A double-sided board manufacturing method with reduced etching factor

Abstract

The invention discloses a double-sided board manufacturing method with reduced etching factor, relates to the field of PCB circuit manufacturing, and comprises the following steps: S1, carrier film lamination, S2, exposure and development, S3, copper plating and film removal, S4, substrate film lamination, S5, silver paste hole plugging: firstly, laser drilling is performed on the film lamination substrate, and then silver paste is plugged into the laser hole, then the silver paste higher than the protective film is scraped off, and finally the silver paste is heated and pre-cured, S6, film tearing and pressing: a pressing machine heats and presses the copper-plated board and the substrate, and after cooling, the conductive carriers on the two copper-plated boards are removed to obtain a double-sided board; the double-sided board manufacturing method with reduced etching factor, through lamination, exposure and development on two conductive carriers, two layers of circuits are plated out respectively by electroplating, thereby avoiding the generation of etching factors of circuits in traditional processes, improving the deviation value between actual impedance and designed impedance, avoiding the step of etching the copper plate and the use of etching solution, and being more environmentally friendly.

Description

Technical Field

[0001] The invention relates to a PCB circuit manufacturing technology, and in particular to a double-sided board manufacturing method with reduced etching factor. Background Art

[0002] The current double-sided board manufacturing process mainly uses a double-sided copper foil substrate through drilling, electroplating, etching and other processes.

[0003] However, this process will produce an etching factor. The etching factor refers to the etching effect of the etching liquid not only downward but also in the left and right directions during the etching process. The ratio of the side etching width to the etching depth is called the etching factor. Side etching is inevitable. The existence of the etching factor affects the upper and lower line widths of the circuit, which can eventually lead to impedance deviations. If the circuits are relatively dense, there will be residual copper between the circuits that has not been etched away, which will eventually lead to a short circuit. Summary of the invention

[0004] The object of the present invention is to provide a double-sided board manufacturing method with reduced etching factor to solve the above-mentioned shortcomings in the prior art.

[0005] In order to achieve the above object, the present invention provides the following technical solution: a method for manufacturing a double-sided board with reduced etching factor, comprising the following steps:

[0006] S1, carrier film lamination: polish one side of two conductive carriers and hot press dry films to form carriers;

[0007] S2, exposure and development: using a film sheet with a circuit pattern to expose and develop one of the carriers to expose the hollow position on the carrier, and using another film sheet with a circuit pattern to expose and develop the other carrier to expose the hollow position on the other carrier;

[0008] S3, copper plating and film removal: firstly, two carriers are electroplated to copper-plate the hollowed-out positions on the carriers, and then the carriers are heated to remove the dry film from the conductive carrier, leaving the copper-plated circuits to form copper-plated plates;

[0009] S4, substrate film pasting: press protective film on both sides of the substrate;

[0010] S5, silver paste plugging: firstly, laser drill holes on the film substrate, then plug the silver paste into the laser holes, then scrape off the silver paste above the protective film, and finally heat and pre-cure the silver paste;

[0011] S6. Film tearing and lamination: first tear off the protective film on both sides of the substrate, then place two copper-plated plates on both sides of the substrate, heat and press the copper-plated plates and the substrate through a laminating machine, and after cooling, remove the conductive carriers on the two copper-plated plates to obtain a double-sided board.

[0012] Furthermore, the conductive carrier in S1 is a steel plate or an aluminum plate, the surface roughness Ra of one side of one conductive carrier is 40-50nm, the surface roughness Ra of the other side of the conductive carrier is 20-30nm, and the hot pressing dry film conditions of one side of the conductive carrier are: the dry film preheating temperature is 35-60℃, the pressing roller temperature is 80-100℃, and the pressure during lamination is 4.0-5.0kgf / cm 2 The standing time after bonding is 20 minutes.

[0013] Furthermore, the dry film removal conditions in S3 are: temperature of 40-50° C., and film removal peeling strength of 10-15 gf / mm.

