Optical fiber circuit board assembly and optoelectronic hybrid circuit board

Abstract

This application relates to the technical field of circuit boards, and specifically discloses an optical fiber circuit board assembly and an optoelectronic hybrid circuit board, which at least include: a substrate, including a main body portion having at least a first opening window and a first extension portion formed by the main body portion extending toward the center of the first opening window inside the first opening window; a first optical fiber interface located at the end of the first extension portion; a first optical fiber unit disposed on the main body portion and the first extension portion, and one end of the first optical fiber unit is connected to the first optical fiber interface, and the first optical fiber unit is used to couple to a first optical device through the first optical fiber interface. By the above method, this application can simplify the assembly of optical interconnection and electrical interconnection, and the efficiency is greatly improved.

Description

Technical Field

[0001] This application relates to the technical field of circuit boards, and particularly to an optical fiber circuit board assembly and an optoelectronic hybrid circuit board. Background Art

[0002] Electrical interconnection refers to using metal lines (usually copper) to achieve signal connection between circuit boards and chips. Optical interconnection refers to using light guiding media (such as optical fibers, optical waveguides, etc.) to achieve signal connection between circuit boards and chips.

[0003] Optical interconnection can be combined with electrical interconnection. However, currently, the number of optical fibers in optical interconnection is usually relatively large, which easily leads to problems such as being in a mess and being difficult to assemble. Summary of the Invention

[0004] Embodiments of this application provide an optical fiber circuit board assembly and an optoelectronic hybrid circuit board to solve the technical problem in the prior art that it is difficult to assemble optical interconnection and electrical interconnection.

[0005] To solve the above technical problem, one technical solution adopted by this application is: to provide an optical fiber circuit board assembly, which at least includes: a substrate, including a main body portion having at least a first opening window and a first extension portion extending from the inside of the main body portion at the first opening window towards the center of the first opening window; a first optical fiber interface located at the end of the first extension portion; a first optical fiber unit disposed on the main body portion and the first extension portion, and one end of the first optical fiber unit is connected to the first optical fiber interface, and the first optical fiber unit is used to couple to a first optical device through the first optical fiber interface.

[0006] To solve the above technical problem, one technical solution adopted by this application is: to provide an optoelectronic hybrid circuit board, which includes: a printed circuit board; the aforementioned optical fiber circuit board assembly, which is stacked with the printed circuit board; a first electronic component disposed on the printed circuit board and corresponding to the first opening window; a first optical device disposed on the printed circuit board, the first optical fiber unit is coupled to the first optical device through the first optical fiber interface, and the first optical device is coupled to the first electronic component through the printed circuit board.

[0007] The beneficial effects of the present application are as follows: Different from the prior art, the substrate of the present application includes at least a main body portion and a first extension portion formed by extending from the inner side of the first opening of the main body portion towards the center of the first opening. The first optical fiber unit is disposed in the main body portion and the first extension portion, and the first optical fiber unit is coupled to the first optical device through the first optical fiber interface. In this way, the first optical fiber unit can be disposed in the main body portion and the first extension portion to realize the fixation and protection of the first optical fiber unit, and thus there will be no messy situation. The setting sequence and position of the first optical fiber unit are fixed, and there is no need to re-position and connect the optical devices one by one. Therefore, the assembly of optical interconnection and electrical interconnection is greatly simplified, and the efficiency is greatly improved. Description of the Drawings

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. Among them:

[0009] Figure 1 is a schematic structural diagram of an embodiment of the optical fiber circuit board assembly of the present application;

[0010] Figure 2 is a schematic structural diagram of another embodiment of the optical fiber circuit board assembly of the present application;

[0011] Figure 3 is a schematic partial structural diagram of another embodiment of the optical fiber circuit board assembly of the present application;

[0012] Figure 4 is a schematic structural diagram of yet another embodiment of the optical fiber circuit board assembly of the present application;

[0013] Figure 5 is a schematic structural diagram of the first embodiment of the optoelectronic hybrid circuit board of the present application;

[0014] Figure 6 is another schematic structural diagram of the first embodiment of the optoelectronic hybrid circuit board of the present application;

[0015] Figure 7 is a schematic structural diagram of the main body portion in the optical fiber circuit board assembly of the present application;

[0016] Figure 8 is a schematic structural diagram of the second embodiment of the optoelectronic hybrid circuit board of the present application. Detailed Embodiments

[0017] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0018] Referring to Figure 1 , in this embodiment, the optical fiber circuit board assembly 10 may include a circuit board that only transmits optical signals, or may include a circuit board that transmits mixed signals including optical signals.

