Transient thermal reflection test method, system, device and terminal equipment

Abstract

The present application is applicable to the field of microscopic thermal imaging technology, and provides a transient thermal reflection test method, system, device and terminal equipment. The transient thermal reflection test method includes: obtaining the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions; under the condition that the periodic excitation conditions remain unchanged, selecting the measurement delay and the reference delay, and obtaining the camera measurement grayscale value and the camera reference grayscale value based on the measurement delay and the reference delay; obtaining the temperature of the device under test at the time of measurement based on the camera measurement grayscale value, the camera reference grayscale value, the thermal reflection coefficient and the average temperature; sorting the temperature of the device under test in the order of the measurement delay from small to large, and obtaining the change of the measured temperature over time. The transient thermal reflection test results of the present application are less affected by intensity drift, which improves the accuracy of the test results.

Description

Technical Field

[0001] The present application belongs to the field of microscopic thermal imaging technology, and in particular to a transient thermal reflection test method, system, device and terminal equipment. Background Art

[0002] The transient thermal reflection test process is time-consuming, and effective intensity drift compensation is the key to ensuring system performance. The basic principle of thermal reflection temperature measurement is that changes in object temperature will cause changes in reflectivity, but the rate of change of reflectivity with temperature is very low (usually no more than 10 -3 ℃ -1 The relative change of camera readings is used to reflect the relative change of reflectivity. The premise of this is that the intensity of the light source and the responsiveness of the camera are assumed to be constant during the measurement process. However, a certain degree of drift is inevitable, and its impact will become more significant as the measurement process takes longer.

[0003] In the transient thermal reflection test, an image acquisition is required for each moment of interest at an unknown temperature, and because the exposure intensity is low, each image acquisition requires more frames to reach the same signal-to-noise ratio level, which significantly increases the time consumption of the transient thermal reflection test. Therefore, the test results are significantly affected by the intensity drift, which affects the accuracy of the test results on the one hand, and limits the test running time on the other hand (too long a time may cause the drift level to be too high so that the test results are unusable), thereby limiting the number of measurement time points. Summary of the invention

[0004] The embodiments of the present application provide a transient thermal reflection test method, system, apparatus and terminal device to solve the problem that the test results are significantly affected by intensity drift.

[0005] This application is implemented through the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a transient thermal reflection test method, comprising:

[0007] Obtain the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions;

[0008] Under the condition that the periodic excitation condition remains unchanged, a measurement delay and a reference delay are selected, and a camera measurement grayscale value and a camera reference grayscale value are obtained based on the measurement delay and the reference delay;

[0009] Based on the camera measurement grayscale value, the camera reference grayscale value, the thermal reflection coefficient and the average temperature, the temperature of the device under test at the measurement time is obtained;

[0010] The temperatures of the devices under test are sorted in ascending order according to the measurement delay, and the change of the measured temperature over time is obtained.

[0011] In combination with the first aspect, in some possible implementations, the camera measured grayscale value and the camera reference grayscale value are the result of a single exposure of the camera to capture an image or the result of averaging multiple frames.

[0012] In combination with the first aspect, in some possible implementations, the average temperature of the device under test after thermal equilibrium under periodic excitation conditions is: Among them, C TR is the thermal reflection coefficient, T b To measure the base temperature of the device under test without applying periodic excitation, c b is the camera basic grayscale value, c a is the gray value of the camera after thermal equilibrium under periodic excitation conditions.

[0013] In combination with the first aspect, in some possible implementations, the temperature of the device under test at the time of measurement is: T i =s i +T a +e, where c i Measure the gray value of the camera, c 0 is the camera reference grayscale value, e is the temperature difference between the reference temperature and the average temperature corresponding to the reference delay, T a is the average temperature of the device under test after thermal equilibrium under periodic excitation conditions, C TR is the thermal reflection coefficient.