[0014] Furthermore, the protective film in S4 is a PET film or a PI film with a thickness of 25-50 μm, and the substrate lamination conditions are: the lamination temperature is 20-25° C., and the lamination pressure is 0.1-0.2 kgf / cm 2 The standing time after bonding is 30 minutes.

[0015] Furthermore, the substrate in S5 is a semi-cured PP board, the diameter of the laser hole is 40-300μm, the silver paste temperature is 20-26°C when plugging the hole, the scraper for scraping the silver paste is a silicone scraper, the hardness of the silicone scraper is 50, the scraping speed of the silicone scraper is 200mm / s, the silver paste pre-curing temperature is 90°C, and the silver paste pre-curing time is 30min.

[0016] Furthermore, the protective film in S6 is torn off 3-5 minutes after the preheating of the silver paste is completed, and the peel strength of the protective film is 200-230gf / mm. When the copper-plated plate and the substrate are pressed by a pressing machine, the heating rates on both sides of the carrier are: 25-120℃ is 1.5-3℃ / min, 120-190℃ is 1.0-1.5℃ / min, the insulation temperature is 180-190℃, the insulation time is 70-80min, and the cooling rate is: 100-190℃ is 1.5-2℃ / min, 25-100℃ is 2-2.5℃ / min. The pressing machine includes a base, a driving mechanism, a buffer mechanism, a clamping mechanism, a rotating mechanism, a sliding mechanism and two heating plates.

[0017] Furthermore, a support frame is fixedly installed on the top of the base, the driving mechanism includes an electric telescopic rod, one end of the electric telescopic rod passes through the support frame and is fixedly connected to the inner wall of the support frame, the buffer mechanism includes a pressure rod and an air pressure valve, one end of the pressure rod is slidably connected to the inner wall of one end of the electric telescopic rod, one side of the air pressure valve is fixedly installed on one side of the electric telescopic rod and is connected to the inner cavity of the electric telescopic rod, a pressure sensor is fixedly installed on one side of the pressure rod, one side of the pressure sensor is fixedly connected to one side of one of the heating plates, and one side of the other heating plate is fixedly connected to one side of the base.

[0018] Furthermore, the clamping mechanism includes two chucks, and the two chucks are symmetrically arranged on the heating plate located on the base, one side of the chuck is slidably connected to the inner wall of the heating plate, and the inner wall of the chuck is threadedly connected with a fastening bolt, and the rotating mechanism includes two rotating rods, one end of the rotating rod is slidably connected to a rotating shaft, two ends of one of the rotating shafts are rotatably connected to one side of the electric telescopic rod, and two ends of the other rotating shaft are rotatably connected to the other side of the electric telescopic rod, one end of the rotating rod is rotatably connected to the inner wall of one side of the heating plate, and a clamping block is provided on one side of the rotating rod.

[0019] Furthermore, the sliding mechanism includes four sliding rods, one end of the four sliding rods are slidably connected to the inner wall of the same heating plate, one end of the sliding rod is slidably connected to the inner wall of the base, a spring 1 is sleeved on the surface of one end of the sliding rod, a sliding block is provided on one side of the sliding rod, a push rod is slidably connected to one side of the sliding block, the surface of the sliding block is slidably connected to the inner wall of the base, one end of the push rod passes through the base and the heating plate in sequence and is slidably connected to the base and the inner wall of the heating plate, and a spring 2 is sleeved on the surface of the push rod.

[0020] Compared with the prior art, the present invention provides a method for manufacturing a double-sided board with reduced etching factor, which has the following beneficial effects: 1. The method for manufacturing a double-sided board with reduced etching factor avoids the generation of etching factors of the circuits in traditional processes by directly electroplating the two layers of circuits on two conductive carriers after lamination, exposure, and development, thereby improving the deviation value between the actual impedance and the designed impedance, and the process is relatively simple, avoiding the step of etching the copper plate and the use of etching solutions, and is more environmentally friendly.

