Display panel, display panel manufacturing method, and display device
By setting an interlocking structure between the cover plate and the substrate and performing laser sintering welding, the problem of insufficient bonding strength between the cover plate and the substrate is solved, improving the reliability and stability of the display panel and enhancing the packaging strength and sealing performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
- Filing Date
- 2022-06-14
- Publication Date
- 2026-04-28
AI Technical Summary
In existing technologies, the bonding ability between the cover plate and the substrate is weak, resulting in poor reliability and stability of the display panel. In particular, cracks and separation are prone to occur during product reliability testing, affecting the display effect.
A first barrier is provided between the cover plate layer and the substrate layer. The first barrier is composed of a mating structure, including a first mating structure on one side of the cover plate layer and a second mating structure on one side of the substrate layer. The mating connection increases the encapsulation strength of the cover plate and the substrate, and they are fixed by laser sintering or adhesive bonding.
It improves the bonding strength between the cover plate and the substrate, enhances the reliability and stability of the display panel, prevents separation under external force, improves sealing and encapsulation strength, and avoids the intrusion of moisture and chemicals.
Smart Images

Figure CN115224215B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a display panel, a method for manufacturing the display panel, and a display device, belonging to the field of light-emitting display technology. Background Technology
[0002] In display panels, the cover plate and the substrate are generally encapsulated with metal and glass powder. Specifically, glass paste is printed on the encapsulation area of the cover plate, and a metal layer is set on the corresponding encapsulation area of the substrate. During encapsulation, the glass powder is sintered and melted by laser to bond with the metal layer, thereby bonding the cover plate and the substrate.
[0003] However, in the existing technology, the bonding ability between the molten glass powder and the metal layer is weak, resulting in poor bonding between the cover plate and the substrate. Cracks are prone to appear in the bonding area, which in turn leads to the separation of the cover plate and the substrate, affecting the reliability and stability of the panel. Summary of the Invention
[0004] This invention provides a display panel, a method for manufacturing the display panel, and a display device to solve the problem of low connection strength between the cover plate and the substrate in existing systems.
[0005] In a first aspect, the present invention provides a display panel, comprising:
[0006] A cover plate layer, a display device layer, and a substrate layer are stacked together;
[0007] A first barrier is provided between the cover plate layer and the substrate layer. The first barrier is located in the edge region of the cover plate layer and surrounds the display device layer.
[0008] The first retaining wall includes a first fitting structure and a second fitting structure. The first fitting structure is located on the side of the cover layer facing the substrate layer, and the second fitting structure is located on the side of the substrate layer facing the cover layer. The first fitting structure and the second fitting structure are fitted together.
[0009] Optionally, the first interlocking structure and the second interlocking structure are fused or glued together.
[0010] Optionally, the first fitting structure includes a protruding structure, and the second fitting structure includes a recessed structure;
[0011] The protruding structure protrudes toward the substrate layer, and the recessed structure is recessed toward the substrate layer;
[0012] The shape of the protruding structure matches the shape of the recessed structure.
[0013] Optionally, the plurality of protruding structures are arranged sequentially along a first direction and a second direction, wherein the first direction is the extension direction of the side of the cover layer where the plurality of protruding structures are located, and the second direction intersects the first direction.
[0014] Optionally, the protrusion structure is one or more of a circular protrusion, a strip protrusion, and a triangular protrusion.
[0015] Optionally, the plurality of protrusions are arranged in parallel along a first direction, which is the extension direction of the side of the cover layer where the plurality of protrusions are located.
[0016] Optionally, the protrusion structure has a strip shape as its orthogonal projection onto the substrate layer, and the strip extends along a second direction.
[0017] Optionally, it further includes a second barrier wall disposed between the cover plate layer and the substrate layer, the second barrier wall being located between the first barrier wall and the display device layer;
[0018] The second retaining wall includes a first sub-layer and a second sub-layer stacked together, the first sub-layer including a glass layer and the second sub-layer including a metal layer.
[0019] Optionally, the first retaining wall extends to the edge of the cover plate layer.
