electronic components

Abstract

The present application provides an electronic component including: a capacitor array including a plurality of multilayer capacitors arranged in a vertical direction, in which adjacent multilayer capacitors include opposite external electrodes including tab portions that are bonded to each other, the external electrodes being arranged in such a manner that an area of the tab portions arranged on a bonding surface is relatively larger than an area of the tab portions arranged on another surface; and a pair of metal frames each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend.

Description

[0001] This application is a divisional application of the patent application with application number 201910207935.X and titled "Electronic assembly" and filed on March 19, 2019. TECHNICAL FIELD

[0002] The present disclosure relates to an electronic assembly. BACKGROUND

[0003] Due to advantages such as compactness and high capacitance of a multilayer capacitor, the multilayer capacitor has been used in various electronic devices.

[0004] Recently, as the rapid increase in the popularization of eco-friendly vehicles and electric vehicles, the electric drive system in the vehicle has increased, and thus the demand for a multilayer capacitor required in such a vehicle has increased.

[0005] In order to be used as an assembly for a vehicle, since the multilayer capacitor should have a high level of thermal resistance or electrical reliability, the required performance level of the multilayer capacitor has gradually increased.

[0006] Accordingly, there has been a need for a structure of a multilayer capacitor having improved resistance to vibration or deformation.

[0007] In detail, there is a need for an electronic device having a structure configured to achieve high capacitance by stacking a plurality of capacitors or a structure of an electronic assembly having improved resistance to vibration or deformation. SUMMARY

[0008] An aspect of the present disclosure is to provide a stacked electronic assembly having improved resistance to vibration and deformation and improved reliability, and increased adhesion between assemblies while achieving high capacitance.

[0009] According to an aspect according to the present disclosure, an electronic package includes a first multilayer capacitor and a pair of metal frames, and wherein the first multilayer capacitor includes a main body including dielectric layers and first and second internal electrodes alternately arranged with each of the dielectric layers interposed between the first and second internal electrodes, and a pair of external electrodes respectively arranged on both end portions of the main body, and in the first multilayer capacitor, the external electrodes include a head portion arranged on an end surface of the main body to be electrically connected to the first or second internal electrode, and first and second strap portions respectively extending from the head portion to a portion of a top surface and a portion of a bottom surface of the main body, wherein the first strap portion of the first multilayer capacitor is longer than the second strap portion in a length direction of the main body of the first multilayer capacitor, wherein the metal frame includes a vertical portion coupled to the head portion of the external electrode, and a mounting portion bent at a lower end of the vertical portion, wherein the electronic package further includes a second multilayer capacitor, the first and second multilayer capacitors being arranged in a vertical direction, wherein the second multilayer capacitor includes a main body including dielectric layers and first and second internal electrodes alternately arranged with each of the dielectric layers interposed between the first and second internal electrodes, and a pair of external electrodes respectively arranged on both end portions of the main body, and in the second multilayer capacitor, the external electrodes include a head portion arranged on an end surface of the main body to be electrically connected to the first or second internal electrode, and first and second strap portions respectively extending from the head portion to a portion of a bottom surface and a portion of a top surface of the main body, wherein the first strap portion of the second multilayer capacitor is longer than the second strap portion in a length direction of the main body of the second multilayer capacitor, the first strap portion of the first multilayer capacitor and the first strap portion of the second multilayer capacitor being coupled to each other. BRIEF DESCRIPTION OF DRAWINGS

[0010] The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a perspective view of a multilayer capacitor applied to an exemplary embodiment in the present disclosure;

[0012] Figure 2A and Figure 2B are plan views of a first internal electrode and a second internal electrode of a multilayer capacitor applied to Figure 1 , respectively;

[0013] Figure 3is a cross-sectional view taken along line I-I' in Figure 1

[0014] Figure 4 is a perspective view showing a schematic structure of an electronic component applied to an exemplary embodiment in the present disclosure;

[0015] Figure 5 is a front view of Figure 4

[0016] Figure 6 is a front view showing a schematic structure of an electronic component applied to another exemplary embodiment in the present disclosure;

[0017] Figure 7 is an exploded perspective view showing a schematic structure of an electronic component applied to another exemplary embodiment in the present disclosure;

[0018] Figure 8 is a front view of Figure 7

[0019] Figure 9 is a perspective view showing a schematic structure of an electronic component applied to another exemplary embodiment in the present disclosure; and

[0020] Figure 10 is an exploded perspective view of Figure 9 DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0022] However, the present disclosure can be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0023] In the drawings, the shape and size of elements can be exaggerated for the purpose of clarity and the same reference numerals will be always used to refer to the same or like elements.

