A hot knife

Abstract

The application discloses a hot cutting knife, which comprises a ring cutting knife assembly fixed at one end of a rotatable rotating arm, wherein the ring cutting knife assembly comprises a cutting knife seat fixed on the rotating arm, a knife seat rotatably arranged on the cutting knife seat, and a heating device fixed on the knife seat, and the heating device is used for heating the ring cutting knife on the knife seat. The heating device can heat the ring cutting knife, cut the BG film, and avoid wrinkles of the BG film caused by rotation of the cutting tool. The heated ring cutting knife has a better effect on the BG film.

Description

TECHNICAL FIELD

[0001] The present application relates to wafer film technology field, especially to a hot cutter. BACKGROUND

[0002] With the progress of science and technology, intelligent wear, smart phones and tablet computers develop towards high speed and large capacity in storage; thin type in volume, the development direction of science and technology requires flash memory and memory controller to be thin and continuously improved, the wafer area tends to be larger and larger, and the thickness tends to be thinner, so that the cracking problem in the processing and cutting of very thin wafers in the conventional process is more challenging.

[0003] In order to adapt to the light weight requirement of the chip, the cutting and thinning processing method is adopted in the processing process; the specific operation is as follows: first, the wafer is cut in the positive direction with a suitable depth, and then the wafer is attached to the BG film, which can effectively protect the chip on the wafer surface from damage and prevent the wafer from being affected by impurities during the thinning process.

[0004] The silicon carbide wafer has high hardness and cannot be broken by expanding the film, so it needs to be broken along the wafer cutting path one by one by a suitable device, and the chip surface is sensitive to debris, so a layer of BG film is attached to the wafer surface during the wafer breaking process to prevent the splitting knife of the splitting mechanism from directly contacting the wafer surface and to prevent the debris generated during the splitting process from polluting the chip. After the BG film is attached to the wafer, the BG film needs to be cut to match the size of the wafer, and the rotation of the cutter will cause wrinkles on the surface of the BG film. SUMMARY

[0005] In order to solve the problem of wrinkles on the BG film caused by the rotation of the cutter during the cutting of the wafer protection film, the present application provides a hot cutter.

[0006] The specific scheme is as follows:

[0007] A hot cutter, comprising a ring cutter assembly fixed at one end of a rotatable rotating arm, the ring cutter assembly comprising a cutting knife seat fixed on the rotating arm, a knife seat rotatingly arranged on the cutting knife seat, a heating device fixed on the knife seat, and the heating device heating the ring cutter on the knife seat.

[0008] The heating device comprises, in sequence along the length direction of the rotating arm, a heat insulation plate fixed on the knife seat, an electric heating plate and a PTC heater, and the ring cutter is fixed between the heat conducting plate and the PTC heater; the electric heating plate is heated by an electric wire.

[0009] The electric wire is connected in series with a resistor.

[0010] The model of the resistor is Pt100.

[0011] The PTC heater is fixed on the heat-conducting plate by fixing bolts and clamps the ring cutter.

[0012] The disclosed hot cutter can heat the ring cutter by the heating device, cut the BG film and avoid wrinkles of the BG film due to rotation of the cutter. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 FIG. 1 is a structural schematic diagram of a full-automatic wafer film coating machine;

[0014] Figure 2 FIG. 3 is a structural schematic diagram of a mold assembly;

[0015] Figure 3 FIG. 5 is a structural schematic diagram of an angle fixing assembly; Figure 1

[0016] Figure 4 FIG. 7 is a structural schematic diagram of an angle fixing assembly; Figure 1

[0017] Figure 5 FIG. 9 is a structural schematic diagram of a wafer transfer device;

[0018] Figure 6 FIG. 11 is a structural schematic diagram of a wafer receiving mechanism;

[0019] Figure 7 FIG. 13 is a working state schematic diagram of a rotary cutting part;

[0020] Figure 8 FIG. 15 is a structural schematic diagram of a rotary cutting part; Figure 1

[0021] Figure 9 FIG. 17 is a structural schematic diagram of a rotary cutting part; Figure 2

[0022] Figure 10 FIG. 19 is a structural schematic diagram of a ring cutter assembly; Figure 1

[0023] FIG. 21 is a structural schematic diagram of a ring cutter assembly; Figure 11 Figure 2

[0024] Figure 12 FIG. 23 is a structural schematic diagram of a balancing assembly;

[0025] Figure 13 FIG. 25 is a process diagram of the ring cutter cutting the BG film.

