Hot patch material and substrate bond strength using a specimen preparation device and method

Abstract

The application relates to the field of material testing, and relates to a sample preparation device and method for hot-state repair material and substrate bonding strength. The sample preparation device for hot-state repair material and substrate bonding strength comprises a heating furnace, a material bin rotatably arranged in the heating furnace, a feeding hopper coaxial with a rotation axis of the material bin, at least one sample cylinder and a rotating motor for driving the material bin to rotate, one end of the feeding hopper is communicated with a top of the material bin, the other end penetrates out of the heating furnace, and the outer wall of the material bin is communicated with at least one connecting pipe; the sample cylinder is configured to be detachably connected to the connecting pipe, so that the sample cylinder and the connecting pipe are communicated. The sample preparation device and method for hot-state repair material and substrate bonding strength provided by the application can prepare a sample in which hot-state repair material and a substrate are fully combined, so that the strength of the hot-state repair material and the substrate bonding material can be accurately tested, and the device has the advantages of simple operation and high preparation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of material testing, in particular to a sample preparation device and method for testing the bonding strength between hot repair material and matrix. BACKGROUND

[0002] Hot repair material is one of the important categories of amorphous refractory material. It is generally made into powder and melts and spreads on the surface of the original lining at high temperature to be integrated with the original lining. After high-temperature sintering, it has good high-temperature volume stability and other properties, and can form a dense lining. It is an online repair material commonly used in various high-temperature furnaces. When local damage occurs during the operation of the high-temperature furnace, hot repair material can be used for repair without cooling and quickly put into production, ensuring the normal operation of the high-temperature furnace, improving the work efficiency of the high-temperature furnace, and prolonging the service life.

[0003] Hot repair material is used to repair the original locally damaged refractory matrix and form a whole with the original matrix material. Therefore, not only high requirements are put forward for the performance of hot repair material itself, but also good bonding strength between hot repair material and matrix is required. At present, in the standard system of refractory material test methods, only two material bonding strength test methods are provided for refractory mortar standards: the refractory mortar is prepared to the consistency for construction, then is applied on the bonding surface of two refractory bricks, and is built into a 2mm brick joint, and after drying and / or baking, the bonding and bending strength test is carried out; and for metal materials, two material welding strength test methods are provided: the materials are welded together, and then the tensile test is carried out. The above methods are not suitable for the molding of the test for the bonding strength test between hot repair material and matrix material. It can be seen that the bonding strength test method for hot repair material and matrix, especially the molding method of the sample, is less studied, and it is difficult to meet the growing use demand of hot repair material. SUMMARY

[0004] The purpose of the present application is to provide a sample preparation device and method for testing the bonding strength between hot repair material and matrix, which can prepare a sample with sufficient bonding between hot repair material and matrix, so as to accurately test the strength of the bonding material between hot repair material and matrix, and has the advantages of simple operation and high preparation efficiency.

[0005] The embodiments of the present application are implemented as follows:

[0006] The embodiment of the present application provides a sample preparation device for hot-state repair material and substrate combination strength, which comprises a heating furnace, a bin rotatably arranged in the heating furnace, a feeding hopper coaxial with a rotation axis of the bin, at least one sample cylinder and a rotating motor for driving the bin to rotate, one end of the feeding hopper is communicated with a top of the bin, and the other end penetrates out of the heating furnace, and the outer wall of the bin is communicated with at least one connecting pipe; the sample cylinder is detachably connected to the connecting pipe so that the sample cylinder and the connecting pipe are communicated.

[0007] In some optional embodiments, the rotating motor is arranged in the bottom of the heating furnace, and an output shaft of the rotating motor penetrates into the heating furnace and is connected with the bin.

[0008] In some optional embodiments, the bottom wall of the heating furnace is connected with a heat insulation cylinder sleeved on the output shaft.

[0009] In some optional embodiments, the sample cylinder is composed of two semicircular table-shaped or semicircular column-shaped sample cylinder shells and a snap ring.

