Bridge arm reactor parameter optimization method, device and computer equipment

Abstract

The present application relates to a method, device, computer equipment, storage medium and computer program product for optimizing the parameters of a bridge arm reactor. The method comprises: obtaining the structural parameters of the bridge arm reactor, calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters; selecting a standard package according to the temperature rise of each package, calculating the temperature rise of the standard package and other packages, and calculating the package coefficient between the standard package and other packages; establishing an equivalent voltage equation group and an equal temperature rise constraint equation, optimizing the equivalent voltage equation group with the equal temperature rise constraint equation as the optimization target, and obtaining the structural parameters and each secondary current of the bridge arm reactor after the optimization is completed. The use of this method can ensure the applicability of the bridge arm reactor under AC / DC composite working conditions.

Description

Technical Field

[0001] The present application relates to the technical field of electrical equipment, and in particular to a method, device, computer equipment, storage medium, and computer program product for optimizing parameters of a bridge arm reactor. Background Art

[0002] High-voltage direct current (HVDC) transmission is widely used for its advantages, including low losses, uniform voltage distribution along the line, and high system stability. A large number of AC / DC composite reactors, such as bridge arm reactors, are used in various transmission projects. The current flowing through the equipment has both DC and AC components. However, as the scale of the power grid continues to grow, the system's capacitive reactive power gradually increases, and nonlinear loads surge. Reactor switching is becoming increasingly frequent, which can lead to localized overheating of the enclosure, accelerating insulation degradation, and causing accidents such as turn-to-turn short circuits and burnout. Surveys show that the annual failure rate of reactors increases significantly with capacity, reaching as high as 5.63% for 20Mvar reactors. The development of high-voltage and high-capacity reactors exacerbates the problem of temperature rise. While monitoring methods are necessary to detect faults and take corrective measures, fundamental correction of design flaws is even more crucial.

[0003] The commonly used design methods for bridge arm reactors are the equal resistance voltage method and the equal temperature rise method. On this basis, domestic and foreign scholars have optimized them from the perspectives of balanced temperature rise, simplified calculation, and reduced losses. However, the influence of operating conditions has not been considered, resulting in the defect of reduced applicability of bridge arm reactors under AC / DC composite operating conditions. Summary of the Invention

[0004] Based on this, it is necessary to provide a method, device, computer equipment, computer-readable storage medium and computer program product for optimizing the parameters of the bridge arm reactor, which can ensure stable applicability under AC / DC composite working conditions, in order to address the above technical problems.

[0005] In a first aspect, the present application provides a method for optimizing parameters of a bridge arm reactor. The method comprises:

[0006] Acquiring structural parameters of a bridge arm reactor, and calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0007] Select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate the encapsulation coefficient between the standard encapsulation and other encapsulations;

[0008] An equivalent voltage equation group and an isothermal rise constraint equation are established, and the equivalent voltage equation group is optimized with the isothermal rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm reactor after the optimization are obtained.

[0009] In one embodiment, selecting a standard encapsulation according to the temperature rise of each encapsulation, calculating the temperature rise of the standard encapsulation and other encapsulations, and calculating the encapsulation coefficient between the standard encapsulation and other encapsulations includes:

[0010] Based on the AC and DC operating conditions of the bridge arm reactor, the temperature rise of each package is obtained, and the package closest to the average temperature rise of all packages is used as the standard package;

[0011] Based on the temperature rise of the standard encapsulation and the other encapsulations, an encapsulation coefficient between the standard encapsulation and the other encapsulations is obtained.

[0012] In one embodiment, the equivalent voltage equations are:

[0013] n1n1f 11 I'1+n1n2f 12 I'2+n1n3f 13 I'3+…+n1n n f 1n I' n =U' / ω

[0014] n2n1f 21 I'1+n2n2f 22 I'2+n2n3f 23 I'3+…+n2n n f 2n I' n =U' / ω

[0015] n3n1f 31 I'1+n3n2f 32 I'2+n3n3f 33 I'3+…+n3n n f 3n I' n =U' / ω

[0016]

[0017] n n n1f n1 I'1+n n n2f n2 I'2+n n n3f n3 I'3+…+n n n n f nn I' n =U' / ω

[0018] I'1+I'2+I'3+…+I' n =I' N

[0019] Among them, n1n n f 1n is the mutual inductance between coil 1 and coil n; I′ n is the power frequency current of the envelope n, U' is the power frequency terminal voltage of the envelope, and ω is the power frequency angular frequency.

[0020] In one embodiment, the isothermal rise constraint equation is:

[0021]

[0022] Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sj is the encapsulation coefficient between the standard encapsulation s and encapsulation j.

[0023] In one embodiment, obtaining the encapsulation coefficient between the standard encapsulation and the other encapsulation based on the temperature rise of the standard encapsulation and the other encapsulation includes:

[0024] The quotient of the temperature rise of the standard envelope and the temperature rise of the other envelopes is obtained as the envelope coefficient between the standard envelope and the other envelopes.

[0025] In one embodiment, the structural parameters include at least one of rated voltage, rated DC current, rated power frequency current, double frequency current, rated inductance, inductance manufacturing tolerance, DC resistance, average temperature rise, hot spot temperature rise, rated loss, transportation size limit and weight.

