Fringe field parallel plate actuator

Abstract

A phase light modulator includes a substrate (110), a mirror (102), a perforated hinge plate (106), and first and second support posts (104). The perforated hinge plate (106) supports the mirror (102). The perforated hinge plate (106) has first and second curved arms (107). The perforated hinge plate (106) is configured to move toward or away from the substrate (110) based on application of a potential difference between the substrate (110) and the perforated hinge plate (106). The first curved arm (107) is connected to the first support post (104), and the second curved arm (107) is connected to the second support post (104).

Description

Technical Field Background Technology

[0002] Actuators (e.g., electrostatic and non-electrostatic) are used in a variety of technologies. For example, actuators can be used in phase light modulators (PLMs) to modulate the phase of light. A phase light modulator can be implemented as a microelectromechanical system (MEMS) including an array of mirrors. An incident light beam is reflected from the mirrors. The MEMS mirrors can be moved vertically independently to change the phase of the incident light beam. Each mirror can represent a pixel. Each pixel in such a MEMS actuator system includes a base electrode and a spring electrode coupled to the mirror. When a voltage difference is generated between the base electrode and the spring electrode, the spring electrode moves toward the base electrode, thereby moving the mirror to different positions. Such MEMS phase light modulators are used in a variety of applications, such as high dynamic range cinemas, light detection and ranging systems, high-capacity optical switches (e.g., for telecommunications or server farms), microscopy / spectroscopy / adaptive optics (e.g., for astronomy, ophthalmology, machine vision, etc.), and holographic displays. Summary of the Invention

[0003] In at least one example, the phase light modulator includes a substrate, a mirror, a perforated hinge plate, and first and second support posts. The perforated hinge plate supports the mirror. The perforated hinge plate has a first bent arm and a second bent arm. The perforated hinge plate is configured to move toward or away from the substrate based on the application of a potential difference between the substrate and the perforated hinge plate. The first bent arm is connected to the first support post, and the second bent arm is connected to the second support post. Attached Figure Description

[0004] Figure 1A and Figure 1B The diagram illustrates two different vertical positions of the internal mirror of the phase light modulator.

[0005] Figure 2 It shows Figure 1A and Figure 1B A three-dimensional view of a phase light modulator, in which the hinge plate is perforated according to a configuration.

[0006] Figure 3 It shows Figure 2 Top view of the hinge plate.

[0007] Figure 4 The diagram illustrates the edge field generated by a perforated hinge plate.

[0008] Figure 5A and Figure 5B The illustration shows how a perforated hinged plate, but with a solid substrate, results in a partial edge field.

[0009] Figure 6 The illustration shows another configuration of the perforated hinge plate.

[0010] Figure 7 The diagram illustrates a comparison of the relationship between displacement and bias voltage between a parallel plate actuator based on an unperforated hinge plate and a parallel plate actuator based on a perforated hinge plate. Detailed Implementation

[0011] As described above, in order to modulate a light beam, a phase light modulator (PLM) includes a mirror that can be adjusted (e.g., moved or shifted) to change the characteristics (e.g., phase) of the reflected beam. In some examples, spatial light modulators use actuators to move the mirror in response to an applied voltage. In some examples, PLMs use microelectromechanical systems (MEMS) based actuators to move the mirror based on a combination of electrostatic and spring forces.

[0012] A parallel-plate electrostatic actuator (e.g., used in MEMS) is a device that uses electrostatic force to move an object (e.g., a mirror of a phase-modulator pixel). For example, the actuator includes a first electrode supporting the mirror. The first electrode is also anchored to an attachment at a distance d from a second (fixed) electrode. The first electrode includes one or more curved arms attached to a support post. The curved arms act as springs (having a spring constant k) and contribute to the spring constant k (stiffness). The first and second electrodes are parallel to each other, and a potential difference is applied between the electrodes to force them closer or further apart, hence the name "parallel-plate actuator".

