Light-emitting panel

Abstract

The present invention discloses a light-emitting panel, which includes a pixel array substrate, a plurality of light-emitting elements, a black matrix layer, and a light-transmitting pattern layer. The pixel array substrate has a plurality of sub-pixel regions and a plurality of light-transmitting regions. These light-emitting elements, the black matrix layer, and the light-transmitting pattern layer are disposed on the pixel array substrate. These light-emitting elements are respectively located on these sub-pixel regions. The black matrix layer is not distributed in these light-transmitting regions. The light-transmitting pattern layer is distributed in these light-transmitting regions. The black matrix layer, the light-transmitting pattern layer, and the pixel array substrate form a plurality of grooves. These grooves are respectively located on these sub-pixel regions. These light-emitting elements are respectively located in these grooves. The black matrix layer and the light-transmitting pattern layer jointly surround the light-emitting elements located in at least one groove.

Description

Technical Field

[0001] The present invention relates to a light-emitting panel, and particularly to a light-emitting panel including a black matrix layer. Background Art

[0002] Most of the existing display panels are opaque, and the application scope of such opaque display panels is inevitably limited in some aspects. For example, in the case of vehicle-mounted displays, the opaque display panel will block the driver's line of sight, so the opaque display panel is not suitable for being directly installed on the windshield as a Head-Up Display (HUD). Similarly, the opaque display panel is not suitable for being directly installed on the visor of a safety helmet or glasses, and thus is not applicable to some wearable devices. Summary of the Invention

[0003] At least one embodiment of the present invention provides a light-emitting panel, which utilizes a light-transmitting region and a light-transmitting pattern layer distributed in the light-transmitting region to increase the application scope of the light-emitting panel disclosed in at least one embodiment of the present invention.

[0004] The light-emitting panel proposed in at least one embodiment of the present invention includes a pixel array substrate, a plurality of light-emitting elements, a black matrix layer, and a light-transmitting pattern layer. The pixel array substrate has a plurality of sub-pixel regions and a plurality of light-transmitting regions, wherein one sub-pixel region is located between at least two adjacent light-transmitting regions. These light-emitting elements are disposed on the pixel array substrate and electrically connected to the pixel array substrate, and these light-emitting elements are respectively located on these sub-pixel regions. The black matrix layer is disposed on the pixel array substrate and is not distributed in these light-transmitting regions. The light-transmitting pattern layer is disposed on the pixel array substrate and is distributed in these light-transmitting regions, wherein the black matrix layer, the light-transmitting pattern layer, and the pixel array substrate form a plurality of grooves. These grooves are respectively located on these sub-pixel regions. These light-emitting elements are respectively located in these grooves. The black matrix layer and the light-transmitting pattern layer jointly surround the light-emitting element located in at least one groove.

[0005] In at least one embodiment of the present invention, the above-mentioned light-emitting panel further includes a plurality of filling materials. These filling materials are respectively filled into these grooves, wherein each light-emitting element has a light-emitting top surface, and these filling materials do not cover the light-emitting top surfaces of these light-emitting elements.

[0006] In at least one embodiment of the present invention, at least one of these filling materials is a black adhesive material.

[0007] In at least one embodiment of the present invention, at least one of these filling materials includes a reflective material and an absorption layer. The reflective material is filled into the groove. The absorption layer is disposed on the reflective material and covers the reflective material, wherein the absorption layer surrounds one of the light-emitting elements in the groove.

[0008] In at least one embodiment of the present invention, each light-emitting element has a light-emitting layer, and the height of the light-emitting layer relative to the pixel array substrate is less than the height of the upper surface of the reflective material relative to the pixel array substrate.

[0009] In at least one embodiment of the present invention, at least one of these filling materials includes a light-transmitting material and an absorbing layer. The light-transmitting material is filled in the groove. The absorbing layer is disposed on the light-transmitting material and covers the light-transmitting material, wherein the absorbing layer surrounds one of the light-emitting elements in the groove.

[0010] In at least one embodiment of the present invention, each light-emitting element has a light-emitting layer, and the height of the light-emitting layer relative to the pixel array substrate is less than the height of the upper surface of the light-transmitting material relative to the pixel array substrate.

[0011] In at least one embodiment of the present invention, the above-mentioned black matrix layer protrudes from the upper surface of the light-transmitting pattern layer, and the height difference between the upper surface of the black matrix layer and the upper surface of the light-transmitting pattern layer is less than or equal to 1.5 micrometers.

[0012] In at least one embodiment of the present invention, the above-mentioned pixel array substrate includes a substrate and a plurality of metal pattern layers. These metal pattern layers are disposed on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel region, the vertical projection of these metal pattern layers on the substrate completely covers the vertical projection of the light-emitting element on the substrate.

[0013] In at least one embodiment of the present invention, the above-mentioned pixel array substrate includes a substrate and a plurality of metal pattern layers. These metal pattern layers are disposed on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel region, at least a part of the vertical projection of the light-emitting element on the substrate does not overlap with the vertical projection of these metal pattern layers on the substrate.

[0014] In at least one embodiment of the present invention, the above-mentioned pixel array substrate includes a substrate and a plurality of metal pattern layers. These metal pattern layers are disposed on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel region, the vertical projection area of these metal pattern layers on the substrate is greater than or equal to half of the vertical projection area of the groove on the substrate.

[0015] In at least one embodiment of the present invention, the above-mentioned pixel array substrate includes a substrate and a plurality of traces. These traces are disposed on the substrate, wherein the black matrix layer extends along these traces and covers these traces.

[0016] In at least one embodiment of the present invention, the above-mentioned light-transmitting pattern layer includes a plurality of light-transmitting layers, and the black matrix layer surrounds one of the light-transmitting layers along a part of these traces, wherein the shape of at least one light-transmitting layer is L-shaped.

[0017] In at least one embodiment of the present invention, the above-mentioned light-transmitting pattern layer includes a plurality of light-transmitting layers, and the black matrix layer surrounds each light-transmitting layer along four of the traces, wherein the shape of each light-transmitting layer is an asymmetric shape.

[0018] Based on the above, by using the light-transmitting pattern layer and these light-transmitting regions, external light can penetrate the light-emitting panel disclosed in the above embodiments. Compared with the common opaque display panels in the prior art, the light-emitting panel disclosed in at least one embodiment of the present invention can have a wider application range. For example, the light-emitting panel of the above embodiment is suitable for making a head-up display (HUD) for vehicles or for use in wearable devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1A is a top view schematic diagram of the light-emitting panel of at least one embodiment of the present invention;

[0020] Figure 1B is Figure 1A a partial enlarged schematic diagram of the light-emitting panel in

[0021] Figure 1C is Figure 1B a cross-sectional schematic diagram drawn along the 1C-1C section line in

[0022] Figure 1D is Figure 1C a partial enlarged schematic diagram of

[0023] Figure 2 is a cross-sectional schematic diagram of the light-emitting panel of another embodiment of the present invention;

[0024] Figure 3 is a cross-sectional schematic diagram of the light-emitting panel of another embodiment of the present invention;

[0025] Figure 4 is a cross-sectional schematic diagram of the light-emitting panel of another embodiment of the present invention;

[0026] Figure 5 is a cross-sectional schematic diagram of the light-emitting panel of another embodiment of the present invention;

[0027] Figure 6 is a top view schematic diagram of the light-emitting panel of another embodiment of the present invention;

[0028] Figure 7A is a top view schematic diagram of the light-emitting panel of another embodiment of the present invention;

[0029] Figure 7B is a top view schematic diagram of the light-emitting panel of another embodiment of the present invention;

[0030] Figure 7C is a top view schematic diagram of the light-emitting panel of another embodiment of the present invention.