[0014] In combination with the first aspect, in some possible implementations, the temperature difference between the reference temperature corresponding to the reference delay and the average temperature is: Wherein, i=1, 2, 3, ..., N; τ i To measure the delay, t c is the period of the excitation signal, and the excitation signal generates the periodic excitation condition.

[0015] In combination with the first aspect, in some possible implementations, the temperature difference between the reference temperature corresponding to the reference delay and the average temperature is: Among them, τ∈[0,t c ], s(τ) is s i The fitting function, t c is the period of the excitation signal, which generates a periodic excitation condition.

[0016] In a second aspect, an embodiment of the present application provides a transient thermal reflection test system, including: a microscope body, a camera, an LED light source, an LED driver, a device under test driver, a temperature control platform, a three-axis nano-displacement platform, a clock generation device, a computer, and an optical platform;

[0017] The temperature control platform is located on the three-axis nano-displacement platform, on which a device under test can be placed, and is used to control the temperature of the device under test and input the temperature information into a computer; the microscope body is placed on an optical platform, and the objective lens of the microscope body is directly opposite to the device under test placed on the temperature control platform; the camera is used to collect the image of the device under test through the eyepiece of the microscope body, obtain the image data of the device under test, and input the image data of the device under test into the computer; the LED driver is used to control the LED light source to generate LED light; the clock generating device is used to generate multiple synchronous clock signals required by the LED driver, the device under test driver and the camera; the device under test driver is used to apply current and voltage to the device under test to make the device under test work; the three-axis nano-displacement platform is placed on the base of the microscope body, and is used to control the movement of the device under test; the computer executes the method according to any one of claims 1 to 6 based on the temperature information and the image data information of the device under test; the computer is also used to control the camera to obtain the image data of the device under test, control the clock generating device to generate multiple synchronous clock signals, control the temperature control platform to adjust the temperature, and control the three-axis nano-displacement platform to move.

[0018] In a third aspect, an embodiment of the present application provides a transient thermal reflection testing device, including: an acquisition module, used to obtain the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions; a delay module, used to select a measurement delay and a reference delay when the periodic excitation conditions remain unchanged, and obtain a camera measurement grayscale value and a camera reference grayscale value based on the measurement delay and the reference delay; a calculation module, used to obtain the temperature of the device under test at the measurement moment based on the camera measurement grayscale value, the camera reference grayscale value, the thermal reflection coefficient and the average temperature; a result module, used to sort the temperatures of the device under test in ascending order of the measurement delay, and obtain the change of the measured temperature over time.

[0019] In a fourth aspect, an embodiment of the present application provides a terminal device, comprising: a processor and a memory, the memory being used to store a computer program, and the processor implementing the transient thermal reflection test method as described in any one of the first aspects when executing the computer program.

[0020] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the transient thermal reflection test method as described in any one of the first aspects is implemented.

[0021] In a sixth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on a terminal device, the terminal device executes the transient thermal reflection test method described in any one of the above-mentioned first aspects.

[0022] It can be understood that the beneficial effects of the second to sixth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0023] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0024] The present application obtains the camera measurement grayscale value and the camera reference grayscale value by selecting the measurement delay and the reference delay, and can obtain the temperature of the device under test at the measurement time based on the camera measurement grayscale value, the camera reference grayscale value, the thermal reflection coefficient and the average temperature after thermal equilibrium under periodic excitation conditions. Since the influence of intensity drift is limited to the measurement delay and the reference delay obtained in the same period, this differential measurement can effectively suppress the influence of intensity drift. Therefore, this magical transient thermal reflection test method has a high resistance to intensity drift.

[0025] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 It is a flow chart of a transient thermal reflection test method provided in one embodiment of the present application;

[0028] Figure 2 is a structural schematic diagram of a transient thermal reflection test system provided in an embodiment of the present application;

[0029] Figure 3 It is a schematic diagram of the timing relationship between the tested excitation, camera exposure and light source pulse illumination in a transient thermal reflection test provided by an embodiment of the present application;

[0030] Figure 4 is a structural schematic diagram of a transient thermal reflection testing device provided in one embodiment of the present application;

[0031] Figure 5 It is a structural diagram of a terminal device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0032] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0033] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0034] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0035] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0036] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0037] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0038] Figure 1is a schematic flow chart of a transient thermal reflection test method provided in an embodiment of the present application, referring to Figure 1 , the transient heat reflection test method is described as follows:

[0039] In step 101, the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions are obtained.

