Electroplating tank jet device

Abstract

The present invention provides an electroplating tank jetting device, comprising: a main body structure, an electroplating assembly, and an electroplating solution jetting and stirring mechanism. Among them, the main body structure includes an electroplating tank for loading the electroplating solution required for the process. The interior of the electroplating tank is partitioned by a partition to form an electroplating solution return tank and an electroplating tank; the electroplating assembly is installed in the electroplating tank; the electroplating solution jetting and stirring mechanism is commonly installed on the electroplating tank and the electroplating assembly, and the electroplating solution jetting and stirring mechanism is used to jet the electroplating solution onto the wafer. The electroplating tank jetting device provided by the present invention has a rotating stirring and jetting function. It can jet the electroplating solution into fine circuits that cannot be reached by general immersion and surge electroplating methods, and can also eject the tiny bubbles in the gaps to avoid uneven electroplating caused by invisible bubbles to the naked eye, improve the product yield, and further enhance the product performance, making it possible to manufacture finer gold wire circuits.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and specifically relates to a jet flow device for an electroplating tank body. Background Art

[0002] The Chinese authorized patent with the publication (announcement) number CN208038575U discloses an electroplating device with a jet flow rod having a moving function, which includes: an electroplating tank, an anode, a cathode, an electroplating solution jet flow system, and a power device. Among them, the electroplating solution jet flow system includes a first liquid inlet pipe, a second liquid inlet pipe, a pump, a three-way valve, and four jet flow main rods. The jet flow rod with a moving function provided by the electroplating device adjusts the relative position between the jet holes and the printed circuit board by reciprocating up and down in the vertical direction, enhancing the solution exchange of the electroplating solution on the surface of the printed circuit board, through holes, and blind holes without affecting the overall solution circulation, thereby effectively improving the plating layer uniformity of electroplating and the through-hole ability of the solution. The jet flow rod can move up and down in the vertical direction, making the plating layer of the printed circuit board uniform and consistent, and the brightness of the electroplating area consistent, greatly improving the quality of electroplating, and the structure is simple.

[0003] In the new generation of electroplating processes (gold electroplating, copper electroplating), the required electroplating precision is getting higher and higher, and the electroplating lines required for the products to be electroplated are getting narrower and narrower. The electroplating device with a jet flow rod having a moving function provided by the above patent is difficult to spray the electroplating solution into the fine circuits that cannot be reached by the general immersion and surge electroplating methods, and it is difficult to eject the tiny bubbles in the gaps, resulting in invisible bubbles causing uneven electroplating, affecting the product yield, and even more affecting the product performance, and it is difficult to meet the manufacturing requirements of finer gold wire circuits, making the yield of the electroplating process lower and lower.

[0004] Therefore, a jet flow device for an electroplating tank body is proposed. Summary of the Invention

[0005] The present invention aims to solve the problems raised in the background art, and provides a jet flow device for an electroplating tank body, which can spray the electroplating solution into the fine circuits that cannot be reached by the general immersion and surge electroplating methods, and can also eject the tiny bubbles in the gaps, avoiding invisible bubbles causing uneven electroplating, improving the product yield, and even more enhancing the product performance, making it possible to manufacture finer gold wire circuits.

[0006] The specific technical solutions are as follows:

[0007] A jet flow device for an electroplating tank body includes:

[0008] A main body structure, which includes an electroplating tank body for loading the electroplating solution required for the process. The interior of the electroplating tank body is separated by a partition to form an electroplating solution return tank and an electroplating tank. The electroplating solution return tank is used to recover the electroplating solution flowing out of the electroplating tank, and the electroplating tank is used to electroplate the electroplating solution onto the wafer.

[0009] An electroplating assembly, which is installed in the electroplating tank and used to fix the wafer;

[0010] An electroplating solution jet stirring mechanism, which is jointly installed on the electroplating tank and the electroplating assembly, and the electroplating solution jet stirring mechanism is used to jet the electroplating solution onto the wafer.

