A heat dissipation duct structure and power grid simulator
By designing a heat dissipation air duct structure, the airflow on the air outlet side of the power module is drained to the air inlet side of the electrical device, the problem of poor heat dissipation effect of the power unit in the power grid simulator is solved, effective heat dissipation of the electrical devices is achieved, and overall heat dissipation effect is improved.
Patent Information
- Application Number
- CN202210830889.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-07-15
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2042-07-15
AI Technical Summary
The heat dissipation effect of the power unit in the power grid simulator is poor, especially when the power is higher than 5MW, the existing heat dissipation structure is difficult to effectively dissipate heat, which makes it difficult to control the temperature rise of the electrical devices.
A heat dissipation air duct structure is designed. By separating the air duct cavity into an air inlet cavity and an air exhaust cavity, and setting a ventilation port on the air duct baffle, the air flow on the air outlet side of the power module is drained to the air inlet side of the electrical device, thereby achieving further heat dissipation of the electrical device.
Through this heat dissipation air duct structure, the airflow can be effectively drained to the electrical device, which improves the heat dissipation effect of the electrical device, avoids the situation where temperature rise is difficult to control, and thus improves the heat dissipation effect of the power unit.
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Figure CN115209701B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of module heat dissipation, and more specifically to a heat dissipation duct structure and a power grid simulator. Background Art
[0002] As a new product in the wind power business field, the grid simulator does not have a mature product structure. There are still few high-power grid simulator products above 5MW on the market, and the heat dissipation solution is unclear. At present, the heat dissipation solution below 5MW is that the power modules on both sides (for example, the bridge-side and grid-side power modules) share a single heat pipe radiator. After passing through the radiator, the hot air flows through the electrical devices (for example, reactors) that match the power module for cooling. The electrical devices that match the power module do not have clear heat dissipation ducts, which makes it difficult to control the temperature rise of these electrical devices. Especially when the power of the grid simulator is higher than 5MW, due to excessive heat loss, the heat dissipation effect will be worse if the existing heat dissipation structure is used to dissipate the electrical components of the power unit.
[0003] In summary, how to solve the problem of poor heat dissipation of power units in power grid simulators has become an urgent problem to be solved by those skilled in the art. Summary of the invention
[0004] In view of this, the present invention provides a heat dissipation duct structure and a power grid simulator to solve the problem of poor heat dissipation effect of the power unit in the power grid simulator.
[0005] To achieve the above object, the present invention provides the following technical solutions:
[0006] A heat dissipation duct structure is used to dissipate heat for a power unit, wherein the power unit includes a power module and an electrical device matching the power module, and the heat dissipation duct structure includes:
[0007] An air duct cavity having an air inlet and an air outlet;
[0008] an air duct baffle, disposed in the air duct cavity, and dividing the air duct cavity into an air inlet cavity communicated with the air inlet and an air exhaust cavity communicated with the air outlet;
[0009] The power module is installed in the air inlet cavity, the electrical device is installed in the air exhaust cavity, and the air duct baffle is provided with a vent for guiding the airflow on the air outlet side of the power module to the air inlet side of the electrical device.
[0010] Optionally, the power module includes a module frame, a power module installed in the module frame and a heat sink, a module air duct is formed in the module frame, the heat sink is located on the air inlet side of the module air duct, and the air outlet side of the module air duct is arranged opposite to the vent.
[0011] Optionally, the power module includes a first power module and a second power module distributed left and right in the module frame, and the heat sink includes a first heat sink for dissipating heat for the first power module and a second heat sink for dissipating heat for the second power module.
[0012] Optionally, the first radiator and the second radiator are arranged in parallel on the air inlet side.
[0013] Optionally, the first radiator and the second radiator are radiators with the same structure and shape, and are symmetrically distributed on both sides;
[0014] Or, the first radiator and the second radiator are both skived-tooth radiators, and the tooth heights of the two are distributed differently;
[0015] Alternatively, the first radiator and the second radiator are a combination of radiators with two different structural shapes.
[0016] Optionally, one of the first power module and the second power module is a grid-side power module, and the other is a bridge-side power module.
[0017] Optionally, both the first power module and the second power module can be extended and expanded along the height direction within the module frame.
[0018] Optionally, an exhaust fan is provided at a position of the exhaust cavity corresponding to the air outlet; or, an inlet fan is provided at a position of the air inlet cavity corresponding to the air inlet.
[0019] Optionally, the electrical device is arranged with an insulating air duct enclosure along the circumferential direction of the ventilation opening, and the inlet end of the insulating air duct enclosure is opposite to the ventilation opening.
