Inkjet head cleaning method

Abstract

An inkjet head cleaning method includes: a step of moving an inkjet head carrier including a plurality of inkjet heads in a first direction; a step of moving a pressurizing structure including a plurality of pressure application portions fixed by a bonding member and arranged in the first direction of the inkjet head carrier in a second direction opposite to the first direction; and a step of curing the bonding member in a state where the inkjet head carrier and the pressurizing structure are pressed.

Description

Technical Field

[0001] This invention relates to an inkjet head cleaning system and a method for cleaning inkjet heads, and more specifically, to an inkjet head cleaning system and method with improved cleaning efficiency. Background Technology

[0002] In recent years, with technological advancements, display products have been produced that achieve both miniaturization and lightweight design while delivering superior performance. To date, cathode ray tube (CRT) televisions have been widely used due to their numerous advantages in performance and price. However, display devices that overcome the limitations of CRTs and offer advantages such as miniaturization, lightweight design, and low power consumption (e.g., plasma displays, liquid crystal displays, and organic light-emitting diode displays) are gaining significant attention in terms of miniaturization and portability.

[0003] In manufacturing the display device, an inkjet printing method is used, which has advantages such as cost reduction. In this inkjet printing method, cleaning of the inkjet head is essential; therefore, various devices for cleaning the inkjet head have been developed. Summary of the Invention

[0004] One object of the present invention is to provide an inkjet head cleaning system that improves cleaning efficiency.

[0005] Another object of the present invention is to provide an inkjet head cleaning method that improves cleaning efficiency.

[0006] However, the purpose of this invention is not limited to the purpose described above, and various extensions can be made without departing from the spirit and scope of this invention.

[0007] To achieve an objective of the present invention, an inkjet cleaning system according to one embodiment may include: an inkjet head carrier including a plurality of inkjet heads; a pressurizing structure disposed in a first direction of the inkjet head carrier and including a plurality of pressure applying portions fixed by a coupling member; and a cleaning plate disposed between the inkjet head carrier and the pressurizing structure.

[0008] In one embodiment, the pressurizing structure may include: a movable portion movable in the first direction and in a second direction opposite to the first direction; and a connecting portion disposed on the movable portion, wherein the plurality of pressure applying portions are fixed to the connecting portion by the connecting member.

[0009] In one embodiment, the plurality of inkjet heads and the plurality of pressure application portions may overlap each other.

[0010] In one embodiment, the bonding component may include one or more selected from naturally curing resins, thermosetting resins, and ultraviolet curing resins.

[0011] In one embodiment, the bonding component may be cured while the inkjet head carrier and the pressure structure are pressed together.

[0012] In one embodiment, the pressure application part may include one or more materials selected from rubber, foamed silicone, metal, glass, and quartz.

[0013] In one embodiment, the inkjet cleaning system may further include a plurality of guide rollers supporting the cleaning plate such that the cleaning plate is disposed between the inkjet head transport body and the pressurized structure.

[0014] In one embodiment, the inkjet cleaning system may further include: a cleaning sheet supply unit for supplying the cleaning sheet to the guide roller; and a cleaning sheet recovery unit for recovering the cleaning sheet used on the inkjet head during cleaning on the guide roller.

[0015] To achieve other objectives of the present invention as described above, an embodiment of an inkjet head cleaning method includes: a step of moving an inkjet head carrier including a plurality of inkjet heads in a first direction; a step of moving a pressure structure disposed in the first direction of the inkjet head carrier and including a plurality of pressure application portions fixed by a coupling member in a second direction opposite to the first direction; and a step of curing the coupling member while the inkjet head carrier and the pressure structure are pressed together.

[0016] In one embodiment, the bonding component may comprise a naturally curing resin, and the step of curing the bonding component may be to cure the bonding component by natural curing.

[0017] In one embodiment, the bonding component may include a thermosetting resin, and the step of curing the bonding component involves heating the bonding component to cure it.

[0018] In one embodiment, the bonding component may comprise an ultraviolet-curable resin, and the step of curing the bonding component may involve applying ultraviolet light to the bonding component to cure it.

[0019] In one embodiment, the inkjet head carrier and the pressurizing structure may be pressed together with a cleaning pad disposed between the inkjet head carrier and the pressurizing structure.

