Touch panel device and manufacturing method thereof

Abstract

A touch panel device and a manufacturing method thereof, the touch panel device comprises a substrate, a touch panel and a photocurable adhesive film. The substrate comprises a top surface, the touch panel is arranged above the top surface of the substrate, and the touch panel comprises a touch plate and a circuit board stacked on each other. The photocurable adhesive film is then fixed between the touch plate and the circuit board, and the photocurable adhesive film is in a cured state.

Description

Technical Field

[0001] The invention relates to an input device, in particular to a touch panel device and a manufacturing method thereof. Background Art

[0002] A touch pad is an input device widely used in computers, and is used to sense the movement or pressure of a user's finger to control the movement of a cursor (eg, displacement or clicking).

[0003] The current manufacturing method of the touch panel device mainly involves applying liquid adhesive on the touch panel through a glue dispenser, attaching the circuit board to the adhesive, and finally performing a high-temperature baking operation so that the adhesive fixes the touch panel and the circuit board to each other.

[0004] However, the above manufacturing method requires the use of a dispensing machine to apply liquid adhesive at a special angle, which is time-consuming and inconvenient in the process. In addition, when the circuit board is attached to the liquid adhesive, the adhesive is prone to overflow. In addition, the thickness of the liquid adhesive after application is large (at least 0.15 mm thick) and uneven application is prone to occur. The liquid adhesive is also prone to generate bubbles during high-temperature baking, resulting in poor flatness of the touch panel, the overall thickness of the touch panel device cannot be further thinned, affecting the user's pressing feel, and the rigidity of the touch panel after being combined with the circuit board is poor, which is prone to shaking, bending or excessive idle travel when the corner is pressed. Summary of the invention

[0005] In view of the above, in one embodiment, a manufacturing method of a touch panel device is provided, including providing a photocurable sheet, wherein the photocurable sheet includes a first release sheet, a second release sheet and a photocurable adhesive film stacked on each other, the photocurable adhesive film is in an uncured state and includes a first surface and a second surface opposite to each other, the first release sheet is attached to the first surface, and the second release sheet is attached to the second surface; removing the first release sheet and attaching the first surface of the photocurable adhesive film to the surface of the touch panel; irradiating the photocurable adhesive film with light from a light-emitting component and removing the second release sheet; attaching the surface of the circuit board to the second surface of the photocurable adhesive film by a machine; and the photocurable adhesive film reacts from the uncured state to the cured state.

[0006] In another embodiment, a manufacturing method of a touch panel device is provided, including providing a photocurable sheet, wherein the photocurable sheet includes a first release sheet, a second release sheet and a photocurable adhesive film stacked on each other, the photocurable adhesive film is in an uncured state and includes a first surface and a second surface opposite to each other, the first release sheet is attached to the first surface, and the second release sheet is attached to the second surface; removing the first release sheet and attaching the first surface of the photocurable adhesive film to the surface of a circuit board; irradiating the photocurable adhesive film with light from a light-emitting component and removing the second release sheet; attaching the surface of the touch panel to the second surface of the photocurable adhesive film by a machine; and the photocurable adhesive film reacts from an uncured state to a cured state.

[0007] In another embodiment, a touch panel device is provided, including a substrate, a touch panel, and a photocurable adhesive film. The substrate includes a top surface, the touch panel is disposed above the top surface of the substrate, and the touch panel includes a touch plate and a circuit board stacked on each other. The photocurable adhesive film is then fixed between the touch plate and the circuit board, and the photocurable adhesive film is in a cured state.

[0008] In summary, according to the touch panel device and the manufacturing method thereof of the embodiment of the present invention, the touch panel and the circuit board are fixed via a photocurable adhesive film. Compared with the conventional liquid adhesive, the touch panel device of the embodiment of the present invention does not need to use an additional glue dispenser during the manufacturing process and will not overflow the glue. In addition, the photocurable adhesive film is thin, the curing speed is fast, and the process does not generate bubbles, so that the flatness of the touch panel and the circuit board after being combined is good and thinner, and the cured photocurable adhesive film can provide better rigidity to avoid problems such as shaking, bending or excessive idle travel when the corners of the touch panel are pressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is an application schematic diagram of an embodiment of a touch panel device of the present invention;

