Display panel, display device and manufacturing method

Abstract

The embodiment of the present invention discloses a display panel, a display device and a preparation method. The display panel includes: a base substrate; an electrode unit arranged on one side of the base substrate, the electrode unit includes a main electrode unit and a redundant electrode unit; a first light-emitting unit, the first light-emitting unit is electrically connected to the main electrode unit; a retaining wall structure and an opening located between the retaining wall structures, the opening includes a first opening, the redundant electrode unit is located in the first opening; a functional structure, the functional structure fills part of the first opening, and the functional structure is at least partially located on the side of the redundant electrode unit away from the base substrate. The embodiment of the present invention can solve the problem that the exposed redundant electrode in the existing display panel has a high reflectivity that affects the display effect, and can reduce the reflection of the redundant electrode unit or increase the light extraction efficiency of the light-emitting unit through the functional structure, reduce the reflection of the electrode, increase the display brightness of the display panel, and improve the display effect.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel, a display device, and a manufacturing method thereof. Background Art

[0002] Existing micro LED or Mini LED display panels usually use mass transfer technology to transfer LEDs to the display substrate for binding. However, due to the yield limit of mass transfer technology, the transferred display panel will produce some abnormal LEDs. For abnormal LEDs, they are generally not repaired directly, but redundant electrode positions are left in the pixels, and new LEDs are re-bound to the redundant electrode positions for compensation.

[0003] However, since the position of the abnormally emitting LED is uncertain, that is, the position of the redundant electrode bound to the new LED is uncertain, in the subsequent photolithography process, all the redundant electrode positions are usually developed to ensure that the repaired LED can emit light normally, but at the same time, most of the unrepaired redundant electrode positions will be directly exposed on the surface. In addition, because the redundant electrodes are usually metal electrodes with high reflectivity, the exposed redundant electrodes will increase the reflectivity of the entire screen and affect the display effect. Summary of the invention

[0004] The present invention provides a display panel, a display device and a preparation method thereof, so as to adjust the light output of the display panel, solve the problems of the panel reflectivity or light output efficiency, and improve the display effect.

[0005] In a first aspect, an embodiment of the present invention provides a display panel, including:

[0006] substrate substrate;

[0007] An electrode unit is arranged on one side of the substrate, and the electrode unit includes a main electrode unit and a redundant electrode unit;

[0008] A first light emitting unit, the first light emitting unit is electrically connected to the main electrode unit;

[0009] A retaining wall structure and an opening between the retaining wall structures, wherein the opening comprises a first opening, and the redundant electrode unit is located in the first opening;

[0010] The functional structure fills a portion of the first opening, and the functional structure is at least partially located on a side of the redundant electrode unit away from the substrate.

[0011] In a second aspect, an embodiment of the present invention further provides a display device, comprising any one of the display panels in the embodiments of the present invention.

[0012] In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, comprising:

[0013] Providing a substrate;

[0014] An electrode unit is formed on one side of the base substrate, wherein the electrode unit includes a main electrode unit and a redundant electrode unit;

[0015] The first light emitting unit is electrically connected to the main electrode unit;

[0016] Forming a retaining wall structure and an opening between the retaining wall structures on the substrate, wherein the opening includes a first opening, and the redundant electrode unit is located in the first opening;

[0017] A functional structure is formed, wherein the functional structure fills a portion of the first opening, and the functional structure is at least partially located on a side of the redundant electrode unit away from the substrate.

[0018] The technical solution of the embodiment of the present invention is to set a base substrate, an electrode unit, a first light-emitting unit, a retaining wall structure and a functional structure in a display panel, wherein the electrode unit is set on one side of the base substrate, and the electrode unit includes a main electrode unit and a redundant electrode unit; the first light-emitting unit is electrically connected to the main electrode unit; an opening is formed between the retaining wall structures, and the opening includes a first opening, and the redundant electrode unit is located in the first opening; part of the functional structure fills the first opening, and the functional structure is at least partially located on the side of the redundant electrode unit away from the base substrate, and the retaining wall structure can be used to limit the functional structure so that the functional structure covers the redundant electrode unit. The embodiment of the present invention can solve the problem that the reflectivity of the exposed redundant electrode in the existing display panel is high and affects the display effect, and can reduce the reflection of the redundant electrode unit through the functional structure, avoid the redundant electrode unit from excessively reflecting light to form a mirror effect, and improve the display quality, or can use the functional structure to increase the light extraction efficiency of the light-emitting unit, improve the display brightness of the display panel, and also help reduce the power consumption of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0020] Figure 2 yes Figure 1 The cross-sectional structure diagram of the display panel along AA' is shown;

[0021] Figure 3 yes Figure 1 The cross-sectional structure diagram of the display panel along BB' is shown;

[0022] Figure 4 is a flow chart of a method for preparing a display panel provided by an embodiment of the present invention;

[0023] Figure 5 yes Figure 4 The structural flow chart of the method for preparing the display panel is shown;

[0024] Figure 6 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0025] Figure 7 is a flow chart of another method for preparing a display panel provided by an embodiment of the present invention;

[0026] Figure 8 yes Figure 7 The structural flow chart of the method for preparing the display panel is shown;

[0027] Fig. 9 yes Figure 2 The shown is a partial enlarged view of the dashed box a of the display panel;

[0028] Fig.10 yes Figure 3 The shown is a partial enlarged view of the dashed box b of the display panel;

[0029] Fig.11 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0030] Fig.12 yes Figure 1 The cross-sectional structure diagram of the display panel along CC' is shown;

[0031] Fig.13 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0032] Fig.14 is a structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0033] Fig.15 yes Fig.14 The cross-sectional structure diagram of the display panel along DD' is shown;

[0034] Fig.16 yes Fig.14 The cross-sectional structure diagram of the display panel along EE' is shown;

[0035] Fig.17 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0036] Fig.18 It is a structural schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0037] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0038] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention, Figure 2 yes Figure 1 The cross-sectional structure diagram of the display panel along AA' is shown. Figure 3 yes Figure 1 The cross-sectional structure diagram of the display panel along BB' is shown in FIG. Figure 1-Figure 3 The display panel includes a base substrate 10; an electrode unit 20 arranged on one side of the base substrate 10, the electrode unit including a main electrode unit 21 and a redundant electrode unit 22; a first light-emitting unit 31, the first light-emitting unit 31 is electrically connected to the main electrode unit 21; a retaining wall structure 40 and an opening 400 located between the retaining wall structures 40, the opening 400 includes a first opening 401, and the redundant electrode unit 22 is located in the first opening 401; a functional structure 50, the functional structure 50 (illustrated by white filling in the figure) fills part of the first opening 401, and the functional structure 50 is at least partially located on a side of the redundant electrode unit 22 away from the base substrate 10.

[0039] The base substrate 10 may be a rigid substrate, such as a glass substrate, or a flexible substrate, such as a substrate made of a flexible organic polymer material, which is not limited here. The base substrate 10 is provided with a pixel circuit for driving the light-emitting unit to emit light. Specifically, the base substrate 10 is also provided with an electrode unit 20, and the pixel circuit in the base substrate 10 is electrically connected to the light-emitting unit through the electrode unit 20, thereby driving the light-emitting unit to emit light.

[0040] In the embodiment of the present invention, the electrode unit 20 includes a main electrode unit 21 and a redundant electrode unit 22, wherein the main electrode unit 21 is electrically connected to the first light-emitting unit 31, and the redundant electrode unit 22 is used as a substitute for the main electrode unit 21 when the first light-emitting unit 31 emits abnormal light due to connection or failure, that is, the first light-emitting unit 31 with abnormal light emission is compensated by electrically connecting a new light-emitting unit to the redundant electrode unit 22. Here, the first light-emitting unit 31 can be understood as the main light-emitting unit, and the new light-emitting unit can be understood as the repair light-emitting unit. In addition, it can be understood that in order to reduce the process, in the actual preparation process, the redundant electrode unit 22 and the main electrode unit 21 are actually prepared simultaneously by the photolithography process in the same process, and there is no difference in their specific structure, material and function. The difference mainly lies in the design of the position of the electrode unit. The electrode unit corresponding to the connection with the first light-emitting unit 31 is the main electrode unit 21, and the rest can be considered as the redundant electrode unit 22.

[0041] It should be noted that the main electrode unit 21 and the redundant electrode unit 22 here can be the concept of an electrode pair, and the corresponding electrically connected light-emitting unit is a horizontal mini-LED, micro-LED or nano-LED, etc., that is, the two poles of the light-emitting unit are located on the same side of the light-emitting unit, and the two poles of the light-emitting unit correspond to the two electrodes in the electrically connected electrode pair, thereby realizing the binding of the light-emitting unit and the electrode unit.

[0042] In the embodiment of the present invention, a retaining wall structure 40 is further provided on the base substrate 10. One of the functions of the retaining wall structure 40 is to limit the area where the redundant electrode unit 22 is located. The retaining wall structure 40 can be understood as being composed of a plurality of cross-connected walls provided on the base substrate 10. A plurality of openings 400 can be formed between the cross-connected walls. The openings 400 here actually refer to the concept of an accommodation space surrounded by the base substrate 10 as the bottom and the retaining wall structure as the side wall. A film layer or structure can be provided on the opening 400 surrounded by the retaining wall structure 40 to cover the opening. The opening 400 here includes a first opening 401 formed by the wall surrounding the redundant electrode unit 22, that is, part of the retaining wall structure 40 is provided around the redundant electrode unit 22, and the opening 400 formed thereby, namely the first opening 401, can accommodate the redundant electrode unit 22. Reference Figure 1 , from a top view, the redundant electrode unit 22 is substantially located in the first opening 401 .