[0040] For ease of understanding, the calculation of the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions is explained in principle as follows:

[0041] The thermal reflection coefficient of the device under test can be considered to be linear, using C TR To express it, the definition is:

[0042]

[0043] Among them, C TR is the thermal reflection coefficient, R is the reflectivity, and T is the temperature.

[0044] It is very difficult to measure the reflectivity with high accuracy, but it is relatively easy to measure the relative change of reflectivity. Therefore, the formula (2) is adopted in engineering applications, that is, 0 Make a linear approximation near C TR Does not vary with temperature:

[0045]

[0046] Then, given that C TR Under the condition of , the temperature change can be deduced by measuring the relative change of reflectivity. This is the basic formula for thermal reflection temperature measurement:

[0047]

[0048] Among them, the relative change of reflectivity is ΔR / R 0 The relative change of the camera reading (gray value) Δc / c 0 To replace (assuming that the incident light intensity is constant), the above formula (3) can be rewritten into the following form with better operability:

[0049]

[0050] According to the results of the research on the principle of photothermal reflection, the intrinsic photothermal reflection characteristics of materials and the influencing factors, the accurate photothermal reflection coefficient C is obtained. TR It is the key to realize temperature measurement, and many factors such as the material being measured, the wavelength of the test light, the incident angle of the test light, etc. will affect C TRThe temperature measurement object is a microwave power device, whose surface material and structure are relatively complex. There is no feasible means to obtain the C TR Therefore, thermal reflection microthermography usually performs pixel-by-pixel C TR Calibration, then keep the light source, objective lens and the position of the test object unchanged, apply excitation to the test object and measure the temperature, so the test process must include C TR Calibration is to obtain pixel-by-pixel C values ​​for a specific test object under specific test conditions. TR Information used for temperature calculations.

[0051] Therefore, the core temperature measurement process is mainly divided into two steps: C TR Calibration and temperature testing.

[0052] C TR The calibration is based on the formula:

[0053]

[0054] In formula (5), T 1 , T 2 Set the temperature for the temperature control table, c 1 、c 2 is the camera reading obtained by collecting images at the set temperature. Only two temperature points are used here, and some literature uses multiple temperature points and then performs linear fitting to obtain C TR , but considering C TR The magnitude and stability of the device, especially the existence of light source intensity drift, takes a long time to measure multiple temperature points and is more susceptible to drift. The solution adopted here is to test only at two temperature points, and then repeat the measurement multiple times to observe each set of measurements to obtain C TR The average value of one or several groups of data after stabilization is selected as C TR The advantages of this solution are that, on the one hand, each set of measurements has only two temperature points, which can minimize the impact of drift, and on the other hand, averaging multiple sets of data can also achieve a noise suppression effect similar to linear fitting after multi-temperature measurement.

[0055] Get C TR After that, you can start temperature measurement, according to the formula:

[0056]

[0057] In formula (6), T r The reference temperature set for the temperature control stage, c r is the camera reading obtained when the device is not powered, i.e., when the image is acquired at the reference temperature, T m is the temperature to be measured, cm After powering up the device, the camera readings are taken while acquiring images at the temperature to be measured.

[0058] The above is an explanation of the calculation principle of the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions.

[0059] For example, according to the above principle, it is not difficult to derive the thermal reflection coefficient C TR .

[0060] Exemplarily, the camera measured grayscale value and the camera reference grayscale value are the result of a single exposure of the camera to capture an image or the result of averaging multiple frames.