[0020] Secondly, embodiments of this application also provide a method for manufacturing a display panel, comprising:
[0021] A cover plate layer and a substrate layer are provided, wherein a display device layer is provided on one side of the substrate layer;
[0022] A first fitting structure is formed in the edge region on one side of the cover plate layer, and a second fitting structure is formed on the side of the substrate layer where the display device layer is located, the second fitting structure being disposed corresponding to the first fitting structure;
[0023] The cover plate layer and the substrate layer are stacked together, and the first fitting structure and the second fitting structure are fitted together to form a first barrier surrounding the display device layer.
[0024] This application provides a display panel including a cover plate layer, a display device layer, and a substrate layer stacked together. A first barrier wall is provided between the cover plate layer and the substrate layer. The first barrier wall is located at the edge region of the cover plate layer and surrounds the display device layer. The first barrier wall includes a first fitting structure and a second fitting structure. The first fitting structure is located on the side of the cover plate layer facing the substrate layer, and the second fitting structure is located on the side of the substrate layer facing the cover plate layer. The first fitting structure and the second fitting structure are fitted together. By fitting together the first fitting structure located at the edge region of the cover plate layer on the side of the cover plate layer facing the substrate layer and the second fitting structure located on the side of the substrate layer facing the cover plate layer, the encapsulation strength between the cover plate layer and the substrate layer is increased, thereby improving the reliability and stability of the display panel. Attached Figure Description
[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention. Furthermore, these drawings and textual descriptions are not intended to limit the scope of the inventive concept in any way, but rather to illustrate the concept of the invention to those skilled in the art by reference to specific embodiments.
[0026] Figure 1 This is a planar schematic diagram of the cover plate and substrate encapsulation in the prior art;
[0027] Figure 2 This is a cross-sectional schematic diagram of the cover plate and substrate packaging in the prior art;
[0028] Figure 3 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;
[0029] Figure 4 This is a schematic diagram of the structure of a display panel when the interlocking structure is not interlocked, as provided in an embodiment of this application.
[0030] Figure 5 This is a schematic diagram of the structure of a display panel after the interlocking structure is fitted, provided in an embodiment of this application.
[0031] Figure 6 This is a schematic diagram of the structure of a display panel after the fitting structure is fitted, according to another embodiment of this application.
[0032] Figure 7 This is a schematic diagram of the arrangement of the concave and convex structures of the cover layer in the display panel provided in the embodiments of this application;
[0033] Figure 8 This is a schematic diagram of the arrangement of the concave and convex structures of the cover layer in a display panel according to another embodiment of this application;
[0034] Figure 9This is a schematic diagram of the arrangement of the concave and convex structures of the cover layer in a display panel according to another embodiment of this application;
[0035] Figure 10 This is a schematic diagram of the structure of a display panel with a second barrier provided in an embodiment of this application;
[0036] Figure 11 This is a schematic flowchart of the display panel manufacturing method provided in the embodiments of this application.
[0037] Explanation of reference numerals in the attached figures:
[0038] 1-Cover plate layer;
[0039] 2-Substrate layer;
[0040] 3-Display device layer;
[0041] 4-First retaining wall;
[0042] 41-First interlocking structure;
[0043] 411 - Protruding structure;
[0044] 42-Second interlocking structure;
[0045] 421-Concave structure;
[0046] 5-Second retaining wall;
[0047] 51 - First Sublayer;
[0048] 52 - Second sub-layer. Detailed Implementation
[0049] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below in conjunction with the embodiments of this invention. Obviously, the described embodiments are only some embodiments of this invention, not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0050] Currently, rigid OLED on-cell displays typically use glass for the cover glass and array substrate, which are also usually made of glass, such as low-temperature polycrystalline silicon. Existing technologies generally use glass powder to bond and encapsulate the cover glass and substrate. Specifically, a paste, such as glass powder, is first printed onto the encapsulation area of the cover glass, while a metal layer corresponds to the glass powder on the substrate. The cover glass and substrate are then bonded together by laser sintering and melting. Figure 1 This is a planar schematic diagram of the cover plate and substrate packaging in the prior art. Figure 2This is a cross-sectional schematic diagram of the cover plate and substrate packaging in the prior art, such as... Figure 1 and Figure 2 As shown, the area in the center of the display panel (including the stacked cover layer 1, display device layer 3, and substrate layer 2) where the display device layer is located is... Figure 1 The AA area is the display area, and the NA area at the edge of the panel is the non-display area. In the non-display area NA, a glass powder encapsulation structure (the shaded part in contact with the cover layer in the figure) is provided between the cover layer 1 and the substrate layer 2. This structure includes the glass paste in contact with the cover layer 1 and the metal layer in contact with the substrate layer 2 (the shaded part in contact with the substrate layer in the figure).