[0026] ​​​​​​In the diagram: 1. Machine frame; 11. Longitudinal plate; 2. Film application platform; 21. Ring cutting groove; 3. Pressing mold assembly; 31. Pressing mold servo moving module; 32. Pressing mold support; 33. Pressing mold roller; 34. Pressing mold cylinder; 35. Pressing mold bracket; 4. Fixed angle assembly; 41. Fixed angle linear motor; 42. Fixed angle roller; 5. Rotary cutting component; 5. Ring cutting blade assembly; 51. Cutting blade holder; 511. Heating device; 512. Blade holder; 5121. Heat insulation plate; 5122. Electric heating plate; 5123. PTC heater. 124, tension spring 513, angle adjusting bolt 514, ring cutter 515, balancing assembly 52, balancing support 521, balancing spring 522, roller support 523, roller 524, long bolt 525, rotary cutting seat 53, rotary drive motor 54, rotary arm 55, wafer receiving mechanism 6, lifting column 61, lifting plate 62, lifting cylinder 63, multi-functional robot 7, transfer robot 71, suction unit 711, hopper 8, wafer 9, BG film 10. Detailed Implementation

[0027] The technical solutions in the embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the implementation of the present invention, and not all of it. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0028] like Figures 1-13 As shown, a fully automatic wafer coating machine is disclosed, including a machine frame 1 with a vertical plate 11 on its upper surface, a wafer coating system, a multi-functional robot system with a multi-functional mechanical arm 7, and a material bin 8. The wafer coating system includes a coating platform 2 set on the machine frame 1, a pressing mold assembly 3 located above the coating platform 2, and a fixed angle assembly 4 set on the vertical plate 11. The fixed angle assembly 4 ensures that when the pressing mold assembly 3 is coating, the angle between the BG film 10 between the pressing roller 33 and the fixed angle roller 42 and the horizontal plane where the coating platform 2 is located remains unchanged. The multi-functional robot arm 7 is equipped with a ring cutter assembly 51 for hot cutting the BG film 10. By cooperating with the molding assembly 3 and the fixed angle assembly 4, the BG film 10 is kept flat before application, and the angle between the BG film 10 and the application platform 2 between the molding roller 33 and the fixed angle roller 42 remains unchanged. The molding roller 33 can remove the air under the BG film 10 to avoid wrinkles. When cutting the BG film 10, a hot-cutting ring cutter assembly 51 is used, which can cut the BG film 10 with a heated ring cutter 515 to avoid wrinkles caused by the blade during the cutting process.

[0029] The molding assembly 3 includes a molding servo moving module 31, on which a molding bracket 32 ​​is slidably connected. A height-adjustable pressing roller 33 is rotatably mounted on the molding bracket 32. When the pressing roller 33 moves downward and contacts the BG film 10, the molding servo moving module 31 controls the molding bracket 32 ​​to move and apply the film in the direction of the BG film 10's movement. When applying the film, the pressing roller 33 can maintain the angle between the BG film 10 and the film application platform 2 by ensuring that the fixed angle roller 42 and the pressing roller 33 move synchronously. The pressing roller 33 can be reciprocated by a fixed angle linear motor and also by an extended plate on the molding bracket 32. The length direction of the extended plate is consistent with the running direction of the film belt, and the pressing roller 33 is rotatably mounted on the extended plate.

[0030] To ensure that the angle between the BG film 10 and the film application platform 2 remains unchanged between the molding roller 33 and the fixed angle roller 42, the running direction of the fixed angle roller 42 can be perpendicular to the direction of the film application platform 2, and the fixed angle roller 42 is rotatably mounted on the fixed angle linear motor 41.