[0024] Further, by the description, unless explicitly described to the contrary, the words "comprise" and variations such as "comprises" or "comprising" will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

[0025] Directions of a hexahedral ceramic body will be defined to clearly describe embodiments of the present disclosure. L, W, and T shown in all the drawings respectively mean a length direction, a width direction, and a thickness direction of a multilayer ceramic capacitor and an electronic component. Here, a Z direction can be the same as a direction in which dielectric layers are laminated. ​​​​

[0026] Figure 1 is a perspective view of a multilayer capacitor to which an exemplary embodiment applied in the present disclosure. Figure 2A and Figure 2B are plan views of a first internal electrode and a second internal electrode of a multilayer capacitor applied in Figure 1 , respectively, and Figure 3 is a cross-sectional view taken along line I-I' in Figure 1

[0027] Hereinafter, a structure of a multilayer capacitor applied to an electronic component according to the present embodiment will be described with reference to Figures 1 to 3

[0028] Referring to Figures 1 to 3 , a multilayer capacitor 100 according to the present embodiment includes a main body (or a capacitor main body) 110 and first and second external electrodes 131 and 132 disposed on an outer surface of the main body 110 in an X direction defined as a first direction, respectively.

[0029] The main body 110 is formed by laminating a plurality of dielectric layers 111 in a Z direction and sintering the laminated dielectric layers 111. Adjacent dielectric layers 111 of the main body 110 can be integrated with each other such that a boundary therebetween can not be easily apparent without using a scanning electron microscope (SEM).

[0030] The main body 110 includes a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122 having different polarities from each other, the first and second internal electrodes 121 and 122 being alternately disposed in the Z direction, and each of the dielectric layers being interposed between the first and second internal electrodes 121 and 122.

[0031] The main body 110 can include an effective area which is a portion contributing to capacitance of the capacitor and cover areas 112 and 113 which are edge portions prepared in upper and lower portions of the main body 110 in the Z direction.

[0032] A shape of the main body 110 is not limited, but can have a hexahedral shape. The main body 110 can have a first surface 1 and a second surface 2 disposed opposite to each other in the Z direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces 1 and 2 and disposed opposite to each other in the X direction, and a fifth surface 5 and a sixth surface 6 connected to the first and second surfaces 1 and 2 and the third and fourth surfaces 3 and 4 and disposed opposite to each other in the Y direction.

[0033] The dielectric layer 111 can include ceramic powder particles, for example, barium titanate (BaTiO3)-based ceramic powder particles, or the like.

[0034] ​​The BaTiO3-based ceramic powder particles can be (Ba 1- x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, or Ba(Ti 1-y Zr y )O3, but the material of the ceramic powder particles is not limited thereto.

[0035] In addition to the ceramic powder particles, a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant can be added to the dielectric layer 111.

[0036] The ceramic additive can include, for example, a transition metal oxide or a transition metal carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like.

[0037] The first internal electrode 121 and the second internal electrode 122, which are electrodes to which different polarities are applied, can be disposed on the dielectric layers 111 stacked in the Z direction. The first internal electrode 121 and the second internal electrode 122 can be alternately disposed to face each other in the Z direction inside the main body 110, with a single dielectric layer 111 interposed therebetween.

[0038] One end of the first internal electrode 121 and one end of the second internal electrode 122 can be respectively exposed through the third surface 3 and the fourth surface 4 of the main body 110.

[0039] In this case, the first internal electrode 121 and the second internal electrode 122 can be electrically insulated by the dielectric layer 111 interposed therebetween.

[0040] The end portions of the first internal electrode 121 and the second internal electrode 122 alternately exposed through the third surface 3 and the fourth surface 4 of the capacitor main body 110 can be respectively connected to the first external electrode 131 and the second external electrode 132 (to be described later) disposed on both end portions of the main body 110 in the X direction to be respectively electrically connected to the first external electrode 131 and the second external electrode 132.

[0041] According to the above-described configuration, when a predetermined voltage is applied to the first external electrode 131 and the second external electrode 132, electric charges are accumulated between the first internal electrode 121 and the second internal electrode 122.

