Liquid supply device and semiconductor deposition equipment

Abstract

The present invention provides a liquid supply device and a semiconductor deposition apparatus, relating to the technical field of semiconductor deposition apparatuses. The liquid supply device includes a liquid source tank body, a refrigerating member, and a sealed heat-insulating housing; the refrigerating member is disposed on the liquid source tank body, and the liquid source tank body is disposed inside the sealed heat-insulating housing; an air outlet and an air inlet capable of communicating with a blowing air source are formed on the sealed heat-insulating housing; an inlet and outlet pipeline is disposed on the liquid source tank body, and one end of the inlet and outlet pipeline protrudes from the sealed heat-insulating housing. The semiconductor deposition apparatus includes the liquid supply device. The technical effect that condensed water does not appear on the surface of the tank of the low-temperature liquid source is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor deposition equipment, and more particularly, to a liquid supply device and a semiconductor deposition equipment. Background Art

[0002] In semiconductor deposition processes, a variety of reaction sources are used, and some of these reaction sources contain substances harmful to the human body. Therefore, liquid leakage sensors are installed in semiconductor production workshops. The liquid leakage sensors are used to monitor whether there is any liquid leakage during semiconductor production. Once liquid leakage is detected, all semiconductor production equipment in operation will be shut down immediately to ensure the safety of the staff. However, if a false alarm occurs, it will cause very large economic losses.

[0003] However, to meet the requirements of a new semiconductor production process, the liquid source in the liquid supply device needs to be cooled to 5°C (low temperature). Under this temperature condition, water vapor from the environment will condense on the surface of the tank containing the 5°C (low temperature) liquid source, and such a phenomenon will cause false alarms of the liquid leakage sensor.

[0004] Therefore, providing a liquid supply device and a semiconductor deposition equipment that do not produce condensed water has become an important technical problem to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of the present invention is to provide a liquid supply device and a semiconductor deposition equipment to alleviate the technical problem in the prior art that the surface of the tank containing a 5°C liquid source has condensed liquid that accidentally touches the liquid leakage sensor.

[0006] In a first aspect, an embodiment of the present invention provides a liquid supply device, including a liquid source tank, a refrigerating member, and a sealed heat-insulating housing;

[0007] The refrigerating member is disposed on the liquid source tank, and the liquid source tank is disposed inside the sealed heat-insulating housing;

[0008] An air outlet and an air inlet capable of communicating with a blowing air source are formed on the sealed heat-insulating housing;

[0009] An inlet and outlet pipeline is disposed on the liquid source tank, and one end of the inlet and outlet pipeline protrudes from the sealed heat-insulating housing.

[0010] In combination with the first aspect, an embodiment of the present invention provides a possible implementation manner of the first aspect, wherein the above liquid supply device further includes a heat-insulating layer, and the heat-insulating layer is wrapped around the liquid source tank.

[0011] In combination with the first aspect, an embodiment of the present invention provides a possible implementation manner of the first aspect, wherein the above heat-insulating layer is made of heat-insulating cotton.

[0012] In combination with the first aspect, an embodiment of the present invention provides a possible implementation manner of the first aspect, wherein the above-mentioned sealed heat-insulating housing includes a bottom plate, an upper cover plate and an outer shell;

[0013] The bottom plate is hermetically arranged at the bottom of the outer shell, and the upper cover plate is hermetically arranged at the top of the outer shell.

[0014] In combination with the first aspect, an embodiment of the present invention provides a possible implementation manner of the first aspect, wherein a circulating liquid flow channel for cooling the refrigerating member is arranged at the bottom of the outer shell.

[0015] In combination with the first aspect, an embodiment of the present invention provides a possible implementation manner of the first aspect, wherein the above-mentioned inlet and outlet pipelines include an inlet pipe, an outlet pipe and a purging pipe;

[0016] The inlet pipe, the outlet pipe and the purging pipe are all arranged on the liquid source tank body;

[0017] One end of the inlet pipe extending into the liquid source tank body is located below the liquid level.

[0018] In combination with the first aspect, an embodiment of the present invention provides a possible implementation manner of the first aspect, wherein the above-mentioned liquid supply device further includes a liquid level sensor, the liquid level sensor is arranged on the liquid source tank body, and the liquid level sensor protrudes from the sealed heat-insulating housing.

[0019] In combination with the first aspect, an embodiment of the present invention provides a possible implementation manner of the first aspect, wherein the above-mentioned air inlet and the air outlet are respectively located on opposite sides of the liquid source tank body.

[0020] In combination with the first aspect, an embodiment of the present invention provides a possible implementation manner of the first aspect, wherein the above-mentioned refrigerating member adopts a semiconductor refrigeration device.

[0021] In the second aspect, an embodiment of the present invention provides a semiconductor deposition device, including the above-mentioned liquid supply device.