[0013] In response to a potential difference applied between the first and second electrodes relative to a spring implemented by the first electrode and its bent arm (which generates an electrostatic force), the first electrode moves toward (or away from) the second electrode. In one embodiment, the first electrode is grounded and the second electrode is coupled to a voltage regulator. The voltage regulator applies a bias voltage to the second electrode. As the bias voltage applied to the second electrode increases, the voltage difference between the first and second electrodes generates an electrostatic force that drives the first electrode toward the second electrode, thereby moving the mirror toward the second electrode. Alternatively, the second electrode can be implemented as a digital electrode, allowing the amount of area on the second electrode receiving the applied voltage to be varied. As the amount of area on the second electrode receiving the applied voltage increases, the electrostatic force also increases, causing the first electrode to be pulled closer to the second electrode. As the voltage decreases (and / or the amount of area on the second electrode receiving the voltage decreases), the electrostatic force decreases, causing the first electrode to move away from the second electrode (e.g., due to the mechanical force of the bent arm). In this way, the controller can control the voltage and / or the amount of area on the second electrode receiving the voltage to control the position of the first electrode, thereby controlling the position of the mirror. The amount of travel of the reflector corresponds to the achievable phase modulation of the PLM.

[0014] Electrostatic actuators include a "pull-in" point, also referred to herein as the collapse point or instability point, which corresponds to the maximum distance the first electrode can travel before collapse occurs. Collapse refers to the first electrode accelerating into contact with the second electrode, thereby disrupting pixel functionality. The pull-in point is an equilibrium point beyond which the system becomes unstable.

[0015] The value “g” refers to the distance between the first and second electrodes in the absence of any electrostatic force (i.e., no applied potential difference). For a parallel plate actuator, the first electrode cannot travel more than 1 / 3 x g before the electrodes uncontrollably collapse together. For example, if g is 900 micrometers (“microns”), the first electrode may only travel 300 micrometers toward the base electrode before pull-in occurs. The phase modulation amount is a function of the relative travel distance between the electrodes and the pixel pitch. The 1 / 3 x g travel limit unnecessarily limits the optical bandwidth of the PLM. A greater difference can be implemented compared to a large-pitch PLM (i.e., a PLM with a larger g-interval between electrodes) to attempt to provide a greater inter-electrode travel distance. For example, a PLM with g of 1500 micrometers allows for an inter-electrode travel distance of 500 micrometers, which is greater than the 300 micrometer travel distance of a PLM with g of 900 micrometers. The pull-in voltage (Vpi) refers to the maximum voltage that can be applied across the electrodes before pull-in occurs. For the parallel plate actuator, Vpi is:

[0016]

[0017] Where k is the spring constant of the first electrode, ∈ is the dielectric constant between the two electrodes, and A is the area of ​​the second (fixed) electrode. As seen in equation (1), the pull-in voltage increases with increasing g. For the required voltage amplitude of Vpi, a certain value of g becomes impractical. A smaller value of k (the spring constant of the bent arm) can reduce the pull-in voltage. However, making k sufficiently small to avoid an excessively large PLM may also be impractical. Therefore, there is a design tension between these two extremes (for a given pixel pitch and hinge material thickness): on the one hand, a larger g is desired to facilitate a higher optical bandwidth PLM; on the other hand, an impractically large bias voltage or an impractically small spring constant is required.

[0018] Figure 1A-Figure 1B The illustration shows an example parallel plate electrostatic actuator 100 at two different locations (e.g., to implement a MEMS-based PLM). Figure 1A-Figure 1BExample actuator 100 includes a mirror 102, a support plate 103, a mirror attachment 104 (e.g., a mirror through-hole), a hinge plate 106 (also referred to as a "spring electrode"), a bending arm 107, a support post 108, a substrate 110 (also referred to as a "base electrode"), and an electrode voltage controller 112.

