Data center cooling system using loop heat pipe and cooling method thereof

By adopting multiple operating modes of loop heat pipe system and dual-segment cooler in the data center, the problems of high energy consumption and uneven heat dissipation of the data center cooling system are solved, and efficient heat transfer and cooling are achieved, saving power consumption of the cooling system and reducing cooling water consumption.

CN115209708BActive Publication Date: 2025-02-28POWERCHINA HUADONG ENG CORP LTD
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Patent Information

Application Number
CN202210957760.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-08-10
Publication Date
2025-02-28
Estimated Expiration
2042-08-10

AI Technical Summary

Technical Problem

The existing data center cooling systems have problems such as high energy consumption, low air heat exchange coefficient and uneven heat dissipation, and the traditional air cooling and water cooling methods have insufficient environmental and resource consumption.

Method used

The loop heat pipe system is adopted, including loop heat pipe, evaporator and dual-segment cooler. The data center heat is absorbed through the evaporator, and the dual-segment cooler is used to adapt to different environmental conditions using a variety of operating modes of the dual-segment cooler (air-cooling, room-temperature circulating water cooling, room-temperature circulating water evaporation and cooling water cooling).

Benefits of technology

It realizes efficient heat transfer and cooling, saves power consumption of the cooling system, reduces cooling water consumption, and improves the adaptability of the data center cooling system in extreme operating conditions.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The present invention relates to a data center cooling system and a cooling method thereof using a loop heat pipe. The system is applicable to the cooling technology field of a data center. The technical solution adopted by the present invention is as follows: the system comprises: a loop heat pipe pipeline, on which a heat pipe working fluid pump capable of circulating the working fluid in the pipeline in a specified direction is provided; an evaporator, arranged on the loop heat pipe pipeline, for absorbing the heat dissipated by the data center, and using the absorbed heat to convert the working fluid in the loop heat pipe pipeline from liquid to gas; a two-stage cooler, arranged on the loop heat pipe pipeline, for absorbing the heat of the gaseous working fluid in the loop heat pipe pipeline, and converting the gaseous working fluid into liquid working fluid; the two-stage cooler has a cooling cylinder, in which an upper filler and a lower filler located below the upper filler are provided, and condensers are provided in both the upper filler and the lower filler, and the condensers are connected to the loop heat pipe pipeline.
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Description

Technical Field

[0001] The present invention relates to a data center cooling system and a cooling method thereof using a loop heat pipe, and is applicable to the cooling technology field of a data center. Background Art

[0002] The data center cooling system provides a suitable temperature environment for electronic equipment and is the auxiliary equipment with the largest energy consumption in the data center, accounting for about 20% to 40% of the energy consumption of the entire data center. Therefore, in addition to creating a reasonable temperature environment, reducing the consumption of external resources such as electricity and cooling water is an important research object of the data center cooling system.

[0003] Conventional mechanical vapor compression cooling systems have many problems, such as huge energy consumption, low air heat exchange coefficient and uneven heat dissipation. In contrast, heat pipe cooling systems can achieve efficient heat conduction without the need for external energy, with higher cold distribution efficiency and lower energy consumption. At the same time, heat pipe cooling systems do not need to directly introduce external fresh air, and will not affect the cleanliness of the computer room. They have developed into one of the most promising natural cooling methods for data centers.

[0004] The cooling process of a data center is actually a process of heat collection, transfer and discharge driven by a certain temperature difference. Heat pipe technology can efficiently transfer the heat emitted by indoor heat sources to outdoor cold sources, so the outdoor cold source determines the overall efficiency of the heat pipe cooling system. Although the traditional air cooling method can make full use of external natural cold sources, it is easily affected by the environment and has poor stability and reliability; although the water cooling method has a higher overall cooling efficiency, it consumes a lot of fresh water resources and has its inherent shortcomings in cold and water-scarce areas. Summary of the invention

[0005] The technical problem to be solved by the present invention is: in view of the above-mentioned problems, a data center cooling system using a loop heat pipe is provided.