[0011] As a preferred solution of the present invention, a horizontally arranged support plate is fixedly installed at the inner bottom of the electroplating tank, the bottom of the partition plate is fixedly connected to the upper part of the support plate, and a plurality of through holes are evenly formed near the bottom of the partition plate, and a cover plate is installed at the notch of the electroplating solution return tank.

[0012] As a preferred solution of the present invention, the electroplating assembly includes a fitting seat, a cylindrical tank, an annular pressing ring, a cathode and an anode. The fitting seat is fixedly installed on the support plate, the cylindrical tank is fixedly installed on the upper part of the fitting seat, and a connection hole is formed on the side wall of the cylindrical tank. The annular pressing ring is installed at the upper part of the notch of the cylindrical tank through an adjusting bolt, and the annular pressing ring is used to fix the wafer at the notch of the cylindrical tank. The cathode is arranged on the outer periphery of the cylindrical tank, and the bottom end of the cathode extends into the inner bottom of the cylindrical tank. The anode is fixedly installed on the annular pressing ring.

[0013] As a preferred solution of the present invention, the electroplating assembly further includes a metal mesh, the metal mesh is arranged inside the cylindrical tank, and the metal mesh is arranged at the bottom end of the cathode through screws. At least three cathodes and anodes are respectively provided.

[0014] As a preferred embodiment of the present invention, the electroplating solution jet stirring mechanism includes a reduction motor, a transmission rod, bevel gears, an annular rail, an annular toothed rail, a hollow connecting rod, a jet pipe, and two nozzles. The reduction motor is fixedly installed on the outer side wall of the electroplating tank body. The transmission rod is sealed and rotatably installed on the side wall of the cylindrical tank body, and one end of the transmission rod is fixedly connected to the output shaft of the reduction motor. The bevel gear is fixedly installed at the other end of the transmission rod, and the bevel gear is located inside the cylindrical tank body. The annular rail is sealed and rotatably installed on the inner side wall of the cylindrical tank body, and an annular flow channel is provided on the outer ring surface of the annular rail. The annular flow channel is communicated with the connection hole. The annular toothed rail is fixedly installed at the bottom of the annular rail, and the teeth on the annular toothed rail are meshed with the bevel gear. The hollow connecting rod is fixedly installed on the inner ring surface of the annular rail, and the inside of the hollow connecting rod is communicated with the annular flow channel. The jet pipe is rotatably installed on the hollow connecting rod through a hollow rotating shaft, and the jet pipe is horizontally arranged. Both nozzles are fixedly installed on the upper part of the jet pipe, and both nozzles are communicated with the annular flow channel through the jet pipe, the hollow rotating shaft, and the hollow connecting rod in sequence.

[0015] As a preferred embodiment of the present invention, the two nozzles are arranged staggeredly, and the included angle between the central axes of the two nozzles is 35 - 45°, and the included angles between the central axes of the two nozzles and the lower surface of the wafer are equal.

[0016] As a preferred embodiment of the present invention, the distances between the two nozzles and the lower surface of the wafer are equal, and the distances between the two nozzles and the lower surface of the wafer are 18 - 19 mm.

[0017] As a preferred embodiment of the present invention, the working pressures of the two nozzles are equal, and the working pressures of the two nozzles are 8 - 12 Pa.

[0018] As a preferred embodiment of the present invention, a liquid return port is embedded at the central position of the mounting seat. The upper end of the liquid return port is communicated with the inner bottom of the cylindrical tank body, and the bottom end of the liquid return port is communicated with the collection port at the side part of the bottom of the electroplating solution return tank through a pipeline.

[0019] As a preferred embodiment of the present invention, a filter pipe and a liquid addition port are embedded on the bottom wall of the electroplating solution return tank. The part of the filter pipe located inside the electroplating solution return tank has filter holes, and the bottom end of the filter pipe is communicated with the connection hole through an infusion pipe. A pressure pump for pumping the electroplating solution inside the electroplating solution return tank into the connection hole is installed on the infusion pipe. The liquid addition port is used to supplement electroplating solution into the electroplating solution return tank through a liquid addition pump.