[0020] Optionally, a mounting shelf for mounting and placing the electrical components is also provided in the exhaust cavity.
[0021] Optionally, the ventilation openings are arranged in a one-to-one correspondence with the power units, and the ventilation openings are adapted to the air outlet ports of the power modules and the air inlet ports of the electrical devices.
[0022] Optionally, the air inlet cavity has multiple layers of supporting structures distributed sequentially from bottom to top, and each layer of the supporting structure is provided with multiple power modules.
[0023] Compared with the background technology introduction, the above-mentioned heat dissipation duct structure is used to dissipate heat for the power unit. The power unit includes a power module and electrical devices matching the power module. The heat dissipation duct structure includes a duct cavity and a duct baffle, wherein the duct cavity has an air inlet and an air outlet; the duct baffle is arranged in the duct cavity, and divides the duct cavity into an air inlet cavity connected to the air inlet and an exhaust cavity connected to the air outlet; the power module is installed in the air inlet cavity, the electrical devices are installed in the exhaust cavity, and the duct baffle is provided with a vent for guiding the airflow on the outlet side of the power module to the air inlet side of the electrical devices. The heat dissipation duct structure divides the duct cavity into an air inlet cavity and an air exhaust cavity by means of an air duct baffle, and the air duct baffle is provided with a vent for guiding the airflow on the air outlet side of the power module to the air inlet side of the electrical device. Therefore, in actual application, the airflow can enter the air inlet cavity from the air inlet, and then the heat exchange airflow flowing through the power module is guided to the electrical devices matching the power module through the vent, so as to further dissipate the heat of these electrical devices and finally be discharged through the air outlet on the exhaust cavity. Then, the hot airflow of the electrical devices located in the exhaust cavity can be discharged in time, so as to avoid the situation where the temperature rise of the electrical devices is difficult to control, thereby helping to improve the heat dissipation effect of the power unit.
[0024] In addition, the present invention also provides a power grid simulator, including a heat dissipation duct structure, which is the heat dissipation duct structure described in any of the above schemes. Since the heat dissipation duct structure has the above technical effects, the power grid simulator having the heat dissipation duct structure should also have corresponding technical effects, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0026] Figure 1 A schematic cross-sectional view of a heat dissipation duct structure provided in an embodiment of the present invention (arrows in the figure represent the direction of airflow);
[0027] Figure 2 A schematic diagram of the external structure of a power unit provided in an embodiment of the present invention;
[0028] Figure 3 A schematic diagram of the front structure of a power unit provided in an embodiment of the present invention;
[0029] Figure 4 A schematic diagram of the side structure of a power unit provided in an embodiment of the present invention;
[0030] Figure 5 A schematic diagram of the module air duct structure of a power unit provided in an embodiment of the present invention (the arrows in the figure represent the direction of air flow);
[0031] Figure 6 A schematic diagram of a structure in which a power module provided by an embodiment of the present invention is installed on supporting structures arranged sequentially from bottom to top in an air inlet cavity;
[0032] Figure 7 A schematic diagram of a structure in which a first radiator and a second radiator provided in an embodiment of the present invention have the same structure and are arranged symmetrically on both sides;
[0033] Figure 8 A schematic structural diagram of a first heat sink and a second heat sink provided in an embodiment of the present invention, both of which are skived-tooth heat sinks and whose tooth heights are distributed differently;
[0034] Fig. 9 The first radiator and the second radiator provided in the embodiment of the present invention are a schematic structural diagram of a combination of radiators of two different structural shapes.
[0035] in, Figure 1-Figure 9 middle:
[0036] Power unit 1, power module 11, module frame 111, module air duct 1110, first power module 112, second power module 113, first radiator 114, second radiator 115, electrical device 12, air duct cavity 2, air inlet 20, air inlet cavity 21, air exhaust cavity 22, air duct baffle 3, vent 31, exhaust fan 4, insulating air duct enclosure 5, mounting shelf 6, support structure 7. DETAILED DESCRIPTION
[0037] The core of the present invention is to provide a heat dissipation duct structure and a power grid simulator to solve the problem of poor heat dissipation effect of the power unit in the power grid simulator.