[0019] Figure 1A-Figure 1B The reflector 102 reflects the light beam in two or more directions depending on its position. For example, and as... Figure 1A As shown, the reflector 102 extends to a first position (e.g., a neutral position when no voltage is applied to the example substrate 110) to reflect light in a first direction. The reflector 102 retracts to... Figure 1B The mirror 102 is positioned at a second location to reflect light in a second direction. It is supported by a support plate 103. The support plate 103 is coupled to the hinge plate 106 via a mirror attachment 104. In some examples, the support plate 103 may be absent and the mirror 102 may be directly coupled to the mirror attachment 104. In some examples, a different object may be included instead of the mirror 102. Figure 1A and Figure 1B In one example, the reflector 102 and / or support plate 103 are manufactured to be larger than the hinge plate 106, such that the reflector 102 and / or support plate 103 are suspended on the support post 108. In this particular configuration, the support post 108 acts as a mechanical stop for the support plate 103, allowing the surface of the hinge plate 106 facing the substrate 110 to make direct contact with the substrate 110. Although Figure 1A-Figure 1B Example structure 100 includes three mirror attachments 104, but structure 100 may include any number of mirror attachments.

[0020] Figure 1A-Figure 1B The example hinge plate 106 includes an electrode comprising a bent arm 107. The bent arm 107 of the hinge plate 106 is characterized by a mechanical spring constant. When stretched, the bent arm 107 applies a mechanical force in the opposite direction to the stretch. The bent arm 107 is attached to a support post 108. The support post 108 is grounded in this example. The support post 108, the bent arm 107, and the hinge plate 106 are all formed of a conductive material (e.g., metal) and coupled together (or formed as a single component), so that the hinge plate 106 is at a ground potential due to the grounding of the support post 108. In this way, when an electrostatic force is applied to the hinge plate 106, the bent arm 107 extends toward the substrate 110, causing the hinge plate 106 to move toward the substrate 110, thereby causing the reflector 102 to... Figure 1A The first position facing Figure 1B The second position is moved (i.e., closer to the substrate 110). The reflector attachment 104 can provide rigidity to the hinge plate 106 to ensure that the hinge 106 does not bend with the increase of electrostatic force. Although Figure 1A and Figure 1B The illustration shows two positions of hinge plate 106 relative to substrate 110, but the potential difference applied between hinge plate 106 and substrate 110 can be varied such that hinge plate 106 is in multiple (two, three, four or more) different positions relative to substrate 110. For example, the spacing between hinge plate 106 and substrate 110 can be continuously varied by analog voltage control or a continuously varying output.

[0021] Figure 2 It shows Figure 1A and Figure 1B A three-dimensional view of structure 100. As shown in this example, hinge plate 106 and substrate 110 are perforated, and the perforations are rectangular (e.g., square). Hinge plate 106 is therefore a conductive member having a plurality of perforations formed therein. Substrate 110 includes a plurality of electrodes that substantially correspond to the perforations of hinge plate 106.

[0022] Figure 3 It shows Figure 2 A top view of the configuration of the perforated hinge plate 106 and the substrate 110. The substrate 110 includes an electrode array, and the perforated hinge plate 106 includes an array of corresponding perforations. Figure 3 As shown, the hinge plate includes a central through-hole 301. A set of eight through-holes 311-318 surrounds the central through-hole 301. A set of twelve through-holes 331-342 surrounds the eight through-holes 311-318. A set of twelve through-holes 371-382 surrounds the twelve through-holes 371-382. The substrate 110 has electrodes corresponding to the through-holes of the hinge plate 106. Electrodes 302 of the substrate 110 correspond to the central through-hole 301 of the hinge plate 106. Electrodes 321-328 correspond to through-holes 311-318. Electrodes 351-362 correspond to through-holes 331-342. Electrodes 391-402 correspond to through-holes 371-382. The shape of each electrode of the substrate 110 approximately matches the shape of the corresponding through-hole of the hinge plate 106. In one example, the shapes of the through-holes and electrodes are rectangular.