[0026] In a second aspect, the present application further provides a device for optimizing parameters of a bridge arm reactor. The device comprises:

[0027] An acquisition module, configured to acquire structural parameters of a bridge arm reactor, and calculate the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0028] A calculation module, configured to select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate an encapsulation coefficient between the standard encapsulation and other encapsulations;

[0029] The optimization module is used to establish an equivalent voltage equation group and an isothermal rise constraint equation, optimize the equivalent voltage equation group with the isothermal rise constraint equation as the optimization target, and obtain the structural parameters and each current of the bridge arm reactor after the optimization is completed.

[0030] In a third aspect, the present application further provides a computer device. The computer device includes a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are performed:

[0031] Acquiring structural parameters of a bridge arm reactor, and calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0032] Select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate the encapsulation coefficient between the standard encapsulation and other encapsulations;

[0033] An equivalent voltage equation group and an isothermal rise constraint equation are established, and the equivalent voltage equation group is optimized with the isothermal rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm reactor after the optimization are obtained.

[0034] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the following steps:

[0035] Acquiring structural parameters of a bridge arm reactor, and calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0036] Select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate the encapsulation coefficient between the standard encapsulation and other encapsulations;

[0037] An equivalent voltage equation group and an isothermal rise constraint equation are established, and the equivalent voltage equation group is optimized with the isothermal rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm reactor after the optimization are obtained.

[0038] In a fifth aspect, the present application further provides a computer program product. The computer program product includes a computer program that, when executed by a processor, implements the following steps:

[0039] Acquiring structural parameters of a bridge arm reactor, and calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0040] Select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate the encapsulation coefficient between the standard encapsulation and other encapsulations;

[0041] An equivalent voltage equation group and an isothermal rise constraint equation are established, and the equivalent voltage equation group is optimized with the isothermal rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm reactor after the optimization are obtained.

[0042] The above-mentioned bridge arm inductor parameter optimization method, device, computer equipment, storage medium and computer program product obtain the structural parameters of the bridge arm inductor, calculate the temperature rise of each package in the bridge arm inductor based on the structural parameters, select a standard package according to the temperature rise of each package, calculate the temperature rise of the standard package and other packages, calculate the package coefficient between the standard package and other packages, establish an equivalent voltage equation group and an equal temperature rise constraint equation, optimize the equivalent voltage equation group with the equal temperature rise constraint equation as the optimization target, obtain the structural parameters and each current of the bridge arm inductor after optimization, realize the optimization of the bridge arm inductor parameters under AC / DC composite working conditions, and ensure the applicability of the bridge arm inductor under AC / DC composite working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a diagram of an application environment of a bridge arm reactor parameter optimization method according to an embodiment;

[0044] Figure 2 1 is a flow chart of a method for optimizing parameters of a bridge arm reactor according to an embodiment;

[0045] Figure 3 A schematic diagram of an encapsulation structure in one embodiment;

[0046] Figure 4 1 is a structural block diagram of a bridge arm reactor parameter optimization device in one embodiment;

[0047] Figure 5 FIG. 1 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0049] The bridge arm reactor parameter optimization method provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown, the terminal 102 communicates with the server 104 via a network. The data storage system can store data that the server 104 needs to process. The data storage system can be integrated on the server 104 or placed on the cloud or other network servers.

[0050] The terminal 102 may be, but is not limited to, a personal computer, laptop computer, smart phone, tablet computer, IoT device, or portable wearable device capable of collecting arm reactor parameters. The IoT device may be a smart speaker, smart TV, smart air conditioner, smart car device, etc. The server 104 may be implemented as an independent server or a server cluster consisting of multiple servers.

[0051] In one embodiment, Figure 2 As shown in the figure, a bridge arm reactor parameter optimization method is provided, which is applied to Figure 1 The following steps are used as an example to illustrate the server in the example:

[0052] Step 202 : Acquire structural parameters of the bridge arm reactor, and calculate the temperature rise of each package in the bridge arm reactor based on the structural parameters.

[0053] Specifically, the structural parameters of the arm reactor to be optimized are obtained. Once these parameters are achieved, the temperature rise of each package within the arm reactor is calculated. Current flowing through a conductor generates a thermal effect, causing the surface temperature of the conductor to rise continuously over time until it stabilizes. Stability is determined when the temperature difference between all test points within a one-hour test interval does not exceed 2K. The temperature rise, measured in Kelvin, is the difference between the temperature at any test point and the average ambient temperature during the final quarter of the test period.

[0054] Step 204 : selecting a standard package according to the temperature rise of each package, calculating the temperature rise of the standard package and other packages, and calculating the package coefficient between the standard package and other packages.

[0055] Specifically, the package closest to the average temperature rise of all packages is selected as the standard package. The package coefficient between the standard package and the other packages is calculated based on the temperature rise of the standard package and the temperature rise of other packages outside the standard package. The package coefficient is used to construct the isothermal constraint equation, which is used to optimize the isothermal constraint equation. The equivalent voltage equation group is optimized by the isothermal constraint equation to make the temperature rise of each package more balanced. Due to the limitations of the calculation method, it is impossible to make the temperature rise of each package completely equal. However, after multiple optimization iterations, the difference between the maximum and minimum average temperature rise of each package can be adjusted to a more reasonable value. The optimization changes the structure of the reactor. After optimization, it is necessary to verify whether the design parameters meet the design requirements, especially paying attention to requirements such as rated inductance and transportation size limits.

