High-precision die bonding system, alignment system and their methods

Abstract

The present invention discloses a high-precision die-bonding system, a high-precision die-bonding method, and an alignment system for high-precision die-bonding. The high-precision die-bonding system includes: a supply unit for setting a die; a receiving unit adjacent to the supply unit; a relay unit disposed between the supply unit and the receiving unit; a suction unit disposed above the supply unit, and the suction unit places the die on the relay unit; and a bonding assembly disposed above the receiving unit. The bonding assembly places the die located on the relay unit on the receiving unit. A high-precision die-bonding system includes: a supply unit for setting a die; a receiving unit adjacent to the supply unit; a relay unit disposed between the supply unit and the receiving unit; a suction unit disposed above the supply unit, and the suction unit places the die on the relay unit; and a bonding assembly disposed above the receiving unit.

Description

Technical Field

[0001] A high-precision die bonding system, alignment system and method thereof, especially a system and method capable of improving cleanliness and die bonding precision. Background Art

[0002] Existing die bonding technologies use a vacuum suction device to suck at least one die, and then move the sucked die to a position to be bonded, such as a wafer, a die, or a carrier plate. The vacuum suction device then bonds the die to the position to be bonded.

[0003] However, the vacuum suction device makes a long-distance displacement from the die sucking position to the position to be bonded. For a die bonding process that requires cleanliness, this long-distance displacement will generate dust due to friction between devices, and this dust may damage the cleanliness.

[0004] As described above, there is room for improvement in how to improve cleanliness, or shorten the moving distance of the vacuum suction device, or change the position of the vacuum suction device. Summary of the Invention

[0005] In view of this, the main object of the present invention is to propose a high-precision die bonding system, alignment system and method thereof, which avoid the displacement device of the system from operating above the wafer or die to improve cleanliness.

[0006] The present invention provides a high-precision die bonding system to achieve the above object, including: a supply unit for setting a die; a receiving unit adjacent to the supply unit; a relay unit disposed between the supply unit and the receiving unit; a suction unit disposed above the supply unit, and the suction unit places the die on the relay unit; and a bonding assembly disposed above the receiving unit; wherein, the bonding assembly places the die located on the relay unit on the receiving unit.

[0007] In summary, for the high-precision die bonding system and method of the present invention, the displacement device of the system is disposed non-directly above or below the supply unit or the receiving unit. Therefore, when the first relay station or the second relay station moves, the dust that may be generated cannot fall on the supply unit or the receiving unit, so as to improve cleanliness. As for the vacuum module, since there is only up and down movement, without lateral displacement movement or only a small lateral displacement, as long as appropriate isolation is made with a partition plate, it can prevent dust from falling from above to the receiving unit. Brief Description of the Drawings

[0008] Figure 1 It is a schematic diagram of a high-precision die bonding system according to the first embodiment of the present invention.

[0009] Figure 2A partial schematic diagram of a high-precision die bonding system according to the first embodiment of the present invention.

[0010] Figure 3 A flowchart of a high-precision die bonding method according to the second embodiment of the present invention.

[0011] Figure 4 A registration schematic diagram of an adhesive mark and a die mark.

[0012] Figure 5 A schematic diagram of a high-precision die bonding system according to the third embodiment of the present invention.

[0013] Figure 6 A partial schematic diagram of a high-precision die bonding system according to the third embodiment of the present invention.

[0014] Figure 7 A schematic diagram of a high-precision die bonding system according to the fourth embodiment of the present invention.

[0015] Figure 8 A partial schematic diagram of a high-precision die bonding system according to the fourth embodiment of the present invention.

[0016] Figure 9 An alignment system for high-precision die bonding according to the fifth embodiment of the present invention.

[0017] Description of reference numerals: 10, 10A, 10B - supply unit; 100, 100A - supply table; 101, 101A - ejector pin; 11, 11A, 11B - suction unit; 110, 110A, 110B - vacuum module; 111, 111A, 111B - suction displacement module; 12, 12A, 12B - receiving unit; 120, 120A, 120B - bearing platform; 13, 13A, 13B - relay unit; 130, 130A, 130B - displacement module; 131, 131A, 131B - first relay table; 132, 132B - second relay table; 14, 14A, 14B - first bonding unit; 140, 140A - first vacuum module; 141 - first transparent module; 15, 15A, 15B - second bonding unit; 150, 150A - second vacuum module; 151 - second transparent module; 154 - separator; 16, 16A, 16B - first upper vision unit; 17, 17A, 17B - second upper vision unit; 18, 18A, 18B - third upper vision unit; 19, 19A, 19B - lower vision unit; 20, 20A, 20B, 30 - die; 200, 300 - die mark; 301 - transparent area; 21, 31 - parts to be bonded; 210, 310 - bonding mark; S1 to S7 - steps; 40 - upper vision unit; 41 - bonding unit; 410 - vacuum module; 411 - transparent module; 42 - receiving unit; 420 - bearing platform; 43 - lower vision unit. Detailed description of the preferred embodiments