[0023] Figure 3The configuration of the perforated hinge plate 106 shown represents a four-digit electrode configuration. Bit 0 corresponds to the center electrode 302. Bit 1 corresponds to electrode rings 321-328. Bit 2 corresponds to electrode rings 351-362. Bit 3 corresponds to electrode rings 391-402. Conductive traces (not shown) are electrically connected to electrode rings 321-328, such that electrodes 321-328 function as single electrodes. Conductive traces are also electrically connected to electrode rings 351-362, such that electrodes 351-362 function as single electrodes. Conductive traces are also electrically connected to electrode rings 391-402, such that electrodes 391-402 function as single electrodes. Therefore, when bit 0 of the four-bit value is asserted (e.g., "1"), a bias voltage is applied to the center electrode 302. Similarly, when bit 1 is asserted, a bias voltage is applied to the electrodes formed by electrode rings 321-328. When bit 2 is asserted, a bias voltage is applied to the electrodes formed by electrode rings 351-362. When bit 3 is active, a bias voltage is applied to the electrodes formed by electrode rings 391-402. The bias voltage applied to each group of electrodes can be the same. For example, if bits 0 and 1 are active, the same voltage is applied to electrodes 302 and 321-328. If all four bits are active, all electrodes 302, 321-328, 351-362, and 391-402 receive the same voltage.

[0024] When viewed from above, as Figure 3 As shown, a gap of length S4 separates the conductive portion 354 from the facing wall defined by the corresponding through-hole 334. The same length S4 can be applied around all four sides of the conductive portion 354, as well as all other conductive portions 302, 321-328, 351-362, and 391-402. S4 should not be arbitrarily small, because in this case, the edge field effect will be weakened, and the device will behave more like a simple through-hole hinge with parallel plate statics.

[0025] In one example implementation ( Figure 3 (Not shown in the image), the areas of the electrode groups on substrate 110 are binary weighted, meaning that if the area of ​​electrode 302 is "X", then the total area of ​​bit 1 electrode rings 321-328 is 2X, the total area of ​​bit 2 electrode rings 351-362 is 4X, and the total area of ​​bit 3 electrode rings 391-402 is 8X. When the edge field actuator is in Figure 7 When operating in the linear displacement region shown (discussed below), the device is able to perform relatively large displacements, which is not easily achieved with conventional parallel plate actuators.

[0026] Figure 4The illustration shows that by perforating the hinge plate 106 (which has corresponding electrodes on the substrate 100), an edge electric field is generated across the electrode region, with the strongest field at the edges / corners of the perforated hinge plate 106. Figure 4 At position 410, the center electrode 302 is shown as being within the perforation 301. The perforation 301 is partially formed by the conductive portions 303 and 304 of the hinge plate 106 (also shown in...). Figure 3 (The text is incomplete and contains several typographical errors. A more accurate translation would require the full context.) The electric field line 411 is shown between the conductive portions 303 / 304 and the electrode 302. At 420, the hinge plate 106 (with its conductive portions 303 / 304) is shown closer to the substrate 110 (with its electrode 302). When the hinge plate 106 is pulled closer to the substrate 110 due to a bias voltage, the electric field generated between the conductive portions 303 / 304 and the electrostatic attraction between the electrodes 302 and 303 / 304 are dominated by the edge field, as shown by the electric field line 413 at 430 relative to the electric field line 411 at 410. As a result, the hinge plate 106 can be brought to the same plane as the substrate 110 without engaging. (The remaining text appears to be a fragmented and incomplete description of an actuator with an unperforated parallel plate.) Figure 3 and Figure 4 All other aspects are the same between the perforated hinge plate configurations described, but the perforated hinge plate allows for greater vertical displacement, thus enabling a greater optical bandwidth for the PLM using this structure.

[0027] The electrostatic force (F) between the hinge plate 106 and the base plate 110 EL The following formula is given:

[0028]

[0029] Where A EL is the effective area of ​​hinge plate 106, x is the controllable distance between hinge plate 106 and substrate 110, and V is the bias voltage. Area (A) EL The area is referred to as the "effective" area. Considering a parallel-plate capacitor, A0 would represent the capacitor's area if only its surface area facing the other plate were calculated. However, for a capacitor with a finite area, edge fields will exist around all its sides. Therefore, the capacitor will have a larger area ("effective area") than the two directly opposite faces subjected to the electric field. As x increases (meaning the hinge plate 106 becomes closer to the substrate 110 due to the more electrode rings to which the bias voltage is applied), the effective area A... EL Decrease. Therefore, A EL A is modulated as a function of the distance between hinge plate 106 and substrate 110. A decreases as the plates are pulled closer together. EL This at least partially offset the increase in x, thus matching the F of the unperforated parallel plate. EL Compared to reducing the electrostatic force F EL .