[0010] Figure 2 is an exploded perspective view of an embodiment of a touch panel device of the present invention;

[0011] Figure 3 is a cross-sectional view of an embodiment of a touch panel device of the present invention;

[0012] Figure 4 is a manufacturing flow chart of an embodiment of a touch panel device of the present invention;

[0013] Figure 5 It is a continuation Figure 4 Manufacturing flow chart;

[0014] Figure 6 It is a continuation Figure 5 Manufacturing flow chart;

[0015] Figure 7is a flowchart of steps of an embodiment of a method for manufacturing a touch panel device of the present invention;

[0016] Figure 8 It is a flowchart of another embodiment of the manufacturing method of the touch panel device of the present invention.

[0017]

Explanation of symbols

[0018] N: Notebook computer

[0019] 1: Touchpad device

[0020] 10:Substrate

[0021] 101: Long block

[0022] 11: Top surface

[0023] 20: Touch panel

[0024] 201: Pivot side

[0025] 202: Swing side

[0026] 203: Press the trigger switch

[0027] 21: Touchpad

[0028] 25: Circuit Board

[0029] 26: Bottom

[0030] 30: Light-cured film

[0031] 31: First release sheet

[0032] 32: Second release sheet

[0033] 35: Light-cured adhesive film

[0034] 351: First surface

[0035] 352: Second surface

[0036] 40: Luminous parts

[0037] 50: Machinery

[0038] T:Thickness

[0039] S01~S06: Steps

[0040] S02', S04': Steps DETAILED DESCRIPTION

[0041] Figure 1 FIG. 1 is a schematic diagram of an application of a touch panel device according to an embodiment of the present invention. Figure 1As shown, the touchpad device 1 can be applied to computer products. The user can operate the touchpad device 1 by sliding or pressing the finger to control the displacement of the cursor or generate a corresponding control signal. For example, in this embodiment, the touchpad device 1 is applied to a notebook computer N, but this is not limited. In other embodiments, the touchpad device 1 can also be applied to other portable computers (such as tablet computers). Alternatively, the touchpad device 1 can also be an independent device and externally connected to the portable computer, which is not limited in this embodiment.

[0042] Figure 2 is an exploded perspective view of an embodiment of a touch panel device of the present invention, Figure 3 FIG. 2 is a cross-sectional view of an embodiment of a touch panel device of the present invention. Figure 2 and Figure 3 As shown, the touch panel device 1 includes a substrate 10, a touch panel 20 and a light-cured adhesive film 35. The substrate 10 can be a hard plate made of metal (such as iron, aluminum or alloy, etc.) or plastic. In this embodiment, the substrate 10 is located at the bottom layer of the touch panel device 1 and has a top surface 11, and the touch panel 20 is disposed above the top surface 11.

[0043] like Figure 2 and Figure 3 As shown, the touch panel 20 includes a touch pad 21 and a circuit board 25 stacked on each other, and the circuit board 25 is located between the substrate 10 and the touch pad 21. The touch pad 21 is used for the user's finger to perform touch operations. For example, the user's finger can slide or press on the touch pad 21, and the circuit board 25 can generate functions such as scrolling, zooming in, zooming out, or opening a window in response to the user's finger sliding or gesture on the touch pad 21. Alternatively, the circuit board 25 can generate functions such as selection or displaying a menu in response to the user's finger pressing, clicking, or double-clicking on the touch pad 21.

[0044] In some embodiments, the touch panel 21 may be a panel made of glass or mylar.

[0045] like Figure 2 and Figure 3 As shown, the circuit board 25 has a bottom surface 26, and the bottom surface 26 faces the top surface 11 of the substrate 10. In this embodiment, a press trigger switch 203 is provided between the bottom surface 26 of the circuit board 25 of the touch panel 20 and the substrate 10. For example, the press trigger switch 203 can be a button switch or a micro switch. In addition, the press trigger switch 203 can make the touch panel 20 be located at a height position and keep a distance from the substrate 10. Thereby, when the touch panel 20 is pressed and descends relative to the substrate 10, the press trigger switch 203 can be pressed to generate a signal, and when the touch panel 20 is released, it can rise and return to the above height position through the elastic force accumulated by the press trigger switch 203.