[0018] The first preferred embodiment of the present invention is a high-precision die bonding system, as Figure 1 shown in Figure 2 shown, the high-precision die bonding system has a supply unit 10, a suction unit 11, a receiving unit 12, a relay unit 13, a bonding assembly, a first upper vision unit 16, a second upper vision unit 17, a third upper vision unit 18 and a lower vision unit 19.

[0019] The supply unit 10 has a supply table 100 and at least one ejector pin 101. The supply table 100 is used to set at least one die 20. The ejector pin 101 is disposed below the supply table 100, and the ejector pin 101 can be single or multiple. If it is a single ejector pin 101, the ejector pin 101 ejects a single die 20 set on the supply table 100. If it is multiple ejector pins 101, the ejector pins 101 eject multiple dies 20 set on the supply table 100. The supply table 100 can perform a lateral movement, a front-back movement or a lateral and front-back movement.

[0020] The suction unit 11 has at least one vacuum module 110 and a suction displacement module 111. The vacuum module 110 is disposed on one side of the suction displacement module 111 and is located above the supply unit 10. The suction displacement module 111 can perform a lateral movement, a forward and backward movement, or a vertical movement.

[0021] The receiving unit 12 is adjacent to the supply unit 10. The receiving unit 12 has a base 120, and the base 120 can be transparent or partially transparent to facilitate the penetration and capture of images. The base 120 can perform a lateral movement, a forward and backward movement, or a lateral and forward and backward movement. The base 120 is for setting a component to be bonded 21, and the component to be bonded 21 is transparent and has a bonding mark 210. The component to be bonded 21 is a wafer, a die, or a carrier plate.

[0022] The relay unit 13 is located between the supply unit 10 and the receiving unit 12. The relay unit has a displacement module 130, a first relay platform 131, and a second relay platform 132. The first relay platform 131 and the second relay platform 132 are disposed at two opposite ends of the displacement module 130. In this embodiment, the relay unit 13 is of a double-wing design. The displacement module 130 can perform a forward and backward movement, a lateral movement, or a rotational movement. The first relay platform 131 and the second relay platform 132 are arranged in parallel.

[0023] The bonding assembly includes a first bonding unit 14 and a second bonding unit 15. The first bonding unit 14 is located above the receiving unit 12. The first bonding unit 14 has at least one first vacuum module 140. The first vacuum module 140 has a first transparent module 141. The first transparent module 141 can be a transparent body or a perforation.

[0024] The second bonding unit 15 is located above the receiving unit 12 and is adjacent to the first bonding unit 14. The second bonding unit 15 has at least one second vacuum module 150. The second vacuum module 150 has at least one second transparent module 151. The second transparent module 151 can be a transparent body or a perforation. In the bonding assembly of the present invention, the first bonding unit 14 and the second bonding unit 15 of the bonding assembly are stationary or do not make large-stroke movements, and a partition plate 154 can be installed, so pollution can be reduced.

[0025] The first upper vision unit 16 is disposed above the suction unit 11 and the supply table 100. To elaborate further, the first upper vision unit 16 is located above the vacuum module 110. The first upper vision unit 16 can have at least one vision module.

[0026] The second upper vision unit 17 is disposed above the relay unit 13. To elaborate further, the second upper vision unit 17 is located above the first relay platform 131 or the second relay platform 132 and is adjacent to the supply unit 10. The second upper vision unit 17 can have at least one vision module.

[0027] The third upper vision unit 18 is located above the first bonding unit 14 and the second bonding unit 15. The third upper vision unit 18 has at least one vision module, and each vision module is located above the second vacuum module 150 or the first vacuum module 140.