[0020] The present invention has the following beneficial effects:

[0021] The electroplating tank body jetting device provided by the present invention mainly consists of a main structure, an electroplating component, and an electroplating solution jetting and stirring mechanism. Among them, the electroplating solution jetting and stirring mechanism has the functions of rotary stirring and jetting. It can jet the electroplating solution into fine circuits that cannot be reached by general immersion and surge electroplating methods, and can also jet out the tiny bubbles in the gaps, avoiding uneven electroplating caused by invisible bubbles to the naked eye, improving the product yield, and further enhancing the product performance, making it possible to manufacture finer gold wire circuits. Description of the Drawings

[0022] Figure 1 It is a schematic structural diagram of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0023] Figure 2 It is a schematic structural diagram of another perspective of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0024] Figure 3 It is a schematic diagram of a partial structure one of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0025] Figure 4 It is a schematic diagram of a partial structure two of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0026] Figure 5 It is a schematic diagram of a partial structure three of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0027] Figure 6 It is a schematic diagram of a partial structure four of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0028] Figure 7 It is a schematic diagram of a partial structure five of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0029] Figure 8 It is a schematic diagram of a partial structure six of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0030] Figure 9 It is a schematic diagram of a partial structure seven of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0031] Figure 10 is Figure 9 an enlarged structural schematic diagram at position C in;

[0032] Figure 11 It is a schematic diagram of a partial structure eight of the electroplating tank body jetting device provided by an embodiment of the present invention;

[0033] Figure 12Partial structural schematic IX of the electroplating tank jetting device provided by the embodiment of the present invention;

[0034] Figure 13 Partial structural schematic X of the electroplating tank jetting device provided by the embodiment of the present invention.

[0035] In the drawings:

[0036] 1. Main body structure; 11. Electroplating tank body; 12. Electroplating tank; 13. Electroplating solution reflux tank; 14. Partition board; 15. Cover plate; 16. Filter pipe; 17. Liquid adding port; 18. Collection port; 19. Support plate;

[0037] 2. Electroplating assembly; 21. Fitting seat; 22. Cylindrical tank body; 23. Cathode; 24. Connection hole; 25. Anode; 26. Annular pressing ring; 27. Bolt; 28. Metal mesh; 29. Screw;

[0038] 3. Electroplating solution jetting and stirring mechanism; 31. Hollow connecting rod; 32. Jetting pipe; 33. Nozzle; 34. Reduction motor; 35. Annular rail; 36. Transmission rod; 37. Bevel gear; 38. Annular tooth rail; 39. Annular flow channel; 40. Liquid return port;

[0039] 4. Wafer. Detailed implementation manners

[0040] The technical solutions of the present invention will be further described below with reference to the drawings and through specific implementation manners.

[0041] Among them, the drawings are only for illustrative purposes, showing only schematic diagrams, not physical diagrams, and cannot be construed as a limitation of this patent; in order to better illustrate the embodiments of the present invention, some components in the drawings will be omitted, enlarged or reduced, and do not represent the dimensions of actual products; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0042] In the drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that if terms such as "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so the terms describing the positional relationship in the drawings are only for illustrative purposes and cannot be construed as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0043] In the description of the present invention, unless otherwise clearly specified and defined, if terms such as "connection" are used to indicate the connection relationship between components, such terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] The electroplating tank body jet device provided by the embodiment of the present invention, as Figures 1 - 13 shown, includes: a main body structure 1, an electroplating component 2, and an electroplating solution jet stirring mechanism 3.

[0045] Among them, the main body structure 1 includes an electroplating tank body 11, and the electroplating tank body 11 is used to load the electroplating solution required for the process. The inside of the electroplating tank body 11 is separated by a partition plate 14 to form an electroplating solution return tank 13 and an electroplating tank 12. The electroplating solution return tank 13 is used to recover the electroplating solution flowing out of the electroplating tank 12, and the electroplating tank 12 is used to electroplate the electroplating solution onto the wafer 4;

[0046] Among them, the electroplating component 2 is installed in the electroplating tank 12 and is used to fix the wafer 4;

[0047] Among them, the electroplating solution jet stirring mechanism 3 is jointly installed on the electroplating tank 12 and the electroplating component 2, and the electroplating solution jet stirring mechanism 3 is used to spray the electroplating solution onto the wafer 4.