[0056] Step 206 , establishing an equivalent voltage equation group and a constant temperature rise constraint equation, optimizing the equivalent voltage equation group with the constant temperature rise constraint equation as the optimization target, and obtaining the structural parameters and each secondary current of the bridge arm reactor after the optimization is completed.

[0057] Specifically, an equivalent voltage equation set and a constant temperature rise constraint equation are established. For a bridge arm reactor composed of n envelopes, the self-inductance of each envelope and its mutual inductance with other envelopes can be calculated. Based on this, according to Kirchhoff's law, an equivalent voltage equation set for the envelopes can be established for parameter optimization using the constant temperature rise method. The equivalent voltage equation set is optimized using the constant temperature rise constraint equation as the optimization target. After optimization, the structural parameters and various secondary currents of the bridge arm reactor are obtained, so that the bridge arm reactor parameters can be adjusted based on the optimization results.

[0058] In the above-mentioned bridge arm inductor parameter optimization method, the structural parameters of the bridge arm inductor are obtained, the temperature rise of each package in the bridge arm inductor is calculated based on the structural parameters, the standard package is selected according to the temperature rise of each package, the temperature rise of the standard package and other packages is calculated, and the package coefficient between the standard package and other packages is calculated, an equivalent voltage equation group and an equal temperature rise constraint equation are established, and the equivalent voltage equation group is optimized with the equal temperature rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm inductor after the optimization is completed are obtained, thereby realizing the optimization of the bridge arm inductor parameters under AC / DC composite working conditions and ensuring the applicability of the bridge arm inductor under AC / DC composite working conditions.

[0059] In one embodiment, selecting a standard encapsulation according to the temperature rise of each encapsulation, calculating the temperature rise of the standard encapsulation and other encapsulations, and calculating the encapsulation coefficient between the standard encapsulation and other encapsulations includes:

[0060] Based on the AC and DC operating conditions of the bridge arm reactor, the temperature rise of each package is obtained, and the package closest to the average temperature rise of all packages is used as the standard package;

[0061] Based on the temperature rise of the standard encapsulation and the other encapsulations, an encapsulation coefficient between the standard encapsulation and the other encapsulations is obtained.

[0062] Specifically, based on the AC and DC operating conditions of the arm reactor, the temperature rise of each package is obtained. From the temperature rises of the packages, the package closest to the average temperature rise of all packages is selected as the standard package. Based on the temperature rises of the standard package and the other packages, the envelope coefficient between the standard package and the other packages is calculated using a preset envelope coefficient calculation formula. The envelope coefficient is used to construct an isothermal constraint equation, which enables the equivalent voltage equation system to be optimized using the isothermal constraint equation as the optimization target. The structural parameters and currents of the arm reactor after optimization are obtained, so that the parameters of the arm reactor can be adjusted based on the optimization results.

[0063] In this embodiment, based on the AC and DC operating conditions of the bridge arm reactor, the temperature rise of each package is obtained, and the package closest to the average temperature rise of each package is used as the standard package. Based on the temperature rise of the standard package and other packages, the package coefficient between the standard package and other packages is obtained to construct an isothermal constraint equation to optimize the equivalent voltage equation group, thereby improving the optimization effect of the isothermal constraint equation.

[0064] In one embodiment, the equivalent voltage equations are:

[0065] n1n1f 11 I'1+n1n2f 12 I'2+n1n3f 13 I'3+…+n1n n f 1n I' n =U' / ω

[0066] n2n1f 21 I'1+n2n2f 22 I'2+n2n3f 23 I'3+…+n2n n f 2n I' n =U' / ω

[0067] n3n1f 31 I'1+n3n2f 32 I'2+n3n3f 33 I'3+…+n3n n f 3n I' n =U' / ω

[0068]

[0069] n n n1f n1 I'1+n n n2f n2 I'2+n n n3f n3 I'3+…+n n n n f nn I' n =U' / ω

[0070] I'1+I'2+I'3+…+I' n =I' N

[0071] Among them, n1n n f 1n is the mutual inductance between coil 1 and coil n; I′ nis the power frequency current of the envelope n, U' is the power frequency terminal voltage of the envelope, and ω is the power frequency angular frequency.

[0072] Specifically, accurate calculation of the envelope inductance is the basis for establishing the equivalent voltage equations. The mutual inductance between non-coaxial parallel solenoid coils is calculated. For a reactor consisting of n envelopes, the self-inductance of each envelope and the mutual inductance with other envelopes can be calculated. Based on this, according to Kirchhoff's law, the envelope equivalent voltage equations can be established:

[0073]

[0074]

[0075]

[0076]

[0077]

[0078]

[0079] The above equations contain many phasors, making them difficult to solve. Since the inductive reactance of the reactor is much greater than the resistance, the influence of the resistance can be ignored. At this time, the phase of the current in each branch is the same, thus eliminating the phase factor. At the power frequency, combined with the simplified calculation of the inductance, the above equations become the following form:

[0080] n1n1f 11 I'1+n1n2f 12 I'2+n1n3f 13 I'3+…+n1n n f 1n I' n =U' / ω

[0081] n2n1f 21 I'1+n2n2f 22 I'2+n2n3f 23 I'3+…+n2n n f 2n I' n =U' / ω

[0082] n3n1f 31 I'1+n3n2f 32 I'2+n3n3f 33 I'3+…+n3n n f 3n I' n =U' / ω

[0083]

[0084] n n n1f n1 I'1+n n n2f n2 I'2+n n n3f n3 I'3+…+n n n n f nn I' n =U' / ω

[0085] I′1+I′2+I′3+…+I′ n =I′ N

[0086] Since the bridge arm reactor operates under a combined AC / DC condition, it is difficult to achieve consistency in the structural parameters obtained under AC and DC conditions. Different from previous solution ideas, and in order to eliminate the influence of frequency, this paper performs a decomposition calculation: the number of turns calculated under the industrial frequency is used as the basis, and on this basis, the double frequency and DC current of each envelope are calculated.

[0087] Therefore, the n-1 constraint equations of the isothermal rise method are combined with the equivalent voltage equations under power frequency to obtain:

[0088] n1n1f 11 I'1+n1n2f 12 I'2+n1n3f 13 I'3+…+n1n n f 1n I' n =U' / ω

[0089] n2n1f 21 I'1+n2n2f 22 I'2+n2n3f 23 I'3+…+n2n n f 2n I' n =U' / ω

[0090] n3n1f 31 I'1+n3n2f 32 I'2+n3n3f 33 I'3+…+n3n n f 3n I' n =U' / ω

[0091]

[0092] n n n1f n1 I'1+n n n2fn2 I'2+n n n3f n3 I'3+…+n n n n f nn I' n =U' / ω

[0093] I′1+I′2+I′3+…+I′ n =I′ N

[0094]

[0095]

[0096]

[0097]

[0098] Where n1n n f 1n is the mutual inductance between coil 1 and coil n; I′ n is the power frequency current of the envelope n, U' is the power frequency terminal voltage of the envelope, and ω is the power frequency angular frequency.

[0099] The voltage at the power frequency end of the envelope is:

[0100] U'=I' N ×ωL N

[0101] Where ω is the power frequency angular frequency, L N is the rated inductance.

[0102] Solving the above equations, we can obtain the number of turns of each package and the power frequency current, check the inductance and size of the reactor, and fine-tune the structural parameters. Based on all the structural parameters at this time, we can simplify the equivalent voltage equations under double frequency AC and DC respectively:

[0103] n1n1f 11 I″1+n1n2f 12 I″2+n1n3f 13 I″3+…+n1n n f 1n I″ n =U″ / 2ω

[0104] n2n1f 21 I″1+n2n2f 22 I″2+n2n3f 23 I″3+…+n2n n f 2n I″n =U″ / 2ω

[0105] n3n1f 31 I″1+n3n2f 32 I″2+n3n3f 33 I″3+…+n3n n f 3n I″ n =U″ / 2ω

[0106]

[0107] n n n1f n1 I″1+n n n2f n2 I″2+n n n3f n3 I″3+…+n n n n f nn I″ n =U″ / 2ω

[0108] I″1+I″2+I″3+…+I″ n =I″ N

[0109] The voltage at the envelope double frequency end is:

[0110] U″=I″ N ×2ωL N

[0111] Where, I″ N It is the rated double frequency current.

[0112] R1I″′1=U″′

[0113] R2I″′2=U″′

[0114] R3I″′3=U″′

[0115]

[0116] R n I″′ n =U″′

[0117] I″′1+I″′2+I″′3+…+I″′ n =I″′ N

[0118] The envelope DC terminal voltage is:

[0119] U″′=I″′ N ×R N

[0120] Where, I″′ n is the rated DC current, R N is the rated resistance.

[0121] The total current of the i-th envelope is:

[0122]

[0123] Where, I' i , I″ N , I″′ n are the industrial frequency AC, double frequency AC and DC current of envelope i respectively.

[0124] In this embodiment, by establishing an equivalent voltage equation group and a constant temperature rise constraint equation, the equivalent voltage equation group is optimized with the constant temperature rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm inductor after optimization are obtained, thereby realizing the optimization of the bridge arm inductor parameters under AC / DC composite working conditions, and ensuring the applicability of the bridge arm inductor under AC / DC composite working conditions.

[0125] In one embodiment, the isothermal rise constraint equation is:

[0126]

[0127] Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sj is the encapsulation coefficient between the standard encapsulation s and encapsulation j.

[0128] Specifically, for the AC / DC composite working condition, the constant temperature rise constraint equation is modified:

[0129]

[0130] Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sj is the encapsulation coefficient between the standard encapsulation s and encapsulation j.

[0131] Figure 3As shown, R1 and R2 are the radii of the two non-coaxial parallel coils, z1 and z2 are the axial distances between the two coils, H1 and H2 are the heights of the two coils, H0 is the center distance between the two coils, T is the center distance between the two coils, and N1 and N2 are the number of turns of the two coils.