[0046] In some embodiments, the circuit board 25 may be a general circuit board (Printed Circuit Board, PCB), a flexible circuit board (Flexible Print Circuit Board, FPCB) or a rigid-flex PCB.

[0047] like Figure 2 and Figure 3 As shown, the touch panel 20 includes a pivot side 201, which is pivotally disposed on one side of the substrate 10, so that the touch panel 20 can swing down relative to the substrate 10 when pressed. In this embodiment, a long block 101 is fixed on one side of the substrate 10 close to the pivot side 201, and the pivot side 201 of the touch panel 20 can be assembled and fixed on the long block 101 by adhesion, snapping or locking, so that the touch panel 20 can swing relative to the substrate 10 with the pivot side 201 as a fulcrum. In addition, in this embodiment, the touch panel 20 includes a swing side 202 relative to the pivot side 201, and a press trigger switch 203 is disposed between the swing side 202 and the substrate 10.

[0048] In some embodiments, the strip block 101 may be a block made of soft materials such as sponge, rubber or silicone, so that the strip block 101 can absorb the deformation of the touch panel 20 or the substrate 10 when it is in motion and have a better pressing feel. Alternatively, the strip block 101 may also be a hard block made of plastic (such as polycarbonate or polyethylene terephthalate) or metal material to enhance the rigidity of the substrate 10 and the combination of the touch panel 20 and the substrate 10. In addition, the strip block 101 made of metal material can also be fixed to the touch panel 20 or the substrate 10 by welding or riveting.

[0049] In some embodiments, the pivot side 201 of the touch panel 20 may be pivoted to one side of the substrate 10 in other ways, and the press trigger switch 203 may be disposed at other positions between the pivot side 201 and the swing side 202 .

[0050] like Figure 2 and Figure 3As shown, the photocurable adhesive film 35 is then fixed between the touch panel 21 and the circuit board 25, and the photocurable adhesive film 35 is in a cured state, wherein the photocurable adhesive film 35 is a film with a specific shape, for example, the shape of the photocurable adhesive film 35 can be the same as the shape of the touch panel 21, and the photocurable adhesive film 35 is in an uncured state and reacts to form a cured state after being irradiated with specific light. Thus, the cured photocurable adhesive film 35 can provide better rigidity to avoid problems such as shaking, bending or excessive idle travel when the corners of the touch panel 20 are pressed. In addition, compared to the conventional use of liquid adhesive, the touch panel device 1 of the embodiment of the present invention does not require the use of an additional glue dispenser during the manufacturing process, and there will be no glue overflow. The thickness of the photocurable adhesive film 35 is thinner (for example, the thickness T of the photocurable adhesive film 35 can be between 0.03 mm and 0.05 mm), the curing speed is fast, and the process does not generate bubbles, so that the touch panel 21 and the circuit board 25 have better flatness after being combined, are thinner, and provide a better pressing feel, which is further described below.

[0051] Figure 4 is a manufacturing flow chart of an embodiment of a touch panel device of the present invention, Figure 5 To continue Figure 4 Manufacturing flow chart, Figure 6 To continue Figure 5 Manufacturing flow chart, Figure 7 The following is a flowchart of a method for manufacturing a touch panel device according to an embodiment of the present invention. The hardware structure mentioned below can refer to Figures 2 to 6 The present invention is disclosed by way of example only, but is not intended to be limited thereto.

[0052] like Figure 7 As shown, in step S01, a light-cured sheet 30 is first provided. Figure 4 As shown, the photocurable sheet 30 includes a first release sheet 31, a second release sheet 32 ​​and a photocurable adhesive film 35 which are stacked on each other. The photocurable adhesive film 35 is in an uncured state and includes a first surface 351 and a second surface 352 opposite to each other. The first release sheet 31 is attached to the first surface 351, and the second release sheet 32 ​​is attached to the second surface 352.

