A solder paste spraying device for strip circuit board

Abstract

The present invention discloses a device for printing solder paste on a strip circuit board, comprising a strip circuit board, and a strip feeding system, a strip conveying system, and a tinning system connected to a main controller. A plurality of strip groove circuit boards are arranged on the strip at equal intervals, and a plurality of positioning holes are provided on the strip. The strip feeding system comprises a whole roll strip feeding mechanism and a feeding detection mechanism; the strip conveying system comprises a strip conveying driving wheel mechanism and a tinning positioning mechanism, and also comprises a strip conveying driven wheel mechanism and a strip conveying track; the tinning system comprises a Y-axis conveying mechanism, an X-axis conveying mechanism, a Z-axis conveying mechanism, and a visual display device connected to the main controller; and further comprises a solder paste spraying adapter, a laser altimeter, and a visual detector connected to the visual display device. The device can realize direct printing at multiple solder paste spraying positions, which can solve the problem of solder paste spraying on strip circuit boards and greatly improve production efficiency through multi-station printing.

Description

Technical Field

[0001] The present invention relates to a circuit board soldering device, in particular to a strip circuit board solder paste spraying device in an SMT production process. Background Art

[0002] In the existing SMT production process, the solder paste is sprayed on the flat groove circuit board using the solder paste needle at the end of the solder paste adapter in cooperation with various systems. Figure 1 The flat groove circuit board 10 is transported by the flow fixture 20 in the figure to realize the printing of solder paste.

[0003] But for Figure 3 For the tinning of the strip circuit board 30 shown, it is necessary to automatically spray solder paste on the circuit board tinning position 31 of each strip circuit board 30 under the condition of the entire roll of strip 40. This is difficult to achieve the solder paste printing function based on the existing solder paste printing device. Summary of the Invention

[0004] The present invention aims to solve the problems existing in the prior art and provides a device for printing solder paste on a strip circuit board. The device can realize direct printing at multiple solder paste printing positions, thereby solving the problem of solder paste printing on a strip circuit board and greatly improving production efficiency through multi-station printing.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A strip circuit board solder paste printing device includes a strip circuit board, a strip feeding system connected to a main controller, a strip conveying system, and a tinning system;

[0007] There are multiple strip circuit boards, which are arranged on the strip at equal intervals, and multiple positioning holes are provided on the strip;

[0008] The tape feeding system includes a whole-roll tape feeding mechanism and a feeding detection mechanism; the whole-roll tape feeding mechanism includes a feeding motor connected to a main controller and a tape roll placement tray driven by the feeding motor; the feeding detection mechanism includes an upper sensing component and a lower sensing component connected to the main controller, and the tape being processed passes between the upper sensing component and the lower sensing component;

[0009] The material belt conveying system includes a material belt conveying driving wheel mechanism and a tinning positioning mechanism connected to the main controller, and also includes a material belt conveying driven wheel mechanism and a material belt conveying track; the material belt conveying driving wheel mechanism includes a conveying servo motor connected to the main controller, and a main transmission gear driven by the conveying servo motor, the gear teeth on the main transmission gear are inserted into the positioning holes on the material belt; the tinning positioning mechanism includes a positioning support block, a positioning PIN needle and a positioning cylinder connected to the main controller, the positioning support block and the positioning PIN needle are installed on the positioning cylinder, and the positioning PIN needle is inserted into the positioning hole of the material belt for positioning by the rising of the positioning cylinder, and the positioning support block is pressed against the bottom surface of the material belt circuit board for positioning; the material belt conveying driven wheel mechanism includes a slave transmission gear, and the gear teeth of the slave transmission gear are inserted into the positioning hole of the material belt being processed; the material belt conveying track includes a track bottom plate, and the material belt being processed moves horizontally on the track bottom plate;

[0010] The tinning system includes a Y-axis conveying mechanism, an X-axis conveying mechanism, a Z-axis conveying mechanism and a visual display device connected to the main controller; it also includes a solder paste spraying adapter, a laser altimeter and a visual detector connected to the visual display device; the X-axis conveying mechanism and the Z-axis conveying mechanism simultaneously move the solder paste adapter, the laser altimeter and the visual detector, and the Y-axis conveying mechanism drives the material belt conveying system installed on it to move back and forth, so that the tinning position of the material belt groove circuit board to be tinned on the material belt is moved below the corresponding point of the solder paste adapter printing position.