[0051] However, the bonding of the cover plate and substrate using the above method results in weak adhesion after melting due to the material differences between the glass powder and the metal layer. This leads to weak encapsulation strength of the cover plate and substrate, resulting in poor stability and reliability of the display panel and display device. Especially during product reliability testing, such as drop tests, temperature and humidity tests, salt spray tests, and electrostatic discharge (ESD) tests, bonding and encapsulation failures are prone to occur. For example, cracks or separation may occur in the bonding and encapsulation area, allowing moisture to seep in. This can cause pixel shrinkage in the OLED light-emitting material, resulting in black screen issues and poor reliability and stability of the display panel and display device.
[0052] To address the aforementioned issues, this application provides a display panel, a method for manufacturing a display device, and a display device to improve the encapsulation strength between the cover plate and the substrate, thereby enhancing the reliability and stability of the display panel and the display device.
[0053] Display panel embodiment
[0054] Figure 3 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application, such as... Figure 1 As shown, the display device provided in this embodiment includes a cover plate layer 1, a display device layer 3 and a substrate layer 2 stacked together; a first barrier 4 is provided between the cover plate layer 1 and the substrate layer 2, the first barrier 4 is located in the edge area of the cover plate layer 1 and surrounds the display device layer 3.
[0055] Specifically, the cover layer 1 is generally made of glass, and the substrate layer 2 is generally made of glass, such as a low-temperature polycrystalline silicon array substrate. A display device layer 3 is disposed between the cover layer 1 and the substrate layer 2, wherein the display device layer 3 may be fixedly disposed on the substrate layer 2. It should be noted that the display device layer 3 is generally disposed in the central part of the cover layer 1 and the substrate layer 2 for display. The part of the cover layer 1 and the substrate layer 2 in the center where the display device layer 3 is disposed is the display area, and the parts around the perimeter of the cover layer 1 and the substrate layer 2 without a display device layer are non-display areas. The first barrier 4 is located in the non-display area at the edge of the cover layer 1, and the first barrier 4 surrounds the display device layer 3, that is, the first barrier 4 surrounds the display device layer 3.
[0056] The first retaining wall 4 includes a first fitting structure 41 and a second fitting structure 42. The first fitting structure 41 is located on the side of the cover layer 1 facing the substrate layer 2, and the second fitting structure 42 is located on the side of the substrate layer 42 facing the cover layer 1. The first fitting structure 41 and the second fitting structure 42 are fitted together.
[0057] Specifically, the first fitting structure 41 is located on the side of the cover layer 1 facing the substrate layer 2, and the second fitting structure 42 is located on the side of the substrate layer 2 facing the cover layer 1. Both the first fitting structure 41 and the second fitting structure 42 are located in the edge region of the cover layer 1. The shapes of the first fitting structure 41 and the second fitting structure 42 are matched and can be fitted together. The cover layer 1 and the substrate layer 2 are encapsulated by the fitting connection of the first fitting structure 41 and the second fitting structure 42.
[0058] The display panel provided in this application has interlocking structures on the cover layer 1 and the substrate layer 2 respectively. The interlocking connection of the interlocking structures forms a first barrier, which increases the interlocking force between the cover layer 1 and the substrate layer 2 during subsequent use, thereby preventing the cover layer 1 and the substrate layer 2 from separating under external force, improving the encapsulation strength, and enhancing the reliability and stability of the display panel.
[0059] In some embodiments, the materials of the first interlocking structure 41 and the second interlocking structure 42 can be the same as those of the cover layer 1 and the substrate layer 2, i.e., both are made of glass. After the first interlocking structure 41 and the second interlocking structure 42 are interlocked, they can be sintered and fused together by laser sintering. For example, by focusing high energy with a laser, the interlocking parts of the two interlocking structures are melted, and after cooling or air drying, the first interlocking structure and the second interlocking structure are connected together to form a whole, i.e., the first barrier wall 4. By melting the interlocking structures, which are both made of glass, the difference in the adhesive materials can be avoided, which may cause cracks and separation at the adhesive parts. This improves the adhesion of the first barrier wall, makes the adhesion strength between the cover layer 1 and the substrate layer 2 higher, and further improves the reliability and stability of the display panel.
