Electronic module

Abstract

The present invention provides an electronic module, comprising a circuit board, at least one electronic component, a covering layer, and a colloid. The at least one electronic component is disposed on the circuit board. The covering layer has a plurality of openings, wherein the covering layer is disposed on the circuit board and covers the at least one electronic component. The colloid is bonded to the covering layer, wherein the colloid fills the openings and coats the at least one electronic component.

Description

Technical Field

[0001] The present invention relates to an electronic module, and particularly to an electronic module including a cover layer. Background Art

[0002] In an existing camera module (NB camera) of a personal computer, electronic components are disposed on a thin circuit board. Since the thin circuit board has poor anti-bending ability, the circuit board may be bent by an external force during assembly by an operator, and thus the electronic components disposed on the circuit board may be damaged. In addition, it may be affected by electromagnetic waves or static electricity generated by the electronic components or from the surroundings, so there is a need to shield the electronic components.

[0003] To solve the above problems, in the prior art, a metal case is disposed on the circuit board and covers the electronic components. The metal case can improve the anti-bending ability of the thin circuit board and provide a good shielding effect. However, since the size and shape of the metal case are not easy to change, customized manufacturing is required for various sizes and shapes of electronic modules, resulting in low processing efficiency and poor mobility. In addition, if there is a need for rework, when the metal case is disassembled, it is easy to damage the circuit board and electronic components, resulting in low rework efficiency and low qualification rate. Summary of the Invention

[0004] The present invention provides an electronic module having good anti-bending ability and shielding effect.

[0005] The electronic module of the present invention includes a circuit board, at least one electronic component, a cover layer, and a colloid. The cover layer may be a mesh structure including an adhesive. At least one electronic component is disposed on the circuit board. The cover layer has a plurality of openings, and the cover layer is disposed on the circuit board and covers at least one electronic component in an attached manner. The colloid is bonded between the upper and lower edges of the cover layer and at least one electronic component, and the colloid fills these openings and coats at least one electronic component.

[0006] In an embodiment of the present invention, the above-mentioned cover layer is a mesh structure.

[0007] In an embodiment of the present invention, the material of the above-mentioned cover layer is an insulating material.

[0008] In an embodiment of the present invention, the above-mentioned electronic module further includes an adhesive, and the adhesive is bonded between the circuit board and the cover layer.

[0009] In an embodiment of the present invention, the above-mentioned electronic module further includes a conductive layer, and the conductive layer coats the cover layer and the colloid.

[0010] In an embodiment of the present invention, the above-mentioned circuit board has a grounding portion, and the conductive layer contacts the grounding portion.

[0011] In an embodiment of the present invention, the above-mentioned electronic module further includes an insulating layer, where the insulating layer is located between the colloid and the conductive layer.

[0012] In an embodiment of the present invention, the above-mentioned electronic module further includes a functional element, where the functional element is disposed on the circuit board, the covering layer has an opening, and the opening exposes the functional element.

[0013] In an embodiment of the present invention, the above-mentioned functional element is a light-emitting element, an indicator element, or a microphone element.

[0014] In an embodiment of the present invention, the above-mentioned colloid is a photo-curing adhesive, a heat-curing adhesive, or a room-temperature curing adhesive, but the present invention is not limited thereto.

[0015] Based on the above, in the electronic module of the present invention, a covering layer having a plurality of openings is disposed on the circuit board and covers the electronic components, the colloid is bonded to the covering layer, and the colloid fills these openings and coats the electronic components. Thereby, the covering layer and the colloid can effectively improve the anti-bending ability of the circuit board and prevent the electronic components disposed on the circuit board from being damaged. In addition, the covering layer is easy to cut, so the covering layer can simply change its size and shape according to actual needs. Thereby, the manufacturing efficiency of the electronic module is high and the flexibility is good. Moreover, the colloid can be selectively adjusted in the formulation ratio according to the requirements of the design or the process to adhere between the covering layer and the electronic components, so the colloid can be easily removed along with the covering layer during rework. Thereby, the electronic module has good rework efficiency and qualified rate.

[0016] To make the above features and advantages of the present invention more obvious and understandable, the following specific embodiments are given and described in detail in conjunction with the accompanying drawings as follows. Description of the Drawings

[0017] Figure 1 A front view of an electronic module showing an embodiment of the present invention.

[0018] Figure 2 Showing Figure 1 a partial structure of the electronic module.

[0019] Figure 3 is Figure 1 a cross-sectional view of the electronic module along line A-A.

[0020] Figure 4 is Figure 1 a partial schematic view of the covering layer.

[0021] Figures 5A to 5C is Figure 1 a manufacturing flow chart of the electronic module.

[0022] Figure 6Cross-sectional view of an electronic module showing another embodiment of the present invention.

