A plating device for processing a multilayer circuit board of an unmanned aerial vehicle

Abstract

The application discloses a kind of electroplating devices for processing multilayer circuit board of unmanned aerial vehicle, including electroplating tank, conveying line, sliding sleeve, sliding plate, movable plate, electric push rod, piston rod, guide rod, bottom plate and multilayer circuit board, the conveying line is located above electroplating tank, the sliding sleeve is slidably arranged on the conveying line, the sliding plate is fixed on the bottom surface of sliding sleeve, and the bottom of the sliding plate movably arranged has movable plate;By being equipped with bottom plate, side slide bar, side sliding block, guide column, spring, bottom stopper, U-shaped seat and side stopper and the like structure, the operator can quickly clamp multilayer circuit board between bottom plate and movable plate, so as to complete the quick placement of multilayer circuit board during electroplating, improve the overall use convenience of electroplating device, also facilitate subsequent quick removal of multilayer circuit board after electroplating, and the distance between the two side stoppers can be adjusted according to the different width of multilayer circuit board, and the use flexibility is high.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit board processing and electroplating, and particularly relates to an electroplating device for processing multilayer circuit boards of unmanned aerial vehicles. BACKGROUND

[0002] An unmanned aerial vehicle, also known as a drone, is an unmanned aircraft that is controlled by radio remote control equipment and self-provided program control device. The control mainboard in the unmanned aerial vehicle is generally made of a multilayer circuit board, which integrates some electronic components and is the core component of the control system of the entire unmanned aerial vehicle. The multilayer circuit board in the unmanned aerial vehicle needs to go through multiple processes during processing, including electroplating operation after chemical copper deposition on the multilayer circuit board. The electroplating of the multilayer circuit board is generally achieved by conveying the multilayer circuit board to the upper part of the electroplating tank through a conveying line and a clamp, and then pushing the clamp and the clamped multilayer circuit board into the electroplating solution in the electroplating tank through a telescopic rod. For example, the existing patent with the publication number CN112165785B discloses an electroplating device for circuit board production, which includes an electroplating tank, a transmission mechanism, a conveying line, a telescopic device and a clamping mechanism. The electroplating device has been widely used in the electroplating processing of various circuit boards and devices.

[0003] The existing electroplating device for circuit board processing is inconvenient to operate, has a complex structure, and cannot quickly place and take out the multilayer circuit board, which hinders the taking and placing of the multilayer circuit board during electroplating and reduces the work efficiency. In addition, the existing clamping mechanism is not convenient to adjust according to multilayer circuit boards of different widths, and has low flexibility. Therefore, the present application provides an electroplating device for processing multilayer circuit boards of unmanned aerial vehicles. SUMMARY

[0004] The present application aims to provide an electroplating device for processing multilayer circuit boards of unmanned aerial vehicles to solve the problems of inconvenient operation and inconvenient adjustment of the existing electroplating device for circuit board processing.

[0005] In order to achieve the above object, the present application provides the following technical scheme: a kind of electroplating device for processing multilayer circuit board of unmanned aerial vehicle, including electroplating tank, conveying line, sliding sleeve, sliding plate, movable plate, electric push rod, piston rod, guide rod, bottom plate and multilayer circuit board, the conveying line is located above electroplating tank, after operation, it can be realized to the multilayer circuit board of clamping and conveying, sliding sleeve is arranged on the conveying line, the sliding plate is fixed on the bottom surface of sliding sleeve, and sliding plate can slide with sliding sleeve, the bottom of sliding plate movably arranged movable plate, movable plate can realize lifting action under the action of electric push rod, the top surface of sliding plate is installed with electric push rod, and the piston rod of electric push rod bottom end penetrates to the bottom of sliding plate and is fixed with movable plate, piston rod can move up and down with movable plate to complete lifting action, the bottom plate is movably installed at the bottom of movable plate, and four corners of the top of bottom plate are all fixed with side slide rod, for the guidance when bottom plate lifts, the top of side slide rod penetrates to the top of movable plate and is fixed with side slide block, four corners of the top of movable plate are all fixed with guide column, side slide block is movably sleeved on guide column, for the guidance of side slide block, and the surface of guide column is also sleeved with spring relative to the bottom of side slide block, for the back push reset after side slide block moves down, the multilayer circuit board is clamped between bottom plate and movable plate, and can complete the stable clamping of multilayer circuit board under the action of spring, the center of the top surface of bottom plate is fixed with two bottom blocks symmetrically, for the blocking and limiting of the bottom of multilayer circuit board, and the center of the bottom surface of movable plate is fixed with U-shaped seat, for the blocking and limiting of the top of multilayer circuit board, the top end of multilayer circuit board is inserted to the inside of U-shaped seat, the bottom end of multilayer circuit board is located between two bottom blocks, so that multilayer circuit board can be positioned in vertical direction, the bottom surface of movable plate is also installed with two side blocks, two side blocks are respectively attached to the two side surfaces of multilayer circuit board, for the limitation of multilayer circuit board in horizontal direction.