[0019] The optical fiber circuit board assembly 10 at least includes: a substrate 11, a first optical fiber interface 141, and a first optical fiber unit 121.

[0020] The substrate 11 includes a main body portion 111 having at least a first opening 101 and a first extension portion 112 formed by extending from the inside of the main body portion 111 at the first opening 101 toward the center of the first opening 101. The first optical fiber interface 141 is located at the end of the first extension portion 112. The first optical fiber unit 121 is disposed on the main body portion 111 and the first extension portion 112, and one end of the first optical fiber unit 121 is connected to the first optical fiber interface 141. The first optical fiber unit 121 is used to couple to the first optical device 201 through the first optical fiber interface 141.

[0021] Specifically, in this embodiment, a graphic transfer process may be used to open the first opening 101 in the central region or the edge region of the main body portion 111, that is, the main body portion 111 in the central region or the edge region is removed, so as to correspondingly dispose electronic components and optical devices in the first opening 101 during subsequent processing.

[0022] The first opening 101 may be a quadrilateral opening, and a plurality of first extension portions 112 are spaced apart from each other on two inner sides, three inner sides, or four inner sides of the first opening 101. Among them, when a plurality of first extension portions 112 are spaced apart from each other on the four inner sides of the first opening 101, the plurality of first extension portions 112 are disposed in a surrounding manner inside the first opening 101.

[0023] The first opening 101 may be a circular or oval opening, and a plurality of first extension portions 112 are spaced apart from each other on one-half, three-quarters, or the entire inner circumference of the first opening 101. Among them, when a plurality of first extension portions 112 are spaced apart from each other on the entire inner circumference of the first opening 101, the plurality of first extension portions 112 are disposed in a surrounding manner inside the first opening 101.

[0024] The first optical fiber unit 121 can be disposed on the main body portion 111 and the first extension portion 112, or can be attached inside the main body portion 111 and the first extension portion 112. The first optical fiber units 121 are arranged in the main body portion 111 and the first extension portion 112 in a certain manner. Among them, the arrangement manners of the respective first optical fiber units 121 in the main body portion 111 and the first extension portion 112 can be the same or different. Each first optical fiber unit 121 includes at least one optical fiber, specifically, it can be one or more optical fibers, one or more groups of optical fibers, etc. Among them, the number of optical fibers in each group of optical fibers can be set according to actual requirements, such as according to the model of the connector to be connected, etc. For example, it can be 1, 4, 8, 12, 24, etc. The number of groups of optical fibers can also be set according to requirements and is not limited here.

[0025] The optical fibers in the first optical fiber unit 121 can be high-temperature optical fibers or ordinary optical fibers. The difference between high-temperature optical fibers and ordinary optical fibers is that: the material of the surface coating layer of high-temperature optical fibers is a high-temperature resistant material, enabling high-temperature optical fibers to meet the applications in high-temperature harsh environments. Although the surface of ordinary optical fibers is also provided with a coating layer, the coating layer on the surface of ordinary optical fibers will lose the function of protecting the optical fibers at high temperatures, and thus the optical fibers are easily damaged. Among them, the designer can select the first optical fiber unit 121 as a high-temperature optical fiber or an ordinary optical fiber according to the application environment of the optical fiber circuit board assembly 10. For example: when it is required that the optical fiber circuit board assembly 10 can work at a high temperature above 100 °C and can be repeatedly bent, the first optical fiber unit 121 can be selected as a high-temperature optical fiber. It should be noted that setting the first optical fiber unit 121 as a high-temperature optical fiber can not only broaden the operating temperature of the optical fiber circuit board assembly 10, but also enable the optical fiber circuit board assembly 10 to be processed by a lamination method during the processing process, thereby broadening the processing methods of the optical fiber circuit board assembly 10.

