Method, device and equipment for monitoring inductance value of GIS branch bus and storage medium

Abstract

The application discloses a method and device for monitoring inductance values of GIS branch bus, equipment and storage medium, wherein the method comprises: obtaining a three-phase distribution mode contained by the GIS branch bus; segmenting the GIS branch bus according to the three-phase distribution mode to obtain one or more bus segments; respectively establishing corresponding three-dimensional finite element simulation models for the bus segments; determining model parameter values of the three-dimensional finite element simulation models, wherein the model parameter values comprise inductance parameter values, and the inductance parameter values comprise self-inductance parameter values of three-phase conductors and mutual inductance parameter values between the three-phase conductors and a shell. The self-inductance parameter values and the mutual inductance parameter values can consider the three-phase wiring mode and trend, and the influence of other conductive bodies in the surrounding environment on the parameter calculation, so that accurate inductance parameters at different positions in the complete GIS branch bus line are obtained, and a more accurate three-dimensional finite element simulation model can be built.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of data processing, and in particular to a method for monitoring inductance of a GIS branch bus, a device for monitoring inductance of a GIS branch bus, an electronic device, and a computer readable storage medium. BACKGROUND

[0002] With the increase of voltage level in power system, GIS (Gas Insulated Switchgear, gas insulated switchgear) fully enclosed gas insulated switchgear as a kind of safe and reliable operation and small footprint switchgear, has become a key device in a variety of voltage level system. In GIS device, the structure of branch bus is highly compact, and the three-phase and shell will generate certain induced voltage when it is in normal operation. At the same time, GIS shell and various short-circuit devices coexist, resulting in the generation of GIS shell and ground loop current, the induced loop current will cause local heating of the equipment outside the shell, produce a great system loss, accelerate the deterioration of equipment insulation, and have a certain impact on the seismic resistance of the equipment, thereby reducing the service life of the equipment. The mutual inductance generated by the three-phase conductors in the shell is the main reason for the generation of induced voltage and loop current of GIS branch bus, therefore, it is very important to determine the mutual inductance generated by the three-phase conductors in the shell for the subsequent description of the induced voltage and ground loop current of the branch bus in the operation process. SUMMARY

[0003] The present application provides a method, device, equipment and storage medium for monitoring inductance of a GIS branch bus, which can more accurately determine the mutual inductance generated by the three-phase conductors in the shell, and help better describe the induced voltage and ground loop current of the branch bus in the operation process.

[0004] According to a first aspect of the present application, a method for monitoring inductance of a GIS branch bus is provided, the method comprising:

[0005] obtaining a three-phase distribution mode contained in the GIS branch bus;

[0006] segmenting the GIS branch bus according to the three-phase distribution mode to obtain one or more bus segments;

[0007] establishing a corresponding three-dimensional finite element simulation model for each bus segment respectively;

[0008] determining model parameter values of each three-dimensional finite element simulation model, the model parameter values including inductance parameter values, the inductance parameter values including self-inductance parameter values of the three-phase conductors and mutual inductance parameter values between the three-phase conductors and the shell.

[0009] According to a second aspect of the present application, a device for monitoring inductance values of a GIS branch bus is provided, the device comprising:

[0010] a three-phase distribution mode obtaining module configured to obtain a three-phase distribution mode of the GIS branch bus;

[0011] a bus segmenting module configured to segment the GIS branch bus according to the three-phase distribution mode to obtain one or more bus segments;

[0012] a simulation model establishing module configured to establish a corresponding three-dimensional finite element simulation model for each bus segment respectively;

[0013] a model parameter value determining module configured to determine model parameter values of each three-dimensional finite element simulation model, the model parameter values comprising inductance parameter values, the inductance parameter values comprising self-inductance parameter values of three-phase conductors and mutual inductance parameter values between the three-phase conductors and an outer shell.

[0014] According to a third aspect of the present application, an electronic device is provided, the electronic device comprising:

[0015] at least one processor; and

[0016] a memory communicatively connected to the at least one processor; wherein

[0017] the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the method of the first aspect.