[0021] 2. The double-sided board manufacturing method with reduced etching factor is to plug the laser holes with silver paste, scrape off the silver paste above the protective film, and finally heat and pre-cure the silver paste. Then, the upper circuit, the semi-cured sheet plugged with silver paste, and the lower circuit are overlapped in this order. After that, a pressing machine is used to heat and pressurize the silver paste so that the silver paste is completely cured and combined with the upper and lower circuits, so that the connection holes can be completely blocked, avoiding the solder from penetrating the connection holes during the subsequent wave soldering of the PCB, which may cause short circuits or cold solder joints. At the same time, the method of plugging the holes with silver paste can have better electrical and thermal conductivity.

[0022] 3. The double-sided board manufacturing method with reduced etching factor moves upward through the electric telescopic rod, first driving the rotating rod to rotate, so that the two clamping blocks are close to each other, and are clamped to the two sides of the conductive carrier located above through the two clamping blocks, so that the conductive carrier located above is driven by the clamping blocks to move upward and separate from the substrate, and the electric telescopic rod continues to move upward, the heating plate moves to drive the four sliding rods to move upward, the sliding rod moves upward to drive the sliding block to move, thereby driving the push rod to move upward, the four push rods move upward to push the substrate to move upward, and the substrate is separated from the conductive carrier below, thereby avoiding damage to the conductive carrier and improving the utilization rate of the conductive carrier. At the same time, it is avoided that the substrate is damaged or deformed due to uneven force on the substrate when the conductive carrier is manually disassembled, thereby improving production efficiency and effectively improving the yield rate of double-sided board manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0024] Figure 1 A process flow chart for manufacturing a double-sided board of the present invention;

[0025] Figure 2 A schematic diagram of the changes in the carrier film lamination, exposure and development, and copper plating process of the double-sided board produced by the present invention;

[0026] Figure 3 A schematic diagram of the process changes of substrate film lamination and silver paste plugging in the double-sided board manufacturing of the present invention;

[0027] Figure 4 A schematic diagram showing changes in the lamination process of double-sided board manufacturing according to the present invention;

[0028] Figure 5 A three-dimensional diagram of the structure of a pressing machine provided in an embodiment of the present invention;

[0029] Figure 6 A cross-sectional view of a front view of a pressing machine structure provided by an embodiment of the present invention;

[0030] Figure 7 A partial cross-sectional view of a buffer mechanism and a rotating mechanism in a pressing machine provided by an embodiment of the present invention;

[0031] Figure 8 A partial cross-sectional view of a sliding mechanism in a pressing machine provided by an embodiment of the present invention;

[0032] Fig. 9 The embodiment of the present invention provides Figure 5 A magnified view of middle;

[0033] Fig.10 The embodiment of the present invention provides Figure 6 Enlarged view of B.

[0034] Description of reference numerals:

[0035] 1. Carrier; 11. Conductive carrier; 12. Dry film; 2. Copper-plated board; 3. Base plate; 31. Protective film; 32. Silver paste; 4. Double-sided board; 5. Base; 51. Driving mechanism; 511. Electric telescopic rod; 52. Buffer mechanism; 521. Pressure rod; 522. Air pressure valve; 523. Pressure sensor; 53. Clamping mechanism; 531. Chuck; 54. Rotating mechanism; 541. Rotating rod; 542. Block; 55. Sliding mechanism; 551. Sliding rod; 552. Push rod; 6. Heating plate. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0037] Embodiment 1:

[0038] See also Figure 1-4 A method for manufacturing a double-sided board with reduced etching factor comprises the following steps:

[0039] S1, carrier film lamination: polish one side of two conductive carriers 11 and hot press and laminate dry films 12 to form carrier board 1;

[0040] S2, exposure and development: using a film sheet with a circuit pattern to expose and develop one of the carriers 1 to expose a hollow position on the carrier 1, and using another film sheet with a circuit pattern to expose and develop another carrier 1 to expose a hollow position on the other carrier 1;

[0041] S3, copper plating and film removal: firstly, the two carriers 1 are electroplated to copper-plate the hollowed-out positions on the carriers 1, and then the carriers 1 are heated to remove the dry film 12 from the conductive carrier 11, leaving the copper-plated circuit to form the copper-plated plate 2;

[0042] S4, film pasting on substrate 3: pressing protective film 31 on both sides of substrate 3;