[0028] The lower vision unit 19 is located below the receiving unit 12. For further discussion, the lower vision unit 19 has at least one vision module. The lower vision unit 19 is located below the base 120. If the first upper vision unit 16, the second upper vision unit 17, the third upper vision unit 18, and the lower vision unit 19 use infrared sensing cameras, the crystal grain and the component to be bonded do not necessarily need to have a transparent area. As long as it is a silicon material or a material through which infrared rays can penetrate, imaging and alignment can still be performed.

[0029] The second embodiment of the present invention is a high-precision die bonding method, as Figure 3 shown.

[0030] Step S1, provide at least one crystal grain. As Figure 1 and Figure 2 shown, the ejector pin 101 ejects the crystal grain 20 to be ejected on the supply table 100. The first upper vision unit 16 captures the image information of the ejected crystal grain 20 and transmits the image information to the suction unit 11. The vacuum module 110 of the suction unit 11 sucks the crystal grain 20 according to the image information. The vacuum module 110 sucks at least one crystal grain 20 or multiple crystal grains 20.

[0031] For further discussion, the supply table 100 of the supply unit 10 performs a forward and backward displacement, a lateral displacement, or a lateral and forward and backward movement to move the crystal grain 20 to be sucked to below the vacuum module 110.

[0032] After the crystal grain 20 to be sucked is moved below the vacuum module 110, the first upper vision unit 16 captures the image information of the crystal grain 20 to be ejected, and the ejector pin 101 ejects the crystal grain 20 according to the image information.

[0033] The first upper vision unit 16 captures the image information of the ejected crystal grain 20 and transmits the image information to the suction unit 11. The vacuum module 110 of the suction unit 11 sucks the crystal grain 20 according to the image information.

[0034] Step S2, transfer at least one crystal grain to a relay unit. The suction displacement module 111 moves the vacuum module 110 sucking the crystal grain 20 to above the first relay table 131 of the relay unit 13.

[0035] The second upper vision unit 17 captures the image information of the die 20 and the first relay station 131 of the relay unit 13, and transmits the image information to the suction unit 11, so that the vacuum module 110 places the die 20 on the first relay station 131.

[0036] After the vacuum module 110 places the die 20 on the first relay station 131, the suction displacement module 111 moves the vacuum module 110 back to the original position to suck the die 20 again.

[0037] The displacement module 130 performs a rotation action to rotate the first relay station 131 above the bearing platform 120 and the second relay station 132 above the supply platform 100. Then the displacement module 130 moves the first relay station 131 below the first bonding unit 14.

[0038] Step S3, align the position of at least one die with the receiving unit. The third upper vision unit 18 captures the image information of the die 20 and provides the image information to the first bonding unit 14, so that the first vacuum module 140 sucks the die 20 located on the first relay station 131.

[0039] After the first vacuum module 140 sucks the die 20, the bearing platform 120 performs a position adjustment on the first vacuum module 140, so that the bonding part 21 to be bonded on the bearing platform 120 can move to the position where the die 20 is to be placed. This position adjustment is a lateral displacement, a front-back displacement or a lateral and front-back displacement.

[0040] After the bearing platform 120 stops moving, please refer to Figure 4 As shown, the third upper vision unit 18 captures the upper image information of the die mark 200 on the die 20 and the bonding mark 210 of the bonding part 21 through the first transparent module 141.

[0041] The lower vision unit 19 captures the lower image information of the bonding mark 210 and the die mark 200 through the bearing platform 120. The bearing platform is transparent or partially transparent to facilitate the penetration and capture of the image.

[0042] The upper image information and the lower image information can determine whether the die 20 is located at the position where the die 20 is to be placed on the bearing platform 120.

[0043] If so, go to step S5.

[0044] If not, the first vacuum module 140 performs a position adjustment to align the die mark 200 with the bonding mark 210. This position adjustment can be an angular rotation, an axial movement or a lateral movement. The third upper vision unit 18 captures the upper image information again, and the lower vision unit 19 captures the lower image information again to determine whether the die 20 is located at the position where the die 20 is to be placed on the bearing platform 120.

[0045] If it is determined from the lower image information of the upper image information retrieved again that the die mark 200 has been aligned with the bonding mark 210, proceed to step S5.

[0046] Step S4, provide at least one die again. The supply table 100 of the supply unit 10 performs a lateral movement, a front-back movement, or a lateral and front-back movement to move the die 20 to be picked up below the vacuum module 110.