[0031] To ensure that the BG film 10 is subjected to uniform force when the pressing roller 33 presses the BG film 10, the pressing support 32 is a gate-shaped frame, and the film application platform 2 is located inside the gate frame. Pressing cylinders 34 are provided on both sides of the top of the gate-shaped frame. The telescopic rod of the pressing cylinder 34 passes through the top of the gate-shaped frame and is connected to the pressing bracket 35 at the end of the telescopic rod of the pressing cylinder 34. The pressing roller 33 is rotatably connected to the pressing bracket 35.

[0032] A rotary cutting component 5 is installed on the multi-functional robotic arm 7. The rotary cutting component 5 includes a rotary cutting seat 53 fixed on the multi-functional robotic arm 7, a rotary drive motor 54 fixed on the rotary cutting seat 53, and a rotary arm 55 connected to the output shaft of the rotary drive motor 54. A ring cutting blade assembly 51 is installed at one end of the rotary arm 55, and a balancing component 52 is installed at the other end of the rotary arm. When the ring cutting blade assembly 51 is cutting, a ring cutting groove 21 needs to be set on the corresponding working surface. Here, the working surface refers to the film application platform 2. An adsorption area is set on the film application platform 2, and a negative pressure chamber is set in the adsorption area. A negative pressure source is set in the negative pressure chamber. The negative pressure source generates negative pressure and adsorbs the wafer 9 through the negative pressure hole set in the adsorption area. The wafer 9 to be coated is placed inside the ring cutting groove 21. The negative pressure source can adsorb the wafer 9 through the negative pressure hole, avoiding the position of the wafer 9 from shifting during cutting. The width of the annular groove 21 is 5mm, the depth of the annular groove 21 is 0.2mm, the material of the film application platform 2 is ceramic, and the inner diameter of the annular groove 21 is 2mm smaller than the outer diameter of the wafer 9.

[0033] The ring cutter assembly 51 comprises a U-shaped cutting knife seat 511 arranged at the end of the rotating arm 55, a ring cutter 515 arranged at the U-shaped opening, and a heating device 512 arranged adjacent to the ring cutter 515 to heat the ring cutter 515. The heating device 512 comprises a knife seat 5121 arranged at the U-shaped opening, a heat insulation plate 5122, an electric heating plate 5123 and a PTC heater 5124 fixed in sequence outside the knife seat 5121 along the length direction of the rotating arm 55, and the ring cutter 515 is fixed between the electric heating plate 5123 and the PTC heater 5124. The electric heating plate 5123 is heated by an electric wire.

[0034] In order to protect the circuit, a resistance is connected in series on the electric wire, and the model of the resistance used is Pt1000. The heating device 512 can heat the ring cutter 515, and the BG film 10 is cut by the heated ring cutter 515, so that the blade in the cutting process does not cause the BG film 10 to wrinkle.

[0035] The knife seat 5121 is rotationally connected to the cutting knife seat 511, and the ring cutter assembly 51 further comprises an angle adjusting mechanism and a reset mechanism. The angle adjusting mechanism enables the ring cutter assembly 51 to rotate relative to the rotating arm 55, and the reset mechanism enables the ring cutter assembly 51 to fix the ring cutter 515 assembly after rotation. The angle adjusting mechanism comprises a protrusion arranged at the bottom of the cutting knife seat 511, and an angle adjusting bolt 514 is threadedly connected in the protrusion. The end of the angle adjusting bolt 514 moves to adjust the angle of the ring cutter 515.

[0036] The reset mechanism is a tension spring 513, and the two ends of the tension spring 513 are respectively connected to the bottom of the cutting knife seat 511 and the knife seat 5121. The two ends of the tension spring are respectively connected to the bottom of the cutting knife seat and the knife seat, and the connection point of the tension spring and the knife seat 5121 is located on the same side of the hinge point between the ring cutter assembly 51 and the cutting knife seat 511.