[0043] In addition, a functional structure 50 is also provided in the display panel of the embodiment of the present invention. The functional structure 50 refers to a structure that regulates the external light incident on the display panel or the light emitted by the light-emitting unit in the display panel. Specifically, the functional structure 50 can be a structure that reduces the reflection of the external light, which is used to prevent the display panel from forming a mirror effect. Of course, the functional structure 50 can also be a structure that extracts the light emitted by the light-emitting unit and increases the light extraction efficiency, which is used to improve the brightness of the display panel. In actual preparation, the glue layer of the functional structure 50 can be coated on the base substrate 10 as a whole layer, covering various structures on the base substrate 10, and then the whole glue layer is thinned by a thinning process to expose structures such as the retaining wall structure on the base substrate 10. In this process, the functional structure 50 can be filled in the opening 400 surrounded by the retaining wall structure 40 by utilizing the limiting effect of the retaining wall structure 40. Among them, the functional structure 50 is filled in the first opening 401, which is actually to cover the redundant electrode unit 22 with the functional structure 50. Specifically, part of the functional structure 50 in the first opening 401 is located on the side of the redundant electrode unit 22 away from the base substrate 10, that is, part of the structure is located on the redundant electrode unit 22. At the same time, when there is a gap between the redundant electrode unit 22 and the adjacent retaining wall structure 40, part of the functional structure 50 filled in the first opening 401 will extend to the gap area, that is, it will directly cover the base substrate 10 in the gap area. In addition, the functional structure 50 is only filled in part of the first opening 401, mainly because when the first light-emitting unit 31 is abnormal, it is necessary to electrically connect a new light-emitting unit to the corresponding redundant electrode unit 22. At this time, the functional structure 50 will not exist in the first opening 401 where the redundant electrode unit 22 is located.

[0044] It can be understood that when the functional structure 50 is made of a light-absorbing material such as a black glue material, and when the functional structure 50 is filled in the first opening 401 so that the functional structure 50 covers the redundant electrode unit 22, the functional structure 50 can be used to block external light from being incident on the redundant electrode unit 22, and the reflected light formed on the redundant electrode unit 22 can also be blocked to prevent it from emitting outward, thereby solving the problem of redundant electrode unit 22 reflecting light. When the functional structure 50 is made of a material with a higher transmittance, such as a white glue material, the functional structure 50 can be used to reflect the light incident laterally into the interior thereof, so that the light emitted laterally by the light-emitting unit can also be reflected by the functional structure and emitted to the outside, thereby increasing the light output of the light-emitting unit and improving the display brightness of the display panel. Of course, in the embodiment of the present invention, the functional structure 50 can also be set to use a material with a certain light transmittance and anti-reflection ability, such as a gray glue material, and the functional structure 50 can be used to reduce the reflection of the redundant electrode unit and increase the light output of the light-emitting unit, thereby improving the display effect of the display panel as a whole.

[0045] The black glue material, white glue material and gray glue material involved in the selection of the above-mentioned functional structure 50 can specifically be silicone or acrylic or epoxy resin-based materials. By doping black or TiO particles and controlling the doping ratio, the black, white or gray effects can be achieved. The glue material here is essentially the concept of a film material, which has good fluidity under medium and high temperature conditions (within 100°C), and will polymerize and become a solid under high temperature conditions (above 150°C). Therefore, in the actual preparation process, it is necessary to first use the bonding process of the optical glue material to bond the film material to the substrate, and then heat it to medium and high temperature conditions to fill it into the retaining wall structure 40, and then bake it at high temperature (above 150°C) for 1-2 hours to make the film material lose its viscosity and completely polymerize into a solid to achieve solidification.

[0046] With respect to the display panel provided in the above embodiment, the present invention also provides a method for preparing the display panel. Figure 4 is a flow chart of a method for preparing a display panel provided by an embodiment of the present invention, Figure 5 yes Figure 4 The structural flow chart of the display panel preparation method shown in FIG. Figure 4 and Figure 5 , the preparation method may include:

[0047] S110, providing a substrate;

[0048] refer to Figure 5 As shown in FIG. a), as mentioned above, the substrate 10 can be a flexible substrate or a rigid substrate, which is not limited here. A person skilled in the art can understand that the substrate 10 is not a simple substrate structure, but also has a pixel circuit structure for driving the light-emitting unit to emit light.

[0049] S120, forming an electrode unit on one side of the base substrate, wherein the electrode unit includes a main electrode unit and a redundant electrode unit;

[0050] refer to Figure 5 In the figure b), the electrode unit 20 can be directly formed by a deposition process using a mask, or can be formed by first preparing a whole electrode layer and then by a patterning process. Specifically, the deposition process can be a process such as thermal evaporation, magnetron sputtering, chemical vapor deposition, etc., and the patterning can be a photolithography process, etc. The electrode unit is generally made of silver, aluminum or alloy materials, which is not limited here.

[0051] S130, electrically connecting the first light-emitting unit to the main electrode unit;

[0052] refer to Figure 5As shown in Figure c), as mentioned above, the first light-emitting unit 31 can be a mini-LED, micro-LED or nano-LED, etc. Here, the first light-emitting unit 31 is electrically connected to the main electrode unit 21, which is essentially a process of binding the LED unit to the main electrode unit 21. Specifically, it can be a process of welding the electrodes of the LED to the electrodes in the main electrode unit 21 correspondingly by using hot-melt solder after cooling.

[0053] S140, forming a retaining wall structure and an opening located between the retaining wall structures on the substrate, wherein the opening includes a first opening, and the redundant electrode unit is located in the first opening;

[0054] refer to Figure 5 In Figure e), the retaining wall structure 40 is actually formed by coating a whole layer of retaining wall structure adhesive, and then etching and developing it through a graphic process such as a photolithography process to retain the solidified area. It can be understood that the opening 400 can be formed simultaneously during the etching process, and the redundant electrode unit 22 will be exposed in a part of the opening 400, namely the first opening 401.

[0055] S150, forming a functional structure, wherein the functional structure fills a portion of the first opening, and the functional structure is at least partially located on a side of the redundant electrode unit away from the substrate.

[0056] refer to Figure 5 h), the specific preparation process of the functional structure 50 is as described above, and will not be repeated here. It should also be added that after the adhesive layer is laminated by the optical adhesive bonding process, and after heating to make it flow and fill in the first opening 401, the retaining wall structure 40 may still be covered with adhesive. Therefore, after the adhesive is cured by high-temperature baking, the adhesive layer needs to be thinned to expose the retaining wall structure 40, which will be described in detail later.

[0057] The technical solution of the embodiment of the present invention is to set a base substrate, an electrode unit, a first light-emitting unit, a retaining wall structure and a functional structure in a display panel, wherein the electrode unit is set on one side of the base substrate, and the electrode unit includes a main electrode unit and a redundant electrode unit; the first light-emitting unit is electrically connected to the main electrode unit; an opening is formed between the retaining wall structures, and the opening includes a first opening, and the redundant electrode unit is located in the first opening; part of the functional structure fills the first opening, and the functional structure is at least partially located on the side of the redundant electrode unit away from the base substrate, and the retaining wall structure can be used to limit the functional structure so that the functional structure covers the redundant electrode unit. The embodiment of the present invention can solve the problem that the reflectivity of the exposed redundant electrode in the existing display panel is high and affects the display effect, and can reduce the reflection of the redundant electrode unit through the functional structure, avoid the redundant electrode unit from excessively reflecting light to form a mirror effect, and improve the display quality, or can use the functional structure to increase the light extraction efficiency of the light-emitting unit, improve the display brightness of the display panel, and also help reduce the power consumption of the display panel.

[0058] Continue to refer Figure 1-Figure 3 The display panel also includes: a second light-emitting unit 32; the opening 400 also includes a second opening 402, and the second light-emitting unit 32 is located at the second opening 402; a first packaging structure 61, the first packaging structure 61 fills the second opening 402, and the first packaging structure 61 is at least partially located on a side of the second light-emitting unit 32 away from the base substrate 10.

[0059] Among them, the second light-emitting unit 32 is essentially a repair light-emitting unit provided for the abnormal part of the first light-emitting unit 31 when the light emission of part of the first light-emitting unit 31 is abnormal. From a simple point of view, there is no essential difference in structure and function between the two light-emitting units. The difference mainly lies in the different designed positions in the display panel, and the second light-emitting unit 32 is a substitute light-emitting unit for the first light-emitting unit 31. The second light-emitting unit 32 can also adopt mini-LED, micro-LED or nano-LED, etc., which is not limited here. In addition, a pixel circuit is also provided on the base substrate 10 for the redundant electrode unit 22, and the pixel circuit is electrically connected to the second light-emitting unit 32 through the redundant electrode unit 22, so that the second light-emitting unit 32 can be driven to emit light.