[0020] In one embodiment, the inkjet head cleaning method may further include, after the step of curing the bonding component, a step of moving the inkjet head carrier in the second direction; and a step of moving the pressurized structure in the first direction.

[0021] In one embodiment, the inkjet head cleaning method may further include, after the step of moving the pressurized structure in the first direction, a step of moving the cleaning plate upward in a third direction perpendicular to the first direction between the inkjet head carrier and the pressurized structure.

[0022] In one embodiment, the inkjet head cleaning method may further include, after the step of moving the cleaning pad upward in the third party, the steps of: moving the inkjet head carrier in the first direction; moving the pressure structure in the second direction; and pressing the inkjet head carrier and the pressure structure together with the cleaning pad sandwiched between them.

[0023] In one embodiment, the cleaning sheet may be disposed between the inkjet head transport body and the pressurized structure via a plurality of guide rollers.

[0024] In one embodiment, the pressure application part may include one or more materials selected from rubber, foamed silicone, metal, glass, and quartz.

[0025] (Invention Effects)

[0026] In one embodiment of the inkjet head cleaning system and method of the present invention, the inkjet head cleaning system can fix the pressure application part for cleaning the inkjet head to the pressure structure by means of a connecting member. At this time, the connecting member is solidified in the state of being pressed against the inkjet head, thereby fixing the position of the pressure application part so that the pressure application part and the inkjet head can be accurately engaged with each other.

[0027] However, the effects of the present invention are not limited to those described above, and various extensions can be made without departing from the spirit and scope of the present invention. Attached Figure Description

[0028] Figure 1 This is a diagram illustrating one embodiment of a display device.

[0029] Figure 2 It means along Figure 1 A cross-sectional view of an embodiment taken by line II′.

[0030] Figure 3 This is a block diagram illustrating an inkjet head cleaning system according to an embodiment of the present invention.

[0031] Figure 4 It means including in Figure 3 A diagram of the inkjet head transporter in an inkjet head cleaning system.

[0032] Figure 5 It means along Figure 4 A cross-sectional view of an embodiment taken by the AA′ line.

[0033] Figure 6 It means along Figure 4 A cross-sectional view of an embodiment taken by the BB' line.

[0034] Figure 7 This is a diagram illustrating an inkjet head cleaning system according to an embodiment of the present invention.

[0035] Figures 8a to 8d This is a diagram illustrating an inkjet head cleaning method according to an embodiment of the present invention.

[0036] (Symbol Explanation)

[0037] CAR: Inkjet head transporter; PS: Pressurized structure; GR: Guide roller; IKH: Inkjet head; SF: Support frame; ES: Exit point; FE1, FE2: Fixing components; TP: Transporter; BM: Connecting component; CP: Connecting component; SP: Cleaning sheet supply unit; RP: Cleaning sheet recovery unit; CS: Cleaning sheet. Detailed Implementation

[0038] Hereinafter, the display device according to various embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same or similar reference numerals are used for the same structural elements in the drawings.

[0039] Figure 1 This is a diagram illustrating one embodiment of a display device.

[0040] Reference Figure 1 One embodiment of the display device 10 may include a first pixel region PA1, a second pixel region PA2, a third pixel region PA3, and a non-pixel region NPA.

[0041] A first pixel region PA1 emits a first light L1 of a first color, a second pixel region PA2 emits a second light L2 of a second color, and a third pixel region PA3 emits a third light L3 of a third color. In one embodiment, the first color can be red, the second color can be green, and the third color can be blue. In this case, the first pixel region PA1 can be a red pixel region, the second pixel region PA2 can be a green pixel region, and the third pixel region PA3 can be a blue pixel region.

[0042] The first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 can form a single pixel region. In this case, the pixel region can emit light from a mixture of the first light L1, the second light L2, and the third light L3.

[0043] A non-pixel region NPA can be located between a first pixel region PA1, a second pixel region PA2, and a third pixel region PA3. For example, a non-pixel region NPA can surround the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3 on a plane. A non-pixel region NPA may not emit light.

[0044] Figure 2 It means along Figure 1 A cross-sectional view of an embodiment taken by line II′.

[0045] Reference Figure 2 The display device 10 may include a first substrate 110, a transistor 120, a light-emitting element 140, a thin film encapsulation layer 150, a dam layer 260, a color conversion layer 250, a color filter layer 230, a light-shielding layer 220, and a low-reflection layer 400.