[0011] In the above-mentioned device for printing solder paste on a strip circuit board, the strip conveying track further includes a track cover plate, and the track cover plate is arranged above the track bottom plate.

[0012] In the above-described device for solder paste printing on a strip circuit board, the upper sensing component and the lower sensing component are respectively provided with an upper stainless steel sensing sheet and a lower stainless steel sensing sheet, and the upper stainless steel sensing sheet and the lower stainless steel sensing sheet are respectively arranged above and below the strip being processed, and the upper stainless steel sensing sheet and the lower stainless steel sensing sheet are respectively connected to a main controller via an upper sensing line and a lower sensing line.

[0013] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0014] First, the material strip feeding system, material strip conveying system and tinning system of the material strip circuit board solder paste printing device of the present invention are coordinated and cooperated with each other by the above three systems. First, the material strip feeding system releases a single material strip from the whole roll of material strip, and then the material strip conveying system moves the single material strip to the position where the tinning system can operate, outputs a signal that the solder paste spraying adapter can operate, and then the tinning system is used to complete the solder paste printing of multiple products and multiple tinning positions in the material strip circuit board, which can solve the problem of solder paste printing on the material strip circuit board and greatly improve production efficiency.

[0015] Secondly, the spacing between the material strip circuit boards in the material strip of the present invention is equidistant. Through the control of the material strip conveying active wheel mechanism and the tin dot system, it is possible to directly print multiple solder paste printing positions after only one identification and detection, further improving production efficiency.

[0016] Third, the positioning support block of the material strip conveying system of the present invention supports the bottom surface of the material strip circuit board, ensuring that the tin point position of each material strip circuit board in place is on the same horizontal plane, thereby improving the accuracy of solder paste printing.

[0017] Fourthly, the material strip being processed in the present invention is placed between the track bottom plate and the track cover plate to press the material strip being processed and play a role of limiting and guiding the material strip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0019] Figure 1 This is a schematic diagram of the main structure of a planar groove circuit board in the prior art;

[0020] Figure 2 This is a schematic diagram of the main structure of the flow fixture in the prior art;

[0021] Figure 3 This is a schematic diagram of the main structure of a strip circuit board in the prior art;

[0022] Figure 4 This is a schematic top view of the structure of the device for printing solder paste on a strip circuit board according to the present invention;

[0023] Figure 5 This is a schematic diagram of the main structure of the strip circuit board of the present invention;

[0024] Figure 6 This is a schematic diagram of the main structure of the whole roll material feeding mechanism of the present invention;

[0025] Figure 7 It is a side view of the structure of the whole roll material feeding mechanism of the present invention;

[0026] Figure 8 It is a schematic top view of the structure of the whole roll material feeding mechanism of the present invention;

[0027] Figure 9 It is a schematic diagram of the main structure of the material belt conveying system of the present invention;

[0028] Figure 10 It is a side structural schematic diagram of the material belt conveying system of the present invention;

[0029] Figure 11 1 is a schematic top view of the structure of the material belt conveying system of the present invention;

[0030] Figure 12 This is a schematic diagram of the main structure of the material belt conveying driving wheel mechanism of the present invention;

[0031] Figure 13 It is a side structural schematic diagram of the material belt conveying driving wheel mechanism of the present invention;

[0032] Figure 14 1 is a schematic top view of the structure of the material belt conveying driving wheel mechanism of the present invention;

[0033] Figure 15 This is a schematic diagram of the main structure of the tin point positioning mechanism of the present invention;

[0034] Figure 16 It is a side view structural diagram of the tinning positioning mechanism of the present invention;

[0035] Figure 17 1 is a schematic diagram of the top view of the tinning positioning mechanism of the present invention;

[0036] Figure 18 This is a schematic diagram of the main structure of the material belt conveying driven wheel mechanism of the present invention;