[0037] The reset mechanism is a compression spring, and the two ends of the compression spring are respectively connected to the bottom of the cutting knife seat 511 and the knife seat 5121. The connection point of the compression spring and the knife seat 5121 is located on the different side of the hinge point between the ring cutter assembly 51 and the cutting knife seat 511.

[0038] The end of the angle adjusting bolt 514 is provided with a spherical nut, which can protect the knife seat 5121. The angle adjusting mechanism and the reset mechanism can adjust the angle of the ring cutter 515, and can protect the blade of the ring cutter 515.

[0039] The rotating arm 55 is provided with an oblong hole, the length direction of the oblong hole is consistent with the length direction of the rotating arm 55, the balancing assembly 52 is fixed in the oblong hole through positioning bolts, and the balancing of the ring cutting is ensured by adjusting the distance between the positioning bolts and the rotating center line; the balancing assembly 52 comprises a balancing support 521, the balancing support 521 is connected with a roller support 523 through a balancing spring 522, and the roller support 523 is provided with a roller 524 rotating thereon. The balancing support 523 is provided with a long bolt, and the end of the long bolt abuts against the roller support 523. The maximum distance of the upward movement of the roller support 523 can be limited, so that the overall balance of the rotating cutting part 5 is avoided from being damaged.

[0040] The multifunctional manipulator 7 is provided with a transfer manipulator 71; the wafer receiving mechanism 6 is arranged on the film pasting platform 2 and is used for receiving the wafer 9 transported by the multifunctional manipulator 7, the wafer receiving mechanism 6 comprises at least three lifting columns 61 and the film pasting platform 2,

[0041] The film pasting platform 2 is entirely an adsorption area, a negative pressure cavity is arranged in the adsorption area, a negative pressure source is arranged in the negative pressure cavity, the negative pressure source generates negative pressure, the wafer 9 is adsorbed through the negative pressure holes arranged in the adsorption area, and the lifting column 61 and the film pasting platform 2 are in sealing sliding connection.

[0042] The middle region of the adsorption area where the lifting column 61 is located does not have an adsorption function, the lifting column 61 and the film pasting platform 2 are not in sliding connection, and the lifting column 61 is preferably four in number.

[0043] The bottom of the lifting column 2 is connected with a lifting plate 62, the lifting plate 62 is lifted through a lifting cylinder 63. The suction part 711 of the transfer manipulator 71 is in a U shape, and the lifting column 61 will not limit the suction part. The transfer manipulator 71, the lifting column 61 and the film pasting platform 2 constitute a wafer transfer device, the transfer manipulator 71 is provided with a negative pressure adsorption mechanism for adsorbing the wafer 9, the negative pressure adsorption mechanism comprises a suction part with a cavity, a negative pressure source is arranged in the suction part, negative pressure is generated in the suction part, and the wafer 9 is adsorbed through small holes on the surface of the suction part. The suction part 711 can be in a U shape, and the lifting column 61 will not limit the suction part. The suction part 711 can also be a suction disc.

[0044] The suction part 711 uses negative pressure to suck the wafer 9 from the hopper, under the action of the multifunctional manipulator, transports the wafer 9 to above the lifting column 62, after the lifting column 62 is lifted, the wafer 9 is placed on the lifting column 62, then under the action of the lifting cylinder 63, the wafer 9 is placed on the film pasting platform 2, and the wafer 9 is adsorbed by using negative pressure. After the film pasting is completed, under the action of the lifting cylinder 63, the lifting column 62 is lifted, the transfer manipulator 71 picks up the wafer 9 and puts it back into the hopper. The wafer transfer device can avoid damaging the wafer 9 in the transfer process.

[0045] A wafer film coating method comprises the following steps:

[0046] Step one: the wafer 9 in the stock bin 8 is taken out by the transfer robot 71 in the multifunctional robot 7, and the wafer 9 is placed on the film sticking platform 2 under the action of the wafer receiving mechanism 6, and the film sticking platform 2 adsorbs the wafer 9.