[0010] In some optional embodiments, the bottom wall of the bin is communicated with at least two connecting pipes arranged at intervals in the circumferential direction, at least two distribution cavities arranged at intervals in the circumferential direction are arranged in the bin, the top of each distribution cavity is communicated with the feeding hopper, and each distribution cavity is communicated with one connecting pipe.

[0011] In some optional embodiments, the axis of the connecting pipe is arranged at an acute angle with the rotation axis, and the connecting pipe extends away from the rotation axis with the distance from the bin.

[0012] The present application also provides a sample preparation method for hot-state repair material and substrate combination strength, which comprises the following steps:

[0013] Placing the substrate material test block in the sample cylinder and heating to a preset temperature;

[0014] Injecting the molten hot-state repair material into the sample cylinder to mix with the substrate material test block;

[0015] Rotating the sample cylinder around the axis to tightly combine the molten hot-state repair material and the substrate material test block, and cooling the sample cylinder after heat preservation for a preset time;

[0016] Taking out the sample in the sample cylinder.

[0017] The beneficial effects of the present application are: the hot repair material and substrate bonding strength sample preparation device provided by the present application comprises a heating furnace, a stock bin rotatably arranged in the heating furnace, a feeding hopper coaxial with the rotation axis of the stock bin, at least one sample cylinder and a rotating motor for driving the stock bin to rotate, one end of the feeding hopper is communicated with the top of the stock bin, the other end penetrates out of the heating furnace, and the outer wall of the stock bin is communicated with at least one connecting pipe; the sample cylinder is detachably connected to the connecting pipe so that the sample cylinder and the connecting pipe are communicated. The hot repair material and substrate bonding strength sample preparation device and preparation method provided by the present application can prepare a sample in which the hot repair material and the substrate are fully combined, so as to accurately test the strength of the hot repair material and the substrate bonding material, and has the advantages of simple operation and high preparation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0019] Figure 1 The partial cross-sectional structure schematic diagram of the hot repair material and substrate bonding strength sample preparation device provided by the embodiments of the present application is shown in the figure.

[0020] Figure 2 The cross-sectional structure schematic diagram of the stock bin of the hot repair material and substrate bonding strength sample preparation device provided by the embodiments of the present application is shown in the figure.

[0021] Figure 3 The partial cross-sectional structure schematic diagram of the connection of the sample cylinder and the connecting pipe of the hot repair material and substrate bonding strength sample preparation device provided by the embodiments of the present application is shown in the figure.

[0022] Figure 4 The cross-sectional structure schematic diagram of the sample cylinder of the hot repair material and substrate bonding strength sample preparation device provided by the embodiments of the present application is shown in the figure.

[0023] Figure 5 The structure schematic diagram of the snap ring of the hot repair material and substrate bonding strength sample preparation device provided by the embodiments of the present application is shown in the figure.

[0024] In the figure: 100, heating furnace; 110, stock bin; 120, feeding hopper; 130, sample cylinder; 131, sample cylinder shell; 132, snap ring; 133, sample groove; 140, rotating motor; 150, connecting pipe; 160, heat insulation cylinder; 170, distribution cavity. DETAILED DESCRIPTION

[0025] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0027] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0028] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0029] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0030] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] In the present application, unless specifically stated and limited otherwise, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is higher in horizontal height than the second feature. The first feature "under", "below" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the first feature is lower in horizontal height than the second feature.

[0032] The features and performances of the sample preparation device and method for the bonding strength between hot-state repair material and substrate of the present application are further described in detail below in combination with the embodiments.