[0060] In the embodiment of the present invention, the display panel is further provided with a first encapsulation structure 61, which is a structure for separately encapsulating the second light-emitting unit 32 after the second light-emitting unit 32 is formed. It should be emphasized that the retaining wall structure 40 in the embodiment of the present invention limits the area where the redundant electrode unit 22 is located, and also limits the area where the second light-emitting unit 32 electrically connected to the redundant electrode unit 22 is located. Another important function of the retaining wall structure 40 is to assist in forming the first encapsulation structure 61 through the limiting function when encapsulating the second light-emitting unit 32. It can be seen that the first encapsulation structure 61 is actually a structure that fills the opening 400 surrounded by the retaining wall structure 40 where the second light-emitting unit 32 is provided, that is, the second opening 402, and protects the second light-emitting unit 32 in the second opening 402. Further, in detail, the first encapsulation structure 61 is essentially a partial structure located on the side of the second light-emitting unit 32 away from the base substrate 10, that is, located above the second light-emitting unit 32. Meanwhile, when there is a gap between the second light emitting unit 32 and the adjacent retaining wall structure 40 , part of the first encapsulation structure 61 filled in the second opening 402 will extend to the gap area, that is, will directly cover the base substrate 10 in the gap area.

[0061] It is also worth noting that, since the functional structure 50 is filled in the first opening 401 and the first encapsulation structure 61 is filled in the second opening 402, when preparing the functional structure 50 and the first encapsulation structure 61, it is necessary to at least clearly define the position of the first opening 401 or the position of the second opening 402. In actual preparation, in the embodiment of the present invention, the position of the second opening 402 can be optionally determined according to the second light-emitting unit 32, and the first encapsulation structure 61 can be accurately filled in the second opening 402 through a printing process.

[0062] It can be seen from this that the display panel manufacturing method provided by the present invention may further include the step of forming a second light-emitting unit and a first encapsulation structure. Figure 4 and Figure 5 In the above preparation method, after step S130 and before step S150, the following steps may also be included:

[0063] S141. Electrically connect a second light-emitting unit to a portion of the redundant electrode units, wherein the opening further includes a second opening, and the second light-emitting unit is located in the second opening.

[0064] refer to Figure 5f), where, as described above, the second light emitting unit 32 may also be a mini-LED, micro-LED or nano-LED, etc. Here, the second light emitting unit 32 is electrically connected to the part of the redundant electrode unit 22, which can also be understood as the process of binding the LED unit to the redundant electrode unit 22. Specifically, it can also be the process of welding the electrodes of the LED to the electrodes in the main electrode unit 21 correspondingly by using hot-melt solder after cooling.

[0065] Furthermore, based on the above preparation method, before step S141, the following steps need to be set:

[0066] S1401, detecting a failed first light-emitting unit, and determining a position of a main electrode unit of the failed first light-emitting unit.

[0067] It can be understood that the second light-emitting unit 32 is essentially a substitute light-emitting unit for the failed first light-emitting unit 31. Therefore, before electrically connecting the second light-emitting unit 32 to the partially redundant electrode unit 22, it is necessary to first determine the position of the partially redundant electrode unit 22, that is, it is necessary to detect the position of the failed first light-emitting unit 31, and then determine the position of the redundant electrode unit 22 that needs to be electrically connected to the second light-emitting unit 32 based on the position of the failed first light-emitting unit 31.

[0068] Therefore, step S141 can be specifically implemented as follows: S1411 , electrically connecting the second light emitting unit 32 to the redundant electrode unit 22 disposed adjacent to the main electrode unit 21 of the failed first light emitting unit 31 .

[0069] Furthermore, after the above step S141, the following steps may also be included:

[0070] S142, filling a first packaging structure in the second opening, wherein the first packaging structure is at least partially located on a side of the second light-emitting unit away from the base substrate.

[0071] refer to Figure 5 g), the process of forming the first encapsulation structure 61 in this step is essentially a process of accurately filling the second opening 402 with the first encapsulation structure 61 based on the known second opening 402. In the actual preparation process, the first encapsulation structure 61 can be filled with a transparent resin material to fill the second opening 402 surrounded by the retaining wall structure 40, and then cured by ultraviolet light, so as to achieve the encapsulation of the second light-emitting unit 32 in the second opening 402.

[0072] Therefore, this step S142 can also be concretized to obtain two specific sub-steps:

[0073] S1421, determining that an opening surrounded by the retaining wall structure corresponding to the redundant electrode unit electrically connected to the second light-emitting unit is a second opening;

[0074] S1422, using a printing process to fill the second opening to form a first packaging structure.

[0075] The printing process here specifically uses a high-precision printing device to scan the position of the redundant electrode unit 22 bound with the second light-emitting unit 32, that is, the position of the second opening 402 provided with the second light-emitting unit 32 is first determined by scanning. Then, a transparent resin is printed in the second opening 402, and finally, the transparent resin in the second opening 402 is cured by ultraviolet light, thereby forming a stable first packaging structure 61.

[0076] It can be understood that after the batch transfer of the first light-emitting unit 31 is completed and the electrical connection with the main electrode unit 21 is achieved, there is a certain probability that the first light-emitting unit 31 will fail. Moreover, because the failed first light-emitting unit 31 is random, the position of the redundant electrode unit 22 that needs to be electrically connected to the second light-emitting unit 32, that is, the redundant electrode unit that needs to be repaired, is not fixed. After the electrical connection of the second light-emitting unit 32 is completed, that is, the repair is completed, even if the position of the repaired second light-emitting unit 32 has been determined, when covering the functional structure 50 on the redundant electrode unit 22 that is not connected to the second light-emitting unit 32, the preparation process that requires a mask such as nanoimprinting is not applicable. The reason is that the position of the second light-emitting unit 32 is not the same on different panels. The mask sets an opening according to the position of the redundant electrode unit 2 that is not connected to the second light-emitting unit 32 on a certain panel. When making the functional structure 50 covering the redundant electrode unit 22, it is only applicable to the single panel and not to other panels. Therefore, the process of forming the functional structure 50 using the preparation process that requires a mask is not applicable to industrial batch production.

[0077] However, the preparation method provided by the embodiment of the present invention is to use a printing process to accurately print the second light-emitting unit 32 that has been determined on each display panel to form a packaging structure. In the actual preparation process, the position of the second light-emitting unit 32 is determined by scanning the panel, and then the second light-emitting unit 32 is printed and packaged. After the packaging of the second light-emitting unit 32 is completed, the functional structure adhesive layer is coated on the entire base substrate 10, so that the functional structure adhesive layer is filled into the opening 400 corresponding to the redundant electrode unit 22 that is not connected to the second light-emitting unit 32. This process can not only effectively package the second light-emitting unit 32, prevent the second light-emitting unit 32 from being damaged by the outside, and ensure the service life of the second light-emitting unit 32, but also accurately package the second light-emitting unit 32 with random positions, and cover the functional structure 50 on the redundant electrode unit 22 that is not connected to the second light-emitting unit 32. The whole process is more free and flexible, and can meet the needs of industrial mass production.

[0078] It should be noted that the above embodiment exemplifies that after forming the second encapsulation structure, the second light-emitting unit is electrically connected in the redundant electrode unit 22 of the second opening 402, that is, after the first light-emitting unit 31 is encapsulated, the second light-emitting unit 32 is used for repair. However, since the second encapsulation structure 62 and the retaining wall structure 40 are formed synchronously during the actual preparation process, when the second light-emitting unit 32 is bound to the redundant electrode unit 22 provided with the retaining wall structure 40, it may be restricted by the retaining wall structure 40, affecting the binding effect. Based on this, in the embodiment of the present invention, it can be considered to use laser transfer to perform repair after encapsulation, so as to avoid the influence of the retaining wall structure 40 on the binding of the second light-emitting unit 32.

[0079] In other embodiments of the present invention, before encapsulating the first light-emitting unit, the failed first light-emitting unit may be determined first, and then the second light-emitting unit 32 may be used for repair, and finally the first light-emitting unit 31 may be encapsulated and the second light-emitting unit 32 may be encapsulated. In summary, the order of encapsulating the first light-emitting unit 31 and repairing the first light-emitting unit 31 and the second light-emitting unit 32 in the embodiments of the present invention is not limited, and those skilled in the art may select and design according to actual needs.

[0080] Based on the actual preparation process of the first packaging structure, the first packaging structure in the embodiment of the present invention is designed to form a specific shape, which is introduced below. Figure 2 The first packaging structure 61 includes a top surface 610, which is located on a side of the first packaging structure 61 away from the base substrate 10 in a direction perpendicular to the plane where the base substrate 10 is located; the top surface 610 is an arc surface, and the top surface 610 bulges in a direction away from the base substrate 10.

[0081] During actual preparation, the first encapsulation structure 61 will first be filled in the second opening 402 with a flexible adhesive material to cover the second light-emitting unit 32, and then the first encapsulation structure 61 will be formed by curing to protect the second light-emitting unit 32. In an embodiment of the present invention, in order to ensure the encapsulation effect of the first encapsulation structure 61, the flexible adhesive material will usually completely fill the second opening 402. At the same time, since the light emitted by the second light-emitting unit 32 needs to be emitted outward through the first encapsulation structure 61, in a specific embodiment, the first encapsulation structure 61 can be optionally provided to include a top surface 610, and the top surface 610 is a convex arc surface. During the preparation process, the material of the cured first encapsulation structure 61 is relatively hard. When the functional structure is thinned, the thinning process has a relatively small effect on the cured first encapsulation structure 61, and the convex arc surface formed by the curing of the first encapsulation structure 61 can be retained. In terms of specific form, the top surface 610 is located on the side of the first encapsulation structure 61 away from the base substrate 10, that is, on the upper surface of the first encapsulation structure 61. The top surface 610 is an arc surface, and the arc surface 610 is convex in the direction away from the base substrate 10, that is, the arc surface 610 is convex upward. Based on this design, in actual preparation, the flexible adhesive can be filled in the second opening 402 in a relatively excessive amount to form the above-mentioned convex arc surface. The convex arc surface on the first packaging structure 61 can achieve a convex lens-like effect, which can focus the light emitted by the second light-emitting unit 32 inside it and emit it upward, thereby ensuring the light extraction efficiency of the second light-emitting unit 32.