[0006] Preferably, the guide rod is fixed on the top surface of the movable plate, and the top end of the guide rod penetrates to the top of the sliding plate, which can further improve the stability of the movable plate during lifting.

[0007] Preferably, an adjustment structure is provided between the side stop and the movable plate, allowing the position of the side stop to be flexibly adjusted to accommodate multilayer circuit boards of different widths. The adjustment structure includes a rectangular slider, a rectangular sliding opening, a threaded rod, and a threaded ring. The rectangular sliding opening is formed on the surface of the movable plate, and the rectangular slider is slidably disposed within the rectangular sliding opening, allowing it to slide left and right. The top end of the side stop extends through the rectangular sliding opening and is fixed to the rectangular slider, enabling the rectangular slider to slide with the side stop to achieve position adjustment. A threaded rod is fixed to the front surface of the rectangular slider, with the front end of the threaded rod extending to the front surface of the movable plate. The threaded ring is fitted onto the threaded rod and is in close contact with the surface of the movable plate for sliding of the rectangular slider. After fixing, the bottom inner wall of the rectangular sliding opening is provided with a bottom slide track that communicates with the bottom surface of the movable plate. The bottom slide track corresponds to the side stop block to ensure smooth sliding of the side stop block. The outer wall of the threaded ring is evenly provided with multiple integrated anti-slip protrusions to facilitate the rotation and screwing of the threaded ring. The threaded ring is threadedly connected to the threaded rod. The surface of the side slider is provided with a through hole, and the size of the through hole is adapted to the guide post to ensure smooth passage of the guide post. The top surface of the guide post is fixed with an anti-detachment stop block, and the anti-detachment stop block is located above the side slider to prevent the side slider from falling off the top of the guide post. The four corners of the movable plate are provided with through holes to ensure smooth passage of the side slider rod, and the through holes correspond to the side slider rod.

[0008] Compared with the prior art, the beneficial effects of the present invention are as follows: through the structure of the base plate, side sliding rod, side sliding block, guide column, spring, bottom stop, U-shaped seat and side stop, the operator can quickly clamp the multi-layer circuit board between the base plate and the movable plate, thereby completing the rapid placement of the multi-layer circuit board during electroplating, improving the overall ease of use of the electroplating device, and facilitating the rapid removal of the multi-layer circuit board after electroplating. At the same time, the distance between the two side stops can be adjusted according to the multi-layer circuit board of different widths, making it highly flexible in use. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the structure of the present invention;

[0010] Figure 2 For the present invention Figure 1 A magnified view of a portion of region A in the middle;

[0011] Figure 3 For the present invention Figure 2 A magnified view of a portion of region B in the middle;

[0012] Figure 4 This is a cross-sectional view of the connection between the side slide rod and the movable plate of the present invention;

[0013] Figure 5 For the present invention Figure 4 A magnified view of a portion of region C in the middle;