[0047] After the die 20 to be picked up is moved below the vacuum module 110, the first upper vision unit 16 retrieves the image information of the die 20 to be ejected, and the ejector pin 101 ejects the die 20 again based on the image information.

[0048] The first upper vision unit 16 retrieves the image information of the ejected die 20 and transmits the image information to the suction unit 11. The vacuum module 110 of the suction unit 11 sucks the die 20 based on the image information.

[0049] The displacement module 130 moves the second relay table 132 below the vacuum module 110 that has sucked the die 20.

[0050] Step S5, place at least one die on the receiving unit. As described in step S3. The first vacuum module 140 of the first bonding unit 14 places the sucked die 20 on the bonding part 21 of the receiving table 120 of the receiving unit 12.

[0051] Step S6, transfer at least one die to the relay unit again. As described in step S4, the suction unit 11 places the sucked die 20 on the second relay table 132.

[0052] Step S7, align the positions of at least one die and the receiving unit again. The third upper vision unit 18 retrieves the image information of the die 20 and provides the image information to the second bonding unit 15 so that the second vacuum module 150 sucks the die 20 located on the second relay table 132.

[0053] After the second vacuum module 150 sucks the die 20, the receiving table 120 makes a position adjustment to the second vacuum module 150 so that the receiving table 120 can move to the position where the die 20 is to be placed. The position adjustment can be a lateral movement, a front-back movement, or a lateral and front-back movement.

[0054] After the receiving table 120 moves to the position where the die 20 is to be placed, the third upper vision unit 18 retrieves the upper image information of the die mark 200 and the bonding mark 210 through the second transparent module 151 of the second bonding unit 15. The lower vision unit 19 retrieves the lower image information of the die mark 200 and the bonding mark 210 through the receiving table 12.

[0055] Based on the upper image information and the lower image information, it is determined whether the die mark 200 is aligned with the bonding mark 210. If they are aligned, the second bonding unit 15 places the die 20 on the carrier 12. If not, the second vacuum module 150 of the second bonding unit 15 makes a position adjustment to align the die mark 200 with the bonding mark 210. This position adjustment is an angular rotation, a lateral movement, or a forward and backward movement, and the upper image information and the lower image information are captured again to determine whether the die 20 is located at the desired die placement position on the carrier 120, that is, the part to be bonded 21.

[0056] If it is determined from the upper image information and the lower image information captured again that the die mark 200 is aligned with the bonding mark 210, the second vacuum module 150 of the second bonding unit 15 places the die 20 at the desired die placement position on the carrier 120, that is, the part to be bonded 21.

[0057] If the second bonding unit 15 has placed the die 20 on the part to be bonded 21 on the carrier 12, it returns to step S1.

[0058] The third embodiment of the present invention is a high-precision die bonding system, as Figure 5 and Figure 6 shown, the high-precision die bonding system has a supply unit 10A, a suction unit 11A, a receiving unit 12A, a relay unit 13A, a first bonding unit 14A, a second bonding unit 15A, a first upper vision unit 16A, a second upper vision unit 17A, a third upper vision unit 18A, and a lower vision unit 19A.

[0059] In the third embodiment, the supply unit 10A, the suction unit 11A, the receiving unit 12A, the relay unit 13A, the first bonding unit 14A, the second bonding unit 15A, the first upper vision unit 16A, the second upper vision unit 17A, the third upper vision unit 18A, and the lower vision unit 19A are arranged in the same manner as in the first embodiment of the high-precision die bonding system of the present invention described above, so no further elaboration will be made here, and it is stated first.

[0060] The difference between the third embodiment and the above-mentioned first embodiment is that the relay unit 13A only has a first relay table 131A and a displacement module 130A. The first relay table 131A is provided on one side of the displacement module 130A, making the relay unit 13A of this embodiment a single-wing design.

[0061] A high-precision die bonding method according to the second embodiment of the present invention, as Figure 3 shown.

[0062] Step S1, provide at least one die. As Figure 5As shown, the ejector pin 101A ejects the die 20A to be ejected on the supply table 100A. The first upper vision unit 16A captures the image information of the ejected die 20A and transmits the image information to the suction unit 11A. The vacuum module 110A of the suction unit 11A sucks the die 20A according to the image information. The vacuum module 110A sucks at least one die 20A or multiple dies 20A.

