Wire Cutting Dispatching Method, System, Computer Device and Storage Medium

Abstract

Wire cutting dispatching method, system, computer device and storage medium, the steps include: the first-level dispatching of dispatching the ingots from the solidification stations of several solidification stations in the source storage area to the empty buffer stations in the corresponding buffer stations in the buffer area; the second-level dispatching of dispatching the ingots from several buffer stations in the buffer area to the corresponding machines in the wire cutting area; the dispatching criteria for selecting ingots in the first-level dispatching and the second-level dispatching are the same; the dispatching criteria include: the screening criteria based on screening the inventory information of the ingots in the source storage area; the sorting criteria based on sorting and dispatching the ingots screened out by the screening criteria according to certain conditions. The present invention can accurately select and feed qualified ingots to the corresponding machines; especially for the spliced ingots, according to the ingot attributes in the machining record of the machine being processed or the most recent machining record, the one closest to the length of the longest segment is preferentially selected for machining, reducing the downtime for adjusting the wire network, narrowing the range of wire network movement, improving the cutting quality, and ensuring the good product rate.

Description

Technical Field

[0001] The present invention belongs to the technical field of wire cutting production of photovoltaic silicon wafers, and in particular relates to a wire cutting dispatching method, system, computer device and storage medium. Background Art

[0002] Among the wafers to be processed, there are wafers with standard cutting lengths, wafers formed by splicing non-standard cutting lengths, as well as standard and non-standard wafers with different diameters. Moreover, among these wafers, there are also N-type and P-type wafers, and there are also many different resistivity or oxygen content distinctions in N-type and P-type wafers. For wafers of so many specifications, the distinction of wafers in the existing processing area is mainly carried out by means of remarks on the process sheet. This manual selection of wafer dispatching often leads to mismatches between wafers and machine tool processing, and equipment status information such as abnormal alarms and the remaining processing time of the machine tool cannot be obtained in a timely manner, resulting in a long waiting time for wafer processing. Adjusting the processing recipe of the machine tool to meet the current machine tool processing leads to a decline in the process stability of the equipment and affects the product yield.

[0003] The existing inefficient and low-quality manual dispatching method is gradually phased out, and an automated dispatching method is gradually adopted. The following has been retrieved:

[0004] Chinese Patent Publication No. CN104977903B proposes a wafer batch dispatching method and system under a machine tool group based on a real-time dispatching system. Based on certain online wafer batch data and dispatching rules corresponding to several machine tools in a set of machine tools, it only involves the selection of wafers by each machine tool in a set of machine tools, mainly to solve the technical problem that the same batch of wafers is simultaneously reserved when the machine tools in the same machine tool group reserve wafer batches.

[0005] Chinese Patent Publication No. CN105097424B proposes a dispatching method and system for a semiconductor process production line, mainly by judging whether the residence time of a lot in the experimental process exceeds the restricted allowable time to effectively control the dispatching and operation process of the experimental lot, so as to ensure the reliability of the experimental process and reduce the rework rate of the experimental process.

[0006] Chinese Patent Publication No. CN101996359A proposes a dispatching method for semiconductor manufacturing processes. By implementing dispatching control based on the operating conditions of equipment, the maximum allowable waiting time of work in process, waiting time, priority, number of wafers, and delivery time, it solves the technical problem of how to make full use of the production capacity of lithography equipment.

[0007] Chinese Patent Publication No. CN103101704B proposes an automatic dispatching method, which only proposes the transportation of a single device product display panel. By controlling the source storage unit, destination storage, and the inlets and outlets of the machine tool, it solves the technical problems of many existing repeated handling times and low efficiency.

[0008] Chinese published patent CN103413771B proposes a dispatching method for a wafer acceptance testing machine, which is a dispatching method for transporting the primary products and final products of the same wafer to the inspection machines in the Inline WAT area and the Final WAT area during the inspection process.

[0009] None of the above patents consider how to select the appropriate ingots for the process tasks of the wire cutting machines in this line from among many types of ingots. In particular, for the dispatching of the inventory where whole ingots and spliced ingots of different specifications are mixed and placed to the machines, under the condition of ensuring matching with the process tasks, how to automatically dispatch and optimize the dispatching selection to minimize the impact of the seam on the wire cutting machine, and avoid large fluctuations in the range of the cutting wire mesh adjustment during automatic dispatching due to the large difference in the length range of the ingot seams before and after, resulting in difficult and time-consuming wire mesh adjustment work, low equipment utilization efficiency, and unstable silicon wafer yield. Summary of the Invention

[0010] The present invention provides a wire cutting dispatching method, system, computer device, and storage medium, which solve the technical problems of low dispatching work efficiency and unstable processing quality in the prior art.

[0011] To solve the above technical problems, the technical solution adopted by the present invention is:

[0012] The wire cutting dispatching method includes the steps of:

[0013] First-level dispatching of dispatching the ingots from the curing positions of several curing stations in the source storage area to the empty buffer positions in the corresponding buffer stations in the buffer area;

[0014] Second-level dispatching of dispatching the ingots from several buffer positions in the buffer area to the corresponding machines in the wire cutting area;

[0015] The dispatching criteria for selecting the ingots in the first-level dispatching and the second-level dispatching are the same;

[0016] The dispatching criteria include:

[0017] A screening criterion based on screening the inventory information of the ingots in the source storage area;

[0018] A sorting criterion for sorting and dispatching the ingots screened according to certain conditions in the screening criterion.

[0019] Further, the screening criterion includes:

[0020] Based on the real-time inventory information of all the ingots in the source storage area under the online conditions, screening according to the main characteristics of the ingots to obtain a primary list;

[0021] Screen the ingots from the primary list according to the ingot configuration characteristics to obtain a first-level list;

[0022] Among them, the main characteristics of the ingots include N / P type classification, diameter size, oxygen content range, and resistivity range;

[0023] The ingot configuration characteristics include whole ingot configuration and spliced configuration.

[0024] Furthermore, the sorting criteria include obtaining a second-level list by sorting according to the ingot length, obtaining a third-level list by sorting according to the production plan, and obtaining a fourth-level list by sorting according to the process time. Among them, the ingots with whole ingot configuration are preferentially selected in the second-level list and / or the third-level list and / or the fourth-level list.