[0006] The technical solution adopted by the present invention is: a data center cooling system using a loop heat pipe, characterized in that it includes:

[0007] A loop heat pipe pipeline, on which a heat pipe working fluid pump is provided, which can make the working fluid in the pipeline circulate in a specified direction;

[0008] An evaporator is arranged on the loop heat pipe pipeline, and is used to absorb the heat dissipated by the data center, and utilizes the absorbed heat to convert the working medium in the loop heat pipe pipeline from liquid to gas;

[0009] A two-stage cooler is arranged on the loop heat pipe pipeline, and is used to absorb the heat of the gaseous working medium in the loop heat pipe pipeline and convert the gaseous working medium into liquid working medium;

[0010] The double-stage cooler has a cooling cylinder, an upper filler and a lower filler below the upper filler are arranged in the cooling cylinder, and condensers are arranged in the upper filler and the lower filler, and the condensers are connected to the loop heat pipe pipeline;

[0011] An upper spray device is provided above the upper filler, and the upper spray device is connected to the circulating water pipeline. A lower spray device is provided above the lower filler, and the lower spray device is connected to the circulating water pipeline via a cooling branch. A cooling device is provided on the cooling branch. The bottom of the cooling cylinder is connected to the circulating water pipeline.

[0012] An air inlet is provided below the upper and lower fillers on the side wall of the cooling cylinder, an air outlet is provided on the top of the cooling cylinder, and a fan capable of driving air flow is provided inside the cooling cylinder.

[0013] The temperature reduction cooling device comprises a pressure reducing cooler, the pressure reducing cooler is connected to a low temperature gas pipeline, and a vacuum pump is arranged on the low temperature gas pipeline.

[0014] The low-temperature gas pipeline is provided with a cold storage device, an adsorber and an eighth stop valve in sequence along the air flow direction;

[0015] A heat pipe bypass is connected in parallel to the loop heat pipe pipeline, and the heat pipe bypass is provided with heat exchange sections respectively located in the cold storage device and the adsorber.

[0016] A gas supply branch is connected on the low-temperature gas pipeline and between the cold storage device and the adsorber, and a ninth stop valve is provided on the gas supply branch;

[0017] The low-temperature gas pipeline, the adsorber and the eighth stop valve are connected to the circulating water pipeline via a water vapor recovery pipeline, and a condenser is provided on the water vapor recovery pipeline.

[0018] The cold source of the condenser is a natural cold source or low-temperature cooling water in the pressure reducing cooler.

[0019] The cold storage device contains phase-change cold storage material; the adsorber contains an adsorbent with water adsorption capacity.

[0020] The condenser tubes in the upper filling layer and the condenser tubes in the lower filling layer are sequentially connected to the loop heat pipe along the working medium circulation flow direction.

[0021] The loop heat pipe pipeline is divided into an evaporation section, a condensation section and an insulation section, wherein the evaporation section is connected to the gas outlet of the evaporator and the inlet of the condensation section, the condensation section is provided with the condenser, the outlet of the condensation section is connected to the liquid inlet of the evaporator through the insulation section, and the insulation section is coated with insulation material.

[0022] A cooling method for a data center cooling system using a loop heat pipe, characterized in that:

[0023] The loop heat pipe pipeline is connected, and the heat pipe working fluid pump is started. The heat dissipation of the data center enters from the evaporator, is transported to the two-stage cooler through the working fluid in the pipeline, and then discharged from the two-stage cooler;

[0024] Operation mode 1 of the two-stage cooler to discharge heat: When the ambient temperature is low, start the fan, and the outside air enters the two-stage cooler under the action of the fan, and passes through the lower and upper fillers in turn to cool the condenser tube inside the filler, and then is discharged from the two-stage cooler;