[0063] Step S2: Transfer at least one die to a relay unit. The suction displacement module 111A moves the vacuum module 110A sucking the die 20A above the first relay table 131A of the relay unit 13A.

[0064] The second upper vision unit 17A captures the image information of the die 20A and the first relay table 131A of the relay unit 13A, and transmits the image information to the suction unit 11A, so that the vacuum module 110A places the die 20A on the first relay table 131A.

[0065] After the vacuum module 110A places the die 20A on the first relay table 131A, the suction displacement module 111A moves the vacuum module 110A back to the original position to suck the die 20A again.

[0066] Step S3: Align the positions of at least one die and a receiving unit. This is the same as step S3 in the high-precision die bonding method of the present invention as described above, so no further elaboration will be made here and it is stated first.

[0067] Step S4: Provide at least one die again. The supply table 100A of the supply unit 10A performs a lateral movement, a front-back movement, or a lateral and front-back movement to move the die 20A to be sucked below the vacuum module 110A.

[0068] After the die 20A to be sucked moves below the vacuum module 110A, the first upper vision unit 16A captures the image information of the die 20A to be ejected, and the ejector pin 101A ejects the die 20A according to the image information.

[0069] The first upper vision unit 16A captures the image information of the ejected die 20A and transmits the image information to the suction unit 11A. The vacuum module 110A of the suction unit 11A sucks the die 20A according to the image information.

[0070] The displacement module 130A moves the first relay table 131A below the vacuum module 110A sucking the die 20A.

[0071] Step S5: Place at least one die on the receiving unit. This is the same as step S5 in the high-precision die bonding method of the present invention as described above, so no further elaboration will be made here and it is stated first.

[0072] Step S6, transfer at least one die to the relay unit again. The vacuum module 110A of the pick-up unit 11A places the picked-up die 20A on the first relay table 131A.

[0073] Step S7, align the positions of at least one die and a receiving unit again. The third upper vision unit 18A captures the image information of the die 20A and provides the image information to the second bonding unit 15A, so that the second vacuum module 150A picks up the die 20A located on the first relay table 131A.

[0074] After the second vacuum module 150A picks up the die 20A, the mounting table 120A adjusts the position of the second vacuum module 150A, so that the mounting table 120A can move to the position where the die 20A is to be placed, that is, the component to be bonded 21A.

[0075] As described in step S3, it can be determined whether the die 20A is located at the position where the die is to be placed on the mounting table 120A through the upper image information and the lower image information. To place the die on the component to be bonded 21A of the mounting table 120A.

[0076] Through the upper image information and the lower image information, it is judged whether the die mark and the bonding mark are aligned. If they are aligned, the second bonding unit 15A places the die 20A on the mounting table 12A. If they are not aligned, the second vacuum module 150A of the second bonding unit 15A makes a position adjustment to align the die mark with the bonding mark. The position adjustment is an angular rotation, a lateral movement or a forward and backward movement. And capture the upper image information and the lower image information again to judge whether the die 20A is located at the position where the die is to be placed on the mounting table 120A.

[0077] If it is judged from the upper image information and the lower image information captured again that the die mark has been aligned with the bonding mark, the second vacuum module 150A of the second bonding unit 15A places the die 20A at the position where the die is to be placed on the mounting table 120A.

[0078] If the second bonding unit 15A has placed the die 20A on the mounting table 12A, then return to step S1.

[0079] The fourth embodiment of the present invention is a high-precision die bonding system, as Figure 7 and Figure 8 shown, the high-precision die bonding system has a supply unit 10B, a pick-up unit 11B, a receiving unit 12B, a relay unit 13B, a first bonding unit 14B, a second bonding unit 15B, a first upper vision unit 16B, a second upper vision unit 17B, a third upper vision unit 18B and a lower vision unit 19B.

[0080] In the fourth embodiment, the supply unit 10B, the suction unit 11B, the receiving unit 12B, the relay unit 13B, the first bonding unit 14B, the second bonding unit 15B, the first upper vision unit 16B, the second upper vision unit 17B, the third upper vision unit 18B and the lower vision unit 19B are arranged in the same way as in the first embodiment of the high-precision die bonding system of the present invention described above, so no further description will be given here, and it is hereby stated first.