[0053] To be specific, the photocurable adhesive film 35 is a film with a fixed shape (here, a rectangle), and contains a photoinitiator or a photosensitizer in the photocurable adhesive film 35, wherein the photoinitiator or the photosensitizer can react when exposed to specific light (e.g., ultraviolet light, infrared light, or visible light), so that the photocurable adhesive film 35 is cured into a solid state as a whole, and the uncured state refers to the state in which the photoinitiator or the photosensitizer of the photocurable adhesive film 35 has not been exposed to specific light and has not reacted and cured. For example, the photocurable adhesive film 35 can be an ultraviolet light-curable adhesive film, and when the photocurable adhesive film 35 is exposed to ultraviolet light, it can react from the uncured state to the cured state. In other embodiments, the photocurable adhesive film 35 can also be an infrared light-curable adhesive film or a visible light-curable adhesive film, which is not limited thereto.

[0054] For example Figure 4 As shown, in the embodiment of the present invention, the first release sheet 31 is attached to the first surface 351 of the photocurable adhesive film 35 and the second release sheet 32 ​​is attached to the second surface 352 of the photocurable adhesive film 35, so that the photocurable sheet 30 as a whole has stronger rigidity, which is convenient for moving or taking the photocurable sheet 30 for assembly in the manufacturing process, and prevents the photocurable adhesive film 35 from contacting the outside world and preventing the photocurable adhesive film 35 from being attached with dust or debris. In some embodiments, the first release sheet 31 and the second release sheet 32 ​​can be transparent sheets or opaque sheets, depending on the operation process, which will be described in detail later.

[0055] like Figure 7 As shown, after step S01, step S02 is performed: removing the first release sheet 31 and attaching the first surface 351 of the photocurable adhesive film 35 to the surface of the touch panel 21. For example, please refer to Figure 4 As shown, in step S02, the first release sheet 31 can be torn off the first surface 351 of the photocurable adhesive film 35 by a film stripping machine or a film tearing machine, and then the first surface 351 of the photocurable adhesive film 35 can be attached to the surface of the touch panel 21 by a processing machine (such as Figure 5 As shown in FIG. 1 ), the photocurable adhesive film 35 and the touch panel 21 are bonded to each other. In addition, in step S02, since the photocurable sheet 30 as a whole has a certain rigidity and the photocurable adhesive film 35 is a thin film with a specific shape, the first surface 351 of the photocurable adhesive film 35 of the photocurable sheet 30 can be quickly attached to the surface of the touch panel 21. Therefore, compared with the conventional method of applying liquid adhesive through a glue dispenser, the embodiment of the present invention can greatly simplify the process and reduce the cost, and there will be no glue overflow.

[0056] like Figure 7 As shown, after step S02, step S03 is performed: the light emitting element 40 emits light to irradiate the light-curing adhesive film 35 and remove the second release film 32. Figure 5As shown, before step S03 starts, the photocurable adhesive film 35 is in the uncured state mentioned above. In step S03, light can be emitted through the light-emitting component 40 to evenly irradiate the photocurable adhesive film 35. For example, when the photocurable adhesive film 35 is a UV-curable adhesive film, the light emitted by the light-emitting component 40 is UV light, so that the photoinitiator or photosensitizer in the photocurable adhesive film 35 is irradiated by the light and starts to react.

[0057] like Figure 7 As shown, after step S03, step S04 is performed: the surface of the circuit board 25 is attached to the second surface 352 of the light curing adhesive film 35 by the machine 50. Step S03 and step S04 can be combined in at least the following two ways, please refer to Figure 5 As shown, the first method is to first remove the second release sheet 32 ​​from the second surface 352 of the photocurable adhesive film 35 by a film stripping machine or a film tearing machine in step S03, and then use the light emitting member 40 to directly irradiate the photocurable adhesive film 35 with light, and then Figure 6 As shown, before the photocurable adhesive film 35 reacts to become a cured state, the surface of the circuit board 25 is quickly attached to the second surface 352 of the photocurable adhesive film 35 through the machine 50 (e.g., a robot arm) (i.e., the above-mentioned step S04). The advantage of this method is that after the light emitting element 40 emits light to irradiate the photocurable adhesive film 35, the circuit board 25 can be directly attached to the second surface 352 of the photocurable adhesive film 35, without waiting for the time to remove the second release sheet 32, and it is easier to complete the attachment of the circuit board 25 before the photocurable adhesive film 35 is cured. In this way, the second release sheet 32 ​​is not limited to a transparent sheet or an opaque sheet.