[0026] Among them, the first optical fiber interface 141 can include an optical connector and the first optical fiber unit 121 extending from the end of the first extension portion 112. The optical connector is provided with a positioning structure, specifically, it can be arranged in the inner cavity of the optical connector. The optical connector can be used to receive the first optical fiber unit 121 extending from the end of the first extension portion 112 in the optical fiber circuit board assembly 10 and position the first optical fiber unit 121 through the positioning structure.

[0027] Specifically, the first optical fiber interface 141 may include a single-channel optical connector and / or a multi-channel optical connector, as well as a first optical fiber unit 121 extending from the end of the first extension 112. Among them, the single-channel optical connector is provided with a positioning structure for positioning one first optical fiber unit 121, and is used to receive and position one first optical fiber unit 121 extending from the substrate 11. The multi-channel optical connector is provided with a positioning structure for positioning multiple first optical fiber units 121, and is used to receive and position multiple first optical fiber units 121 extending from the first extension 112.

[0028] In the actual manufacturing process, whether it is a single-channel optical connector or a multi-channel optical connector, the corresponding first optical fiber unit 121 needs to be first inserted into the inner cavity of the optical connector, then the optical fiber can be fixed with glue, and the excess optical fiber can be cut off, and then polished, so as to make the first optical fiber interface 141 that meets the requirements.

[0029] The beneficial effect of this application is: different from the prior art, the substrate of this application includes at least a main body part and a first extension part formed by the main body part extending towards the center of the first opening on the inner side of the first opening. The first optical fiber unit is arranged in the main body part and the first extension part, and the first optical fiber unit is coupled to the first optical device through the first optical fiber interface. In this way, the first optical fiber unit can be arranged in the main body part and the first extension part to realize the fixation and protection of the first optical fiber unit, and thus there will be no messy situation. The arrangement order and position of the first optical fiber units are fixed, and there is no need to re-position and connect the optical devices one by one. Therefore, the assembly of optical interconnection and electrical interconnection is greatly simplified, and the efficiency is greatly improved.

[0030] In an embodiment, the substrate 11 further includes a second extension part 113 extending outward from the outer side of the main body part 111. The optical fiber circuit board assembly 10 further includes a second optical fiber interface 142, and the second optical fiber interface 142 is located at the end of the second extension part 113. Among them, a part of the first optical fiber unit 121 is arranged in the second extension part 113, the other end of the first optical fiber unit 121 is connected to the second optical fiber interface 142, and the first optical fiber unit 121 is used to couple to the second optical device 202 or the second optical fiber unit 122 through the second optical fiber interface 142.

[0031] Specifically, a part of the first optical fiber unit 121 may be buried in the second extension part 113 or may be attached to the inside of the second extension part 113. The first optical fiber unit 121 is arranged in the second extension part 113 in a certain manner.

[0032] The second optical fiber interface 142 may include a single-channel optical connector and / or a multi-channel optical connector, and a first optical fiber unit 121 extending from the end of the second extension 113. Among them, the single-channel optical connector is provided with a positioning structure for positioning one first optical fiber unit 121, and is used to receive and position one first optical fiber unit 121 extending from the substrate 11. The multi-channel optical connector is provided with a positioning structure for positioning multiple first optical fiber units 121, and is used to receive and position multiple first optical fiber units 121 extending from the second extension 113.

[0033] In the actual manufacturing process, whether it is a single-channel optical connector or a multi-channel optical connector, the corresponding first optical fiber unit 121 needs to be inserted into the inner cavity of the optical connector first, then the optical fiber can be fixed with glue, and the excess optical fiber can be cut off, and then polished to make the second optical fiber interface 142 that meets the requirements.

[0034] In one embodiment, the substrate 11 further includes: a plurality of third extensions 114 extending outward from the outer side of the main body 111, and the ends of the plurality of third extensions 114 are distributed in a semi-surrounding or surrounding manner. Further, the ends of the plurality of third extensions 114 can be arranged in a single-ring array or a double-ring array to increase the arrangement density of the optical devices and increase the integration degree of the optoelectronic hybrid circuit board 100.

