A preparation process of plug-in blind hole HDI board

Abstract

The invention discloses a preparation process of a plug-in blind hole HDI board, belonging to the technical field of preparation processes of HDI boards. The invention proposes a preparation process of a plug-in blind hole HDI board, wherein a cutting device cuts an outer layer board and an inner layer board, and in a subsequent processing process, the outer layer board and the inner layer board are separated by an ascending action, and a glue injection device injects glue into the edges of the outer layer board and the inner layer board through subsequent glue injection, so that the two can be quickly combined together during subsequent pressing, and under the drive of a slide table, the glue injection tube can be used to rotate around a circular groove while the two maintain a sealed state, and the glue flowing into the glue storage box is continuously injected into the glue injection head through the glue injection tube, so as to be sprayed out from the glue injection head to spray glue on the edges of the separated inner layer board and the outer layer board, and the glue injection and cutting use the same power, thereby reducing costs, and in the subsequent pressing process, the two are tightly fitted together through glue.

Description

Technical Field

[0001] The invention relates to the technical field of HDI board preparation technology, and in particular to a preparation process of a plug-in type blind hole HDI board. Background Art

[0002] In the field of circuit boards, in order to achieve better functions on the same PCB board, it is necessary to install components of different welding types on the front and back sides of the same PCB. The HDI board with single-sided large-aperture blind holes can well meet the requirements of installing components of different welding types on the same PCB board.

[0003] The current method for making single-sided large-aperture back-drilled holes is: after the PCB board is pressed together, a blind hole is drilled by controlling the depth of the back-drilling method, and then the through-hole copper is deposited and the hole is filled with electroplating, pattern electroplating, and outer layer etching is performed to complete the metallization of the back-drilled hole, thereby forming a plug-in blind hole HDI board. However, this process method easily leads to insufficient depth of the plug-in blind hole, which makes it impossible to install components, and when the blind hole is metallized, it is easy to cause the copper at the bottom of the blind hole to be too thin, or even no copper at the bottom of the hole, resulting in poor conduction at the bottom of the plug-in blind hole. In response to the problems existing in the current process technology methods, this patent designs a new process method for making plug-in blind hole HDI boards, which can solve such problems well.

[0004] However, there are many problems in the prior art. For example, the depth-controlled back-drilling method is used to make blind holes. Due to a certain error in the thickness of the medium after pressing, it is easy to cause the back-drilling depth to be insufficient or too deep, resulting in an open circuit or a short circuit in the blind hole after metallization. During pattern electroplating, the blind hole formed by the back-drilling cannot exchange the solution well, and the bottom of the blind hole is prone to poor tin plating, resulting in no copper at the bottom of the blind hole after the outer layer is alkaline etched, which ultimately leads to an open circuit in the plug-in blind hole.

[0005] Patent number CN201610186958.3 is a preparation process for a stacked hole laser HDI board. The stacked hole conductive layer is formed by one pressing, one laser drilling, and the whole board hole filling and electroplating. There is no need for two pressings, two laser drillings, and the whole board hole filling and electroplating. This reduces the process, reduces costs, and improves production efficiency; completely improves the copper blistering problem; has great market prospects and economic value. However, the process is independently powered for clamping, glue injection, and cutting, which increases the cost of the equipment. Summary of the invention

[0006] The object of the present invention is to provide a preparation process of a plug-in type blind hole HDI board to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solution: a preparation process of a plug-in type blind hole HDI board, comprising the following steps;

[0008] S1: After the outer plate and the inner plate are stacked together by the stacking device, the cutting device cuts the outer plate and the inner plate as a whole, and the clamping device clamps the outer plate and lifts it away from the inner plate;

[0009] S2: copper reduction treatment is performed on the inner layer board with through holes;

[0010] S3: Perform blind hole drilling on the inner layer board with through holes by using a drilling device;

[0011] S4: After drilling, the inner layer board is processed and moved to the stacking device;

[0012] S5: The position where the outer layer plate is aligned with the through hole is processed by the drilling device through the through hole;

[0013] S6: The through holes of the outer layer plate are aligned with the inner layer plate, glue is applied to the opposite edges of the outer layer plate and the inner layer plate by a glue injection device, and the outer layer plate and the inner layer plate are pressed together by a superposition device.