[0042] In this case, the capacitance of the multilayer capacitor 100 can be proportional to an overlapping area between the first internal electrode 121 and the second internal electrode 122, which overlap each other in the Z direction in the active area.

[0043] The first internal electrode 121 and the second internal electrode 122 can be formed using a conductive paste formed of at least one of a noble metal material such as platinum (Pt), palladium (Pd), and a palladium-silver (Pd-Ag) alloy, nickel (Ni), and copper (Cu).

[0044] The conductive paste can be printed by a screen printing method, a gravure printing method, or the like, but the printing method is not limited thereto.

[0045] The first external electrode 131 and the second external electrode 132 can be provided with voltages having different polarities, and can be disposed on both ends of the main body 110 in the X direction. The first external electrode 131 and the second external electrode 132 can be connected to exposed ends of the first internal electrode 121 and the second internal electrode 122, respectively, to be electrically connected thereto.

[0046] The first external electrode 131 is disposed on one end of the main body 110 in the X direction.

[0047] The first external electrode 131 can include a first head portion 131a and first strap portions 131b and 131c.

[0048] The first head portion 131a is disposed on the third surface 3 of the main body 110, and contacts a portion of the first internal electrode 121 exposed outside through the third surface 3 of the main body 110 to connect the first internal electrode 121 and the first external electrode 131 to each other.

[0049] The first strap portion 131b extends from the first head portion 131a to a portion of the first surface 1, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the main body 110, and the first strap portion 131c extends from the first head portion 131a to a portion of the second surface 2 of the main body 110.

[0050] The first strap portion 131c disposed on the second surface 2 corresponding to a bonding surface (to be described later) of the main body 110 can include a first extension portion.

[0051] The second external electrode 132 can be disposed on the other end of the main body 110 in the X direction.

[0052] The second external electrode 132 can include a second head portion 132a and second strap portions 132b and 132c.

[0053] The second head 132a is disposed on the fourth surface 4 of the main body 110 and contacts a portion of the second inner electrode 122 exposed through the fourth surface 4 of the main body 110 to connect the second inner electrode 122 and the second outer electrode 132 to each other.

[0054] The second band portion 132b extends from the second head 132a to a portion of the first surface 1, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the main body 110, and the second band portion 132c extends from the second head 132a to a portion of the second surface 2 of the main body 110.

[0055] The second band portion 132c disposed on the second surface 2 corresponding to the bonding surface (to be described later) of the main body 110 can include a second extension portion.

[0056] The first outer electrode 131 and the second outer electrode 132 can further include plating layers.

[0057] The plating layers can include first and second nickel (Ni) plating layers and first and second tin (Sn) plating layers covering the first and second nickel plating layers.

[0058] Figure 4 is a perspective view showing a schematic structure of an electronic assembly applied to an exemplary embodiment in the present disclosure, and Figure 5 is Figure 4 a front view of

[0059] Referring to Figure 4 and Figure 5 , the electronic assembly according to the present embodiment includes a capacitor array including a plurality of multilayer capacitors 100 and 100' disposed in a Z direction (vertical direction), and a first metal frame 140 connected to a first outer electrode 131 of a lowermost multilayer capacitor 100 in the Z direction among the capacitor array, and a second metal frame 150 connected to a second outer electrode 132 of the lowermost multilayer capacitor 100.

[0060] In the present embodiment, the capacitor array has been described as including two multilayer capacitors 100 and 100' disposed in the vertical direction. However, the capacitor array is not limited thereto and can stack three or more multilayer capacitors in the vertical direction.

[0061] Hereinafter, the capacitor array will be described. Among the multilayer capacitors disposed adjacent to each other in the Z direction, the band portions of the opposite outer electrodes are bonded to each other, and the outer electrodes are disposed in such a manner that the area of the band portion disposed on the bonding surface is relatively greater than the area of the band portion disposed on the other surface.

[0062] To this end, the band portion disposed on the bonding surface can include an extension portion elongated in the X direction.