[0082] Continue to refer Figure 2 , in the direction perpendicular to the base substrate 10, the height difference between the top surface 610 and the surface of the retaining wall structure 40 away from the base substrate 10 is less than or equal to 6 μm. The surface of the retaining wall structure 40 away from the base substrate 10 refers to the upper surface of the retaining wall structure 40, and its height relative to the base substrate 10 is as follows: Figure 2 The height of the top surface 610 on the base substrate 10 is shown as H1. Figure 2 As shown, H2, where H2-H1≤6μm is set, can ensure that the first packaging structure 61 has a convex arc surface of a certain height, that is, the convex arc surface has a certain curvature, and the convex arc surface is used to achieve effective light focusing effect, so that the light emitted by the second light-emitting unit 32 in the first packaging structure 61 is emitted outward as much as possible.

[0083] Considering that light emitting units of different colors may have inconsistent light emitting efficiencies, in the embodiment of the present invention, when packaging the second light emitting units, the light emitting effects of the second light emitting units of different colors can be balanced. Figure 2Optionally, the second light-emitting unit 32 includes a first color light-emitting unit 321 and a second color light-emitting unit 322; the first encapsulation structure 61 includes a first sub-encapsulation structure 611 and a second sub-encapsulation structure 612, the first sub-encapsulation structure 611 corresponds to the first color light-emitting unit 321, and the second sub-encapsulation structure 612 corresponds to the second color light-emitting unit 322; the orthographic projection area of ​​the top surface of the first sub-encapsulation structure 611 on the base substrate 10 is smaller than the orthographic projection area of ​​the top surface of the second sub-encapsulation structure 612 on the base substrate 10; wherein the wavelength of light emitted by the first color light-emitting unit 321 is greater than the wavelength of light emitted by the second color light-emitting unit 322.

[0084] Here, the first color light emitting unit 321 and the second color light emitting unit 322 can be understood as a red light emitting unit and a green light emitting unit, respectively. In comparison, the red light emitting unit has a lower light emitting efficiency. Of course, this embodiment can also be applied to any two other light emitting units with different light emitting efficiencies, such as a green light emitting unit and a blue light emitting unit.

[0085] Based on this, in the embodiment of the present invention, the first encapsulation structure 61 for the first color light-emitting unit 321 and the second color light-emitting unit 322 is set differently, with the purpose of using different first encapsulation structures 61 to balance the light output of the two color light-emitting units. Specifically, the first color light-emitting unit 321 corresponds to the first sub-encapsulation structure 611, which means that the first sub-encapsulation structure 611 is filled in the second opening 402 where the first color light-emitting unit 321 is located, and the first sub-encapsulation structure 611 is at least partially located on the side of the first color light-emitting unit 321 away from the base substrate 10. Similarly, the second color light-emitting unit 322 corresponds to the second sub-encapsulation structure 612, which means that the second sub-encapsulation structure 612 is filled in the second opening 402 where the second color light-emitting unit 322 is located, and the second sub-encapsulation structure 612 is at least partially located on the side of the second color light-emitting unit 322 away from the base substrate 10. In this embodiment, the orthographic projection area of ​​the top surface of the first sub-package structure 611 on the base substrate 10 is set to be smaller than the orthographic projection area of ​​the top surface of the second sub-package structure 612 on the base substrate 10. In essence, by reducing the orthographic projection area of ​​the top surface of the first sub-package structure 611, the curvature of the top surface of the first sub-package structure 611 can be made more obvious in the two sub-package structures with the same height. The first color light-emitting unit 321 can achieve a more effective light focusing effect through the more obvious protrusion of the top surface, so that the light emitted by the first color light-emitting unit 321 in the first sub-package structure 611 is emitted more outward, thereby compensating for the lower light-emitting efficiency of the first color light-emitting unit 321, so as to achieve a balance in the light output of the two color light-emitting units, balance the brightness of the light-emitting units with different light-emitting efficiencies, and ensure the display effect.

[0086] Figure 6is a schematic cross-sectional view of another display panel provided by an embodiment of the present invention, referring to Figure 6 In another embodiment of the present invention, optionally, the second light-emitting unit 32 includes a first color light-emitting unit 321 and a second color light-emitting unit 322; the first encapsulation structure 61 includes a first sub-encapsulation structure 611 and a second sub-encapsulation structure 612, the first sub-encapsulation structure 611 corresponds to the first color light-emitting unit 321, and the second sub-encapsulation structure 612 corresponds to the second color light-emitting unit 322; the cross-sectional shape of the top surface of the first sub-encapsulation structure 611 on the first plane is a first arc, and the cross-sectional shape of the top surface of the second sub-encapsulation structure 612 on the first plane is a second arc, and the curvature radius r1 corresponding to the first arc is smaller than the curvature radius r2 corresponding to the second arc; wherein the first plane is a plane perpendicular to the substrate 10.

[0087] As described above, since the top surface 610 of the first encapsulation structure 61 is a convex curved surface, an arc will be formed in the cross section of the top surface on the plane perpendicular to the substrate 10, i.e., the first plane. The purpose of setting the top surface of the encapsulation structure as a convex curved surface in the embodiment of the present invention is to make the encapsulation structure form an effect similar to a convex lens, and those skilled in the art will know that the greater the curvature of the surface of the convex lens, the smaller its focal length and the higher its focusing ability. Therefore, by distinguishing the curvature of the top surfaces of the first sub-encapsulation structure 611 and the second sub-encapsulation structure 612 corresponding to the first color light-emitting unit 321 and the second color light-emitting unit 322, respectively, and changing the focusing ability of the two sub-encapsulation structures, the light extraction efficiency of the first color light-emitting unit 321 and the second color light-emitting unit 322 can be further balanced. Specifically, in the present embodiment, a curvature radius r1 of a first arc corresponding to the top surface of the first sub-package structure 611 is set to be smaller than a curvature radius r2 of a second arc corresponding to the top surface of the second sub-package structure 612. In essence, the curvature of the top surface of the first sub-package structure 611 is relatively increased, thereby relatively improving the focusing ability of the first sub-package structure 611, so that the emitted light of the first color light-emitting unit 321 with lower light-emitting efficiency in the first sub-package structure 611 can further balance the brightness of the light-emitting units with different light-emitting efficiencies, thereby ensuring the display effect.

[0088] Continue to refer Figure 1 and Figure 3 The display panel also includes: a second encapsulation structure 62, the second encapsulation structure 62 is at least partially located on the side of the first light-emitting unit 31 away from the substrate 10, and the orthographic projection of the second encapsulation structure 62 on the substrate 10 covers the orthographic projection of the first light-emitting unit 31 on the substrate 10; the distance from the surface of the second encapsulation structure 62 on the side away from the substrate 10 to the substrate 10 is equal to the distance from the surface of the retaining wall structure 40 on the side away from the substrate 10 to the substrate 10.

[0089] The second packaging structure 62 is a packaging structure formed by batch packaging each first light-emitting unit 31 after the first light-emitting units 31 are batch transferred and bound to the corresponding main electrode units 21. Specifically, after the first light-emitting units 31 are batch transferred and bound to the corresponding main electrode units 21, a whole layer of packaging glue layer can be coated on the base substrate 10, and then the packaging glue layer is patterned by a photolithography process, so as to form an independent second packaging structure 62 for each first light-emitting unit 31.

[0090] In order to ensure a good packaging effect, the second packaging structure 62 needs to completely cover the first light-emitting unit 31. From a projection perspective, the orthographic projection of the second packaging structure 62 on the base substrate 10 covers the orthographic projection of the first light-emitting unit 31 on the base substrate 10. In addition, part of the second packaging structure 62 is located on the first light-emitting unit 31, that is, on the side of the first light-emitting unit 31 away from the base substrate 10. At the same time, part of the second packaging structure 62 also extends to the peripheral area of ​​the first light-emitting unit 31, directly covering the base substrate 10 in the peripheral area of ​​the first light-emitting unit 31.

[0091] Based on this, the preparation method provided in the above embodiment may also include a process of preparing a second packaging structure. Figure 4 and Figure 5 After step S130, the following steps may also be included:

[0092] S131. Form a second packaging structure, where the second packaging structure is at least partially located on a side of the first light-emitting unit away from the base substrate, and an orthographic projection of the second packaging structure on the base substrate covers an orthographic projection of the first light-emitting unit on the base substrate.

[0093] refer to Figure 5 d), the specific preparation process of the second packaging structure 62 is as described above and will not be repeated here.