[0060] Furthermore, since the interlocking structure is made of the same material as the cover layer 1 and the substrate layer 2, the interlocking structure can be obtained by processing the cover layer 1 and the substrate layer 2. For example, the portions of the cover layer 1 and the substrate layer 2 corresponding to the display area can be thinned, while the areas in the non-display area where the interlocking structure needs to be set are not thinned or are thinned to a lesser extent, thus forming a thicker raised area of glass. Then, through etching or cold carving, interlocking structures are processed in the raised areas of the cover layer 1 and the substrate layer 2 respectively. In this way, the first barrier 4 formed after sintering and welding is an integral part of the cover layer 1 and the substrate layer 2, which can also improve the sealing of the area between the cover layer 1 and the substrate layer 2, blocking external moisture, smoke and other chemicals, and improving the sealing of the display panel.
[0061] In other embodiments of this application, the first fitting structure 41 and the second fitting structure 42 can also be connected by an adhesive, such as placing liquid adhesive in the fitting part of the fitting structure. This not only connects the fitting structures but also fills any gaps that may exist after the fitting structures are fitted, thus improving the sealing of the display panel.
[0062] Figure 4 This is a schematic diagram of the structure of a display panel when the interlocking structure is not interlocked, according to an embodiment of this application. Figure 5 This is a schematic diagram of the structure of a display panel after the fitting structure is fitted, as provided in an embodiment of this application. Figure 4 and Figure 5 As shown, in the display panel provided in this application, the first fitting structure 41 includes a protruding structure 411, and the second fitting structure 42 includes a recessed structure 421. The protruding structure 411 protrudes toward the substrate layer 2, and the recessed structure 421 is recessed toward the substrate layer 2; the shape of the protruding structure 411 and the shape of the recessed structure 421 match.
[0063] Specifically, the first fitting structure 41 located on the side of the cover plate layer 1 near the substrate layer 2 includes a protruding structure 411 that protrudes toward the substrate layer 2. The corresponding second fitting structure 42 on the side of the substrate layer 2 near the cover plate layer 1 includes a recessed structure 421. The protruding structure 411 and the recessed structure 421 are in the same position and shape, so that the protruding structure 411 falls into the recessed structure 421.
[0064] In some embodiments, the number of protrusions 411 and recesses 421 may be multiple. It should be noted that, because a recess is inevitably formed between adjacent protrusions when protrusions are formed, a plurality of protrusions 411 are formed on the cover layer 1, and a recess is also formed next to the protrusions 411 on the cover layer 1. Similarly, protrusions also exist on the substrate layer 2.
[0065] In some embodiments, the recessed structures between the plurality of protrusions 411 on the cover plate layer 1 can be configured to have the same shape as the recessed structures 421 on the substrate layer 2 by adjusting the spacing and edge shape between the plurality of recessed structures 421 on the cover plate layer 1, and the protrusions between the plurality of recessed structures 421 on the substrate layer 2 can be configured to have the same shape as the protrusions 411 on the cover plate layer 1 by adjusting the spacing and edge shape between the plurality of recessed structures 421 on the substrate layer 2. This allows the protrusions 411 on the cover plate layer 1 to engage with the recessed structures 421 on the substrate layer 2, and also allows the recessed structures on the cover plate layer 1 to engage with the protrusions on the substrate layer 2. Figure 6 As shown, this further increases the degree of integration, improving the reliability and stability of the display panel and display device.
[0066] In some specific implementation processes, the protruding shape of the protrusion structure and the recessed shape of the recessed structure can be varied, such as circular, strip, and triangular, etc. Multiple shapes can also be used at the same time, as long as the protrusion of the cover plate layer 1 matches the corresponding recessed shape on the substrate layer 2, and can be fitted together. They will not be listed one by one here.