[0023] Description of reference numerals:

[0024] 100, 100A Electronic module

[0025] 110 Circuit board

[0026] 112 Grounding portion

[0027] 120 Electronic component

[0028] 130 Cover layer

[0029] 132 Opening

[0030] 138 Opening

[0031] 140 Colloid

[0032] 150 Back adhesive

[0033] 160 Conductive layer

[0034] 170 Functional element

[0035] 180 Lens

[0036] 190 Insulating layer Detailed implementation manner

[0037] Figure 1 Front view of an electronic module showing an embodiment of the present invention. Figure 2 Showing Figure 1 Partial structure of the electronic module. Please refer to Figure 1 And Figure 2 , the electronic module 100 of this embodiment is, for example, a camera module (NB camera) of a personal computer, which includes a circuit board 110, a lens 180, a functional element 170 related to the camera function, and at least one electronic component 120 ( Figure 2 Shown as multiple). The electronic component 120 is arranged on the circuit board 110. The functional element 170 is, for example, a light-emitting element, an indicator element, or a microphone element. Among them, the light-emitting element is, for example, an infrared LED, which is used for supplementary lighting in a low-illumination or even lightless environment, and the indicator element is, for example, a white LED, which is used to remind the user of the state of the electronic module 100. In other embodiments, the electronic module 100 can be in other forms, and the present invention does not limit this.

[0038] Figure 3 Is Figure 1 Cross-sectional view of the electronic module along line A-A. Figure 4 Is Figure 1 Partial schematic diagram of the cover layer. Please refer to Figures 2 to 4, the electronic module 100 of this embodiment further includes a cover layer 130 and a colloid 140. The cover layer 130 has a plurality of openings 132, and the cover layer 130 is disposed on the circuit board 110 and covers the electronic components 120. The colloid 140 is bonded between the upper and lower edges of the cover layer 130 and the electronic components 120. The colloid 140 fills these openings 132 and coats the electronic components 120.

[0039] Thereby, the cover layer 130 and the colloid 140 of this embodiment can effectively improve the anti-bending ability of the circuit board 110 and prevent the electronic components 120 disposed on the circuit board 110 from being damaged. Moreover, the cover layer 130 is easy to cut, so the cover layer 130 can simply change its size and shape according to actual needs. Thereby, when manufacturing the cover layer 130, a large-area cover layer 130 can be directly manufactured and then cut according to actual needs. That is to say, the cover layer 130 does not need to be customized for various sizes and shapes of the electronic module 100 during manufacturing. Therefore, the electronic module 100 of this embodiment has high manufacturing efficiency and good flexibility. In addition, since the cover layer 130 is easy to remove from the circuit board 110, when the cover layer 130 is removed, the colloid 140 attached to the cover layer 130 can be easily removed from the circuit board 110 together with the cover layer 130 without damaging the circuit board 110 or the electronic components 120. Thereby, the electronic module 100 of this embodiment has good rework efficiency and maintains the qualified rate after rework.

[0040] In this embodiment, the circuit board 110 is, for example, a thin printed circuit board (PCB board). As Figure 1 shown, in this embodiment, the cover layer 130 has an opening 138, and the opening 138 exposes the functional element 170 and the lens 180.

[0041] Please refer to Figure 4 , in this embodiment, the cover layer 130 is a mesh structure, and these openings 132 are evenly distributed throughout the cover layer 130. In other embodiments, the cover layer 130 can be other forms of structures having a plurality of openings 132, and the present invention does not limit this. The density of these openings 132 can be adjusted according to actual needs. In addition, the material of the cover layer 130 is, for example, an insulating material, and the cover layer 130 having insulating properties can isolate the electronic components 120 and prevent short-circuit problems. For example, the cover layer 130 can be non-woven fabric, or the cover layer 130 can be made of polyvinyl chloride (PVC), but the present invention is not limited thereto.

[0042] In this embodiment, the colloid 140 can penetrate into the space below the covering layer 130 in a liquid state through these openings 132. For example, the colloid 140 can be a photo-curable adhesive or a heat-curable adhesive, or can be of types such as room-temperature curing type, mixing type, quick-drying type, resin, silica gel, epoxy adhesive, acrylic adhesive, etc. The formulation combination of the colloid 140 can be adjusted according to design and manufacturing requirements, and the present invention does not limit this. After the colloid 140 fills these openings 132 and the space between the covering layer 130 and the circuit board 110, the colloid 140 can be cured by ultraviolet light irradiation or heating, or can be cured after standing at room temperature for a period of time.

[0043] As Figure 2 shown, in this embodiment, the circuit board 110 has a grounding portion 112. Most of the material of the grounding portion 112 is a copper layer, a gold layer or a tin layer. The grounding portion 112 exposed on the surface of the circuit board 110 is, for example, rectangular and surrounds the electronic component 120, but the present invention is not limited thereto. Continuing from the above, the electronic module 100 as Figure 3 shown further includes a conductive layer 160, and the conductive layer 160 covers the covering layer 130 and the colloid 140. Specifically, the conductive layer 160 covers above the covering layer 130 and the colloid 140, and surrounds the periphery of the covering layer 130 and the colloid 140. The conductive layer 160 contacts the grounding portion 112 from the periphery of the covering layer 130 and the colloid 140, and the conductive layer 160 can shield the electronic component 120 covered therein, thereby preventing the electronic component 120 from being affected by surrounding electromagnetic waves or static electricity. In this embodiment, the conductive layer 160 is made of a material having conductive properties. For example, the conductive layer 160 can be made of a metal conductive paint or a conductive adhesive, and is formed on the covering layer 130 and the colloid 140 by spraying. Or the conductive layer 160 can also be made of graphite, and graphite has good heat conductivity, and can improve the heat dissipation efficiency of the electronic module 100, preventing the electronic component 120 from being damaged due to overheating.