[0035] The optical fiber circuit board assembly 10 further includes: a third optical fiber interface 143 and a plurality of third optical fiber units 123.

[0036] The third optical fiber interface 143 is located at the end of the third extension 114. A plurality of third optical fiber units 123 are arranged in the main body 111 and each third extension 114, and one end of the third optical fiber unit 123 is connected to the third optical fiber interface 143. The third optical fiber unit 123 is used to couple to the third optical device 203 through the third optical fiber interface 143.

[0037] Further, the ends of the plurality of third extensions 114 are arranged in a single-ring array or a double-ring array. Furthermore, the third optical devices 203 are arranged in a single-ring array or a double-ring array to increase the arrangement density of the third optical devices 203 and increase the integration degree of the optoelectronic hybrid circuit board 100.

[0038] In one embodiment, at least one third extension 114 is bent near the remaining third extensions 114 to form a state where the ends of the plurality of third extensions 114 are distributed in a semi-surrounding or surrounding manner.

[0039] Such as Figure 7As shown, in one embodiment, the substrate 11 includes: a first film layer 1111, a second film layer 1112, and a bonding layer 1113 that are stacked and spaced apart. The first film layer 1111 and the second film layer 1112 are stacked and spaced apart, and the first optical fiber unit is received between the first film layer 1111 and the second film layer 1112. Wherein, a first opening is formed between the first film layer 1111 and the second film layer 1112 at the end of the first extension portion, and the first optical fiber interface is at least partially located within the first opening. The bonding layer 1113 fills the remaining space between the first film layer 1111 and the second film layer 1112 except for the first optical fiber unit, so as to fix the first optical fiber unit relative to the first film layer 1111.

[0040] In one embodiment, the first film layer 1111 is a flexible material; the second film layer 1112 and the bonding layer 1113 are thermosetting materials or thermoplastic materials; wherein, the bonding layer 1113 includes n bonding layers 1114 stacked, and multiple first optical fiber units are distributed in m layers of optical fiber unit layers stacked, where n≥1, m≥1; the optical fiber unit layer is disposed between two adjacent bonding layers 1114 or within one of the bonding layers 1114.

[0041] In one embodiment, the first film layer 1111 and the second film layer 1112 are flexible materials, wherein, the bonding layer 1113 includes n bonding layers 1114 stacked, and multiple first optical fiber units are distributed in m layers of optical fiber unit layers stacked, where n≥1, m≥1. The optical fiber unit layer is disposed between two adjacent bonding layers 1114 or within one of the bonding layers 1114, and the bonding layer 1114 is a thermosetting material or a thermoplastic material.

[0042] Specifically, the flexible material can specifically be a flexible composite material, for example, it can be: polyimide, polyethylene terephthalate, polydimethylsiloxane, etc. The first film layer 1111 is made of a flexible material, and a flexible substrate 11 can be obtained, so as to be able to withstand repeated bending to adapt to actual position requirements. The thickness of the first film layer 1111 may not be greater than 100μm, for example, 20μm - 100μm, specifically such as 20μm, 25μm, 45μm, 65μm, 85μm, 100μm, etc., and no specific limitation is made here.

[0043] Wherein, a bonding layer 1113 is provided between the adjacent first film layer 1111 and the second film layer 1112 to be connected together through the bonding layer 1113, and a corresponding optical fiber unit 12 is fixed between the adjacent first film layer 1111 and the second film layer 1112 through the bonding layer 1113, and the bonding layer 1113 fills the remaining space between the adjacent first film layer 1111 and the second film layer 1112 except for the optical fiber unit 12.