[0046] The first substrate 110 may be a transparent or opaque insulating substrate. In one embodiment, the first substrate 110 may include glass, quartz, etc. In other embodiments, the first substrate 110 may include organic insulating materials such as polyimide, polycarbonate, polyethylene terephthalate, polyacrylate, etc.

[0047] The active pattern 121 may be disposed on the first substrate 110. In one embodiment, the active pattern 121 may include amorphous silicon, polycrystalline silicon, etc. In other embodiments, the active pattern 121 may include oxide semiconductor.

[0048] The gate insulating layer 131 may be disposed on the first substrate 110 and cover the active pattern 121. The gate insulating layer 131 may include an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxide nitride.

[0049] The gate electrode 122 can be disposed on the gate insulating layer 131 and overlap with the active pattern 121. The gate electrode 122 may include a conductive material such as copper (Cu), molybdenum (Mo), titanium (Ti), or aluminum (Al).

[0050] Interlayer insulating layer 132 may be disposed on gate insulating layer 131 and cover gate electrode 122. Interlayer insulating layer 132 may include inorganic insulating material such as silicon oxide, silicon nitride, or silicon nitride.

[0051] The source electrode 123 and drain electrode 124 can be disposed on the interlayer insulating layer 132 and connected to the active pattern 121. The source electrode 123 and drain electrode 124 can include conductive materials such as copper (Cu), molybdenum (Mo), titanium (Ti), and aluminum (Al).

[0052] The active pattern 121, gate electrode 122, source electrode 123, and drain electrode 124 can form a transistor 120. The transistor 120 can be disposed in each of the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3.

[0053] The planarization layer 133 can be disposed on the interlayer insulating layer 132 and cover the source electrode 123 and the drain electrode 124. The planarization layer 133 may include inorganic insulating materials such as silicon oxide, silicon nitride, and silicon nitride, and / or organic insulating materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin, and benzocyclobutene.

[0054] Pixel electrode 141 can be disposed on planarization layer 133 and connected to drain electrode 124. Pixel electrode 141 may include a transparent conductive layer and a reflective conductive layer. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), etc., and the reflective conductive layer may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pb), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), etc. In one embodiment, pixel electrode 141 may have a stacked structure of ITO, Ag, and ITO. In this case, pixel electrode 141 may be a reflective electrode.

[0055] A pixel defining film 134 may be disposed on the planarization layer 133 and cover at least a portion of the pixel electrode 141. In one embodiment, the pixel defining film 134 may cover the periphery of the pixel electrode 141 and may have a pixel opening that exposes the center of the pixel electrode 141. The pixel defining film 134 may include inorganic insulating materials such as silicon oxide, silicon nitride, and silicon nitride, and / or organic insulating materials such as acrylic resins, epoxy resins, phenolic resins, polyamide resins, polyimide resins, unsaturated polyester resins, polyphenylene resins, polyphenylene sulfide resins, and benzocyclobutene.

[0056] The light-emitting layer 142 can be disposed on the pixel electrode 141 and the pixel defining film 134 exposed through the pixel opening. Holes provided from the pixel electrode 141 and electrons provided from the counter electrode 143 combine in the light-emitting layer 142 to form excitons. As the excitons change from an excited state to a ground state, the light-emitting layer 142 can emit light. In one embodiment, the light-emitting layer 142 can emit a third light L3.

[0057] The counter electrode 143 can be disposed on the light-emitting layer 142. The counter electrode 143 may include a transparent conductive layer containing lithium (Li), calcium (Ca), aluminum (Al), magnesium (Mg), silver (Ag), platinum (Pt), lead (Pb), nickel (Ni), gold (Au), neodymium (Nd), iridium (Ir), chromium (Cr), barium (Ba), etc. The counter electrode 143 may be a transparent electrode.

[0058] Pixel electrode 141, light-emitting layer 142, and counter electrode 143 can form light-emitting element 140. Light-emitting element 140 can be disposed in each of the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3.

[0059] A thin-film encapsulation layer 150 may be disposed on the counter electrode 143. The thin-film encapsulation layer 150 can prevent impurities, moisture, etc., from penetrating from the outside into the light-emitting element 140. The thin-film encapsulation layer 150 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the thin-film encapsulation layer 150 may include a first inorganic encapsulation layer 151, a second inorganic encapsulation layer 153 disposed on the first inorganic encapsulation layer 151, and an organic encapsulation layer 152 disposed between the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153.