[0037] Figure 19 1 is a side structural diagram of the material belt conveying driven wheel mechanism of the present invention;

[0038] Figure 20 This is a schematic diagram of the main structure of the strip tinning system of the present invention;

[0039] Figure 21 1. It is a side view structural diagram of the strip tinning system of the present invention;

[0040] Figure 22 1. It is a schematic diagram of the top view of the strip tinning system of the present invention;

[0041] Figure 23 This is a schematic diagram of the main structure of the device for printing solder paste on a strip circuit board according to the present invention;

[0042] Figure 24 This is a side structural diagram of a device for printing solder paste on a strip circuit board according to the present invention;

[0043] Figure 25 The figure is a schematic diagram of the main controller circuit of the device for printing solder paste on a strip circuit board according to the present invention. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and more understandable, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0045] In the claims, description and above-mentioned drawings of the present invention, unless otherwise clearly defined, the use of terms such as "front", "side" or "third" is for the purpose of distinguishing different objects rather than for describing a specific order.

[0046] In the claims, specification and the above-mentioned drawings of the present invention, unless otherwise expressly defined, directional words such as the terms "center", "transverse", "longitudinal", "horizontal", "vertical", "top", "bottom", "inside", "outside", "up", "down", "front", "back", "left", "right", "clockwise", "counterclockwise" and the like indicating directions or positional relationships are based on the directions and positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the specific scope of protection of the present invention.

[0047] In the claims, description and above-mentioned drawings of the present invention, unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" should be understood in a broad sense, that is, any connection method without displacement relationship and relative rotation relationship between the two parties, that is, including non-detachable fixed connection, detachable fixed connection, integral connection and fixed connection through other devices or elements.

[0048] In the claims, description and drawings of the present invention, if the terms "include", "have" and their variations are used, they are intended to mean "including but not limited to".

[0049] Now combined Figures 4 to 25 The present invention describes a solder paste printing device for a strip circuit board, which includes a strip groove circuit board 100, a strip feeding system 200 connected to a main controller, a strip conveying system 300 and a tinning system 400.

[0050] like Figure 5 As shown, the present invention includes multiple strip-shaped circuit boards 100, which are evenly spaced on a strip 500. Seen in the figure, the first strip-shaped circuit board 100A, the second strip-shaped circuit board 100B, the third strip-shaped circuit board 100C, the fourth strip-shaped circuit board 100D, the fifth strip-shaped circuit board 100E, and the sixth strip-shaped circuit board 100F are arranged in this order. Multiple positioning holes 510 are also provided on the strip 500.

[0051] Please combine Figures 6 to 8 As shown, the material tape feeding system 200 of the present invention includes a whole roll material tape feeding mechanism 210 and a feeding detection mechanism 220.

[0052] The full-roll material feeding mechanism 210 of the present invention includes a feed motor 211 connected to a main controller and a tape roll placement tray 212 driven by the feed motor 211. Specifically, a full-roll material 500 is placed and secured within the tape roll placement tray 212, which is secured to a feed shaft 213. The feed motor 211 is driven, and the feed shaft 213 drives the tape roll placement tray 212 to rotate synchronously, continuously releasing individual strips of material 500 from the full roll. These strips are then processed sequentially by the tape transport system 300 and the tinning system 400 (backend machine).

[0053] The inventive feeding detection mechanism 220 includes an upper sensing assembly and a lower sensing assembly connected to the main controller. The material strip 500 being processed passes between the upper sensing assembly 221 and the lower sensing assembly 222. Specifically, the upper sensing assembly 221 and the lower sensing assembly 222 are respectively equipped with an upper stainless steel sensing sheet 221A and a lower stainless steel sensing sheet 222A. The upper stainless steel sensing sheet 221A and the lower stainless steel sensing sheet 222A are respectively arranged above and below the material strip 500 being processed. The upper stainless steel sensing sheet 221A and the lower stainless steel sensing sheet 222A are connected to the main controller via an upper sensing line 221B and a lower sensing line 222B, respectively, to form two sets of upper and lower sensing structures. When the material strip 500 being processed contacts the upper stainless steel sensor sheet 221A located above, the feeding detection mechanism 220 generates an upper sensing signal, which indicates that the material strip 500 being processed is too short, and the main controller controls the feeding motor 211 to start and the back-end machine (material strip conveying system 300 and tinning system 400) to stop; when the material strip 500 being processed contacts the lower stainless steel sensor sheet 222A, the feeding detection mechanism 220 generates a lower sensing signal, which indicates that the material strip 500 being processed has been released too much, and the main controller controls the feeding motor 211 to stop to stop releasing the material strip 500.

