Device and method for peeling off thermal stripping film on wafer surface

Abstract

The present invention relates to the field of chip manufacturing technology, and in particular to a device and method for peeling off a thermal peeling film on a wafer surface, comprising a frame, wherein a waste collecting roller and a tape fixing roller are respectively arranged at the upper end of the frame, wherein the waste collecting roller and the tape fixing roller are arranged at intervals, and a hot-melt film-tearing tape is sleeved on the tape fixing roller; the frame is also respectively provided with a tensioning assembly, a film-tearing assembly and a hot-scalding assembly; the tensioning assembly comprises a first tensioning roller arranged below the waste collecting roller, and a second tensioning roller and a third tensioning roller arranged below the tape fixing roller, wherein the second tensioning roller and the third tensioning roller are arranged at intervals up and down. The present invention adopts a servo linear module to tear off the film, and the module moving speed is adjustable and uniform, and the force is uniform and stable, thereby ensuring the quality of the wafer film-tearing process, realizing automatic control, and improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to a device and method for peeling off a thermal stripping film on a wafer surface. Background Art

[0002] The manufacturing process of IC chips includes various process steps. Among them, the bonding process of the wafer before baking requires a layer of thermal release film to be covered on one side of the wafer chip to ensure the quality of the chip. In the subsequent debonding process, the thermal release film needs to be torn off from the wafer surface before the subsequent process flow can be carried out.

[0003] At present, the domestic method of peeling off the thermal peeling film is to manually hold a utility knife and pick up the thermal peeling film from the notch position. Then the film is held by hand and peeled off. During the peeling process, the wafer needs to be pressed down by the other hand. If the hand is not pressed firmly, the wafer is often pulled away and dropped, resulting in wafer damage. At the same time, it is difficult for the human hand to maintain consistency. If the hand is too strong, it may damage the wafer. Therefore, it is very important to use an automated machine to peel off.

[0004] Therefore, the present application provides a device and method for peeling off the thermal stripping film on the surface of a wafer to solve the above-mentioned technical problems. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings existing in the prior art, and to propose a device and method for tearing off the thermal peeling film on the surface of a wafer. A servo linear module is used to tear off the film. The module has an adjustable and uniform moving speed, and the force is uniform and stable, ensuring the quality of the wafer tearing process, realizing automatic control, and improving production efficiency.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A device for peeling off a thermal peeling film on a wafer surface comprises a frame, wherein a waste collecting roller and a tape fixing roller are respectively arranged at the upper end of the frame, wherein the waste collecting roller and the tape fixing roller are arranged at intervals, and a hot-melt film peeling tape is sleeved on the tape fixing roller;

[0008] The frame is also provided with a tensioning assembly, a film tearing assembly and a hot stamping assembly respectively;

[0009] The tensioning assembly comprises a first tensioning roller disposed below the waste collecting roller, and a second tensioning roller and a third tensioning roller disposed below the adhesive tape fixing roller, wherein the second tensioning roller and the third tensioning roller are disposed at intervals in the upper and lower parts;

[0010] The film-tearing assembly comprises a film-tearing roller and a film-tearing roller moving module connected to the film-tearing roller, wherein the film-tearing roller is arranged below the first tensioning roller, the film-tearing roller is arranged on one side of the frame, and the film-tearing roller moving module is arranged on the other side of the frame;

[0011] The hot stamping assembly includes a hot stamping mechanism and a hot stamping roller moving module connected to the hot stamping mechanism, wherein the hot stamping mechanism is arranged opposite to the film tearing roller, and the hot stamping mechanism is arranged on one side of the frame, and the hot stamping roller moving module is arranged on the other side of the frame;

[0012] A heating adsorption fixture is provided at the lower end of the frame, and a wafer is horizontally placed on the heating adsorption fixture;

[0013] The hot-melt film-tearing tape is sequentially wound around a waste collecting roller, a first tensioning roller, a film-tearing roller, a third tensioning roller and a second tensioning roller and then connected to a tape fixing roller; and the hot-melt film-tearing tape is arranged on the surface of the wafer.

[0014] The present invention also provides a method for using a device for peeling off a thermal stripping film on a wafer surface, comprising the following steps:

[0015] Step 1, Start: Initialize the peeling device, move the hot rolling roller moving module to the standby position, move the film tearing roller moving module to the standby position, the system automatically detects the temperature of the heating adsorption fixture, whether the temperature of the hot rolling mechanism meets the standard, if not, continue to heat until it meets the standard, the initialization is completed, and wait for loading;

[0016] Step 2: Loading: Place the wafer on the heating adsorption fixture by manual loading or other methods, open the vacuum of the heating adsorption fixture to adsorb the wafer;

[0017] Step 3: Move the film tearing roller moving module to the tearing starting position;