[0047] Step two: the BG film 10 is transported to above the wafer 9 by the composite film film-feeding system, and the BG film 10 is attached to the surface of the wafer 9 under the action of the pressing die assembly 31.

[0048] Step three: the position of the wafer 9 is positioned by the visual positioning device in the multifunctional robot 7, and the BG film 10 is cut by the rotary cutting part 5.

[0049] Step four: after the BG film 10 is cut, the wafer 9 after film sticking is transferred to the transfer robot 71 by the wafer receiving mechanism 6, and then the wafer 9 after film sticking is transferred to the stock bin 8.

[0050] Step five: the cut BG film 10 is recycled by the excess material collection system.

[0051] In step one, the wafer receiving mechanism 6 receives the wafer 9, including receiving the wafer 9 by the liftable lifting column 61, lowering the lifting column 61 below the film sticking platform after receiving the wafer 9, and adsorbing the wafer 9 by the negative pressure generated on the film sticking platform 2.

[0052] In step two, the composite film film-feeding system transports the composite film from the film-feeding driven roller system to the film sticking platform through the film-feeding inflation shaft, divides the composite film into a protective film and a BG film 10 before entering the film sticking platform 2, recycles the protective film through the protective film film-receiving system, and transports the BG film 10 to above the film sticking platform.

[0053] The end of the film-feeding inflation shaft is fixed with a film-feeding electromagnetic brake, the film-feeding electromagnetic brake is electrically connected between the tension control roller, the tension control roller detects the tension of the film strip and feeds back to the film-feeding electromagnetic brake, and the composite film is always kept tensioned; the film-feeding buffer roller is arranged between the film-feeding driven roller system, and the film-feeding buffer roller contacts the composite film through its own gravity.

[0054] In step two, the pressing die assembly 3 cooperates with the fixed angle assembly 4 when attaching the BG film 10 to the surface of the wafer 9; the pressing die roller 33 in the pressing die assembly 3 can also move along the running direction of the die under the action of the pressing die moving servo module 31 when the BG film 10 is close to the film sticking platform 2, the position of the fixed angle roller 42 in the fixed angle assembly 4 also changes, and the angle between the BG film 10 between the pressing die roller 33 and the fixed angle roller 42 and the horizontal plane where the film sticking platform 2 is located does not change.

[0055] In step three, the rotary cutting component 5 includes a rotary cutting seat 53 fixed on the multifunctional mechanical arm 7, a rotary driving motor 54 fixed on the rotary cutting seat 3, a rotary arm 55 connected at an output shaft of the rotary driving motor 54, an annular cutting knife assembly 51 arranged at one end of the rotary arm 55, and a balancing assembly 52 arranged at the other end of the rotary arm 55; the annular cutting knife assembly 51 needs to be provided with an annular cutting groove on the corresponding working surface when cutting.

[0056] The excess material collecting system includes an excess material collecting air expansion shaft, an excess material collecting driving roller, an excess material collecting roller system, and an excess material collecting buffer roller, the cut BG film 10 is conveyed to the excess material collecting buffer roller by the excess material collecting roller system,

[0057] An excess material collecting electromagnetic brake is fixed at an end of the excess material collecting air expansion shaft, and the excess material collecting electromagnetic brake is electrically connected with an excess material collecting tension control roller, the excess material collecting tension control roller detects the tension of the film strip and feeds back to the excess material collecting electromagnetic brake, so that the cut BG film 10 is always kept in tension; the excess material collecting buffer roller is arranged between the excess material collecting driven roller system and contacts the cut BG film 10 through its own gravity.

[0058] In step five, the cut BG film 10 passes through the gap between the two locking plates of the locking device, and then is recycled by the excess material collecting system; the cut BG film 10 is fixed by controlling the opening and closing of the two locking plates. Specifically, the lower locking plate is fixed on the vertical plate 11, the upper locking plate is controlled to rise and fall by the locking cylinder, thereby controlling the closing of the two locking plates.