[0031] Symbol Explanation

[0032] 100, 200, 300, 400, 500, 600, 700a, 700b, 700c: Light-emitting panel

[0033] 110, 410, 510, 610: Pixel array substrate

[0034] 111s, 511s: Sub-pixel region

[0035] 111t, 611t: Light-transmitting region

[0036] 112a, 112b, 112c, 112d, 512a, 512b, 512c, 512d: Metal pattern layer

[0037] 113a, 113b, 113c, 113d, 113e, 115a, 115b, 115c: Insulating layer

[0038] 114b, 114c, 114d, 114s: Contact window

[0039] 119: Substrate

[0040] 119n: Normal direction

[0041] 121, 621: Black matrix layer

[0042] 121g: Protrusion length

[0043] 122: Light-transmitting pattern layer

[0044] 122p, 622p: Light-transmitting layer

[0045] 130: Light-emitting element

[0046] 131: Light-emitting top surface

[0047] 132: Light-emitting layer

[0048] 140, 240, 340: Filling material

[0049] 151: Transparent layer

[0050] 152: Anti-reflection layer

[0051] 241: Light-transmitting material

[0052] 242: Light-absorbing layer

[0053] 341: Reflective material

[0054] 460: Flat layer

[0055] CP5: Projection area

[0056] D1: The first direction

[0057] D2: The second direction

[0058] DL6, SL6, T11, T41: Trace lines

[0059] E12: Edge

[0060] G1: Height difference

[0061] GR1: Group

[0062] L1: Light ray

[0063] LA5: Translucent area

[0064] M71, M72, M73: Main pixel area

[0065] MP1: Vertical projection area

[0066] MP5: Projection area

[0067] P41: Pad

[0068] R1: Groove

[0069] RA1: Reserved area

[0070] SB1: Connector

[0071] TC1: Semiconductor layer

[0072] TG1: Gate

[0073] TT1: Active element Detailed implementation manners

[0074] In the following text, in order to clearly present the technical features of this case, the dimensions (such as length, width, thickness, and depth) of the elements (such as layers, films, substrates, and regions, etc.) in the drawings are enlarged in a non-uniform scale. Therefore, the descriptions and explanations of the following embodiments are not limited to the quantity, dimensions, and shapes of the elements presented in the drawings, but should cover the dimensions, shapes, and the deviations between the two caused by actual manufacturing processes and / or tolerances. For example, the flat surfaces shown in the drawings may have rough and / or non-linear features, and the acute angles shown in the drawings may be rounded. Therefore, the elements presented in the drawings of this case are mainly for illustration purposes, and are not intended to accurately depict the actual shapes of the elements, nor to limit the claims of this case.

[0075] Second, words such as "about", "approximate" or "substantially" that appear in the content of this case not only cover the explicitly recited numerical values and numerical ranges, but also cover the allowable deviation ranges that can be understood by those of ordinary skill in the art to which the invention pertains. The deviation range can be determined by the errors generated during measurement, and such errors are caused, for example, by the limitations of both the measurement system and the manufacturing process conditions. For example, two objects (such as the plane of a substrate or a trace) are "substantially parallel" or "substantially perpendicular", where "substantially parallel" and "substantially perpendicular" respectively represent that the parallelism and perpendicularity between these two objects can include non-parallelism and non-perpendicularity caused by the allowable deviation range.

[0076] In addition, "about" can mean within one or more standard deviations of the above numerical values, such as within ±30%, ±20%, ±10% or ±5%. Words such as "about", "approximate" or "substantially" that appear in the text of this case can select acceptable deviation ranges or standard deviations according to optical properties, etching properties, mechanical properties or other properties, rather than simply applying a single standard deviation to all properties such as the above optical properties, etching properties, mechanical properties and other properties.

[0077] Figure 1A is a top view schematic diagram of a light-emitting panel according to at least one embodiment of the present invention. Please refer to Figure 1A , the light-emitting panel 100 includes a pixel array substrate 110 and a black matrix layer 121, wherein the black matrix layer 121 is disposed on the pixel array substrate 110 and is located on one side of the pixel array substrate 110. Taking Figure 1A as an example, the black matrix layer 121 is located on the upper surface of the pixel array substrate 110. The shape of the black matrix layer 121 can be mesh-like, and the black matrix layer 121 covers a part of the upper surface of the pixel array substrate 110, but does not completely cover the upper surface of the pixel array substrate 110. The black matrix layer 121 has a black dye (such as carbon black) and thus appears black, so the black matrix layer 121 can substantially completely absorb visible light.

[0078] The pixel array substrate 110 has a plurality of sub-pixel regions 111s and a plurality of light-transmitting regions 111t, and the black matrix layer 121 is not distributed in these light-transmitting regions 111t. In other words, these light-transmitting regions 111t are formed in the regions of the pixel array substrate 110 that are not covered by the black matrix layer 121. These sub-pixel regions 111s can be arranged regularly. Taking Figure 1A as an example, a plurality of (such as three) sub-pixel regions 111s can be aggregated into a group GR1, and these groups GR1 can be arranged in an array so that these sub-pixel regions 111s are arranged regularly. In addition, in this embodiment, each group GR1 can be the main pixel region of the pixel array substrate 110.

[0079] One of these sub-pixel regions 111s can be located between at least two adjacent light-transmitting regions 111t. For Figure 1A example, each sub-pixel region 111s can be located between four adjacent light-transmitting regions 111t and surrounded by these four adjacent light-transmitting regions 111t, where these four adjacent light-transmitting regions 111t can also surround three sub-pixel regions 111s, as Figure 1A shown.

[0080] Figure 1B is Figure 1A a partial enlarged schematic view of the light-emitting panel in Figure 1A and Figure 1B . Referring to

[0081] , the light-emitting panel 100 further includes a plurality of light-emitting elements 130, where these light-emitting elements 130 are disposed on the pixel array substrate 110 and are respectively located on these sub-pixel regions 111s, and each light-emitting element 130 can emit light L1.

[0082] Figure 1C is Figure 1B a cross-sectional schematic view drawn along the line 1C-1C in Figure 1B and Figure 1C . Referring to Figure 1A and Figure 1BAs shown. The light-transmitting pattern layer 122 can be an organic material layer or an inorganic material layer, and can be formed by inkjet, printing, or photolithography.

[0083] In Figure 1B the embodiment shown, these light-transmitting layers 122p can completely cover these light-transmitting regions 111t, that is, the region occupied by the light-transmitting layer 122p on the pixel array substrate 110 is substantially the light-transmitting region 111t. Therefore, Figure 1B the marked light-transmitting regions 111t can be regarded as these light-transmitting layers 122p. In addition, Figure 1B seen from, that is, in the top view of the light-emitting panel 100, the shape of each light-transmitting layer 122p is an asymmetrical shape. That is to say, the shape of the light-transmitting layer 122p is neither a line-symmetrical shape nor a point-symmetrical shape.