[0025] Furthermore, the sorting according to the ingot length in the sorting criteria includes:

[0026] Sort the absolute value of the difference between the ingot length of the ingot being processed or most recently processed by the machine and the ingot length of the ingots in the first-level list in ascending order to obtain the second-level list;

[0027] Among them, for the ingots with whole ingot configuration, the ingot length is the length of its own ingot;

[0028] For the ingots with spliced configuration, the ingot length is the length of its longest segment;

[0029] Preferably, the sorting according to the production plan in the sorting criteria includes:

[0030] Based on the shipment date of the wafers, customer type, and the inventory quantity of the corresponding ingots in the source storage area, sort the second-level list in the order of the urgency of the shipment date and / or the importance of the customer and / or the quantity of the ingots in the source storage area from less to more to obtain the third-level list;

[0031] Preferably, the sorting according to the process time in the sorting criteria includes:

[0032] Based on the standard curing time of the ingots, select the ingots with actual curing time greater than the standard curing time from the third-level list, and arrange them in descending order of the actual curing time to obtain the fourth-level list.

[0033] Furthermore, the first-level dispatching step includes:

[0034] Check the buffer area to see if there is a buffer table with an empty buffer station;

[0035] When the number of buffer tables with empty buffer stations ≥ 1,

[0036] Based on the idle time of the empty buffer stations of the buffer table, sort the remaining wire cutting time of the ingots being processed by the machine corresponding to the buffer table in ascending order, and dispatch the buffer tables corresponding to the machines with shorter remaining wire cutting time first;

[0037] When the number of empty buffer stations in the buffer table > 0,

[0038] Check and confirm that the robot for picking and placing the ingots, which is set between the source storage area and the buffer area, is in an online condition and in an idle state;

[0039] Confirm that the source storage area is in an online condition and in an idle state;

[0040] Execute the dispatching standard, and select the ingots required for the empty buffer stations of the buffer table from the curing stations in the source storage area;

[0041] Pre-inspect whether the selected ingots can be dispatched to the empty buffer stations in the buffer table, and confirm whether they are the ingots required by the machine corresponding to the buffer table;

[0042] If the ingots are inspected and found not to be dispatchable, record the reasons and re-select from other curing stations in the source storage area;

[0043] Preferably, the inspection of the empty buffer stations in the buffer table and the working state of the robot are both carried out by a parallel dual-inspection mode composed of a sensor-triggered recognition mode and a regular self-inspection mode.

[0044] Further, the secondary dispatching steps include:

[0045] Check all the machines in the wire cutting area, and select the machines in an operating or idle state in the online mode;

[0046] When the number of ingots being processed in the machine is 0,

[0047] Execute the dispatching standard, obtain the ingots required by the selected machine from the buffer table corresponding to the machine, and dispatch them to the selected machine;

[0048] Conduct an appearance inspection at the ingot inlet of the machine; if the appearance inspection of the ingot is unqualified, perform exception handling;

[0049] Execute wire cutting on the ingots in the selected machine;

[0050] Execute the inspection of the ingots and wafers during wire cutting and the wafers after wire cutting is completed.

[0051] Wire cutting dispatching system, including:

[0052] First-level dispatching unit: used to dispatch the ingots from the curing stations in several curing platforms in the source storage area to the empty buffer stations in the corresponding buffer platforms in the buffer area;

[0053] Second-level dispatching unit: used to dispatch the ingots from several buffer stations in the buffer area to the corresponding machines in the wire cutting area;

[0054] The dispatching criteria for selecting the ingots in the first-level dispatching unit and the second-level dispatching unit are the same;

[0055] The dispatching criteria include:

[0056] Screening criteria module based on screening the inventory information of the ingots in the source storage area;

[0057] Sorting criteria module for sorting and dispatching the ingots screened out according to the screening criteria under certain conditions.

[0058] Furthermore, the screening criteria module includes:

[0059] Based on the real-time inventory information of all the ingots under the online conditions in the source storage area, screening according to the main characteristics of the ingots to obtain a primary list;

[0060] Screening the ingots from the primary list according to the configuration characteristics of the ingots to obtain a first-level list;

[0061] Among them, the main characteristics of the ingots include N / P type classification, diameter size, oxygen content range, and resistivity range;

[0062] The configuration characteristics of the ingots include whole ingot configuration and splicing configuration.

[0063] Furthermore, the sorting criteria module includes obtaining a second-level list by sorting according to the ingot length, obtaining a third-level list by sorting according to the production plan, and obtaining a fourth-level list by sorting according to the process time. Among them, the ingots with whole ingot configuration are preferentially selected in the second-level list and / or the third-level list and / or the fourth-level list.

[0064] Furthermore, the sorting according to the ingot length in the sorting criteria module includes:

[0065] Sorting the absolute value of the difference between the ingot length of the ingot being processed or the most recently processed ingot by the machine and the ingot length of the ingots in the first-level list in ascending order to obtain the second-level list;

[0066] Among them, for the ingot with an integral bar configuration, the bar length of the ingot is its own bar length;

[0067] For the ingot with a spliced configuration, the bar length of the ingot is the bar length of its longest segment. For the ingot with an integral bar configuration;

[0068] Preferably, the sorting standard module sorts according to the production plan, including:

[0069] Based on the shipment date of the wafers, the customer type, and the inventory quantity of the corresponding ingots in the source storage area, sort the secondary list in the order of the urgency of the shipment date and / or the importance of the customer and / or the increasing order of the number of ingots in the source storage area to obtain the tertiary list;

[0070] Preferably, the sorting standard module sorts according to the process time, including:

[0071] Based on the standard curing time of the ingots, select the ingots from the tertiary list whose actual curing time is greater than the standard curing time, and arrange them in descending order of the actual curing time to obtain the quaternary list.

[0072] Furthermore, the first-level dispatching unit includes:

[0073] Check the buffer area to see if there is a buffer table with an empty buffer station;

[0074] When the number of buffer tables with empty buffer stations ≥ 1,

[0075] Based on the idle time of the empty buffer stations in the buffer table, sort the wire cutting remaining time of the ingots being processed by the machine corresponding to the buffer table in ascending order, and the buffer table corresponding to the machine with a shorter wire cutting remaining time is preferentially dispatched;

[0076] When the number of empty buffer stations in the buffer table > 0,

[0077] Check and determine that the manipulator for picking and placing the ingots, which is set between the source storage area and the buffer area, is in an online condition and in an idle state;

[0078] Determine that the source storage area is in an online condition and in an idle state;

[0079] Execute the dispatching standard, and select the ingots required for the empty buffer stations of the buffer table from the curing stations in the source storage area;

[0080] Pre-check whether the ingot in the buffer table can be dispatched to an empty buffer station in the buffer table, and determine whether it is the ingot required by the machine corresponding to the buffer table;

[0081] If the ingot is checked and cannot be dispatched, record the reason and re-select from other curing stations in the source storage area;

[0082] Preferably, the inspection of the empty buffer stations in the buffer table and the working status of the manipulator are both carried out by a parallel dual-inspection mode composed of a sensor-triggered recognition mode and a timed self-inspection mode.