[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0039] See also Figure 1-Figure 9 ,in, Figure 1 A schematic cross-sectional view of a heat dissipation duct structure provided in an embodiment of the present invention (arrows in the figure represent the direction of airflow); Figure 2 A schematic diagram of the external structure of a power unit provided in an embodiment of the present invention; Figure 3 A schematic diagram of the front structure of a power unit provided in an embodiment of the present invention;
[0040] Figure 4 A schematic diagram of the side structure of a power unit provided in an embodiment of the present invention; Figure 5 A schematic diagram of the module air duct structure of a power unit provided in an embodiment of the present invention (the arrows in the figure represent the direction of air flow); Figure 6 A schematic diagram of a structure in which a power module provided by an embodiment of the present invention is installed on supporting structures arranged sequentially from bottom to top in an air inlet cavity; Figure 7 A schematic diagram of a structure in which a first radiator and a second radiator provided in an embodiment of the present invention have the same structure and are arranged symmetrically on both sides; Figure 8 A schematic structural diagram of a first heat sink and a second heat sink provided in an embodiment of the present invention, both of which are skived-tooth heat sinks and whose tooth heights are distributed differently; Fig. 9 The first radiator and the second radiator provided in the embodiment of the present invention are a schematic structural diagram of a combination of radiators of two different structural shapes.
[0041] The embodiment of the present invention provides a heat dissipation duct structure, referring to Figure 1 , used for dissipating heat for the power unit 1, the power unit 1 includes a power module 11 and an electrical device 12 matched with the power module 11, the heat dissipation air duct structure includes an air duct cavity 2 and an air duct baffle 3, wherein the air duct cavity 2 has an air inlet 20 (specifically, it can be designed as a structural form of an air inlet grille) and an air outlet; the air duct baffle 3 is arranged in the air duct cavity 2, and divides the air duct cavity 2 into an air inlet cavity 21 connected with the air inlet 20 and an air exhaust cavity 22 connected with the air outlet; the power module 11 is installed in the air inlet cavity 21, the electrical device 12 is installed in the air exhaust cavity 22, and the air duct baffle 3 is provided with a vent 31 for guiding the airflow on the air outlet side of the power module 11 to the air inlet side of the electrical device 12.
[0042] The heat dissipation duct structure divides the duct cavity 2 into an air inlet cavity 21 and an air exhaust cavity 22 by means of an air duct baffle 3, and the air duct baffle 3 is provided with a vent 31 for guiding the airflow on the air outlet side of the power module 11 to the air inlet side of the electrical device 12. Therefore, in actual application, the airflow can enter the air inlet cavity 21 from the air inlet 20, and then the heat exchange airflow flowing through the power module 11 is guided to the electrical device 12 matching the power module 11 through the vent 31, so as to further dissipate the heat of these electrical devices 12, and finally be discharged through the air outlet on the exhaust cavity 22, and then the hot airflow of the electrical device 12 located in the exhaust cavity 22 can be discharged in time, so as to avoid the situation where the temperature rise of the electrical device 12 is difficult to control, thereby helping to improve the heat dissipation effect of the power unit 1.
[0043] It should be noted that those skilled in the art should be able to understand that in order to ensure that the airflow in the air duct cavity 2 has flow power, the air duct cavity 2 should be equipped with a suction fan or an exhaust fan, for example, Figure 1The exhaust chamber 22 is provided with an exhaust fan 4 at a position corresponding to the air outlet; or the air inlet chamber 21 is provided with an inlet fan at a position corresponding to the air inlet 20. In actual application, the arrangement can be selected according to specific arrangement requirements, and no further specific limitation is made here.
[0044] It should also be noted that the electrical device 12 matching the power module 11 may specifically be a device such as a reactor. In actual application, it may be set to a required device according to actual conditions, and no further specific limitation is given here.
[0045] In some specific implementation schemes, the power module 11 may specifically include a module frame 111, a power module and a heat sink installed in the module frame 111, a module air duct 1110 is formed in the module frame 111, the heat sink is located at the air inlet side of the module air duct 1110, and the air outlet side of the module air duct is arranged opposite to the vent 31. By arranging the heat sink at the air inlet side of the module air duct 1110, and the air outlet side of the module air duct 1110 is arranged opposite to the vent 31, the hot air flow of the heat sink can be taken away faster, which helps to improve the heat exchange effect. In addition, when there are multiple power units 1, since the power modules 11 corresponding to each power unit have their own independent module air ducts 1110, it is possible to effectively avoid the interference of heat dissipation performance between the power modules, which helps to improve the uniformity of heat dissipation.