[0043] S5, plugging holes with silver paste 32: firstly, laser drilling is performed on the film-attached substrate 3, and then the silver paste 32 is plugged into the laser hole, then the silver paste 32 above the protective film 31 is scraped off, and finally the silver paste 32 is heated and pre-cured;

[0044] S6, film tearing and pressing: first tear off the protective film 31 on both sides of the substrate 3, then place two copper-plated plates 2 on both sides of the substrate 3, heat and press the copper-plated plates 2 and the substrate 3 through a pressing machine, and after cooling, remove the conductive carriers 11 on the two copper-plated plates 2 to obtain a double-sided board 4.

[0045] In the present invention, the conductive carrier 11 in S1 is a steel plate or an aluminum plate, the surface roughness Ra of one side of one conductive carrier 11 is 40-50nm, the surface roughness Ra of the other side of the conductive carrier 11 is 20-30nm, and the conditions for hot pressing the dry film 12 on one side of the conductive carrier 11 are: the preheating temperature of the dry film 12 is 35-60°C, the temperature of the pressing roller is 80-100°C, and the pressure during lamination is 4.0-5.0kgf / cm 2 The standing time after bonding is 20 minutes. The bonding force between the electroplated copper and the carrier is less than the bonding force between the copper and the substrate 3 after solidification. The copper and the conductive carrier 11 can be separated by external force. The different surface roughness of the two conductive carriers 11 can achieve the effect of separation one by one after the double-sided board 4 is pressed.

[0046] In the present invention, the removal conditions of the dry film 12 in S3 are: a temperature of 40-50° C. and a film removal peeling strength of 10-15 gf / mm. The lower peeling strength makes it easier to separate the dry film 12 from the conductive carrier 11, thereby improving work efficiency.

[0047] In the present invention, the protective film 31 in S4 is a PET film or a PI film with a thickness of 25-50 μm. The film lamination conditions of the substrate 3 are as follows: the lamination temperature is 20-25°C, the lamination pressure is 0.1-0.2 kgf / cm 2 The standing time after bonding is 30 minutes. The appropriate temperature and pressure ensure the bonding effect of the protective film 31 while preventing the semi-cured substrate 3 from being deformed by force.

[0048] In the present invention, the substrate in S5 is a semi-cured PP board, the diameter of the laser hole is 40-300μm, the silver paste temperature is 20-26°C when plugging the hole, the scraper for scraping the silver paste is a silicone scraper, the hardness of the silicone scraper is 50, and the scraping speed of the silicone scraper is 200mm / s, the silver paste pre-curing temperature is 90°C, and the silver paste pre-curing time is 30min.

[0049] In the present invention, the protective film 31 in S6 is torn off 3-5 minutes after the preheating of the silver paste 32 is completed, and the peel strength of the protective film 31 is 200-230gf / mm. When the copper-plated plate 2 and the substrate 3 are pressed by the pressing machine, the heating rate on both sides of the carrier 1 is: 25-120℃ is 1.5-3℃ / min, 120-190℃ is 1.0-1.5℃ / min, the insulation temperature is 180-190℃, the insulation time is 70-80min, and the cooling The rate is: 1.5-2℃ / min at 100-190℃, 2-2.5℃ / min at 25-100℃. The silver paste plugging method can have better electrical and thermal conductivity. The substrate 3 still retains a certain temperature within 3-5 minutes after the silver paste 32 is preheated. At this time, it is easier to tear off the protective film 31 and it is not easy to leave residue. Through the temperature control of the pressing process, the copper-plated circuit is better combined with the substrate 3, and the substrate 3 is fully flowed, so that the substrate 3 is flatter and less likely to deform after solidification.