[0084] The black matrix layer 121, the light-transmitting pattern layer 122, and the pixel array substrate 110 can form a plurality of grooves R1, and these light-emitting elements 130 are respectively located in these grooves R1. Among them, the pixel array substrate 110 forms the bottom of these grooves R1, and the black matrix layer 121 and the light-transmitting pattern layer 122 jointly form the side walls of at least one groove R1, so that the black matrix layer 121 and the light-transmitting pattern layer 122 can jointly surround the light-emitting element 130 located in at least one groove R1.

[0085] Taking Figure 1B and Figure 1C as an example, the black matrix layer 121 and the light-transmitting pattern layer 122 can jointly form the side walls of each groove R1, and the black matrix layer 121 and the light-transmitting pattern layer 122 can jointly surround the light-emitting element 130 in each groove R1. These grooves R1 are respectively located on these sub-pixel regions 111s, but not on the light-transmitting region 111t. Therefore, these grooves R1 are only distributed within these sub-pixel regions 111s and not within any light-transmitting region 111t.

[0086] The pixel array substrate 110 includes a substrate 119, a plurality of metal pattern layers 112a, 112b, 112c, and 112d, and a plurality of insulating layers 113a, 113b, 113c, 113d, 113e, 115a, 115b, and 115c, wherein these metal pattern layers 112a to 112d, these insulating layers 113a to 113e, and 115a to 115c are all stacked and disposed on the substrate 119. At least one of the metal pattern layers 112a, 112b, 112c, and 112d can be composed of one or more metal layers.

[0087] At least one of the metal pattern layers 112a, 112b, and 112c may have three metal layers. One metal layer may be an aluminum metal layer, and the other two metal layers may be titanium metal layers, with the aluminum metal layer sandwiched between the two titanium metal layers. Alternatively, at least one of the metal pattern layers 112a, 112b, and 112c may have two metal layers: one aluminum metal layer and one titanium metal layer, with the aluminum metal layer closer to the light-emitting element 130.

[0088] In the metal pattern layer 112d, the metal layers of the pads P41 may include a nickel-gold layer, an aluminum metal layer, and a titanium metal layer, with the nickel-gold layer closest to the light-emitting element 130. Except for these pads P41, the film layer composition of other parts of the metal pattern layer 112d may be the same as that of the metal pattern layers 112a, 112b, or 112c.

[0089] In addition, before forming the above nickel-gold layer, the pad P41 may also have one aluminum metal layer and two metal layers, with the aluminum metal layer sandwiched between the two titanium metal layers. During the formation of the nickel-gold layer, the uppermost titanium metal layer may be removed first. Then, a nickel-gold layer is deposited on the aluminum metal layer by chemical means, such as electroless plating.

[0090] The substrate 119 and the insulating layers 113a, 113b, 113c, 113d, 113e, 115a, 115b, and 115c may be transparent, where the substrate 119 is, for example, a glass plate or a transparent polymer material substrate. The aforementioned transparent polymer material substrate is made of, for example, polyethylene terephthalate (PET) or polyimide (PI). Alternatively, the transparent polymer material substrate may also be made of other polymer materials.

[0091] Each of the metal pattern layers 112a, 112b, 112c, and 112d may be located between two adjacent ones of the insulating layers 113a, 113b, 113c, 113d, 113e, 115a, 115b, and 115c. For Figure 1C example, the metal pattern layer 112a is located between the insulating layers 113a and 113b, and the metal pattern layer 112b is located between the insulating layers 113b and 115a. The metal pattern layer 112c is located between the insulating layers 115a and 115b, and the metal pattern layer 112d is located between the insulating layers 113c and 113d.

[0092] The metal pattern layer 112a is disposed on the substrate 119, and the metal pattern layers 112b and 112c are located between the metal pattern layers 112a and 112d, wherein the metal pattern layer 112c is located between the metal pattern layers 112b and 112d, and the metal pattern layer 112b is located between the metal pattern layers 112a and 112c. In addition, the pixel array substrate 110 may further include a plurality of semiconductor layers TC1, wherein these semiconductor layers TC1 are located on the substrate 119, and the insulating layer 113a covers these semiconductor layers TC1 and the substrate 119.

[0093] The metal pattern layer 112a is located on the insulating layer 113a, and the insulating layer 113b covers the metal pattern layer 112a. The metal pattern layer 112b is located on the insulating layer 113b, and the insulating layer 115a covers the metal pattern layer 112b. The metal pattern layer 112c is located on the insulating layer 115a, and the insulating layer 115b covers the metal pattern layer 112c.

[0094] Both the metal pattern layer 112d and the insulating layer 113c are located on the insulating layer 115b, and the insulating layer 113d covers the metal pattern layer 112d and the insulating layer 113c, so that the insulating layer 113c is sandwiched between the insulating layer 115b and 113d. The insulating layers 115c and 113e are located on the insulating layer 113d, wherein the insulating layer 115c is sandwiched between the insulating layer 113e and 113d, and these light-transmitting layers 122p are located on the insulating layer 113e.

[0095] In this embodiment, the insulating layers 115a, 115b, and 115c may be organic material layers, and the insulating layers 113a, 113b, 113c, 113d, and 113e may be inorganic material layers, which are made of, for example, silicon oxide, silicon nitride, or other inorganic materials. These insulating layers 113a, 113b, 113c, 113d, and 113e have the effect of blocking water vapor to prevent or avoid water vapor from penetrating into the light-emitting panel 100, thereby preventing the light-emitting elements 130 and the pixel array substrate 110 from being affected by water vapor and failing.

[0096] The pixel array substrate 110 may further include a plurality of contact windows 114b and 114c, wherein these contact windows 114b and 114c connect these metal pattern layers 112b, 112c, and 112d, so that these metal pattern layers 112b, 112c, and 112d can be electrically connected to each other. Specifically, each of these contact windows 114b and 114c is substantially a conductive pillar and connects two adjacent layers of these metal pattern layers 112b, 112c, and 112d.

[0097] by Figure 1CFor example, these contact windows 114b penetrate through the insulating layer 115a and connect the metal pattern layers 112b and 112c so that the metal pattern layers 112b and 112c can be electrically connected to each other. These contact windows 114c penetrate through the insulating layers 113c and 115b and connect the metal pattern layers 112c and 112d so that the metal pattern layers 112c and 112d can be electrically connected to each other. In this way, through the contact windows 114b and 114c, these metal pattern layers 112b, 112c, and 112d can be electrically connected to each other.

[0098] In Figure 1C In the illustrated embodiment, the pixel array substrate 110 may be an active element array substrate and have a plurality of active elements TT1, which may be a plurality of thin film transistors (TFTs). Specifically, the pixel array substrate 110 may further include a plurality of semiconductor layers TC1, where these semiconductor layers TC1 are disposed on the substrate 119 and covered by the insulating layer 113a. The metal pattern layer 112a may include a plurality of gate electrodes TG1, where these gate electrodes TG1 are disposed on the insulating layer 113a and respectively overlap with these semiconductor layers TC1 so that the overlapping gate electrodes TG1 and semiconductor layers TC1 and a portion of the insulating layer 113a sandwiched between the gate electrodes TG1 and semiconductor layers TC1 can form a capacitor.