[0018] According to a fourth aspect of the present application, a computer readable storage medium is provided, the computer readable storage medium stores computer instructions for enabling a processor to implement the method of the first aspect when executed.

[0019] In the embodiment, the GIS branch bus is divided into one or more bus segments according to different three-phase distribution modes in the actual line of the GIS branch bus. Then, in combination with the finite element simulation method, a three-dimensional finite element simulation model corresponding to each bus segment is established according to the actual structure of each bus segment, and self-inductance parameter values of three-phase conductors and mutual inductance parameter values between the three-phase conductors and an outer shell of the three-dimensional finite element simulation model are calculated. This enables the calculation of self-inductance parameter values and mutual inductance parameter values to consider the three-phase wiring mode and direction, as well as the influence of other conductive bodies in the surrounding environment on the parameter calculation, to obtain accurate inductance parameters at different positions in the complete GIS branch bus line, which helps to build a more accurate three-dimensional finite element simulation model to describe the actual outer shell and ground loop current of the current bus segment during operation.

[0020] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a flowchart of a method for monitoring the inductance value of a GIS branch bus provided in Embodiment 1 of this application;

[0023] Figure 2 This is a schematic diagram of a three-phase horizontally distributed GIS branch bus provided in Embodiment 1 of this application;

[0024] Figure 3 This is a schematic diagram of a three-phase vertically distributed GIS branch bus provided in Embodiment 1 of this application;

[0025] Figure 4 This is a schematic diagram of a three-phase non-horizontal and non-vertical distributed GIS branch bus provided in Embodiment 1 of this application;

[0026] Figure 5 This is a schematic diagram of a magnetic field generated in the conductor of phase A after a current is applied to phase A, as provided in Embodiment 1 of this application;

[0027] Figure 6 This is a schematic diagram of a magnetic field generated inside the shell of phase B after a current is applied to phase A, as provided in Embodiment 1 of this application.

[0028] Figure 7 This is a schematic diagram of the structure of a device for monitoring the inductance value of a GIS branch bus provided in Embodiment 2 of this application;

[0029] Figure 8 This is a schematic diagram of the structure of an electronic device provided in Embodiment 3 of this application. Detailed Implementation

[0030] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0031] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0032] Example 1

[0033] Figure 1 A flowchart of a method for monitoring the inductance value of a GIS branch bus provided in Embodiment 1 of this application is shown below. Figure 1 As shown, the method may include the following steps:

[0034] Step 110: Obtain the three-phase distribution pattern of the GIS branch bus.

[0035] GIS branch bus refers to the branch bus of a GIS device. In one implementation, the three-phase distribution of each branch bus in the GIS device can be found on the design drawings of the GIS device.

[0036] For example, the three-phase distribution can include, but is not limited to: three-phase horizontal distribution, three-phase vertical distribution, and three-phase non-horizontal and non-vertical distribution. Three-phase horizontal distribution refers to the three phase lines (i.e., conductors) of the branch busbar being arranged horizontally, such as... Figure 2 As shown. Three-phase vertical distribution refers to the three phase lines of a branch busbar being arranged vertically, such as... Figure 3 As shown. A three-phase non-horizontal and non-vertical distribution refers to a branch busbar whose three phase lines are arranged in a non-horizontal and non-vertical manner, such as... Figure 4 As shown. Among them, in Figures 2-4 In this context, phase A, phase B, and phase C refer to the three phase lines of the branch busbar.

[0037] Step 120: According to the three-phase distribution method, the GIS branch bus is segmented to obtain one or more bus segments.

[0038] In practice, a GIS branch bus may have different three-phase distribution patterns at different locations. In order to more accurately describe the inductance parameters of different three-phase distribution patterns at different locations, this embodiment, after obtaining the three-phase distribution pattern contained in the GIS branch bus, can divide the GIS branch bus into one or more bus segments according to the three-phase distribution pattern.

[0039] In one embodiment, step 120 may further include the following steps:

[0040] Obtain the boundary information between different three-phase distribution methods; divide the GIS branch bus along the boundary information to obtain multiple bus segments.