[0061] Exemplarily, the average temperature of the device under test in the embodiment of the present application after thermal equilibrium under periodic excitation conditions is: Among them, C TR is the thermal reflection coefficient, T b To measure the base temperature of the device under test without applying periodic excitation, c b is the camera basic grayscale value, c a is the gray value of the camera after thermal equilibrium under periodic excitation conditions.

[0062] In step 102, under the condition that the periodic excitation condition remains unchanged, a measurement delay and a reference delay are selected, and a camera measurement grayscale value and a camera reference grayscale value are obtained based on the measurement delay and the reference delay.

[0063] Exemplarily, the measurement delay and the reference delay are in the same cycle. When the measurement delay and the reference delay are selected, the measurement delay is the time difference between the measurement moment and the start moment of the cycle in which the measurement moment is located, and the reference delay is the time difference between the reference moment and the start moment of the cycle in which the reference moment is located. For example, we assume that this cycle is from 9:00:00 to 9:05:00, that is, the cycle is 5 minutes, the measurement moment is 9:01:00, and the reference moment is 9:02:00, then the measurement delay is 1 minute and the reference delay is 2 minutes. In actual calculations, the measurement delay and the reference delay are usually very small, and the example here is only for the convenience of understanding this solution.

[0064] In step 103, the temperature of the device under test at the time of measurement is obtained based on the camera measurement grayscale value, the camera reference grayscale value, the thermal reflection coefficient and the average temperature.

[0065] Exemplarily, the temperature of the device under test at the time of measurement is: T i =s i +T a +e, where c i Measure the gray value of the camera, c 0is the camera reference grayscale value, e is the temperature difference between the reference temperature and the average temperature corresponding to the reference delay, T a is the average temperature of the device under test after thermal equilibrium under periodic excitation conditions, C TR is the thermal reflection coefficient.

[0066] Specifically, c i and c 0 The acquisition of the temperature should be close in time, and the overall time consumption is short enough so that the influence of intensity drift is small enough. The acceptable time consumption depends on the specific drift level and temperature measurement accuracy requirements.

[0067] Exemplarily, the temperature difference between the reference temperature corresponding to the reference delay and the average temperature is: Wherein, i=1, 2, 3, ..., N; τ i To measure the delay, t c is the period of the excitation signal, and the excitation signal generates the periodic excitation condition.

[0068] Specifically, i The weighted average of is taken as negative as e, that is Wherein, i=1, 2, 3, ..., N; τ i To measure the delay, t c is the period of the excitation signal, the excitation signal generates the periodic excitation condition, when the selected τ i When the distribution is approximately uniform, it can be considered that each τ i Corresponding temperature T i The mean value is approximately equal to T a ,Right now The weights are Right now

[0069] Exemplarily, the temperature difference between the reference temperature corresponding to the reference delay and the average temperature may also be: Among them, τ∈[0,t c ], s(τ) is s i The fitting function, t c is the period of the excitation signal, which generates a periodic excitation condition.

[0070] Specifically, s(τ) can be obtained by using known methods, such as piecewise polynomial fitting, linear interpolation, cubic spline interpolation, etc.

[0071] In step 104, the temperatures of the devices under test are sorted in ascending order according to the measurement delay, and the variation of the measured temperature over time is obtained.

[0072] The above-mentioned transient thermal reflection test method obtains the camera measurement grayscale value and the camera reference grayscale value by selecting the measurement delay and the reference delay, and can obtain the temperature of the device under test at the measurement time based on the camera measurement grayscale value, the camera reference grayscale value, the thermal reflection coefficient and the average temperature after thermal equilibrium under periodic excitation conditions. Since the influence of intensity drift is limited to the measurement delay and the reference delay obtained in the same period, this differential measurement can effectively suppress the influence of intensity drift. Therefore, this magical transient thermal reflection test method has a high resistance to intensity drift.

[0073] Optional, Figure 2 1 is a schematic diagram of the structure of a transient thermal reflection test system provided in an embodiment of the present application. As shown in the figure, the transient thermal reflection test system includes: a microscope body 201, a camera 202, an LED light source 203, an LED driver 204, a device under test driver 205, a temperature control platform 206, a three-axis nano-displacement platform 207, a clock generation device 208, a computer 209 and an optical platform 210.