[0058] In the above, another method is that in step S03, the light emitting element 40 is first used to illuminate the second release sheet 32 ​​and the photocurable adhesive film 35, so that the light passes through the second release sheet 32 ​​and is transmitted to the photocurable adhesive film 35, and then the second release sheet 32 ​​is removed from the second surface 352 of the photocurable adhesive film 35 by a film stripping machine or a film tearing machine, and then before the photocurable adhesive film 35 reacts to become a cured state, the surface of the circuit board 25 is quickly attached to the second surface 352 of the photocurable adhesive film 35 by the machine 50 (i.e., the above step S04). The advantage of this method is that in the process of the light emitting element 40 emitting light to illuminate the photocurable adhesive film 35, the second release sheet 32 ​​can still be used to prevent the photocurable adhesive film 35 from contacting with the outside world and preventing dust or debris from being attached. In addition, in this method, the second release sheet 32 ​​needs to be a transparent sheet to allow light to pass through smoothly.

[0059] In the above step S04, after the machine 50 attaches the surface of the circuit board 25 to the second surface 352 of the photocurable adhesive film 35, the machine 50 can further apply pressure to the circuit board 25 so that the circuit board 25 is pressed against the second surface 352 of the photocurable adhesive film 35 to achieve a better bonding effect.

[0060] For example Figure 7 As shown, after step S04, step S05 is performed: the photocurable adhesive film 35 reacts from an uncured state to a cured state. For example, after being irradiated with light, the photocurable adhesive film 35 can be left to stand for 1 to 3 seconds to automatically react from the uncured state to a cured state, so that the touch panel 21 and the circuit board 25 are combined and fixed to each other to form the above-mentioned touch panel 20. In this way, compared with the conventional method of applying liquid adhesive through a dispensing machine and then baking, the photocurable adhesive film 35 of the embodiment of the present invention has a fast curing speed (curing can be completed within 3 seconds) and no bubbles are generated during the process, so that the flatness of the touch panel 21 and the circuit board 25 after being combined is good to provide a better pressing feel. In addition, the photocurable adhesive film 35 cured into a solid state can provide better rigidity to avoid problems such as shaking, bending or excessive idle travel when the corners of the touch panel 20 are pressed.

[0061] In some embodiments, the above-mentioned photocurable adhesive film 35 can be an ultraviolet light curable adhesive film, and the light emitted by the light emitting element 40 is ultraviolet light, and the ultraviolet light is a long-wave ultraviolet light with a wavelength range between 320nm and 400nm, wherein the heat carried by the long-wave ultraviolet light is low, and therefore, it can avoid damaging the surface of human skin during the process and improve the process safety. In addition, the long-wave ultraviolet light has strong penetrating power, which can increase the curing strength of the photocurable adhesive film 35 after curing, so that the combination of the touch panel 21 and the circuit board 25 is more firm, and the rigidity of the touch panel 20 is improved to further avoid the problems of shaking, bending or excessive idle travel when the corners of the touch panel 20 are pressed.

[0062] For example Figure 7 As shown, after step S05, step S06 is performed: the touch panel 21 and the circuit board 25 are mounted on the substrate 10. Figure 3 As shown, the touch pad 21 and the circuit board 25 can be combined with the photocurable adhesive film 35 to form the touch panel 20. The pivot side 201 of the touch panel 20 can be assembled on the long block 101 of the fixed substrate 10 by bonding, snapping or locking, so that the touch panel 20 can be swingably installed above the substrate 10.

[0063] Figure 8 FIG. 1 is a flowchart of another embodiment of the method for manufacturing a touch panel device of the present invention. Figure 8 As shown, this embodiment is different from the above Figure 7The difference between the embodiment of the present invention is that after step S01, step S02' is performed: the first release sheet 31 is removed and the first surface 351 of the photocurable adhesive film 35 is attached to the surface of the circuit board 25. After step S03, step S04 is performed: the surface of the touch panel 21 is attached to the second surface 352 of the photocurable adhesive film 35 by the tool 50. In other words, the manufacturing method of the touch panel device 1 of the present embodiment is to first attach the first surface 351 of the photocurable adhesive film 35 to the surface of the circuit board 25, and then attach the surface of the touch panel 21 to the second surface 352 of the photocurable adhesive film 35 after the photocurable adhesive film 35 is irradiated with light.

