Electronic device
By configuring flexible components and space-occupying components between the frame and the substrate, the acoustic characteristics and assembly challenges of far-field microphones are solved, achieving efficient sound recognition and simplified production.
Patent Information
- Application Number
- CN202210351178.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-04-06
- Filing Date
- 2022-04-02
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2042-04-02
AI Technical Summary
In microphones for electronic devices, the acoustic characteristics of far-field microphones are limited by the narrow space inside the frame, which makes the sound holes easy to get blocked during assembly, making it difficult to achieve efficient sound recognition.
An elastic component is installed between the frame and the substrate to fill the gap, and a space-occupying component occupies part of the space to form a reasonable sound hole structure, ensuring that the sound hole size is appropriate and easy to assemble.
It improves the sound collection and recognition rate of electronic devices, simplifies the production process, and avoids the risk of sound hole blockage.
Smart Images

Figure CN115209258B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to an electronic device. BACKGROUND
[0002] Various techniques have been developed for improving sound reception level in an electronic device having a microphone mechanism such as a TV receiver, a tablet, and a portable telephone. For example, an electronic device (portable telephone) having the following configuration is disclosed in Japanese Patent Application Publication No. 2008-193249.
[0003] A plurality of sound receiving holes for picking up sound from the outside are provided in a front housing of the electronic device, and sound guide holes for guiding sound to a microphone provided on a substrate arranged inside the housing are formed in the substrate. Sound entering the housing from the sound receiving holes is guided to the microphone via the sound guide holes. To prevent sound leakage from outside the sound receiving holes, the sound receiving holes around the space between the housing and the substrate are covered with an elastic member (upright wall portion). A hole for guiding sound to the microphone is provided in the elastic member.
[0004] PRIOR ART DOCUMENTS
[0005] PATENT DOCUMENTS
[0006] Patent Document 1: Japanese Patent Application Publication No. 2008-193249 SUMMARY
[0007] Technical Problem to be Solved by the Invention
[0008] Here, for example, in the case of a near-field microphone that picks up sound in the vicinity of the device like a microphone of a portable telephone, the space formed inside the housing can be somewhat wide.
[0009] On the other hand, for example, in the case of a far-field microphone that picks up sound at a distance somewhat apart from the device like a microphone of a TV receiver, the narrower the space formed inside the housing, the better the acoustic characteristics of sound collection. Therefore, the hole provided in the elastic member that covers the space between the housing and the substrate described above is preferably small. However, if the hole of the elastic member is reduced, it is difficult to perform alignment among the hole formed in the elastic member, the sound receiving hole, and the sound guide hole in the production process, and there is a concern that the space serving as a passage for sound can be blocked during assembly.
[0010] In view of the above, an object of the present application is to provide an electronic device with good acoustic characteristics of sound collection.
[0011] Technical Solution to Solve the Technical Problem
[0012] To solve the above-mentioned technical problems, an electronic device according to one aspect of the present invention includes: a frame having a sound receiving hole that guides sound from outside the frame into the frame; a substrate disposed in the frame and having a microphone mounted thereon; an elastic member configured to fill the gap between the inner wall of the frame and the substrate outside the periphery of the sound receiving hole, such that a space is formed between the inner wall of the frame and the substrate around the sound receiving hole; and a space-occupying member (hereinafter also referred to as a first member) configured to occupy a portion of the space.
[0013] Beneficial effects
[0014] According to one aspect of the present invention, the object is to provide an electronic device with good acoustic characteristics that can collect sound. Attached Figure Description
[0015] Figure 1 This is a perspective view and a partial enlarged view showing an example of the appearance of an electronic device (TV receiver) according to an embodiment of the present invention.
[0016] Figure 2 for Figure 1 Rear view of the microphone unit assembly of the electronic device shown.
[0017] Figure 3 for Figure 2 An exploded perspective view of the microphone unit assembly shown.
[0018] Figure 4 for Figure 2 The diagram shows a top-view cross-sectional view of the microphone unit assembly.
[0019] Figure 5 for Figure 4 Enlarged view within the frame.
[0020] Figure 6 for Figure 2 The diagram shows a side cross-sectional view of the microphone unit assembly.
[0021] Figure 7 yes Figure 5 Enlarged view within the frame.
[0022] Figure 8 Viewed from the inside of the frame Figure 2 The diagram shows the microphone unit assembly with the base plate mounted on it.
[0023] Figure 9 It means Figure 7 The diagram shows the deformed examples within the frame.
[0024] Figure 10 It means Figure 7FIG. 1 is a diagram showing the configuration of the microphone unit device according to the present embodiment.