[0048] The electroplating tank body jet device adopting the above technical solution mainly consists of a main body structure 1, an electroplating component 2, and an electroplating solution jet stirring mechanism 3. Among them, the electroplating solution jet stirring mechanism 3 has the functions of rotary stirring and jetting. It can spray the electroplating solution into the fine circuits that cannot be reached by the general immersion and surge electroplating methods, and can also spray out the tiny bubbles in the gaps to avoid uneven electroplating caused by invisible bubbles to the naked eye, improve the product yield, and further enhance the product performance, making it possible to manufacture finer gold wire circuits.

[0049] Specifically, in this embodiment: a horizontally arranged support plate 19 is fixedly installed at the inner bottom of the electroplating tank 12. The provided support plate 19 is used to install the mounting seat 21 in the electroplating component 2. The bottom of the partition plate 14 is fixedly connected to the upper part of the support plate 19, and a plurality of through holes are evenly opened near the bottom of the partition plate 14. The provided plurality of through holes are used to connect the electroplating solution return tank 13 and the electroplating tank 12 to ensure that the electroplating solution in the electroplating tank 12 is conducted with the cathode 23 and the anode 25 in the electroplating component 2. A cover plate 15 is installed at the notch of the electroplating solution return tank 13. The provided cover plate 15 can prevent foreign objects from falling into the inside of the electroplating solution return tank 13 and affecting the quality of the electroplating solution.

[0050] Specifically, to achieve the specific functions of the electroplating component 2, in this embodiment: The electroplating component 2 includes a mounting seat 21, a cylindrical tank 22, an annular retaining ring 26, a cathode 23, and an anode 25. The mounting seat 21 is fixedly installed on the support plate 19. The cylindrical tank 22 is fixedly installed on the upper part of the mounting seat 21, and a connection hole 24 is formed in the side wall of the cylindrical tank 22. The annular retaining ring 26 is installed at the upper part of the notch of the cylindrical tank 22 through an adjusting bolt 27, and the annular retaining ring 26 is used to fix the wafer 4 at the notch of the cylindrical tank 22. The cathode 23 is arranged on the outer periphery of the cylindrical tank 22, and the bottom end of the cathode 23 extends into the inner bottom of the cylindrical tank 22. The anode 25 is fixedly installed on the annular retaining ring 26.

[0051] Among them, the annular retaining ring 26 is installed by using the adjusting bolt 27, so that the annular retaining ring 26 is convenient for disassembly and assembly, and thus the loading and unloading of the wafer 4 is relatively convenient. The cathode 23 is used to connect the negative pole of the DC power supply, and the anode 25 is used to connect the positive pole of the DC power supply, so that the metal in the electroplating solution can be electroplated onto the surface of the wafer 4.

[0052] Specifically, to improve the electroplating quality, in this embodiment: The electroplating component 2 further includes a metal mesh 28. The metal mesh 28 is arranged inside the cylindrical tank 22, and the metal mesh 28 is arranged at the bottom end of the cathode 23 through a screw 29. At least three cathodes 23 and anodes 25 are respectively provided. The metal mesh 28 cooperates with three cathodes 23 and three anodes 25 to make the current distribution between the cathodes 23 and the anodes 25 relatively uniform, thereby improving the electroplating quality.