[0033] As Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, the embodiment of the present application provides a sample preparation device for hot-state repair material and substrate bonding strength, which comprises a heating furnace 100, a material bin 110 rotatably arranged in the heating furnace 100 about a vertical axis, a feeding hopper 120, three sample cylinders 130 and a rotating motor 140 for driving the material bin 110 to rotate about the vertical axis, the axis of the feeding hopper 120 is arranged to coincide with the vertical axis and one end is communicated with the top of the material bin 110 and the other end penetrates out of the heating furnace 100, the material bin 110 is provided with three distribution cavities 170 arranged at intervals along the circumference thereof, the top of each distribution cavity 170 is communicated with the feeding hopper 120, the bottom wall of the material bin 110 is communicated with three connecting pipes 150 arranged at intervals along the circumference thereof, the axis of the connecting pipe 150 is arranged at an angle of 45 degrees with the rotating axis, the connecting pipe 150 extends away from the material bin 110 to the direction away from the rotating axis, and each distribution cavity 170 is communicated with one connecting pipe 150; one end of the sample cylinder 130 is provided with a cylindrical sample groove 133 for accommodating a test block of substrate material, and the inner wall of the top of the sample groove 133 is provided with an internal thread; the sample cylinder 130 can be connected to the external thread arranged at the end of the connecting pipe 150 through the internal thread, so that the sample groove 133 of the sample cylinder 130 and the corresponding connecting connecting pipe 150 are communicated. The rotating motor 140 is arranged in the bottom of the heating furnace 100, the output shaft of the rotating motor 140 penetrates into the heating furnace 100 and is connected with the material bin 110, and the bottom wall of the heating furnace 100 is connected with a heat insulation cylinder 160 sleeved on the output shaft. The sample cylinder 130 is composed of two semicircular table-shaped sample cylinder housings 131 connected through a quarter circular ring-shaped elastic clasp 132, each sample cylinder housing 131 is provided with a semicircular cylindrical groove, and the two semicircular cylindrical grooves are matched to form the sample groove 133 when the two sample cylinder housings 131 are connected through the clasp 132; wherein the diameter of the trumpet-shaped opening at the upper end of the feeding hopper 120 is 200-250 mm; the length of the connecting pipe 150 is 20 mm, the inner diameter is 45 mm, the diameter of the sample groove 133 of the sample cylinder 130 is 50 mm, the length of the sample groove 133 is 180 mm, and the length of the sample cylinder 130 is 200 mm.

[0034] The present application also provides a sample preparation method for hot-state repair material and substrate bonding strength, which comprises the following steps:

[0035] The two sample cylinder housings 131 are connected to form the sample cylinder 130 through the clasp 132, and the two semicircular cylindrical grooves of the sample cylinder 130 are matched to form the sample groove 133 for accommodating the test block of substrate material, the diameter of the test block of substrate material is 50 mm, and the length is 75 mm; then the sample cylinder 130 is connected to the corresponding connecting pipe 150 through the thread, at this time the test block of substrate material slides to the bottom of the sample groove 133 due to the action of gravity, the heating furnace 100 is started to heat to a preset temperature of 1000℃, and the temperature is kept for 20 min;

[0036] The hot repair material is stirred evenly and fed into each distribution cavity 170 of the hopper 110 through the feeding hopper 120. The hot repair material enters the sample groove 133 of each sample cylinder 130 through each distribution cavity 170. The hot repair material in the sample groove 133 is melted by heating in the heating furnace 100 and mixed with the matrix material test piece.

[0037] The rotating motor 140 is controlled to start and rotate the hopper 110 and the connected sample tube 130 around the vertical axis. The high-speed centrifugal force causes the molten hot repair material and the matrix material sample in the sample tank 133 to be tightly combined. The rotating motor 140 is then turned off and the sample tube 130 is kept warm for 5 minutes before being cooled to room temperature.

[0038] The sample cylinder 130 is rotated to separate it from the connecting tube 150, and the retaining ring 132 is removed to disassemble the two sample cylinder shells 131 that constitute the sample cylinder 130. The tightly bonded hot repair material and matrix material test block are taken out and subsequent tensile, flexural or shear tests are performed to determine the bonding strength between the hot repair material and the matrix material.