[0025] Figure 11 is a diagram showing the configuration of another modification example within the frame of Figure 7
[0026] Figure 12 is a diagram showing the configuration of another modification example within the frame of Figure 7
[0027] Figure 13 is a diagram showing the configuration of another modification example within the frame of Figure 7
[0028] Figure 14 is a diagram showing an example of a state in which an elastic member is attached to the frame of the microphone unit device shown in Figure 2
[0029] Figure 15 is a diagram showing a state in which an elastic member is attached to the frame of the microphone unit device shown in Figure 2
[0030] Figure 16 is a diagram showing an example of a state in which an elastic member is attached to the frame of the microphone unit device shown in Figure 2
[0031] Figure 17 is a diagram showing an example of a state in which an elastic member is attached to the frame of the microphone unit device shown in Figure 2
[0032] Figure 18 is a diagram showing an example of a state in which an elastic member is attached to the frame of the microphone unit device shown in Figure 2
[0033] Figure 19 is a diagram showing an example of a state in which an elastic member is attached to the frame of the microphone unit device shown in Figure 2
[0034] Figure 20 is a diagram showing an example of a state in which an elastic member is attached to the frame of the microphone unit device shown in Figure 2
[0035] Figure 21 is a diagram showing an example of a state in which an elastic member is attached to the frame of the microphone unit device shown in Figure 2 DETAILED DESCRIPTION
[0036] Hereinafter, one aspect of the present embodiment (hereinafter, also referred to as "the present embodiment") will be described based on the drawings.
[0037] <Embodiment>
[0038] An embodiment of the present application will be described below with reference to the drawings.
[0039] <Configuration of TV receiver>
[0040] Figure 1 is a perspective view showing an example of the appearance of an electronic device (TV receiver) 1 of the present embodiment. As an electronic device to which the present application is applied, in addition to a TV receiver, a tablet computer or the like can be used. A microphone unit device 10 is provided at the bottom of the display screen of the TV receiver 1. Hereinafter, the configuration of the microphone unit device 10 will be described. In addition, in the following description, the side of the display screen of the TV receiver 1 is set as the front side (or the front face), and the opposite side is set as the rear side (or the back face).
[0041] <Configuration of microphone unit device>
[0042] Figure 2 is a rear view of the microphone unit device 10, Figure 3 is an exploded perspective view as viewed from the obliquely front side of the microphone unit device 10. As shown in Figure 3 , the microphone unit device 10 is configured by a frame 11, a substrate 13, and a substrate holder 20, and is assembled by screws S.
[0043] The frame 11 is formed of a material such as polycarbonate, for example, and covers the front side of the microphone unit device 10. At positions substantially equally from the center in the left-right direction of the frame 11, two sound receiving holes 15 that guide sound outside the frame 11 into the frame 11 are formed.
[0044] Two microphones 14 are mounted on the substrate 13. The substrate 13 is configured by a printed circuit board, for example, and various components for configuring the microphone unit device 10 are mounted thereon in addition to the microphones 14. The components are, for example, connectors, resistors, capacitors, and the like.
[0045] The two sound receiving holes 15 and the two microphones 14 provided on the frame 11 are provided at corresponding positions. In addition, an elastic member 12 is disposed in a manner to fill the gap between the inner wall of the frame 11 other than the periphery of the sound receiving hole 15 and the substrate 13, to form a space between the inner wall of the frame 11 at the periphery of the sound receiving hole 15 and the substrate 13.
[0046] As shown in Figure 3 , the substrate holder 20 is disposed at the rear of the substrate 13, and as shown by an arrow d, the substrate holder 20 presses the substrate 13 toward the frame 11 from the rear, whereby the elastic member 12 can be held in a compressed state, and the substrate 13 can be brought into close contact with the frame 11.
[0047] Figure 4 This is a top cross-sectional view of the microphone unit assembly 10 assembled as described above. Figure 4 The lower side touches the front of the TV receiver 1 (and microphone unit 10), while the upper side touches the rear of the TV receiver 1.
[0048] also, Figure 5 yes Figure 4 The enlarged view within the frame shows the periphery of one of the two microphones 14 mounted on the microphone unit device 10. Figure 6 It is a side cross-sectional view of the microphone unit device 10 including the microphone 14 on the cut surface, and Figure 6 The right side of the device is in contact with the front of TV receiver 1, and the left side is in contact with the rear of TV receiver 1.