[0014] Furthermore, the stacking device includes an outer frame, an upper support plate, a lower support plate, an upper spring, a suction cup, a suction cup seat and a lifting assembly, wherein the lower support plate is fixed to the bottom end of the outer frame, the upper support plate is movably connected to the outer frame, an upper spring is fixed on the surface of the upper support plate facing the lower support plate, the bottom end of the upper spring is connected to the suction cup seat, and a suction cup is fixed on the suction cup seat;

[0015] One end of the lifting assembly is installed on the top surface of the upper supporting plate, and the other end of the lifting assembly is connected to the outer frame.

[0016] Furthermore, the lifting assembly includes a motor, a reducer, a screw and a guide sleeve. The motor, the reducer and the guide sleeve are installed on the outer frame. The motor is connected to the reducer. The screw connected to the reducer is meshed with the guide sleeve and fixedly connected to the upper support plate.

[0017] Furthermore, the cutting device comprises a cutting track, a slide, a moving motor, a moving wheel, a cutting motor and a cutting wheel, the cutting track is sleeved on the inner side of the outer frame, the bottom of the cutting track is inserted into the movable slide, the slide is provided with a moving motor, the moving wheel connected to the moving motor abuts against the cutting track, the bottom of the slide is connected to the cutting motor, and the cutting motor is provided with a cutting wheel;

[0018] The bending part of the cutting track is processed by arc.

[0019] Furthermore, the clamping device includes a negative pressure air pump, a left clamping plate, a right clamping plate, an air pipe, and a guide rod. The negative pressure air pump is mounted on the upper support plate. A four-way pipe is connected to the negative pressure air pump, wherein the air pipes connected to the two ends of the four-way pipe are respectively arranged on both sides of the upper support plate, one end of the guide rod is inserted into the air pipe for sealing connection, and the other ends of the guide rods on both sides are respectively fixed to the left clamping plate and the right clamping plate, and the left clamping plate and the right clamping plate are staggered and clamped on both sides of the outer plate;

[0020] Furthermore, the remaining pipes of the four-way pipe are connected to the suction cup seat through the suction cup seat, and descend through the upper support plate driven by the lifting assembly. The suction cup of the upper support plate contacts the surface of the outer plate, and the negative pressure air pump extracts the gas in the four-way pipe during operation. Then the left clamping plate and the right clamping plate move toward each other to clamp the two sides of the outer plate, and the outer plate is firmly clamped by the suction cup and the left clamping plate and the right clamping plate by extracting the gas between the suction cup and the upper support plate.

[0021] Furthermore, the drilling device includes a drilling motor, a drill shaft, a drill bit, a dust hood, a movable frame and a movable sleeve. The movable frame is L-shaped, one end of the movable frame is inserted into the bearing of the workbench, and the other end of the movable frame is sleeved with a telescopic outer rod, wherein the movable sleeve is arranged on the port of the outer rod, and the drilling motor is fixed on the top surface of the movable sleeve, the drilling motor is connected to one end of the drill shaft, and the other end of the drill shaft is fixed to the drill bit through a coupling, the movable frame rotates and adjusts the position of the movable sleeve, and the drill bit rotates under the drive of the drilling motor.

[0022] Furthermore, the dust hood is fixed to the bottom of the movable sleeve, wherein the drill shaft passes through the dust hood, and the dust hood is connected to the air pump on the movable frame through a pipeline, and the air pump extracts dust left by drilling in the dust hood.

[0023] Furthermore, the glue injection device includes a glue storage box, a pump body, a delivery pipe, a circular groove, an arc cover, a glue injection pipe and a glue injection head. One end of the pump body is connected to the glue storage box, and the other end of the pump body is connected to the delivery pipe. The delivery pipe is connected to the top of the cutting track and is connected to the circular groove at the top of the cutting track. The arc cover is embedded in the circular groove for sealing connection, and the two are in rotational contact. The glue injection pipe connected to the arc cover is connected to the circular groove, and an angle-adjustable glue injection head is also fixed on the glue injection pipe.

[0024] Furthermore, the glue injection tube is a hollow steel pipe, and the glue injection tube is fixed on the slide. When the slide moves around the cutting track, the arc cover rotates synchronously around the circular groove, and the glue in the glue storage box passes through the circular groove and the glue injection tube and the glue injection head to be coated on the edges of the outer plate and the inner plate.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The present invention proposes a preparation process for a plug-in blind hole HDI board. By lifting the upper support plate, the outer plate connected thereto can also rise or fall. When the outer plate rises, the upper plate or the inner plate can be processed respectively through subsequent drilling. At the same time, before processing, the outer plate and the inner plate can be initially superimposed to facilitate the cutting device to cut the outer plate and the inner plate. In the subsequent processing, the outer plate and the inner plate are separated by the rising action, and the glue injection device injects glue to the edges of the outer plate and the inner plate through subsequent glue injection, so that the two can be quickly combined together during the subsequent pressing.