[0064] In summary, according to the touch panel device and the manufacturing method thereof of the embodiment of the present invention, the touch panel and the circuit board are fixed via a photocurable adhesive film. Compared with the conventional liquid adhesive, the touch panel device of the embodiment of the present invention does not need to use an additional glue dispenser during the manufacturing process and will not overflow the glue. In addition, the photocurable adhesive film is thin, the curing speed is fast, and the process does not generate bubbles, so that the flatness of the touch panel and the circuit board after being combined is good and thinner, and the cured photocurable adhesive film can provide better rigidity to avoid problems such as shaking, bending or excessive idle travel when the corners of the touch panel are pressed.

[0065] Although the technical contents of the present invention have been disclosed as above in the preferred embodiments, they are not used to limit the present invention. Any slight changes and modifications made by anyone familiar with this technology without departing from the spirit of the present invention should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be based on the scope defined by the attached claims.

Claims

1. A method for manufacturing a touch panel device, It is characterized in that include: (a) providing a photocurable sheet, wherein the photocurable sheet comprises a first release sheet, a second release sheet and a photocurable adhesive film which are stacked one on another, the photocurable adhesive film being in an uncured state and comprising a first surface and a second surface opposite to each other, the first release sheet being attached to the first surface, and the second release sheet being attached to the second surface; (b) removing the first release sheet and attaching the first surface of the photocurable adhesive film to a surface of a touch panel; (c) emitting a light from a light emitting element to irradiate the light-curable adhesive film and remove the second release sheet; (d) attaching a surface of a circuit board to the second surface of the photocurable adhesive film using a tool; and (e) the photocurable adhesive film reacts from the uncured state to a cured state; Wherein, the light is emitted by the light emitting component to irradiate the light-curing adhesive film only after the second release sheet in the step (c) is removed.

2. A method for manufacturing a touch panel device, It is characterized in that include: (a) providing a photocurable sheet, wherein the photocurable sheet comprises a first release sheet, a second release sheet and a photocurable adhesive film which are stacked one on another, the photocurable adhesive film being in an uncured state and comprising a first surface and a second surface opposite to each other, the first release sheet being attached to the first surface, and the second release sheet being attached to the second surface; (b) removing the first release sheet and attaching the first surface of the photocurable adhesive film to a surface of a circuit board; (c) emitting a light from a light emitting element to irradiate the light-curable adhesive film and remove the second release sheet; (d) attaching a surface of a touch panel to the second surface of the photocurable adhesive film using a tool; and (e) the photocurable adhesive film reacts from the uncured state to a cured state; Wherein, the light is emitted by the light emitting component to irradiate the light-curing adhesive film only after the second release sheet in the step (c) is removed.

3. The method for manufacturing a touch panel device according to claim 1 or 2, It is characterized in that The second release sheet in step (c) is a transparent release sheet, and the second release sheet is removed only after the light emitting component emits the light to illuminate the second release sheet and the light-curing adhesive film.

4. The method for manufacturing a touch panel device according to claim 1 or 2, It is characterized in that The light emitted by the light emitting element in step (c) is ultraviolet light, and the wavelength of the light is between 320nm and 400nm.

5. The method for manufacturing a touch panel device according to claim 1 or 2, It is characterized in that The step (e) further includes: installing the touch panel and the circuit board on a substrate.

6. A touch panel device manufactured by the manufacturing method according to any one of claims 1 to 5, It is characterized in that include: a substrate including a top surface; A touch panel is disposed above the top surface of the substrate, the touch panel comprising a touch plate and a circuit board stacked on each other; as well as A light-curing adhesive film is fixed between the touch panel and the circuit board, and the light-curing adhesive film is in a cured state.

7. The touch panel device according to claim 6, It is characterized in that The touch panel includes a pivot side, and the pivot side is pivotally disposed on one side of the substrate.

8. The touch panel device according to claim 7, It is characterized in that The touch panel includes a swing side relative to the pivot side, and a press trigger switch is arranged between the swing side and the substrate.

9. The touch panel device according to claim 6, It is characterized in that The thickness of the light-cured adhesive film is between 0.03 mm and 0.05 mm.

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