[0094] However, the present invention also provides a simpler preparation method for the retaining wall structure and the second packaging structure. Figure 7 is a flow chart of another method for preparing a display panel provided by an embodiment of the present invention, Figure 8 yes Figure 7 The structural flow chart of the display panel preparation method is shown in FIG. Figure 4 and Figure 5 as well as Figure 7 and Figure 8 Based on the preparation method provided in the above embodiment, step S131 and step S140 can be prepared and formed simultaneously using the same process step, that is, the above step S131 and step S140 can be specifically replaced by the following two sub-steps:

[0095] S1310, forming an encapsulation layer on the base substrate, wherein the encapsulation layer is at least partially located on a side of the first light-emitting unit and the electrode unit away from the base substrate, and an orthographic projection of the encapsulation layer on the base substrate covers an orthographic projection of the first light-emitting unit and the electrode unit on the base substrate;

[0096] S1400, patterning the packaging layer using a photolithography process to form a second packaging structure and a retaining wall structure.

[0097] Based on this, reference Figure 7 , wherein d) shows the process of forming the encapsulation layer 60 on the substrate, specifically the process of coating a whole layer of adhesive. e) shows the process of photolithography patterning the encapsulation layer 60 according to the positions of the main electrode unit 21 and the redundant electrode unit 22, and simultaneously forming the second encapsulation structure 62 and the retaining wall structure 40, that is, the second encapsulation structure 62 and the retaining wall structure 40 are simultaneously formed in the same process, and there is no order of precedence.

[0098] It is worth noting that if Figure 4 and Figure 5 In the preparation process shown, the second encapsulation structure 62 and the retaining wall structure 40 are essentially realized in two processes, and the specific implementation method can adopt the adhesive layer coating and photolithography patterning process. Obviously, for the process steps of separately forming the second encapsulation structure 62 and the retaining wall structure 40, the shape, material, etc. of the second encapsulation structure 62 and the retaining wall structure 40 can be independently designed, so as to use the second encapsulation structure 62 and the retaining wall structure 40 to independently adjust the light output performance of the first light-emitting unit 31 and the second light-emitting unit 32, so as to avoid mutual influence. Figure 7 and Figure 8 In the manufacturing process shown, the second packaging structure 62 and the retaining wall structure 40 are formed simultaneously using the same process, which can save steps and masks and reduce time and material costs.

[0099] It should also be emphasized that in the embodiment of the present invention, since the functional structure 50 is prepared by a process of whole-layer coating and then thinning, the retaining wall structure 40 and the second encapsulation structure 62 need to be exposed by thinning, and since the thinning process is applied to the entire panel, the retaining wall structure 40 and the second encapsulation structure 62, which are relatively soft in material, will be thinned simultaneously. Therefore, in an actual display panel, the upper surfaces of the retaining wall structure 40 and the second encapsulation structure 62 will remain at the same height on the base substrate 10, that is, the distance from the surface of the second encapsulation structure 62 away from the base substrate 10 to the base substrate 10 is equal to the distance from the surface of the retaining wall structure 40 away from the base substrate 10 to the base substrate 10.

[0100] Therefore, in the preparation method provided by the embodiment of the present invention, step S150 may specifically include the following steps:

[0101] S151, attaching a functional structure adhesive layer to a side of the base substrate where the retaining wall structure is provided in a vacuum heating environment, wherein the orthographic projection of the functional structure adhesive layer on the base substrate covers the retaining wall structure, the opening between the retaining wall structures, and the orthographic projection of the first packaging structure on the base substrate;

[0102] The specific steps of laminating the adhesive layer here can be referred to as described above, and will not be repeated here.

[0103] S152. Use an ashing process or a wet etching process to thin the functional structure adhesive layer to form a functional structure.

[0104] Among them, step S152 can specifically be a process of ashing the entire surface, or a process of immersing the entire surface in a solution for wet etching. The ashing and wet etching can remove the excess functional structure adhesive layer covering the retaining wall structure 40, while exposing the first packaging structure 61 and the second packaging structure 62 to ensure the light output of the light-emitting unit therein.

[0105] Of course, considering the errors in the thinning process and the fact that the thinning process will form a rough surface, there may be a certain error in the height of the upper surface of the second packaging structure 62 and the upper surface of the retaining wall structure 40, or there may be a certain error in the height of the local area of ​​the upper surface of the second packaging structure 62 and the upper surface of the retaining wall structure 40. The error range is limited to 30% here, and it can be considered that the upper surfaces of the retaining wall structure 40 and the second packaging structure 62 are maintained at the same height on the substrate 10.

[0106] It should also be noted that the second packaging structure 62 needs to transmit outward the emitted light of the first light-emitting unit 31 therein, and the first packaging structure 61 needs to transmit outward the emitted light of the second light-emitting unit 32 therein. In order to avoid light emission differences between the two light-emitting units due to different packaging structures, the first packaging structure 61 and the second packaging structure 62 can be made of materials with the same or similar refractive index to eliminate the light type differences between the two light-emitting units.

[0107] Further, Fig. 9 yes Figure 2 The enlarged view of the part of the dashed box a of the display panel is shown. Fig.10 yes Figure 3 The enlarged view of the part of the dashed box b of the display panel is shown, refer to Fig. 9 and Fig.10 Based on the above-mentioned thinning process, in the display panel actually formed, at least part of the surface of the retaining wall structure 40 and the second encapsulation layer 62 away from the base substrate 10 is a rough concave-convex surface.

[0108] While thinning the adhesive layer of the functional structure using a thinning process, the retaining wall structure 40, the second encapsulation layer 62 and the first encapsulation structure 61 will be exposed, and the upper surface of the exposed retaining wall structure 40, the second encapsulation layer 62 and the first encapsulation structure 61, that is, the surface on the side away from the base substrate 10, can be roughened to achieve diffuse reflection, which helps to avoid specular reflection after the external light enters the display panel, thereby further reducing the reflectivity of the display panel. For the first encapsulation structure 61, the roughened surface also helps to reduce the probability of total reflection of the internal light at the interface, increase the light emitted by the internal light-emitting unit to the outside, and improve the light extraction efficiency of the internal light-emitting unit.

[0109] In addition, as described in steps S1310 and S1400 above, for the above-mentioned retaining wall structure 40 and the second encapsulation structure 62, in the embodiment of the present invention, the retaining wall structure 40 and the second encapsulation structure 62 can be prepared and formed by the same material in the same process, that is, the retaining wall structure 40 and the second encapsulation structure 62 are made of the same material. In the preparation process of the second encapsulation structure 62 as described above, the retaining wall structure 40 can be formed. Specifically, a whole layer of encapsulation adhesive layer is coated on the base substrate 10, and then the encapsulation adhesive layer is patterned by an etching process. The mask used for patterning is designed with an opening pattern of the second encapsulation structure 62 and an opening pattern of the retaining wall structure 40. The mask can be used to etch the whole layer of encapsulation adhesive layer to form the second encapsulation structure 62 covering the first light-emitting unit 31 and the retaining wall structure 40 surrounding the redundant electrode unit 22.

[0110] Further, continue to refer to Figure 3 In the display panel, the second encapsulation structure 62 includes a third side surface 623 and a first surface 621. The third side surface 623 is located on one side of the second encapsulation layer 62 along the first direction 1, and the first direction 1 is parallel to the plane where the base substrate 10 is located; in the direction perpendicular to the plane where the base substrate 10 is located, the first surface 621 is located on the side of the second encapsulation structure 62 away from the base substrate 10; the angle between the third side surface 623 and the first surface 621 is a third angle α3, and the third angle α3 is an acute angle.

[0111] In the embodiment of the present invention, when preparing the second encapsulation structure, the encapsulation glue layer can be patterned by using a photolithography process, wherein a negative photoresist can be used. It is known to those skilled in the art that when a negative photoresist is used, the photoresist in the exposed area will be denatured and solidified, and the encapsulation glue layer in the solidified area will be retained during the development process, and due to the over-etching effect of the developer, the bottom of the solidified area is etched more severely than the top, which will make the retained encapsulation glue layer, that is, the second encapsulation structure 62, present an inverted table-like structure. Here, the third side 623 is essentially the inclined side wall of the second encapsulation structure 62 as an inverted table-like structure, and the first surface 623 is essentially the bottom surface of the second encapsulation structure 62 as an inverted table-like structure with a larger area, which can also be understood as the upper surface of the inverted table-like structure. Based on the actual preparation process, the angle between the third side surface 623 and the first surface 621 in the second packaging structure 62 of the embodiment of the present invention, that is, the third angle α3, is actually the upper vertex angle of the inverted table-like structure. The third angle α3 is an acute angle, which indicates that in the upward direction perpendicular to the substrate 10, the side wall of the second packaging structure 62 is inclined outward, that is, the upper surface area of ​​the second packaging structure 62 is larger than the lower surface area, which indicates that the second packaging structure 62 is an inverted table-like structure.

[0112] refer to Figure 3 It can be seen from the light path shown that the inverted table-shaped second packaging structure 62 has an outwardly inclined side wall, and the light emitted by the first light-emitting unit 31 will be reflected upward by the third side surface 623 when it is incident on the side wall, i.e., the third side surface 623. That is, by reasonably designing the second packaging structure 62 to form an inverted table-shaped structure, its inclined side wall can be used to emit as much light as possible from the light-emitting unit encapsulated therein to the front of the display panel, thereby improving the light extraction efficiency of the first light-emitting unit.