[0132] When the center distance between the two coils is 0, the mutual inductance of two coaxial parallel cylindrical coils is calculated as follows:

[0133]

[0134] in:

[0135]

[0136] H 1e =H0+(H1+H2) / 2

[0137] H 2e =H0+(H1-H2) / 2

[0138] Extracting the number of turns and generalizing it, the mutual inductance of any two solenoids is:

[0139] M ij =n i n j f(D i ,H i ,D j ,H j ,H ij )

[0140] Where n i 、n j 、D i 、D j 、H i 、H j are the number of turns, diameter and height of the i-th and j-th solenoids respectively; H ij is the center distance between the two solenoids (i=1,2,…,n; j=1,2,…,n; i≠j).

[0141] In this embodiment, the constant temperature rise constraint equation is improved for AC / DC combined working conditions, and the equivalent voltage equation group is optimized with the constant temperature rise constraint equation as the optimization target. The structural parameters and each current of the bridge arm inductor after optimization are obtained, thereby realizing the optimization of the bridge arm inductor parameters under AC / DC combined working conditions and ensuring the applicability of the bridge arm inductor under AC / DC combined working conditions.

[0142] In one embodiment, obtaining the encapsulation coefficient between the standard encapsulation and the other encapsulation based on the temperature rise of the standard encapsulation and the other encapsulation includes:

[0143] The quotient of the temperature rise of the standard envelope and the temperature rise of the other envelopes is obtained as the envelope coefficient between the standard envelope and the other envelopes.

[0144] Specifically, based on the isothermal rise method, let the sth package be the standard package, which is the package closest to the average temperature rise of all packages, and define the package coefficient T sj for:

[0145]

[0146] Where, T s 、T j are the temperature rises of envelope s and envelope j respectively (j = 1, 2,…, n; j ≠ s).

[0147] In this embodiment, by obtaining the quotient of the temperature rise of the standard package and the temperature rise of other packages as the package coefficient between the standard package and other packages, it is beneficial to adjust the isothermal constraint equation according to the package coefficient, improve the optimization of the bridge arm inductor parameters, and ensure the applicability of the bridge arm inductor under AC / DC composite working conditions.

[0148] In one embodiment, the structural parameters include at least one of rated voltage, rated DC current, rated power frequency current, double frequency current, rated inductance, inductance manufacturing tolerance, DC resistance, average temperature rise, hot spot temperature rise, rated loss, transportation dimension limit and weight.

[0149] Specifically, the structural parameters of the bridge arm reactor include at least one of rated voltage, rated DC current, rated power frequency current, double frequency current, rated inductance, inductance manufacturing tolerance, DC resistance, average temperature rise, hot spot temperature rise, rated loss, transportation size limit and weight.

[0150] Taking the bridge arm reactor of a converter valve in an 800 kV UHV Flexible DC project as an example, its known structural parameters are shown in Table 1. This series of parameters constitutes the basic constraints for the design calculation.

[0151] Table 1

[0152]

[0153] Optimization achieved a more balanced temperature rise across all packages. Due to computational limitations, it was not possible to achieve a completely equal temperature rise across all packages. After six iterations, the difference between the maximum and minimum average temperature rise across all packages decreased from 2.24K to 1.10K. Since optimization changes the reactor structure, it was necessary to verify that the design parameters met the requirements after optimization, paying particular attention to requirements such as rated inductance and transportable dimensions. Optimization increased the number of turns and decreased the current for packages with higher temperature rises; while it decreased the number of turns and increased the current for packages with lower temperature rises, ultimately achieving a more balanced temperature rise across all packages.

[0154] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0155] Based on the same inventive concept, an embodiment of the present application further provides an arm reactor parameter optimization device for implementing the aforementioned arm reactor parameter optimization method. The solution provided by this device is similar to the solution described in the aforementioned method. Therefore, the specific limitations of one or more arm reactor parameter optimization device embodiments provided below can be found in the limitations of the arm reactor parameter optimization method described above and will not be further elaborated here.

[0156] In one embodiment, Figure 4 As shown, a bridge arm reactor parameter optimization device is provided, including: an acquisition module 401, a calculation module 402 and an optimization module 403, wherein:

[0157] An acquisition module 401 is configured to acquire structural parameters of a bridge arm reactor and calculate the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0158] A calculation module 402 is configured to select a standard package based on the temperature rise of each package, calculate the temperature rise of the standard package and other packages, and calculate the package coefficient between the standard package and other packages;

[0159] The optimization module 403 is used to establish an equivalent voltage equation group and an isothermal rise constraint equation, optimize the equivalent voltage equation group with the isothermal rise constraint equation as the optimization target, and obtain the structural parameters and each current of the bridge arm reactor after the optimization is completed.

[0160] In one embodiment, the calculation module 402 is specifically configured to obtain the temperature rise of each package based on the AC and DC operating conditions of the bridge arm reactor, and to use the package closest to the average temperature rise of each package as the standard package;

[0161] Based on the temperature rise of the standard encapsulation and the other encapsulations, an encapsulation coefficient between the standard encapsulation and the other encapsulations is obtained.