[0083] Furthermore, the secondary dispatching unit includes:

[0084] Inspect all the machines in the wire cutting area and select the machines that are in the running or idle state in the online mode;

[0085] When the number of processed ingots in the machine is 0,

[0086] Execute the dispatching standard, obtain the ingot required by the selected machine from the buffer table corresponding to the machine, and dispatch it to the selected machine;

[0087] Conduct an appearance inspection at the infeed port of the machine; if the appearance inspection of the ingot is unqualified, execute exception handling;

[0088] Execute wire cutting on the ingot in the selected machine;

[0089] Execute the inspection of the ingot and wafer during wire cutting and the wafer after wire cutting is completed.

[0090] A computer device includes a memory and a processor; the memory stores a computer program; the processor is used to execute the computer program, and when executing the computer program, the processor executes the steps of the wire cutting dispatching method as described above.

[0091] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor executes the steps of the wire cutting dispatching method as described above.

[0092] Using the wire cutting dispatching method, system, computer device and storage medium designed by the present invention, the dispatching screening criteria are optimized, and several dispatching criteria with different conditions are set. This dispatching sorting criteria not only improves the dispatching efficiency, saves waiting time and improves production efficiency, but also can accurately select qualified wafers for corresponding machines and accurately feed materials according to the actual working state of the machines and the remaining time of the processed wafers. In particular, for the spliced wafers, according to the wafer attributes in the wafers being processed or the most recent processing records of the machines, the wafers closest to the length of the longest segment are preferentially selected for processing, which minimizes the time for stopping and adjusting the wire mesh, reduces the range of wire mesh movement, not only improves the cutting quality, but also reduces the technical problem of unstable yield caused by frequent large-scale adjustment of the wire mesh. Description of the Drawings

[0093] Figure 1 is a flowchart of the wire cutting dispatching method according to an embodiment of the present invention;

[0094] Figure 2 is a signal diagram of the wire cutting dispatching method according to an embodiment of the present invention;

[0095] Figure 3 is a flowchart of the wafer dispatching criteria according to an embodiment of the present invention;

[0096] Figure 4 is a flowchart of the primary dispatching selection according to an embodiment of the present invention;

[0097] Figure 5 is a flowchart of the secondary dispatching selection according to an embodiment of the present invention;

[0098] Figure 6 is a schematic structural diagram of the wire cutting dispatching system according to an embodiment of the present invention.

[0099] In the figure: Detailed Description of the Embodiment

[0100] The present invention will be described in detail below with reference to the drawings and specific embodiments.

[0101] This embodiment proposes a wire cutting dispatching method, such as Figure 1-2As shown in the figure, it mainly involves the primary dispatching of the cured ingots from the curing stations in several curing platforms in the source storage area to the empty buffer stations in the corresponding buffer platforms in the buffer area, and the secondary dispatching of the ingots from several buffer stations in the buffer area to the corresponding machines in the wire cutting area. Among them, the source storage area has several curing platforms, and each curing platform is provided with several curing stations for placing the ingots to be cured. These ingots are to be cured after bonding, and after being completely cured, they are successively dispatched to the buffer area and the wire cutting area; there are several wire cutting machines in the wire cutting area for cutting the ingots into wafers; the buffer area is placed between the source storage area and the wire cutting area, and is provided with several buffer platforms for buffering the ingots to be cut. Each buffer platform corresponds to a machine, and at least one buffer station is provided in each buffer platform. In this embodiment, only some of the equipment in the source storage area, buffer area and wire cutting area are exemplified. The source storage area includes curing platform 11, curing platform 12, curing platform 21, curing platform 22, curing platform 31 and curing platform 32, and several curing stations are provided in each curing platform; the buffer area includes buffer platform 1, buffer platform 2 and buffer platform 3, and several buffer stations are provided in each buffer platform; the wire cutting area is provided with machine 1, machine 2 and machine 3. According to the principle of the shortest moving transportation path, at least two curing platforms corresponding to one buffer platform and at least one buffer platform corresponding to one machine are preset in advance.

[0102] As Figure 2 shown in the figure, an upper terminal machine is respectively provided in the curing area, buffer area and wire cutting area, namely the curing terminal machine, buffer terminal machine and wire cutting terminal machine. The curing terminal machine is connected to each curing station in the curing area, the buffer terminal machine is connected to each buffer station in the buffer area, and the wire cutting terminal machine is connected to each wire cutting machine in the wire cutting area; and sensors for detecting whether there is an ingot are provided in each curing station, buffer station and machine, including the empty signal of no ingot and the idle signal of having an ingot. After the sensor obtains the signal of no ingot existence, it means that the dispatching signal needs to be started, and the alarm signal is transmitted to the equipment control system EAP through the corresponding upper terminal machine respectively. After the production execution management system MES obtains the alarm signal about the dispatched ingot from the EAP, it immediately notifies the dispatching system AMA to perform primary dispatching on the corresponding curing area or buffer area, and perform secondary dispatching on the corresponding buffer area or wire cutting area. This is the process of the sensor trigger recognition mode; and the dispatching criteria for selecting ingots in the primary dispatching and secondary dispatching are the same.

[0103] In addition, a Watchdog program is also provided in the AMA as a timing self-check mode, which respectively scans the curing area, buffer area and wire cutting area within a limited time, and performs an independent scan every few minutes to check whether the curing stations, buffer stations and machines are empty or idle, so as to determine whether the AMA needs to trigger dispatching. This timing self-check mode works in parallel with the sensor trigger recognition mode.

[0104] In this embodiment, a parallel double-check mode is adopted to identify the curing stations in the curing area, the buffer stations in the buffer area, and the machines in the wire cutting area to determine whether they are empty or idle. In case of deviation or error in the inspection mode identified by the sensor, a self-check mode at regular intervals can be adopted for inspection to ensure the accuracy of work assignment and improve the precision rate of work assignment.

[0105] As Figure 3 shown, the work assignment criteria include a screening criterion and a sorting criterion. Among them, the screening criterion is based on screening the inventory information of all the wafers in the source storage area; the sorting criterion is based on sorting and assigning work to all the wafer information screened out by the screening criterion according to certain conditions.

[0106] Specifically, the screening criterion includes:

[0107] Based on the real-time inventory information of all the wafers under online conditions in the source storage area, screening is carried out according to the main characteristics of the wafers to obtain a primary list. Among them, in the actual production process, each batch of produced silicon wafers needs to have certain technical parameters, that is, the technical parameters of this wafer. The main characteristics of the wafer are these main technical parameters, including N / P type classification, diameter size, oxygen content range, and resistivity range, etc.