[0022] Advantageous effects:

[0023] The present invention provides a liquid supply device, including a liquid source tank body, a refrigerating member and a sealed heat-insulating housing; the refrigerating member is arranged on the liquid source tank body, the liquid source tank body is arranged inside the sealed heat-insulating housing; an air outlet and an air inlet capable of communicating with a blowing gas source are arranged on the sealed heat-insulating housing; an inlet and outlet pipeline is arranged on the liquid source tank body, and one end of the inlet and outlet pipeline protrudes from the sealed heat-insulating housing.

[0024] Specifically, the refrigerating component can refrigerate the liquid source tank to make the temperature of the liquid in the liquid source tank meet the process requirements. Then, according to the process requirements, the process liquid in the liquid source tank is transmitted to the reaction chamber through the inlet and outlet pipelines. Moreover, the air inlet on the sealed heat-insulating housing can be communicated with the blowing gas source. During the production process, the blowing gas enters the sealed heat-insulating housing from the air inlet to blow the liquid source tank, which can keep the outer wall of the liquid source tank dry. And the blowing gas can be discharged from the air outlet for collection, avoiding the appearance of condensed water on the outer wall of the liquid source tank.

[0025] The present invention provides a semiconductor deposition device, including a liquid supply device. The semiconductor deposition device has the above advantages compared with the prior art, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a schematic structural diagram of the liquid supply system provided by an embodiment of the present invention.

[0028] ICON:

[0029] 100 - Liquid source tank; 110 - Inlet and outlet pipelines; 111 - Liquid inlet pipe; 112 - Liquid outlet pipe; 113 - Purge pipe;

[0030] 200 - Refrigerating component;

[0031] 300 - Sealed heat-insulating housing; 301 - Air outlet; 302 - Air inlet; 303 - Circulating liquid flow channel; 310 - Bottom plate; 320 - Upper cover plate; 330 - Outer shell;

[0032] 400 - Thermal insulation layer;

[0033] 500 - Liquid level sensor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] The following will clearly and completely describe the technical solutions of the present invention with reference to the drawings. Obviously, the described embodiments are some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0035] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0036] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0037] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] The present invention will be further described in detail below through specific embodiments in conjunction with the drawings.

[0039] See Figure 1 As shown, an embodiment of the present invention provides a liquid supply device, including a liquid source tank 100, a refrigerating member 200, and a sealed heat-insulating housing 300; the refrigerating member 200 is disposed on the liquid source tank 100, and the liquid source tank 100 is disposed inside the sealed heat-insulating housing 300; an air outlet 301 and an air inlet 302 capable of communicating with a blowing air source are provided on the sealed heat-insulating housing 300; an inlet and outlet pipeline 110 is provided on the liquid source tank 100, and one end of the inlet and outlet pipeline 110 protrudes from the sealed heat-insulating housing 300.

[0040] Specifically, the refrigerating component 200 can refrigerate the liquid source tank 100 so that the temperature of the liquid in the liquid source tank 100 meets the process requirements. Then, according to the process requirements, the process liquid in the liquid source tank 100 is transferred to the reaction chamber through the liquid outlet pipe 112. Moreover, the air inlet 302 on the sealed heat-insulating housing 300 can be connected to the blowing gas source. During the production process, the blowing gas enters the sealed heat-insulating housing 300 from the air inlet 302 to blow the liquid source tank 100, which can keep the outer wall of the liquid source tank 100 dry, and the blowing gas can be discharged from the air outlet 301 for collection, avoiding the appearance of condensed water on the outer wall of the liquid source tank 100.

[0041] Among them, the blowing gas can be nitrogen, carbon dioxide or inert gas. In addition, those skilled in the art can select the type of blowing gas according to actual needs, and details will not be elaborated here.

[0042] See Figure 1 As shown, in an alternative embodiment of the present embodiment, the liquid supply device further includes a heat-insulating layer 400, and the heat-insulating layer 400 is wrapped around the liquid source tank 100.

[0043] Specifically, a heat-insulating layer 400 is wrapped around the liquid source tank 100. By setting the heat-insulating layer 400, the influence of the blowing gas on the temperature of the liquid source tank 100 can be reduced.

[0044] See Figure 1 As shown, in an alternative embodiment of the present embodiment, the heat-insulating layer 400 is made of heat-insulating cotton.

[0045] Specifically, the heat-insulating layer 400 can be made of heat-insulating cotton, and can also be made of silicate heat-insulating materials, ceramic heat-insulating materials, etc.

[0046] In addition, those skilled in the art can also select the material of the heat-insulating layer 400 according to actual needs, and details will not be elaborated here.

[0047] See Figure 1 As shown, in an alternative embodiment of the present embodiment, the sealed heat-insulating housing 300 includes a bottom plate 310, an upper cover plate 320 and an outer shell 330; the bottom plate 310 is sealed at the bottom of the outer shell 330, and the upper cover plate 320 is sealed at the top of the outer shell 330.

[0048] Specifically, the bottom plate 310, the upper cover plate 320 and the outer shell 330 are connected to form the sealed heat-insulating housing 300, and the bottom plate 310 and the upper cover plate 320 are respectively sealed to the outer shell 330 to prevent the leakage of gas or liquid inside the sealed heat-insulating housing 300.