[0046] In a further embodiment, referring to Figure 2 , the power module may specifically include a first power module 112 and a second power module 113 distributed in the left and right of the module frame 111, and the radiator may include a first radiator 114 for dissipating heat for the first power module 112 and a second radiator 115 for dissipating heat for the second power module 113. Specifically, one of the first power module 112 and the second power module 113 may be a grid-side power module, and the other may be a bridge-side power module. By respectively providing corresponding radiators for the grid-side power module and the bridge-side power module, the heat dissipation requirements of the two power modules can be guaranteed. Of course, it can be understood that the above-mentioned method of distributing the first power module 112 and the second power module 113 in the left and right is only an example of an embodiment of the present invention. In actual application, other distribution methods may be selected according to actual needs, and no further specific limitation is made here.
[0047] In some specific implementation schemes, the first power module 112 and the second power module 113 can be designed to be a structural form that can extend and expand in the height direction within the module frame 111. By designing into this structural form, the stacking dimensions of multiple power units in the width direction can be maintained without changing, and the dimensions in the depth direction can be maintained without increasing, thereby achieving capacity expansion of the power unit and avoiding the impact of the expansion in the width and depth directions on the maintenance of the entire machine.
[0048] In a further embodiment, as shown in FIG3 , the first radiator 114 and the second radiator 115 can be specifically designed to be arranged in parallel on the air inlet side. By designing in this way, on the one hand, the arrangement of the radiator is more convenient, and on the other hand, the first radiator 114 and the second radiator 115 can be cooled simultaneously by the cold air flow on the air inlet side, and compared with the front-to-back arrangement of the two radiators, the wind resistance is smaller and the heat transfer effect is better.
[0049] In some specific embodiments, reference Figure 7 As shown, the first radiator 114 and the second radiator 115 can be specifically designed as radiators with the same structure and shape, and are symmetrically distributed on the left and right; Figure 8 As shown, the first heat sink 114 and the second heat sink 115 can also be designed as skived-tooth heat sinks, and the tooth heights of the two are distributed differently; Fig. 9 As shown, the first heat sink 114 and the second heat sink 115 can also be designed as a combination of two heat sinks with different structural shapes. Among them, the specific structural form of the heat sink can be a skived-tooth heat sink, a heat pipe heat sink, or other heat sink structural forms commonly used by technicians in this field. In actual application, the heat sink and heat pipe scheme can be arranged separately according to the different power unit losses, and the tooth thickness, tooth spacing, substrate thickness and heat sink material can be adjusted in different latitudes according to the loss size to reduce the size of the power module for reasonable layout and cost optimization. The corresponding heat sink combination can be selected and configured according to actual needs, and no more specific restrictions are made here.
[0050] In some more specific embodiments, reference Figure 4 and Figure 5 Combined with Figure 1 The above-mentioned electrical device 12 may be surrounded by an insulating air duct enclosure 5 along the circumferential direction of the vent 31, and the inlet end of the insulating air duct enclosure 5 is opposite to the vent 31. By designing the insulating air duct enclosure 5, the vent 31 of the air duct baffle 3 can guide the wind from the air outlet side of the power module 11 into the insulating air duct enclosure 5, and then conduct the airflow to the electrical device 12 (such as the reactor) through the insulating air duct enclosure 5, and take away the heat of the electrical device 12 through the heat dissipation air gap of the electrical device 12, which helps to improve the heat dissipation effect of the electrical device 12.
[0051] In some more specific embodiments, reference Figure 2 , Figure 4 and Figure 5 The exhaust cavity 22 may also be provided with an installation shelf 6 for mounting and storing the electrical device 12. By designing the installation shelf 6, the installation of the electrical device 12 is made more stable and reliable. Specifically, the installation shelf 6 may be designed as a supporting rod (e.g., I-beam, angle iron, or other steel) spanning the exhaust cavity 22.
[0052] In some more specific embodiments, reference Figure 1 The vents 31 and the power units 1 are preferably arranged in a one-to-one correspondence, and are preferably designed to match the air outlets of the power modules 11 and the air inlet ports of the electrical devices 12. By designing the above structure, each power unit can form an independent heat dissipation duct system through the air inlet cavity 21, the corresponding vents 31 and the air exhaust cavity 22, and the heat dissipation is more uniform.
[0053] In some other specific embodiments, referring to Figure 6 As shown, the air inlet cavity 21 can be specifically designed to have multiple layers of supporting structures 7 distributed sequentially from bottom to top, and multiple power modules 11 are arranged on each layer of supporting structure 7. This arrangement makes the arrangement of the power modules more regular and more convenient for installation and maintenance.
[0054] In addition, the present invention also provides a power grid simulator, including a heat dissipation duct structure, which is the heat dissipation duct structure described in any of the above schemes. Since the heat dissipation duct structure has the above technical effects, the power grid simulator having the heat dissipation duct structure should also have corresponding technical effects, which will not be repeated here.