[0060] A dam layer 260 can be disposed on the thin-film encapsulation layer 150. The dam layer 260 can be disposed in a non-pixel region NPA. The dam layer 260 can block light incident upon it. Therefore, the dam layer 260 can prevent color mixing between the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3.

[0061] The first protective layer 241 can be disposed on the thin-film encapsulation layer 150 and can cover the dam layer 260. The first protective layer 241 can prevent impurities such as moisture and air from penetrating from the outside into the color filter layer 230 and the color conversion layer 250. The first protective layer 241 may include inorganic insulating materials such as silicon oxide, silicon nitride, and silicon nitride oxide.

[0062] A color conversion layer 250 may be disposed on the first protective layer 241. The color conversion layer 250 may include a first color conversion pattern 251, a second color conversion pattern 252, and a light-transmitting pattern 253. The first color conversion pattern 251 may be disposed in a first pixel region PA1, the second color conversion pattern 252 may be disposed in a second pixel region PA2, and the light-transmitting pattern 253 may be disposed in a third pixel region PA3. In one embodiment, a dam layer 260 may be disposed between the first color conversion pattern 251, the second color conversion pattern 252, and the light-transmitting pattern 253.

[0063] The first color transformation pattern 251 can transform incident light into a first light L1. In one embodiment, the first color transformation pattern 251 can transform a third light L3 into the first light L1. The first color transformation pattern 251 may include a red phosphor. The red phosphor may include at least one of (Ca, Sr, Ba)S, (Ca, Sr, Ba)2Si5N8, CaAlSiN3, CaMoO4, and Eu2Si5N8. Furthermore, the first color transformation pattern 251 may include a quantum dot 251Q. The quantum dot 251Q can transform the third light L3 into the first light L1. The first color transformation pattern 251 may also include a scatterer 251S. The scatterer 251S can scatter incident light into the first color transformation pattern 251 in various directions. The scatterer 251S may be a metal oxide particle or an organic particle. The metal oxide particles can be titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), indium oxide (In2O3), zinc oxide (ZnO), tin oxide (SnO2), etc., and the organic particles can be acrylic resin, urethane resin, etc.

[0064] The second color transformation pattern 252 can transform incident light into a second light L2. In one embodiment, the second color transformation pattern 252 can transform a third light L3 into the second light L2. The second color transformation pattern 252 may include a green phosphor. The green phosphor may include yttrium aluminum garnet (YAG), (Ca,Sr,Ba)2SiO4, SrGa2S4, barium magnesium aluminate (BAM), α-SiAlON (α-Syrone), β-SiAlON (β-Syrone), Ca3Sc2Si3O4, etc. 12 Tb3Al5O 12 BaSiO4, CaAlSiON and (Sr 1-x Ba x At least one of Si2O2N2. In this case, (Sr 1-x Ba xIn Si2O2N2, x can be any number between 0 and 1. Furthermore, the second color transformation pattern 252 may include quantum dots 252Q. Quantum dots 252Q can transform the third light L3 into the second light L2. The second color transformation pattern 252 may also include a scatterer 252S. The scatterer 252S can scatter the light incident on the second color transformation pattern 252 in various directions. The scatterer 252S included in the second color transformation pattern 252 and the scatterer 251S included in the first color transformation pattern 251 can be substantially the same.

[0065] The light-transmitting pattern 253 can transform incident light into a third light L3. In one embodiment, the light-transmitting pattern 253 allows the third light L3 to pass through. The light-transmitting pattern 253 may include a transparent polymer material. Furthermore, the light-transmitting pattern 253 may also include a scatterer 253S. The scatterer 253S can scatter incident light into various directions. The scatterer 253S included in the light-transmitting pattern 253, the scatterer 251S included in the first color-changing pattern 251, and the scatterer 252S included in the second color-changing pattern 252 may be substantially the same.

[0066] The second protective layer 242 can be disposed on the color conversion layer 250. The second protective layer 242 can prevent impurities such as moisture and air from penetrating from the outside into the color filter layer 230 and the color conversion layer 250. The second protective layer 242 may include inorganic insulating materials such as silicon oxide, silicon nitride, and silicon nitride oxide.