[0054] Please combine Figures 9 to 19 As shown, the strip transport system 300 of the present invention includes a strip transport driving wheel mechanism 310 and a soldering and positioning mechanism 320 connected to a main controller, as well as a strip transport driven wheel mechanism 330 and a strip transport track 340. The strip groove circuit board 100 being processed passes through the strip transport track 340, the strip transport driven wheel mechanism 330, the soldering and positioning mechanism 320, and the strip transport driving wheel mechanism 310 in sequence.

[0055] The material strip transport driving wheel mechanism 310 of the present invention includes a transport servo motor 311 connected to the main controller, and a main transmission gear 312 driven by the transport servo motor 311. Specifically, the transport servo motor 311 drives a main transmission shaft 315 fixed on a bearing 314 through a coupling 313, thereby driving the main transmission gear 312 connected to the main transmission shaft 315 to continuously rotate. The gear teeth on the main transmission gear 312 are inserted into the positioning holes 510 on the material strip 500, so that when the main transmission gear 312 rotates, it drives the circuit board 100 of the material strip to be tinned on the material strip 500 to translate to the designated position preset by the main controller, providing a start positioning signal for the positioning action of the tinning positioning mechanism 320, and the start positioning signal is the upper and lower cylinder action signal.

[0056] The tinning positioning mechanism 320 of the present invention includes a positioning support block 321, a positioning PIN needle 322 and a positioning cylinder 323 connected to the main controller. The positioning support block 321 and the positioning PIN needle 322 are installed on the positioning cylinder 323. The positioning cylinder 323 rises to insert the positioning PIN needle 322 into the positioning hole 510 of the material strip 500 being processed for positioning. At the same time, the positioning support block 321 supports the bottom surface of the circuit board 100 with the material strip groove in place. The positioning of the material strip 500 and the circuit board 100 with the material strip groove in place is completed by controlling the up and down movement of the cylinder 323.

[0057] The material belt conveying driven wheel mechanism 330 of the present invention includes a slave transmission gear 331, which is connected to a slave transmission shaft 333 via a bearing 332. Specifically, the slave transmission shaft 333 is mounted on the bearing 332, and the slave transmission gear 331 is fixed to the slave transmission shaft 333. The gear teeth of the slave transmission gear 331 are inserted into the positioning holes 510 of the material belt 500 being processed. The material belt 500 driven by the material belt conveying driving wheel mechanism 310 will drive the slave transmission gear 331 to rotate. Through the forward and backward positioning of the material belt 500 by the slave transmission gear 331 and the main transmission gear 312, the material belt 500 is tensioned.

[0058] The material belt conveying track 340 of the present invention includes a track base plate 341 and a track cover plate 342. The material belt 500 being processed moves horizontally on the track base plate 341. The track cover plate 342 is arranged above the track base plate 341 to press the material belt 500 being processed and play a role in limiting and guiding the material belt 500.

[0059] When the material belt conveying system 300 of the present invention is working, the conveying servo motor 311 of the material belt conveying active wheel mechanism 310 drives the main transmission gear 312 to rotate, and the gear teeth of the main transmission gear 312 hook the positioning hole 510 on the material belt 500 to translate the material belt 500 on the material belt conveying track 340 horizontally left and right; the gear teeth of the slave transmission gear 331 of the material belt conveying driven wheel mechanism 330 also hook the positioning hole 510 of the material belt 500 to translate the material belt 500, while the slave transmission gear 331 rotates accordingly. The material belt conveying driven wheel mechanism 330 mainly assists in the rotation and plays the role of tensioning the material belt 500. The material strip conveying track 340 confines the material strip 500 to the same horizontal and vertical directions to limit the left and right displacement and the vertical displacement of the material strip 500 being processed; the tinning positioning mechanism 320 will pull the material strip 500 to the designated position preset by the main controller through the main transmission gear 312, and then the positioning PIN needle 322 will be inserted into the positioning hole 510 of the material strip 500 being processed for positioning through the rise of the positioning cylinder 323. The positioning support block 321 supports the bottom surface of the material strip groove circuit board 100 at the designated position to ensure that the tinning position of each material strip groove circuit board 100 in place is on the same horizontal plane, so as to complete the conveying and positioning work before the tinning system 400 is activated.