[0063] The top surface of the main body 110 is a bonding surface for the lower multilayer capacitor 100 disposed below in the Z direction. Therefore, the first tab 131c disposed on the top surface of the main body 110 has a relatively larger area than the first tab 131b disposed on another surface (the bottom surface or both side surfaces) of the main body 110. The bottom surface of the main body 110' is a bonding surface for the upper multilayer capacitor 100' disposed above in the Z direction. Therefore, the first tab 131c' disposed on the bottom surface of the main body 110' has a relatively larger area than the first tab 131b' disposed on another surface (the top surface or both side surfaces) of the main body 110'.

[0064] In addition, the top surface of the main body 110 is a bonding surface for the lower multilayer capacitor 100 disposed below in the Z direction. Therefore, the second tab 132c disposed on the top surface of the main body 110 has a relatively larger area than the second tab 132b disposed on another surface (the bottom surface or both side surfaces) of the main body 110. The bottom surface of the main body 110' is a bonding surface for the upper multilayer capacitor 100' disposed above in the Z direction. Therefore, the second tab 132c' disposed on the bottom surface of the main body 110' has a relatively larger area than the second tab 132b' disposed on another surface (the top surface or both side surfaces) of the main body 110'.

[0065] The two first tabs 131c and 131c' disposed on the bonding surface and vertically facing each other are bonded to each other by the conductive bonding portion 161b disposed therebetween. The two second tabs 132c and 132c' disposed on the bonding surface and vertically facing each other are bonded to each other by the conductive bonding portion 162b disposed therebetween.

[0066] Each of the conductive bonding portions 161b and 162b can be formed with a high-temperature solder, a conductive adhesive, or the like, but the material thereof is not limited thereto.

[0067] For example, in the two vertically disposed multilayer capacitors 100 and 100', the first tabs 131c and 131c' and the second tabs 132c and 132c' disposed on the bonding surface and bonded to each other respectively have first extension portions and second extension portions and respectively have a relatively larger area than the first tabs 131b and 131b' and the second tabs 132b and 132b' disposed on another surface. Therefore, the bonding strength of the two vertically stacked multilayer capacitors 100 and 100' can be improved.

[0068] The first metal frame 140 can serve as a first terminal electrically connected to the first external electrode 131 of the capacitor array.

[0069] The first metal frame 140 includes a first vertical portion 141 and a first mounting portion 142.

[0070] The first vertical portion 141 is coupled to a first head portion 131a of the first external electrode 131 of the lowermost multilayer capacitor 100 to be electrically connected to the first external electrodes 131 and 131' of the capacitor array, and can be longer than the first head portion 131a in the Z direction.

[0071] The conductive coupling portion 161a can be provided between the first vertical portion 141 and the first head portion 131a.

[0072] The first mounting portion 142 is bent at a lower end of the first vertical portion 141 to extend in the X direction and be separated from the lowermost multilayer capacitor 100, for example, a predetermined distance from a lower end of the capacitor array in the Z direction. The first mounting portion 142 can serve as a connection terminal during board mounting.

[0073] The second metal frame 150 can serve as a second terminal electrically connected to the second external electrode 132 of the capacitor array.

[0074] The second metal frame 150 includes a second vertical portion 151 and a second mounting portion 152.

[0075] The second vertical portion 151 is coupled to a second head portion 132a of the second external electrode 132 of the lowermost multilayer capacitor 100 to be electrically connected to the second external electrodes 132 and 132' of the capacitor array, and can be provided to be longer than the second head portion 132a in the Z direction.

[0076] The conductive coupling portion 162a can be provided between the second vertical portion 151 and the second head portion 132a.

[0077] The second mounting portion 152 is bent at a lower end of the second vertical portion 151 to extend in the X direction and be separated from the lowermost multilayer capacitor 100, for example, a predetermined distance from a bottom surface of the capacitor array in the Z direction. The second mounting portion 152 can serve as a connection terminal during board mounting.

[0078] According to the present embodiment, a capacitor array including a plurality of multilayer capacitors can be provided to achieve high capacitance. A distance between the capacitor array and a mounting board can be secured using a metal frame to prevent stress from being directly transmitted from the board to the multilayer capacitors during board mounting. Thus, thermal reliability and mechanical reliability of an electronic package can be improved.

[0079] In the case where the metal frames are bonded to both side surfaces of the capacitor array, respectively, the bonding state is good at room temperature. However, in an environment where the use temperature significantly changes (for example, an electrical assembly), stress can be generated at the bonding boundary due to a difference in the coefficient of thermal expansion between the metal frames bonded to each other and the external electrodes of the multilayer capacitor, and the bonding strength can decrease due to thermal and mechanical shocks, thereby causing the multilayer capacitor to debond from the metal frame.