[0049] also, Figure 7 yes Figure 5 A magnified view of the area within the box. However, in Figure 7 In the middle, the up and down directions are the same as Figure 5 On the contrary, Figure 7 The upper part touches the front of the TV receiver 1 (or microphone unit 10), and the lower part touches the rear of the TV receiver 1. In the following text, reference will be made to... Figure 7 The configuration around the sound receiving hole 15 of the microphone unit device 10 according to the embodiment will be described in detail.
[0050] As described above, the front surface of the microphone unit assembly 10 is covered by the frame 11, and external sound is guided into the interior of the frame 11 through the sound receiving hole 15 provided on the frame 11. Furthermore, a space-occupying member 16, configured as part of the occupied space, is disposed within the frame 11. Hereinafter, the space-occupying member will also be referred to as the first member. Figure 7 As shown, the first component 16 can also be formed to protrude from the inner wall of the frame 11 toward the space.
[0051] A microphone 14 is mounted on a substrate 13 disposed inside the frame 11. In this embodiment, the microphone 14 is disposed on the surface of the substrate 13 opposite to the space. A sound guide hole 17 is formed on the substrate 13, extending from the space side surface of the substrate 13 to the microphone side surface.
[0052] Furthermore, the elastic member 12 is configured to fill the gap between the inner wall of the frame 11 and the substrate 13 outside the periphery of the sound receiving hole 15, thereby forming a space between the inner wall of the frame 11 and the substrate 13 around the sound receiving hole 15.
[0053] The elastic component 12 is formed of an elastic cushioning material such as rubber, polyurethane, or foamed polyurethane, filling the gap between the substrate 13 and the frame (front cover) 11, ensuring tight contact between the substrate 13 and the frame 11, and preventing sound from entering from the frame 11 except through the sound-receiving hole 15. Figure 7 As shown, in the elastic member 12, a hole 19 is provided in the portion connecting the sound receiving hole 15 and the sound guiding hole 17. The sound guided from the sound receiving hole 15 into the interior of the frame 11 is guided to the microphone 14 through the hole 19 and the sound guiding hole 17 of the elastic member 12. Double-sided adhesive tape is provided between the elastic member 12 and the substrate 13 as a fixing unit.
[0054] The elastic component 12 is fixed to the substrate 13 by double-sided tape. The substrate 13 overlaps the elastic component 12. The elastic component 12 and the substrate 13 are sandwiched between the frame 11 and the substrate holder 20. The frame 11 and the substrate holder 20 are fixed by fastening the fixing screws S.
[0055] The sound hole in the entire microphone unit device 10 is a sound channel formed between the sound receiving hole 15 in the frame 11 and the sound guiding hole 17 in the substrate 13, and is formed by the space of the sound receiving hole 15 in the frame 11, the space of the sound guiding hole 17 in the substrate 13 and the space of the hole 19 in the elastic member 12.
[0056] With this configuration, sound enters the aperture 19 through the receiving aperture 15. At this time, the entire aperture functions as a resonant space, and the sound enters the microphone 14 through the sound guide aperture 17 of the substrate 13. The microphone 14 converts the input sound into an electrical signal, thereby obtaining an electrical signal with a level corresponding to the converted sound.
[0057] The important thing here is the size (volume) of the entire sound hole. For example, in order to achieve hands-free voice recognition through TV receiver 1, a far-field microphone is needed to pick up sound from a distance. However, in this case, a smaller sound hole in the microphone unit device 10 results in better sound collection characteristics and a higher sound recognition rate.
[0058] Therefore, the hole 19 formed in the elastic member 12 is preferably small. However, since the elastic member 12 is made of a different material than the substrate 13 and the frame 11, it needs to be mounted to the substrate 13 and the frame 11 during the manufacturing process. Therefore, to avoid the risk of blocking the sound hole during assembly, it is preferable to enlarge the hole 19 of the elastic member 12 as much as possible. However, as mentioned above, when the volume of the sound hole is small, the acoustic characteristics of sound collection are good and the sound recognition rate is improved. Therefore, by providing the first member 16 inside the frame 11, the part surrounding the sound hole is double-layered. By reducing the overall volume of the sound hole, the sound receiving characteristics can be improved, resulting in a good sound recognition rate.
[0059] in addition, Figure 8A diagram showing a state in which the substrate 13 is attached to the frame 11 as viewed from the inside of the frame. When assembled, alignment of the sound receiving hole 15 and the hole 19 of the elastic member 12 is required to avoid blocking the sound hole. Therefore, as shown in Figure 8 the frame 11 is formed with a positioning rib 21, and a hole for positioning is provided at a corresponding position of the elastic member 12, so that the frame 11 and the elastic member 12 are correctly positioned, and deformation of the elastic member 12 in the lateral direction is prevented.