[0025] Operation mode 2: When the ambient temperature is high and the circulating water is sufficient, the normal temperature circulating water in the circulating water pipeline is sprayed on the upper packing through the upper spray device, and the sprayed normal temperature circulating water cools the condenser tube inside the packing;

[0026] At the same time, the fan is started, and the outside air enters the double-stage cooler under the action of the fan, and passes through the lower and upper fillers in turn. The normal temperature circulating water in the fillers evaporates and absorbs heat, cooling the condenser tube inside;

[0027] Operation mode three: When the ambient temperature is high and the circulating water is less, the normal temperature circulating water in the circulating water pipeline is converted into low temperature cooling water through the cooling device, and the low temperature cooling water is sprayed on the lower packing through the lower spray device, and the sprayed low temperature cooling water cools the condenser inside the packing;

[0028] Operation mode 4: When the external ambient temperature is high and the heat load of the data center is too large, the normal temperature circulating water in the circulating water pipeline is converted into low temperature cooling water through the cooling device. The low temperature cooling water is sprayed on the lower packing through the lower spray device, and the sprayed low temperature cooling water cools the condenser tube inside the packing;

[0029] At the same time, the normal temperature circulating water in the circulating water pipeline sprays the upper packing through the upper spray device, and the sprayed normal temperature circulating water cools the condenser tube inside the packing;

[0030] At the same time, the fan is started, and the outside air enters the double-stage cooler under the action of the fan, and passes through the lower and upper fillers in turn. The normal temperature circulating water in the fillers evaporates and absorbs heat, cooling the condenser tube inside.

[0031] The temperature reduction cooling device comprises a pressure reducing cooler, the pressure reducing cooler is connected to a low temperature gas pipeline, and a vacuum pump is arranged on the low temperature gas pipeline;

[0032] The low-temperature gas pipeline is provided with a cold storage device, an adsorber and an eighth stop valve in sequence along the air flow direction;

[0033] A heat pipe bypass is connected in parallel to the loop heat pipe pipeline, and the heat pipe bypass is provided with heat exchange sections located in the cold storage device and the adsorber respectively;

[0034] A gas supply branch is connected on the low-temperature gas pipeline and between the cold storage device and the adsorber, and a ninth stop valve is provided on the gas supply branch;

[0035] The low-temperature gas pipeline, the adsorber and the eighth stop valve are connected to the circulating water pipeline via a water vapor recovery pipeline, and a condenser is provided on the water vapor recovery pipeline;

[0036] The method of converting the normal temperature circulating water in the circulating water pipeline into low temperature cooling water by the cooling device comprises:

[0037] Fill the decompression cooler with an appropriate amount of normal temperature circulating water, start the vacuum pump, evacuate and cool the normal temperature circulating water in the decompression cooler, and the low temperature gas discharged by the vacuum pump passes through the cold storage device and the adsorber in turn, releasing the cold and adsorbing the water vapor in the gas; the circulating water in the decompression cooler becomes low temperature cooling water after reaching the set temperature;

[0038] After the adsorber is saturated with adsorption, external air is allowed to flow in through the air supply branch through the ninth stop valve to take away the water vapor in the adsorber, and then enters the condenser through the water vapor recovery pipeline, where the water vapor is condensed and recovered.

[0039] The beneficial effects of the present invention are as follows: the present invention absorbs the heat of the data center through the evaporator, and transfers the heat to the two-stage cooler through the loop heat pipe pipeline, and the heat is discharged by the two-stage cooler. The two-stage cooler has multiple operating modes such as air cooling, normal temperature circulating water cooling, normal temperature circulating water combined with fan evaporation heat absorption and cooling water cooling, and can be applied to different working conditions.