[0067] The color filter layer 230 can be disposed on the second protective layer 242. The color filter layer 230 may include a first color filter 231, a second color filter 232, and a third color filter 233. The first color filter 231 can be disposed on the first color change pattern 251, the second color filter 232 can be disposed on the second color change pattern 252, and the third color filter 233 can be disposed on the light-transmitting pattern 253.

[0068] The color filter layer 230 allows light of a certain wavelength band incident on it to pass through, while blocking light of other wavelength bands incident on it. The first color filter 231 allows first light L1 to pass through, for example, blocking second light L2 and third light L3. The second color filter 232 allows second light L2 to pass through, for example, blocking first light L1 and third light L3. The third color filter 233 allows third light L3 to pass through, for example, blocking first light L1 and second light L2. In one embodiment, the first color filter 231, the second color filter 232, and the third color filter 233 may be a red color filter, a green color filter, and a blue color filter, respectively.

[0069] A light-shielding layer 220 may be disposed on the second protective layer 242. The light-shielding layer 220 may be disposed in a non-pixel region NPA. In one embodiment, the light-shielding layer 220 may be disposed between the first color filter 231, the second color filter 232, and the third color filter 233. The light-shielding layer 220 can block light incident on itself. Thus, the light-shielding layer 220 can prevent color mixing between the first pixel region PA1, the second pixel region PA2, and the third pixel region PA3. In one embodiment, the light-shielding layer 220 may include the same material as the third color filter 233.

[0070] A low-reflection layer 400 can be disposed on the color filter layer 230 and the light-shielding layer 220. The low-reflection layer 400 can reduce the reflectivity of external light incident on the color filter layer 230. The low-reflection layer 400 may include a first low-reflection pattern 410, a second low-reflection pattern 420, and a third low-reflection pattern 430. The first low-reflection pattern 410 can be disposed on the first color filter 231, the second low-reflection pattern 420 can be disposed on the second color filter 232, and the third low-reflection pattern 430 can be disposed on the third color filter 233.

[0071] The first low-reflection pattern 410 may include a plurality of first inorganic layers. The first inorganic layers may be stacked on the first color filter 231. The refractive indices of adjacent first inorganic layers may be different from each other. The first low-reflection pattern 410 can reduce the reflectivity of external light incident on the first color filter 231.

[0072] The second low-reflection pattern 420 may include a plurality of second inorganic layers. These second inorganic layers may be stacked on the second color filter 232. The refractive indices of adjacent second inorganic layers may differ from each other. The second low-reflection pattern 420 can reduce the reflectivity of external light incident on the second color filter 232.

[0073] The third low-reflection pattern 430 may include multiple third inorganic layers. These third inorganic layers may be stacked on top of the third color filter 233. The refractive indices of adjacent third inorganic layers may differ from each other. The third low-reflection pattern 430 can reduce the reflectivity of external light incident on the third color filter 233.

[0074] The first low-reflection pattern 410, the second low-reflection pattern 420, and the third low-reflection pattern 430 may each comprise two or more inorganic layers of different types. In one embodiment, the first low-reflection pattern 410, the second low-reflection pattern 420, and the third low-reflection pattern 430 may each comprise at least two of a silicon nitride layer, a silicon oxide layer, and a silicon oxynitride layer.

[0075] In the above-described configuration, at least one layer can be formed by an inkjet printing process. For example, the color-changing layer 250 can be formed by the inkjet printing process. Furthermore, various other configurations can also be formed by the inkjet printing process. In this case, after performing the inkjet printing process, a cleaning process for the relevant equipment is required.

[0076] Figure 3 This is a block diagram illustrating an inkjet head cleaning system according to an embodiment of the present invention.

[0077] Reference Figure 3 Various processes can be performed during the manufacture of the display device 10. For example, a portion of one of the multiple components of the display device 10 can be formed via an inkjet printing process. For this purpose, an inkjet printing apparatus (IPD) can be used. The inkjet printing apparatus (IPD) may include an inkjet head carrier. The inkjet head carrier may include a support frame and a plurality of inkjet heads.

[0078] After the inkjet printing device IPD is used in the manufacturing process of the display device 10, a cleaning process is required to reuse it in the manufacturing process of the display device 10. In various embodiments, an inkjet head cleaning device ICD can clean the inkjet printing device IPD. For example, the inkjet head cleaning device ICD can clean the plurality of inkjet heads. For this purpose, the inkjet head cleaning device ICD can include various configurations, which will be described with reference to the accompanying drawings below.