[0060] 〔Modified Embodiment〕
[0061] The configuration of the embodiment described above is an example of the present application, and the configuration of the sound receiving hole 15 of the electronic device 1 of the present application is also considered in modified embodiments in addition to the structure of the above-described embodiment. In the following Figures 9 to 13 , diagrams showing modified examples of the configuration shown in Figure 7 are shown. Hereinafter, the configurations of these modified examples are described.
[0062] 〔Modified Embodiment 1〕
[0063] In the embodiment, a configuration example in which the first member 16 is formed to protrude toward the space from the inner wall of the frame 11 is described. However, the first member can also be formed to protrude toward the space from the substrate 13. For example, as shown in Figure 9 , the first member 161 can also be provided integrally with the substrate 13.
[0064] According to the above configuration, when the first member 161 is designed to be changed, the mold of the frame 11 does not need to be changed, and the manufacturing process can be simplified.
[0065] 〔Modified Embodiment 2〕
[0066] The first member can also protrude toward the space from both the frame 11 side and the substrate 13 side. For example, as shown in Figure 10 , the first member 162 can be formed to protrude toward the space from the frame 11 side, and the first member 161 can be formed to protrude toward the space from the substrate 13 side.
[0067] According to the above configuration, the first members 161 and 162 protrude toward the space from both the frame 11 and the substrate 13, so that the volume of the entire space can be further reduced, and the sound collecting sound characteristics can be improved.
[0068] 〔Modified Embodiment 3〕
[0069] In addition, the microphone unit device 10 can include a space occupying member (also referred to as a second member) 163 configured to occupy a portion of the sound receiving hole 15. For example, as shown in Figure 11As shown, a plurality of sound receiving holes can be formed in the frame 11 by the second member 163 protruding toward the space from the frame 11 side. Here, the "second member" is one of the variants of the "space occupying member".
[0070] According to the above configuration, by providing the second member 163, the volume of the entire space can be further reduced, and the sound collection acoustic characteristics can be improved.
[0071] [Variant 4]
[0072] Further, in the microphone unit device 10, the first member 164 can be disposed on the space side of the substrate 13. For example, as shown, Figure 12 the first member 164 can be disposed on the substrate 13. The first member 164 can be, for example, a component of the microphone unit device 10 mounted on the substrate 13. Further, the disposition position, shape, size, etc. of the first member 164 can be arbitrary.
[0073] According to the above configuration, the first member 164, in which the frame 11 and the substrate 13 are separate components, can be disposed on the substrate 13, and thus the shape, size, disposition position of the first member 164 can be freely designed.
[0074] [Variant 5]
[0075] Further, in the microphone unit device 10, as shown, Figure 13 the microphone 14 can be disposed on the space side of the substrate 13.
[0076] According to the above configuration, since the microphone 14 itself occupies the space and reduces the volume of the space, by being combined with the first member 162, the sound collection acoustic effect can be improved. Further, since it is not necessary to form sound guide holes in the substrate 13, the manufacturing process can be simplified.
[0077] Further, the microphone unit device 10, based on the microphone 14 being disposed on the space side of the substrate 13, can also dispose the first member, in which the microphone 14, the frame 11, and the substrate 13 are separate components, on the empty portion on the space side of the substrate 13 as the microphone 14. Further, the first member can be attached using double-sided tape or an adhesive on the area on the side opposite to the side of the face of the microphone 14 that contacts the substrate 13, i.e. the area to the extent that the sound receiving performance of the microphone 14 does not decrease. According to such a configuration, the volume of the space can be reduced by the first member disposed on the space side of the microphone 14 and the substrate, and thus the sound collection acoustic effect can be improved.
[0078] Further, the microphone unit device 10 can be provided with the first member 162 protruding from the frame 11 as illustrated, on the basis of the first member in which the microphone 14, the frame 11, and the substrate 13 can each be a separate component being arranged on the space side of the substrate 13. Figure 13 According to such a configuration, the volume of the space can be reduced by the microphone 14, the first member 162 protruding from the frame 11, and the first member in which the microphone 14, the frame 11, and the substrate 13 can each be a separate component, and the sound collecting effect can be further improved.
[0079] Figures 14 to 21 is a view of the state in which the elastic member 12 is attached to the frame 11, as viewed from the back side of the microphone unit device 10 (i.e., the inside of the frame 11). Hereinafter, the configuration of the various modifications will be described from other angles. Figures 14 to 21
[0080] [Modification 6]
[0081] In Modification 6, as illustrated in Figure 14 , the first member 16 can be ring-shaped and surround the entire periphery of the sound receiving hole 15 when viewed in cross section. The inner diameter of the first member 16 can also be the same as the outer diameter of the sound receiving hole 15. That is, Figure 14 corresponds to the cross-sectional view of Figure 7 .