[0039] The sample preparation device and method for the bonding strength between hot repair material and matrix provided in the embodiment of the present application uses a sample cylinder 130 to accommodate a matrix material sample block for heating and heat preservation, and uses a feeding hopper 120 to pass the hot repair material into the sample cylinder 130 through a material distribution cavity 170 in the hopper 110 and a corresponding connecting pipe 150 to melt the hot repair material, and uses a rotating motor 140 to drive the hopper 110 and the connected sample cylinder 130 to rotate around a vertical axis, so that the molten hot repair material in the sample cylinder 130 and the matrix material sample block are tightly combined to form an integrated sample for testing the bonding strength between the hot repair material and the matrix material. Compared with the method of directly manually pouring the hot repair material into the matrix material, not only does it avoid high-temperature operation, but it is also safe and simple to operate. The bonding strength between the hot repair material and the matrix material is closer to actual production, so the test data is more accurate, and it effectively avoids the hot repair material from directly peeling off when the surface of the matrix material hardens.

[0040] Among them, the bottom wall of the heating furnace 100 is connected to an insulating tube 160 that is sleeved on the output shaft. The insulating tube 160 can reduce the impact of the high temperature in the heating furnace 100 on the output shaft of the rotating motor 140, and prevent the output shaft of the rotating motor 140 from being heated and deformed and affecting the use effect. The sample tube 130 is detachably connected to the external thread set at the end of the connecting tube 150 through an internal thread, which is convenient for operators to install and remove the sample tube 130, and is convenient for batch molding test samples, thereby improving test efficiency. The sample tube 130 is composed of two semi-conical sample tube shells 131 connected by an elastic clamping ring 132. On the one hand, it is convenient for the sample in the sample groove 133 of the sample tube 130 to expand when heated. On the other hand, it can play the role of fastening the two sample tube shells 131 through the elastic clamping ring 132, and prevent the sample from cracking and affecting the test.

[0041] The embodiments described above are only part of the embodiments of the present application, rather than all the embodiments. The detailed description of the embodiments of the present application is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present application.

Claims

1. A specimen preparation device for hot patch material to substrate bond strength, characterized by, The device comprises a heating furnace, a hopper rotatably arranged in the heating furnace, a feeding hopper coaxial with the rotation axis of the hopper, at least one sample cylinder and a rotating motor for driving the rotation of the hopper, one end of the feeding hopper is communicated with the top of the hopper, and the other end penetrates out of the heating furnace, the bottom wall of the hopper is communicated with at least two connecting pipes arranged at intervals along the circumference thereof, at least two distribution cavities arranged at intervals along the circumference are arranged in the hopper, the top of the distribution cavity is communicated with the feeding hopper, each distribution cavity is communicated with one connecting pipe, the axis of the connecting pipe is arranged at an acute angle with the rotation axis, and the connecting pipe extends away from the rotation axis as it extends away from the hopper; the sample cylinder is detachably connected to the connecting pipe so that the sample cylinder and the connecting pipe are communicated.

2. The test piece preparation device for the bond strength of a hot patch material to a substrate according to claim 1, characterized by, The rotating motor is arranged in the bottom of the heating furnace, and the output shaft of the rotating motor penetrates into the heating furnace and is connected with the hopper.

3. The apparatus for preparing a test piece for bonding strength between a hot patching material and a substrate according to claim 2, characterized by, The bottom wall of the heating furnace is connected with a heat insulation cylinder sleeved on the output shaft.

4. The apparatus for preparing a test piece for bonding strength between a hot patching material and a substrate according to claim 1, characterized by The sample cylinder is composed of two semicircular table-shaped or semicircular column-shaped sample cylinder shells and a snap ring connection.

5. The method of claim 1, wherein the method is characterized by: The device comprises the following steps: placing a matrix material test block in the sample cylinder and heating to a preset temperature; injecting molten hot repair material into the sample cylinder to mix with the matrix material test block; rotating the sample cylinder around the axis to tightly combine the molten hot repair material and the matrix material test block, keeping the sample cylinder for a preset time and then cooling; taking out the sample in the sample cylinder.

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