[0027] 2. The present invention proposes a preparation process for a plug-in blind hole HDI board, in which the bending part of the cutting track is treated with an arc, and by treating the corner with an arc, the subsequent turning is convenient during the movement of the slide, and the smoothness of the movement is also ensured, and the end corners of the processed inner and outer layers are also arc-shaped, which reduces the cutting process of the rounded corners in the subsequent processing.

[0028] 3. The present invention proposes a preparation process for a plug-in blind hole HDI board, which clamps the outer layer board by means of a negative pressure air pump while the suction cup assists in fixing the upper support plate, thereby ensuring the stability of the movement of the upper support plate during the rising or falling process.

[0029] 4. The present invention proposes a preparation process for a plug-in blind hole HDI board. Under the drive of a slide, a glue injection tube can be used to rotate around a circular groove while the two remain sealed. The glue flowing into the glue storage box is continuously injected into the glue injection head through the glue injection tube, and then sprayed out from the glue injection head to spray glue on the edges of the separated inner and outer layers. The same power is used for one circle of glue injection and cutting, which reduces costs. In the subsequent pressing process, the two are tightly fitted together by glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is the overall structure diagram of the present invention;

[0031] Figure 2 It is the outer frame structure diagram of the present invention;

[0032] Figure 3 This is a diagram showing the stacking device and the clamping device of the present invention in a non-working state;

[0033] Figure 4 It is a working state diagram of the superposition device and the clamping device of the present invention;

[0034] Figure 5 It is a structural diagram of the glue injection device of the present invention;

[0035] Figure 6It is an exploded view of the glue injection device of the present invention;

[0036] Figure 7 For the present invention Figure 6 A magnified image

[0037] Figure 8 It is a structural diagram of the cutting device of the present invention;

[0038] Fig. 9 For the present invention Figure 8 Enlarged view of point B.

[0039] In the figure: 1. stacking device; 11. outer frame; 12. upper support plate; 13. lower support plate; 14. upper spring; 15. suction cup; 16. suction cup seat; 17. lifting assembly; 171. motor; 172. reducer; 173. screw; 174. guide sleeve; 2. cutting device; 21. cutting track; 22. slide; 23. moving motor; 24. moving wheel; 25. cutting motor; 26. cutting wheel; 3 , clamping device; 31, negative pressure air pump; 32, left clamping plate; 33, right clamping plate; 34, air pipe; 35, guide rod; 4, drilling device; 41, drilling motor; 42, drill shaft; 43, drill bit; 44, dust hood; 45, movable sleeve; 46, movable frame; 5, glue injection device; 51, glue storage box; 52, pump body; 53, delivery pipe; 54, circular groove; 55, arc cover; 56, glue injection tube; 57, glue injection head. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] See also Figure 1-9 , a preparation process of a plug-in type blind hole HDI board, comprising the following steps;

[0042] Step 1: After the outer layer plate and the inner layer plate are stacked together by the stacking device 1, the cutting device 2 cuts the outer layer plate and the inner layer plate as a whole, and the clamping device 3 clamps the outer layer plate and lifts it away from the inner layer plate;

[0043] Step 2: Reduce the copper content of the inner layer board with through holes;

[0044] Step 3: Perform blind hole drilling on the inner layer board with through holes by using the drilling device 4;

[0045] Step 4: After the drilling is completed, the inner layer board is processed and moved to the stacking device 1;

[0046] Step 5: The outer plate is aligned with the through hole and a through hole is processed by the drilling device 4;

[0047] Step 6: The through holes of the outer layer plate are aligned with those of the inner layer plate, glue is applied to the opposite edges of the outer layer plate and the inner layer plate by the glue injection device 5, and the outer layer plate and the inner layer plate are pressed together by the stacking device 1.