[0082] According to the above-described configuration, the volume of the first member 16 can be increased, and the sound collecting effect can be improved.
[0083] [Modification 7]
[0084] In Modification 7, as illustrated in Figure 15 , the first member 16 can be ring-shaped and surround the entire periphery of the sound receiving hole 15 when viewed in cross section. The inner diameter of the first member 16 can also be larger than the outer diameter of the sound receiving hole 15.
[0085] According to the above-described configuration, in the case where the sound receiving hole 15 is drilled in the frame 11 from the back side using a drill, the operability can be improved.
[0086] [Modification 8]
[0087] In Modification 8, the first member 16 can be arranged so as to surround a portion of the sound receiving hole 15. For example, as illustrated in Figure 16 , two first members 16 can be arranged in a crescent shape so as not to surround the entire periphery of the sound receiving hole 15, but rather so that the two first members 16 surround the sound receiving hole 15 only in the lateral direction of Figure 16 .
[0088] Based on the above configuration, the first component 16 can be appropriately positioned even when there is insufficient space in the longitudinal direction. Furthermore, if the first component 16 is positioned away from the sound receiving hole 15, operability can be improved when drilling the sound receiving hole 15 from the rear using a drilling machine on the frame 11.
[0089] [Variation Example 9]
[0090] In the embodiments and variations described, examples where the space and the outer edge of the first component 16 are annular were described. However, in the microphone unit device 10 of the present invention, the space may have a polygonal shape when viewed from the normal direction of the frame 11, and the outer edge of the first component 16 may have a polygonal shape when viewed from the normal direction of the frame 11. For example, as Figure 17 and 18 As shown, the space and the outer edge of the first component 16 can also be rectangular. Additionally, as... Figure 18 As shown, the first component 16 can also be configured to surround the sound receiving hole 15 only in the lateral direction.
[0091] Based on the above configuration, by making the first component 16 a polygon, the volume of the first component 16 can be increased. As a result, the volume of space can be reduced, and the sound collection effect can be improved.
[0092] [Variation Example 10]
[0093] In variation 10, it can also be as follows: Figure 19 As shown, a plurality of sound receiving holes 15 are provided on the frame 11, and holes are formed at positions corresponding to the sound receiving holes 15. In addition, the aforementioned holes are holes opened in the first component 16, and divide the inner edge of the first component 16.
[0094] Based on the above configuration, the area of the space can be relatively reduced, and the acoustic characteristics of the sound collection can be improved.
[0095] [Variation Example 11]
[0096] In variation 11, such as Figure 20 As shown, multiple sound receiving holes 15 can also be provided in the frame 11, and the first component 16 is annular, with the inner edge of the first component 16 located outside the outer edge of the sound receiving hole 15.
[0097] Based on the above configuration, the area of the space can be relatively reduced, and the acoustic characteristics of the sound collection can be improved. Drilling the sound receiving hole 15 from the rear of the frame 11 with a drilling machine improves operability.
[0098] [Variation Example 12]
[0099] In the present embodiment, it can be configured to include: a housing formed with a first sound receiving hole group and a second sound receiving hole group that introduce sound from outside the housing into the housing; a substrate disposed inside the housing and having a first microphone that receives sound from the first sound receiving hole group and a second microphone that receives sound from the second sound receiving hole group; a first elastic member configured to fill a gap between an inner wall of the housing other than the periphery of the first sound receiving hole group and the substrate to form a first space between the inner wall of the housing and the substrate at the periphery of the first sound receiving hole group; a second elastic member configured to fill a gap between an inner wall of the housing other than the periphery of the second sound receiving hole group and the substrate to form a second space between the inner wall of the housing and the substrate at the periphery of the second sound receiving hole group; a third member configured to occupy a portion of the first space; and a fourth member configured to occupy a portion of the second space, any one of the configuration positions, shapes, volumes of the first and second spaces, and the number of sound receiving holes included in the first and second sound receiving hole groups of the third and fourth members being different. For example, as shown in FIG. 8, the third member 16 can be increased at the periphery of the left first microphone 14, and the fourth member 16 can be decreased at the periphery of the right second microphone 14. Alternatively, the third member 16 can not be provided at the periphery of the first microphone 14, and only the fourth member 16 can be provided at the periphery of the second microphone 14. In addition, the third and fourth members are each one of variations of a space occupying member. According to the above configuration, it is possible to pick up near-field sound with one microphone and to pick up far-field sound with the other microphone. Therefore, it is possible to correspond to sound of both the near field and the far field. Figure 21
[0100] 〔Manufacturing method〕
[0101] Next, an example of a manufacturing method of the microphone unit device 10 will be described. The manufacturing method of the microphone unit device 10 includes a molding process, a substrate molding process, and an assembly process.