[0108] On the basis of the primary list, the wafer information that meets the requirements is further screened out according to the configuration characteristics of the wafers to obtain a first-level list. Among them, the wafer configuration characteristics mainly include the whole-wafer configuration characteristics and the splicing configuration characteristics. In actual production, there are wafers with standard lengths, that is, wafers with a whole-wafer configuration; the remaining wafers with non-standard lengths need to be spliced to form a spliced rod with a standard length, that is, wafers with a splicing configuration. For wafers with a splicing configuration, at least two non-standard wafers are spliced together, and it also includes wafers spliced by three or more non-standard wafers. For each wafer with a splicing configuration, it includes a spliced rod with the longest long segment. In the first-level list, wafers with a whole-wafer configuration are preferentially selected; after the wafers with a whole-wafer configuration are processed, wafers with a splicing configuration are selected. Among the wafers with a splicing configuration, wafers with fewer splicing numbers are preferentially selected. This setting ensures that non-spliced wafers are preferentially selected, followed by spliced wafers, quickly and efficiently screening wafers without considering adjusting the wire mesh for wire cutting, and ensuring the stability of the wafer quality and the yield rate.

[0109] Further, the sorting criteria successively include: a secondary list obtained by sorting according to the bar length, a tertiary list obtained by sorting according to the production plan, and a quaternary list obtained by sorting according to the process time. Among them, the wafers with a whole-bar configuration are preferentially selected in the secondary list and / or the tertiary list and / or the quaternary list, and then the wafers with a splicing configuration are selected. The purpose is to preferentially ensure the stability and integrity of the quality of the silicon wafers after wire cutting of the wafers with a whole-bar configuration, without adjusting the wire mesh, and improve the wire cutting effect and wire cutting efficiency.

[0110] The sorting according to the bar length in the sorting criteria includes:

[0111] The absolute value of the difference between the bar length of the wafer being processed by the machine or the wafer processed most recently and the bar length of the wafer in the primary list is sorted in ascending order to obtain the secondary list; among them, for the wafer with a whole-bar configuration, the bar length is its own bar length; for the wafer with a splicing configuration, the bar length is the bar length of its longest segment for the wafer with a whole-bar configuration.

[0112] Specifically, for the wafer with a whole-bar configuration:

[0113] Taking the bar length of the wafer being processed by the machine or the wafer processed most recently as the reference length, the absolute value obtained by subtracting the length of the wafer with a whole-bar configuration in the primary list from the reference length is used to preferentially dispatch the wafers with a smaller absolute value; the information of the wafers with a whole-bar configuration sorted in ascending order of the absolute value forms the secondary list. Taking the bar length of the wafer being processed in the machine as the reference value, if there is no wafer being processed in the machine, then the bar length of the wafer processed last in the historical record is used as the reference value. Select all the wafers with a whole-bar configuration from the primary list, and compare the lengths of the selected wafers with the reference value. The wafers closer to the reference value, that is, the wafers with a smaller absolute value of the difference between the bar length of the selected wafer and the reference value, are preferentially dispatched; this not only avoids the problem that there are redundant wafers not being cut due to the inappropriate wire mesh of the diamond wire, but also prevents the waste of diamond wire due to the too short length of the wafer.

[0114] For the wafer with a splicing configuration:

[0115] Taking the rod length of the longest segment in the ingot of the splicing configuration being processed by the machine or the most recent processed one as the reference length, the absolute value obtained by subtracting the rod length of the longest segment in the ingot of the splicing configuration in the first-level list from the reference length, and giving priority to dispatching the ingot with a smaller absolute value; the information of the ingots of the splicing configuration obtained by sorting in ascending order of the absolute value forms a second-level list. Taking the rod length of the longer segment in the ingot of the splicing configuration being processed by the machine as the reference value, if there is no ingot of the splicing configuration being processed by the machine, then taking the rod length of the longer segment in the ingot of the splicing configuration of the last processed one in the historical record as the reference value, selecting all the ingots of the splicing configuration from the first-level list, and comparing the rod length of the longer segment of the selected ingots with the reference value, the ingot of the splicing configuration with a rod length of the longer segment closer to the reference value, that is, the ingot of the splicing configuration with a smaller absolute value of the difference between the rod length of the longer segment and the reference value is given priority for dispatching.

[0116] Further, the sorting according to the production plan in the sorting criteria includes: based on the shipping date of the wafers, the customer type, and the inventory quantity of the corresponding ingots in the source storage area, sorting from the second-level list in ascending order of the urgency of the shipping date and / or the importance of the customer and / or the quantity of the ingots in the source storage area to obtain a third-level list. These priority conditions can be preset in the AMA in advance. Of course, in this sorting process, it can also include the sorting of other planning conditions, such as the classification conditions of important raw and auxiliary materials or the classification conditions in the crystal pulling process. This sorting mainly involves dispatching according to the priority degree of the production plan. For the content of such priority sorting, different color marking methods can be preset in the AMA in advance for distinction.

[0117] Further, the sorting according to the process time in the sorting criteria includes: based on the standard curing time of the ingots, selecting the ingots with an actual curing time longer than the standard curing time from the third-level list, and arranging them in descending order of the actual curing time to obtain a fourth-level list. The purpose is to ensure that all the ingots to be dispatched must meet the standard curing time requirements, and the ingots cured first are dispatched first, that is, the ingots with a longer total curing time, which means a longer placement time after curing, are dispatched first. This time, by restricting the curing time length, the bonding strength is ensured to meet the wire cutting standard and the risk of rod dropping or wafer dropping during the wire cutting process is prevented.

[0118] Combined Figure 1 、 Figure 4 and Figure 5 , the wire cutting dispatching method is described in detail,

[0119] The first-level dispatching steps include:

[0120] All online workstations in all buffer stations in the buffer area are inspected using a parallel dual-inspection mode consisting of a sensor-triggered recognition mode and a timed self-inspection mode to identify which buffer stations in the buffer area have empty buffer workstations, and the information of these empty buffer workstations is provided to the AMA to facilitate the accurate triggering of the first-level dispatching instruction.

[0121] Inspect the buffer area to see if there are buffer stations with empty buffer workstations; when the number of buffer stations with empty buffer workstations ≥ 1, based on the idle time of the empty buffer workstations in the buffer station, sort the buffer stations corresponding to the machines processing the ingots in ascending order according to the remaining wire-cutting time of the ingots. The buffer station corresponding to the machine with the shorter remaining wire-cutting time is given priority for dispatching. That is, when the number of buffer stations with empty buffer workstations is one or more, sort the buffer stations with empty buffer workstations according to the size order of the remaining wire-cutting time of the ingots being processed in the machines corresponding to the buffer stations, and arrange them in ascending order of the remaining wire-cutting time. That is, the buffer station corresponding to the machine that is about to finish wire cutting is given priority for ingot dispatching to ensure that the machine that finishes wire cutting first receives the dispatched ingot, ensuring that the machine does not run idle and improving the utilization rate of the machine.