[0050] Embodiment 2:

[0051] See also Figure 5-10 , this embodiment provides a technical solution based on the first embodiment: the pressing machine in S6 includes a base 5, a driving mechanism 51, a buffer mechanism 52, a clamping mechanism 53, a rotating mechanism 54, a sliding mechanism 55 and two heating plates 6, a support frame is fixedly installed on the top of the base 5, the driving mechanism 51 includes an electric telescopic rod 511, one end of the electric telescopic rod 511 passes through the support frame and is fixedly connected to the inner wall of the support frame, the buffer mechanism 52 includes a pressure rod 521 and a pneumatic valve 522, one end of the pressure rod 521 is slidably connected to the inner wall of one end of the electric telescopic rod 511, and one side of the pneumatic valve 522 is fixedly installed on one side of the electric telescopic rod 511 and is connected to the inner wall of the electric telescopic rod 511. The inner cavities of the electric telescopic rod 511 are connected, and the inner cavity between the electric telescopic rod 511 and the pressure rod 521 is inflated and deflated by adjusting the air pressure valve 522. A pressure sensor 523 is fixedly installed on one side of the pressure rod 521, and one side of the pressure sensor 523 is fixedly connected to one side of one of the heating plates 6, and one side of the other heating plate 6 is fixedly connected to one side of the base 5. The two heating plates 6 are controlled by the PLC programming program. By controlling the electric telescopic rod 511 to move downward and driving the pressure rod 521 to move, the upper heating plate 6 is driven to move downward, and the copper-plated plate 2 and the substrate 3 are pressed together through the pressing parameters set on the pressing machine.

[0052] In the present invention, the clamping mechanism 53 includes two clamps 531, and the two clamps 531 are symmetrically arranged on the heating plate 6 located on the base 5. One side of the clamp 531 is slidably connected to the inner wall of the heating plate 6, and the inner wall of the clamp 531 is threadedly connected with a fastening bolt. The rotating mechanism 54 includes two rotating rods 541, and one end of the rotating rod 541 is slidably connected to a rotating shaft, and the two ends of one rotating shaft are rotatably connected to one side of the electric telescopic rod 511, and the two ends of the other rotating shaft are rotatably connected to the other side of the electric telescopic rod 511. One end of the rotating rod 541 is rotatably connected to the inner wall of one side of the heating plate 6, and a clamping block 5 is provided on one side of the rotating rod 541. 42. When the upper heating plate 6 presses one side of the upper copper-plated plate 2, the electric telescopic rod 511 continues to move and compresses the air in its inner cavity. At the same time, the electric telescopic rod 511 moves downward to drive the two rotating rods 541 to rotate, so that the blocks 542 at one end of the two rotating rods 541 move away from each other. After the pressing is completed, the electric telescopic rod 511 moves upward, first driving the rotating rod 541 to rotate, so that the two blocks 542 approach each other, and are connected to the two sides of the conductive carrier 11 located above through the two blocks 542, so that the blocks 542 drive the conductive carrier 11 located above to move upward and separate from the substrate 3.

[0053] In the present invention, the sliding mechanism 55 includes four sliding rods 551, one end of the four sliding rods 55 is slidably connected to the inner wall of the same heating plate 6, one end of the sliding rod 551 is slidably connected to the inner wall of the base 5, a spring 1 is sleeved on the surface of one end of the sliding rod 551, a sliding block is provided on one side of the sliding rod 551, a top rod 552 is slidably connected to one side of the sliding block, the surface of the sliding block is slidably connected to the inner wall of the base, one end of the top rod 552 passes through the base 5 and the heating plate 6 in sequence and is slidably connected to the inner walls of the base 5 and the heating plate 6, a spring 2 is sleeved on the surface of the top rod 552, and continues to move upward through the electric telescopic rod 511, the heating plate 6 moves and drives the four sliding rods 551 to move upward, the sliding rod 551 moves upward and drives the sliding block to move, thereby driving the top rod 552 to move upward, the four top rods 552 move upward and push the substrate 3 to move upward, so as to separate the substrate 3 from the conductive carrier 11 below.