[0060] Please combine Figures 20 to 22 As shown, the tinning system 400 of the present invention includes a Y-axis conveying mechanism 410, an X-axis conveying mechanism 420, a Z-axis conveying mechanism 430, and a visual display device 450 connected to a main controller. It also includes a solder paste spray adapter 440, a laser altimeter 460, and a visual detector 470 connected to the visual display device 450. The solder paste spray adapter 440 is connected to the visual display device 450 via a solder paste printing controller 480. The Y-axis conveying mechanism 410, the X-axis conveying mechanism 420, and the Z-axis conveying mechanism 430 are movably mounted on a machine base, while the visual display device 450 is fixed to the machine base.

[0061] Please combine Figure 23 and Figure 24As shown, the entire material strip conveying system 300 is mounted and fixed on the Y-axis conveying mechanism 410 of the present invention. After the tinning positioning mechanism 320 in the material strip conveying system 300 is positioned, the material strip 500 is positioned on the material strip conveying track 340, so that the material strip 500 does not move back and forth on the conveying track 340. When the Y-axis conveying mechanism 410 moves back and forth along the horizontal direction of the material strip 500, the material strip conveying system 300 fixed on the Y-axis conveying mechanism 410 moves as a whole, so that the material strip 500 positioned on the Y-axis conveying mechanism 410 also moves precisely back and forth along the direction of movement of the Y-axis conveying mechanism 410, so that the tinning position 110 in the circuit board 100 with the material strip groove to be tinned on the material strip 500 can be accurately moved to the corresponding point below the printing position of the solder paste adapter 440.

[0062] The X-axis conveying mechanism 420 and the Z-axis conveying mechanism 430 simultaneously move the solder paste adapter 440, the laser altimeter 460 and the visual detector 470 to align the mobile solder paste adapter 440 with the soldering position 110 in the strip groove circuit board 100 to be soldered.

[0063] When the tinning system 400 of the present invention is working, the visual detector 470 is aligned with the strip 500 on the material strip conveying track 340 on the material strip conveying system 300 on the Y-axis conveying mechanism 410 by moving the X-axis conveying mechanism 420 and the Z-axis conveying mechanism 430 to detect the x value and y value of the strip groove circuit board 100 to be tinned, and the x value and y value are fed back to the visual display device 450. Figure 5 In the embodiment shown, the visual detector 470 sequentially aligns with a positioning detection point on the first material strip groove circuit board 100A, the second material strip groove circuit board 100B, the third material strip groove circuit board 100C, the fourth material strip groove circuit board 100D, the fifth material strip groove circuit board 100E, and the sixth material strip groove circuit board 100F to detect the x value and y value.

[0064] The laser altimeter 460 then measures the Z value of the height of the soldering point 110 on the strip groove circuit board 100 and feeds this Z value back to the visual display device 450. The feedback x-, y-, and Z-values ​​are used to set a transport deviation compensation value via a feedback device within the visual display device 450. This transport deviation compensation value is then transmitted to the Y-axis transport mechanism 410, the X-axis transport mechanism 420, and the Z-axis transport mechanism 430. Upon receiving the transport deviation compensation value, the X-axis transport mechanism 420 and the Z-axis transport mechanism 430 send the solder paste adapter 440 to precisely spray solder paste at the soldering point 110 on the strip groove circuit board 100, controlling the solder paste size under the control of the solder paste printing controller 480. The Y-axis conveying mechanism 410 receives the conveying deviation compensation value and synchronously moves back and forth in the horizontal forward direction of the material strip 500, further improving the accuracy of the solder paste adapter 440 in spraying solder paste on the tin point position 110 on the material strip groove circuit board 100, and further accurately controlling the size of the solder paste.