[0122] When the number of empty buffer workstations in any buffer station > 0, that is, in the sensor-triggered recognition mode, the alarm signal is transmitted to the EAP through the buffer terminal. MES recognizes the alarm signal from the empty buffer workstations of this buffer station in the EAP and automatically transmits it to the AMA for confirmation by the AMA. At the same time, the timed self-inspection mode in the AMA is also enabled. When it is detected that there are empty buffer workstations in this buffer station, regardless of the number of buffer workstations in each buffer station, as long as one or more empty buffer workstations are detected, they can be recognized by the parallel dual-inspection mode, thus triggering dispatching (Start).

[0123] To ensure that the ingots can be safely and quickly dispatched, it is necessary to determine that the curing workstations in the corresponding curing stations connected to the buffer station are under online conditions and there are ingots placed, and that the curing workstations are in an idle state without dispatching, that is, the ingots can be taken away by the manipulator at any time. Each buffer station can select the ingots to be dispatched from several curing stations. As long as there are ingots meeting the composite dispatching criteria in the curing workstations of the corresponding curing stations, and the curing workstations are under online conditions and in an idle state without dispatching, dispatching can be carried out to the buffer workstations.

[0124] Meanwhile, check and confirm that the robot arm, which is set between the source storage area and the buffer area and is used to pick and place the wafers on the curing stations of the curing table, is in the online condition (Online) and in the idle state (Idle). After the working state changes to the automatic (Auto) handling mode, immediately operate the wafers on the curing stations and dispatch them to the empty buffer stations in the buffer table. Among them, the status of the robot arm is also identified through a parallel dual-check mode composed of a sensor-triggered recognition mode and a timed self-check mode. If the curing station is in a non-idle state of dispatching or handling, or the robot arm is in a non-idle state of handling, the wafers in the source storage area cannot be dispatched and can only wait for discharging.

[0125] Meanwhile, execute the dispatching standard for the curing tables in the source storage area, the buffer tables in the buffer area, and the machine tools corresponding to the buffer tables, and select the wafers required for the empty buffer stations of the buffer tables from the curing stations in the source storage area.

[0126] MES obtains the wafer information in the source storage area that meets the requirements in the four-level list through the dispatching standard, and should not include the wafer information that has been dispatched to the entrance of the machine tool, the wafer information without a specified machine tool, and the non-dispatchable wafer information. When it is checked that the number of wafers Count > 0 stored on the curing stations in the corresponding curing table, AMA starts the dispatching program and notifies the robot arm to select the wafers; otherwise, wait for the next dispatching and material picking.

[0127] Before discharging the wafers from the curing tables in the source storage area, it is also necessary to perform a pre-inspection on the selected wafers from the curing tables through the MES interface to determine whether the wafers can be dispatched to the empty buffer stations in the buffer table, and verify whether the wafers are the wafers required by the machine tool corresponding to the buffer table. If the judgment result is that the wafers are dispatchable, continue to move along the wafer conveyor line to the empty buffer stations of the buffer table in the buffer area.

[0128] If the wafers are inspected as non-dispatchable, the reasons for the non-dispatchable wafers will be recorded in the system, and the number of wafers stored on the curing stations in the corresponding curing table will be updated; and then select wafers from other curing stations in the curing table in the source storage area again and continue the pre-inspection.

[0129] Furthermore, the secondary dispatching steps include:

[0130] When the number of processed wafers in the machine tool is 0,

[0131] Select a machine tool and execute the dispatching standard. Obtain the ingots required by the machine tool from the buffer table corresponding to the selected machine tool, and dispatch them to the machine tool. During this process, a parallel dual-check mode is used to identify and check the buffer table corresponding to the machine tool. If the buffer station (HOB) in the buffer table corresponding to the machine tool is in an idle state (Idle) that is not being dispatched in the online mode, that is, the ingot on this buffer station can be taken away by the handling tool between the buffer table and the machine tool at any time; and the handling tool is in the automatic (Auto) handling mode and is in the ready-to-load state (Ready ToLoad).

[0132] When the number of processed ingots in the machine tool is not 0, wait for the material to be discharged.

[0133] At the same time, check all the machine tools in the wire cutting area, and select the machine tools in the online mode (Online) that are in the running (Run) or idle (Idle) state and form a list. The status of all the machine tools in the wire cutting area is checked using a parallel dual-check mode composed of a sensor-triggered identification mode and a timed self-check mode to identify which machine tools in the wire cutting area are in the running (Run) or idle (Idle) state in the online mode and are in the automatic (Auto) dispatching mode, and provide the information of these machine tools to the AMA, thereby triggering dispatching (Start), that is, triggering the secondary dispatching instruction.

[0134] When the number of buffer tables with empty buffer stations ≥ 1, according to the idle (OHB Idle) time of the empty buffer stations in the buffer table, sort the wire cutting remaining time of the ingots being processed by the machine tool corresponding to the buffer table in ascending order, so that the buffer table corresponding to the machine tool with a shorter wire cutting remaining time is preferentially dispatched.

[0135] Select a machine tool. The MES interface obtains the ingot information that can be dispatched in the first-level list from the buffer area; after receiving the first-level list, the AMA sorts the ingots according to the sorting standard to obtain a fourth-level list, and selects an ingot from the buffer stations in the buffer area; the MES interface then adds the selected ingot information to the task buffer program (Queue); if the addition is successful, execute dispatching. If the addition of the ingot information fails, the MES interface will record the reason for the unsuccessful addition of dispatching in the system; the AMA will continue to sort the ingots and select an ingot again to add to the task buffer program to check whether the addition is successful.

[0136] If the selected ingot is successfully added to the cache program within 5 attempts, the AMA will continue to sort the ingots and select another ingot to add to the task cache program (Queue), and then continue to determine whether the addition is successful. If the selected ingot fails to be successfully added to the cache task program for more than 5 consecutive times, it means that the selected ingot does not meet the dispatching requirements. In this case, a machine will be reselected and the ingots will be rematched and dispatched for this machine until the addition is successful.

[0137] If the number of machines that do not meet the dispatching requirements > 0, then continue to select machines, re - sort, select ingots and add them to the task cache program for dispatching. Otherwise, end the process and wait for the next dispatching.