[0067] In this embodiment, the multiple protruding structures and recessed structures can be arranged sequentially along different directions. Figure 7 This is a schematic diagram of the arrangement of the concave and convex structures in the cover layer of the display panel provided in this application embodiment. The distribution of the concave and convex structures is shown from a top view of the cover layer. Figure 7 As shown in the embodiment, in the display panel provided in this paper, multiple protruding structures are arranged sequentially along a first direction, which is the extension direction of the side of the cover plate layer where the multiple protruding structures are located.
[0068] Specifically, the protruding and recessed structures on the cover layer 1 can be distributed in a dotted pattern, and their specific shapes can be circular, square, or triangular, etc. Taking the orthogonal projection of the recessed and protruding structures onto the substrate layer as a circle as an example, the specific details are as follows: Figure 7 As shown, the protruding structures 411 are arranged sequentially along the side extension direction of the cover plate layer 1, and can be distributed on each edge of the cover plate layer 1, so that the protruding structures surround the cover plate layer 1.
[0069] It should be noted that, because it is a top view, Figure 7 The corresponding recessed structures on the substrate layer are not shown in the diagram. However, the recessed structures on the substrate layer correspond one-to-one with the protruding structures on the cover plate layer 1. Therefore, given the clear distribution of the protruding structures on the cover plate layer 1, the recessed structures on the substrate layer are also definite and obvious, so they will not be described further here.
[0070] Based on the above embodiments, the dotted uneven structures of the cover plate layer 1 and the substrate layer 2 can also be arranged sequentially along the second direction to form multiple rows of uneven structures. For example, in addition to the protrusions 411 being arranged once along the side extension direction of the cover plate layer 1, they can also be arranged along directions intersecting the side extension direction of the cover plate layer 1, such as along directions perpendicular to the first direction, to form multiple rows of protrusions. Simultaneously, the substrate layer also has multiple rows of corresponding recessed structures, specifically as follows: Figure 8 As shown. Thus, increasing the number of concave and convex structures can further increase the encapsulation strength after mating and connection, thereby improving the reliability and stability of the display panel and display device.
[0071] Figure 9 This is a schematic diagram of the arrangement of the concave and convex structures of the cover layer in a display panel according to another embodiment of this application, such as... Figure 9 As shown, in the display panel provided in this application embodiment, the protruding structure on the cover layer 1 can also be strip-shaped. Its orthographic projection onto the cover layer 1 or substrate layer is strip-shaped, and the strip extends in a direction perpendicular to the edge of the cover layer's side. For example... Figure 9 As shown. Correspondingly, the recessed structure on the substrate layer is also strip-shaped. The strip-shaped protrusion 411 on the cover plate layer 1 can be integrally embedded into the strip-shaped recessed structure on the substrate layer. In this way, by increasing the area of the interlocking part, the purpose of increasing the interlocking strength is achieved, thereby further improving the reliability and stability of the display panel.
[0072] It should be noted that the strip-shaped concave-convex structure can also have edges, thereby further increasing the fitting strength of the concave-convex structure and improving the reliability and stability of the display panel and display device.
[0073] Figure 10 This is a schematic diagram of the structure of a display panel with a second barrier provided in an embodiment of this application, as shown below. Figure 10 As shown in this application, the second barrier 5 is located between the first barrier 4 and the display device layer 3; the second barrier 5 includes a first sub-layer 51 and a second sub-layer 52 stacked together, the first sub-layer 51 includes a glass layer, and the second sub-layer 52 includes a metal layer.
[0074] Specifically, the second barrier 5 can be formed by encapsulating glass powder. For example, a first sub-layer 51 is formed by printing glass paste in the bonding area on the side of the cover layer 1 near the substrate layer 2, and a second sub-layer 52 is formed by setting a metal layer in the area corresponding to the glass paste on the side of the substrate layer 2 near the cover layer 1. Then, the glass paste is melted by laser sintering, so that the glass paste and the metal layer are bonded together, thereby achieving the bonding of the cover layer 1 and the substrate layer 2.
[0075] It should be noted that the second barrier 5 is located in the area between the cover layer 1 and the substrate layer 2, close to the display device layer 3, while the first barrier 4 mentioned above is located in the area between the cover layer 1 and the substrate layer 2, far away from the display device layer 3. The first barrier 4 and the second barrier 5 can respectively achieve the purpose of connecting the cover layer and the substrate layer, and can both achieve the bonding of the cover layer 1 and the substrate layer 2, thereby further improving the encapsulation strength between the cover layer and the substrate layer.