[0030] Figure 3 and Figure 4 The example illustration shows that the hinge plate 106 is perforated and the substrate 110 is formed as a series of discrete electrodes. Figure 5A and Figure 5B Hinge plate 106 is shown as follows Figure 4 Another example shown is a perforated plate, but the substrate 110 is solid (i.e., not a discrete electrode). Electric field line 511 illustrates that some of the electric field is an edge field, while electric field 513 illustrates the electric field caused by the parallel plates. Due to the partial edge field caused by the perforation of only the hinge plate 106, the hinge plate 106 can be brought closer to the substrate 110 before attraction occurs, compared to a PLM with an unperforated parallel plate.

[0031] Figure 6 An example of a hinge plate 606 and a substrate 610 is shown. A curved arm 607 extends from a support post 108 into the hinge plate 606, as shown. The hinge plate 606 has a configuration including four external serrated perforations 621-624. Each external serrated perforation 621-624 has opposing surfaces with a serrated shape. For example, perforation 621 has a pair of opposing surfaces 625 and 626, and each surface has a serrated shape as shown. The same applies to perforations 622-624. The substrate has a configuration of four corresponding serrated electrodes 631-634, which, when viewed from above, are located within the perforations 621-624, as shown. Figure 6 As shown. Accordingly, each serrated electrode is within the coverage area of ​​its corresponding serrated perforation (the coverage area of ​​each perforation is larger than the coverage area of ​​each corresponding electrode). The area of ​​each electrode 631-634 is smaller than the area of ​​each corresponding perforation 621-624. Electrodes 631-634 are electrically connected via conductive element 635. In one embodiment, electrodes 631-634 and conductive element 635 are formed as a single conductive structure. Electrodes 631-634 represent bit 3 of a four-position electrode structure. This shape has several uses. First, by introducing serrations, the linear distance that can be contained in a given area is increased. Second, the introduction of cusps serves to further concentrate the charge at the edges of the conductor and enhance the edge field effect.

[0032] The hinge plate 606 also has a set of internal perforations 641-644, and the substrate has electrodes 651-654 corresponding to the perforations 641-644. The area of ​​each electrode 651-654 is smaller than the area of ​​each corresponding perforation 641-644. Each serrated electrode 651-654 is within the coverage area of ​​the corresponding serrated perforation 641-644. Electrodes 651-654 are interconnected and correspond to bit 2. The hinge plate 606 also includes perforations 661-664, and the substrate has electrodes 671-674 corresponding to the perforations 661-664, and electrodes 671-674 have an area smaller than the area of ​​the corresponding perforation. Electrodes 671-674 are interconnected and represent bit 1. Each electrode 671-674 is within the coverage area of ​​the corresponding perforation 661-664. The substrate includes a center electrode at 691 (but... Figure 6 (Hidden in the view). In this case, bit 0 is the parallel plate actuator.

[0033] Each of electrodes 651-654 includes a corresponding pair of triangular protrusions. For example, electrode 651 is illustrated with triangular protrusions 695 and 696. The contour of the inner surface of the perforation 641 includes matching triangular grooves 697 and 698 for each of the triangular protrusions 695 and 696. The triangular protrusions facilitate additional edge fields.

[0034] therefore, Figure 6 The configuration includes output through-rings 621-624, which surround inner through-rings 641-644. Furthermore, through-rings 641-644 surround through-rings 661-664. The substrate 610 is similarly configured with multiple electrode rings—one ring surrounding an inner ring, and so on.