[0048] The stacking device 1 includes an outer frame 11, an upper support plate 12, a lower support plate 13, an upper spring 14, a suction cup 15, a suction cup seat 16 and a lifting assembly 17. The lower support plate 13 is fixed to the bottom end of the outer frame 11. The outer frame 11 is installed on a workbench, and the cross-section of the outer frame 11 is rectangular. The upper support plate 12 is movably connected to the outer frame 11. The upper support plate 12 can move up and down the outer frame 11. An upper spring 14 is fixed on the surface of the upper support plate 12 facing the lower support plate 13. The bottom end of the upper spring 14 is connected to the suction cup seat 16. The suction cup 15 is fixed on the suction cup seat 16. Through the setting of the upper spring 14, when the suction cup 15 is adsorbed on the outer plate when the upper support plate 12 descends, there is a certain buffer to avoid direct action on the outer plate.

[0049] One end of the lifting assembly 17 is mounted on the top surface of the upper support plate 12 , and the other end of the lifting assembly 17 is connected to the outer frame 11 .

[0050] The lifting assembly 17 includes a motor 171, a reducer 172, a screw 173 and a guide sleeve 174. The motor 171, the reducer 172 and the guide sleeve 174 are installed on the outer frame 11. The motor 171 is connected to the reducer 172. The screw 173 connected to the reducer 172 is meshed with the guide sleeve 174. The guide sleeve 174 is fixedly connected to the upper support plate 12. After the motor 171 drives the reducer 172 to reduce the rotation rate, the reducer 172 rotates through the screw 173. The screw 173 rotates forward or backward under the drive of the motor 171, so that the guide sleeve 174 can rise or fall along the outer frame 11, thereby driving the upper support plate 12. The purpose of the support plate 12 rising or falling is to achieve the rising or falling of the outer plate connected thereto by the purpose of lifting and lowering the upper support plate 12. When the outer plate rises, the upper plate or the inner plate can be processed separately through subsequent drilling. At the same time, before processing, the outer plate and the inner plate can be initially overlapped to facilitate the cutting device 2 to cut the outer plate and the inner plate. In the subsequent processing, the outer plate and the inner plate are separated by the rising action, and the glue injection device 5 injects glue to the edges of the outer plate and the inner plate through subsequent glue injection, so that the two can be quickly combined together during the subsequent pressing.

[0051] The cutting device 2 includes a cutting track 21, a slide 22, a moving motor 23, a moving wheel 24, a cutting motor 25 and a cutting wheel 26. The cutting track 21 is sleeved on the inner side of the outer frame 11. The bottom of the cutting track 21 is stuck in the movable slide 22. The slide 22 is provided with a moving motor 23. The moving wheel 24 connected to the moving motor 23 is against the cutting track 21. The moving motor 23 is provided with power. After the moving motor 23 receives an instruction, the moving motor 23 drives the moving wheel 24 to rotate. Since the slide 22 can move along the cutting track 21, during the rotation of the moving wheel 24, the slide 22 moves around the set cutting track 21 through the friction between the two. The bottom of the slide 22 is connected to the cutting motor 25. The cutting wheel 26 is installed on the cutting motor 25. In the process of moving, the cutting motor 25 can drive the cutting wheel 26 to rotate. The rotation of the cutting wheel 26 is used to cut the inner plate and the outer plate.

[0052] The bending part of the cutting track 21 is processed with an arc, and by processing the corners with an arc, the subsequent turning is facilitated during the movement of the slide 22, and the smoothness of the movement is ensured. The end corners of the processed inner and outer plates are also arc-shaped, and the cutting process of the rounded corners is reduced in the subsequent processing process.

[0053] The clamping device 3 includes a negative pressure air pump 31, a left clamping plate 32, a right clamping plate 33, an air pipe 34, and a guide rod 35. The negative pressure air pump 31 is installed on the upper support plate 12. A four-way pipe is connected to the negative pressure air pump 31, wherein the negative pressure air pump 31 introduces or extracts gas into the four-way pipe, and the air pipes 34 connected to both ends of the four-way pipe are respectively arranged on both sides of the upper support plate 12, wherein one end of the four-way pipe is connected to the negative pressure air pump 31, and the other end of the guide rod 35 is inserted into the air pipe 34 for sealing connection, and the other ends of the guide rods 35 on both sides are respectively connected to the left clamping plate 32 and the right clamping plate 33. The left clamping plate 32 and the right clamping plate 33 are fixed, and the left clamping plate 32 and the right clamping plate 33 are staggered and clamped on both sides of the outer layer plate. When the negative pressure air pump 31 introduces gas into the two air pipes 34, the guide rod 35 can be telescopically moved along the air pipes 34, so as to adjust the positions of the left clamping plate 32 and the right clamping plate 33. The left clamping plate 32 and the right clamping plate 33 can move towards each other or in opposite directions under the drive of the air pipe 34. When the left clamping plate 32 and the right clamping plate 33 move towards each other, they are used to clamp the outer layer plate. When the left clamping plate 32 and the right clamping plate 33 move in opposite directions, the left clamping plate 32 and the right clamping plate 33 loosen the outer layer plate.