[0076] Moreover, the first barrier 4 can extend to the edge of the cover layer 1, that is, one end of the first barrier 4 is flush with the edge cutting line of the cover layer. While increasing the fitting area and improving the encapsulation strength, it can also seal the area between the cover layer 1 and the substrate layer 2, preventing the wetting and corrosion damage of external moisture, smoke and other chemicals, and further improving the reliability and stability of the display panel and display device.
[0077] The display panel provided in this application embodiment, by providing concave and convex structures of the same material that can be interlocked on the cover layer 1 and the substrate layer 2, and then welding them together by laser sintering to form a first barrier 4, increases the encapsulation strength and improves the sealing performance between the cover layer 1 and the substrate layer 2. Furthermore, one end of the first barrier 4 can be flush with the cut edge of the cover layer 1, and a second barrier 5, including a glass sublayer and a metal layer, can be provided between the first barrier 4 and the display device layer 3, further enhancing the encapsulation strength between the cover layer 1 and the substrate layer 2, thereby improving the reliability and stability of the display panel and the display device.
[0078] Example of display panel manufacturing method:
[0079] This embodiment provides a method for manufacturing a display device. Figure 11 This is a schematic flowchart of the display panel manufacturing method provided in the embodiments of this application, as shown below. Figure 11 As shown, the method for manufacturing a display panel includes:
[0080] S101, Provides a cover layer and a substrate layer, wherein one side of the substrate layer has a display device layer.
[0081] Specifically, one side of the substrate layer has a display device layer. The area on the substrate layer where the display device layer is disposed, and the area on the cover plate layer corresponding to this area are both display areas. The area on the substrate layer where no display device layer is disposed, and the area on the cover plate layer corresponding to this area are non-display areas.
[0082] S202. A first fitting structure is formed in the edge region on one side of the cover plate layer, and a second fitting structure is formed on the side of the substrate layer with the display device layer, wherein the second fitting structure is correspondingly provided with the first fitting structure.
[0083] Specifically, the first fitting structure can be formed on the cover plate layer by thinning the area corresponding to the display device layer, making the edge area on one side of the cover plate layer thicker, and then performing etching or cold carving on the thicker area to form the first fitting structure. The second fitting structure can be formed on the side of the substrate layer with the display device layer using the same method. In this way, the materials of the first fitting structure and the second fitting structure are the same as the materials of the cover plate and the substrate (generally glass), and the first fitting structure and the cover plate layer are a whole, and the second fitting structure and the substrate layer are a whole, which is more robust.
[0084] Of course, the method of forming the interlocking structure in this application can also be to form a first interlocking structure on the cover plate layer and a second interlocking structure on the substrate layer by printing or applying glass paste in the area where the interlocking device needs to be formed.
[0085] S103. The cover plate layer and the substrate layer are stacked, and the first fitting structure and the second fitting structure are fitted together to form a first barrier surrounding the display device layer.
[0086] It should be noted that the first interlocking structure can surround the area on the cover plate layer corresponding to the display device layer on the substrate layer, and correspondingly, the second interlocking structure can surround the display device layer on the substrate layer. After the first and second interlocking structures are interlocked, the interlocking portions of the two interlocking structures can be melted by focusing high energy with a laser. After melting, cooling or air drying, the first and second interlocking structures are connected together to form a whole, namely the first barrier wall, thereby bonding the cover plate layer and the substrate layer together. Alternatively, an adhesive can be added to the interlocking portion to bond the first and second interlocking structures together, forming the first barrier wall. The interlocking structure can be an uneven structure.
[0087] Furthermore, the display panel fabrication method provided in this application embodiment may further include, before forming the first barrier, setting a second barrier in the region near the display device layer between the cover layer and the substrate layer. Specifically, this may involve printing glass paste in the bonding area on the side of the cover layer near the substrate layer, and setting a metal layer in the region corresponding to the glass paste on the side of the substrate layer near the cover layer. Then, the glass paste is melted by laser sintering, causing the glass paste to bond with the metal layer to form the second barrier. In this case, the first barrier can be positioned between the second barrier and the cut edge of the cover layer, with one end flush with the cut edge of the cover layer and the other end aligned with the second barrier.