[0053] Specifically, in order to implement the specific functions of the electroplating solution jet stirring mechanism 3, in this embodiment: The electroplating solution jet stirring mechanism 3 mainly consists of a reduction motor 34, a transmission rod 36, bevel gears 37, an annular rail 35, an annular toothed rail 38, a hollow connecting rod 31, a jet pipe 32, and two nozzles 33. The reduction motor 34 is fixedly installed on the outer side wall of the electroplating tank body 11. The transmission rod 36 is sealed and rotatably installed on the side wall of the cylindrical tank body 22, and one end of the transmission rod 36 is fixedly connected to the output shaft of the reduction motor 34. The bevel gear 37 is fixedly installed at the other end of the transmission rod 36, and the bevel gear 37 is located inside the cylindrical tank body 22. The annular rail 35 is sealed and rotatably installed on the inner side wall of the cylindrical tank body 22, and an annular flow channel 39 is provided on the outer ring surface of the annular rail 35. The annular flow channel 39 is communicated with the connection hole 24. The annular toothed rail 38 is fixedly installed at the bottom of the annular rail 35, and the teeth on the annular toothed rail 38 mesh with the bevel gear 37. The hollow connecting rod 31 is fixedly installed on the inner ring surface of the annular rail 35, and the inside of the hollow connecting rod 31 is communicated with the annular flow channel 39. The jet pipe 32 is rotatably installed on the hollow connecting rod 31 through a hollow rotating shaft, and the jet pipe 32 is horizontally arranged. Both nozzles 33 are fixedly installed on the upper part of the jet pipe 32. Both nozzles 33 are sequentially communicated with the annular flow channel 39 through the jet pipe 32, the hollow rotating shaft, and the hollow connecting rod 31.

[0054] Among them, the working principle of the electroplating solution jet stirring mechanism 3 is as follows: The electroplating solution is added into the inside of the annular flow channel 39 through the connection hole 24. The electroplating solution is sprayed onto the lower surface of the wafer 4 through the two nozzles 33. At the same time, the reduction motor 34 drives the transmission rod 36 to rotate. The transmission rod 36 drives the bevel gear 37 to rotate. The bevel gear 37 drives the annular toothed rail 38 to rotate. The annular toothed rail 38 drives the annular rail 35 to rotate. The annular rail 35 drives the two nozzles 33 to revolve around the inner side wall of the cylindrical tank body 22. At the same time, when the electroplating solution sprayed by the two nozzles 33 impacts the lower surface of the wafer 4, a reaction force is applied to the two nozzles 33. Since the jet pipe 32 is rotatably installed on the hollow connecting rod 31 through a hollow rotating shaft, at this time, under the action of the reaction force, the two nozzles 33 generate self-rotation, so as to realize the revolution and self-rotation of the two nozzles 33 around the inner side wall of the cylindrical tank body 22 at the same time, so that the electroplating solution sprayed by the two nozzles 33 can completely cover the lower surface of the entire wafer 4, and further enable a uniform electroplating layer to be formed on the lower surface of the wafer 4, thereby improving the electroplating quality.

[0055] Specifically, in order to enable the electroplating solution to be sprayed into the fine circuits on the lower surface of the wafer 4 and to eject the tiny bubbles in the gaps, so as to avoid uneven electroplating caused by invisible bubbles to the naked eye, in this embodiment: the two nozzles 33 are arranged staggeredly, and the included angle between the central axes of the two nozzles 33 is 35-45°, the included angles between the central axes of the two nozzles 33 and the lower surface of the wafer 4 are equal, the distances between the two nozzles 33 and the lower surface of the wafer 4 are equal, and the distance between the two nozzles 33 and the lower surface of the wafer 4 is 18-19 mm, the working pressures of the two nozzles 33 are equal, and the working pressure of the two nozzles 33 is 8-12 Pa.

[0056] Specifically, in order to enable the device to work continuously, in this embodiment: a liquid return port 40 is embedded at the central position of the mounting seat 21, the upper end of the liquid return port 40 is communicated with the inner bottom of the cylindrical tank 22, and the bottom end of the liquid return port 40 is communicated with the collection port 18 on the side of the bottom of the electroplating solution return tank 13 through a pipeline. The liquid return port 40 is used for the electroplating solution inside the cylindrical tank 22 to flow back into the electroplating solution return tank 13, which can prevent the inside of the cylindrical tank 22 from being filled with electroplating solution and causing compressive damage to the wafer 4, so that the device can work continuously.