[0014] In the figure: 1, electroplating tank; 2, conveying line; 3, sliding sleeve; 4, sliding plate; 5, movable plate; 6, electric push rod; 7, piston rod; 8, guide rod; 9, bottom plate; 10, multilayer circuit board; 11, bottom stopper; 12, U-shaped seat; 13, side sliding rod; 14, side sliding block; 15, side stopper; 16, guide column; 17, spring; 18, rectangular sliding mouth; 19, threaded rod; 20, threaded ring; 21, rectangular sliding block; 22, guide hole. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0016] EMBODIMENT

[0017] Please refer to Figures 1 to 5The application provides a technical scheme: a plating device for processing a multilayer circuit board of an unmanned aerial vehicle, which comprises an electroplating tank 1, a conveying line 2, a sliding sleeve 3, a sliding plate 4, a movable plate 5, an electric push rod 6, a piston rod 7, a guide rod 8, a bottom plate 9 and a multilayer circuit board 10, the conveying line 2 is located above the electroplating tank 1 and is used for conveying the multilayer circuit board 10 after clamping, the sliding sleeve 3 is slidably arranged on the conveying line 2, the sliding plate 4 is fixed to the bottom surface of the sliding sleeve 3, the sliding plate 4 can slide on the conveying line 2 through the sliding sleeve 3, the movable plate 5 is movably arranged at the bottom of the sliding plate 4, the electric push rod 6 is installed on the top surface of the sliding plate 4, the piston rod 7 at the bottom end of the electric push rod 6 penetrates through the bottom of the sliding plate 4 and is fixed to the movable plate 5, the electric push rod 6 can lift the movable plate 5 through the piston rod 7 after starting, the bottom plate 9 is movably installed at the bottom of the movable plate 5, side sliding rods 13 are welded at the four corners of the top of the bottom plate 9, the top ends of the side sliding rods 13 penetrate through the top of the movable plate 5 and are welded with side sliding blocks 14, guide columns 16 corresponding to the side sliding blocks 14 are fixed at the four corners of the top of the movable plate 5, the side sliding blocks 14 are movably sleeved on the guide columns 16, so that the bottom plate 9 can slide up and down through the side sliding rods 13, springs 17 are further sleeved on the surfaces of the guide columns 16 relative to the bottoms of the side sliding blocks 14, and are used for pushing back and resetting after the bottom plate 9 slides down, the multilayer circuit board 10 is clamped between the bottom plate 9 and the movable plate 5, meanwhile, the spring 17 can ensure the clamping stability of the multilayer circuit board 10, two bottom stoppers 11 are symmetrically fixed at the center of the top surface of the bottom plate 9, can block and position the bottom of the multilayer circuit board 10, a U-shaped seat 12 is fixed at the center of the bottom surface of the movable plate 5, the top end of the multilayer circuit board 10 is inserted into the inner side of the U-shaped seat 12, can block and position the top of the multilayer circuit board 10, the bottom end of the multilayer circuit board 10 is located between the two bottom stoppers 11, and two side stoppers 15 are further installed on the bottom surface of the movable plate 5 and are used for blocking and positioning the two sides of the multilayer circuit board 10, the two side stoppers 15 are respectively attached to the two side surfaces of the multilayer circuit board 10, and an adjusting structure is arranged between the side stopper 15 and the movable plate 5.

[0018] In the embodiment, preferably, the guide rod 8 is fixed to the top surface of the movable plate 5 through bolts, and the top end of the guide rod 8 penetrates through the top of the sliding plate 4, so that the stability of the movable plate 5 during lifting can be further ensured.

[0019] In the embodiment, preferably, the adjusting structure comprises a rectangular sliding block 21, a rectangular sliding port 18, a threaded rod 19 and a threaded ring 20, the rectangular sliding port 18 is arranged on the surface of the movable plate 5, the rectangular sliding block 21 is slidingly arranged in the rectangular sliding port 18, the top end of the side stop block 15 penetrates into the rectangular sliding port 18 and is fixed with the rectangular sliding block 21, the rectangular sliding block 21 can slide together with the side stop block 15 to realize position adjustment, the front surface of the rectangular sliding block 21 is welded with the threaded rod 19, and the front end of the threaded rod 19 extends to the front surface of the movable plate 5, the threaded ring 20 is sleeved on the threaded rod 19, and the threaded ring 20 is close to the surface of the movable plate 5 to realize the fixation of the rectangular sliding block 21, and the threaded ring 20 can be loosened subsequently, so that the rectangular sliding block 21 can be adjusted again, the position of the side stop block 15 is changed, the bottom end inner wall of the rectangular sliding port 18 is provided with a bottom sliding channel communicated with the bottom surface of the movable plate 5, the bottom sliding channel corresponds to the side stop block 15 and is used for the smooth penetration and sliding of the side stop block 15, the outer wall of the threaded ring 20 is uniformly provided with a plurality of integral anti-skid protrusions, the rotation of the threaded ring 20 is facilitated, and the threaded ring 20 is in threaded connection with the threaded rod 19.