[0059] Through the cooperation between the mold assembly 3 and the fixed angle assembly 4, the BG film 10 is kept in a flat state before being pasted, and the angle between the BG film 10 between the mold roller 33 and the fixed angle roller 42 and the pasting platform remains unchanged, the mold roller 33 can exhaust the air below the BG film 10 to avoid wrinkles; the annular cutting knife assembly 51 used for cutting the BG film 10 can cut the BG film 10 by using the heated blade to avoid wrinkles caused by the annular cutting knife 515 during the cutting process. The cooperation between the lifting support 61 and the transfer mechanical arm 71 can avoid damage to the wafer 9 during the transfer process. The cooperation between the annular cutting knife assembly 51 and the balancing assembly 52 can keep the annular cutting knife 515 in a balanced position during the film cutting process. The cooperation between the tension spring 513 and the angle adjusting bolt 514 can adjust the angle of the annular cutting knife 515 to avoid damage to the cutting head of the annular cutting knife 515 during the film cutting process.

[0060] The technical means disclosed in the present application are not limited to the technical means disclosed in the above embodiments, and include technical solutions composed of any combination of the above technical features. It should be noted that, for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements are also considered within the scope of protection of the present application.

Claims

1. A hot knife, which is applied to a full-automatic wafer film coating machine. The full-automatic wafer film coating machine comprises a multi-energy robot system with a multifunctional manipulator; The multifunctional manipulator is provided with a rotary cutting component, the rotary cutting component comprises a rotary cutting seat fixed on the multifunctional manipulator, a rotary driving motor fixed on the rotary cutting seat, and a rotary arm connected with an output shaft of the rotary driving motor; characterized in that: the rotary cutting component comprises a ring cutting knife assembly fixed on one end of the rotary arm, the ring cutting knife assembly comprises a cutting knife seat fixed on the rotary arm, a knife seat rotatably arranged on the cutting knife seat, and a heating device fixed on the knife seat, the heating device heats the ring cutting knife on the knife seat; along the length direction of the rotary arm, the heating device comprises, in sequence, a heat insulation plate fixed on the knife seat, an electric heating plate, and a PTC heater, and the ring cutting knife is fixed between the heat insulation plate and the PTC heater. The electric heating plate is heated by an electric wire. The ring cutting knife assembly further comprises an angle adjusting mechanism and a reset mechanism, the angle adjusting mechanism enables the rotary cutting component to rotate relative to the rotary arm, and the reset mechanism fixes the rotary cutting component after rotation; the angle adjusting mechanism comprises a protrusion arranged at the bottom of the cutting knife seat, and an angle adjusting bolt is threadedly connected in the protrusion; the end of the angle adjusting bolt moves to adjust the angle of the ring cutting knife; the reset mechanism is a tension spring, two ends of the tension spring are connected with the bottom of the cutting knife seat and the knife seat respectively, and the connection point of the tension spring and the knife seat is located on the same side of the hinge joint between the rotary cutting component and the cutting knife seat; or the reset mechanism is a compression spring, two ends of the compression spring are connected with the bottom of the cutting knife seat and the knife seat respectively, and the connection point of the compression spring and the knife seat is located on the different side of the hinge joint between the rotary cutting component and the cutting knife seat. A balance assembly is arranged at the other end of the rotary arm; a long circular hole is arranged on the rotary arm, the length direction of the long circular hole is consistent with the length direction of the rotary arm, the balance assembly is fixed in the long circular hole through positioning bolts, and the balance during ring cutting is ensured by adjusting the distance between the positioning bolts and the rotary center line; the balance assembly comprises a balance support, the balance support is connected with a roller support through a balance spring, and a roller is rotatably arranged on the roller support; a long bolt is arranged on the balance support, the end of the long bolt abuts against the roller support, and the maximum distance of upward movement of the roller support is limited.

2. A hot knife as claimed in claim 1, wherein The electric wire is provided with a resistance in series.

3. A hot knife as claimed in claim 2, wherein The resistance is Pt100.

4. The hot knife of claim 1, wherein, The PTC heater is fixed on the heat insulation plate through a fixing bolt and clamps the ring cutting knife.

Images