[0054] Working principle: When performing the pressing step in S6, the staff first places the copper-plated plate 2 containing the conductive carrier 11 with a relatively low surface roughness on the heating plate 6 located below and places the positioning holes of the carrier plate 1 on the corresponding top rod 552, moves the clamps 531 on both sides of the heating plate 6, and rotates the fastening bolts so that the clamps 531 fix the edges of the conductive carrier 11, and then places the substrate 3 of S5 on the copper-plated plate 2, and then places another copper-plated plate 2 on the substrate 3, and then starts the electric telescopic rod 511 to move downward, and drives the pressure rod 521 to move, thereby driving the upper heating plate 6 to move downward. When the upper heating plate 6 presses one side of the upper copper-plated plate 2, the electric telescopic rod 511 continues to move and compresses the air in its inner cavity. At the same time, the electric telescopic rod 511 moves downward to drive the two rotating rods 541 to rotate, so that the blocks 542 at one end of the two rotating rods 541 move away from each other, and the copper-plated plate 2 is pressed according to the pressing parameters set on the pressing machine. The copper plate 2 and the substrate 3 are pressed together. After the pressing is completed, the electric telescopic rod 511 moves upward, first driving the rotating rod 541 to rotate, so that the two clamping blocks 542 are close to each other, and are clamped to the two sides of the conductive carrier 11 located above through the two clamping blocks 542. The electric telescopic rod 511 continues to move upward, and the pressure in its inner cavity decreases, and drives the heating plate 6 to move upward through the pressure rod 521, thereby driving the conductive carrier 11 located above to move upward and separate from the substrate 3 through the clamping block 542. The electric telescopic rod 511 continues to move upward, and drives the four sliding rods 551 to move upward through the movement of the heating plate 6, and compresses the spring 1. The sliding rod 551 moves upward to drive the sliding block to move, thereby driving the top rod 552 to move upward, and compresses the spring 2. The four top rods 552 move upward to push the substrate 3 to move upward, so that the substrate 3 is separated from the conductive carrier 11 below, and the double-sided board 4 is obtained, that is, the production of the double-sided board 4 is completed.

[0055] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A method for manufacturing a double-sided board with reduced etching factor, characterized in that: The specific steps include: S1, carrier film lamination: polishing one side of two conductive carriers (11) and laminating dry films (12) by hot pressing to form a carrier board (1); S2, exposure and development: using a film sheet with a circuit pattern to expose and develop one of the carriers (1) to expose a hollow position on the carrier (1), and using another film sheet with a circuit pattern to expose and develop the other carrier (1) to expose a hollow position on the other carrier (1); S3, copper plating and film removal: firstly, the two carriers (1) are electroplated to copper-plate the hollowed-out positions on the carriers (1), and then the carriers (1) are heated to remove the dry film (12) from the conductive carrier (11), leaving the copper-plated circuit to form a copper-plated plate (2); S4, laminating the substrate (3): laminating the protective film (31) on both sides of the substrate (3); S5, plugging holes with silver paste (32): firstly, laser drilling is performed on the film-attached substrate (3), and then the silver paste (32) is plugged into the laser holes, then the silver paste (32) that is higher than the protective film (31) is scraped off, and finally, the silver paste (32) is heated and pre-cured; S6, film tearing and laminating: firstly, the protective film (31) on both sides of the substrate (3) is torn off, and then two copper-plated plates (2) are placed on both sides of the substrate (3), and the copper-plated plates (2) and the substrate (3) are heated and pressed by a laminating machine, and after cooling, the conductive carriers (11) on the two copper-plated plates (2) are removed to obtain a double-sided board (4); The protective film (31) in S6 is torn off 3-5 minutes after the preheating of the silver paste (32) is completed, and the peel strength of the protective film (31) is 200-230 gf / mm. When the copper-plated plate (2) and the substrate (3) are pressed together by a pressing machine, the heating rates of both sides of the carrier plate (1) are: 1.5-3°C / min at 25-120°C, 1.0-1.5°C / min at 120-190°C, the holding temperature is 180-190°C, the holding time is 70-80 minutes, and the cooling rate is: 1.5-2°C / min at 100-190°C, 2-2.5°C / min at 25-100°C. The pressing machine comprises a base (5), a driving mechanism (51), a buffer mechanism (52), a clamping mechanism (53), a rotating mechanism (54), a sliding mechanism (55) and two heating plates (6); A support frame is fixedly mounted on the top of the base (5); the driving mechanism (51) comprises an electric telescopic rod (511); one end of the electric telescopic rod (511) passes through the support frame and is fixedly connected to the inner wall of the support frame; the buffer mechanism (52) comprises a pressure rod (521) and an air pressure valve (522); one end of the pressure rod (521) is slidably connected to the inner wall of one end of the electric telescopic rod (511); one side of the air pressure valve (522) is fixedly mounted on one side of the electric telescopic rod (511) and is connected to the inner cavity of the electric telescopic rod (511); a pressure sensor (523) is fixedly mounted on one side of the pressure rod (521); one side of the pressure sensor (523) is fixedly connected to one side of one of the heating plates (6); and one side of the other heating plate (6) is fixedly connected to one side of the base (5); The clamping mechanism (53) comprises two clamps (531), the two clamps (531) are symmetrically arranged on the heating plate (6) located on the base (5), one side of the clamps (531) is slidably connected to the inner wall of the heating plate (6), and the inner wall of the clamps (531) is threadedly connected with a fastening bolt, and the rotating mechanism (54) comprises two rotating rods (541), one end of the rotating rods (541) is slidably connected to a rotating shaft, two ends of one of the rotating shafts are rotatably connected to one side of the electric telescopic rod (511), and two ends of the other rotating shaft are rotatably connected to the other side of the electric telescopic rod (511), one end of the rotating rod (541) is rotatably connected to the inner wall of one side of the heating plate (6), and one side of the rotating rod (541) is provided with a clamping block (542); The sliding mechanism (55) comprises four sliding rods (551), one end of the four sliding rods (551) is slidably connected to the inner wall of the same heating plate (6), one end of the sliding rod (551) is slidably connected to the inner wall of the base (5), a spring 1 is sleeved on the surface of one end of the sliding rod (551), a sliding block is provided on one side of the sliding rod (551), a push rod (552) is slidably connected to one side of the sliding block, the surface of the sliding block is slidably connected to the inner wall of the base, one end of the push rod (552) passes through the base (5) and the heating plate (6) in sequence and is slidably connected to the inner walls of the base (5) and the heating plate (6), and a spring 2 is sleeved on the surface of the push rod (552).