[0113] Similarly, considering that light-emitting units of different colors may have inconsistent light-emitting efficiencies, the second packaging structure may be designed differently in the embodiment of the present invention so that first light-emitting units of different colors have relatively balanced light-emitting efficiencies. Fig.11 is a schematic cross-sectional view of another display panel provided by an embodiment of the present invention, referring to Fig.11 In another embodiment of the present invention, the first light-emitting unit 31 includes a third color light-emitting unit 313 and a fourth color light-emitting unit 314, and the wavelength of light emitted by the third color light-emitting unit 313 is greater than the wavelength of light emitted by the fourth color light-emitting unit 314. The third angle α3' of the second encapsulation structure 62 located on the side of the third color light-emitting unit 313 away from the base substrate 10 is smaller than the third angle α3" of the second encapsulation structure 62 located on the side of the fourth color light-emitting unit 313 away from the base substrate 10.

[0114] As can be seen from the above, the third color light emitting unit 313 and the fourth color light emitting unit 314 can also be understood as a red light emitting unit and a green light emitting unit, respectively. In comparison, the light emitting efficiency of the red light emitting unit is lower. In this embodiment, the third angle α3' of the second encapsulation structure 62 covering the red light emitting unit is set to be relatively small, which actually means that the side wall of the second encapsulation structure 62 is set to be more inclined, and the inclination angle is closer to 45°. Fig.11 As can be understood from the optical path shown, when the side wall inclination angle is closer to 45°, the light emitted laterally from the red light emitting unit can be emitted through the side wall in a direction perpendicular to the substrate 10 and upward. By setting the side wall inclination angles of the second packaging structure corresponding to light emitting units of different colors differently, the light emitting units with lower light emitting efficiency can emit more light to the front of the display panel, thereby achieving the effect of balancing the light output of light emitting units of different colors and reducing the brightness difference between light emitting units of different colors.

[0115] Since the retaining wall structure and the second packaging structure are actually manufactured by the same process, namely the photolithography process, based on the same principle, the retaining wall structure will also be an inverted table-like structure. Fig.12 yes Figure 1 The cross-sectional structure diagram of the display panel along CC' is shown in FIG. Figure 1 and Fig.12 The retaining wall structure 40 includes a fourth side surface 414 and a second surface 422. The fourth side surface 414 is located on one side of the retaining wall structure 40 along the first direction 1, perpendicular to the direction of the plane where the substrate 10 is located, and the second surface 422 is located on the side of the retaining wall structure 40 away from the substrate 10; the angle between the fourth side surface 414 and the second surface 422 is a fourth angle α4, the third angle α3 is less than the fourth angle α4, and the fourth angle α4 is an acute angle. The fourth side surface 414 is essentially the inclined side wall of the retaining wall structure 40 as an inverted table-like structure, and the second surface 422 is essentially the bottom surface of the retaining wall structure 40 as an inverted table-like structure with a larger area, which can also be understood as the upper surface of the inverted table-like structure. Similarly, the angle between the fourth side surface 414 and the second surface 422 in the retaining wall structure 40, i.e., the fourth angle α4, is actually the upper vertex angle of the inverted table-like structure. The fourth angle α4 is an acute angle, which indicates that in the upward direction perpendicular to the substrate 10, the side wall of the retaining wall structure 40 is inclined outward, that is, the upper surface area of ​​the retaining wall structure 40 is larger than the lower surface area, which means that the retaining wall structure 40 is an inverted table-like structure.

[0116] In addition, since the spacing between adjacent second packaging structures 62 is greater than the spacing between adjacent retaining wall structures 40, when preparing the second packaging structures 62 and the retaining wall structures 40, the adhesive material at the gap between the second packaging structures 62 with a larger spacing is more severely overetched during development and etching, that is, the etching liquid will etch more at the bottom of the second packaging structure 62, and ultimately the bottom surface area of ​​the second packaging structure 62 formed after development will be smaller than the bottom surface area of ​​the retaining wall structure 40, and the side wall of the second packaging structure 62 will also be relatively more inclined, such as Fig. 9 As shown, the third angle α3 of the second packaging structure 62 is smaller than the fourth angle α4 of the retaining wall structure 40 .

[0117] Fig.13 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, referring to Figure 1 and Fig.13 In another embodiment of the present invention, the first opening 401 may include a first sub-opening 4011 and a second sub-opening 4012; the retaining wall structure 40 includes a first side surface 411 away from the first sub-opening 4011 and a second side surface 412 away from the second sub-opening 4012; the angle between the first side surface 411 and the surface of the retaining wall structure 40 away from the base substrate 10 is a first angle α1, and the angle between the second side surface 412 and the surface of the retaining wall structure 40 away from the base substrate 10 is a second angle α2; wherein, one of the first angle α1 and the second angle α2 is greater than the other.

[0118] Here, the first opening 401 is provided to include two sub-openings, which is essentially a different arrangement of the retaining wall structures 40 surrounding the two sub-openings. Specifically, the side of the retaining wall structure 40 that is away from the first sub-opening 4011, namely the first side 411, refers to the side of the retaining wall structure 40 that is away from the first sub-opening 4011 in the direction parallel to the substrate 10. Similarly, the side of the retaining wall structure 40 that is away from the second sub-opening 4012, namely the second side 412, refers to the side of the retaining wall structure 40 that is away from the second sub-opening 4012 in the direction parallel to the substrate 10. Here, the angle between the first side surface 411 and the side surface, i.e., the upper surface, of the retaining wall structure 40 away from the base substrate 10 is set to be a first angle α1, and the angle between the second side surface 412 and the side surface, i.e., the upper surface, of the retaining wall structure 40 away from the base substrate 10 is set to be a second angle α2, and one of the first angle α1 and the second angle α2 is set to be greater than the other. In essence, the inclination angles of the two side surfaces of the retaining wall structure 40 are set differently, so as to adjust the light output efficiency of adjacent light-emitting units through side reflection to meet the light output requirements of the light-emitting units in the display panel.

[0119] Continue to refer Figure 1 and Fig.13Further, the redundant electrode unit 22 includes a first redundant electrode unit 221 and a second redundant electrode unit 222, the first redundant electrode unit 221 is located in the first sub-opening 4011, and the second redundant electrode unit 222 is located in the second sub-opening 4012; the first light-emitting unit 31 includes a third color light-emitting unit 313 and a fourth color light-emitting unit 314; the first redundant electrode unit 221 corresponds to a first pixel circuit (not shown in the figure), the second redundant electrode unit 222 corresponds to a second pixel circuit (not shown in the figure), the first pixel circuit drives the third color light-emitting unit 313, and the second pixel circuit drives the fourth color light-emitting unit 314, wherein the first angle α1 is smaller than the second angle α2, and the wavelength of light emitted by the third color light-emitting unit 313 is greater than the wavelength of light emitted by the fourth color light-emitting unit 314.

[0120] First, it can be understood that for the main electrode unit 21, it is responsible for electrically connecting the pixel circuit with the main light-emitting unit, and using the pixel circuit to drive and light up the first light-emitting unit. As for the redundant electrode unit 22, it serves as a backup electrode for the main electrode unit 21. When the first light-emitting unit emits abnormal light, it binds a new light-emitting unit, electrically connects the pixel circuit with the main light-emitting unit, and uses the pixel circuit to drive and light up the new light-emitting unit. It can be understood that a main electrode unit 21 and a redundant electrode unit 22 will share the same pixel circuit, that is, correspond to the same pixel circuit.

[0121] In this embodiment, according to the two color light-emitting units included in the first light-emitting unit, namely the third color light-emitting unit 313 and the fourth color light-emitting unit 314, the two corresponding pixel circuits are defined as the first pixel circuit and the second pixel circuit respectively. Furthermore, according to the first pixel circuit and the second pixel circuit, the two corresponding redundant electrode units 22 are defined as the first redundant electrode unit 221 and the second redundant electrode unit 222 respectively. In this embodiment, the difference between the first sub-opening 4011 and the second sub-opening 4012 mainly lies in the redundant electrode units 22 therein, the first sub-opening 4011 contains the first redundant electrode unit 221, and the second sub-opening 4012 contains the second redundant electrode unit 222. The difference between the first redundant electrode unit 221 and the second redundant electrode unit 222 mainly lies in the first light-emitting unit 31 corresponding to the backup electrode.

[0122] Based on the above logic, it can be known that the first sub-opening 4011 actually corresponds to the third color light emitting unit 313, and the second sub-opening 4012 corresponds to the fourth color light emitting unit 314. As described in the above embodiment, the third color light emitting unit 313 and the fourth color light emitting unit 314 can be understood as a red light emitting unit and a green light emitting unit, respectively. In comparison, the light emitting efficiency of the red light emitting unit is lower. In the present embodiment, for the red light-emitting unit, the angle between the first side surface 411 and the upper surface of the retaining wall structure 40, i.e., the first angle α1, is set to be relatively small, while for the green light-emitting unit, the angle between the second side surface 412 and the upper surface of the retaining wall structure 40, i.e., the second angle α2, is set to be relatively large. In fact, the inclination angle of the first side surface 411 relative to the second side surface 412 is made smaller, so as to be closer to 45°, so that the light emitted by the red light-emitting unit, i.e., the third color light-emitting unit 313, is reflected through the first side surface 411 and emitted more in the upward direction perpendicular to the base substrate 10, so that the light-emitting unit with lower luminous efficiency emits more light toward the front of the display panel, thereby achieving the effect of balancing the light output of light-emitting units of different colors and reducing the brightness difference between light-emitting units of different colors.