[0049] See Figure 1As shown, in an alternative solution of this embodiment, a circulating liquid flow channel 303 for cooling the refrigeration component 200 is provided at the bottom of the outer shell 330.

[0050] Specifically, a circulating liquid flow channel 303 is opened at the bottom of the outer shell 330. Through the arrangement of the circulating liquid flow channel 303, the refrigeration component 200 can be cooled.

[0051] See Figure 1 As shown, in an alternative solution of this embodiment, the inlet and outlet pipeline 110 includes an inlet pipe 111, an outlet pipe 112, and a purge pipe 113; the inlet pipe 111, the outlet pipe 112, and the purge pipe 113 are all provided on the liquid source tank body 100; one end of the inlet pipe 111 extending into the liquid source tank body 100 is located below the liquid level.

[0052] Specifically, when carrying out production work according to process requirements, inert gas is blown into the liquid source tank body 100 through the purge pipe 113. The inert gas can carry the vaporized reaction source out from the storage tank, so as to transfer the vaporized reaction source after being cooled to the reaction chamber for the process.

[0053] See Figure 1 As shown, in an alternative solution of this embodiment, the liquid supply device further includes a liquid level sensor 500. The liquid level sensor 500 is provided on the liquid source tank body 100 and protrudes from the sealed heat insulation housing 300.

[0054] Specifically, through the arrangement of the liquid level sensor 500, the staff can conveniently know the remaining amount of the reaction source in the liquid source tank body 100.

[0055] See Figure 1 As shown, in an alternative solution of this embodiment, the air inlet 302 and the air outlet 301 are respectively located on opposite sides of the liquid source tank body 100.

[0056] Specifically, by respectively locating the air inlet 302 and the air outlet 301 on opposite sides of the liquid source tank body 100, the nitrogen gas blown into the sealed heat insulation housing 300 from the air inlet 302 can blow the liquid source tank body 100 over the largest range and carry away the condensed water on the liquid source tank body 100.

[0057] See Figure 1 As shown, in an alternative solution of this embodiment, the refrigeration component 200 uses a semiconductor refrigerator.

[0058] Specifically, the refrigeration component 200 can use a semiconductor refrigerator or a heat exchanger.

[0059] In addition, those skilled in the art can select the type of the refrigeration component 200 according to actual needs.

[0060] This embodiment provides a semiconductor deposition apparatus, including a liquid supply device.

[0061] Specifically, the semiconductor deposition apparatus provided in this embodiment has the advantages of the above liquid supply device compared with the prior art, and will not be elaborated here.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid supply device, characterized in that, it comprises: a liquid source tank body (100), a refrigerating element (200) and a sealed heat-insulating housing (300); the refrigerating element (200) is arranged on the liquid source tank body (100), and the liquid source tank body (100) is arranged inside the sealed heat-insulating housing (300); an air outlet (301) and an air inlet (302) capable of communicating with a blowing air source are formed on the sealed heat-insulating housing (300); a liquid inlet and outlet pipeline (110) is arranged on the liquid source tank body (100), and one end of the liquid inlet and outlet pipeline (110) protrudes from the sealed heat-insulating housing (300); the air inlet (302) and the air outlet (301) are respectively located on opposite sides of the liquid source tank body (100).

2. The liquid supply device according to claim 1, characterized in that, it further comprises a heat-insulating layer (400), and the heat-insulating layer (400) is coated on the liquid source tank body (100).

3. The liquid supply device according to claim 2, characterized in that, the heat-insulating layer (400) is made of heat-insulating cotton.

4. The liquid supply device according to claim 1, characterized in that, the sealed heat-insulating housing (300) comprises a bottom plate (310), an upper cover plate (320) and a housing (330); the bottom plate (310) is hermetically arranged at the bottom of the housing (330), and the upper cover plate (320) is hermetically arranged at the top of the housing (330).

5. The liquid supply device according to claim 4, characterized in that, a circulating liquid flow channel (303) for cooling the refrigerating element (200) is arranged at the bottom of the housing (330).

6. The liquid supply device according to any one of claims 1 - 5, characterized in that, the liquid inlet and outlet pipeline (110) comprises a liquid inlet pipe (111), a liquid outlet pipe (112) and a purging pipe (113); the liquid inlet pipe (111), the liquid outlet pipe (112) and the purging pipe (113) are all arranged on the liquid source tank body (100); one end of the liquid inlet pipe (111) extending into the liquid source tank body (100) is located below the liquid level.

7. The liquid supply device according to claim 6, characterized in that, it further comprises a liquid level sensor (500), the liquid level sensor (500) is arranged on the liquid source tank body (100), and the liquid level sensor (500) protrudes from the sealed heat-insulating housing (300).

8. The liquid supply device according to any one of claims 1 - 5, characterized in that, the refrigerating element (200) is a semiconductor refrigerating device.

9. A semiconductor deposition device, characterized in that, it comprises the liquid supply device according to any one of claims 1 - 8.

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