[0079] Figure 4 It means Figure 3 A diagram of the inkjet head transporter included in the inkjet printing unit of the inkjet head cleaning system.

[0080] Reference Figure 4 , Figure 3 An inkjet printing apparatus (IPD) may include an inkjet head carrier (CAR). The inkjet head carrier (CAR) may include a support frame (SF) and multiple inkjet heads (IKH).

[0081] Multiple inkjet heads (IKH) can be arranged in various ways. For example, such as... Figure 4 As shown, the inkjet heads IKH can be arranged spaced apart in one direction. Alternatively, they can be arranged in rows and columns. Furthermore, various methods can be used to arrange the inkjet heads IKH within the area where ink can be applied.

[0082] Inkjet heads IKH can be configured in various quantities within the range used for coating ink. For example, such as Figure 4 As shown, the inkjet head carrier CAR can be configured with three inkjet heads IKH. Alternatively, the inkjet head carrier CAR can also be configured with two or fewer, or four or more, inkjet heads IKH.

[0083] Figure 5 It means along Figure 4 A cross-sectional view of an embodiment taken by line AA′. Figure 6 It means along Figure 4 A cross-sectional view of an embodiment taken by the BB' line.

[0084] Reference Figure 5 and Figure 6 The inkjet head IKH can be fixed to the support frame SF via the fixing component FE1. The inkjet head IKH can eject ink in the first direction DR1. At this time, ink may remain on the surface of the inkjet head IKH where ink is ejected. In this case, problems may occur when the inkjet head IKH ejects ink.

[0085] Therefore, in order for the inkjet printing process to proceed normally, a cleaning process for the inkjet head IKH is required. The cleaning process will be described in accordance with... Figure 7 The following will be discussed in conjunction with the accompanying figures.

[0086] The diagram shows the lower surface of the inkjet head IKH and the lower surface of the support frame SF arranged on the same line, but the actual structure may differ. Each inkjet head IKH may not be fixed at the same height. For example, in... Figure 6 The central inkjet head IKH can be fixed at a different position in the first direction DR1 or the second direction DR2 compared to the inkjet heads IKH located on the sides. That is, the central inkjet head IKH can be fixed at a higher or lower position compared to the inkjet heads IKH located on the sides.

[0087] Figure 7 This is a diagram illustrating an inkjet head cleaning system according to an embodiment of the present invention.

[0088] Reference Figure 7 The inkjet head cleaning system may include an inkjet head transporter (CAR), a pressurization structure (PS), a cleaning sheet supply unit (SP), a cleaning sheet recovery unit (RP), a guide roller (GR), and a cleaning sheet (CS).

[0089] The pressurized structure PS may include a pressure application part PAP, a connecting part BM, a fixing part FE2, a connecting part CP, and a transport part TP.

[0090] The pressurized structure PS can move in the first direction DR1 and the second direction DR2 opposite to the first direction DR1. The transport unit TP can move the pressure application unit PAP, etc., in the first direction DR1 or the second direction DR2.

[0091] A connecting part CP can be configured on the transport section TP. The connecting part CP can perform the function of a substrate for connecting the pressure application section PAP and the connecting component BM. The connecting part CP can be fixed to the transport section TP by the fixing component FE2. If it is necessary to replace the pressure application section PAP later, the connecting part CP can be replaced to replace the pressure application section PAP.

[0092] The pressure application part PAP can be disposed on the connecting part CP. The pressure application part PAP can tightly contact the cleaning plate CS with the inkjet head IKH. Thus, the inkjet head IKH can be cleaned using the cleaning plate CS. The upper part of the pressure application part PAP can have a shape substantially the same as the nozzle ES of the inkjet head IKH. The pressure application part PAP can be pressed against the nozzle ES of the inkjet head IKH, and the cleaning plate CS is sandwiched between the pressure application part PAP and the nozzle ES of the inkjet head IKH. At this time, the pressure application part PAP can apply pressure to make the cleaning plate CS abut against the nozzle ES of the inkjet head IKH, thereby cleaning the nozzle ES of the inkjet head IKH.

[0093] In various embodiments, the pressure application part PAP may include one or more materials selected from rubber, foamed silicone, metal, glass, and quartz.