[0018] Step 4, hot stamping: Move the hot stamping roller moving module to the wafer tearing position, the hot stamping mechanism descends to contact the wafer surface, waits for 15 seconds of heating time, so that the front end of the hot melt tear film tape is firmly attached to the thermal peeling film on the wafer surface, rises and moves to the tail of the wafer, the hot stamping mechanism descends again to contact the wafer surface, waits for 10 seconds of heating time, so that the rear end of the hot melt tear film tape is firmly attached to the thermal peeling film on the wafer surface, the hot stamping mechanism rises, and the hot stamping roller moving module moves to the standby position;

[0019] Step 5, film tearing: the film tearing roller module starts to move toward the wafer, and the thermal peeling film on the surface of the wafer is torn off by the film tearing roller and the hot melt film tearing tape. After the tearing is completed, the film tearing roller module moves to the standby position;

[0020] Step 6: Waste material rewinding: The waste material rewinding roller starts to rotate in reverse time and stops rotating after the film is rewound;

[0021] Step 7: Unloading: manually or robotically remove the wafer;

[0022] Step 8: Repeat steps 2 to 7 until the film peeling of a batch of wafers is completed.

[0023] By adopting the above technical scheme: the hot-melt film-tearing tape is sequentially wound through the waste collection roller, the first tensioning roller, the film-tearing roller, the third tensioning roller and the second tensioning roller, and then connected to the tape fixing roller, and the hot-melt film-tearing tape is placed on the wafer surface on the heated adsorption fixture, when the film-tearing roller moving module moves to the tearing start position, the hot-melt film-tearing tape just falls in the diameter direction of the wafer, and then the front and rear ends of the hot-melt film-tearing tape are firmly adhered to the film on the wafer through the hot ironing mechanism, and then the film is torn off by the film-tearing roller under the movement of the film-tearing roller moving module.

[0024] The present invention has the following beneficial effects:

[0025] The present invention adopts a vacuum adsorption fixture, the wafer is firmly adsorbed, the wafer is evenly stressed, and damage to the wafer due to loose pressing or uneven force is effectively avoided.

[0026] The present invention adopts hot-melt adhesive tape to tear the film, thereby avoiding the risk of scratching the wafer when using a sharp tool to pick up the film during manual tearing.

[0027] The present invention adopts a servo linear module to tear off the film. The module moving speed is adjustable and uniform, and the force is uniform and stable, which ensures the quality of the wafer film tearing process, realizes automatic control, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 for Figure 1 Another perspective structural diagram of;

[0030] Figure 3 It is a schematic diagram of the back structure of the present invention.

[0031] In the figure: 1 frame, 2 waste collecting roller, 3 first tensioning roller, 4 film tearing roller, 5 heating adsorption fixture, 6 wafer, 7 hot stamping mechanism, 8 second tensioning roller, 9 third tensioning roller, 10 hot melt film tearing tape, 11 tape fixing roller, 12 film tearing roller moving module, 13 hot stamping roller moving module. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0033] Reference Figure 1-Figure 3A device for peeling off a thermal peeling film on a wafer surface comprises a frame 1, wherein the upper end of the frame 1 is provided with a waste collecting roller 2 and a tape fixing roller 11, the waste collecting roller 2 and the tape fixing roller 11 are arranged at intervals, and a hot-melt film peeling tape 10 is sleeved on the tape fixing roller 11.

[0034] The frame 1 is also provided with a tensioning assembly, a film tearing assembly and a hot stamping assembly.

[0035] Specifically, the tensioning assembly includes a first tensioning roller 3 disposed below the waste collecting roller 2, and a second tensioning roller 8 and a third tensioning roller 9 disposed below the tape fixing roller 11, wherein the second tensioning roller 8 and the third tensioning roller 9 are arranged at intervals from top to bottom. In actual application, during the film tearing process, the first tensioning roller 3, the second tensioning roller 8 and the third tensioning roller 9 are used to tension the hot-melt film tearing tape 10.

[0036] Specifically, the film-tearing assembly includes a film-tearing roller 4 and a film-tearing roller moving module 12 connected to the film-tearing roller 4, wherein the film-tearing roller 4 is arranged below the first tensioning roller 3, the film-tearing roller 4 is arranged on one side of the frame 1, and the film-tearing roller moving module 12 is arranged on the other side of the frame 1. In actual application, the film-tearing roller moving module 12 drives the film-tearing roller 4 to perform a horizontal translation action on the heating adsorption fixture 5 described below, thereby realizing the film-tearing action on the wafer 6.