[0162] In one embodiment, the equivalent voltage equations in the optimization module 403 are:

[0163] n1n1f 11 I'1+n1n2f 12 I'2+n1n3f 13 I'3+…+n1n n f 1n I' n =U' / ω

[0164] n2n1f 21 I'1+n2n2f 22 I'2+n2n3f 23 I'3+…+n2n n f 2n I' n =U' / ω

[0165] n3n1f 31 I'1+n3n2f 32 I'2+n3n3f 33 I'3+…+n3n n f 3n I' n =U' / ω

[0166]

[0167] n n n1f n1 I'1+n n n2f n2 I'2+n n n3f n3 I'3+…+n n n n f nn I' n =U' / ω

[0168] I'1+I'2+I'3+…+I' n =I' N

[0169] Among them, n1n n f 1n is the mutual inductance between coil 1 and coil n; I′ n is the power frequency current of the envelope n, U' is the power frequency terminal voltage of the envelope, and ω is the power frequency angular frequency.

[0170] In one embodiment, the constant temperature rise constraint equation in the optimization module 403 is:

[0171]

[0172] Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sj is the encapsulation coefficient between the standard encapsulation s and encapsulation j.

[0173] In one embodiment, the calculation module 402 is specifically configured to obtain a quotient of a temperature rise of a standard enclosure and a temperature rise of other enclosures as an enclosure coefficient between the standard enclosure and the other enclosures.

[0174] In one embodiment, the structural parameters in the acquisition module 401 specifically include at least one of rated voltage, rated DC current, rated power frequency current, double frequency current, rated inductance, inductance manufacturing tolerance, DC resistance, average temperature rise, hot spot temperature rise, rated loss, transportation size limit and weight.

[0175] The above-mentioned bridge arm inductor parameter optimization device obtains the structural parameters of the bridge arm inductor, calculates the temperature rise of each package in the bridge arm inductor based on the structural parameters, selects a standard package according to the temperature rise of each package, calculates the temperature rise of the standard package and the other packages, calculates the package coefficient between the standard package and the other packages, establishes an equivalent voltage equation group and an equal temperature rise constraint equation, optimizes the equivalent voltage equation group with the equal temperature rise constraint equation as the optimization target, obtains the structural parameters and each current of the bridge arm inductor after optimization, realizes the optimization of the bridge arm inductor parameters under AC / DC composite working conditions, and ensures the applicability of the bridge arm inductor under AC / DC composite working conditions.

[0176] Each module in the above-mentioned bridge arm reactor parameter optimization device can be implemented in whole or in part through software, hardware, or a combination thereof. Each module can be embedded in or independent of a processor in a computer device in hardware form, or can be stored in a memory in the computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0177] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 5As shown. The computer device includes a processor, memory, and a network interface connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, a method for optimizing the parameters of a bridge arm reactor is implemented.

[0178] Those skilled in the art will understand that Figure 5 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0179] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented:

[0180] Acquiring structural parameters of a bridge arm reactor, and calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0181] Select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate the encapsulation coefficient between the standard encapsulation and other encapsulations;

[0182] An equivalent voltage equation group and an isothermal rise constraint equation are established, and the equivalent voltage equation group is optimized with the isothermal rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm reactor after the optimization are obtained.

[0183] In one embodiment, when the processor executes the computer program, the processor further implements the following steps: based on the AC and DC operating conditions of the bridge arm reactor, obtaining the temperature rise of each package, and taking the package closest to the average temperature rise of each package as the standard package;

[0184] Based on the temperature rise of the standard encapsulation and the other encapsulations, an encapsulation coefficient between the standard encapsulation and the other encapsulations is obtained.

[0185] In one embodiment, when the processor executes the computer program, the equivalent voltage equations are:

[0186] n1n1f 11 I'1+n1n2f 12 I'2+n1n3f 13 I'3+…+n1nn f 1n I' n =U' / ω

[0187] n2n1f 21 I'1+n2n2f 22 I'2+n2n3f 23 I'3+…+n2n n f 2n I' n =U' / ω

[0188] n3n1f 31 I'1+n3n2f 32 I'2+n3n3f 33 I'3+…+n3n n f 3n I' n =U' / ω

[0189]

[0190] n n n1f n1 I'1+n n n2f n2 I'2+n n n3f n3 I'3+…+n n n n f nn I' n =U' / ω

[0191] I'1+I'2+I'3+…+I' n =I' N

[0192] Among them, n1n n f 1n is the mutual inductance between coil 1 and coil n; I′ n is the power frequency current of the envelope n, U' is the power frequency terminal voltage of the envelope, and ω is the power frequency angular frequency.

[0193] In one embodiment, when the processor executes the computer program, the constant temperature rise constraint equation is:

[0194]

[0195] Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sjis the encapsulation coefficient between the standard encapsulation s and encapsulation j.

[0196] In one embodiment, when the processor executes the computer program, the following steps are further implemented: obtaining the quotient of the temperature rise of the standard enclosure and the temperature rise of other enclosures as the enclosure coefficient between the standard enclosure and other enclosures.

[0197] In one embodiment, when the processor executes the computer program, the structural parameters specifically include at least one of rated voltage, rated DC current, rated power frequency current, double frequency current, rated inductance, inductance manufacturing tolerance, DC resistance, average temperature rise, hot spot temperature rise, rated loss, transportation size limit and weight.