[0099] The pixel array substrate 110 may further include a plurality of contact windows 114d and 114s, where both the contact windows 114d and 114s penetrate through the insulating layers 113a and 113b and connect the semiconductor layer TC1 and the metal pattern layer 112b. The contact windows 114d and 114s do not directly electrically connect to the gate electrodes TG1 to avoid short circuits. Each semiconductor layer TC1 is connected to one contact window 114d and one contact window 114s, as Figure 1C shown. In this way, the semiconductor layer TC1, the contact windows 114d and 114s, the gate electrodes TG1, and a portion of the insulating layer 113a form the active element TT1, which may be a thin film transistor, where the contact windows 114d and 114s can respectively serve as the drain and source of the active element TT1.

[0100] Using these contact windows 114d and 114s, these semiconductor layers TC1 can be electrically connected to a plurality of pads (not labeled) of the metal pattern layer 112b. Since the metal pattern layers 112b, 112c, and 112d can be electrically connected to each other through the contact windows 114b and 114c, these semiconductor layers TC1 can be electrically connected to the metal pattern layers 112c and 112d through the contact windows 114d, 114s, and the metal pattern layer 112b.

[0101] It should be noted that Figure 1CThe depicted metal pattern layers 112a, 112b, 112c, and 112d, insulating layers 113a, 113b, 113c, 113d, 113e, 115a, 115b, and 115c, and contact windows 114b, 114c, 114d, and 114s are only for illustrative purposes and do not limit the number of metal pattern layers, insulating layers, and contact windows included in the pixel array substrate 110. For example, in other embodiments, the insulating layer 113e may be omitted. Alternatively, the insulating layer 115a and the metal pattern layer 112c may be omitted so that the insulating layer 115b can directly cover the metal pattern layer 112b.

[0102] The metal pattern layer 112d may include a plurality of traces T41 and a plurality of pads P41, and the metal pattern layer 112a may include a plurality of traces T11 (only shown in Figure 1B ). These traces T41 and T11 and these pads P41 are all disposed on the substrate 119, where the traces T41 and the pads P41 are both located above the trace T11, so the traces T41 and T11 are not coplanar with each other.

[0103] The traces T11 and T41 have different orientations from each other. Taking Figure 1B as an example, these traces T11 all extend along a first direction D1, and these traces T41 all extend along a second direction D2, where the first direction D1 is different from the second direction D2. For example, in Figure 1B , the first direction D1 may be a horizontal direction, and the second direction D2 may be a vertical direction, so the first direction D1 and the second direction D2 may be substantially perpendicular to each other.

[0104] These traces T11 are connected to these gate electrodes TG1, and these traces T41 can be electrically connected to the contact window 114s through the contact windows 114c, 114b and the metal pattern layers 112c, 112b, where the contact window 114s corresponds to the source electrode of the active element TT1. These light-emitting elements 130 are respectively electrically connected to these pads P41. For example, the light-emitting elements 130 can be electrically connected to the pads P41 through a connecting member SB1 so that these light-emitting elements 130 can be electrically connected to the pixel array substrate 110, where the connecting member SB1 is, for example, solder or indium particles.

[0105] In Figure 1C 's embodiment, the anode (not labeled) of the light-emitting element 130 is electrically connected to the contact window 114d through the connecting member SB1, the pad P41, the contact windows 114c, 114b and the metal pattern layers 112c and 112b. The contact window 114d corresponds to the drain electrode of the active element TT1, so the anode of the light-emitting element 130 is electrically connected to the drain electrode of the active element TT1.

[0106] Since the trace T11 is connected to the gate TG1, and the trace T41 is electrically connected to the contact window 114s (i.e., the source of the active device TT1), the switching signal transmitted by these traces T11 can turn on or off the active device TT1, so that the electrical signal transmitted by the trace T41 can be input to the light-emitting element 130 through the turned-on active device TT1, thereby causing the light-emitting element 130 to emit light. Thus, these traces T11, T41 and these active devices TT1 can control these light-emitting elements 130 to emit light.

[0107] In this embodiment, these light-emitting elements 130 can emit light of different colors, such as red light, green light and blue light. For Figure 1B example, the three light-emitting elements 130 located in three adjacent sub-pixel regions 111s can be a red light-emitting diode, a green light-emitting diode and a blue light-emitting diode respectively. Thus, these traces T11, T41 and these active devices TT1 can control these light-emitting elements 130 to emit light of different colors (such as red light, green light and blue light), so that the light-emitting panel 100 can generate an image. In addition, the above three adjacent sub-pixel regions 111s can form a group GR1, and each group GR1 can be a main pixel.

[0108] In addition, the shape of each pad P41 can be strip-shaped. For Figure 1B example, the two pads P41 located in each sub-pixel region 111s can extend along the second direction D2 and be arranged along the first direction D1. After these light-emitting elements 130 are disposed on the pixel array substrate 110, the light-emitting elements 130 can extend along the first direction D1, so that the light-emitting elements 130 located in a single sub-pixel region 111s do not cover all the pads P41, and the partial pads P41 not covered by the light-emitting elements 130 can form a reserved area RA1.

[0109] A reserved area RA1 can accommodate at least one light-emitting element 130. When the light-emitting element 130 in a sub-pixel region 111s fails and cannot emit light L1, a normal light-emitting element 130 can be disposed in the reserved area RA1 adjacent to the failed light-emitting element 130 to replace the failed light-emitting element 130. Thus, the sub-pixel region 111s where the original failed light-emitting element 130 is located can still emit light L1, so as to reduce or avoid the adverse effect of the failed light-emitting element 130 on the image quality of the light-emitting panel 100.

[0110] It should be noted that, in this embodiment, the metal pattern layer 112d includes a plurality of traces T41, and the metal pattern layer 112a includes a plurality of traces T11. However, in other embodiments, other metal pattern layers may include the traces T41 and T11. For example, the metal pattern layer 112c may include these traces T41, and the traces T41 may be electrically connected to the contact window 114s through the contact window 114b and the metal pattern layer 112b. Therefore, Figure 1B For Figure 1C illustration only and not to limit that the metal pattern layer 112d should include the trace T41 and the metal pattern layer 112a should include the trace T11.

[0111] The black matrix layer 121 and the light-transmitting pattern layer 122 are both located on the insulating layer 113e, where the black matrix layer 121 extends along these traces T11 and T41 and covers these traces T11 and T41. In this way, the black matrix layer 121 can reduce or prevent the reflection of external light by these traces T11 and T41, improving the image quality of the light-emitting panel 100. In addition, in Figure 1B the illustrated embodiment, the black matrix layer 121 can surround each light-transmitting layer 122p along four of the traces, namely two traces T11 and two traces T41.

[0112] These metal pattern layers 112a, 112b, 112c, and 112d and these semiconductor layers TC1 do not overlap with the light-transmitting pattern layer 122. In other words, these metal pattern layers 112a, 112b, 112c, and 112d and these semiconductor layers TC1 are not distributed in any light-transmitting region 111t. Thus, external light can penetrate the light-transmitting pattern layer 122 and the light-transmitting region 111t without being blocked by the metal pattern layers 112a, 112b, 112c, and 112d and the semiconductor layer TC1, making the light-emitting panel 100 suitable for making a transparent display. In addition, since the shape of each light-transmitting layer 122p is an asymmetric shape (as Figure 1B shown), the light-transmitting pattern layer 122 can reduce the diffraction effect on light, thereby reducing or preventing the adverse effects of optical diffraction on the image.