[0080] Like the present embodiment, when the plurality of multilayer capacitors are vertically disposed, separation between the multilayer capacitors and the metal frame and debonding between the vertically stacked multilayer capacitors can additionally occur.

[0081] To address the above-described drawbacks, in the related art, a non-conductive adhesive is applied to the stacked multilayer capacitors to enhance the bonding strength.

[0082] However, the non-conductive adhesive is mainly an organic material and a polymer, and significant stress can be easily applied to the multilayer capacitor. Thus, when the polymer firmly holds the multilayer capacitor to maintain the bonding under significant stress, a crack can occur in the multilayer capacitor.

[0083] The possibility of a short circuit occurring between the terminals due to humidity in the organic material can increase due to the hygroscopic tendency of the organic material.

[0084] However, according to the present embodiment, when an electronic assembly is manufactured in a capacitor array type, separation between the multilayer capacitors and the metal frame and separation between the vertically stacked multilayer capacitors can be suppressed. Thus, the reliability of the electronic assembly can be improved.

[0085] Figure 6 is a front view showing a schematic structure of an electronic assembly to which another exemplary embodiment in the present disclosure is applied.

[0086] Referring to Figure 6 The first vertical portion 141 of the first metal frame 140' and the second vertical portion 151 of the second metal frame 150' can further include a first extension portion 143 and a second extension portion 153, respectively.

[0087] The first extension portion 143 extends in the Z direction from an upper end of the first vertical portion 141 and is bonded to a first head portion 131a' of the first external electrode 131' of the upper multilayer capacitor 100' to further improve the bonding strength between the first metal frame 140' and the upper multilayer capacitor 100' and the lower multilayer capacitor 100.

[0088] The conductive bonding portion 161c can be disposed between the first extension portion 143 and the first head portion 131a' of the upper multilayer capacitor 100'.

[0089] The second extension 153 extends in the Z direction from the upper end of the second vertical portion 151 and is coupled to the second head portion 132a' of the second external electrode 132' of the upper multilayer capacitor 100' to further improve the coupling strength between the second metal frame 150' and the upper and lower multilayer capacitors 100 and 100'.

[0090] The conductive coupling portion 162c can be provided between the second extension 153 and the second head portion 132a' of the upper multilayer capacitor 100'.

[0091] Figure 7 is an exploded perspective view showing a schematic structure of an electronic assembly to which another exemplary embodiment in the present disclosure is applied, Figure 8 is Figure 7 a front view of

[0092] Referring to Figure 7 and Figure 8 , the first and second metal frames 140'' and 150'' can further include first and second coupling portions 144 and 154, respectively.

[0093] The first coupling portion 144 is bent from the upper end of the first vertical portion 141 and extends in the X direction to be disposed between the opposite first band portions 131c' and 131c of the upper and lower multilayer capacitors 100' and 100.

[0094] The conductive coupling portions 161d and 161e can be respectively provided between the first coupling portion 144 and the first band portion 131c and between the first coupling portion 144 and the first band portion 131c' to further improve the coupling strength between the first metal frame 140'' and the upper and lower multilayer capacitors 100' and 100.

[0095] The second coupling portion 154 is bent from the upper end of the second vertical portion 151 and extends in the X direction to be disposed between the opposite second band portions 132c' and 132c of the upper and lower multilayer capacitors 100' and 100.

[0096] The conductive coupling portions 162d and 162e can be respectively provided between the second coupling portion 154 and the second band portion 132c and between the second coupling portion 154 and the second band portion 132c' to further improve the coupling strength between the second metal frame 150'' and the upper and lower multilayer capacitors 100' and 100.

[0097] Figure 9 is a perspective view showing a schematic structure of an electronic assembly to which another exemplary embodiment in the present disclosure is applied, and Figure 10 is Figure 9 an exploded perspective view of

[0098] Referring to Figure 9 and Figure 10 The electronic assembly can further include a plurality of multilayer capacitors 100 and 100' disposed in the Y direction (horizontal direction).

[0099] The first metal frame 1400 is bonded to the first external electrodes 131 and 131' of the plurality of multilayer capacitors 100 and 100', serving as a common electrode connecting adjacent first external electrodes 131 and 131' to each other.