[0055] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0056] It should be understood that the use of "system", "device", "unit" and / or "module" in this application is only a method for distinguishing different components, elements, parts, parts or assemblies at different levels. However, if other words can achieve the same purpose, the word can be replaced by other expressions.
[0057] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "a kind" and / or "the" do not refer to the singular, but also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. The elements defined by the sentence "includes a..." do not exclude the existence of other identical elements in the process, method, commodity or device that includes the elements.
[0058] In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two.
[0059] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.
[0060] If a flow chart is used in the present application, the flow chart is used to illustrate the operations performed by the system according to the embodiment of the present application. It should be understood that the preceding or following operations are not necessarily performed accurately in order. On the contrary, each step can be processed in reverse order or simultaneously. At the same time, other operations can also be added to these processes, or a certain step or several steps of operations can be removed from these processes.
[0061] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the core idea of the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.
Claims
1. A heat dissipation duct structure, used for dissipating heat from a power unit (1), the power unit (1) comprising a power module (11) and an electrical device (12) matching the power module (11), characterized in that: The heat dissipation duct structure comprises: An air duct cavity (2) having an air inlet (20) and an air outlet; An air duct baffle (3) is arranged in the air duct cavity (2) and divides the air duct cavity (2) into an air inlet cavity (21) connected to the air inlet (20) and an air outlet cavity (22) connected to the air outlet; The power module (11) is installed in the air inlet cavity (21), the electrical device (12) is installed in the air outlet cavity (22), and the air duct baffle (3) is provided with a vent (31) for guiding the airflow on the air outlet side of the power module (11) to the air inlet side of the electrical device (12), the air inlet cavity (21) has multiple layers of supporting structures (7) distributed sequentially from bottom to top, and each layer of the supporting structure (7) is provided with multiple power modules (11); the vent (31) is arranged in a one-to-one correspondence with the power unit (1), and the vent (31) is adapted to the air outlet port of the power module (11) and the air inlet port of the electrical device (12).
2. The heat dissipation duct structure according to claim 1, characterized in that: The power module (11) comprises a module frame (111), a power module installed in the module frame (111), and a heat sink; a module air duct (1110) is formed in the module frame (111); the heat sink is located on the air inlet side of the module air duct (1110); and the air outlet side of the module air duct is arranged opposite to the vent (31).
3. The heat dissipation duct structure according to claim 2, characterized in that: The power module comprises a first power module (112) and a second power module (113) which are distributed on the left and right sides of the module frame (111); the heat sink comprises a first heat sink (114) for dissipating heat for the first power module (112) and a second heat sink (115) for dissipating heat for the second power module (113).
4. The heat dissipation duct structure according to claim 3, characterized in that: The first radiator (114) and the second radiator (115) are arranged in parallel on the air inlet side.
5. The heat dissipation duct structure according to claim 4, characterized in that: The first radiator (114) and the second radiator (115) are radiators with the same structure and shape, and are distributed symmetrically on the left and right; Or, the first heat sink (114) and the second heat sink (115) are both skived-tooth heat sinks, and the tooth heights of the two are distributed differently; Alternatively, the first radiator (114) and the second radiator (115) are a combination of radiators with two different structural shapes.
6. The heat dissipation duct structure according to claim 3, characterized in that: One of the first power module (112) and the second power module (113) is a grid-side power module, and the other is a bridge-side power module.
7. The heat dissipation duct structure according to claim 3, characterized in that: The first power module (112) and the second power module (113) are both capable of extending and expanding in the height direction within the module frame (111).
8. The heat dissipation duct structure according to any one of claims 1 to 7, characterized in that: An exhaust fan (4) is provided in the exhaust cavity (22) at a position corresponding to the air outlet; or an intake fan is provided in the air intake cavity (21) at a position corresponding to the air inlet (20).
9. The heat dissipation duct structure according to any one of claims 1 to 7, characterized in that: The electrical device (12) is provided with an insulating air duct enclosure plate (5) along the circumferential direction of the ventilation opening (31), and the inlet end of the insulating air duct enclosure plate (5) is opposite to the ventilation opening (31).
10. The heat dissipation duct structure according to any one of claims 1 to 7, characterized in that: The exhaust cavity (22) is also provided with a mounting shelf (6) for mounting and placing the electrical device (12).
11. A power grid simulator, comprising a heat dissipation duct structure, characterized in that: The heat dissipation duct structure is the heat dissipation duct structure according to any one of claims 1 to 10.
Citation Information
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