[0040] When the ambient temperature is low, natural cold sources can be fully utilized to save power consumption of the cooling system; when the ambient temperature is high, low-temperature cooling water can be obtained by evacuating and reducing pressure, and cold storage devices and adsorbers can be set up to achieve efficient use of cold energy and water vapor recovery, greatly reducing cooling water consumption; when the ambient temperature is high and the heat load of the data center is too large, a gradient cooling method that combines evaporative cooling of normal temperature circulating water and evaporative cooling of low-temperature cooling water can be used to improve the heat dissipation capacity of the condensing end of the loop heat pipe and increase the adaptability of the data center cooling system to extreme working conditions.

[0041] The present invention uses a pressure reducing cooler and Vacuum Pump In cooperation, low-temperature cooling water with a temperature far lower than that of normal circulating water can be obtained through evacuation and decompression, thereby reducing the consumption of cooling water. The low-temperature water vapor discharged by the vacuum pump is recovered through the adsorber, which greatly reduces the consumption of cooling water. In addition, the cold storage device makes full use of the cooling capacity of the low-temperature water vapor.

[0042] In the present invention, the gaseous heat pipe working fluid from the evaporator is firstly evaporated and cooled by circulating water at room temperature, and then evaporated and cooled by low-temperature cooling water at a lower temperature, forming a gradient cooling process, which has high thermodynamic efficiency and is suitable for high heat load conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a structural schematic diagram of an embodiment.

[0044] In the figure: loop heat pipe pipeline 1, circulating water pipeline 2, low-temperature cooling water pipeline 3, low-temperature gas pipeline 4, water vapor recovery pipeline 5, heat pipe working fluid pump 6, evaporator 7, first stop valve 8, second stop valve 9, two-stage cooler 10, upper filler 11, lower spray device 12, lower filler 13, upper spray device 14, fan 15, third stop valve 16, fourth stop valve 17, pressure reducing cooler 18, fifth stop valve 19, sixth stop valve 20, vacuum pump 21, seventh stop valve 22, cold accumulator 23, adsorber 24, eighth stop valve 25, ninth stop valve 26, tenth stop valve 27, condenser 28. DETAILED DESCRIPTION

[0045] This embodiment is a data center cooling system using a loop heat pipe, including: a loop heat pipe pipeline, an evaporator, and a two-stage cooler.

[0046] In this example, an evaporator is provided on the loop heat pipe pipeline, and the evaporator is used to absorb the heat dissipated by the data center and use the absorbed heat to convert the working fluid in the loop heat pipe pipeline from liquid to gas.

[0047] In this embodiment, the loop heat pipe pipeline is divided into an evaporation section, a condensation section and an insulation section, wherein the evaporation section is connected to the air outlet of the evaporator and the inlet of the condensation section, the condensation section is arranged in a double-stage cooler, the outlet of the condensation section is connected to the liquid inlet of the evaporator through the insulation section, the insulation section is coated with insulation material and is provided with a heat pipe working fluid pump, through which the working fluid in the pipeline can circulate along a specified flow direction.

[0048] In this embodiment, the two-stage cooler has a cooling cylinder, in which an upper filler and a lower filler located below the upper filler are arranged. Condensation pipes are arranged in both the upper filler and the lower filler. The condensation pipes in the upper and lower fillers are connected in series in sequence to the condensation section of the loop heat pipe pipeline along the circulation flow direction of the heat pipe working fluid.

[0049] In this example, an upper spray device is provided above the upper filler, and the upper spray device is connected to the circulating water pipeline via the first circulating water branch, and the sixth stop valve is provided on the first circulating water branch; a lower spray device is provided above the lower filler, and the lower spray device is connected to the circulating water pipeline via a cooling branch (including a low-temperature cooling water pipeline and a second circulating water branch), and a cooling device is provided on the cooling branch for converting normal-temperature circulating water in the circulating water pipeline into low-temperature cooling water; water can be collected at the bottom of the cooling cylinder, and the bottom of the cooling cylinder is connected to the circulating water pipeline via the third stop valve.