[0054] The remaining pipes of the four-way pipe are connected to the suction cup seat 16 and the suction cup 15, and the upper support plate 12 is lowered by the drive of the lifting assembly 17. The suction cup 15 of the upper support plate 12 contacts the surface of the outer plate, and the negative pressure air pump 31 extracts the gas in the four-way pipe during operation. Then the left clamping plate 32 and the right clamping plate 33 move toward each other to clamp the two sides of the outer plate, and the gas between the suction cup 15 and the upper support plate 12 is extracted, and the outer plate is firmly clamped by the suction cup 15 and the left clamping plate 32 and the right clamping plate 33. The outer plate is clamped by the negative pressure air pump 31, and the suction cup 15 assists in fixing the upper support plate 12, thereby ensuring the stability of the movement of the upper support plate 12 during the rising or falling process.

[0055] The drilling device 4 includes a drilling motor 41, a drilling shaft 42, a drill bit 43, a dust cover 44, a movable frame 46 and a movable sleeve 45. The movable frame 46 is L-shaped. The movable frame 46 is set so that one end of it is in an extended state. One end of the movable frame 46 is inserted into the bearing of the workbench. The movable frame 46 can rotate around the bearing of the workbench. The other end of the movable frame 46 is sleeved with a telescopic outer rod, and the outer rod can move along the movable frame 46. During the movement of the outer rod around the movable frame 46, it is used to adjust its diameter range and allow its drill bit 43 to move to a specified position. The movable sleeve 45 is arranged on the port of the outer rod, and the movable sleeve 45 can move upward or downward and rotate along the outer rod to adjust the drilling angle thereof. A drilling motor 41 is fixed on the top surface of the movable sleeve 45, and the drilling motor 41 is connected to one end of the drilling shaft 42, and the other end of the drilling shaft 42 is fixed to the drill bit 43 through a coupling. The movable frame 46 rotates and adjusts the position of the movable sleeve 45, and the drill bit 43 rotates under the drive of the drilling motor 41. The drilling motor 41 is fixed to the movable sleeve 45 by bolts, which is convenient for subsequent installation and disassembly;

[0056] And the dust hood 44 is fixed at the bottom of the movable sleeve 45, wherein the drill shaft 42 passes through the dust hood 44, and the dust hood 44 is connected to the air pump on the movable frame 46 through a pipeline, and the air pump extracts the dust left by drilling in the dust hood 44. After the drilling motor 41 receives the instruction, the drilling motor 41 drives the drill shaft 42 to rotate. During the rotation of the drill shaft 42, the drill bit 43 also rotates at the same time. The drill bit 43 is rotated to drill holes, and through the rotation of the movable sleeve 45, the drill bit 43 can be rotated to drill holes in the upward or downward direction, so that the outer plate or the inner plate at the upper and lower positions can be drilled.

[0057] The glue injection device 5 includes a glue storage box 51, a pump body 52, a delivery pipe 53, a circular groove 54, an arc cover 55, a glue injection pipe 56 and a glue injection head 57. One end of the pump body 52 is connected to the glue storage box 51, and the other end of the pump body 52 is connected to the delivery pipe 53. The delivery pipe 53 is connected to the top of the cutting track 21 and is communicated with the circular groove 54 at the top of the cutting track 21. The arc cover 55 is embedded in the circular groove 54 for sealing connection, and the two are in rotational contact. The glue injection pipe 56 connected to the arc cover 55 is communicated with the circular groove 54. The glue injection pipe 56 is also fixed with an angle-adjustable glue injection head 57. The glue storage box 51 stores glue for bonding, and the pump body 52 draws glue into the delivery pipe 53 after working, so that it flows into the circular groove 54. During the continuous injection process, the circular groove 54 is filled until it flows into the glue injection pipe 56.