[0138] Of course, if it is detected that a certain machine is in the running (Run) or idle (Idle) state in the online mode (Online), and all the buffer stations corresponding to it are also empty (Empty), and it is checked whether the curing stations and the transfer manipulator in the corresponding curing station are in the idle (Idle) state in the online mode (Online), then the empty buffer stations in the buffer station and this machine will be synchronously started for primary dispatching and secondary dispatching. That is, the ingots selected from the curing stations according to the dispatching criteria are transmitted to the empty buffer stations in the buffer station by the manipulator, and then immediately transported from this buffer station to this machine.

[0139] Before dispatching the ingot to the corresponding machine, it also includes performing an appearance inspection at the inlet of this machine. This inspection can be manual inspection or machine - scanned appearance inspection, mainly to check whether there are cracks, notches or scratches on its appearance to prevent the occurrence of batch unqualified products. If the appearance inspection of the dispatched ingot is unqualified, abnormal handling will be executed.

[0140] The selected and dispatched ingot continues to enter the machine and perform wire cutting processing on it; after starting the cutting, start the reporting process; during the wire cutting process, check the cut ingot and the obtained wafers, mainly to check whether there are problems such as ingot dropping or wafer dropping. If such problems occur, execute abnormal handling. After the cutting is completed, start the reporting process; after the wire cutting is completed, also check the appearance of the obtained finished wafers; if an abnormality occurs, execute abnormal handling.

[0141] The finished wafers are discharged, and the machine is in the idle (Idle) state in the online mode, waiting for the next batch of ingots to be dispatched from the source storage area.

[0142] The wire cutting dispatching system, as Figure 6 shown, includes:

[0143] The first-level dispatching unit: used to dispatch the ingots from the curing positions of several curing stations in the source storage area to the empty buffer positions in the corresponding buffer stations in the buffer area;

[0144] The second-level dispatching unit: used to dispatch the ingots from several buffer positions in the buffer area to the corresponding machines in the wire cutting area;

[0145] The dispatching criteria for selecting ingots in the first-level dispatching unit and the second-level dispatching unit are the same.

[0146] Furthermore, the dispatching criteria include a screening criteria module and a sorting criteria module; the screening criteria module screens based on the inventory information of the ingots in the source storage area; the sorting criteria module sorts and dispatches the ingots screened by the screening criteria according to certain conditions.

[0147] Furthermore, the screening criteria module includes: based on the real-time inventory information of all the ingots under the online conditions in the source storage area, screening according to the main characteristics of the ingots to obtain a primary list; screening the ingots from the primary list according to the configuration characteristics of the ingots to obtain a first-level list; among them, the main characteristics of the ingots include N / P type classification, diameter size, oxygen content range, and resistivity range; the configuration characteristics of the ingots include whole ingot configuration and splicing configuration.

[0148] Furthermore, the sorting criteria module includes a second-level list obtained by sorting according to the ingot length, a third-level list obtained by sorting according to the production plan, and a fourth-level list obtained by sorting according to the process time. Among them, the ingots with whole ingot configuration are preferentially selected in the second-level list and / or the third-level list and / or the fourth-level list.

[0149] Furthermore, the sorting according to the ingot length in the sorting criteria module includes:

[0150] The absolute value of the difference between the ingot length of the ingot being processed or the most recently processed ingot on the machine and the ingot length of the ingots in the first-level list is sorted in ascending order to obtain a second-level list; among them, for the ingots with whole ingot configuration, the ingot length is the length of its own ingot; for the ingots with splicing configuration, the ingot length is the length of its longest segment for the ingots with whole ingot configuration.

[0151] Specifically, for the ingots with whole ingot configuration:

[0152] Taking the ingot length of the ingot being processed or the most recently processed ingot on the machine as the reference length, the absolute value obtained by subtracting the length of the ingots with whole ingot configuration in the first-level list from the reference length is used to preferentially dispatch the ingots with smaller absolute values; the information of the ingots with whole ingot configuration sorted in ascending order of the absolute value forms a second-level list;

[0153] For the ingots with splicing configuration:

[0154] Taking the rod length of the longest segment in the ingot being processed by the machine or the most recent processed ingot as the reference length, the absolute value obtained by subtracting the rod length of the longest segment in the ingots with splicing configurations in the first-level list from the reference length, and the ingots with smaller absolute values are preferentially dispatched; the information of the ingots with splicing configurations sorted in ascending order of the absolute values forms the second-level list.

[0155] Further, the sorting according to the production plan in the sorting standard module includes: based on the shipping date of the wafers, customer type, and the inventory quantity of the corresponding ingots in the source storage area, etc., sorting in the second-level list in the order of the urgency of the shipping date and / or the importance of the customer and / or the number of ingots in the source storage area from less to more to obtain the third-level list.

[0156] Further, the sorting according to the process time in the sorting standard module includes: based on the standard curing time of the ingots, selecting the ingots with actual curing time longer than the standard curing time from the third-level list, and arranging them in descending order of the actual curing time to obtain the fourth-level list.

[0157] Further, the first-level dispatching unit includes:

[0158] Check the buffer area to see if there is a buffer table with an empty buffer station;

[0159] When the number of buffer tables with empty buffer stations ≥ 1, based on the idle time of the empty buffer stations in the buffer table, sort the wire cutting remaining time of the ingots being processed by the machines corresponding to the buffer tables in ascending order, and the buffer tables corresponding to the machines with shorter wire cutting remaining time are preferentially dispatched;

[0160] When the number of empty buffer stations in the buffer table > 0,

[0161] Check and determine that the manipulator set between the source storage area and the buffer area for picking and placing ingots is in the online condition (Online) and in the idle (Idle) state;

[0162] Determine that the source storage area is in the online condition (Online) and in the idle (Idle) state;

[0163] Execute the dispatching standard, and select the ingots required for the empty buffer stations of the buffer table from the curing positions in the source storage area;

[0164] Pre-check whether the selected ingots can be dispatched to the empty buffer stations in the buffer table and determine whether they are the ingots required by the machines corresponding to the buffer table;

[0165] If the ingots are checked and cannot be dispatched, record the reasons and re-select from other curing positions in the source storage area.

[0166] Further, for the empty buffer stations in the buffer table, a parallel dual-check mode composed of a sensor-triggered recognition mode and a timed self-check mode is adopted; for the status of the manipulator, a parallel dual-check mode composed of a sensor-triggered recognition mode and a timed self-check mode is adopted.

[0167] Further, the secondary dispatching unit includes:

[0168] Check all the machines in the wire cutting area and select the machines in the running (Run) or idle (Idle) state in the online mode;

[0169] When the number of processed wafers in the machine is 0,

[0170] Execute the dispatching standard, obtain the wafers required by the selected machine from the buffer table corresponding to the machine, and dispatch them to the selected machine;

[0171] Conduct an appearance inspection at the infeed port of the machine; if the appearance inspection of the wafer is unqualified, perform exception handling;

[0172] Execute wire cutting on the wafers in the selected machine;

[0173] Execute inspections on the wafers during wire cutting, the wafers after wire cutting, and the wafers and chips during wire cutting.