[0123] It should be noted that the second light-emitting unit 32 may or may not be provided in the retaining wall structure 40 corresponding to the first sub-opening 4011 and the second sub-opening 4012. It can be understood that when preparing the retaining wall structure 40, by pre-setting the size relationship between the first angle α1 and the second angle α2, when the first light-emitting unit 31 fails and the second light-emitting unit 32 is provided in the first sub-opening 4011 or the second sub-opening 4012, the inclined side wall of the retaining wall structure 40 can be used to reflect the emitted light so that more of the light is emitted toward the front of the display panel, thereby improving the light output efficiency of the second light-emitting unit 32.

[0124] Continue to refer Figure 1 and Figure 2 Optionally, at least two retaining wall structures 40 are included between adjacent redundant electrode units 22 , and the opening 400 between adjacent retaining wall structures 40 includes a third opening 403 , and part of the functional structure 50 fills the third opening 403 .

[0125] Here, at least two retaining wall structures 40 are arranged between adjacent redundant electrode units 22, which, on the one hand, allows each redundant electrode unit 22 to be surrounded by an independent retaining wall structure 40, and on the other hand, the functional structure 50 can be filled in at least two retaining wall structures 40 between two adjacent redundant electrode units 22. Here, the functional structure 50 in the third opening 403 is actually located on the side surface of the base substrate 10 where the electrode unit is arranged, and directly covers the base substrate 10. By using the functional structure 50, when the second light-emitting unit 32 is bound to the redundant electrode unit 22, the light emitted by the second light-emitting unit 32 can be extracted, so that the large-angle light emitted by the second light-emitting unit 32 is emitted to the outside to a certain extent, thereby improving the light extraction efficiency of the second light-emitting unit 32, which helps to increase the brightness of the display panel.

[0126] Continue to refer Figure 1 and Fig.12 Optionally, the display panel further includes a fourth opening 404 , at least one sidewall of the fourth opening 404 is a sidewall of the second packaging structure 62 , and part of the functional structure 50 fills the fourth opening 404 .

[0127] Among them, at least one side wall of the fourth opening 404 is the side wall of the second packaging structure 62, which actually means that there is a gap between the retaining wall structure 40 and the second packaging structure 62, forming the fourth opening 404. The functional structure 50 is filled in the gap between the retaining wall structure 40 and the second packaging structure 62, i.e., the fourth opening 404, so that the light emitted at a large angle from the first light-emitting unit 31 in the second packaging structure 62 can be extracted through the functional structure 50, thereby increasing the light output at a large angle, which is also an improvement on the light extraction efficiency of the first light-emitting unit 31 to a certain extent, and helps to increase the brightness of the display panel.

[0128] Fig.14 is a structural schematic diagram of another display panel provided by an embodiment of the present invention, Fig.15 yes Fig.14 The cross-sectional structure diagram of the display panel along DD' is shown in FIG. Fig.14 and Fig.15 In another embodiment of the present invention, a retaining wall structure 40 may be optionally included between adjacent redundant electrode units 22. In this case, adjacent redundant electrode units 22 share a retaining wall structure 40, are separated by the retaining wall structure 40, and define the area where the redundant electrode units 22 are located. This embodiment can reduce the number of retaining wall structures 40, and the spacing between the retaining wall structures 40 is relatively large. In actual preparation, the mask openings used in lithography are relatively small, and the requirements for the opening accuracy are lower, which is more convenient for preparation. In other words, this embodiment is more suitable for high-resolution display panels, in which the spacing between redundant electrode units in high-resolution display panels is small, and is suitable for directly setting a retaining wall structure between adjacent redundant electrode units.

[0129] Fig.16 yes Fig.14 The cross-sectional structure diagram of the display panel along EE' is shown in FIG. Fig.14 and Fig.16 The display panel further includes a fifth opening 405 , at least one sidewall of the fifth opening 405 is a sidewall of the second encapsulation structure 62 , at least one sidewall is a sidewall of the retaining wall structure 40 , and part of the redundant electrode unit 22 is located in the fifth opening 405 .

[0130] Here, at least one side wall of the fifth opening 405 is a side wall of the second packaging structure 62, and at least one side wall is a side wall of the retaining wall structure 40. In essence, the second packaging structure 62 is reused as the retaining wall structure 40 of the redundant electrode unit 22 adjacent thereto. The second packaging structure 62 cooperates with other retaining wall structures 40 to limit the area where the adjacent redundant electrode unit 22 is located, so as to facilitate filling of the functional structure or filling of the first packaging structure after the second light-emitting unit 32 is bound to the redundant electrode unit 22.

[0131] As mentioned above, the functional structure in the embodiment of the present invention can be selected according to the actual required functions. Specifically, the functional structure 50 in the embodiment of the present invention can be configured to use a shading material. Specifically, the shading material can be a black adhesive material with a thickness within the range of 10 μm and a transmittance of less than 6%. Alternatively, the functional structure 50 can also be made of a reflective material. Specifically, the reflective material can be a white adhesive material, and its reflectivity should be greater than 80%. In addition, it can also be made of a gray adhesive material, which can simultaneously achieve the effects of reducing reflection and increasing light output. The transmittance of the gray adhesive material should be less than 30%, and the reflectivity should be greater than 50%.

[0132] When the functional structure 50 is prepared with a black adhesive material, its transmittance is less than 6%, which indicates that it has a high light absorption capacity and can absorb the incident light from the outside to prevent the external light from being incident on the redundant electrode unit 22 to form a reflection, thereby achieving the effect of anti-reflection. When the functional structure 50 is prepared with a white adhesive material, its reflectivity is greater than 80%, and it can reflect the light emitted from the light-emitting unit to the outside, thereby improving the light-emitting efficiency of the light-emitting unit. Of course, the functional structure 50 can also be prepared with a gray adhesive material. At this time, the transmittance of the functional structure 50 is less than 30%, and the reflectivity is greater than 5%. It can absorb the incident light from the outside, and can also emit the light emitted by the light-emitting unit and incident into the functional structure 50 to the outside, thereby having the functions of reducing the reflection of external light and improving the light-emitting efficiency of the light-emitting unit.

[0133] Fig.17 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, referring to Fig.17In other embodiments of the present invention, the functional structure 50 may also include a first functional layer 51 and a second functional layer 52, wherein the first functional layer 51 is located on the side of the second functional layer 52 away from the base substrate 10; the first functional layer 51 satisfies T1<6%; the second functional layer 52 satisfies R2>80%; wherein T1 is the transmittance of the first functional layer 51, and R2 is the reflectivity of the second functional layer 52.

[0134] Among them, the first functional layer 51 is located on the side of the second functional layer 52 away from the base substrate 10, that is, the first functional layer 51 is located above the second functional layer 52. The transmittance of the first functional layer 51 located in the upper layer is less than 6%, indicating that it has good light absorption performance and can effectively block external light to prevent external light from continuing to be incident on the redundant electrode unit 22. The reflectivity of the second functional layer 52 located in the lower layer is greater than 80%, which can make the light emitted by the adjacent light-emitting unit be transmitted inside it, which helps this part of the light to be emitted from the retaining wall structure to the outside, thereby increasing the light extraction efficiency of the light-emitting unit. Obviously, this setting method uses two layers of functional layers to respectively reduce reflection and increase light extraction, which is more helpful to improve the display effect of the display panel as a whole.

[0135] Specifically, the thickness h1 of the first functional layer 51 can be set to 3-5 μm, and the thickness h2 of the second functional layer 52 can be set to 5-7 μm. Considering the limited height of the retaining wall structure, the thickness of the functional structure filled in the opening of the retaining wall structure will also be limited. In this embodiment, setting the first functional layer 51 of 3-5 μm can ensure sufficient absorption of external incident light, and effectively block external light from entering the redundant electrode unit to avoid reflection. Setting the second functional layer 52 of 5-7 μm can form a wider lateral light transmission channel, which is convenient for the large-angle light of the light-emitting unit to be transmitted through the channel and then emitted from the retaining wall structure to the outside, thereby improving the light extraction efficiency of the light-emitting unit.

[0136] Based on the same inventive concept, an embodiment of the present invention further provides a display device, Fig.18 is a schematic diagram of a display device provided by an embodiment of the present invention, with reference to Fig.18 , the display device may include the display panel 100 in any of the above embodiments. Since the display device provided in the embodiment of the present invention is made of the display panel 100 in the above embodiment, the display device has the same or similar beneficial effects as the display panel provided in the embodiment of the present invention, which will not be described in detail here. Exemplarily, the display device may be an electronic device such as a mobile phone, a computer, a smart wearable device (for example, a smart watch), and a vehicle-mounted display device, which is not limited in the embodiment of the present invention.

[0137] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: substrate substrate; An electrode unit is arranged on one side of the substrate, and the electrode unit includes a main electrode unit and a redundant electrode unit; a first light emitting unit, wherein the first light emitting unit is electrically connected to the main electrode unit; A retaining wall structure and an opening located between the retaining wall structures, wherein the opening includes a first opening, and the redundant electrode unit is located in the first opening; a functional structure, wherein the functional structure fills part of the first opening, and the functional structure is at least partially located on a side of the redundant electrode unit away from the substrate; the functional structure is made of a light-shielding material and / or a light-reflecting material; It also includes a second packaging structure, the second packaging structure is at least partially located on a side of the first light-emitting unit away from the base substrate, the orthographic projection of the second packaging structure on the base substrate covers the orthographic projection of the first light-emitting unit on the base substrate, and along a direction perpendicular to the base substrate and away from the base substrate, the side wall of the second packaging structure is inclined toward a side away from the first light-emitting unit; wherein, The opening further includes a fourth opening, at least one sidewall of the fourth opening is a sidewall of the second packaging structure, and part of the functional structure fills the fourth opening; and / or, The opening also includes a fifth opening, at least one side wall of the fifth opening is a side wall of the second packaging structure, at least one side wall is a side wall of the retaining wall structure, part of the redundant electrode unit is located in the fifth opening, the functional structure fills part of the fifth opening and at least part of the functional structure is located on a side of the redundant electrode unit away from the substrate.