[0044] It should be noted that when the thickness of the bonding layer 1113 is too small, it is difficult to fix the optical fiber, and when the thickness is too large, it is difficult to maintain the flexibility of the substrate 11. Herein, the thickness refers to the thickness of the bonding layer 1113 in the direction perpendicular to the plate surface of the first film layer 1111 and the second film layer 1112. In this embodiment, the thickness of the thinnest region of the bonding layer 1113 between two adjacent first film layers 1111 and second film layers 1112 is greater than one-tenth of the diameter of the optical fiber unit 12 and less than 10 times the diameter of the optical fiber unit 12, or greater than one-half of the diameter of the optical fiber unit 12 and less than 2 times the diameter of the optical fiber unit 12. For example, the thickness of the thinnest region of the bonding layer 1113 between two adjacent first film layers 1111 and second film layers 1112 is one-fifth, one-half, 1 time, 2 times, 5 times, etc. of the optical fiber diameter, and no specific limitation is made here.

[0045] Specifically, the thickness of the bonding layer 1113 is not less than 50 μm and can be 50 μm, 60 μm, 70 μm, etc. After using the bonding layer 1113, the peel strength between two adjacent first film layers 1111 and second film layers 1112 is not less than 15 N / cm3.

[0046] Specifically, in an application scenario, the adhesive layer 1114 is solid and flexible within the first temperature range and / or the first pressure range, and has fluidity within the second temperature range and / or the second pressure range, where any temperature value in the first temperature range is not greater than any temperature value in the second temperature range. Specifically, at normal temperature and pressure, or close to normal temperature and pressure, the adhesive layer 1114 is solid and flexible, and when it is heated to a certain temperature and / or a certain pressure is applied, it has a certain fluidity. Specifically, the adhesive layer 1114 can be a thermoplastic material or a thermosetting material.

[0047] Among them, different materials of the adhesive layer 1114 can be selected according to the actual use environment of the optical fiber circuit board assembly 10. Specifically, when it is necessary to adapt to a high-temperature environment, as described above, the optical fiber of the optical fiber unit 12 uses a high-temperature optical fiber, and the material of the adhesive layer 1114 can be at least one of an epoxy resin system, an acrylic system, and a silicone system. When only operating in an ordinary normal-temperature environment, as described above, the optical fiber of the optical fiber unit 12 uses an ordinary optical fiber, and the material of the adhesive layer 1114 can be at least one of an acrylic system and a silicone system.

[0048] With the bonding layer 1114 made of the above materials, when the substrate 11 is heated and / or pressurized, the bonding layer 1114 can flow and wrap around the periphery of the optical fiber unit 12, and fill the space other than the optical fiber between the adjacent first film layer 1111 and the second film layer 1112, thereby fixing the optical fiber more securely, reducing the loosening and displacement of the optical fiber due to insecure fixation during long-term use, and thus improving the reliability of the substrate 11 and the optical fiber circuit board assembly 10.

[0049] Refer to Figure 5-6 , in this embodiment, the optoelectronic hybrid circuit board 100 includes: a printed circuit board 30, an optical fiber circuit board assembly 10, a first electronic component 401, and a first optical device 201.

[0050] The optical fiber circuit board assembly 10 is the optical fiber circuit board assembly 10 in the above embodiment. The optical fiber circuit board assembly 10 and the printed circuit board 30 are stacked, the first electronic component 401 is disposed on the printed circuit board 30, and the first electronic component 401 is disposed corresponding to the first opening 101. The first optical device 201 is disposed on the printed circuit board 30, the first optical fiber unit 121 is coupled to the first optical device 201 through the first optical fiber interface 141, and the first optical device 201 is coupled to the first electronic component 401 through the printed circuit board 30.

[0051] Among them, the first electronic component 401 may extend beyond or not extend beyond the first opening 101.

[0052] Specifically, a support member 60 is disposed between the printed circuit board 30 and the optical fiber circuit board assembly 10. Specifically, mounting holes (not shown in the figure) may be provided on the printed circuit board 30 and the optical fiber circuit board assembly 10. At this time, the support member 60 may be a screw, a rivet, a pin, etc., which are fixedly connected to the printed circuit board 30 and the optical fiber circuit board assembly 10 by being inserted into the mounting holes. In this way, the fixation between the printed circuit board 30 and the optical fiber circuit board assembly 10 can be made more secure and the disassembly is also more convenient.

[0053] Such as Figure 6 shown, in one embodiment, the optoelectronic hybrid circuit board 100 further includes: a first optical device 201. The first optical device 201 is disposed on the printed circuit board 30, and the first optical device 201 is disposed on the periphery of the first electronic component 401.