[0020] In the embodiment, preferably, the surface of the side sliding block 14 is provided with a guide hole 22 penetratingly arranged, and the size of the guide hole 22 is matched with the guide column 16, so that the guide column 16 can smoothly penetrate, the top end surface of the guide column 16 is fixed with an anti-falling block, and the anti-falling block is located above the side sliding block 14, so that the side sliding block 14 can be prevented from falling off from the top end of the guide column 16, and the four corners of the movable plate 5 are provided with through holes corresponding to the side sliding rod 13, so that the side sliding rod 13 can smoothly penetrate.

[0021] In the embodiment, the model of the electric push rod 6 is SLEL501.

[0022] The working principle and use process of the application are as follows: when the electroplating device is used, the bottom plate 9 is first pulled down, so that the side sliding rod 13 moves downward with the side sliding block 14, and the spring 17 is gradually compressed, the bottom plate 9 can be smoothly pulled down, and the distance between the bottom stop block 11 and the U-shaped seat 12 is enlarged, then the multilayer circuit board 10 is horizontally pushed from any side of the bottom plate 9 to between the bottom plate 9 and the movable plate 5, and the bottom end of the multilayer circuit board 10 is between the two bottom stop blocks 11, then the bottom plate 9 is gradually loosened, the spring 17 pushes the side sliding block 14 back, and the side sliding rod 13 moves upward with the bottom plate 9 to reset, finally the top end of the multilayer circuit board 10 can be between the two side stop blocks 15 and embedded in the inside of the U-shaped seat 12, so that the multilayer circuit board 10 can be quickly clamped and placed, after the subsequent conveying line 2 runs, the sliding plate 4 can be transported above the electroplating tank 1, at this time the electric push rod 6 works, the piston rod 7 extends to push the movable plate 5 and the bottom plate 9 downward, so that the multilayer circuit board 10 is immersed in the electroplating solution in the electroplating tank 1, electroplating can be realized, after electroplating is completed, the electric push rod 6 works again, the piston rod 7 retracts to move the movable plate 5 and the bottom plate 9 upward, so that the multilayer circuit board 10 after electroplating can be transported to the next process by the operation of the conveying line 2, and the workers in the next process only need to pull down the bottom plate 9, so that the top end of the multilayer circuit board 10 moves out of the two side stop blocks 15, and the multilayer circuit board 10 can be horizontally pulled out from any side of the bottom plate 9, and the multilayer circuit board 10 can be quickly taken out.

[0023] When the distance between the two side stop blocks 15 is adjusted according to the different widths of the multilayer circuit board 10, the threaded ring 20 is only rotated counterclockwise, so that the rectangular sliding block 21 can slide in the rectangular sliding port 18, at this time the side stop block 15 can be adjusted by sliding, and after adjustment to the appropriate position, the threaded ring 20 is rotated clockwise, so that the edge of the threaded ring 20 is tightly attached to the front surface of the movable plate 5, the side stop block 15 can be fixed, and the position of the side stop block 15 can be flexibly and conveniently adjusted.

[0024] Although the embodiments of the application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the application, and the scope of the application is defined by the appended claims and their equivalents.