[0041] For example, assuming that the distribution of the three phases in a GIS branch busbar is three-phase horizontal distribution, three-phase non-horizontal and non-vertical distribution, and three-phase vertical distribution respectively, we can obtain the boundary line between the three-phase horizontal distribution and the three-phase non-horizontal and non-vertical distribution, as well as the boundary line between the three-phase non-horizontal and non-vertical distribution and the three-phase vertical distribution. Then, according to these two boundary lines, the GIS branch busbar is divided into busbar segments corresponding to the three-phase horizontal distribution, busbar segments corresponding to the three-phase non-horizontal and non-vertical distribution, and busbar segments corresponding to the three-phase vertical distribution.

[0042] Step 130: Establish corresponding three-dimensional finite element simulation models for each busbar segment.

[0043] Specifically, after segmenting the GIS branch busbar to obtain one or more busbar segments, a corresponding three-dimensional finite element simulation model is created for each busbar segment. Compared to creating a three-dimensional finite element simulation model for a single GIS branch busbar, this embodiment combines the three-phase distribution of the GIS branch busbar and constructs three-dimensional finite element simulation models for busbar segments with different distribution patterns. This helps to build more accurate three-dimensional finite element simulation models for describing busbar segments with different distribution patterns. This embodiment does not limit the method of constructing the three-dimensional finite element simulation model.

[0044] In one embodiment, step 130 may further include the following steps:

[0045] Obtain the structural information and material properties of the busbar segment; based on the structural information and material properties, construct a three-dimensional finite element simulation model of the corresponding busbar segment using a set simulation modeling tool.

[0046] In practice, differences in structural information can lead to variations in mutual inductance among the three phases. Therefore, when constructing a three-dimensional finite element simulation model of a busbar segment, the structural information of that busbar segment can be considered.

[0047] The structural information of the busbar segment can reflect the structure of the busbar segment and information about the surrounding environment that affects the magnetic field distribution. In implementation, the structural information of the busbar segment can be retrieved from the design drawings. This structural information may include, but is not limited to, the following: the inner and outer radii of the conductors in the busbar segment, the inner and outer radii of the busbar segment, the height of the busbar segment above the ground, the three-phase distribution of the busbar segment and the distance between the three phases, surrounding conductive walls, and the location of other conductors.

[0048] When building a 3D finite element simulation model of the current busbar segment, the material properties of the current busbar segment can also be set. For example, the material can be any material contained in the current busbar segment, such as three-phase conductors (i.e., wires), the outer shell, the inert gas in the busbar segment, the ground, the walls, and other conductors. Material properties can include electrical conductivity, relative permittivity, and permeability, etc., thereby combining the above structural information to build a 3D finite element simulation model that includes wires, the outer shell, the inert gas, the ground, the walls, and other related conductors.

[0049] Once the structural information and material properties of the busbar segments are obtained, a three-dimensional finite element simulation model of the corresponding busbar segment can be constructed using a pre-defined simulation modeling tool. For example, this simulation modeling tool may include COMSOL finite element software.

[0050] Step 140: Determine the model parameter values ​​of each three-dimensional finite element simulation model. The model parameter values ​​include inductance parameter values, which include the self-inductance parameter values ​​of the three-phase conductors and the mutual inductance parameter values ​​between the three-phase conductors and the shell.

[0051] After the three-dimensional finite element simulation model is built, the model parameter values ​​can be set. In this embodiment, the model parameter values ​​of the three-dimensional finite element simulation model may include inductance parameter values. Furthermore, the inductance parameter values ​​may include the self-inductance parameter values ​​of the three-phase conductors and the mutual inductance parameter values ​​between the three-phase conductors and the shell.

[0052] In practice, the inductance parameters of the three-dimensional finite element simulation model can be calculated based on Faraday's law of induction and the finite element method for electromagnetic fields.