[0174] A computer device includes a memory and a processor; the memory stores a computer program; the processor is configured to execute the computer program and, when executing the computer program, cause the processor to execute the steps of the wire cutting dispatching method described above.

[0175] A computer-readable storage medium stores a computer program, which, when executed by a processor, causes the processor to execute the steps of the wire cutting dispatching method described above.

[0176] By adopting the wire cutting dispatching method, system, computer device, and storage medium designed by the present invention, the dispatching screening criteria are optimized, and several dispatching criteria with different conditions are set. This dispatching sorting criterion not only improves the dispatching efficiency, saves waiting time, improves production efficiency, and reduces production costs; but also can accurately select qualified wafers and precisely feed them into the corresponding machines according to the actual working status of the machines and the remaining time of the processed wafers. In particular, for spliced wafers, according to the wafer attributes in the currently processed or the most recent processing record of the machine, the wafer with the length closest to the longest segment length is preferentially selected for processing, minimizing the time for stopping and adjusting the wire mesh, reducing the range of wire mesh movement, not only improving the cutting quality, but also reducing the technical problem of unstable yield caused by frequent large-scale adjustment of the wire mesh.

[0177] The above has described the embodiments of the present invention in detail. The above content is only the preferred embodiments of the present invention and cannot be considered as defining the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. Wire cutting dispatching method, characterized in that the steps Including: The first-level dispatching of dispatching the ingots from the curing positions of several curing platforms in the source storage area to the empty buffer positions of the corresponding buffer platforms in the buffer area; The second-level dispatching of dispatching the ingots from several buffer positions in the buffer area to the corresponding machines in the wire cutting area; The dispatching criteria for selecting the ingots in the first-level dispatching and the second-level dispatching are the same; The dispatching criteria include: The screening criteria based on screening the inventory information of the ingots in the source storage area; The sorting criteria for sorting and dispatching the ingots screened out by the screening criteria according to certain conditions; The first-level dispatching step includes: checking the buffer area to see if there is a buffer platform with an empty buffer position; When the number of empty buffer positions in the buffer platform > 0, checking and determining that the manipulator set between the source storage area and the buffer area for picking and placing the ingots is in the online condition and in the idle state; Executing the dispatching criteria, and selecting the ingots required for the empty buffer positions of the buffer platform from the curing positions in the source storage area; Pre-inspecting whether the selected ingots can be dispatched to the empty buffer positions in the buffer platform, and determining whether they are the ingots required by the machine corresponding to the buffer platform; If the ingots are checked and cannot be dispatched, recording the reasons and re-selecting from other curing positions in the source storage area; The second-level dispatching step includes: checking all the machines in the wire cutting area and selecting the machines in the running or idle state in the online mode; When the number of processed ingots in the machine is 0, executing the dispatching criteria, obtaining the ingots required by the selected machine from the corresponding buffer platform of the machine, and dispatching them to the selected machine.

2. The wire cutting dispatching method according to claim 1, characterized in that, The screening criteria include: Based on the real-time inventory information of all the ingots in the online condition in the source storage area, screening according to the main characteristics of the ingots to obtain a primary list; Screening the ingots from the primary list according to the configuration characteristics of the ingots to obtain a first-level list; Among them, the main characteristics of the ingots include N / P type classification, diameter size, oxygen content range, and resistivity range; The configuration characteristics of the ingots include whole ingot configuration and splicing configuration.

3. The wire cutting dispatching method according to claim 1 or 2, characterized in that, The sorting criteria include obtaining a second-level list by sorting according to the ingot length, obtaining a third-level list by sorting according to the production plan, and obtaining a fourth-level list by sorting according to the process time. Among them, the ingots with the whole ingot configuration are preferentially selected in the second-level list and / or the third-level list and / or the fourth-level list.

4. The wire cutting dispatching method according to claim 3, characterized in that, The sorting according to the ingot length in the sorting criteria includes: Sorting the absolute value of the difference between the ingot length of the ingot being processed or the most recently processed ingot by the machine and the ingot length of the ingots in the first-level list in ascending order to obtain the second-level list; Among them, for the ingots with the whole ingot configuration, the ingot length is the length of its own ingot; For the ingots with the splicing configuration, the ingot length is the length of its longest segment.

5. The wire cutting dispatching method according to claim 4, characterized in that, The sorting according to the production plan in the sorting criteria includes: Based on the wafer shipment date, customer type, and the inventory quantity of the corresponding ingots in the source storage area, sort the items in the secondary list in the order of the urgency of the shipment date and / or the importance of the customer and / or the increasing order of the quantity of the ingots in the source storage area to obtain the tertiary list.

6. The wire cutting dispatching method according to claim 4, characterized in that, The sorting criteria according to the process time include: Based on the standard curing time of the ingots, select the ingots from the tertiary list whose actual curing time is greater than the standard curing time, and arrange them in the order of the decreasing actual curing time to obtain the quaternary list.

7. The wire cutting dispatching method according to any one of claims 1-2, 4-6, characterized in that, The first-level dispatching steps include: Check the buffer area to see if there is a buffer table with an empty buffer station; When the number of buffer tables with empty buffer stations ≥ 1, Based on the idle time of the empty buffer stations in the buffer table, sort the buffer tables corresponding to the machines processing the ingots in ascending order according to the remaining wire-cutting time of the ingots. The buffer tables corresponding to the machines with shorter remaining wire-cutting time are given priority for dispatching; When the number of empty buffer stations in the buffer table > 0, Check and confirm that the manipulator set between the source storage area and the buffer area for picking and placing the ingots is in the online condition and in the idle state; Confirm that the source storage area is in the online condition and in the idle state; Execute the dispatching standard, and select the ingots required for the empty buffer stations of the buffer table from the curing stations in the source storage area; Pre-inspect whether the selected ingots can be dispatched to the empty buffer stations in the buffer table and determine whether they are the ingots required by the machine corresponding to the buffer table; If the ingots are found to be not dispatchable upon inspection, record the reasons and re-select from other curing stations in the source storage area.

8. The wire cutting dispatching method according to claim 7, wherein The inspection of the empty buffer stations in the buffer table and the working state of the manipulator are both carried out in a parallel dual-inspection mode composed of a sensor-triggered recognition mode and a timed self-inspection mode.

