of the first surface 111 away from the second surface 112 and covers the electronic element 14.

[0104] In the embodiment, the third pad 12 is arranged on the first surface 111, the first pad 13 is arranged on the second surface 112, the tin paste layer 15 (or tin ball) is arranged on the third pad 12, and the electronic element 14 is arranged on the tin paste layer 15. The insulating glue 16 is arranged on the bottom of the side of the electronic element 14 close to the tin paste layer 15, so that the stability and firmness of the electronic element 14 are improved, and the third pad 12 is prevented from being exposed.

[0105] In the embodiment, the electronic element 14 includes an active element and a passive element.

[0106] In the embodiment, the circuit board 2 is an FPC board.

[0107] In the embodiment, the connecting assembly 3 includes the first connecting sheet 31 and the second connecting sheet 32. The first connecting sheet 31 is in abutment with and electrically connected to the first pad 13 on the packaging module 1. The second connecting sheet 32 is in abutment with and electrically connected to the second pad 23 on the circuit board 2.

[0108] In the embodiment, the connecting assembly 3 further includes the connecting portion 33. One end of the first connecting sheet 31 and the second connecting sheet 32 is arranged opposite to each other and forms an opening 34, and the other end is connected to each other. The connecting assembly 3 is embedded in the first plastic sealing layer 7. The connecting area is isolated from air by plastic sealing material, so that the reliability is better, and the connection stability is better.

[0109] In the embodiment, the first connecting sheet 31 and the second connecting sheet 32 are metal springs. When the first connecting sheet 31 and the second connecting sheet 32 at one end of the opening 34 are close to each other under extrusion, a reverse elastic force is formed, so that the packaging module 1 and the circuit board 2 can be fully contacted, and the risk of poor contact or open circuit caused by dislocation of the connecting assembly 3 in the subsequent process is reduced.

[0110] In the embodiment, in combination with the description of Figure 8 , the first connecting sheet 31 includes two first contact ends 311, and the second connecting sheet 32 includes two second contact ends (not shown in the figure). The first connecting sheet 31 is electrically connected to the circuit board 2 through the two first contact ends 311, and the second connecting sheet 32 is electrically connected to the packaging module 1 through the two second contact ends. Through the above design, the resistance of the connecting assembly 3 can be reduced.

[0111] In the embodiment, the connecting assembly 3 is multiple. Multiple connecting assemblies 3 can realize multi-point electrical connection, and the stability of the electrical connection between the packaging module 1 and the circuit board 2 can be improved.

[0112] In the embodiment, the material of the first plastic sealing layer 7 and the second plastic sealing layer 8 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and the like.

[0113] Please refer to Figure 15 It can be understood that, in another embodiment, the packaging module 200 further comprises a support 6, and the connecting assembly 3 further comprises a connecting portion 33, and the first connecting sheet 31 and the second connecting sheet 32 are connected to each other at the end away from the opening 34 and connected to the connecting portion 33. That is, the first connecting sheet 31, the second connecting sheet 32, and the connecting portion 33 form a Y-shaped structure. The end of the connecting portion 33 away from the first connecting sheet 31 and the second connecting sheet 32 is fixed between the second surface 112 and the third surface 21 by the support 6. The connecting portion 33 is fixed on the support 6, which can ensure the stability of the connecting assembly 3 during the process.

[0114] In the embodiment, the material of the support 6 can be plastic, which is convenient for molding, low in cost, and light in weight.

[0115] In the embodiment, the connecting assembly 3 can be multiple, and the support 6 can be one. The multiple connecting assemblies 3 are arranged around the support 6, and the connecting portion 33 is fixed on the support 6. At this time, the support 6 is arranged inside the packaging module 200, and the multiple connecting assemblies 3 adopt one support 6, which can save the space inside the packaging module 200.