[0058] The glue injection tube 56 is a hollow steel pipe, and the glue injection tube 56 is fixed on the slide 22 through a telescopic tube. When the slide 22 moves around the cutting track 21, the arc cover 55 rotates around the circular groove 54 synchronously, and the glue in the glue storage box 51 is coated on the edges of the outer plate and the inner plate through the circular groove 54 and the glue injection tube 56 through the glue injection head 57. The glue injection tube 56 can rotate around the circular groove 54 while the two remain in a sealed state. The glue flowing into the glue storage box 51 is continuously injected into the glue injection head 57 through the glue injection tube 56, and then sprayed out from the glue injection head 57 to spray glue on the edges of the separated inner plate and outer plate. In the subsequent pressing process, the two are tightly fitted together by glue.

[0059] In summary, in the preparation process of the plug-in blind hole HDI board of the present invention, the bottom end of the upper spring 14 is connected to the suction cup seat 16, and the suction cup seat 16 is fixed with a suction cup 15. Through the setting of the upper spring 14, when the upper support plate 12 descends, the suction cup 15 is adsorbed on the outer plate, which has a certain buffer to avoid direct action on the outer plate; through the purpose of the upper support plate 12 rising and falling, the outer plate connected thereto can also rise or fall. When the outer plate rises, the upper plate or the inner plate can be processed respectively through subsequent drilling. At the same time, before processing, the outer plate and the inner plate can be initially superimposed, which is convenient for the cutting device 2 to be external The outer layer plate and the inner layer plate are cut, and in the subsequent processing, the outer layer plate and the inner layer plate are separated by the rising action, and the glue injection device 5 injects glue on the edges of the outer layer plate and the inner layer plate through subsequent glue injection, and the glue injection tube 56 is coated on the edges of the outer layer plate and the inner layer plate through the glue injection head 57. The glue injection tube 56 can be rotated around the circular groove 54 while the two remain in a sealed state. The glue flowing into the glue storage box 51 is continuously injected into the glue injection head 57 through the glue injection tube 56, and then sprayed out from the glue injection head 57 to spray glue on the edges of the separated inner layer plate and the outer layer plate. In the subsequent pressing process, the two are tightly fitted together by glue.

[0060] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A preparation process of a plug-in type blind hole HDI board, characterized in that: The steps include: S1: After the outer layer plate and the inner layer plate are stacked together by the stacking device (1), the cutting device (2) cuts the outer layer plate and the inner layer plate as a whole, and the clamping device (3) clamps the outer layer plate and lifts it away from the inner layer plate; S2: copper reduction treatment is performed on the inner layer board with through holes; S3: performing blind hole drilling on the inner layer board having through holes by using the drilling device (4); S4: After the drilling is completed, the inner layer plate is processed and moved to the stacking device (1); S5: a through hole is machined through the outer plate at a position aligned with the through hole by a drilling device (4); S6: the through holes of the outer plate are aligned with the inner plate, glue is applied to the opposite edges of the outer plate and the inner plate by means of the glue injection device (5), and the outer plate and the inner plate are pressed together by means of the stacking device (1); The stacking device (1) comprises an outer frame (11), an upper support plate (12), a lower support plate (13), an upper spring (14), a suction cup (15), a suction cup seat (16) and a lifting assembly (17), wherein the lower support plate (13) is fixed to the bottom end of the outer frame (11), the upper support plate (12) is movably connected to the outer frame (11), an upper spring (14) is fixed to the surface of the upper support plate (12) facing the lower support plate (13), the bottom end of the upper spring (14) is connected to the suction cup seat (16), and the suction cup (15) is fixed to the suction cup seat (16); One end of the lifting assembly (17) is mounted on the top surface of the upper support plate (12), and the other end of the lifting assembly (17) is connected to the outer frame (11); The clamping device (3) comprises a negative pressure air pump (31), a left clamping plate (32), a right clamping plate (33), an air pipe (34), and a guide rod (35). The negative pressure air pump (31) is mounted on the upper support plate (12). A four-way pipe is connected to the negative pressure air pump (31), wherein the air pipes (34) connected to both ends of the four-way pipe are respectively arranged on both sides of the upper support plate (12). One end of the guide rod (35) is inserted into the air pipe (34) for sealing connection. The other ends of the guide rods (35) on both sides are respectively fixed to the left clamping plate (32) and the right clamping plate (33). The left clamping plate (32) and the right clamping plate (33) are staggered and clamped on both sides of the outer plate. The remaining pipe of the four-way pipe passes through the suction cup seat (16) and is connected to the suction cup (15), and is lowered through the upper support plate (12) under the drive of the lifting assembly (17), and the suction cup (15) of the upper support plate (12) contacts the surface of the outer plate. The negative pressure air pump (31) extracts the gas in the four-way pipe during operation, and the left clamping plate (32) and the right clamping plate (33) move towards each other to clamp the two sides of the outer plate, and the outer plate is firmly clamped by the suction cup (15) and the left clamping plate (32) and the right clamping plate (33) by extracting the gas between the suction cup (15) and the upper support plate (12); The drilling device (4) comprises a drilling motor (41), a drilling shaft (42), a drill bit (43), a dust cover (44), a movable frame (46) and a movable sleeve (45). The movable frame (46) is L-shaped. One end of the movable frame (46) is inserted into a bearing of a workbench. The other end of the movable frame (46) is sleeved with a telescopic outer rod. The movable sleeve (45) is mounted on the end of the outer rod. The drilling motor (41) is fixed on the top surface of the movable sleeve (45). The drilling motor (41) is connected to one end of the drilling shaft (42). The other end of the drilling shaft (42) is fixed to the drill bit (43) via a coupling. The movable frame (46) rotates and adjusts the position of the movable sleeve (45). The drill bit (43) rotates under the drive of the drilling motor (41). The rotation of the movable sleeve (45) allows the drill bit (43) to drill upward or downward by rotating, thereby drilling holes in the outer layer plate or the inner layer plate at the upper and lower positions.