9. The wire cutting dispatching method according to any one of claims 1-2, 4-6, and 8, wherein The second-level dispatching steps include: Check all the machines in the wire-cutting area and select the machines that are in the running or idle state in the online mode; When the number of processed ingots in the machine is 0, Execute the dispatching standard, obtain the ingots required by the selected machine from the corresponding buffer table in the buffer area, and dispatch them to the selected machine; Conduct an appearance inspection at the infeed port of the machine; if the appearance inspection of the ingot is unqualified, perform exception handling; Execute the wire-cutting process on the ingots in the selected machine; Execute the inspection of the ingots, wafers during the wire-cutting process, and the wafers after the wire-cutting is completed.

10. A wire cutting dispatching system, wherein Include: The first-level dispatching unit: used to dispatch the ingots from the curing stations in several curing platforms in the source storage area to the empty buffer stations in the corresponding buffer tables in the buffer area; The second-level dispatching unit: used to dispatch the ingots from several buffer stations in the buffer area to the corresponding machines in the wire-cutting area; The dispatching standards for selecting the ingots in the first-level dispatching unit and the second-level dispatching unit are the same; The dispatching standards include: A screening criteria module for screening based on the inventory information of the ingots in the source storage area; A sorting criteria module for sorting and dispatching the ingots selected from the screening criteria according to certain conditions; The first-level dispatching step includes: checking the buffer area to see if there is a buffer table with an empty buffer station; When the number of empty buffer stations in the buffer table > 0, check and determine that the manipulator set between the source storage area and the buffer area for picking and placing the ingots is online and in an idle state; Execute the dispatching criteria, and select the ingots required for the empty buffer stations of the buffer table from the curing stations in the source storage area; Pre-inspect whether the selected ingots can be dispatched to the empty buffer stations in the buffer table, and determine whether they are the ingots required by the machine corresponding to the buffer table; If the ingots are found to be non-dispatchable, record the reasons and re-select from other curing stations in the source storage area; The second-level dispatching step includes: checking all the machines in the wire cutting area and selecting the machines that are in the running or idle state in the online mode; When the number of processed ingots in the machine is 0, execute the dispatching criteria, obtain the ingots required by the selected machine from the buffer table corresponding to the machine, and dispatch them to the selected machine.

11. The wire cutting dispatching system according to claim 10, wherein The screening criteria module includes: Based on the real-time inventory information of all the ingots under the online condition in the source storage area, screen according to the main characteristics of the ingots to obtain a primary list; Screen the ingots from the primary list according to the configuration characteristics of the ingots to obtain a first-level list; Among them, the main characteristics of the ingots include N / P type classification, diameter size, oxygen content range, and resistivity range; The configuration characteristics of the ingots include whole ingot configuration and splicing configuration.

12. The wire cutting dispatching system according to claim 10 or 11, characterized in that, The sorting criteria module includes obtaining a second-level list by sorting according to the ingot length, obtaining a third-level list by sorting according to the production plan, and obtaining a fourth-level list by sorting according to the process time. Among them, the ingots with whole ingot configuration are preferentially selected in the second-level list and / or the third-level list and / or the fourth-level list.

13. The wire cutting dispatching system according to claim 12, characterized in that, The sorting according to the ingot length in the sorting criteria module includes: Sorting the absolute value of the difference between the ingot length of the ingot being processed or the most recently processed by the machine and the ingot length of the ingots in the first-level list in ascending order to obtain the second-level list; Among them, for the ingots with whole ingot configuration, the ingot length is the length of its own ingot; For the ingots with splicing configuration, the ingot length is the length of the longest segment for the ingots with whole ingot configuration.

14. The wire cutting dispatching system according to claim 13, characterized in that, The sorting according to the production plan in the sorting criteria module includes: Based on the shipping date of the wafers, the customer type, and the inventory quantity of the corresponding ingots in the source storage area, sort the second-level list in the order of the urgency of the shipping date and / or the importance of the customer and / or the increasing order of the quantity of the ingots in the source storage area to obtain the third-level list.

15. The wire cutting dispatching system according to claim 13, characterized in that, The sorting according to the process time in the sorting criteria module includes: Based on the standard curing time of the ingot, select the ingots from the three - level list whose actual curing time is greater than the standard curing time, and arrange them in descending order of the actual curing time to obtain the four - level list.

16. The wire cutting dispatching system according to any one of claims 10-11, 13-15, characterized in that, The first - level dispatching unit includes: Check whether there is a buffer table in the buffer area that has an empty buffer station; When the number of buffer tables with empty buffer stations ≥ 1, Based on the vacant time of the empty buffer stations in the buffer table, sort the buffer tables corresponding to the machines processing the ingots in ascending order according to the remaining wire - cutting time of the ingots. The buffer table corresponding to the machine with a shorter remaining wire - cutting time is given priority for dispatching; When the number of empty buffer stations in the buffer table > 0, Check and determine that the manipulator set between the source storage area and the buffer area for picking and placing the ingots is in an online condition and in an idle state; Determine that the source storage area is in an online condition and in an idle state; Execute the dispatching standard, and select the ingots required for the empty buffer stations of the buffer table from the curing stations in the source storage area; Pre - check whether the ingots in the buffer table can be dispatched to the empty buffer stations in the buffer table, and determine whether they are the ingots required by the machine corresponding to the buffer table; If the ingots are found to be non - dispatchable after inspection, record the reasons and re - select from other curing stations in the source storage area.

17. The wire cutting dispatching system according to claim 16, characterized in that, The inspection of the empty buffer stations in the buffer table and the working state of the manipulator are both carried out in a parallel dual - inspection mode composed of a sensor - triggered recognition mode and a timed self - inspection mode.

18. The wire cutting dispatching system according to any one of claims 10-11, 13-15, 17, characterized in that, The second - level dispatching unit includes: Check all the machines in the wire - cutting area and select the machines that are in a running or idle state in the online mode; When the number of processed ingots in the machine is 0, Execute the dispatching standard, obtain the ingots required by the selected machine from the buffer table corresponding to the machine, and dispatch them to the selected machine; Conduct an appearance inspection at the in - feed port of the machine; if the appearance inspection of the ingot is unqualified, perform exception handling; Execute the wire - cutting process on the ingots in the selected machine; Execute the inspection of the ingots, wafers during the wire - cutting process, and the wafers after wire - cutting is completed.

19. A computer device, characterized in that, It includes a memory and a processor; the memory stores a computer program; the processor is used to execute the computer program, and when executing the computer program, the processor executes the steps of the wire - cutting dispatching method as described in any one of claims 1 - 9.

20. A computer-readable storage medium, characterized in that, Stores a computer program, which, when executed by a processor, causes the processor to execute the steps of the wire - cutting dispatching method as described in any one of claims 1 - 9.

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