[0081] The difference between the fourth embodiment and the above-mentioned first embodiment is that the relay unit 13B has a first relay platform 131B, a second relay platform 132B and a displacement module 130B. The first relay platform 131B and the second relay platform 132B are arranged on two opposite sides of the displacement module 130B, and the first relay platform 131B and the second relay platform 132B are arranged in a staggered manner, so that the relay unit 13B in this embodiment is a staggered design.

[0082] A high-precision die bonding method according to the second embodiment of the present invention is as Figure 3 shown.

[0083] Step S1: Provide at least one die. This is the same as step S1 in the high-precision die bonding method of the present invention described above, so no further description will be given here, and it is hereby stated first.

[0084] Step S2: Transfer at least one die to a relay unit. The suction displacement module 111B moves the vacuum module 110B sucking the die 20B above the first relay platform 131B of the relay unit 13B.

[0085] The second upper vision unit 17B captures the image information of the die 20B and the first relay platform 131B of the relay unit 13B, and transmits the image information to the suction unit 11B, so that the vacuum module 110B places the die 20B on the first relay platform 131B.

[0086] After the vacuum module 110B places the die 20B on the first relay platform 131B, the suction displacement module 111B moves the vacuum module 110B back to the original position to suck the die 20B again.

[0087] The displacement module 130B moves the first relay platform 131B above the bearing platform 120B, and moves the second relay platform 132B above the supply platform 100B. Then the displacement module 130B moves the first relay platform 131B below the first bonding unit 14B.

[0088] In this embodiment, steps S3 to S7 are the same as steps S3 to S7 in the high-precision die bonding method of the present invention described above, so no further description will be given here, and it is hereby stated first.

[0089] Figure 9A positioning system for high-precision die bonding according to the fifth embodiment of the present invention Figure 9 Displays the alignment of the bonding mark and a die mark. The positioning system for high-precision die bonding of the present invention is applicable to a die 30 having a die mark 300. The positioning system includes an upper vision unit 40, a bonding unit 41, a receiving unit 42, and a lower vision unit 43.

[0090] The bonding unit 41 has a vacuum module 410, and the vacuum module 410 has a transparent module 411. The transparent module 411 is a transparent body or a perforation.

[0091] The upper vision unit 40 is disposed above the bonding unit 41.

[0092] The receiving unit 42 has a base 420. The base 420 is transparent. The base 420 is for a component 31 to be bonded to be disposed. The component 31 to be bonded is transparent and has at least one bonding mark 310.

[0093] The above-mentioned die 30 has at least one transparent area 301, and the die mark 300 is located in the transparent area 301.

[0094] As described above, the vacuum module 410 sucks the die 30. The upper vision unit 40 captures the upper image information of the die mark 300 and the bonding mark 310 through the transparent module 411 and the transparent area 301. The lower vision unit 43 captures the lower image information of the bonding mark 310 and the die mark 300 through the base 420 and the component 31 to be bonded. Whether the die 30 is aligned with the component 31 to be bonded on the base 420 is known through the upper image information and the lower image information. When precise alignment is required for the positioning system for high-precision die bonding, the bonding unit 41 is laterally shifted or the base 420 is laterally shifted for alignment to achieve precise alignment between the die 30 and the component 31 to be bonded.

[0095] In summary, for the high-precision die bonding system and method of the present invention, the displacement device of the system is disposed above or below the supply unit or the receiving unit in a non-direct manner. Therefore, when the vacuum module, the first relay table, or the second relay table moves, the fine dust that may be generated cannot fall onto the supply unit or the receiving unit, thereby improving the cleanliness.

[0096] In addition, the moving distance of the first vacuum module or the second vacuum module is very small, so the fine dust that may be generated is very little, and thus the cleanliness can also be maintained.

[0097] Furthermore, the design of the relay unit, the first bonding unit, and the second bonding unit of the present invention can provide at least one die to the receiving unit at a time, thereby improving the die bonding rate.

[0098] Furthermore, the alignment method used in the present invention utilizes the alignment between the die marks and the bonding marks, so the die bonding accuracy can be improved.

[0099] Secondly, the first bonding unit and the second bonding unit of the bonding assembly of the present invention are stationary or do not move in a large stroke, and a separator plate can be installed, so pollution can be reduced. At the same time, for the sake of accuracy, the first bonding unit and the second bonding unit of the bonding assembly can move slightly laterally. Therefore, the present invention has the characteristics of low pollution and high accuracy.