[0035] The area of ​​the fringe field may be limited by the underlying metal wiring. In this case, all metal wiring is on the surface, so some parallel plate behavior may be unavoidable. Furthermore, the perforation should be balanced based on the mechanical stiffness of the hinge. In the case of PLM, the mirror and mirror vias may increase the hinge stiffness, but at the cost of requiring solid hinge metal below and around the mirror vias to address misalignment issues. The design of the fringe field electrodes should also consider manufacturing misalignment tolerances.

[0036] Figure 7 A graph of displacement versus bias voltage is shown. The displacement value refers to the distance x of the hinge plate from its initial state g. Figure 7 The diagram shows three curves: 710, 716, and 720. These curves belong to the parallel plate PLM model. Curve 710 represents the displacement of an unperforated hinge plate, while curve 720 represents the displacement of a perforated hinge plate (e.g., ...). Figure 3 or Figure 4 Hing plate 106 or Figure 6The displacement of the hinge plate 606 and the perforated substrate 110 is illustrated by curve 710. As the bias voltage increases, the displacement also increases. Curve 710 terminates at line 711, which represents a displacement of 250 nm. Line 711 is the point of attraction where the two parallel plates (without perforations) undesirably collide with each other. Therefore, for the without-perforated parallel plates, the PLM actuator cannot make a displacement beyond line 711. Figure 7 The example is for 750nm g, so line 711 is a displacement of 250nm (1 / 3 x 750nm). Curve 716 is used for a PLM in which the hinge plate is perforated but the substrate 110 is not perforated. In this configuration, some overtravel is implemented—more than in the unperforated structure characterized by curve 710, but less than in the perforated hinge and substrate structure of curve 720.

[0037] Curve 720 illustrates the behavior of a PLM in which the hinge plate is perforated. In this case, the substrate is also configured with discrete electrodes, for example... Figure 3 and Figure 6 The discrete electrodes are shown. Due to the edge field implemented by these electrode configurations, the actuator is able to achieve significantly larger displacements. For example... Figure 7 As shown in the example, the hinge plate can even extend beyond the plane of the substrate 110, thus enabling displacements of g even greater than 750 nm.

[0038] Region 760 is for displacements less than 1 / 3 x g (less than 250 nm in this example). Region 765 is for displacements between one-third and 100% of g. The shape of curve 720 within region 760 differs from that within region 765. Within region 760, the perforated hinge plate and substrate primarily function as parallel plates. However, within region 765, due to edge field effects, the actuator exhibits a more linear relationship between displacement and bias voltage than in region 760. For the disclosed example, although linear bit-weighted actuation is required for PLM applications, the entire range is a usable travel distance due to appropriate feedback and control loops associated with the bias, which was not possible with previous PLMs.

[0039] Within the scope of the claims, modifications to the described embodiments are possible, and other embodiments are also possible.

Claims

1. A phase light modulator, comprising: A substrate, the substrate comprising a plurality of electrodes; Reflector; A perforated hinge plate supporting the reflector, the hinge plate having a bending arm and a plurality of perforations, the perforated hinge plate being configured to move toward or away from the substrate based on the application of a potential difference between the substrate and the perforated hinge plate, and each of the plurality of perforations corresponding to a corresponding electrode among the plurality of electrodes of the substrate; The first support column, to which the curved arm is connected.

2. The phase light modulator according to claim 1, wherein the perforated hinge plate comprises: A first perforation having a serrated shape, the first perforation having an area; and A second perforation with a serrated shape, the second perforation having an area.

3. The phase light modulator according to claim 2, wherein the substrate comprises: A first electrode having a serrated shape, the first electrode having an area smaller than the area of ​​the first perforation; and A second electrode having a serrated shape, the second electrode having an area smaller than the area of ​​the second perforation.

4. The phase light modulator according to claim 1, wherein: The hinge plate includes a first serrated perforated ring and a second serrated perforated ring within the first serrated perforated ring; The substrate includes a first serrated electrode ring, each electrode of the first serrated electrode ring being within the coverage area of ​​a corresponding serrated perforation of the first serrated perforated ring, and the substrate includes a second serrated electrode ring, each electrode of the second serrated electrode ring being within the coverage area of ​​a corresponding serrated perforation of the second serrated perforated ring.