[0057] Specifically, in order to enable the device to work normally, in this embodiment: a filter pipe 16 and a liquid addition port 17 are embedded on the bottom wall of the electroplating solution return tank 13. The part of the filter pipe 16 located inside the electroplating solution return tank 13 has filter holes, and the bottom end of the filter pipe 16 is communicated with the connection hole 24 through an infusion pipe. A pressure pump for pumping the electroplating solution inside the electroplating solution return tank 13 into the connection hole 24 is installed on the infusion pipe. The liquid addition port 17 is used to supplement the electroplating solution into the electroplating solution return tank 13 through a liquid addition pump.

[0058] In summary, the electroplating tank jetting device provided in this embodiment has the following advantages:

[0059] The electroplating tank jetting device mainly consists of a main body structure 1, an electroplating component 2, and an electroplating solution jetting and stirring mechanism 3. Among them, the electroplating solution jetting and stirring mechanism 3 has the functions of rotary stirring and jetting. It can spray the electroplating solution into fine circuits that cannot be reached by general immersion and surge electroplating methods, and can also eject the tiny bubbles in the gaps, avoiding uneven electroplating caused by invisible bubbles to the naked eye, improving the product yield, and further enhancing the product performance, making it possible to manufacture finer gold wire circuits.

[0060] In use, connect the cathode 23 to the negative pole of the DC power supply and the anode 25 to the positive pole of the DC power supply. Fix the wafer 4 at the notch of the cylindrical groove body 22 by using the adjusting bolt 27 in cooperation with the annular pressing ring 26, and then power on. First, start the reduction motor 34 to drive the transmission rod 36 to rotate. The transmission rod 36 drives the bevel gear 37 to rotate, the bevel gear 37 drives the annular tooth rail 38 to rotate, the annular tooth rail 38 drives the annular rail 35 to rotate, and the annular rail 35 drives the two nozzles 33 to revolve around the inner side wall of the cylindrical groove body 22. Then start the pressure pump. The pressure pump pumps the electroplating solution inside the electroplating solution return tank 13 into the connection hole 24. The electroplating solution is ejected through the two nozzles 33. When the electroplating solution ejected from the two nozzles 33 impacts the lower surface of the wafer 4, a reaction force is applied to the two nozzles 33. Under the action of the reaction force, the two nozzles 33 rotate self - clockwise, so as to realize the revolution of the two nozzles 33 around the inner side wall of the cylindrical groove body 22 while rotating self - clockwise, so that the electroplating solution ejected from the two nozzles 33 can completely cover the lower surface of the whole wafer 4, and then a uniform electroplating layer can be formed on the lower surface of the wafer 4, thereby improving the electroplating quality.

[0061] The above are only the preferred embodiments of the present invention, and do not limit the implementation manners and protection scope of the present invention accordingly. For those skilled in the art, it should be realized that all the equivalent replacements and obvious changes made by using the description and illustration content of the present invention should be included in the protection scope of the present invention.