Claims

1. A high-precision die-bonding system, characterized in that, Comprising: A supply unit for setting a die; A receiving unit adjacent to the supply unit; A relay unit disposed between the supply unit and the receiving unit; A pick-up unit disposed above the supply unit, and the pick-up unit places the die on the relay unit; and An adhesive assembly disposed above the receiving unit; Wherein, the adhesive assembly places the die located on the relay unit on the receiving unit; Wherein, the relay unit has a displacement module and a first relay platform, and the first relay platform is disposed on one side of the displacement module; Wherein, the pick-up unit has at least one vacuum module and a pick-up displacement module, and the vacuum module is disposed on the pick-up displacement module; Wherein, both the displacement module and the pick-up displacement module are disposed neither directly above nor directly below the supply unit or the receiving unit, The pick-up unit places the die on the relay unit through the following steps: The pick-up displacement module moves the vacuum module sucking the die above the first relay platform of the relay unit; A second upper vision unit captures image information of the die and the first relay platform, and transmits the image information to the pick-up unit, so that the vacuum module places the die on the first relay platform; The displacement module of the relay unit performs a rotation action, so that the first relay platform is rotated above a bearing platform of the receiving unit; Or, the displacement module performs a rotation action, so that the first relay platform is rotated above the bearing platform, and a second relay platform is rotated above a supply platform of the supply unit, and then the displacement module moves the first relay platform below a first adhesive unit of the adhesive assembly; and Or, the displacement module moves the first relay platform above the bearing platform, and the second relay platform is moved above the supply platform, and then the displacement module moves the first relay platform below the first adhesive unit.

2. The high-precision die bonding system according to claim 1, wherein The supply unit has a supply platform and at least one ejector pin, the ejector pin is disposed below the supply platform, the supply platform is for setting the die, and the ejector pin ejects the die.

3. The high-precision die bonding system according to claim 2, wherein The supply platform can perform a lateral movement, a front-back movement, or a lateral and front-back movement.

4. The high-precision die-bonding system according to claim 1, characterized in that The receiving unit has a bearing platform.

5. The high-precision die-bonding system according to claim 4, wherein The bearing platform is transparent or partially transparent to facilitate the penetration and capture of images, and the bearing platform can perform a lateral movement, a front-back movement, or a lateral and front-back movement.

6. The high-precision die bonding system according to claim 1, wherein, The second relay platform is disposed on the other side of the displacement module, the first relay platform and the second relay platform are arranged in a parallel arrangement or a staggered arrangement, and the displacement module can perform a front-back movement, a lateral movement, or a rotational movement.

7. The high-precision die-bonding system according to claim 1, wherein The adhesive assembly has a second adhesive unit; the first adhesive unit has at least one first vacuum module, and the first vacuum module has a first transparent module; the second adhesive unit has at least one second vacuum module, and the second vacuum module has at least one second transparent module.

8. The high-precision die-bonding system according to claim 1, wherein, There is also a first upper vision unit, a third upper vision unit and a lower vision unit. The first upper vision unit is disposed above the suction unit, the second upper vision unit is located above the relay unit, the third upper vision unit is located above the first bonding unit and the second bonding unit, and the lower vision unit is located below the receiving unit.

9. A high-precision die bonding method, characterized in that, Including the following steps: Provide a supply unit for setting a die for a suction unit, and the suction unit sucks the die; The suction unit transfers the sucked die to a relay unit; The relay unit moves the die to below a bonding assembly, and the bonding assembly sucks the die; Move a receiving unit to the position where the die is to be placed, and the die is aligned with the position where the die is to be placed on the receiving unit; The supply unit provides another die to the suction unit again, and the suction unit sucks the die; Place the other die on the receiving unit, and the bonding assembly places the die at the position where the die is to be placed on the receiving unit; Transfer the other die to the relay unit, and the suction unit places the other die on the relay unit; The relay unit moves the other die to below the bonding assembly; and The bonding assembly sucks the other die, the receiving unit moves to the position where the die is to be placed, the other die is aligned with the position where the die is to be placed, and the bonding assembly places the other die at the position where the die is to be placed; In the step of providing the die, the following steps are further included: A supply table of the supply unit performs a forward and backward displacement, a lateral displacement or a lateral and forward and backward movement to move the die to be sucked below the vacuum module of the suction unit; A first upper vision unit captures image information of the die to be ejected, and at least one ejector pin ejects the die according to the image information; and The first upper vision unit captures image information of the ejected die and transmits the image information to the suction unit, and the vacuum module sucks the die according to the image information; In the step of transferring the die to a relay unit, the following steps are further included: A suction displacement module moves the vacuum module sucking the die above a first relay table of the relay unit; A second upper vision unit captures image information of the die and the first relay table and transmits the image information to the suction unit, so that the vacuum module places the die on the first relay table; A displacement module of the relay unit performs a rotation action to rotate the first relay table above a mounting table of the receiving unit. Wherein, the displacement module and the suction displacement module are both disposed not directly above or below the supply unit or the receiving unit; Alternatively, the displacement module performs a rotation action to rotate the first relay table above the mounting table and a second relay table above a supply table of the supply unit, and the displacement module then moves the first relay table below a first bonding unit of the bonding assembly; and Alternatively, the displacement module moves the first relay station above the bearing platform, and the second relay station is moved above the supply platform, and then the displacement module moves the first relay station below the first bonding unit.