[0044] The manufacturing process of the electronic module 100 of this embodiment will be described below.

[0045] Figures 5A to 5C is Figure 1 a manufacturing flowchart of the electronic module. First, as Figure 5A shown, a circuit board 110 is provided, which has a grounding portion 112, and the electronic component 120 is disposed on the circuit board 110. Then, as Figure 5BAs shown, the cover layer 130 is cut into corresponding sizes and shapes according to actual requirements, and the cover layer 130 is disposed on the circuit board 110 to cover the electronic components 120. In this embodiment, the bottom of the cover layer 130 further includes an adhesive 150, and the adhesive 150 is glued between the circuit board 110 and the cover layer 130. The adhesive 150 has adhesiveness, and the adhesive 150 can be pre-configured at the bottom of the cover layer 130. Therefore, the cover layer 130 can be pre-fixed by using the adhesive 150 pre-configured at the bottom of the cover layer 130.

[0046] As Figure 5C shown, the colloid 140 is sprayed on the cover layer 130 in a spraying manner, for example. The colloid 140 penetrates through these openings 132 of the cover layer 130 to the lower side of the cover layer 130 to coat the electronic components 120. Then, the colloid 140 is irradiated with ultraviolet light or heated, and the colloid 140 becomes a solid state with good anti-bending ability. Finally, the conductive layer 160 is disposed on the cover layer 130 in a spraying manner, for example, so that the conductive layer 160 coats the upper side and the side of the cover layer 130 and the colloid 140 and contacts the grounding portion 112, thus completing Figure 3 the electronic module 100 shown.

[0047] It should be noted that during the spraying process, a mask (not shown) can be disposed at a position corresponding to the opening 138. Therefore, the functional elements 170 and the lens 180 in the opening 138 will not be covered by the colloid 140 or the conductive layer 160.

[0048] Figure 6 The cross-sectional view of the electronic module according to another embodiment of the present invention is shown. Please refer to Figure 3 and Figure 6 , the electronic module 100A of this embodiment is similar to the Figure 3 electronic module 100. The difference between the two is that in this embodiment, the electronic module 100A further includes an insulating layer 190, and the insulating layer 190 is located between the colloid 140 and the conductive layer 160. Thereby, the insulating layer 190 can further isolate the electronic components 120 from the conductive layer 160. Therefore, even if the colloid 140 does not uniformly coat the electronic components 120, the electronic components 120 will not contact the conductive layer 160 to cause a short-circuit problem.

[0049] In summary, in the electronic module of the present invention, a covering layer having a plurality of openings is disposed on a circuit board and covers electronic components, a colloid is bonded to the covering layer, and the colloid fills these openings and coats the electronic components. Thereby, the covering layer and the colloid can effectively improve the bending resistance of the circuit board and prevent the electronic components disposed on the circuit board from being damaged. In addition, the covering layer is easy to cut, so the covering layer can be simply changed in size and shape according to actual needs. Thereby, the electronic module has high manufacturing efficiency and good mobility. Also, since the colloid adheres to the covering layer, the colloid can be easily removed together with the covering layer during rework. Thereby, the electronic module has good rework efficiency and qualification rate. In addition, a conductive layer coats the covering layer and the colloid and contacts a grounding portion, so the conductive layer can form a shield for the electronic components, thereby preventing the electronic components from being affected by surrounding electromagnetic waves or static electricity.

[0050] Although the present invention has been disclosed above by way of examples, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the appended claims.

Claims

1. An electronic module, characterized in that, Comprising: A circuit board; At least one electronic component, disposed on the circuit board; A cover layer, having a plurality of openings, wherein the cover layer is disposed on the circuit board and covers the at least one electronic component; A colloid, bonded to the cover layer, wherein the colloid fills the openings and coats the at least one electronic component; and An adhesive backing, wherein the adhesive backing is glued between the circuit board and the cover layer.

2. The electronic module according to claim 1, characterized in that The cover layer is a mesh structure.

3. The electronic module according to claim 1, characterized in that, The material of the cover layer includes an insulating material.

4. The electronic module according to claim 1, further comprising a conductive layer, wherein the conductive layer coats the cover layer and the colloid.

5. The electronic module according to claim 4, characterized in that, The circuit board has a grounding portion, and the conductive layer contacts the grounding portion.

6. The electronic module according to claim 4, further comprising an insulating layer, wherein the insulating layer is located between the colloid and the conductive layer.

7. The electronic module according to claim 1, further comprising a functional element, wherein the functional element is disposed on the circuit board, and the cover layer has an opening that exposes the functional element.

8. The electronic module according to claim 7, characterized in that The functional element is a light-emitting element, an indicator element, or a microphone element.

9. The electronic module according to claim 1, characterized in that The colloid is a photo-curing adhesive, a heat-curing adhesive, or a room-temperature curing adhesive.

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