Claims

1. An electroplating tank jet flow device, characterized in that, Comprising: A main body structure (1), which includes a plating tank body (11) for loading the plating solution required for the process. The interior of the plating tank body (11) is separated by a partition plate (14) to form a plating solution return tank (13) and a plating tank (12). The plating solution return tank (13) is used to recover the plating solution flowing out of the plating tank (12), and the plating tank (12) is used to electroplate the plating solution onto the wafer (4); A plating assembly (2) installed in the plating tank (12) for fixing the wafer (4); A plating solution jet stirring mechanism (3) jointly installed on the plating tank (12) and the plating assembly (2), and the plating solution jet stirring mechanism (3) is used to spray the plating solution onto the wafer (4); A horizontally arranged support plate (19) is fixedly installed at the inner bottom of the plating tank (12). The bottom of the partition plate (14) is fixedly connected to the upper part of the support plate (19), and a plurality of through holes are evenly formed near the bottom of the partition plate (14). A cover plate (15) is installed at the notch of the plating solution return tank (13); The plating assembly (2) includes a fitting seat (21), a cylindrical tank body (22), an annular pressing ring (26), a cathode (23) and an anode (25). The fitting seat (21) is fixedly installed on the support plate (19), the cylindrical tank body (22) is fixedly installed on the upper part of the fitting seat (21), and a connection hole (24) is formed on the side wall of the cylindrical tank body (22). The annular pressing ring (26) is installed at the upper part of the notch of the cylindrical tank body (22) through an adjusting bolt (27), and the annular pressing ring (26) is used to fix the wafer (4) at the notch of the cylindrical tank body (22). The cathode (23) is arranged on the outer periphery of the cylindrical tank body (22), and the bottom end of the cathode (23) extends into the inner bottom of the cylindrical tank body (22). The anode (25) is fixedly installed on the annular pressing ring (26); The electroplating solution jet stirring mechanism (3) includes a reduction motor (34), a transmission rod (36), bevel gears (37), an annular rail (35), an annular toothed rail (38), a hollow connecting rod (31), a jet pipe (32), and two spray heads (33). The reduction motor (34) is fixedly installed on the outer side wall of the electroplating tank body (11). The transmission rod (36) is sealed and rotatably installed on the side wall of the cylindrical tank body (22), and one end of the transmission rod (36) is fixedly connected to the output shaft of the reduction motor (34). The bevel gear (37) is fixedly installed at the other end of the transmission rod (36), and the bevel gear (37) is located inside the cylindrical tank body (22). The annular rail (35) is sealed and rotatably installed on the inner side wall of the cylindrical tank body (22), and an annular flow channel (39) is provided on the outer ring surface of the annular rail (35). The annular flow channel (39) is communicated with the connection hole (24). The annular toothed rail (38) is fixedly installed at the bottom of the annular rail (35), and the teeth on the annular toothed rail (38) are meshed with the bevel gear (37). The hollow connecting rod (31) is fixedly installed on the inner ring surface of the annular rail (35), and the inside of the hollow connecting rod (31) is communicated with the annular flow channel (39). The jet pipe (32) is rotatably installed on the hollow connecting rod (31) through a hollow rotating shaft, and the jet pipe (32) is horizontally arranged. Both of the two spray heads (33) are fixedly installed on the upper part of the jet pipe (32). Both of the two spray heads (33) are communicated with the annular flow channel (39) through the jet pipe (32), the hollow rotating shaft, and the hollow connecting rod (31) in sequence.

2. The jet flow device for an electroplating bath according to claim 1, wherein The electroplating assembly (2) further includes a metal mesh (28). The metal mesh (28) is arranged inside the cylindrical tank body (22), and the metal mesh (28) is arranged at the bottom end of the cathode (23) through screws (29). At least three cathodes (23) and anodes (25) are respectively provided.

3. The electroplating bath jet flow device according to claim 2, wherein The two spray heads (33) are staggered, and the included angle between the central axes of the two spray heads (33) is 35 - 45°. The included angles between the central axes of the two spray heads (33) and the lower surface of the wafer (4) are equal.

4. The electroplating tank jet device according to claim 3, wherein, The distances between the two spray heads (33) and the lower surface of the wafer (4) are equal, and the distances between the two spray heads (33) and the lower surface of the wafer (4) are 18 - 19 mm.

5. The electroplating bath jet device according to claim 4, characterized in that, The working pressures of the two spray heads (33) are equal, and the working pressures of the two spray heads (33) are 8 - 12 Pa.

6. The jet flow device for an electroplating tank body according to claim 5, characterized in that, A liquid return port (40) is embedded at the central position of the fitting seat (21). The upper end of the liquid return port (40) is communicated with the inner bottom of the cylindrical tank body (22), and the bottom end of the liquid return port (40) is communicated with the collection port (18) at the bottom side of the electroplating solution return tank (13) through a pipeline.

7. The jet flow device for the electroplating bath according to claim 6, characterized in that, A filter tube (16) and a liquid addition port (17) are embedded in the bottom wall of the electroplating solution reflux tank (13). The part of the filter tube (16) located inside the electroplating solution reflux tank (13) has filter holes, and the bottom end of the filter tube (16) is connected to the connection hole (24) through an infusion tube. A pressure pump for pumping the electroplating solution inside the electroplating solution reflux tank (13) into the connection hole (24) is installed on the infusion tube. The liquid addition port (17) is used to supplement the electroplating solution into the electroplating solution reflux tank (13) through a liquid addition pump.

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