[0113] The light-emitting panel 100 further includes a plurality of filling materials 140, and these filling materials 140 are respectively filled into these grooves R1. The filling materials 140 can be black glue materials and have black dyes, such as carbon black. Therefore, the filling materials 140 are black in color, and the filling materials 140 can basically completely absorb visible light. In other words, the filling materials 140 can absorb external light and reduce the reflection of external light, thereby improving the image quality of the light-emitting panel 100. In addition, the filling materials 140 can be formed in the grooves R1 by printing, such as inkjet.

[0114] Each light-emitting element 130 has a light-emitting top surface 131 and a light-emitting layer 132, where the light-emitting layer 132 can generate light rays L1, and the light rays L1 can be emitted from the light-emitting top surface 131. These filling materials 140 do not cover the light-emitting top surfaces 131 of these light-emitting elements 130. Figure 1C For example, each light-emitting element 130 can protrude from the upper surface of the filling material 140. Therefore, the filling material 140 basically does not block the light rays L1 emitted from the light-emitting top surface 131, so as to avoid adversely affecting the image quality of the light-emitting panel 100.

[0115] Since these light-emitting elements 130 can emit light of different colors, such as red light, green light, and blue light, the light-emitting layers 132 of these light-emitting elements 130 can generate light rays L1 of different colors. Figure 1C In view of this, the height of the light-emitting layer 132 relative to the pixel array substrate 110 is less than the height of the upper surface of the filling material 140 relative to the pixel array substrate 110, so the filling material 140 can cover the side of the light-emitting layer 132, as Figure 1C shown.

[0116] The upper surfaces of the black matrix layer 121 and the light-transmitting pattern layer 122 may not be flush with each other. For example, the black matrix layer 121 may protrude from the upper surface of the light-transmitting pattern layer 122. The height difference G1 between the upper surface of the black matrix layer 121 and the upper surface of the light-transmitting pattern layer 122 (i.e., the light-transmitting layer 122p) may be less than or equal to 1.5 micrometers. When the height difference G1 is greater than 1.5 micrometers, during the formation of the filling material 140, there is a risk of overflow of the filling material 140 or insufficient thickness of the filling material 140. Therefore, the height difference G1 less than or equal to 1.5 micrometers can reduce the above risks, thereby helping to improve the yield of the light-emitting panel 100. In addition, in other embodiments, the height difference G1 may be equal to or approximately 0, that is, the upper surfaces of the black matrix layer 121 and the light-transmitting pattern layer 122 may be substantially flush with each other.

[0117] The light-emitting panel 100 may further include a transparent layer 151, where the transparent layer 151 is disposed on the pixel array substrate 110 and comprehensively covers the upper surface of the pixel array substrate 110. Therefore, the transparent layer 151 can cover these light-emitting elements 130, these filling materials 140, the black matrix layer 121, and the light-transmitting pattern layer 122, as Figure 1C shown, to protect these light-emitting elements 130.

[0118] The light-emitting panel 100 may further include at least one anti-reflection layer 152. Figure 1CFor example, the light-emitting panel 100 includes two anti-reflection layers 152, and the two anti-reflection layers 152 are respectively located on opposite sides of the pixel array substrate 110. In other words, the pixel array substrate 110 is located between the two anti-reflection layers 152. One of the anti-reflection layers 152 can be disposed above the transparent layer 151 and the light-emitting elements 130, and the other anti-reflection layer 152 can be disposed on the lower surface of the substrate 119.

[0119] The anti-reflection layer 152 allows the light L1 and external light to penetrate, and can reduce the reflection of the light L1 and external light. The lower anti-reflection layer 152 can further allow most of the external light penetrating the light-transmitting pattern layer 122 to exit from the light-emitting panel 100, so as to reduce the reflection of the light-transmitting region 111t to the external light, thereby improving the image quality of the light-emitting panel 100.

[0120] In the same sub-pixel region 111s, for example, in each sub-pixel region 111s, the vertical projection area MP1 of the metal pattern layers 112a, 112b, 112c, and 112d and the semiconductor layer TC1 on the substrate 119 can be greater than or equal to half of the vertical projection area of the groove R1 on the substrate 119 (equivalent to Figure 1C the sub-pixel region 111s shown), and the vertical projections of the metal pattern layers 112a, 112b, 112c, and 112d and the semiconductor layer TC1 on the substrate 119 can completely cover the vertical projection of the light-emitting element 130 on the substrate 119. In other words, the metal pattern layers 112a, 112b, 112c, and 112d can cover the entire bottom surface (not labeled) of the light-emitting element 130, as Figure 1C shown.

[0121] Figure 1D is Figure 1C a partial enlarged schematic diagram. Please refer to Figure 1C and Figure 1D , the black matrix layer 121 can protrude or be flush with the edge of the outermost metal pattern layer 112d (including the trace T41) of the pixel array substrate 110. Taking Figure 1D the trace T41 shown as an example, the black matrix layer 121 protrudes from the edge E12 of the trace T41 and has a plurality of protruding lengths 121g. Each protruding length 121g is the length of the vertical projection on the substrate 119 of the distance between the adjacent edge of the black matrix layer 121 and the edge of the metal pattern layer 112d (such as the edge E12), and each protruding length 121g is perpendicular to the normal direction 119n of the substrate 119. In addition, in order to increase the aperture ratio of the light-emitting panel 100, within the allowable tolerance range, the protruding length 121g can be greater than 0 micrometers and less than or equal to 10 micrometers.

[0122] Figure 2It is a cross-sectional schematic view of a light-emitting panel according to another embodiment of the present invention. Please refer to Figure 2 , the light-emitting panel 200 of this embodiment is similar to the aforementioned light-emitting panel 100, and both the light-emitting panels 200 and 100 also include some identical components, such as a pixel array substrate 110 and a plurality of light-emitting elements 130. The following mainly describes the differences between the light-emitting panel 200 and 100. The same features of the light-emitting panels 200 and 100 will not be repeated in principle.

[0123] The light-emitting panel 200 includes at least one filling material 240. Taking Figure 2 as an example, the light-emitting panel 200 may include a plurality of filling materials 240, and these filling materials 240 are respectively filled into these grooves R1. Different from the aforementioned filling material 140, each filling material 240 may include a light-transmitting material 241 and a light-absorbing layer 242. The light-transmitting material 241 is filled into the groove R1, and the light-absorbing layer 242 is disposed on the light-transmitting material 241 and covers the light-transmitting material 241.

[0124] The forming methods of the filling material 240 and the aforementioned filling material 140 may be the same as each other. For example, the light-transmitting material 241 and the light-absorbing layer 242 may be formed by printing (such as inkjet). The light-absorbing layer 242 and the aforementioned filling material 140 may both be black cement and have a black dye, such as carbon black. Therefore, the color of the light-absorbing layer 242 is black, and the light-absorbing layer 242 can basically completely absorb visible light. Therefore, the light-absorbing layer 242 can reduce the reflection of external light to improve the image quality of the light-emitting panel 200.

[0125] In addition, the light-absorbing layer 242 surrounds the light-emitting element 130 in the groove R1 and does not cover the light-emitting top surface 131. For example, each light-emitting element 130 may protrude from the upper surface of the light-absorbing layer 242. In this way, the light-absorbing layer 242 basically does not block the light L1 emitted from the light-emitting top surface 131 to avoid adverse effects on the image quality of the light-emitting panel 200.