[0050] In this embodiment, the cooling device includes a decompression cooler, which is connected to the circulating water pipeline via the second branch of the circulating water, and is also connected to the lower spray device via the low-temperature cooling water pipeline, wherein the second branch of the circulating water is provided with a fourth stop valve, and the low-temperature cooling water pipeline is provided with a fifth stop valve. In this example, a low-temperature gas pipeline connected to the outside air is connected to the decompression cooler, and a vacuum pump, a seventh stop valve, a cold storage device, an adsorber and an eighth stop valve are sequentially provided on the low-temperature gas pipeline from the decompression cooler end to the other end.

[0051] In this embodiment, a first stop valve is provided on the evaporation section of the loop heat pipe pipeline, a heat pipe bypass is connected in parallel to the first stop valve, and the heat pipe bypass is provided with heat exchange sections located in the cold storage device and the adsorber respectively, and a second stop valve is provided between the two heat exchange sections.

[0052] In this example, an air supply branch connected to the outside air is connected on the low-temperature gas pipeline, between the cold storage device and the adsorber, and a ninth stop valve is provided on the air supply branch; a circulating water pipeline is connected on the low-temperature gas pipeline, between the adsorber and the eighth stop valve, via a water vapor recovery pipeline, and a tenth stop valve and a condenser are provided on the water vapor recovery pipeline. The cold source required for the condenser can be a natural cold source or low-temperature cooling water in a pressure reducing cooler.

[0053] In this embodiment, a phase-change cold storage material can be used inside the cold storage device to improve the quality of cold capacity; the adsorber can be filled with an adsorbent such as aluminum oxide or salts that has a strong adsorption capacity for the water phase.

[0054] In this embodiment, an air inlet is provided on the side wall of the cooling cylinder below the lower layer of filler, an air outlet is provided on the top of the cooling cylinder, and a fan is provided at the top of the cooling cylinder. External air can enter the cooling cylinder from the air inlet under the action of the fan, and pass through the lower layer of filler and the upper layer of filler in turn before being discharged from the air outlet on the top of the cooling cylinder.

[0055] The cooling method of this embodiment has multiple operating modes, which are described below respectively:

[0056] Operation mode 1: When the ambient temperature is low, the condensing end of the loop heat pipe is cooled by a natural cold source. First, assume that all valves are closed and all components are stopped.

[0057] Start the fan, and the outside air enters the double-stage cooler under the action of the fan, and passes through the lower layer of filler and the upper layer of filler in turn to cool the internal heat pipe pipeline, and then is discharged from the double-stage cooler;

[0058] Open the first stop valve and start the heat pipe working fluid pump, the loop heat pipe pipeline is connected, the heat dissipation of the data center enters from the evaporator and is discharged from the two-stage cooler.

[0059] Operation mode 2: When the ambient temperature is high and the circulating water is sufficient, the condensing end of the loop heat pipe is cooled by a natural cold source. First, assume that all valves are closed and all components are stopped.

[0060] Open the sixth stop valve, and the normal temperature circulating water sprays the upper filler through the sixth stop valve and the upper spray device in turn. The sprayed normal temperature soul ring water enters the upper filler to cool the internal loop heat pipe. The spray water finally gathers at the bottom of the double-stage cooler and enters the circulating water pipeline through the third stop valve;

[0061] At the same time, the fan is started, and the outside air enters the double-stage cooler under the action of the fan, and passes through the lower and upper fillers in turn. The circulating water in the fillers evaporates and absorbs heat, cooling the internal heat pipe pipeline, and the air is then discharged from the double-stage cooler;

[0062] Open the first stop valve and start the heat pipe working fluid pump, the loop heat pipe pipeline is connected, the heat dissipation of the data center enters from the evaporator, and is discharged from the upper filler in the two-stage cooler.

[0063] Operation mode 3: When the ambient temperature is high and the circulating water is less, the condensing end of the loop heat pipe is cooled by low-temperature cooling water. First, assume that all valves are closed and all components are stopped.