[0053] In one embodiment, when calculating the self-inductance parameter value, step 140 can determine the self-inductance parameter value in the following manner:

[0054] After introducing current into any phase conductor of the three phases of the busbar segment, calculate the first total magnetic flux generated inside the phase conductor; based on the first total magnetic flux, calculate the self-inductance parameter value of the phase conductor.

[0055] For example, assuming the current busbar segmentation has a three-phase horizontal distribution, such as... Figure 5 As shown, if a current is introduced into phase A conductor, the first total magnetic flux generated in region S of phase A conductor can be obtained, where region S is... Figure 5 The shaded area in the diagram represents the cross-section of the conductor within phase A. In one implementation, the first total magnetic flux generated in region S of phase A can be calculated using the following formula:

[0056] Φ A =∫ S B·ds

[0057] Where S is the surface of region S, B is the magnetic induction intensity obtained in region S, and ds is an infinitesimal vector.

[0058] After obtaining the first total magnetic flux, the self-inductance parameter value of phase A conductor can be calculated using the following formula:

[0059]

[0060] Among them, L A N represents the self-inductance parameter value of phase A. A The number of coil turns for phase A (e.g., N can be set according to the actual circuit model). A =1), i A This is the current value applied to phase A.

[0061] Referring to the calculation method for the self-inductance parameter value of phase A above, the self-inductance parameter value of phase B and phase C can be calculated.

[0062] In another embodiment, when calculating the mutual inductance parameter values, step 140 can determine the mutual inductance parameter values ​​in the following manner:

[0063] After introducing current into any phase conductor of the three phases of the busbar segment, calculate the second total magnetic flux generated inside the shell of each of the three phases; based on the second total magnetic flux, calculate the mutual inductance parameter values ​​of the conductor with the current introduced to the shell of each of the three phases.

[0064] For example, such as Figure 6 As shown, if a current is introduced into the A-phase conductor, the second total magnetic flux generated in region S' inside the B-phase casing can be obtained. Region S' inside the B-phase casing is... Figure 6The shaded area in the diagram represents the cross-section of the conductor within phase B. In one implementation, the second total magnetic flux generated by phase A within region S' of phase B can be calculated using the following formula:

[0065] Φ AB =∫ S’ B·dS'

[0066] After obtaining the second total magnetic flux, the mutual inductance parameters of phase A conductor to phase B shell can be calculated using the following formula:

[0067]

[0068] Among them, L AB N represents the mutual inductance parameter value between phase A conductor and phase B casing. A i is the number of turns of the coil in phase A. A This is the current value applied to phase A.

[0069] Referring to the mutual inductance parameter L of phase A conductor to phase B casing mentioned above AB The calculation method can also be used to calculate the mutual inductance parameter L between phase A conductor and phase C shell. AC The mutual inductance parameter L between phase A conductor and phase A casing AA The mutual inductance parameter L between phase B conductor and phase C casing BC The mutual inductance parameter L between phase B conductor and phase B casing BB The mutual inductance parameter L between phase B conductor and phase A casing BA The mutual inductance parameter L between phase C conductor and phase B casing CB The mutual inductance parameter L between phase C conductor and phase A casing CA The mutual inductance parameter L between the C-phase conductor and the C-phase casing C wait.

[0070] It should be noted that after current is introduced into a phase conductor, the total magnetic flux generated inside that phase conductor is different from the total magnetic flux generated by the outer shell of that phase conductor. For example, for L... A In this context, region S refers to the area of ​​the plane perpendicular to the direction of the magnetic field of the entire conductor in phase A; while for region L... AA In this context, the S' region refers to the plane area perpendicular to the direction of the magnetic field generated by the conductor in the middle of phase A on the outer shell.

[0071] Once the inductance parameter values ​​of all busbar segments are determined, the inductance parameter values ​​of the entire GIS branch busbar at different locations can be obtained.