[0126] From Figure 2 viewpoint, the height of the light-emitting layer 132 relative to the pixel array substrate 110 is less than the height of the upper surface of the light-transmitting material 241 relative to the pixel array substrate 110. In other words, the light-transmitting material 241 may cover the side (not labeled) of the light-emitting layer 132, but the light-absorbing layer 242 does not cover the side of the light-emitting layer 132. Secondly, the light L1 can penetrate the light-transmitting material 241 and be transmitted within the light-transmitting material 241.

[0127] Therefore, the light L1 generated by the light-emitting layer 132 can enter the light-transmitting material 241 from the side and bottom surfaces of the light-emitting element 130. The light L1 transmitted in the light-transmitting material 241 can enter the metal pattern layers 112a, 112b, 112c, and 112d below the groove R1, so that the light L1 can be reflected by the metal pattern layers 112a, 112b, 112c, and 112d, thereby increasing the brightness of the light-emitting panel 200.

[0128] It is worth mentioning that the light-emitting panel 200 includes a pixel array substrate 110. Therefore, in the same sub-pixel region 111s, for example, in each sub-pixel region 111s, these metal pattern layers 112a, 112b, 112c, and 112d will cover the entire bottom surface of the light-emitting element 130. In this way, the light L1 incident on the light-transmitting material 241 from the side and bottom surfaces of the light-emitting element 130 will be blocked and reflected by the metal pattern layers 112a, 112b, 112c, and 112d, so that the light-emitting panel 200 presents an image only on one side thereof.

[0129] Figure 3 It is a schematic cross-sectional view of a light-emitting panel according to another embodiment of the present invention. Please refer to Figure 3 , the light-emitting panel 300 of this embodiment is similar to the aforementioned light-emitting panel 200. The only difference between the light-emitting panels 300 and 200 is that the filling material 340 included in the light-emitting panel 300 is different from the filling material 240. The following mainly describes the differences between the light-emitting panels 300 and 200. The same features of the light-emitting panels 300 and 200 will not be repeated in principle.

[0130] The light-emitting panel 300 includes at least one filling material 340. Taking Figure 3 as an example, the light-emitting panel 300 may include a plurality of filling materials 340, and these filling materials 340 are respectively filled into these grooves R1. Different from the aforementioned filling material 240, each filling material 340 may include a reflective material 341 and an absorption layer 242. The reflective material 341 is filled into the groove R1, and the absorption layer 242 is disposed on the reflective material 341 and covers the reflective material 341. The absorption layer 242 also surrounds the light-emitting element 130 in the groove R1 and does not cover the light-emitting top surface 131 to avoid blocking the light L1 emitted from the light-emitting top surface 131.

[0131] The forming methods of the reflective material 341 and the absorption layer 242 may be the same as each other. Among them, the reflective material 341 and the absorption layer 242 may be formed by printing (such as inkjet). Different from the absorption layer 242, the reflective material 341 may be a white adhesive material and has a white dye, such as titanium dioxide. Therefore, the color of the reflective material 341 is white and can reflect visible light.

[0132] In Figure 3In the illustrated embodiment, the height of the light-emitting layer 132 relative to the pixel array substrate 110 is less than the height of the upper surface of the light-reflecting material 341 relative to the pixel array substrate 110. In other words, the light-reflecting material 341 can cover the side edges of the light-emitting layer 132, but the light-absorbing layer 242 does not cover the side edges of the light-emitting layer 132, so that the light L1 generated by the light-emitting layer 132 can be incident on the light-reflecting material 341 from the side edges of the light-emitting element 130. Since the light-reflecting material 341 can reflect visible light, the light-reflecting material 341 can reflect the light L1 coming from the side edges of the light-emitting element 130, thereby increasing the brightness of the light-emitting panel 300.

[0133] Figure 4 is a cross-sectional schematic view of a light-emitting panel according to another embodiment of the present invention. Please refer to Figure 4 , the light-emitting panel 400 of this embodiment is similar to the aforementioned light-emitting panel 300, and the main difference between the light-emitting panels 400 and 300 lies in the pixel array substrate 410 included in the light-emitting panel 400. The following mainly describes the differences between the light-emitting panels 400 and 300. The same features of the light-emitting panels 400 and 300 will not be repeated in principle.

[0134] The pixel array substrate 410 of this embodiment is similar to the pixel array substrate 110 of the aforementioned embodiment. For example, the pixel array substrate 410 also includes a plurality of metal pattern layers 112a, 112b, 112c, and 112d and a substrate 119. However, different from the pixel array substrate 110, the pixel array substrate 410 includes a smaller number of insulating layers. Specifically, the pixel array substrate 410 also includes insulating layers 113a, 113b, 113c, 113d, 115a, and 115b, but does not include insulating layers 113e and 115c. Therefore, compared with the pixel array substrate 110, the pixel array substrate 410 includes a smaller number of insulating layers.

[0135] Since the pixel array substrate 410 does not include the insulating layers 113e and 115c, in this embodiment, the light-transmitting pattern layer 122 and the black matrix layer 121 are both disposed on the insulating layer 113d and can be in direct contact with the insulating layer 113d. Comparing Figure 3 with Figure 4 , it can also be seen that Figure 4 the thicknesses of the light-transmitting pattern layer 122 and the black matrix layer 121 in Figure 3 are respectively greater than the thicknesses of the light-transmitting pattern layer 122 and the black matrix layer 121 in Figure 3 . In addition, different from the light-emitting panel 300 shown in Figure 4 , the light-emitting panel 400 of this embodiment further includes a planarization layer 460, wherein the planarization layer 460 covers the light-transmitting pattern layer 122 and the black matrix layer 121, but may not cover the light-emitting element 130 and the filling material 340.

[0136] Figure 5 is a cross-sectional schematic view of a light-emitting panel according to another embodiment of the present invention. Please refer to Figure 5 . The light-emitting panel 500 of this embodiment is similar to the light-emitting panel 200 of the foregoing embodiment. Only the different features of the light-emitting panel 500 from the light-emitting panel 200 will be described below. The same features of the light-emitting panels 500 and 200 will not be repeated in principle.

[0137] The light-emitting panel 500 includes a pixel array substrate 510. Similar to the pixel array substrate 110, the pixel array substrate 510 includes a plurality of metal pattern layers 512a, 512b, 512c, and 512d and a substrate 119, where these metal pattern layers 512a, 512b, 512c, and 512d are respectively similar to the metal pattern layers 112a, 112b, 112c, and 112d in the foregoing embodiment. However, different from the foregoing pixel array substrate 110, in the same sub-pixel region 511s of the pixel array substrate 510, for example, in each sub-pixel region 511s, at least a part of the vertical projection of the light-emitting element 130 on the substrate 119 does not overlap with the vertical projections of these metal pattern layers 512a, 512b, 512c, and 512d on the substrate 119.

[0138] Specifically, in the Figure 5 illustrated embodiment, the vertical projections of these metal pattern layers 512a, 512b, 512c, and 512d on the substrate 119 form a plurality of projection regions MP5, and each light-emitting element 130 will also form a plurality of projection regions CP5 on the substrate 119 ( Figure 5 only one is shown), where the projection region MP5 and the projection region CP5 partially overlap, and the light-transmitting region LA5 in the projection region CP5 does not overlap with the projection region MP5. In other words, a part (i.e., the light-transmitting region LA5) of the projection region CP5 does not overlap with the projection region CP5.