2. The display panel according to claim 1, characterized in that: Also includes: a second light emitting unit; The opening further includes a second opening, and the second light emitting unit is located at the second opening; A first packaging structure fills the second opening, and the first packaging structure is at least partially located on a side of the second light emitting unit away from the base substrate.

3. The display panel according to claim 2, characterized in that: The first packaging structure comprises a top surface, and along a direction perpendicular to the plane where the substrate is located, the top surface is located on a side of the first packaging structure away from the substrate; The top surface is a curved surface, and the top surface is convex in a direction away from the base substrate.

4. The display panel according to claim 3, characterized in that: The second light emitting unit includes a first color light emitting unit and a second color light emitting unit; The first encapsulation structure includes a first sub-encapsulation structure and a second sub-encapsulation structure, the first sub-encapsulation structure corresponds to a first color light-emitting unit, and the second sub-encapsulation structure corresponds to a second color light-emitting unit; The orthographic projection area of ​​the top surface of the first sub-package structure on the base substrate is smaller than the orthographic projection area of ​​the top surface of the second sub-package structure on the base substrate; wherein, The wavelength of light emitted by the first color light emitting unit is greater than the wavelength of light emitted by the second color light emitting unit.

5. The display panel according to claim 3, characterized in that: The second light emitting unit includes a first color light emitting unit and a second color light emitting unit; The first encapsulation structure includes a first sub-encapsulation structure and a second sub-encapsulation structure, the first sub-encapsulation structure corresponds to a first color light-emitting unit, and the second sub-encapsulation structure corresponds to a second color light-emitting unit; The cross-sectional shape of the top surface of the first sub-package structure on the first plane is a first arc, and the cross-sectional shape of the top surface of the second sub-package structure on the first plane is a second arc, and the curvature radius corresponding to the first arc is smaller than the curvature radius corresponding to the second arc; wherein, The first plane is a plane perpendicular to the base substrate.

6. The display panel according to claim 3, characterized in that: In a direction perpendicular to the base substrate, a height difference between the top surface and a surface of the retaining wall structure on a side away from the base substrate is less than or equal to 6 μm.

7. The display panel according to claim 1, characterized in that: The first opening includes a first sub-opening and a second sub-opening; the retaining wall structure includes a first side surface facing away from the first sub-opening and a second side surface facing away from the second sub-opening; The angle between the first side surface and the surface of the retaining wall structure away from the substrate is a first angle, and the angle between the second side surface and the surface of the retaining wall structure away from the substrate is a second angle; wherein one of the first angle and the second angle is greater than the other.

8. The display panel according to claim 7, characterized in that: The redundant electrode unit comprises a first redundant electrode unit and a second redundant electrode unit, the first redundant electrode unit is located in the first sub-opening, and the second redundant electrode unit is located in the second sub-opening; The first light-emitting unit includes a third color light-emitting unit and a fourth color light-emitting unit; The first redundant electrode unit corresponds to a first pixel circuit, the second redundant electrode unit corresponds to a second pixel circuit, the first pixel circuit drives the third color light-emitting unit, and the second pixel circuit drives the fourth color light-emitting unit, wherein the first angle is smaller than the second angle, and the wavelength of light emitted by the third color light-emitting unit is greater than the wavelength of light emitted by the fourth color light-emitting unit.

9. The display panel according to claim 1, characterized in that: The distance between the surface of the second encapsulation structure away from the substrate and the substrate is equal to the distance between the surface of the retaining wall structure away from the substrate and the substrate.

10. The display panel according to claim 9, characterized in that: The second packaging structure and the retaining wall structure are made of the same material.

11. The display panel according to claim 9, characterized in that: At least a portion of the surface of the retaining wall structure and the second encapsulation layer on a side away from the base substrate is a rough concave-convex surface.

12. The display panel according to claim 1, characterized in that: The second packaging structure includes a third side surface and a first surface, the third side surface is located on one side of the second packaging layer along a first direction, and the first direction is parallel to the plane where the substrate is located; In a direction perpendicular to the plane where the substrate is located, the first surface is located on a side of the second packaging structure away from the substrate; An angle between the third side surface and the first surface is a third angle, and the third angle is an acute angle.

13. The display panel according to claim 12, characterized in that: The retaining wall structure comprises a fourth side surface and a second surface, the fourth side surface is located at one side of the retaining wall structure along the first direction and perpendicular to the direction of the plane where the substrate is located, and the second surface is located at a side of the retaining wall structure away from the substrate; An angle between the fourth side surface and the second surface is a fourth angle, the third angle is smaller than the fourth angle, and the fourth angle is an acute angle.

14. The display panel according to claim 1, characterized in that: At least two of the retaining wall structures are included between adjacent redundant electrode units, and the opening between adjacent retaining wall structures includes a third opening, and part of the functional structure fills the third opening.

15. The display panel according to claim 1, characterized in that: The functional structure adopts light-shielding material.

16. The display panel according to claim 1, characterized in that: The functional structure comprises a first functional layer and a second functional layer, wherein the first functional layer is located on a side of the second functional layer away from the substrate; The first functional layer is made of light-shielding material, and the second functional layer is made of light-reflecting material.

17. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-16.

18. A method for preparing a display panel, characterized in that: include: Providing a substrate; forming an electrode unit on one side of the base substrate, wherein the electrode unit includes a main electrode unit and a redundant electrode unit; A first light emitting unit is electrically connected to the main electrode unit; Forming a retaining wall structure and an opening between the retaining wall structures on the substrate, wherein the opening comprises a first opening, and the redundant electrode unit is located in the first opening; forming a functional structure, wherein the functional structure fills a portion of the first opening, and the functional structure is at least partially located on a side of the redundant electrode unit away from the substrate; The functional structure adopts light-shielding material and / or light-reflecting material; After the first light-emitting unit is electrically connected to the main electrode unit, the method further comprises: A second encapsulation structure is formed, wherein the second encapsulation structure is at least partially located on a side of the first light-emitting unit away from the base substrate, the orthographic projection of the second encapsulation structure on the base substrate covers the orthographic projection of the first light-emitting unit on the base substrate, and along a direction perpendicular to the base substrate and away from the base substrate, the side wall of the second encapsulation structure is inclined toward a side away from the first light-emitting unit; wherein, The opening further includes a fourth opening, at least one sidewall of the fourth opening is a sidewall of the second packaging structure, and part of the functional structure fills the fourth opening; and / or, The opening also includes a fifth opening, at least one side wall of the fifth opening is a side wall of the second packaging structure, at least one side wall is a side wall of the retaining wall structure, part of the redundant electrode unit is located in the fifth opening, the functional structure fills part of the fifth opening and at least part of the functional structure is located on a side of the redundant electrode unit away from the substrate.

19. The preparation method according to claim 18, characterized in that: After the first light-emitting unit is electrically connected to the main electrode unit and before the functional structure is formed, the method further includes: A second light emitting unit is electrically connected to a portion of the redundant electrode units, the opening further includes a second opening, and the second light emitting unit is located in the second opening.

20. The preparation method according to claim 19, characterized in that: After the second light emitting unit is electrically connected to part of the redundant electrode units, the method further comprises: A first packaging structure is filled in the second opening, wherein the first packaging structure is at least partially located on a side of the second light emitting unit away from the base substrate.

21. The preparation method according to claim 18, characterized in that: Forming a retaining wall structure and an opening between the retaining wall structures on the substrate, and forming a second packaging structure, including: Forming an encapsulation layer on the base substrate, wherein the encapsulation layer is at least partially located on a side of the first light-emitting unit and the electrode unit away from the base substrate, and the orthographic projection of the encapsulation layer on the base substrate covers the orthographic projection of the first light-emitting unit and the electrode unit on the base substrate; The packaging layer is patterned by using a photolithography process to form the second packaging structure and the retaining wall structure.

22. The preparation method according to claim 20, characterized in that: Filling the second opening with a first packaging structure includes: Determine that the opening surrounded by the retaining wall structure corresponding to the redundant electrode unit electrically connected to the second light-emitting unit is the second opening; The first packaging structure is filled in the second opening by a printing process.

23. The preparation method according to claim 20, characterized in that: Before electrically connecting the second light emitting unit to part of the redundant electrode units, the method further includes: detecting the failed first light emitting unit, and determining the position of the main electrode unit of the failed first light emitting unit; The second light emitting unit is electrically connected to part of the redundant electrode units, comprising: The second light emitting unit is electrically connected to the redundant electrode unit disposed adjacent to the main electrode unit of the failed first light emitting unit.

24. The preparation method according to claim 20, characterized in that: Form a functional structure, including: In a vacuum heating environment, attach a functional structural adhesive layer to a side of the base substrate where the retaining wall structure is provided, wherein the orthographic projection of the functional structural adhesive layer on the base substrate covers the retaining wall structure, the opening between the retaining wall structures, and the orthographic projection of the first packaging structure on the base substrate; The functional structure adhesive layer is thinned by an ashing process or a wet etching process to form the functional structure.

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