[0102] (a) Molding process
[0103] The housing 11 and the substrate holder 20 are molded in advance. The elastic member 12 is processed into a predetermined shape.
[0104] (b) Substrate molding process
[0105] The substrate 13 is formed, and the microphone 14 and other constituent members are mounted on the substrate 13.
[0106] (c) Assembly process
[0107] A double-sided adhesive tape is attached to the face surrounded by the protruding portion of the elastic member 12. The elastic member 12 is placed on the base plate 13, the base plate holder 20 is placed and covered on the base plate 13, and the frame 11 is embedded. At this time, the hole provided in the base plate 13 is inserted into the positioning rib 21 provided on the frame 11 side.
[0108] Thus, the position deviation of the sound guide hole 17 of the base plate 13 and the sound receiving hole 15 of the frame 11 can be prevented.
[0109] Further, by embedding the base plate holder 20 into the claw portion provided in the frame 11, the base plate 13 can be pressed and fixed from the back direction. The base plate holder 20 and the frame 11 are fixed by the fixing screw S, and the assembly process is completed.
[0110] The assembly is a manual work, and if the hole 19 of the elastic member 12 is too small, the position deviation occurs between the sound receiving hole 15 of the frame 11, the sound guide hole 17 of the base plate 13, and the hole 19 of the elastic member 12 at the time of assembly due to the deviation caused by the difference of the operators, the deviation at the time of work, the deviation of the size of the hole 19 of the elastic member 12, etc., and the sound passage is blocked, the sound does not enter the microphone 14, and the risk of not recognizing the sound occurs.
[0111] However, according to the present application, the hole 19 of the elastic member 12 can be made larger to some extent, and thus, if the above manufacturing method is used, even if the assembly process is a manual work, the mass production of the microphone unit device without the defective condition can be achieved.
[0112] [Summary] [Mode 1]
[0113] The electronic device of one embodiment of the present application includes a frame including a sound receiving hole that guides sound outside the frame into the frame; a substrate disposed in the frame and including a microphone; an elastic member disposed to fill a gap between an inner wall of the frame other than around the sound receiving hole and the substrate, so that a space is formed between the inner wall of the frame around the sound receiving hole and the substrate; and a first member disposed to occupy a part of the space.
[0114] According to the above configuration, the volume of the space is reduced by the first member disposed to occupy a part of the space, so that the acoustic characteristics of the device can be improved. Further, since the volume of the space can be reduced by the first member, the hole formed in the sound receiving hole and the elastic member does not need to be reduced in size, and thus, the position alignment between the holes can be easily performed in the production process.
[0115] [Mode 2]
[0116] The electronic device of one embodiment of the present application can be configured such that the first member is formed to protrude from an inner wall of the frame toward the space.
[0117] According to the above configuration, since the first member can be integrally formed with the frame, the production cost of the electronic device can be reduced.
[0118] [Mode 3]
[0119] The electronic device of one embodiment of the present application can be configured such that the first member is annular, and the inner diameter of the first member is the same as the outer diameter of the sound receiving hole.
[0120] According to the above configuration, the volume of the first member can be increased, and the sound collection effect can be improved.
[0121] [Mode 4]
[0122] The electronic device of one embodiment of the present application can be configured such that the first member is annular, and the inner diameter of the first member is larger than the outer diameter of the sound receiving hole.
[0123] According to the above configuration, in the case where the sound receiving hole is drilled from the back with a drill, the operability can be improved.
[0124] [Mode 5]
[0125] The electronic device of one embodiment of the present application can be configured such that the first member is arranged so as to surround a part of the sound receiving hole.
[0126] According to the above configuration, in the case where the sound receiving hole is drilled from the back with a drill, the operability can be improved.
[0127] [Mode 6]
[0128] The electronic device of one embodiment of the present application can be configured such that the space has a polygonal shape when viewed from the normal direction of the frame, and the outer edge of the first member has a polygonal shape when viewed from the normal direction of the frame.
[0129] According to the above configuration, by making the first member polygonal, the volume of the first member can be increased. As a result, the volume of the space can be reduced, and the sound collection effect can be improved.
[0130] [Mode 7]
[0131] The electronic device of one embodiment of the present application can be configured such that a plurality of sound receiving holes are provided in the frame, and holes are formed in the first member at positions corresponding to the sound receiving holes.