[0037] Specifically, the hot stamping assembly includes a hot stamping mechanism 7 and a hot stamping roller moving module 13 connected to the hot stamping mechanism 7. The hot stamping mechanism 7 is arranged opposite to the film tearing roller 4, and the hot stamping mechanism 7 is arranged on one side of the frame 1, and the hot stamping roller moving module 13 is arranged on the other side of the frame 1. In actual application, the hot stamping roller moving module 13 drives the hot stamping mechanism 7 to perform horizontal translation and up and down movements on the heating adsorption fixture 5 described below, so that the hot stamping mechanism 7 heats and firmly adheres the hot melt film tearing tape 10 to the film on the surface of the wafer 6, thereby preparing for the subsequent film tearing.

[0038] In addition, the film-tearing roller moving module 12 and the hot rolling roller moving module 13 both use servo linear modules to tear off the film, and the module moving speed is adjustable and uniform, and the force is uniform and stable, ensuring the quality of the wafer film-tearing process.

[0039] Among them, a heating adsorption fixture 5 is provided at the lower end of the frame 1, and a wafer 6 is placed horizontally on the heating adsorption fixture 5; here, the heating adsorption fixture 5 adopts a vacuum adsorption fixture, the wafer is firmly adsorbed, and the wafer is evenly stressed, which effectively avoids damage to the wafer due to loose pressing or uneven force.

[0040] Among them, the hot melt film tearing tape 10 is wound around the waste collection roller 2, the first tensioning roller 3, the film tearing roller 4, the third tensioning roller 9 and the second tensioning roller 8 in sequence and then connected to the tape fixing roller 11; and the hot melt film tearing tape 10 is arranged on the surface of the wafer 6.

[0041] In this embodiment, the hot melt film tearing tape 10 is wound through the waste collecting roller 2, the first tensioning roller 3, the film tearing roller 4, the third tensioning roller 9 and the second tensioning roller 8 in sequence and then connected to the tape fixing roller 11, and the hot melt film tearing tape 10 is placed on the surface of the wafer 6 on the heating adsorption fixture 5. When the film tearing roller moving module 12 moves to the tearing position, the hot melt film tearing tape 10 just falls to the diameter direction of the wafer 6, and then the front and rear ends of the hot melt film tearing tape 10 are firmly adhered to the film on the wafer 6 through the hot ironing mechanism 7, and then the film is torn off by the film tearing roller 4 under the movement of the film tearing roller moving module 12. The hot melt tape is used here to tear the film, avoiding the risk of scratching the wafer when using a sharp tool to pick up the film during manual tearing.

[0042] A method for using a device for peeling off a thermal stripping film on a wafer surface comprises the following steps:

[0043] Step 1, start: the peeling device is initialized, the hot rolling roller moving module 13 is moved to the standby position, the film tearing roller moving module 12 is moved to the standby position, the system automatically detects the temperature of the heating adsorption fixture 5, whether the temperature of the hot rolling mechanism 7 meets the standard, if not, continue to heat until it meets the standard, the initialization is completed, and wait for loading;

[0044] Step 2: Loading: Place the wafer 6 on the heating adsorption fixture 5 by manual loading or other methods, open the heating adsorption fixture 5 to vacuum, and adsorb the wafer 6;

[0045] Step 3: Move the module to the tearing start position: Move the film tearing roller moving module 12 to the tearing start position;

[0046] Step 4, hot stamping: Move the hot stamping roller moving module 13 to the wafer tearing position, the hot stamping mechanism 7 descends to contact the surface of the wafer 6, waits for 15 seconds of heating time, so that the front end of the hot melt tear film tape 10 is firmly attached to the thermal peeling film on the surface of the wafer 6, rises and moves to the tail of the wafer, the hot stamping mechanism 7 descends again to contact the surface of the wafer 6, waits for 10 seconds of heating time, so that the rear end of the hot melt tear film tape 10 is firmly attached to the thermal peeling film on the surface of the wafer 6, the hot stamping mechanism 7 rises, and the hot stamping roller moving module 13 moves to the standby position;

[0047] Step 5, film peeling: the film peeling roller module 12 starts to move toward the wafer 6, and the film peeling roller 4 and the hot melt film peeling tape 10 are used to peel off the thermal peeling film on the surface of the wafer 6. After the peeling is completed, the film peeling roller module 12 moves to the standby position;

[0048] Step 6, waste material winding: the waste material collecting roller 2 starts to rotate in reverse time and stops rotating after the film winding is completed;

[0049] Step 7: Unloading: manually or mechanically taking away the wafer 6;

[0050] Step 8: Repeat steps 2 to 7 until the film peeling of a batch of wafers is completed.

[0051] To sum up, the present invention adopts a vacuum adsorption fixture, the wafer is firmly adsorbed, and the wafer is evenly stressed, which effectively avoids damage to the wafer due to loose pressing or uneven force; hot melt tape is used to tear the film, which avoids the risk of scratching the wafer when using a sharp tool to pick up the film during manual tearing; a servo linear module is used to tear the film, the module movement speed is adjustable and uniform, and the force is uniform and stable, ensuring the quality of the wafer tearing process, realizing automatic control, and improving production efficiency.