5. The phase light modulator of claim 4, wherein the perforated hinge plate includes a first perforation having a first opposing surface and a second opposing surface, the first opposing surface having a serrated shape, and the second opposing surface also having a serrated shape.

6. The phase light modulator of claim 1, wherein the substrate includes a first electrode, a second electrode, a third electrode and a fourth electrode, and the perforated hinge plate includes perforations corresponding to the first electrode, the second electrode, the third electrode and the fourth electrode.

7. The phase light modulator according to claim 1, wherein the hinge plate comprises: First perforation; A first perforated ring surrounding the first perforation; and A second perforated ring surrounds the first perforated ring.

8. The phase light modulator according to claim 7, wherein the substrate comprises: First electrode; A first electrode ring surrounding the first electrode; and A second electrode ring that surrounds the first electrode ring.

9. A phase light modulator, comprising: A substrate including a first electrode and a second electrode; Reflector; A perforated hinge plate supports the reflector, the perforated hinge plate including a first curved arm and a second curved arm that allow the hinge plate and the reflector to move relative to the substrate, and the perforated hinge plate having a first perforation including a first electrode and having a coverage area greater than the coverage area of ​​the first electrode, and the perforated hinge plate having a second perforation including a second electrode and having a coverage area greater than the coverage area of ​​the second electrode; A first support column, the first curved arm being connected to the first support column; and The second support column, the second curved arm is connected to the second support column.

10. The phase light modulator of claim 9, wherein the first electrode has a opposing surface having a serrated shape.

11. The phase light modulator of claim 9, wherein the first electrode and the second electrode have serrated opposing surfaces, and the first perforation and the second perforation have serrated opposing surfaces.

12. The phase light modulator of claim 9, wherein the first electrode and the second electrode are rectangular, and the first aperture and the second aperture are rectangular.

13. The phase light modulator according to claim 9, wherein: The substrate includes an electrode array, the electrode array including a first electrode and a second electrode; and The perforated hinge plate includes a perforated array, which includes a first perforation and a second perforation.

14. The phase light modulator according to claim 9, wherein: The substrate has a third electrode and a fourth electrode; and The perforated hinge plate has a third perforation, the third perforation including the third electrode and having a coverage area greater than that of the third electrode, and the perforated hinge plate has a fourth perforation, the fourth perforation including the fourth electrode and having a coverage area greater than that of the fourth electrode.

15. The phase light modulator of claim 9, wherein when a potential difference is applied between the perforated hinge plate and the substrate, an edge electric field is generated between the perforated hinge plate and the substrate at the first perforation and the second perforation.

16. A phase light modulator, comprising: The substrate includes a first group of second electrodes, a second group of second electrodes, a third group of second electrodes, and a fourth group of second electrodes; An electrode voltage controller, coupled to the first group of electrodes to the fourth group of electrodes and configured to selectively apply a voltage to any one of the first group of electrodes to the fourth group of electrodes; Reflector; A perforated hinge plate supports the reflector, the perforated hinge plate including a first group of perforations, a second group of perforations, a third group of perforations and a fourth group of perforations, the first group of perforations to the fourth group of perforations being configured to receive corresponding first group of electrodes to the fourth group of electrodes; The first curved arm, the second curved arm, the third curved arm, and the fourth curved arm allow the hinge plate and the reflector to move relative to the substrate; and A first support column, a second support column, a third support column, and a fourth support column, wherein the first curved arm to the fourth curved arm is connected to the corresponding first support column to the fourth support column.

17. The phase light modulator of claim 16, wherein each of the first to fourth groups of electrodes is rectangular.

18. The phase light modulator of claim 17, wherein each of the first group of perforations to the fourth group of perforations has an opposing serrated surface.

19. The phase light modulator of claim 16, wherein each of the first set of electrodes has opposing serrated surfaces.

20. The phase light modulator of claim 19, wherein each of the first set of perforations has opposing serrated surfaces.

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