[0132] According to the above configuration, the area of the space can be relatively reduced.
[0133] [Mode 8]
[0134] The electronic device of one embodiment of the present application can be configured such that a plurality of sound receiving holes are provided in the housing, the first member is ring-shaped, and the inner edge of the first member is positioned outside the outer edge of the sound receiving hole.
[0135] According to the above configuration, the area of the space can be relatively reduced.
[0136] [Mode 9]
[0137] The electronic device of one embodiment of the present application can be configured to include a second member which is positioned so as to occupy a part of the sound receiving hole.
[0138] According to the above configuration, by including the second member, the volume of the entire space can be further reduced, and the sound collection acoustic characteristics can be improved.
[0139] [Mode 10]
[0140] The electronic device of one embodiment of the present application can be configured such that the first member is positioned on the space side of the substrate.
[0141] According to the above configuration, the first member can be formed as a separate component from the housing and the substrate, and thus the position, shape, size, and the like of the first member can be freely designed. In addition, since the housing and the substrate are modified in addition to the design change of the first member, the manufacturing process can be simplified.
[0142] [Mode 11]
[0143] The electronic device of one embodiment of the present application can be configured such that the first member is formed to protrude from the substrate toward the space.
[0144] According to the above configuration, since the first member can be integrally formed with the substrate, the production cost of the electronic device can be reduced.
[0145] [Mode 12]
[0146] To solve the above problem, in the electronic device of one embodiment of the present application, a microphone is positioned on the side of the substrate opposite to the space, and a plurality of sound guide holes are formed in the substrate from the side of the space to the side of the microphone.
[0147] According to the above configuration, the microphone 14 and other components can be mounted on the same side of the substrate, and thus by not mounting any components on the space side of the substrate 13, the side of the substrate 13 can be flat and in close contact with the inner side of the housing 11 with a minimum distance and without a gap, the volume of the space can be reduced, and the sound collection acoustic characteristics can be improved.
[0148] [Mode 13]
[0149] To solve the above problem, in an electronic device of one embodiment of the present application, the microphone is arranged on the space side of the substrate.
[0150] According to the above configuration, it is not necessary to form a sound guide hole in the substrate, and thus the production process can be simplified.
[0151] [Mode 14]
[0152] In an electronic device of one embodiment of the present application, there are provided: a housing which is provided with a first sound receiving hole group and a second sound receiving hole group that guide sound from outside the housing into the housing; a substrate which is arranged in the housing and is provided with a first microphone that receives sound from the first sound receiving hole group and a second microphone that receives sound from the second sound receiving hole group; a first elastic member which is arranged to fill a gap between an inner wall of the housing other than around the first sound receiving hole group and the substrate, so that a first space is formed between the inner wall of the housing around the first sound receiving hole group and the substrate; a second elastic member which is arranged to fill a gap between an inner wall of the housing other than around the second sound receiving hole group and the substrate, so that a second space is formed between the inner wall of the housing around the second sound receiving hole group and the substrate; a third member which is arranged to occupy a part of the first space; and a fourth member which is arranged to occupy a part of the second space, in which any one of the arrangement positions, shapes, volumes of the first space and the second space, and the number of sound receiving holes included in the first sound receiving hole group and the second sound receiving hole group of the third member and the fourth member are different.
[0153] According to the above configuration, by changing the configuration of the periphery of the two microphones, the sound collection sound characteristic can be improved even for sound close to the electronic device and sound far from the electronic device.
[0154] [Mode 15]
[0155] A TV receiver of one embodiment of the present application includes: a housing which is provided with a sound receiving hole that guides sound from outside the housing into the housing; a substrate which is arranged in the housing and is provided with a microphone; an elastic member which is arranged to fill a gap between an inner wall of the housing other than around the sound receiving hole and the substrate, so that a space is formed between the inner wall of the housing around the sound receiving hole and the substrate; and a first member which is arranged to occupy a part of the space.
[0156] According to the above configuration, the same effect as the electronic device is obtained.
[0157] The present application is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining the technical means disclosed in the different embodiments respectively are also included in the technical scope of the present application.