[0065] Please combine Figure 5 In the embodiment shown, the tin dot system 400 of the present invention only needs to complete the y-value detection of the first material strip groove circuit board 100A, and can accurately move the second material strip groove circuit board 100B, the third material strip groove circuit board 100C, the fourth material strip groove circuit board 100D, the fifth material strip groove circuit board 100E, and the sixth material strip groove circuit board 100F in sequence to the solder paste adapter printing position one by one. Only one detection needs to be completed to simultaneously perform solder paste printing on the subsequent products.

[0066] Please combine Figure 23 and Figure 24 The figure shows the working principle of a solder paste printing device for a strip circuit board according to the present invention. When the device is started, the feed motor 211 in the strip feeding system 200 rotates to release a single strip 500 fixed to the strip reel placement tray 212. After the single strip 500 has been released to a sufficient length, the strip 500 is manually inserted into the strip conveying track 340 of the strip conveying system 300 and then moved forward until the positioning hole 510 of the strip 500 engages with the main transmission gear 312 of the strip conveying active wheel mechanism 310. The main transmission gear 312 can then pull the strip 500, energizing the conveying servo motor 311 to complete the threading of the strip 500.

[0067] After the material threading is completed, the program is started, and the conveying servo motor 311 of the material belt conveying active wheel mechanism 310 rotates the corresponding number of circles at the distance set by the main controller program to make the material belt 500 move horizontally a certain distance in the material belt conveying track 340 (the distance set in this embodiment is the distance between the three material belt groove circuit boards 100 on the material belt), and then the positioning cylinder 323 in the tinning positioning mechanism 320 of the material belt conveying system 300 rises to complete the positioning work, and outputs a signal to the main controller that the tinning system 400 can act.

[0068] After receiving a signal indicating that soldering system 400 is enabled for operation, the Y-axis conveyor mechanism 410, X-axis conveyor mechanism 420, and Z-axis conveyor mechanism 430 of soldering system 400 are activated. Through the movement of the Y-axis conveyor mechanism 410, X-axis conveyor mechanism 420, and Z-axis conveyor mechanism 430, the laser altimeter 460 and visual detector 470 detect and output the x- and y-values ​​of the strip-recessed circuit board 100, as well as the Z-value of the height of the soldering location 110 on the strip-recessed circuit board 100. The visual display device 450 then outputs a conveying deviation compensation value to control the solder paste adapter, and the Y-axis conveyor mechanism 410 controls the forward and backward movement of the strip 500 in its horizontal direction of advancement. The Y-axis conveyor mechanism 410, X-axis conveyor mechanism 420, and Z-axis conveyor mechanism 430 work closely together to precisely print solder paste at multiple locations on the strip-recessed circuit boards 100 on the strip 500. After the printing is completed, the printing process is completed.

[0069] The above steps are repeated, continuously starting and stopping the transport servo motor 311 in the strip transport system 300, and continuously releasing the strip 500. The strip transport driving wheel mechanism 310 then performs transport and positioning. In this embodiment, three strip-recessed circuit boards 100 can be transported and positioned simultaneously. The soldering point positioning mechanism 320, through its own equipment functions, sprays solder paste at multiple soldering points on multiple strip-recessed circuit boards 100.

[0070] The solder paste printing device for a strip circuit board of the present invention can also be used for Figure 5 By identifying the position and height of the first material strip groove circuit board 100A shown, the solder paste printing of multiple products such as the second material strip groove circuit board 100B, the third material strip groove circuit board 100C, the fourth material strip groove circuit board 100D, the fifth material strip groove circuit board 100ET and the sixth material strip groove circuit board 100F can be completed through the cooperation of the mechanism, thereby reducing the detection time and improving production efficiency.