[0139] Therefore, these metal pattern layers 512a, 512b, 512c, and 512d do not cover the entire bottom surface of the light-emitting element 130, so that the light L1 entering the light-transmitting material 241 from the bottom surface of the light-emitting element 130 can penetrate these metal pattern layers 512a, 512b, 512c, and 512d and exit from the underlying substrate 119 and the anti-reflection layer 152. Thus, images can be displayed simultaneously on opposite sides of the light-emitting panel 500.

[0140] Table (I) and Table (II) below are the results obtained by designing multiple light-emitting panels according to the above embodiments and measuring the reflectance of these light-emitting panels. It should be noted first that in Table (I) and Table (II), the light-emitting elements 130 used in these light-emitting panels are two types of micro light-emitting diodes with different sizes. One is a micro light-emitting diode with a larger size, having a width and length of 34 μm × 58 μm. The other is a micro light-emitting diode with a smaller size, having a width and length of 20 μm × 40 μm.

[0141] In addition, these light-emitting panels shown in Table (I) and Table (II) further employ two different black matrix layers 121. One of the black matrix layers 121 has a higher refractive index and is denoted as "BM high refractive index" in Table (I) and Table (II). The other black matrix layer 121 has a lower refractive index and is denoted as "BM low refractive index" in Table (I) and Table (II).

[0142] The black matrix layer 121 with a high refractive index (i.e., BM high refractive index) contains a material with a relatively high refractive index, which can be inorganic particles. For example, the inorganic particles are made of titanium dioxide. The black matrix layer 121 with a low refractive index (i.e., BM low refractive index) contains a material with a relatively low refractive index, which can be a gas. For example, the black matrix layer 121 with a low refractive index may contain multiple microbubbles, where the width (i.e., particle diameter) of each microbubble can be 550 nm or less, and the gas inside the microbubble can be air or nitrogen.

[0143]

[0144] Table (I)

[0145] Group 0 in Table (I) is the control group, and the light-emitting panel of Group 0 does not include the black matrix layer 121, the filling material 140, and the anti-reflection layer 152. That is, the light-emitting panel of Group 0 basically only includes the light-emitting element 130 and the pixel array substrate 110. From Table (I), under the condition of no black matrix layer 121, filling material 140, and anti-reflection layer 152, the large-sized light-emitting element 130 (width of 34 μm and length of 58 μm) has a reflectance of 22%, while the small-sized light-emitting element 130 (width of 20 μm and length of 40 μm) has a reflectance of 21.8%.

[0146] Groups 1 and 5 to 9 are light-emitting panels including the black matrix layer 121. Compared with the control group of Group 0, the light-emitting panels of Groups 1 and 5 to 9 significantly have a relatively low reflectance, which can be 12.5% or less. For example, in Group 1, the light-emitting panel with "BM high refractive index" and the large-sized light-emitting element 130 (34 μm × 58 μm) has a reflectance of 12.3%.

[0147] The light-emitting panels that include at least one of the filling material 140 and the anti-reflection layer 152, but do not include any black matrix layer 121, namely groups 2 to 4, have a minimum reflectivity of 16.6% and a maximum reflectivity of 20.2%. It can be seen from this that, compared with the filling material 140 and the anti-reflection layer 152, the black matrix layer 121 can more effectively and significantly reduce the reflectivity.

[0148] It is worth mentioning that the size of the light-emitting element 130 with a size of 34 μm × 58 μm is larger than the size of the light-emitting element 130 with a size of 20 μm × 40 μm. Therefore, in the same group, the reflectivity of the light-emitting element 130 with a size of 34 μm × 58 μm will necessarily be greater than the reflectivity of the light-emitting element 130 with a size of 20 μm × 40 μm. In addition, by comparing groups 3 and 4, groups 6 and 7, and groups 8 and 9 in Table (1) pairwise, it can be seen that the anti-reflection layer 152 can indeed effectively reduce the reflectivity, and the effect of the double-layer anti-reflection layer 152 in reducing the reflectivity is more significant than that of the single-layer anti-reflection layer 152.

[0149] The black matrix layer 121 with a low refractive index can cause the reflectivity of the light-emitting panel to decrease. Therefore, in the same group and under the condition of the same size, "BM low refractive index" has a lower reflectivity. Although the black matrix layer 121 with a low refractive index can cause the reflectivity of the light-emitting panel to decrease, from Table (1), when the reflectivity is not less than 5%, the effect of the black matrix layer 121 with a low refractive index in reducing the reflectivity is limited. For example, for the light-emitting element 130 with a size of 34 μm × 58 μm in groups 1, 5 to 7, and group 8. When the reflectivity is less than 5%, for example, in group 9 and the light-emitting element 130 with a size of 20 μm × 40 μm in group 8, the black matrix layer 121 with a low refractive index can significantly reduce the reflectivity.

[0150]

[0151] Table (2)

[0152] All groups in Table (2) use the black matrix layer 121, the filling material 140, and 340. It can be seen that groups 10-1 and 10-2 that use the filling material 140 (such as black glue) have relatively low reflectivities. Although groups 11-1, 11-2, 12-1, and 12-2 that use the filling material 340 (including the reflective material 341) have relatively high reflectivities, the reflectivities of groups 11-1, 11-2, 12-1, and 12-2 are all below 8%. For example, in group 12-1, the light-emitting panel with "BM high refractive index" and the light-emitting element 130 with a size of 34 μm × 58 μm has a reflectivity of 7.9%. Therefore, the filling material 340 can still help reduce the reflectivity of the light-emitting panel.

[0153] Although the effect of the filling material 340 in reducing the reflectivity is not as good as that of the filling material 140, the reflective material 341 of the filling material 340 can reflect the light L1. Therefore, the filling material 340 can increase the brightness of the light-emitting panel and improve the optical efficiency by 50% to 70%. In addition, the effect of the filling material 240 in reducing the reflectivity is also not as good as that of the filling material 140, but the light-transmitting material 241 of the filling material 240 can cause the light L1 to be reflected by the metal pattern layers 112a, 112b, 112c, and 112d (or Figure 5 the metal pattern layers 512a, 512b, 512c, and 512d in

[0154] In Table (II), the "metal pattern layer under the light-emitting element", for example, the metal pattern layer 112c (or Figure 5 the metal pattern layer 512c in

[0155] Figure 6 is a top view schematic diagram of a light-emitting panel according to another embodiment of the present invention. Please refer to Figure 6 , the light-emitting panel 600 of this embodiment is similar to the light-emitting panel 100 of the foregoing embodiment, and the following mainly describes the different features of the light-emitting panel 600 from the foregoing embodiment. The same features of the light-emitting panels 600 and 100 will not be repeated in principle.

[0156] The light-emitting panel 600 includes a pixel array substrate 610, a black matrix layer 621, and a light-transmitting pattern layer (not labeled). The pixel array substrate 610 has a plurality of sub-pixel regions 111s, a plurality of light-transmitting regions 611t, a plurality of trace lines DL6 and SL6. The light-transmitting pattern layer includes a plurality of light-transmitting layers 622p distributed in the light-transmitting regions 611t. The trace line SL6 extends along the first direction D1, and the trace line DL6 extends along the second direction D2. In addition, the structures and functions of the trace line DL6 and the trace line T41 can be the same, and the structures and functions of the trace line SL6 and the trace line T11 can also be the same.