[0158] Explanation of Reference Signs
[0159] 1: TV receiver (electronic device)
[0160] 10: Microphone unit device
[0161] 11: Frame
[0162] 12: Elastic member
[0163] 13: Substrate
[0164] 14: Microphone
[0165] 15: Sound-receiving hole
[0166] 16, 161, 162, 163, 164: Space-occupying member
[0167] 17: Sound-guiding hole
[0168] 19: Hole (of elastic member)
[0169] 20: Substrate holder
[0170] 21: Positioning rib
Claims
1. An electronic device, characterized in that, It possesses: A frame having an annular sound-receiving hole that guides sound from outside the frame into the frame. A substrate, which is disposed within the frame and has a microphone mounted thereon; An elastic member configured to fill the gap between the inner wall of the frame and the substrate outside the periphery of the sound receiving hole, thereby forming a space between the inner wall of the frame and the substrate around the sound receiving hole; and The first component is configured to occupy a portion of the space. The sound receiving hole is located directly above the microphone. The elastic member has an annular hole, and the inner diameter of the hole in the elastic member is larger than the inner diameter of the sound receiving hole. The first component is located outside the sound receiving hole and inside the elastic component. The frame has ribs, which are used to position the elastic component.
2. The electronic device according to claim 1, characterized in that, The first component is formed to protrude from the inner wall of the frame toward the space.
3. The electronic device according to claim 1 or 2, characterized in that, The first component is ring-shaped. The inner diameter of the first component is the same as the outer diameter of the sound receiving hole.
4. The electronic device according to claim 1 or 2, characterized in that, The first component is ring-shaped. The inner diameter of the first component is larger than the outer diameter of the sound receiving hole.
5. The electronic device according to claim 1 or 2, characterized in that, The first component is configured to surround a portion of the sound receiving hole.
6. The electronic device according to claim 1 or 2, characterized in that, The space has a polygonal shape when viewed from the normal direction of the frame. When viewed from the normal direction of the frame, the outer edge of the first component has a polygonal shape.
7. The electronic device according to claim 1 or 2, characterized in that, The frame is provided with multiple sound receiving holes. On the first component, holes are formed at positions corresponding to each of the sound receiving holes.
8. The electronic device according to claim 1 or 2, characterized in that, The frame is provided with multiple sound receiving holes. The first component is ring-shaped. The inner edge of the first component is located outside the outer edge of the sound receiving hole.
9. The electronic device according to any one of claims 1 to 8, characterized in that, It has a second component that is configured to occupy a portion of the sound receiving hole.
10. The electronic device according to any one of claims 1 to 9, characterized in that, The first component is disposed on the space side of the substrate.
11. The electronic device according to any one of claims 1 to 9, characterized in that, The first component is formed to protrude from the substrate into the space.
12. The electronic device according to any one of claims 1 to 11, characterized in that, The microphone is disposed on the surface of the substrate opposite to the space. A sound guide hole is formed on the substrate, extending from the spatial side of the substrate to the microphone side.
13. The electronic device according to any one of claims 1 to 10, characterized in that, The microphone is disposed on the spatial side of the substrate.
14. An electronic device, characterized in that, It possesses: A frame having a first group of sound receiving holes and a second group of sound receiving holes for guiding sound from outside the frame into the frame; A substrate, disposed within the frame, is equipped with a first microphone for receiving sound from the first group of sound receiving holes and a second microphone for receiving sound from the second group of sound receiving holes; A first elastic member is configured to fill the gap between the inner wall of the frame and the substrate outside the periphery of the first sound receiving hole group, so as to form a first space between the inner wall of the frame and the substrate around the first sound receiving hole group. The second elastic member is configured to fill the gap between the inner wall of the frame and the substrate outside the periphery of the second sound receiving hole group, so as to form a second space between the inner wall of the frame and the substrate around the second sound receiving hole group. A third component, configured to occupy a portion of the first space; as well as The fourth component, configured to occupy a portion of the second space, The third component and the fourth component differ in any of the following: their configuration position and shape; the volume of the first space and the second space; and the number of sound holes contained in the first sound hole group and the second sound hole group.
15. A television receiver, characterized in that, include: A frame having a first group of sound receiving holes and a second group of sound receiving holes for guiding sound from outside the frame into the frame; A substrate, disposed within the frame, is equipped with a first microphone for receiving sound from the first group of sound receiving holes and a second microphone for receiving sound from the second group of sound receiving holes; A first elastic member is configured to fill the gap between the inner wall of the frame and the substrate outside the periphery of the first sound receiving hole group, so as to form a first space between the inner wall of the frame and the substrate around the first sound receiving hole group. The second elastic member is configured to fill the gap between the inner wall of the frame and the substrate outside the periphery of the second sound receiving hole group, so as to form a second space between the inner wall of the frame and the substrate around the second sound receiving hole group. A third component, configured to occupy a portion of the first space; as well as The fourth component, configured to occupy a portion of the second space, The third component and the fourth component differ in any of the following: their configuration position and shape; the volume of the first space and the second space; and the number of sound holes contained in the first sound hole group and the second sound hole group.
Citation Information
Patent Citations
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