[0198] The above-mentioned computer equipment obtains the structural parameters of the bridge arm inductor, calculates the temperature rise of each package in the bridge arm inductor based on the structural parameters, selects a standard package according to the temperature rise of each package, calculates the temperature rise of the standard package and the other packages, calculates the package coefficient between the standard package and the other packages, establishes an equivalent voltage equation group and an equal temperature rise constraint equation, optimizes the equivalent voltage equation group with the equal temperature rise constraint equation as the optimization target, obtains the structural parameters and each current of the bridge arm inductor after optimization, realizes the optimization of the bridge arm inductor parameters under AC / DC composite working conditions, and ensures the applicability of the bridge arm inductor under AC / DC composite working conditions.

[0199] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0200] Acquiring structural parameters of a bridge arm reactor, and calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0201] Select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate the encapsulation coefficient between the standard encapsulation and other encapsulations;

[0202] An equivalent voltage equation group and an isothermal rise constraint equation are established, and the equivalent voltage equation group is optimized with the isothermal rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm reactor after the optimization are obtained.

[0203] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented: based on the AC and DC operating conditions of the bridge arm reactor, the temperature rise of each package is obtained, and the package closest to the average temperature rise of each package is used as the standard package;

[0204] Based on the temperature rise of the standard encapsulation and the other encapsulations, an encapsulation coefficient between the standard encapsulation and the other encapsulations is obtained.

[0205] In one embodiment, when the computer program is executed by a processor, the equivalent voltage equations are:

[0206] n1n1f 11 I'1+n1n2f 12 I'2+n1n3f 13 I'3+…+n1n n f 1n I' n =U' / ω

[0207] n2n1f 21 I'1+n2n2f 22 I'2+n2n3f 23 I'3+…+n2n n f 2n I' n =U' / ω

[0208] n3n1f 31 I'1+n3n2f 32 I'2+n3n3f 33 I'3+…+n3n n f 3n I' n =U' / ω

[0209]

[0210] n n n1f n1 I'1+n n n2f n2 I'2+n n n3f n3 I'3+…+n n n n f nn I' n =U' / ω

[0211] I'1+I'2+I'3+…+I' n =I' N

[0212] Among them, n1n n f 1n is the mutual inductance between coil 1 and coil n; I′ n is the power frequency current of the envelope n, U' is the power frequency terminal voltage of the envelope, and ω is the power frequency angular frequency.

[0213] In one embodiment, when the computer program is executed by a processor, the constant temperature rise constraint equation is:

[0214]

[0215] Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sj is the encapsulation coefficient between the standard encapsulation s and encapsulation j.

[0216] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented: obtaining the quotient of the temperature rise of the standard enclosure and the temperature rise of other enclosures as the enclosure coefficient between the standard enclosure and other enclosures.

[0217] In one embodiment, when the computer program is executed by a processor, the structural parameters specifically include at least one of rated voltage, rated DC current, rated power frequency current, double frequency current, rated inductance, inductance manufacturing tolerance, DC resistance, average temperature rise, hot spot temperature rise, rated loss, transportation dimension limit and weight.

[0218] The above-mentioned storage medium obtains the structural parameters of the bridge arm inductor, calculates the temperature rise of each package in the bridge arm inductor based on the structural parameters, selects a standard package according to the temperature rise of each package, calculates the temperature rise of the standard package and other packages, calculates the package coefficient between the standard package and other packages, establishes an equivalent voltage equation group and an equal temperature rise constraint equation, optimizes the equivalent voltage equation group with the equal temperature rise constraint equation as the optimization target, obtains the structural parameters and each current of the bridge arm inductor after optimization, realizes the optimization of the bridge arm inductor parameters under AC / DC composite working conditions, and ensures the applicability of the bridge arm inductor under AC / DC composite working conditions.

[0219] In one embodiment, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the following steps:

[0220] Acquiring structural parameters of a bridge arm reactor, and calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters;

[0221] Select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate the encapsulation coefficient between the standard encapsulation and other encapsulations;

[0222] An equivalent voltage equation group and an isothermal rise constraint equation are established, and the equivalent voltage equation group is optimized with the isothermal rise constraint equation as the optimization target, and the structural parameters and each current of the bridge arm reactor after the optimization are obtained.

[0223] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented: based on the AC and DC operating conditions of the bridge arm reactor, the temperature rise of each package is obtained, and the package closest to the average temperature rise of each package is used as the standard package;

[0224] Based on the temperature rise of the standard encapsulation and the other encapsulations, an encapsulation coefficient between the standard encapsulation and the other encapsulations is obtained.

[0225] In one embodiment, when the computer program is executed by a processor, the equivalent voltage equations are:

[0226] n1n1f 11 I'1+n1n2f 12 I'2+n1n3f 13 I'3+…+n1n n f 1n I' n =U' / ω

[0227] n2n1f 21 I'1+n2n2f 22 I'2+n2n3f 23 I'3+…+n2n n f 2n I' n =U' / ω

[0228] n3n1f 31 I'1+n3n2f 32 I'2+n3n3f 33 I'3+…+n3n n f 3n I' n =U' / ω

[0229]

[0230] n n n1f n1 I'1+n n n2f n2 I'2+n n n3f n3 I'3+…+n n n n f nn I' n =U' / ω

[0231] I'1+I'2+I'3+…+I' n =I' N

[0232] Among them, n1n n f 1n is the mutual inductance between coil 1 and coil n; I′ n is the power frequency current of the envelope n, U' is the power frequency terminal voltage of the envelope, and ω is the power frequency angular frequency.