[0094] Multiple pressure application portions (PAPs) can be configured on the same line extending along the first direction DR1, along with the respective configurations of multiple inkjet heads (IKHs). That is, the pressure application portions (PAPs) can be configured to overlap with the inkjet heads (IKHs) in the first direction DR1.

[0095] The bonding component BM can fix the pressure application part PAP and the connecting part CP. The bonding component BM can include various resins. In various embodiments, the bonding component BM can include any one or more selected from natural curing resins, thermosetting resins, and ultraviolet curing resins.

[0096] When the individual inkjet heads IKH are fixed to the support frame SF, they may not be able to be fixed in the same position. For example, the inkjet head IKH located on the third direction DR3 and the remaining inkjet heads IKH may have different positions on the second direction DR2. The third direction DR3 can be defined as a direction perpendicular to the first direction DR1. As a result, when the pressure application part PAP is pressed against the inkjet head carrier CAR, the cleaning plate CS may not be able to precisely seal against the nozzle ES of each inkjet head IKH.

[0097] Therefore, with the bonding component BM uncured, the pressure structure PS and the inkjet head carrier CAR can be pressed together to form the bonding component BM such that the pressure structure PS engages with the nozzle ES. Then, the bonding component BM can be cured to maintain this shape. Curing can be performed while the pressure structure PS and the inkjet head carrier CAR are pressed together with a cleaning pad CS sandwiched between them. This prevents direct contact between the pressure application part PAP of the pressure structure PS and the inkjet head IKH of the inkjet head carrier CAR, thus preventing damage to the inkjet head IKH.

[0098] The cleaning sheet supply unit SP can supply cleaning sheet CS, which can move along the third direction DR3 via guide roller GR. The cleaning sheet CS can perform the function of cleaning the inkjet head IKH between the inkjet head carrier CAR and the pressure structure PS. In various embodiments, when the inkjet head carrier CAR moves along the first direction DR1 and the pressure structure PS moves along the second direction DR2 and is pressed against each other, the cleaning sheet CS located between the inkjet head carrier CAR and the pressure structure PS can be in close contact with the inkjet head IKH, thereby enabling the cleaning of the inkjet head IKH.

[0099] After the cleaning pad CS is used in the cleaning process, the cleaning pad CS can be moved in one direction (e.g., the third direction DR3). Therefore, a new cleaning pad CS can be used when cleaning the inkjet head carrier CAR used in the inkjet process.

[0100] Figures 8a to 8d This is a diagram illustrating an inkjet head cleaning method according to an embodiment of the present invention.

[0101] Reference Figure 8a The inkjet head carrier CAR can be configured on the pressurized structure PS. The inkjet head carrier CAR can be arranged such that the inkjet head IKH overlaps with the pressurized structure PS.

[0102] Reference Figure 8b The inkjet head carrier CAR can move in the first direction DR1. The pressure structure PS can move in the second direction DR2. At this time, the cleaning sheet CS does not need to move. The inkjet head carrier CAR and the pressure structure PS can be sandwiched between each other and pressed together.

[0103] At this point, the bonding component BM is not yet cured, so the shape of each bonding component BM can be deformed depending on the position of each inkjet head IKH. For example, the inkjet head IKH located at the end of the third direction DR3 can be fixed at a higher or lower position in the second direction DR2 compared to the inkjet head IKH located in the center. Thus, when crimping the inkjet head carrier CAR and the pressure structure PS, the bonding component BM located at the end of the third direction DR3 can be crimped relatively less or relatively more than the bonding component BM located in the center.

[0104] When the inkjet head carrier CAR and the pressure structure PS are pressed together with a cleaning pad CS sandwiched between them, no damage occurs in the inkjet head carrier CAR. For example, the cleaning pad CS can prevent scratches that may occur in the inkjet head carrier CAR.

[0105] Reference Figure 8c Curing can be performed while the inkjet head carrier (CAR) and the pressure structure (PS) are pressed together. This curing process fixes the shape of the bonded component (BM).

[0106] In various embodiments, the bonding component BM may include a naturally curable resin. In this case, the bonding component BM can be fixed in shape by natural curing. In various embodiments, the bonding component BM may include a thermosetting resin. In this case, the bonding component BM can be fixed in shape by heat curing. Alternatively, in various embodiments, the bonding component BM may include a photocurable material. For example, the bonding component BM may include an ultraviolet-curable material. In this case, the bonding component BM can be fixed in shape by ultraviolet curing.