10. The high-precision die bonding method according to claim 9, wherein In the step of transferring the die to the relay unit again, the suction unit sucks the die located in the supply unit and places the die on the second relay station; or the suction unit places the sucked die on the first relay station.

11. The high-precision die bonding method according to claim 9, wherein In the step of aligning the positions of the die and the receiving unit, the following steps are further included: A third upper vision unit captures the image information of the die, and the image information is provided to the first bonding unit, so that a first vacuum module of the first bonding unit is located above the die on the first relay station; the bearing platform moves to the position where the die is to be placed; The third upper vision unit captures the upper image information of the die mark of the die and the bonding mark of a bonding part on the bearing platform through a first transparent module of the first vacuum module; A lower vision unit captures the lower image information of the bonding mark and the die mark through the bearing platform; the upper image information and the lower image information can determine whether the die is located at the position where the die is to be placed on the bearing platform; If so, proceed to the step of placing the die on the receiving unit; if not, the first vacuum module makes a position adjustment to align the die mark with the bonding mark; the third upper vision unit captures the upper image information again, and the lower vision unit captures the lower image information again to determine whether the die is located at the position where the die is to be placed; and If the die mark has been aligned with the bonding mark, proceed to the step of placing the die on the receiving unit.

12. The high-precision die bonding method according to claim 11, wherein, The method further includes a step of aligning the positions of the die and the receiving unit again. The third upper vision unit captures the image information of the die and provides the image information to a second bonding unit of the bonding assembly, so that a second vacuum module of the second bonding unit sucks the die located on the second relay station; or the third upper vision unit captures the image information of the die and provides the image information to the second bonding unit, so that the second vacuum module sucks the die located on the first relay station; The bearing platform moves to the position where the die is to be placed. The third upper vision unit captures the upper image information through a second transparent module of the second bonding unit, and the lower vision unit captures the lower image information through the bearing platform; based on the upper image information and the lower image information, it is determined whether the die mark and the bonding mark are aligned. If they are aligned, the second bonding unit places the die on the bearing platform; after the second bonding unit has placed the die on the bearing platform, return to the step of providing the die.

13. The high-precision die bonding method according to claim 11, wherein In the step of aligning the positions of the die and the receiving unit, the bonding part is provided on the bearing platform, and the bonding part is transparent.

14. A alignment system for high-precision die bonding, applicable to a die having die marks, characterized in that The alignment system for high-precision die bonding is applied to the high-precision die bonding system according to any one of claims 1-8. The alignment system for high-precision die bonding includes: A bonding unit having a vacuum module, and the vacuum module has a transparent module; An upper vision unit is arranged above the bonding unit; A receiving unit has a base for setting a bonding component, and the bonding component has a bonding mark; and A lower vision unit is arranged below the receiving unit; Wherein, the chip has a transparent area, the chip mark is located in the transparent area, the base is transparent or partially transparent to facilitate the penetration and capture of images; the transparent module is a transparent body or a perforation; the vacuum module sucks the chip, and the upper vision unit passes through the transparent module and the chip to capture the upper image information of the chip mark and the bonding mark; the lower vision unit passes through the base to capture the lower image information of the chip mark and the bonding mark, and through the upper image information and the lower image information, it is known whether the chip is aligned with the base; the bonding unit is laterally displaced or the base is laterally displaced to perform alignment, achieving precise alignment of the chip and the bonding component.

Images