[0100] The first metal frame 1400 includes a first bonding portion 1430, a first mounting portion 1420, and a first vertical portion 1410.

[0101] The first bonding portion 1430 is elongated in the X direction and bonded to the upper side of the extended first band portion 131c of the plurality of first external electrodes 131, to electrically and physically connect the upper side of the extended first band portion 131c of the plurality of first external electrodes 131 to each other.

[0102] The first mounting portion 1420 is disposed opposite the first bonding portion 1430 in the Z direction and serves as a connection terminal during board mounting.

[0103] Further, the first mounting portion 1420 is disposed a predetermined distance apart from the bottom surface of the multilayer capacitor 100 in the Z direction.

[0104] The first vertical portion 1410 extends downward from the end of the first bonding portion 1430 in such a manner that the lower end of the first vertical portion 1410 is connected to the end of the first mounting portion 1420.

[0105] The plurality of first vertical portions 1410 are respectively bonded to the first head portions 131a of the first external electrodes 131 in the X direction, to electrically and physically connect the first head portions 131a of the first external electrodes 131 to each other.

[0106] The second metal frame 1500 is bonded to the second external electrodes 132 and 132' of the plurality of multilayer capacitors 100 and 100', serving as a common electrode connecting adjacent second external electrodes 132 and 132' to each other.

[0107] The second metal frame 1500 includes a second bonding portion 1530, a second mounting portion 1520, and a second vertical portion 1510.

[0108] The second bonding portion 1530 is elongated in the X direction and bonded to the upper side of the extended first band portion 132c of the plurality of second external electrodes 132, to electrically and physically connect the upper side of the extended second band portion 132c of the plurality of second external electrodes 132 to each other.

[0109] The second mounting portion 1520 is disposed opposite the second coupling portion 1530 in the Z direction and serves as a connection terminal during board mounting.

[0110] Further, the second mounting portion 1520 is disposed a predetermined distance apart from the bottom surface of the multilayer capacitor 100 in the Z direction.

[0111] The second vertical portion 1510 extends downward from the end of the second coupling portion 1530 in such a manner that the lower end of the second vertical portion 1510 is connected to the end of the second mounting portion 1520.

[0112] The plurality of second vertical portions 1510 are respectively coupled to the second head portions 132a of the plurality of second external electrodes 132 in the X direction to electrically and physically connect the second head portions 132a of the plurality of second external electrodes 132 to each other.

[0113] The first lower band portion of the upper multilayer capacitor 100' is coupled to the first coupling portion 1430, and the second lower band portion thereof is coupled to the second coupling portion 1530.

[0114] Test Example

[0115] A test was performed to confirm the degree of improvement in the coupling strength between the lower multilayer capacitor and the upper multilayer capacitor when two multilayer capacitors are vertically disposed, and among the four surfaces of the band portions of the external electrodes disposed on the main body, the area of the band portion disposed on the coupling surface is greater than the area of the band portion disposed on the other surface.

[0116] Similar to the exemplary embodiment shown in Figure 6 In the test, two multilayer capacitors were vertically disposed, in detail, the band portions disposed opposite each other in the Z direction were coupled to each other, and the head portions of the external electrodes were respectively coupled to the vertical portions and the extension portions of the metal frame. Then, a force of 20 N and 30 N was applied to the upper multilayer capacitor (for example, the front of the upper multilayer capacitor) for 10 seconds at a speed of 1 mm / min, and the number of debonded upper multilayer capacitors was input. The number of samples was 5 in each condition.

[0117] In Table (1), a denotes the length in the X direction of the band portion having a relatively large area, and b denotes the length in the X direction of the band portion having a relatively small area, and EA (the quantities of defects) denotes the number of defects of the debonded upper multilayer capacitors.

[0118] Table (1)

[0119]

[0120] Referring to Table (1), a / b = 1 is a case where the band portion of the joining surface has the same size as the band portion of the other surface. In this case, the upper multilayer capacitor was delaminated under both of the applied loads of 20 N and 40 N.

[0121] In the case of a / b = 1.05, the upper multilayer capacitor was not delaminated under the applied load of 20 N, whereas the upper multilayer capacitor was delaminated under the applied load of 40 N.

[0122] In the case of a / b greater than or equal to 1.1, the upper multilayer capacitor was not delaminated under both of the applied loads of 20 N and 40 N.