[0107] Reference Figure 8d After the shape of the component BM is fixed by curing, the inkjet head carrier CAR can move in the second direction DR2, and the pressurized structure PS can move in the first direction DR1.

[0108] Then, the inkjet head carrier CAR can be used in the inkjet printing process. After the inkjet printing process, the inkjet head carrier CAR can be positioned on the pressure structure PS. At this time, the rollers of the cleaning sheet supply unit SP and the cleaning sheet recovery unit RP can rotate, allowing the cleaning sheet CS to move in the third direction DR3. Thus, a new cleaning sheet CS for cleaning the inkjet head IKH of the inkjet head carrier CAR can be positioned between the inkjet head carrier CAR and the pressure structure PS.

[0109] After the new cleaning plate CS is positioned between the inkjet head carrier CAR and the pressure structure PS, the inkjet head carrier CAR and the pressure structure PS can be moved relative to each other to perform crimping. This allows for the cleaning of the inkjet head IKH of the inkjet head carrier CAR.

[0110] (Industry availability)

[0111] The exemplary embodiments of the present invention relate to inkjet head cleaning systems and methods that can be applied to cleaning inkjet printing apparatuses used in the manufacture of computers, laptops, mobile phones, smartphones, smart tablets, PMPs, PDAs, MP3 players, etc.

[0112] The inkjet head cleaning system and method of the present invention have been described above with reference to the accompanying drawings. However, the embodiments described are illustrative, and those skilled in the art can make modifications and alterations without departing from the scope of the technical concept of the present invention as set forth in the claims.

Claims

1. A method for cleaning an inkjet head, comprising: The step of moving an inkjet head carrier comprising multiple inkjet heads in a first direction. The step of moving a pressurizing structure, which is disposed in the first direction of the inkjet head carrier and includes a plurality of pressure applying portions fixed by a connecting component, in a second direction opposite to the first direction; as well as The step of curing the bonding component while the inkjet head carrier and the pressure structure are pressed together. The bonding component comprises resin. In its uncured state, the bonding component is formed into a shape where the pressure structure and the inkjet head are interlocked by pressing the pressure structure and the inkjet head carrier together. When the inkjet head carrier moves along the first direction and the pressurizing structure moves along the second direction and is pressed against each other, the cleaning plate located between the inkjet head carrier and the pressurizing structure is in close contact with the inkjet head, thereby cleaning the inkjet head.

2. The inkjet head cleaning method according to claim 1, characterized in that, The bonding component comprises a naturally curing resin. The step of curing the bonding component involves curing the bonding component through natural curing.

3. The inkjet head cleaning method according to claim 1, characterized in that, The bonding component includes a thermosetting resin. The step of curing the bonding component involves heating the bonding component to cure it.

4. The inkjet head cleaning method according to claim 1, characterized in that, The bonding component includes a UV-curable resin. The step of curing the bonding component involves applying ultraviolet light to the bonding component to cure it.

5. The inkjet head cleaning method according to claim 1, characterized in that, The inkjet head carrier and the pressurizing structure are pressed together with the cleaning plate disposed between the inkjet head carrier and the pressurizing structure.

6. The inkjet head cleaning method according to claim 1, characterized in that, After the step of curing the bonding component, the method further includes: The step of moving the inkjet head carrier in the second direction; and The step of moving the pressurized structure in the first direction.

7. The inkjet head cleaning method according to claim 6, characterized in that, After the step of moving the pressurized structure in the first direction, the method further includes: The step of moving the cleaning plate upward in a third direction perpendicular to the first direction between the inkjet head carrier and the pressurized structure.

8. The inkjet head cleaning method according to claim 7, characterized in that, After the step of moving the cleaning plate upwards in the third party, the method further includes: The step of moving the inkjet head carrier in the first direction; The step of moving the pressurized structure in the second direction; and The step of pressing the inkjet head carrier and the pressure structure together with the cleaning plate sandwiched between them.

9. The inkjet head cleaning method according to claim 7, characterized in that, the cleaning sheet is arranged between the inkjet head conveyance body and the pressure applying structure by a plurality of guide rollers.

10. The inkjet head cleaning method according to claim 1, characterized in that, the pressure applying portion includes any one or more selected from the group consisting of rubber, foamed silicone, metal, glass, and quartz.

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