[0074] The temperature control stage 206 is located on the three-axis nano-displacement stage 207, and can be used to place the device under test, control the temperature of the device under test, and input the temperature information into the computer 209. The microscope body 201 is placed on the optical platform 210, and the objective lens of the microscope body 201 is directly opposite to the device under test placed on the temperature control stage 206. The camera 202 is used to collect the image of the device under test through the eyepiece of the microscope body 201, obtain the image data of the device under test, and input the image data of the device under test into the computer 209. The LED driver 204 is used to control the LED light source 203 to generate LED light. The clock generating device 208 is used to generate multiple synchronous clock signals required by the LED driver 204, the device under test driver 205 and the camera 202. The device under test driver 205 is used to apply current and voltage to the device under test to make the device under test work. The three-axis nano-displacement stage 207 is placed on the base of the microscope body 201, and is used to control the movement of the device under test.

[0075] The computer 209 executes any of the above-mentioned transient thermal reflection test methods based on the temperature information and the image data information of the device under test. The computer 209 is also used to control the camera 202 to obtain the image data of the device under test, control the clock generation device 208 to generate multiple synchronous clock signals, control the temperature control stage 206 to adjust the temperature, obtain and calculate the temperature data related to the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions, and control the three-axis nano-displacement stage 207 to move.

[0076] Specifically, based on the transient thermal reflection test system, the image of the object being tested can be captured within a specific short period of time through finely controlled narrow pulse illumination, thereby achieving transient thermal reflection microscopic thermal imaging with high time resolution. Figure 3As shown, Figure 3 The core timing relationship in the transient thermal reflection test is depicted. On the one hand, the illumination pulse (i.e., LED light) is synchronized with the excitation signal of the measured object to ensure that the pulse illumination is applied at the corresponding moment within multiple working cycles of the measured object, so that multiple frames of images can be collected for average noise reduction. On the other hand, by adjusting the relative delay between the illumination pulse and the start time of the excitation, the temperature information of the measured object at different times within the working cycle can be obtained, and then the temperature change process of the measured object can be reconstructed.

[0077] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0078] Corresponding to the transient heat reflection test method described in the above embodiment, Figure 4 A structural block diagram of a transient thermal reflection testing device provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0079] See also Figure 4 The transient thermal reflection testing device in the embodiment of the present application may include an acquisition module 301, a delay module 302, a calculation module 303 and a result module 304.

[0080] Optionally, the acquisition module 301 is used to obtain the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions.

[0081] Exemplarily, the camera measured grayscale value and the camera reference grayscale value are the result of a single exposure of the camera to capture an image or the result of averaging multiple frames.

[0082] Exemplarily, the average temperature of the device under test in the embodiment of the present application after thermal equilibrium under periodic excitation conditions is: Among them, C TR is the thermal reflection coefficient, T b To measure the base temperature of the device under test without applying periodic excitation, c b is the camera basic grayscale value, c a is the gray value of the camera after thermal equilibrium under periodic excitation conditions.

[0083] Optionally, the delay module 302 is used to select a measurement delay and a reference delay when the periodic excitation condition remains unchanged, and obtain a camera measurement grayscale value and a camera reference grayscale value based on the measurement delay and the reference delay.

[0084] Optionally, the calculation module 303 is used to obtain the temperature of the device under test at the measurement time based on the camera measurement grayscale value, the camera reference grayscale value, the thermal reflection coefficient and the average temperature.

[0085] Exemplarily, the temperature of the device under test at the time of measurement is: T i =s i +T a +e, where c i Measure the gray value of the camera, c 0 is the camera reference grayscale value, e is the temperature difference between the reference temperature and the average temperature corresponding to the reference delay, T a is the average temperature of the device under test after thermal equilibrium under periodic excitation conditions, C TR is the thermal reflection coefficient.