[0072] The mutual inductance generated by the three-phase conductors within the respective phase enclosures is the main cause of induced voltage and circulating current in GIS branch buses. Therefore, in the process of establishing the GIS bus induced voltage and enclosure circulating current model, the calculation of the enclosure mutual inductance parameters is a key factor affecting the accuracy of the final model calculation results. Differences in the actual line layout and routing, as well as variations in the surrounding environment, can cause differences in the mutual inductance parameters of multiple three-phase enclosures within a single line. In this embodiment, based on the different three-phase distribution patterns in the actual GIS branch bus lines, the GIS branch bus is divided into one or more bus segments. Then, using the finite element simulation method, a three-dimensional finite element simulation model corresponding to each bus segment is established based on the actual structure of each bus segment, and the self-inductance parameters of the three-phase conductors and the mutual inductance parameters between the three-phase conductors and the enclosure in this three-dimensional finite element simulation model are calculated. This allows the calculation of self-inductance and mutual inductance parameters to take into account the three-phase wiring method and routing, as well as the influence of other conductors in the surrounding environment on the parameter calculation. This results in accurate inductance parameters at different locations in the complete GIS branch bus line, which helps to build a more accurate three-dimensional finite element simulation model to describe the actual shell and grounding circulation of the current bus segment during operation.

[0073] Furthermore, the self-inductance parameter values ​​of the casing and conductors calculated according to the method of this application are basically the same as the measured self-inductance parameter values, which verifies the feasibility of this method.

[0074] Example 2

[0075] Figure 7 This is a schematic diagram of a device for monitoring the inductance value of a GIS branch busbar according to Embodiment 2 of this application. The device may include the following modules:

[0076] The three-phase distribution mode acquisition module 210 is used to acquire the three-phase distribution mode contained in the GIS branch bus.

[0077] The busbar segmentation module 220 is used to segment the GIS branch busbar according to the three-phase distribution method to obtain one or more busbar segments;

[0078] The simulation model building module 230 is used to build corresponding three-dimensional finite element simulation models for each busbar segment.

[0079] The model parameter value determination module 240 is used to determine the model parameter values ​​of each three-dimensional finite element simulation model. The model parameter values ​​include inductance parameter values, which include the self-inductance parameter values ​​of the three-phase conductors and the mutual inductance parameter values ​​between the three-phase conductors and the shell.

[0080] In one embodiment, the busbar segmentation module 220 is specifically used for:

[0081] Obtain the boundary information between different three-phase distribution patterns;

[0082] The GIS branch bus is divided along the boundary information to obtain multiple bus segments.

[0083] In one embodiment, the three-phase distribution method includes, but is not limited to: three-phase horizontal distribution, three-phase vertical distribution, and three-phase non-horizontal and non-vertical distribution.

[0084] In one embodiment, the simulation model building module 230 is specifically used for:

[0085] Obtain the structural information and material properties of the busbar segment;

[0086] Based on the structural information and material properties, a three-dimensional finite element simulation model of the corresponding busbar segment is constructed using the established simulation modeling tools.

[0087] In one embodiment, the structural information includes, but is not limited to:

[0088] The inner and outer radii of the conductors in the busbar segment, the inner and outer radii of the busbar segment, the height of the busbar segment above the ground, the distance between the three phases of the busbar segment, the surrounding conductive walls, and the location of other conductors.

[0089] In one embodiment, when the inductance parameter value is the self-inductance parameter value of a three-phase conductor, the model parameter value determination module 240 is specifically used for:

[0090] After introducing current into any phase conductor of the three phases of the busbar segment, calculate the first total magnetic flux generated inside that phase conductor;

[0091] Calculate the self-inductance parameter value of the phase conductor based on the first total magnetic flux.

[0092] In one embodiment, when the inductance parameter value is the mutual inductance parameter value between the three-phase conductor and the casing, the model parameter value determination module 240 is specifically used for:

[0093] After introducing current into any phase conductor of the three phases of the busbar segment, calculate the second total magnetic flux generated inside the casing of each of the three phases.

[0094] Based on the second total magnetic flux, calculate the mutual inductance parameters of the conductors carrying the current to the three-phase casing.