Claims

1. An electroplating apparatus for processing multilayer circuit boards for unmanned aerial vehicles, comprising an electroplating tank (1), a conveyor line (2), a sliding sleeve (3), a sliding plate (4), a movable plate (5), an electric push rod (6), a piston rod (7), a guide rod (8), a base plate (9), and a multilayer circuit board (10), wherein the conveyor line (2) is located above the electroplating tank (1), the sliding sleeve (3) is slidably disposed on the conveyor line (2), the sliding plate (4) is fixed to the bottom surface of the sliding sleeve (3), the movable plate (5) is movably disposed at the bottom of the sliding plate (4), the electric push rod (6) is installed on the top surface of the sliding plate (4), and the piston rod (7) at the bottom end of the electric push rod (6) penetrates to the bottom of the sliding plate (4) and is fixed to the movable plate (5), characterized in that: The base plate (9) is movably mounted on the bottom of the movable plate (5), and side slide rods (13) are fixed at the four corners of the top of the base plate (9). The top of the side slide rod (13) extends through to the top of the movable plate (5) and is fixed with a side slider (14). Guide posts (16) are fixed at the four corners of the top of the movable plate (5). The side slider (14) is movably sleeved on the guide post (16), and a spring (17) is also sleeved on the surface of the guide post (16) relative to the bottom of the side slider (14). The multilayer circuit board (10) is clamped between the base plate (9) and the movable plate (5). Two bottom blocks (11) are symmetrically fixed at the center of the top surface of the base plate (9), and a U-shaped seat (12) is fixed at the center of the bottom surface of the movable plate (5). The top of the multilayer circuit board (10) is inserted into the inside of the U-shaped seat (12), and the bottom of the multilayer circuit board (10) is located between the two bottom blocks (11). Two side blocks (15) are also installed on the bottom surface of the movable plate (5). The two side blocks (15) are respectively attached to the two side surfaces of the multilayer circuit board (10). An adjustment structure is provided between the side blocks (15) and the movable plate (5).

2. The electroplating apparatus for processing multilayer circuit boards of unmanned aerial vehicles according to claim 1, characterized in that: The guide rod (8) is fixed to the top surface of the movable plate (5), and the top end of the guide rod (8) extends through to the top of the slide plate (4).

3. The electroplating apparatus for processing multilayer circuit boards of unmanned aerial vehicles according to claim 1, characterized in that: The adjustment structure includes a rectangular slider (21), a rectangular slide opening (18), a threaded rod (19), and a threaded ring (20). The rectangular slide opening (18) is opened on the surface of the movable plate (5). The rectangular slider (21) is slidably disposed in the rectangular slide opening (18). The top end of the side stop (15) extends through the rectangular slide opening (18) and is fixed to the rectangular slider (21). The front surface of the rectangular slider (21) is fixed with the threaded rod (19), and the front end of the threaded rod (19) extends to the front surface of the movable plate (5). The threaded ring (20) is sleeved on the threaded rod (19), and the threaded ring (20) is in close contact with the surface of the movable plate (5).

4. The electroplating apparatus for processing multilayer circuit boards of unmanned aerial vehicles according to claim 3, characterized in that: The bottom inner wall of the rectangular sliding opening (18) is provided with a bottom sliding track that communicates with the bottom surface of the movable plate (5), and the bottom sliding track corresponds to the side stop block (15).

5. The electroplating apparatus for processing multilayer circuit boards of unmanned aerial vehicles according to claim 3, characterized in that: The outer wall of the threaded ring (20) is uniformly provided with multiple integrated anti-slip protrusions, and the threaded ring (20) is threadedly connected to the threaded rod (19).

6. The electroplating apparatus for processing multilayer circuit boards of unmanned aerial vehicles according to claim 1, characterized in that: The surface of the side slider (14) is provided with a guide hole (22), and the size of the guide hole (22) is adapted to the guide post (16).

7. The electroplating apparatus for processing multilayer circuit boards of unmanned aerial vehicles according to claim 1, characterized in that: The top surface of the guide post (16) is fixed with an anti-detachment block, and the anti-detachment block is located above the side slider (14).

8. The electroplating apparatus for processing multilayer circuit boards of unmanned aerial vehicles according to claim 1, characterized in that: The movable plate (5) has through holes at each of its four corners, and the through holes correspond to the side slide rods (13).

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