[0054] In one embodiment, the optoelectronic hybrid circuit board 100 further includes: a second optical fiber unit or a second optical device 202 disposed on the printed circuit board 30. The first optical fiber unit is coupled to the second optical fiber unit or the second optical device 202 through the second optical fiber interface, and the second optical device 202 is coupled to the first electronic component 401 through the printed circuit board 30.

[0055] In one embodiment, the optoelectronic hybrid circuit board 100 further includes: a second electronic component 50 and a third optical device 203. The second electronic component 50 and the third optical device 203 are both disposed on the printed circuit board 30, and a plurality of third optical devices 203 are spaced apart from each other, and the plurality of third optical devices 203 are distributed in a semi-surrounding or surrounding manner outside the second electronic component 50. The third optical fiber unit is coupled to the third optical device 203 through a third optical fiber interface, and the third optical device 203 is coupled to the second electronic component 50 through the printed circuit board 30. Further, the plurality of third optical devices 203 can be arranged in a single-ring array or a double-ring array to increase the arrangement density of the plurality of third optical devices 203 and increase the integration degree of the optoelectronic hybrid circuit board 100.

[0056] In one embodiment, a second opening window 102 is further formed in the main body portion, and the second opening window 102 is spaced apart from the first opening window 101. The optoelectronic hybrid circuit board 100 further includes: a third electronic component. The third electronic component is disposed on the printed circuit board 30, and the third electronic component is correspondingly disposed with the second opening window 102 of the optoelectronic hybrid circuit board 100, wherein the second opening window 102 is used to expose the third electronic component.

[0057] As Figure 8 shown, in one embodiment, the optoelectronic hybrid circuit board 100 further includes: a printed circuit board 30, an optical fiber circuit board assembly 10, a high-speed substrate 70, a first optical device 201, and a first electronic component 401. The optical fiber circuit board assembly 10 is the optical fiber circuit board assembly 10 in the above embodiment. The printed circuit board 30 can be made of ordinary inexpensive boards and there may be no high-speed signals inside the printed circuit board 30. The high-speed substrate 70 is disposed on one side of the printed circuit board 30. The first optical device 201 and the first electronic component 401 are both disposed on the side of the high-speed substrate 70 away from the printed circuit board 30. Among them, the number of the first optical devices 201 can be multiple. The optical fiber circuit board assembly 10 and the printed circuit board 30 are stacked, and the first electronic component 401 is correspondingly disposed with the first opening window 101. The first optical fiber unit 121 is coupled to the first optical device 201 through a first optical fiber interface 141, and the first optical device 201 is coupled to the first electronic component 401 through the high-speed substrate 70.

[0058] In one embodiment, the above-mentioned first electronic component 401 can be an Application Specific Integrated Circuit (ASIC) chip for a dedicated application, and the above-mentioned first optical device 201 can be a Photonic Engine.

[0059] The above are only the embodiments of the present application, and do not thus limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall similarly be included within the patent protection scope of the present application.

Claims

1. An optoelectronic hybrid circuit board, characterized in that, it at least includes: a substrate, including a main body portion having at least a first opening window and a plurality of first extending portions formed by the main body portion extending from the inner side of the first opening window towards the center of the first opening window; a first optical fiber interface, with each end of each of the first extending portions respectively provided with the first optical fiber interface; a first optical fiber unit, disposed on the main body portion and the first extending portions, and one end of the first optical fiber unit is connected to the first optical fiber interface, and each first optical fiber unit of each of the first extending portions is respectively used to couple at least one first optical device through the corresponding first optical fiber interface a printed circuit board, stacked with the substrate, and a support member is disposed between the printed circuit board and the substrate; a first electronic component, disposed on the printed circuit board, and the first electronic component is disposed corresponding to the first opening window; a first optical device, disposed on the printed circuit board, and the first optical device is disposed around the first electronic component, and each first optical fiber unit is respectively coupled to at least one of the first optical devices through the corresponding first optical fiber interface, and the first optical device is coupled to the first electronic component through the printed circuit board.