2. A process for preparing a plug-in type blind hole HDI board as claimed in claim 1, characterized in that: The lifting assembly (17) comprises a motor (171), a reducer (172), a screw (173) and a guide sleeve (174). The motor (171), the reducer (172) and the guide sleeve (174) are mounted on the outer frame (11). The motor (171) is connected to the reducer (172). The screw (173) connected to the reducer (172) is meshed with the guide sleeve (174). The guide sleeve (174) is fixedly connected to the upper support plate (12).

3. A process for preparing a plug-in type blind hole HDI board as claimed in claim 1, characterized in that: The cutting device (2) comprises a cutting track (21), a slide (22), a moving motor (23), a moving wheel (24), a cutting motor (25) and a cutting wheel (26); the cutting track (21) is sleeved on the inner side of the outer frame (11); the bottom of the cutting track (21) is inserted into the movable slide (22); the moving motor (23) is arranged in the slide (22); the moving wheel (24) connected to the moving motor (23) abuts against the cutting track (21); the bottom of the slide (22) is connected to the cutting motor (25); and the cutting wheel (26) is installed on the cutting motor (25); The bending part of the cutting track (21) is processed into an arc.

4. A process for preparing a plug-in type blind hole HDI board as claimed in claim 1, characterized in that: The dust hood (44) is fixed to the bottom of the movable sleeve (45), wherein the drill shaft (42) passes through the dust hood (44), and the dust hood (44) is connected to an air pump on the movable frame (46) through a pipeline, and the air pump extracts dust left by drilling holes in the dust hood (44).

5. The process for preparing a plug-in type blind hole HDI board according to claim 3, characterized in that: The glue injection device (5) comprises a glue storage box (51), a pump body (52), a delivery pipe (53), a circular groove (54), an arc cover (55), a glue injection pipe (56) and a glue injection head (57). One end of the pump body (52) is connected to the glue storage box (51), and the other end of the pump body (52) is connected to the delivery pipe (53). The delivery pipe (53) is connected to the top of the cutting track (21) and communicates with the circular groove (54) at the top of the cutting track (21). The arc cover (55) is embedded in the circular groove (54) for sealing connection, and the two are in rotational contact. The glue injection pipe (56) connected to the arc cover (55) is communicated with the circular groove (54), and an angle-adjustable glue injection head (57) is also fixed to the glue injection pipe (56).

6. A process for preparing a plug-in type blind hole HDI board as claimed in claim 5, characterized in that: The glue injection tube (56) is a hollow steel pipe, and the glue injection tube (56) is fixed on the slide (22). When the slide (22) moves around the cutting track (21), the arc cover (55) rotates around the circular groove (54) synchronously, and the glue in the glue storage box (51) passes through the circular groove (54) and the glue injection tube (56) and the glue injection head (57) to be coated on the edges of the outer plate and the inner plate.

Images