[0088] The display device manufacturing method provided in this application involves setting a first interlocking structure on a cover layer and a second interlocking structure on a substrate layer. By interlocking and connecting the first and second interlocking structures to form a first barrier, the encapsulation of the cover layer and substrate layer is more robust due to the interlocking of the two parts. Furthermore, since the cover layer and substrate layer are generally made of the same material (both are glass), the two parts of the first barrier are also made of the same material. After the first and second interlocking structures are sintered and fused, there is no difference in the materials within the first barrier, resulting in stronger adhesion. The method also includes a second barrier for bonding the cover layer and substrate layer, further improving the encapsulation strength between them. Moreover, by simultaneously setting the first and second barriers and aligning one end of the first barrier with the cut edge of the cover layer, moisture, smoke, and other chemicals are prevented from entering the area between the cover layer and substrate layer, thus preventing damage to the panel device and improving the reliability and stability of the display panel.
[0089] Display device embodiment:
[0090] Based on the same inventive concept, this application also provides a display device, such as a mobile phone, a smart band, and a watch. Specifically, the display device includes the display panel mentioned in the above panel embodiment. By providing interlocking concave-convex structures of the same material on the cover layer and the substrate layer, and then welding them together by laser sintering to form a first barrier, the encapsulation strength between the cover layer and the substrate layer is higher and the sealing performance is stronger. Furthermore, one end of the first barrier can be flush with the cut edge of the cover layer, and a second barrier including a glass sublayer and a metal layer can be provided between the first barrier and the display device layer, further improving the encapsulation strength of the cover layer and the substrate layer. Moreover, by setting one end of the first barrier to be flush with the edge cut line of the cover layer, the area between the cover layer and the substrate layer is sealed and isolated, preventing the infiltration and corrosion damage from external moisture, smoke, or other chemicals, thus greatly improving the reliability and stability of the display panel and the display device.
[0091] Furthermore, in this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A display panel, characterized in that, It includes a cover plate layer, a display device layer, and a substrate layer that are stacked together; A first barrier is provided between the cover plate layer and the substrate layer, the first barrier being located at the edge region of the cover plate layer and surrounding the display device layer; a second barrier is also provided between the cover plate layer and the substrate layer; the second barrier is located between the first barrier and the display device layer; The first retaining wall includes a first fitting structure and a second fitting structure. The first fitting structure is located on the side of the cover plate layer facing the substrate layer, and the second fitting structure is located on the side of the substrate layer facing the cover plate layer. The first fitting structure and the second fitting structure are fitted together. The first fitting structure includes a protruding structure, and the second fitting structure includes a recessed structure; the protruding structure protrudes toward the substrate layer, and the recessed structure is recessed toward the substrate layer; the shape of the protruding structure and the shape of the recessed structure match. The second retaining wall includes a first sub-layer and a second sub-layer stacked together, the first sub-layer including a glass layer and the second sub-layer including a metal layer; The first interlocking structure, the second interlocking structure, the cover plate layer, and the substrate layer are all made of glass. After the first interlocking structure and the second interlocking structure are interlocked, they are sintered and fused at the interlocking point by laser sintering to achieve a seamless connection and form the first barrier wall, thereby sealing the cover plate layer and the substrate layer. The first retaining wall is positioned between the second retaining wall and the cut edge of the cover plate layer. One end of the first retaining wall is flush with the cut edge of the cover plate layer, and the other end is aligned with the second retaining wall.
2. The display panel according to claim 1, characterized in that, The plurality of protruding structures are arranged sequentially along a first direction and a second direction, wherein the first direction is the extension direction of the side of the cover layer where the plurality of protruding structures are located, and the second direction intersects with the first direction.
3. The display panel according to claim 1, characterized in that, The protrusion structure is one or more of the following: circular protrusion, strip protrusion, and triangular protrusion.
4. The display panel according to claim 1, characterized in that, The plurality of protruding structures are arranged in parallel along a first direction, which is the extension direction of the side of the cover layer where the plurality of protruding structures are located.
5. The display panel according to claim 4, characterized in that, The protrusion structure is projected onto the substrate layer in the shape of a strip, which extends along a second direction that intersects with the first direction.
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