[0116] The packaging module provided by the application realizes interconnection between the packaging module 1 and the circuit board 2 by using the connecting assembly 3, without using tin paste and without going through a secondary high-temperature reflow process, so that the production process is shorter, multiple packaging modules can be manufactured at the same time, and the manufacturing efficiency of the packaging module 100 is effectively improved. In the plastic sealing process, the distance between the first connecting sheet 31 and the second connecting sheet 32 can be adjusted to ensure that the circuit board 2 and the packaging module 1 are in full contact and electrically connected, and the requirement for the surface flatness of the circuit board 2 is relatively low. The region where the connecting assembly 3 is arranged is isolated from air by the second plastic sealing layer, so that the reliability of the connecting assembly 3 is better, and the connection is more stable.

Claims

1. A method for manufacturing a package module, comprising: providing at least one package module, including a package substrate, the package substrate including a first surface and a second surface opposite to the first surface, the first surface being provided with electronic components; providing a circuit board, including a third surface and a fourth surface opposite to the third surface; placing each of the package modules on the third surface, and providing at least one connecting component between the second surface of each of the package modules and the third surface, so that each of the package modules and the circuit board are electrically connected through the connecting component, to obtain an intermediate body, wherein the connecting component includes a first connecting sheet, a second connecting sheet and a connecting part, the first connecting sheet is in contact with and electrically connected to a first pad on the second surface, the second connecting sheet is in contact with and electrically connected to a second pad on the third surface, one end of the first connecting sheet and one end of the second connecting sheet are spaced apart and form an opening, the other end of the first connecting sheet and the other end of the second connecting sheet are connected to each other and connected to the connecting part, the connecting part is fixed between the second surface and the third surface through a support, along the thickness direction of the intermediate body, the support is arranged outside the electronic components; forming a first plastic encapsulation layer and a second plastic encapsulation layer on the surface of the intermediate body, the first plastic encapsulation layer is formed between the second surface and the third surface and covers the connecting component, the second plastic encapsulation layer is formed on the first surface and covers the electronic components; and cutting the intermediate body after the first plastic encapsulation layer and the second plastic encapsulation layer are formed, along the thickness direction of the intermediate body, to remove the part of the intermediate body containing the support, to obtain at least one package module. The connecting component is a plurality of, the support is arranged around the electronic components, and the plurality of connecting components are fixed on the support.

2. The method for preparing the packaging module as described in claim 1, characterized in that, The support includes a fixed part and a hollow part, the connecting part is arranged on the fixed part, and the hollow part penetrates through the side wall of the support close to the connecting component and the other side wall of the support away from the connecting component.

3. The method for preparing the packaging module as described in claim 2, characterized in that, The connecting component is a plurality of, the plurality of connecting components are arranged around the support, and the plurality of connecting parts are fixed on the support.

4. The method for preparing the packaging module as described in claim 1, characterized in that, The method includes:

5. The package module prepared by the method of claim 1, wherein the package module is prepared by the method of claim 1. at least one package module, including a package substrate, the package substrate including a first surface and a second surface opposite to the first surface, the first surface being provided with electronic components; a circuit board, including a third surface and a fourth surface opposite to the third surface, each of the package modules is arranged on the third surface; ​ At least one connecting component is arranged between the second surface and the third surface of each of the packaging modules, so that each of the packaging modules and the circuit board are electrically connected through the connecting component. The connecting component includes a first connecting sheet, a second connecting sheet and a connecting part. The first connecting sheet is in contact with and electrically connected to the first pad on the second surface. The second connecting sheet is in contact with and electrically connected to the second pad on the third surface. The first connecting sheet and the second connecting sheet are arranged apart from each other at one end to form an opening, and are connected to each other at the other end and connected to the connecting part. A first plastic sealing layer is formed between the second surface and the third surface and covers the connecting component. A second plastic sealing layer is formed on the side of the first surface away from the second surface and covers the electronic component. The connecting part is fixed between the second surface and the third surface by a support.

6. The package module of claim 5, wherein the first and second package modules are mounted on the same substrate. There are a plurality of connecting components, and the plurality of connecting components are arranged around the support. The plurality of connecting parts are fixed on the support.

7. The package module of claim 6, wherein the first and second package modules are mounted on the same substrate. ​

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