[0064] In the early stage of operation mode three, the fourth stop valve is opened to fill an appropriate amount of normal temperature circulating water into the pressure reducing cooler, and the fourth stop valve is closed after the filling is completed; the seventh stop valve, the eighth stop valve and the third stop valve are opened, and the vacuum pump is started to evacuate and cool the normal temperature circulating water in the pressure reducing cooler. The low-temperature gas discharged by the vacuum pump first releases the cold capacity through the cold storage device, and then enters the adsorber, and the water vapor in the gas is adsorbed by the adsorbent in the adsorber; after the circulating water in the pressure reducing cooler reaches the set temperature, the fifth stop valve is opened, and the low-temperature cooling water sprays the lower layer filler through the fifth stop valve and the lower layer spray device in turn, and the sprayed low-temperature cooling water enters the lower layer filler to cool the internal loop heat pipe, and the spray water finally gathers at the bottom of the double-stage cooler and enters the circulating water pipeline through the third stop valve;

[0065] Open the first stop valve and start the heat pipe working fluid pump, the loop heat pipe pipeline is connected, the data center heat dissipation enters from the evaporator, and is discharged from the lower layer of filler in the two-stage cooler.

[0066] In the later stage of the operation mode 3 of this embodiment, when the adsorber is saturated with adsorption, the valve is switched to save power consumption. The vacuum pump, the fifth stop valve, the seventh stop valve, the eighth stop valve and the first stop valve are turned off, and the ninth stop valve, the tenth stop valve and the second stop valve are opened; the external air flows in from the ninth stop valve, takes away the water vapor in the adsorber, and then enters the condenser through the tenth stop valve, and the water vapor is condensed and recovered; at this time, the loop heat pipe working fluid flows through the heat pipe working fluid pump, the evaporator, the adsorber, the second stop valve, the cold storage device, the upper filler and the lower filler in sequence, and the cold used to cool the loop heat pipe comes from the desorption heat absorption of the adsorber and the cold stored in the cold storage device; after the adsorber is desorbed, the previous operation is performed again.

[0067] Operation mode 4: When the external ambient temperature is high and the heat load of the data center is too large, the natural cold source and low-temperature cooling water are used to perform mixed cooling on the condensing end of the loop heat pipe. First, assume that all valves are closed and all components are stopped.

[0068] In the early stage of operation mode 4, the fourth stop valve is opened to charge an appropriate amount of circulating water at room temperature into the pressure reducing cooler, and the fourth stop valve is closed after the charging is completed; the seventh stop valve, the eighth stop valve and the third stop valve are opened, and the vacuum pump is started to evacuate and cool the circulating water in the pressure reducing cooler. The low-temperature gas discharged by the vacuum pump first passes through the cold storage device to release the cold capacity, and then enters the adsorber, and the water vapor in the gas is adsorbed by the adsorbent in the adsorber; after the circulating water in the pressure reducing cooler reaches the set temperature, the fifth stop valve is opened, and the low-temperature cooling water is sprayed on the lower layer filler through the fifth stop valve and the lower layer spraying device in turn, and the sprayed low-temperature cooling water enters the lower layer filler to cool the loop heat pipe inside it;

[0069] At the same time, the sixth stop valve is opened, and the normal temperature circulating water passes through the sixth stop valve and the upper spray device in turn. The sprayed normal temperature water enters the upper filler to cool the internal loop heat pipe. The spray water is finally collected at the bottom of the double-stage cooler and enters the circulating water pipeline through the third stop valve;

[0070] At the same time, the fan is started, and the outside air enters the double-stage cooler under the action of the fan, and passes through the lower and upper fillers in turn. The circulating water in the fillers evaporates and absorbs heat, cooling the internal heat pipe pipeline, and the air is then discharged from the double-stage cooler;

[0071] Open the first stop valve and start the heat pipe working fluid pump, the loop heat pipe pipeline is connected, the heat dissipation of the data center enters from the evaporator, and is discharged from the upper and lower fillers in the two-stage cooler.