2. A double-sided board manufacturing method with reduced etching factor according to claim 1, characterized in that: The conductive carrier (11) in S1 is a steel plate or an aluminum plate, one side of one conductive carrier (11) has a surface roughness Ra of 40-50 nm, and the other side of the conductive carrier (11) has a surface roughness Ra of 20-30 nm. The conditions for hot pressing the dry film (12) on one side of the conductive carrier (11) are as follows: the preheating temperature of the dry film (12) is 35-60° C., the temperature of the pressing roller is 80-100° C., and the pressure during lamination is 4.0-5.0 kgf / cm 2 The standing time after bonding is 20 minutes.

3. A double-sided board manufacturing method with reduced etching factor according to claim 1, characterized in that: The removal conditions of the dry film (12) in S3 are: a temperature of 40-50° C. and a film removal peeling strength of 10-15 gf / mm.

4. A method for manufacturing a double-sided board with reduced etching factor according to claim 1, characterized in that: The protective film (31) in S4 is a PET film or a PI film with a thickness of 25-50 μm. The film lamination conditions of the substrate (3) are as follows: the lamination temperature is 20-25° C., and the lamination pressure is 0.1-0.2 kgf / cm 2 The standing time after bonding is 30 minutes.

5. A method for manufacturing a double-sided board with reduced etching factor according to claim 1, characterized in that: The substrate (3) in S5 is a semi-cured PP board, the diameter of the laser hole is 40-300 μm, the temperature of the silver paste (32) is 20-26° C. when plugging the hole, the scraper for scraping the silver paste (32) is a silicone scraper, the hardness of the silicone scraper is 50, and the scraping speed of the silicone scraper is 200 mm / s, the pre-curing temperature of the silver paste (32) is 90° C., and the pre-curing time of the silver paste (32) is 30 min.

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