[0123] Therefore, in detail, a / b > 1.05 in consideration of the fact that 20 N is a standard of the applied load of the capacitor in a usual high adhesion force outgoing inspection. More in detail, a / b > 1.05 in consideration of a strengthened reliability standard.

[0124] As described above, according to the exemplary embodiments, it is possible to improve the vibration resistance and deformation resistance reliability and the joining strength between components while realizing a high capacitance of the electronic component.

[0125] Although the exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and changes can be made thereto without departing from the scope of the present application as defined by the appended claims.

Claims

1. An electronic assembly comprising: a first multilayer capacitor and a pair of metal frames, and wherein the first multilayer capacitor includes a main body including dielectric layers and first and second internal electrodes alternately arranged with each of the dielectric layers interposed between the first and second internal electrodes, and a pair of external electrodes respectively arranged on both end portions of the main body and electrically connected to the first and second internal electrodes, respectively, and in the first multilayer capacitor, each of the pair of external electrodes includes a head portion respectively arranged on both end surfaces of the main body and first and second band portions respectively extending from the respective head portions to a portion of a top surface and a portion of a bottom surface of the main body, wherein, in a length direction of the main body of the first multilayer capacitor, the first band portion of the first multilayer capacitor is longer than the second band portion, wherein the metal frame includes a vertical portion coupled to the head portion of the external electrode and a mounting portion bent at a lower end of the vertical portion, wherein the electronic assembly further includes a second multilayer capacitor, the first multilayer capacitor and the second multilayer capacitor being arranged in a vertical direction, wherein the second multilayer capacitor includes a main body including dielectric layers and first and second internal electrodes alternately arranged with each of the dielectric layers interposed between the first and second internal electrodes, and a pair of external electrodes respectively arranged on both end portions of the main body and electrically connected to the first and second internal electrodes, respectively, and in the second multilayer capacitor, each of the pair of external electrodes includes a head portion respectively arranged on both end surfaces of the main body and first and second band portions respectively extending from the respective head portions to a portion of a bottom surface and a portion of a top surface of the main body, wherein, in a length direction of the main body of the second multilayer capacitor, the first band portion of the second multilayer capacitor is longer than the second band portion, the first band portion of the first multilayer capacitor and the first band portion of the second multilayer capacitor being coupled to each other. 2.The electronic assembly of claim 1, comprising a plurality of first multilayer capacitors arranged in a horizontal direction. 3.The electronic assembly of claim 1, comprising a plurality of second multilayer capacitors arranged in a horizontal direction.

4. The electronic assembly of claim 1, wherein, areas of the first band portions of the first and second multilayer capacitors coupled to each other are greater than areas of the second band portions of the first and second multilayer capacitors. 5.The electronic assembly of claim 1, further comprising a conductive coupling portion arranged between the head portion of the respective external electrode of the first multilayer capacitor and the vertical portion.

6. The electronic assembly of claim 5, wherein, The conductive bonding portion is also provided between the first band portion of the first multilayer capacitor and the first band portion of the second multilayer capacitor which are bonded to each other.

7. The electronic assembly of claim 1, wherein, The mounting portion is separated from a lower end of the first multilayer capacitor.

8. The electronic assembly of claim 1, wherein, Each of the metal frames includes an extension portion extending from an upper end of the vertical portion to be bonded to a head portion of a corresponding one of the outer electrodes of the second multilayer capacitor.

9. The electronic assembly of claim 8, further comprising a conductive bonding portion provided between the head portion of a corresponding outer electrode of the first multilayer capacitor and the vertical portion and between the head portion of a corresponding outer electrode of the second multilayer capacitor and the extension portion.

10. The electronic assembly of claim 1, wherein, Each of the metal frames further includes a bonding portion bent from the vertical portion to extend between a first band portion of the first multilayer capacitor and a first band portion of the second multilayer capacitor.

11. The electronic assembly of claim 10, further comprising a conductive bonding portion provided between the bonding portion and the first band portion of the first multilayer capacitor and the first band portion of the second multilayer capacitor.

12. The electronic assembly of claim 10, wherein, The electronic assembly includes a plurality of first multilayer capacitors and a plurality of second multilayer capacitors and corresponding metal frames provided in a horizontal direction, the bonding portions of the metal frames located on the same side in a length direction of the main body being integrated with each other.

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