[0052] In addition, it should be noted that the film tearing roller moving module, hot stamping roller moving module, heating adsorption fixture, hot stamping mechanism, etc. involved in the present invention are essentially no different from the prior art, so their structure and working principle are not elaborated in detail here.

[0053] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A device for peeling off a thermal stripping film on a wafer surface, comprising a frame (1), characterized in that: The upper end of the frame (1) is provided with a waste collecting roller (2) and a tape fixing roller (11), respectively. The waste collecting roller (2) and the tape fixing roller (11) are arranged at intervals, and a hot-melt film-tearing tape (10) is sleeved on the tape fixing roller (11); The frame (1) is also provided with a tensioning assembly, a film tearing assembly and a hot stamping assembly; The tensioning assembly comprises a first tensioning roller (3) arranged below the waste collecting roller (2), and a second tensioning roller (8) and a third tensioning roller (9) arranged below the adhesive tape fixing roller (11), wherein the second tensioning roller (8) and the third tensioning roller (9) are arranged at an interval up and down; The film-tearing assembly comprises a film-tearing roller (4) and a film-tearing roller moving module (12) connected to the film-tearing roller (4), the film-tearing roller (4) being arranged below the first tensioning roller (3), the film-tearing roller (4) being arranged on one side of the frame (1), and the film-tearing roller moving module (12) being arranged on the other side of the frame (1); The hot stamping assembly comprises a hot stamping mechanism (7) and a hot stamping roller movable module (13) connected to the hot stamping mechanism (7); the hot stamping mechanism (7) and the film-tearing roller (4) are arranged opposite to each other, and the hot stamping mechanism (7) is arranged on one side of the frame (1), and the hot stamping roller movable module (13) is arranged on the other side of the frame (1); A heating adsorption fixture (5) is provided at the lower end of the frame (1), and a wafer (6) is horizontally placed on the heating adsorption fixture (5); The hot-melt film-tearing tape (10) is sequentially wound around a waste collecting roller (2), a first tensioning roller (3), a film-tearing roller (4), a third tensioning roller (9) and a second tensioning roller (8) and then connected to a tape fixing roller (11); and the hot-melt film-tearing tape (10) is arranged on the surface of the wafer (6); The hot-ironing roller moving module (13) drives the hot-ironing mechanism (7) to perform horizontal translation and up-and-down movements on the heating adsorption fixture (5), so that the hot-ironing mechanism (7) heats and firmly adheres the front and rear ends of the hot-melt tearing tape (10) to the film on the surface of the wafer (6).

2. The method for using the device for peeling off the thermal stripping film on the surface of a wafer according to claim 1, characterized in that: The following steps are involved: Step 1, start: the peeling device is initialized, the hot rolling roller moving module (13) is moved to the standby position, the film tearing roller moving module (12) is moved to the standby position, the system automatically detects the temperature of the heating adsorption fixture (5), whether the temperature of the hot rolling mechanism (7) meets the standard, and if it does not meet the standard, continues to heat until it meets the standard, and then the initialization is completed and waits for loading; Step 2: Loading: manually placing the wafer (6) on the heating adsorption fixture (5), opening the vacuum of the heating adsorption fixture (5) to adsorb the wafer (6); Step 3: Move the module to the tearing start position: Move the film tearing roller moving module (12) to the tearing start position; Step 4, hot stamping: the hot stamping roller moving module (13) is moved to the wafer tearing position, the hot stamping mechanism (7) is lowered to contact the surface of the wafer (6), and after waiting for 15 seconds of heating time, the front end of the hot melt tear film tape (10) is firmly adhered to the thermal peeling film on the surface of the wafer (6), and then it is raised and moved to the tail of the wafer. The hot stamping mechanism (7) is lowered again to contact the surface of the wafer (6), and after waiting for 10 seconds of heating time, the rear end of the hot melt tear film tape (10) is firmly adhered to the thermal peeling film on the surface of the wafer (6), and the hot stamping mechanism (7) is raised, and the hot stamping roller moving module (13) is moved to the standby position; Step 5, film peeling: the film peeling roller moving module (12) starts to move towards the wafer (6), and the film peeling roller (4) and the hot melt film peeling tape (10) are used to peel off the thermal peeling film on the surface of the wafer (6). After the peeling is completed, the film peeling roller moving module (12) moves to a standby position; Step 6, waste film rewinding: the waste film rewinding roller (2) starts to rotate in reverse time and stops rotating after the film rewinding is completed; Step 7: Unloading: manually or robotically remove the wafer (6); Step 8: Repeat steps 2 to 7 until the film peeling of a batch of wafers is completed.

Images