[0072] In the later stage of operation mode 4, when the adsorber is saturated with adsorption, the valve is switched to save power consumption. The vacuum pump, the fifth stop valve, the seventh stop valve, the eighth stop valve and the first stop valve are turned off, and the ninth stop valve, the tenth stop valve and the second stop valve are opened; the external air flows in from the ninth stop valve, takes away the water vapor in the adsorber, and then enters the condenser through the tenth stop valve, and the water vapor is condensed and recovered; at this time, the loop heat pipe working fluid flows through the heat pipe working fluid pump, evaporator, adsorber, the second stop valve, cold storage, upper packing and lower packing in sequence, and the cold used to cool the loop heat pipe comes from the desorption heat absorption of the adsorber, the cold stored in the cold storage and the evaporation heat absorption of the cooling water in the lower packing; after the adsorber is desorbed, the previous operation is performed again.

[0073] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A data center cooling system using a loop heat pipe, characterized in that: include: A loop heat pipe pipeline, on which a heat pipe working fluid pump is provided, which can make the working fluid in the pipeline circulate in a specified direction; An evaporator is arranged on the loop heat pipe pipeline, and is used to absorb the heat dissipated by the data center, and utilizes the absorbed heat to convert the working medium in the loop heat pipe pipeline from liquid to gas; A two-stage cooler is arranged on the loop heat pipe pipeline, and is used to absorb the heat of the gaseous working medium in the loop heat pipe pipeline and convert the gaseous working medium into liquid working medium; The double-stage cooler has a cooling cylinder, an upper filler and a lower filler below the upper filler are arranged in the cooling cylinder, and condensers are arranged in the upper filler and the lower filler, and the condensers are connected to the loop heat pipe pipeline; An upper spray device is provided above the upper filler, and the upper spray device is connected to the circulating water pipeline. A lower spray device is provided above the lower filler, and the lower spray device is connected to the circulating water pipeline via a cooling branch. A cooling device is provided on the cooling branch. The bottom of the cooling cylinder is connected to the circulating water pipeline. An air inlet is provided below the upper and lower fillers on the side wall of the cooling cylinder, an air outlet is provided on the top of the cooling cylinder, and a fan capable of driving air flow is provided inside the cooling cylinder; The temperature reduction cooling device comprises a pressure reducing cooler, the pressure reducing cooler is connected to a low temperature gas pipeline, and a vacuum pump is arranged on the low temperature gas pipeline; The low-temperature gas pipeline is provided with a cold storage device, an adsorber and an eighth stop valve in sequence along the air flow direction; A heat pipe bypass is connected in parallel to the loop heat pipe pipeline, and the heat pipe bypass is provided with heat exchange sections located in the cold storage device and the adsorber respectively; A gas supply branch is connected on the low-temperature gas pipeline and between the cold storage device and the adsorber, and a ninth stop valve is provided on the gas supply branch; The low-temperature gas pipeline, the adsorber and the eighth stop valve are connected to the circulating water pipeline via a water vapor recovery pipeline, and a condenser is provided on the water vapor recovery pipeline.

2. The data center cooling system using a loop heat pipe according to claim 1, characterized in that: The cold source of the condenser is a natural cold source or low-temperature cooling water in the pressure reducing cooler.

3. The data center cooling system using a loop heat pipe according to claim 1, characterized in that: The cold storage device contains phase-change cold storage material; the adsorber contains an adsorbent with water adsorption capacity.

4. The data center cooling system using a loop heat pipe according to claim 1, characterized in that: The condenser tubes in the upper filling layer and the condenser tubes in the lower filling layer are sequentially connected to the loop heat pipe along the working medium circulation flow direction.

5. The data center cooling system using a loop heat pipe according to claim 1 or 4, characterized in that: The loop heat pipe pipeline is divided into an evaporation section, a condensation section and an insulation section, wherein the evaporation section is connected to the gas outlet of the evaporator and the inlet of the condensation section, the condensation section is provided with the condenser, the outlet of the condensation section is connected to the liquid inlet of the evaporator through the insulation section, and the insulation section is coated with insulation material.