[0086] Exemplarily, the temperature difference between the reference temperature corresponding to the reference delay and the average temperature is: Wherein, i=1, 2, 3, ..., N; τ i To measure the delay, t c is the period of the excitation signal, and the excitation signal generates the periodic excitation condition.

[0087] Exemplarily, the temperature difference between the reference temperature corresponding to the reference delay and the average temperature may also be: Among them, τ∈[0,t c ], s(τ) is s i The fitting function, t c is the period of the excitation signal, and the excitation signal generates the periodic excitation condition.

[0088] Optionally, the result module 304 is used to sort the temperatures of the measured devices in ascending order of the measurement delay to obtain the change of the measured temperature over time.

[0089] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0090] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0091] The present application also provides a terminal device, see Figure 5 The terminal device 500 may include: at least one processor 510 and a memory 520, wherein the memory 520 is used to store a computer program, and the processor 510 is used to call and run the computer program stored in the memory 520 to implement the steps in any of the above-mentioned method embodiments, for example Figure 1 Steps 101 to 104 in the illustrated embodiment. Alternatively, when the processor 510 executes the computer program, the functions of each module / unit in the above-mentioned device embodiments are implemented, for example Figure 4 Functions of modules 301 to 304 are shown.

[0092] Exemplarily, the computer program may be divided into one or more modules / units, one or more modules / units are stored in the memory 520, and executed by the processor 510 to complete the present application. The one or more modules / units may be a series of computer program segments capable of completing specific functions, and the program segments are used to describe the execution process of the computer program in the terminal device 500.

[0093] Those skilled in the art will understand that Figure 5 It is only an example of a terminal device and does not constitute a limitation on the terminal device. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components, such as input and output devices, network access devices, buses, etc.

[0094] The processor 510 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or the processor may be any conventional processor, etc.

[0095] The memory 520 may be an internal storage unit of the terminal device, or an external storage device of the terminal device, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. The memory 520 is used to store the computer program and other programs and data required by the terminal device. The memory 520 may also be used to temporarily store data that has been output or is to be output.

[0096] The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the bus in the drawings of the present application is not limited to only one bus or one type of bus.

[0097] The transient thermal reflection test method provided in the embodiment of the present application can be applied to transient thermal reflection testing, computers, wearable devices, vehicle-mounted devices, tablet computers, laptops, netbooks, mobile phones and other terminal devices. The embodiment of the present application does not impose any restrictions on the specific type of terminal devices.

[0098] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in each embodiment of the above-mentioned transient thermal reflection test method can be implemented.

[0099] An embodiment of the present application provides a computer program product. When the computer program product runs on a mobile terminal, the mobile terminal can implement the steps in each embodiment of the above-mentioned transient thermal reflection test method when executing the computer program product.

[0100] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device that can carry the computer program code to the camera device / terminal device, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a disk or an optical disk.

[0101] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0102] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0103] In the embodiments provided in the present application, it should be understood that the disclosed devices / network equipment and methods can be implemented in other ways. For example, the device / network equipment embodiments described above are merely schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0104] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0105] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A transient heat reflection test method, It is characterized in that include: Obtaining a thermal reflection coefficient of the device under test and an average temperature of the device under test after thermal equilibrium under periodic excitation conditions; Under the condition that the periodic excitation condition remains unchanged, a measurement delay and a reference delay are selected, and a camera measurement grayscale value and a camera reference grayscale value are obtained based on the measurement delay and the reference delay; Based on the camera measurement grayscale value, the camera reference grayscale value, the thermal reflection coefficient and the average temperature, obtaining the temperature of the device under test at the measurement time; The temperatures of the devices under test are sorted in ascending order according to the measurement delay, and the variation of the measured temperature over time is obtained; The temperature of the device under test at the measurement time is: T i =s i +T a +e, where c i The grayscale value measured by the camera, c 0 is the reference gray value of the camera, e is the temperature difference between the reference temperature corresponding to the reference delay and the average temperature, T a is the average temperature of the device under test after thermal equilibrium under periodic excitation conditions, C TR is the thermal reflection coefficient.