[0095] The device for identifying the inductance of a GIS branch bus provided in this application embodiment can execute the method for identifying the inductance of a GIS branch bus provided in any embodiment of this application, and has the corresponding functional modules and beneficial effects of executing the method.

[0096] Example 3

[0097] Figure 8 A schematic diagram of the structure of an electronic device 10 that can be used to implement embodiments of the methods of this application is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the application described and / or claimed herein.

[0098] like Figure 8 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0099] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0100] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the method described in Embodiment 1.

[0101] In some embodiments, the method described in Embodiment 1 may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the method described in Embodiment 1 above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the method described in Embodiment 1 by any other suitable means (e.g., by means of firmware).

[0102] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0103] Computer programs used to implement the methods of this application may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0104] In the context of this application, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium can be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0105] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0106] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0107] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0108] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this is not limited herein.

[0109] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for monitoring the inductance value of a GIS branch busbar, characterized in that, The method includes: Obtain the three-phase distribution pattern of the GIS branch bus; Based on the three-phase distribution method, the GIS branch busbar is segmented to obtain multiple busbar segments; Establish corresponding three-dimensional finite element simulation models for each busbar segment; Determine the model parameter values ​​for each three-dimensional finite element simulation model. The model parameter values ​​include inductance parameter values, which include the self-inductance parameter values ​​of the three-phase conductors and the mutual inductance parameter values ​​between the three-phase conductors and the shell. The step of segmenting the GIS branch busbar according to the three-phase distribution method to obtain multiple busbar segments includes: Obtain the boundary information between different three-phase distribution patterns; The GIS branch busbar is divided along the boundary information to obtain multiple busbar segments; The three-phase distribution methods include: three-phase horizontal distribution, three-phase vertical distribution, and three-phase non-horizontal and non-vertical distribution.

2. The method according to claim 1, characterized in that, The step of establishing corresponding three-dimensional finite element simulation models for each busbar segment includes: Obtain the structural information and material properties of the busbar segment; Based on the structural information and material properties, a three-dimensional finite element simulation model of the corresponding busbar segment is constructed using the established simulation modeling tools.

3. The method according to claim 2, characterized in that, The structural information includes: The inner and outer radii of the conductors in the busbar segment, the inner and outer radii of the busbar segment, the height of the busbar segment above the ground, the distance between the three phases of the busbar segment, and the location of surrounding conductive walls and other conductors.

4. The method according to any one of claims 1-3, characterized in that, When the inductance parameter value is the self-inductance parameter value of a three-phase conductor, determining the model parameter values ​​of each three-dimensional finite element simulation model includes: After introducing current into any phase conductor of the three phases of the busbar segment, calculate the first total magnetic flux generated inside that phase conductor; Calculate the self-inductance parameter value of the phase conductor based on the first total magnetic flux.

5. The method according to any one of claims 1-3, characterized in that, When the inductance parameter value is the mutual inductance parameter value between the three-phase conductor and the shell, determining the model parameter values ​​of each three-dimensional finite element simulation model includes: After introducing current into any phase conductor of the three phases of the busbar segment, calculate the second total magnetic flux generated inside the casing of each of the three phases. Based on the second total magnetic flux, calculate the mutual inductance parameters of the conductors carrying the current to the three-phase casing.

6. A device for monitoring the inductance value of a GIS branch busbar, controlled by the method for monitoring the inductance value of a GIS branch busbar as described in any one of claims 1-5, characterized in that, The device includes: The three-phase distribution mode acquisition module is used to acquire the three-phase distribution mode contained in the GIS branch bus. The busbar segmentation module is used to segment the GIS branch busbar according to the three-phase distribution method to obtain multiple busbar segments; The simulation model building module is used to build corresponding three-dimensional finite element simulation models for each busbar segment. The model parameter value determination module is used to determine the model parameter values ​​of each three-dimensional finite element simulation model. The model parameter values ​​include inductance parameter values, which include the self-inductance parameter values ​​of the three-phase conductors and the mutual inductance parameter values ​​between the three-phase conductors and the shell.

7. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that cause a processor to execute the method of any one of claims 1-5.

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