[0157] Different from the aforementioned light-emitting panel 100, in the light-emitting panel 600, the black matrix layer 621 covers these traces DL6 and SL6, and surrounds a light-transmitting layer 622p along a part of these traces DL6 and SL6, wherein the shape of at least one light-transmitting layer 622p is L-shaped. For Figure 6 example, the shapes of each light-transmitting region 611t and each light-transmitting layer 622p are both L-shaped.

[0158] Each L-shaped light-transmitting layer 622p can be divided into eight groups GR1 (equivalent to the main pixel region), wherein both the size of the light-transmitting region 611t and the light-transmitting layer 622p are larger than those of the light-transmitting region 111t and the light-transmitting layer 122p in the aforementioned embodiment. Therefore, the light-transmitting pattern layer of this embodiment can reduce the diffraction of light, reduce the intensity of multi-order light and high-frequency light, so as to reduce the edge blur of the penetrated image, thereby improving the image quality of the light-emitting panel 600.

[0159] Figures 7A to 7C It is a top view schematic diagram of the light-emitting panels of other multiple embodiments of the present invention. Figures 7A to 7C The disclosed light-emitting panels 700a, 700b and 700c are all similar to the aforementioned embodiments, wherein each of the light-emitting panels 700a, 700b and 700c also includes multiple traces DL6 and SL6 and a black matrix layer (such as the black matrix layer 621, Figures 7A to 7C not shown), and the black matrix layer covers these traces DL6 and SL6. The following only describes the different characteristic features of the light-emitting panels 700a, 700b and 700c from the aforementioned embodiments. As for the same characteristic features of the aforementioned embodiments and Figures 7A to 7C the embodiments, they will not be repeated below.

[0160] Different from the aforementioned embodiments, the shapes of the main pixel regions of the three light-emitting panels 700a, 700b and 700c are all different from those of the aforementioned embodiments. Please refer to Figure 7A , for example, Figure 7A the shape of the main pixel region M71 in Figure 7B is rectangular, wherein the long side of the main pixel region M71 extends along the first direction D1, and the short side extends along the second direction D2. However, in other embodiments, the long side of the main pixel region M71 can extend along the second direction D2, and the short side can extend along the first direction D1. Please refer to Figure 7C and Figure 7B and Figure 7C respectively show the main pixel region M72 with a circular shape and the main pixel region M73 with an irregular shape.

[0161] In summary, since external light can penetrate the light-transmitting pattern layer distributed in the light-transmitting area, the light-emitting panel disclosed in at least one embodiment of the present invention can have a wider application range compared with common existing opaque display panels. For example, in the aspect of vehicle-mounted displays, the light-emitting panel of the above embodiment can allow external light to penetrate, so it will not block the driver's line of sight, and thus is suitable for being directly installed on the windshield as a head-up display (HUD). Similarly, the light-emitting panel of the above embodiment is also suitable for being directly installed on the visor of a safety helmet or on glasses, so it is also applicable to wearable devices.

[0162] Although the present invention is disclosed in combination with the above embodiments, it is not intended to limit the present invention. Those of ordinary skill in the art to which the present invention pertains can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A light-emitting panel, comprising: a pixel array substrate having a plurality of sub-pixel regions and a plurality of light-transmitting regions, wherein one of the sub-pixel regions is located between at least two adjacent ones of the light-transmitting regions; a plurality of light-emitting elements disposed on the pixel array substrate and electrically connected to the pixel array substrate, wherein the light-emitting elements are respectively located on the sub-pixel regions; a black matrix layer disposed on the pixel array substrate and not distributed in the light-transmitting regions; and a light-transmitting pattern layer disposed on the pixel array substrate and distributed in the light-transmitting regions, wherein the black matrix layer, the light-transmitting pattern layer and the pixel array substrate form a plurality of grooves, the grooves are respectively located on the sub-pixel regions, the light-emitting elements are respectively located in the grooves, wherein the pixel array substrate forms the bottoms of the grooves, and the black matrix layer and the light-transmitting pattern layer both contact an insulating layer of the pixel array substrate to jointly form the side walls of at least one of the grooves, so that the black matrix layer and the light-transmitting pattern layer jointly surround the light-emitting element located in at least one of the grooves.

2. The light-emitting panel according to claim 1, further comprising: a plurality of filling materials respectively filled into the grooves, wherein each of the light-emitting elements has a light-emitting top surface, and the filling materials do not cover the light-emitting top surfaces of the light-emitting elements.

3. The light-emitting panel according to claim 2, wherein at least one of the filling materials is a black adhesive material.

4. The light-emitting panel according to claim 2, wherein at least one of the filling materials comprises: a reflective material filled into the groove; and a light-absorbing layer disposed on the reflective material and covering the reflective material, wherein the light-absorbing layer surrounds one of the light-emitting elements in the groove.

5. The light-emitting panel according to claim 4, wherein each of the light-emitting elements has a light-emitting layer, and the height of the light-emitting layer relative to the pixel array substrate is less than the height of the upper surface of the reflective material relative to the pixel array substrate.

6. The light-emitting panel according to claim 2, wherein at least one of the filling materials comprises: a light-transmitting material filled into the groove; and a light-absorbing layer disposed on the light-transmitting material and covering the light-transmitting material, wherein the light-absorbing layer surrounds one of the light-emitting elements in the groove.

7. The light-emitting panel according to claim 6, wherein each of the light-emitting elements has a light-emitting layer, and the height of the light-emitting layer relative to the pixel array substrate is less than the height of the upper surface of the light-transmitting material relative to the pixel array substrate.

8. The light-emitting panel according to claim 1, wherein the black matrix layer protrudes from the upper surface of the light-transmitting pattern layer, and the height difference between the upper surface of the black matrix layer and the upper surface of the light-transmitting pattern layer is less than or equal to 1.5 micrometers.

9. The light-emitting panel according to claim 1, wherein the pixel array substrate comprises: a substrate; and a plurality of metal pattern layers disposed on the substrate and not overlapping with the light-transmitting pattern layer, wherein in the same sub-pixel region, the vertical projections of the metal pattern layers on the substrate completely cover the vertical projection of the light-emitting element on the substrate.

10. The light-emitting panel according to claim 1, wherein the pixel array substrate comprises: a substrate; and A plurality of metal pattern layers are disposed on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel region, at least a part of the vertical projection of the light-emitting element on the substrate does not overlap with the vertical projection of the metal pattern layers on the substrate.

11. The light-emitting panel according to claim 1, wherein the pixel array substrate comprises: a substrate; and a plurality of metal pattern layers are disposed on the substrate and do not overlap with the light-transmitting pattern layer, wherein in the same sub-pixel region, the area of the vertical projection of the metal pattern layers on the substrate is greater than or equal to half of the area of the vertical projection of the groove on the substrate.

12. The light-emitting panel according to claim 1, wherein the pixel array substrate comprises: a substrate; and a plurality of traces are disposed on the substrate, wherein the black matrix layer extends along the traces and covers the traces.

13. The light-emitting panel according to claim 12, wherein the light-transmitting pattern layer comprises a plurality of light-transmitting layers, and the black matrix layer surrounds one of the light-transmitting layers along a part of the traces, wherein the shape of at least one of the light-transmitting layers is L-shaped.

14. The light-emitting panel according to claim 12, wherein the light-transmitting pattern layer comprises a plurality of light-transmitting layers, and the black matrix layer surrounds each of the light-transmitting layers along four of the traces, wherein the shape of each of the light-transmitting layers is an asymmetrical shape.

Images