2. The transient heat reflection test method according to claim 1, It is characterized in that The camera measured grayscale value and the camera reference grayscale value are the result of a single exposure of the camera to collect an image or the result of averaging multiple frames.

3. The transient heat reflection test method according to claim 1, It is characterized in that The average temperature of the device under test after thermal equilibrium under periodic excitation conditions is: Among them, C TR is the thermal reflection coefficient, T b To measure the base temperature of the device under test without applying periodic excitation, c b is the camera basic grayscale value, c a is the gray value of the camera after thermal equilibrium under periodic excitation conditions.

4. The transient heat reflection test method according to claim 1, It is characterized in that The temperature difference between the reference temperature and the average temperature corresponding to the reference delay is: Wherein, i=1, 2, 3, ..., N; τ i To measure the delay, t c is the period of the excitation signal, and the excitation signal generates the periodic excitation condition.

5. The transient heat reflection test method according to claim 1, It is characterized in that The temperature difference between the reference temperature and the average temperature corresponding to the reference delay is: Among them, τ∈[0,tc], s(τ) is s i The fitting function, t c is the period of the excitation signal, and the excitation signal generates the periodic excitation condition.

6. A transient thermal reflection test system, It is characterized in that include: Microscope body, camera, LED light source, LED driver, DUT driver, temperature control table, three-axis nano-displacement table, clock generation device, computer and optical platform; The temperature control platform is located on the three-axis nano-displacement platform, can be used to place the device under test, and is used to control the temperature of the device under test and input the temperature information into the computer; The microscope body is placed on the optical platform, and the objective lens of the microscope body is directly opposite to the device under test placed on the temperature control platform; The camera is used to collect an image of the device under test through the eyepiece of the microscope body, obtain image data of the device under test, and input the image data of the device under test into the computer; The LED driver is used to control the LED light source to generate LED light; The clock generating device is used to generate a plurality of synchronous clock signals required by the LED driver, the device under test driver and the camera; The device under test driver is used to apply current and voltage to the device under test to make the device under test work; The three-axis nano-displacement stage is placed on the microscope base and is used to control the movement of the device under test; The computer executes the method according to any one of claims 1 to 5 based on the temperature information and the image data information of the device under test; The computer is also used to control the camera to acquire image data of the device under test, control the clock generating device to generate multiple synchronous clock signals, control the temperature control stage to adjust the temperature, and control the three-axis nano-displacement stage to move.

7. A transient heat reflection test device, It is characterized in that include: An acquisition module, used to acquire the thermal reflection coefficient of the device under test and the average temperature of the device under test after thermal equilibrium under periodic excitation conditions; A time delay module, used for selecting a measurement time delay and a reference time delay when the periodic excitation condition remains unchanged, and obtaining a camera measurement grayscale value and a camera reference grayscale value based on the measurement time delay and the reference time delay; A calculation module, used for obtaining the temperature of the device under test at the time of measurement based on the camera measurement gray value, the camera reference gray value, the thermal reflection coefficient and the average temperature; The result module is used to sort the temperature of the device under test in the order of the measured delay from small to large, and obtain the change of the measured temperature over time; The temperature of the device under test at the measurement time is: T i =s i +T a +e, where c i The grayscale value measured by the camera, c 0 is the reference gray value of the camera, e is the temperature difference between the reference temperature corresponding to the reference delay and the average temperature, T a is the average temperature of the device under test after thermal equilibrium under periodic excitation conditions, C TR is the thermal reflection coefficient.

8. A terminal device, It is characterized in that include: A processor and a memory, the memory being used to store a computer program, the processor being used to call and run the computer program stored in the memory to execute the transient thermal reflection test method according to any one of claims 1 to 5.

9. A computer-readable storage medium storing a computer program. It is characterized in that When the computer program is executed by a processor, the transient thermal reflection test method according to any one of claims 1 to 5 is implemented.

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