[0071] The foregoing description shows and describes preferred embodiments of the present invention. As previously mentioned, it should be understood that the present invention is not limited to the form disclosed herein and should not be construed as excluding other embodiments. Instead, the present invention can be used in various other combinations, modifications, and environments and can be modified within the scope of the inventive concept described herein by the teachings above or by techniques or knowledge in the relevant art. Modifications and variations made by those skilled in the art without departing from the spirit and scope of the present invention are intended to be within the scope of the appended claims.

Claims

1. A solder paste printing device for a strip circuit board, characterized in that: The invention comprises a material strip groove circuit board (100), a material strip feeding system (200) connected to a main controller, a material strip conveying system (300) and a tinning system (400); the material strip groove circuit board (100) is provided with a plurality of material strip groove circuit boards (100), the plurality of material strip groove circuit boards (100) are arranged on the material strip (500) at equal intervals, and a plurality of positioning holes (510) are provided on the material strip (500); The material strip feeding system (200) comprises a whole-roll material strip feeding mechanism (210) and a feeding detection mechanism (220); the whole-roll material strip feeding mechanism (210) comprises a feeding motor (211) connected to a main controller, and a material strip roll placement disk (212) driven by the feeding motor (211); the feeding detection mechanism (220) comprises an upper induction component and a lower induction component connected to the main controller, and the material strip (500) being processed passes between the upper induction component (221) and the lower induction component (222); The material belt conveying system (300) includes a material belt conveying driving wheel mechanism (310) connected to the main controller and a tinning positioning mechanism (320), and also includes a material belt conveying driven wheel mechanism (330) and a material belt conveying track (340); the material belt conveying driving wheel mechanism (310) includes a conveying servo motor (311) connected to the main controller, and a main transmission gear (312) driven by the conveying servo motor (311), and the teeth on the main transmission gear (312) are inserted into the positioning holes (510) on the material belt (500); the tinning positioning mechanism (320) includes a positioning support block (321), a positioning PIN needle (322) and a positioning cylinder (323) connected to the main controller, The positioning support block (321) and the positioning PIN needle (322) are installed on the positioning cylinder (323), and the positioning PIN needle (322) is inserted into the positioning hole (510) of the material belt (500) for positioning by the positioning cylinder (323) rising, and at the same time, the positioning support block (321) is pressed against the bottom surface of the circuit board (100) in the positioning groove of the material belt; the material belt conveying driven wheel mechanism (330) includes a slave transmission gear (331), and the teeth of the slave transmission gear (331) are inserted into the positioning hole (510) of the material belt (500) being processed; the material belt conveying track (340) includes a track bottom plate (341), and the material belt (500) being processed moves horizontally on the track bottom plate (341); The tinning system (400) comprises a Y-axis conveying mechanism (410), an X-axis conveying mechanism (420), a Z-axis conveying mechanism (430) and a visual display device (450) connected to a main controller; and further comprises a tin-spraying paste adapter (440), a laser altimeter (460) and a visual detector (470) connected to the visual display device (450); the X-axis conveying mechanism (420) and the Z-axis conveying mechanism (430) simultaneously move the tin-spraying paste adapter (440), the laser altimeter (460) and the visual detector (470); the Y-axis conveying mechanism (410) drives the material belt conveying system (300) mounted thereon to move forward and backward, so that the tinning position (110) of the material belt groove circuit board (100) to be tinned on the material belt (500) is moved to below the corresponding point position of the tin-spraying position of the tin-spraying paste adapter (440).

2. The solder paste printing device for a strip circuit board according to claim 1, characterized in that: The material belt conveying track (340) further includes a track cover plate (342), and the track cover plate (342) is arranged above the track bottom plate (341).

3. The solder paste printing device for a strip circuit board according to claim 1 or 2, characterized in that: The upper sensing component (221) and the lower sensing component (222) are respectively provided with an upper stainless steel sensing sheet (221A) and a lower stainless steel sensing sheet (222A), and the upper stainless steel sensing sheet (221A) and the lower stainless steel sensing sheet (222A) are respectively arranged above and below the material strip (500) being processed, and the upper stainless steel sensing sheet (221A) and the lower stainless steel sensing sheet (222A) are respectively connected to the main controller via an upper sensing line (221B) and a lower sensing line (222B).

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