2. The optoelectronic hybrid circuit board according to claim 1, characterized in that, the substrate further includes: a second extending portion formed by extending outward from the outer side of the main body portion; the optoelectronic hybrid circuit board further includes: a second optical fiber interface, located at the end of the second extending portion; wherein, a part of the first optical fiber unit is disposed in the second extending portion, the other end of the first optical fiber unit is connected to the second optical fiber interface, and the first optical fiber unit is used to couple a second optical device or a second optical fiber unit through the second optical fiber interface.

3. The optoelectronic hybrid circuit board according to claim 1, characterized in that, the substrate further includes: a plurality of third extending portions formed by extending outward from the outer side of the main body portion, and the ends of the plurality of third extending portions are distributed in a semi-surrounding or surrounding manner; the optoelectronic hybrid circuit board further includes: a third optical fiber interface, located at the end of the third extending portion; a plurality of third optical fiber units, each of the third optical fiber units is buried in the main body portion and each of the third extending portions, and one end of the third optical fiber unit is connected to the third optical fiber interface, and the third optical fiber unit is used to couple a third optical device through the third optical fiber interface.

4. The optoelectronic hybrid circuit board according to claim 3, characterized in that, at least one of the third extending portions is bent to be near the remaining third extending portions, so as to form a state where the ends of the plurality of third extending portions are distributed in a semi-surrounding or surrounding manner.

5. The optoelectronic hybrid circuit board according to claim 1, characterized in that, the substrate includes: a first film layer and a second film layer that are stacked and spaced apart, the first optical fiber unit is received between the first film layer and the second film layer, wherein, a first opening is formed between the first film layer and the second film layer at the end of the first extending portion, and at least a part of the first optical fiber interface is located in the first opening; The bonding layer is filled in the remaining space between the first film layer and the second film layer except for the first optical fiber unit, so as to fix the first optical fiber unit relative to the first film layer.

6. The optoelectronic hybrid circuit board according to claim 5, wherein, the first film layer is a flexible material; the second film layer and the bonding layer are thermosetting materials or thermoplastic materials; wherein, the bonding layer includes n adhesive layers arranged in a stack, and a plurality of the first optical fiber units are distributed in m layers of optical fiber unit layers in a stack, where n≥1 and m≥1; the optical fiber unit layer is disposed between two adjacent adhesive layers or within one of the adhesive layers.

7. The optoelectronic hybrid circuit board according to claim 5, wherein, the first film layer and the second film layer are flexible materials; wherein, the bonding layer includes n adhesive layers arranged in a stack, and a plurality of the first optical fiber units are distributed in m layers of optical fiber unit layers in a stack, where n≥1 and m≥1; the optical fiber unit layer is disposed between two adjacent adhesive layers or within one of the adhesive layers, and the adhesive layer is a thermosetting material or a thermoplastic material.

8. The optoelectronic hybrid circuit board according to claim 2, wherein, the optoelectronic hybrid circuit board further includes: a second optical fiber unit or a second optical device disposed on the printed circuit board, the first optical fiber unit is coupled to the second optical fiber unit or the second optical device through the second optical fiber interface, and the second optical device is coupled to the first electronic component through the printed circuit board.

9. The optoelectronic hybrid circuit board according to claim 3, wherein, the optoelectronic hybrid circuit board further includes: a second electronic component and a third optical device, both disposed on the printed circuit board, and a plurality of the third optical devices are spaced apart from each other, and a plurality of the third optical devices are distributed in a semi-surrounding or surrounding manner outside the second electronic component, the third optical fiber unit is coupled to the third optical device through the third optical fiber interface, and the third optical device is coupled to the second electronic component through the printed circuit board.

10. The optoelectronic hybrid circuit board according to claim 1, wherein, a second opening window is further formed on the main body portion, and the second opening window is spaced apart from the first opening window; the optoelectronic hybrid circuit board further includes: a third electronic component, disposed on the printed circuit board, and the third electronic component is correspondingly disposed with the second opening window of the optoelectronic hybrid circuit board, wherein the second opening window is used to expose the third electronic component.

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