6. A cooling method for a data center cooling system using a loop heat pipe according to any one of claims 1 to 5, characterized in that: The loop heat pipe pipeline is connected, and the heat pipe working fluid pump is started. The heat dissipation of the data center enters from the evaporator, is transported to the two-stage cooler through the working fluid in the pipeline, and then discharged from the two-stage cooler; Operation mode 1 of the two-stage cooler to discharge heat: When the ambient temperature is low, start the fan, and the outside air enters the two-stage cooler under the action of the fan, and passes through the lower and upper fillers in turn to cool the condenser tube inside the filler, and then is discharged from the two-stage cooler; Operation mode 2: When the ambient temperature is high and the circulating water is sufficient, the normal temperature circulating water in the circulating water pipeline is sprayed on the upper packing through the upper spray device, and the sprayed normal temperature circulating water cools the condenser tube inside the packing; At the same time, the fan is started, and the outside air enters the double-stage cooler under the action of the fan, and passes through the lower and upper fillers in turn. The normal temperature circulating water in the fillers evaporates and absorbs heat, cooling the condenser tube inside; Operation mode three: When the ambient temperature is high and the circulating water is less, the normal temperature circulating water in the circulating water pipeline is converted into low temperature cooling water through the cooling device, and the low temperature cooling water is sprayed on the lower packing through the lower spray device, and the sprayed low temperature cooling water cools the condenser inside the packing; Operation mode 4: When the external ambient temperature is high and the heat load of the data center is too large, the normal temperature circulating water in the circulating water pipeline is converted into low temperature cooling water through the cooling device. The low temperature cooling water is sprayed on the lower packing through the lower spray device, and the sprayed low temperature cooling water cools the condenser tube inside the packing; At the same time, the normal temperature circulating water in the circulating water pipeline sprays the upper packing through the upper spray device, and the sprayed normal temperature circulating water cools the condenser tube inside the packing; At the same time, the fan is started, and the outside air enters the double-stage cooler under the action of the fan, and passes through the lower and upper fillers in turn. The normal temperature circulating water in the fillers evaporates and absorbs heat, cooling the condenser tube inside; The temperature reduction cooling device comprises a pressure reducing cooler, the pressure reducing cooler is connected to a low temperature gas pipeline, and a vacuum pump is arranged on the low temperature gas pipeline; The low-temperature gas pipeline is provided with a cold storage device, an adsorber and an eighth stop valve in sequence along the air flow direction; A heat pipe bypass is connected in parallel to the loop heat pipe pipeline, and the heat pipe bypass is provided with heat exchange sections located in the cold storage device and the adsorber respectively; A gas supply branch is connected on the low-temperature gas pipeline and between the cold storage device and the adsorber, and a ninth stop valve is provided on the gas supply branch; The low-temperature gas pipeline, the adsorber and the eighth stop valve are connected to the circulating water pipeline via a water vapor recovery pipeline, and a condenser is provided on the water vapor recovery pipeline.

7. The cooling method according to claim 6, characterized in that: The method of converting the normal temperature circulating water in the circulating water pipeline into low temperature cooling water by the cooling device comprises: Fill the decompression cooler with an appropriate amount of normal temperature circulating water, start the vacuum pump, evacuate and cool the normal temperature circulating water in the decompression cooler, and the low temperature gas discharged by the vacuum pump passes through the cold storage device and the adsorber in turn, releasing the cold and adsorbing the water vapor in the gas; the circulating water in the decompression cooler becomes low temperature cooling water after reaching the set temperature; After the adsorber is saturated with adsorption, external air is allowed to flow in through the air supply branch through the ninth stop valve to take away the water vapor in the adsorber, and then enters the condenser through the water vapor recovery pipeline, where the water vapor is condensed and recovered.

Citation Information

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