[0233] In one embodiment, when the computer program is executed by a processor, the constant temperature rise constraint equation is:

[0234]

[0235] Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sj is the encapsulation coefficient between the standard encapsulation s and encapsulation j.

[0236] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented: obtaining the quotient of the temperature rise of the standard enclosure and the temperature rise of other enclosures as the enclosure coefficient between the standard enclosure and other enclosures.

[0237] In one embodiment, when the computer program is executed by a processor, the structural parameters specifically include at least one of rated voltage, rated DC current, rated power frequency current, double frequency current, rated inductance, inductance manufacturing tolerance, DC resistance, average temperature rise, hot spot temperature rise, rated loss, transportation dimension limit and weight.

[0238] The above-mentioned computer program product obtains the structural parameters of the bridge arm inductor, calculates the temperature rise of each package in the bridge arm inductor based on the structural parameters, selects a standard package according to the temperature rise of each package, calculates the temperature rise of the standard package and the other packages, calculates the package coefficient between the standard package and the other packages, establishes an equivalent voltage equation group and a constant temperature rise constraint equation, optimizes the equivalent voltage equation group with the constant temperature rise constraint equation as the optimization target, obtains the structural parameters and each current of the bridge arm inductor after optimization, realizes the optimization of the bridge arm inductor parameters under AC / DC composite working conditions, and ensures the applicability of the bridge arm inductor under AC / DC composite working conditions.

[0239] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0240] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processor involved in the various embodiments provided herein may be, but are not limited to, a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic unit, a data processing logic unit based on quantum computing, and the like.

[0241] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0242] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A method for optimizing parameters of a bridge arm reactor, characterized in that: The method comprises: Acquiring structural parameters of a bridge arm reactor, and calculating the temperature rise of each package in the bridge arm reactor based on the structural parameters; Select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate the encapsulation coefficient between the standard encapsulation and other encapsulations; Establishing an equivalent voltage equation group and an isothermal rise constraint equation, optimizing the equivalent voltage equation group with the isothermal rise constraint equation as the optimization target, and obtaining the structural parameters and each secondary current of the bridge arm reactor after the optimization is completed; The step of selecting a standard encapsulation according to the temperature rise of each encapsulation, calculating the temperature rise of the standard encapsulation and other encapsulations, and calculating the encapsulation coefficient between the standard encapsulation and other encapsulations includes: Based on the AC and DC operating conditions of the bridge arm reactor, the temperature rise of each package is obtained, and the package closest to the average temperature rise of all packages is used as the standard package; Obtaining an encapsulation coefficient between the standard encapsulation and the other encapsulation based on the temperature rise of the standard encapsulation and the other encapsulation; The isothermal rise constraint equation is: Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sj is the encapsulation coefficient between the standard encapsulation s and encapsulation j; The obtaining of the encapsulation coefficient between the standard encapsulation and the other encapsulation based on the temperature rise of the standard encapsulation and the other encapsulation includes: The quotient of the temperature rise of the standard envelope and the temperature rise of the other envelopes is obtained as the envelope coefficient between the standard envelope and the other envelopes.

2. The method according to claim 1, characterized in that The equivalent voltage equations are: Among them, n1n n f 1n is the mutual inductance between coil 1 and coil n; I n is the power frequency current of the envelope n, U' is the power frequency terminal voltage of the envelope, and ω is the power frequency angular frequency.

3. The method according to claim 1, characterized in that The structural parameters include at least one of rated voltage, rated DC current, rated power frequency current, double frequency current, rated inductance, inductance manufacturing tolerance, DC resistance, average temperature rise, hot spot temperature rise, rated loss, transportation size limit and weight.

4. A bridge arm reactor parameter optimization device, characterized in that: The device comprises: An acquisition module, configured to acquire structural parameters of a bridge arm reactor, and calculate the temperature rise of each package in the bridge arm reactor based on the structural parameters; A calculation module, configured to select a standard encapsulation according to the temperature rise of each encapsulation, calculate the temperature rise of the standard encapsulation and other encapsulations, and calculate an encapsulation coefficient between the standard encapsulation and other encapsulations; An optimization module is used to establish an equivalent voltage equation group and an isothermal rise constraint equation, optimize the equivalent voltage equation group with the isothermal rise constraint equation as the optimization target, and obtain the structural parameters and each secondary current of the bridge arm reactor after the optimization is completed; The calculation module is specifically used to obtain the temperature rise of each package based on the AC and DC operating conditions of the bridge arm reactor, and take the package closest to the average temperature rise of each package as the standard package; based on the temperature rise of the standard package and the other packages, obtain the package coefficient between the standard package and the other packages; The constant temperature rise constraint equation in the optimization module is: Among them, n s is the number of turns of the package s, I s is the total current of the envelope s, J s is the current density under AC / DC combined working conditions, H s is the height of the envelope s, T sj is the encapsulation coefficient between the standard encapsulation s and encapsulation j; The calculation module is specifically used to obtain the quotient of the temperature rise of the standard encapsulation and the temperature rise of other encapsulations as the encapsulation coefficient between the standard encapsulation and the other encapsulations.

5. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 3 are implemented.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 3 are implemented.

7. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 3 are implemented.

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